Dissertations / Theses on the topic 'Polyimide'
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Gopalanarayanan, Bhaskar. "Analysis of Thermoplastic Polyimide + Polymer Liquid Crystal Blends." Thesis, University of North Texas, 1998. https://digital.library.unt.edu/ark:/67531/metadc279285/.
Full textCano, Camilo I. "Polyimide Microstructures From Powdered Precursors: Phenomenological and Parametric Studies on Particle Inflation." Akron, OH : University of Akron, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=akron1123710711.
Full text"August, 2005." Title from electronic dissertation title page (viewed 09/24/2005) Includes bibliographical references.
Neuhaus, Herbert John. "Electrical conduction in polyimide." Thesis, Massachusetts Institute of Technology, 1989. http://hdl.handle.net/1721.1/14476.
Full textMOUANE, KHALID. "Polyimide thin-ply composite." Thesis, Luleå tekniska universitet, Institutionen för teknikvetenskap och matematik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-70118.
Full textCao, Yuanmei. "Antireflective Polyimide Based Films." University of Akron / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=akron1335501090.
Full textDangarwala, Gaurav A. "A model of the change in viscosity of polyimide PMR-15 during cure." Ohio : Ohio University, 1993. http://www.ohiolink.edu/etd/view.cgi?ohiou1175284832.
Full textWang, Jia. "Synthesis and properties of polyimide/organo clay and polyimide/polyaniline-modified clay nanocomposites." University of Cincinnati / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1282055379.
Full textCriss, Jim McRae. "Synthesis, characterization, and study of polyimide processing additives and their effect on polyimide properties." Thesis, Georgia Institute of Technology, 1993. http://hdl.handle.net/1853/20015.
Full textBott, Richard H. "Characterization of modified polyimide adhesives." Diss., Virginia Polytechnic Institute and State University, 1988. http://hdl.handle.net/10919/53914.
Full textPh. D.
Rojahn, Martin. "Encapsulation of a retina implant /." [S.l. : s.n.], 2003. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB10378693.
Full textSejour, Hensley. "Investigation of Dithiolenes for Propylene/Propane Membrane Separations." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19697.
Full textKaneko, K., T. Hori, E. Nakane, H. Kondo, and T. Mizutani. "Space Charge Behavior of Polyimide Film." IEEE, 2004. http://hdl.handle.net/2237/7209.
Full textKioul, Azzedine. "Polyimide ceramers : composition, morphology and properties." Thesis, Loughborough University, 1993. https://dspace.lboro.ac.uk/2134/10592.
Full textCollins, Gustina B. "Laser Processing of Polyimide on Copper." Thesis, Virginia Tech, 2001. http://hdl.handle.net/10919/32559.
Full textMaster of Science
FLAMENT, OLIVIER. "Etude xps des interfaces polyimide/isolant." Paris 7, 1990. http://www.theses.fr/1990PA077034.
Full textPanigot, Michael John. "Synthesis and photochemistry of polyimide endcaps." Case Western Reserve University School of Graduate Studies / OhioLINK, 1991. http://rave.ohiolink.edu/etdc/view?acc_num=case1055531066.
Full textSekar, Sudalai muthu Suriya. "Characterization of Polyimide/Graphene Hybrid Nanocomposites." University of Cincinnati / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1565348858679907.
Full textEllison, Matthew M. "Metal/polymer interactions in polyimide adhesives." Diss., This resource online, 1995. http://scholar.lib.vt.edu/theses/available/etd-08282003-155323/.
Full textMiller, Larry M. "A model for the prediction of thermo-oxidative mass loss of ceramic coated polyimide composites." Ohio : Ohio University, 1995. http://www.ohiolink.edu/etd/view.cgi?ohiou1174609538.
Full textRymer, Dawn Lee. "The atmospheric chemical vapor deposition of titanium nitride on polyimide substrates." Ohio : Ohio University, 1995. http://www.ohiolink.edu/etd/view.cgi?ohiou1179952065.
Full textSili, Elyse. "Étude et caractérisation des décharges partielles et du vieillissement du polyimide en environnement aéronautique." Toulouse 3, 2012. http://thesesups.ups-tlse.fr/1922/.
Full textThe anxiety maintained on one hand by the exceptional increase in the consumption of fossil fuels and on the other hand by the concern for environmental protection has motivated the scientists who work in the transportation domain to find alternative solutions. So the aircraft industry is increasingly shifting towards more electrical technologies. Hence electrical systems with higher powers are required. However, the increase in electrical power demand to supply these alternative electrical systems requires higher voltages. Or increasing the supply voltage combined with the constraints imposed by the avionics environment (pressure drop due to the altitude, temperature cycles and variation of moisture) would introduce others, namely an increased probability of electrical discharge. Unwanted partial discharge (PD) in electrical systems can lead to the deterioration of solid insulation and consequently failure of whole components. The need therefore exists to understand the effect of environmental parameters on the PD characteristics and on the insulation lifetime which is the aim of this work. In the first part, we have been investigating the effect of low pressure combined with high temperature on the partial discharge characteristics as the ignition voltage and the dissipated energy. Results show two different behaviours related to temperature at the left of the Paschen minimum. In an attempt to explain these results, it appears that this effect is related to the presence of two different breakdown phenomena. Then the domain of validity of two corrective expressions on the Paschen's law found in the literature, in case of changing the air environment was investigated. Results show that these corrections are valid under atmospheric pressure. However, for combined variation of temperature and pressure a new empirical expression has been added and validated for temperatures higher than 35°C. In a second part, the aeronautic environment effects on the partial discharge properties were investigated. The obtained noticeable changes in the PD characteristics with temperature, pressure and humidity variations were presented and mainly explained on the basis of electron mean free path. Finally, after having investigated the effect of temperature, pressure, and moisture on discharge characteristics, we focused on the effect of these environmental parameters on the behaviour of the energy dissipated by the discharges and on polyimide film endurance during aging under partial discharge. The energy measurements were carried out in real time during aging tests and the relationship between the energies involved and the polyimide lifetime was investigated for different environmental conditions. Accordingly to these results, it seems difficult to establish a direct relationship between the energy dissipated and the material lifetime, even if it still valid in various conditions. This is mainly due to the interaction between the discharge by-products and the environment that affects the film endurance. A more effective relationship between lifetime and the discharge intensity has been found. It has been shown that the lifetime and the discharge intensity are inversely proportional regardless of the applied conditions
Sorensen, E. Todd. "Cross-linkable polyimide blends for stable membranes." Thesis, Georgia Institute of Technology, 1996. http://hdl.handle.net/1853/10086.
Full textSexton, Charles W. "Infrared spectroscopic study of polyimide film degradation." CardinalScholar 1.0, 2009. http://liblink.bsu.edu/uhtbin/catkey/1540709.
Full textLiterature review and introduction -- Evaluation of sampling techniques -- Film degradation studies on freestanding films.
Department of Chemistry
Silva, Marta Sofia Fragoso da. "Polyimide and polyetherimide organic solvent nanofiltration membranes." Master's thesis, FCT - UNL, 2007. http://hdl.handle.net/10362/1133.
Full textCerrón-Infantes, Alonso, and Miriam M. Unterlass. "High-Performance polyimide particles with angular shape." Revista de Química, 2016. http://repositorio.pucp.edu.pe/index/handle/123456789/99080.
Full textHigh-performance polymers (HPPs) play an important role in modern technology. Many efforts aim to develop cost-effective pathways to synthesize polymers without causing any harm to health and the environment. Polyimides (PIs) belong to the class of HPPs and they show outstanding features e.g. high-temperature stability, resistance to aggressive chemicals and radiation, as well as insulating properties. PI synthesis, however, present yet major challenges. We herein present an alternative approach to PIs of intriguing shape and of impressive size.
Mecham, Sue Jewel. "Gas permeability of polyimide/polysiloxane block copolymers." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/43136.
Full textMaster of Science
Horning, Leslie Sauder. "Development of polyimide/metal gradient microcomposite films." Thesis, Virginia Tech, 1990. http://hdl.handle.net/10919/44460.
Full textMaster of Science
Зленко, Віталій Олександрович, Виталий Александрович Зленко, Vitalii Oleksandrovych Zlenko, Сергій Іванович Проценко, Сергей Иванович Проценко, and Serhii Ivanovych Protsenko. "Dispersed Co thin films on polyimide substrate." Thesis, Видавництво СумДУ, 2011. http://essuir.sumdu.edu.ua/handle/123456789/20647.
Full textNelson, Warren W. "Synthesis and Characterization of Polylactide/Polyimide Blends." University of Cincinnati / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1282575053.
Full textSurya, Ramakrishna. "Synthesis and Characterization of Polyimide/Polyacrylonitrile Blend." University of Cincinnati / OhioLINK, 2019. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1574417741513506.
Full textGirardeaux, Christophe. "L'interface titane/polyimide. Etude experimentale et theorique." Paris 7, 1993. http://www.theses.fr/1993PA077259.
Full textMecham, Sue J. "Gas permeability of polyimide/polysiloxane block copolymers /." This resource online, 1994. http://scholar.lib.vt.edu/theses/available/etd-06112009-063219/.
Full textDelozier, Donavon Mark. "Preparation and characterization of polyimide/organoclay nanocomposites." W&M ScholarWorks, 2002. https://scholarworks.wm.edu/etd/1539623403.
Full textRobillard, Kerri Ann. "The Imidization Reactions of PMR-15 Polyimide." W&M ScholarWorks, 1992. https://scholarworks.wm.edu/etd/1539625735.
Full textSim, Seok-Hoon. "Modifications of polyimides and polyimide-inorganic oxide hybrids with perfluoroether oligomers for use as matrices for carbon-fibre composites." Thesis, Loughborough University, 2004. https://dspace.lboro.ac.uk/2134/35624.
Full textHolmes, Brenda L. "Effect of a derivatized oxide layer and environment on the bond durability of aluminum/polyimide and titanium/polyimide bonds." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/41597.
Full textA surface pretreatment for aluminum and titanium
involving the reaction of phosphonic acid (RPO(OH)2),
R=butyl or vinyl for aluminum and R=vinyl for titanium, has
been investigated. The durability of phosphonic
acid-pretreated samples was compared with that for P2-etched
(ferric sulfate-sulfuric acid) adherends. Samples were
bonded with LaRC-IA adhesive in a wedge test geometry.
Environmental testing consisted of static and cyclical
exposure for 240 hours in three atmospheres: 1) 170°C, 2
torr; 2) -20°C; 3) 60°C, 70% relative humidity. Crack
propagation arrested within 48 hours. The order of
durability in static environmental tests for aluminum was
vinyl phosphonic acid > P2 > butyl phosphonic acid. The
durability performance was reversed for cyclic testing. The
durability of specimens using P2-etched titanium was
superior to that for vinyl phosphonic acid-treated titanium
in all environmental tests.
Master of Science
Lopes, Mafalda Pessoa. "Influence of commercially available polyimide and formation conditions on the performance and structure of asymmetric polyimide organic solvent nanofiltration membranes." Master's thesis, Faculdade de Ciências e Tecnologia, 2009. http://hdl.handle.net/10362/5906.
Full textThis work covers experimental and theoretical research related to the impact of the polymer structure of commercially available polyimide and polyetherimides as well as the formation conditions on the performance and structure of polyimide Organic Solvent Nanofiltration membranes. The influence in some membrane formation parameters such as polymer choice, solvent system composition, chemical crosslinking, solubility, humidity and coagulation bath temperature on the performance of PI membranes was investigated. A series of integrally skinned asymmetric membranes were prepared using different polyimide polymers, like Lenzing P84, P84 HT, Matrimid 5218 polyimide membranes and also polyetherimides membrane Ultem 1000. Non-crosslinked membranes were used to evaluate the influence of the polyimide choice and solvent system choice- DMF/1,4-Dioxane, NMP/THF and DMSO/Acetone in terms of performance and morphology. Non chemically modified membranes in DMF/1,4-Dioxane solvent system demonstrated low reproducibility. Polyimide P84 was found to generate tighter membranes with better rejection and higher flux performance than the other polyimides in study. Calculations were made to test the hypothesis that solubility parameters interaction can be a useful tool in theoretical predictions of PI OSN membranes performance and structure. Membrane formation conditions influenced membrane performance, but not to such extension as polymers and solvent system composition choice. SEM pictures revealed a significant difference in membranes morphology. The presence of macrovoids was higher in P84 and HT than in Matrimid and Ultem. These studies open up future possibilities for controlling the MWCO of different PI OSN membranes.
Suzuki, Takeharu, and n/a. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring." Griffith University. School of Microelectronic Engineering, 2004. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20040813.131206.
Full textSuzuki, Takeharu. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring." Thesis, Griffith University, 2004. http://hdl.handle.net/10072/367295.
Full textThesis (PhD Doctorate)
Doctor of Philosophy (PhD)
School of Microelectronic Engineering
Full Text
Saysouk, François. "Élaboration et caractérisation de films polyimide-nitrure de bore nanocomposites pour l'isolation électrique à haute température." Toulouse 3, 2014. http://thesesups.ups-tlse.fr/2445/.
Full textThe advanced research for warm regions integration and/or operation in power electronics, results in an increased level of electrical and thermal stresses imposed on all their constituents. This concerns, in particular, the components of the power modules and high temperature rotating machines. In literature a thin dielectric layer for the high temperature (> 200 °C) isolation of different parts in power modules and rotating machines is missing. Polyimides, thermosetting polymer materials, are good candidates for this type of applications; however in this range of temperatures, these are limited from an electrical point of view. The introduction of inorganic nanoparticles in the polyimide matrix can be a solution to enhance its dielectric properties. The availability of new nanoparticles allows the fabrication of increased performance nanocomposites with high electric field and high temperature (up to 400 °C) performances. In this thesis, novel polyimide/boron nitride (PI/BN) nanocomposites have been prepared. Their dielectric properties were studied particularly in the range from 200 °C to 350 °C. Also, the influence of the size of the nanoparticles of BN (between 40 nm and 250 nm) has been studied. It's known that the presence of agglomerates in the nanocomposites limits the dielectric properties under high electric field; many improvements have been made in this direction to ameliorate the fabrication process. Dielectric losses, conduction currents and electrical conductivity improvements have been obtained in the nanocomposites compared to the neat matrix: a 2 to 4 decades reduction has been measured in the considered temperature range. Furthermore, the breakdown field resulted doubled at 350 °C for nanocomposites. Finally an analysis of the various physical mechanisms involved in the electrical conduction improvement was realised
Dunson, Debra Lynn. "Synthesis and Characterization of Thermosetting Polyimide Oligomers for Microelectronics Packaging." Diss., Virginia Tech, 2000. http://hdl.handle.net/10919/27394.
Full textPh. D.
Schlea, Michelle Renee. "Processing and characterization of high performance polyimide nanocomposites." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/39557.
Full textSturgill, G. Kip. "Stabilization of polyimide blends through solid-state crosslinking." Diss., Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/10080.
Full textChuang, Yen-Ling, and 莊燕鈴. "Preparation and Properties of Polyimide/Clay and Polyimide/Titania Nanocomposite Materials." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/90298028628155407390.
Full text中原大學
化學研究所
91
Abstract This essay is divided into two parts。 In the first part,a series of polyimide/clay nancomposite materials consist of electroctive polyimide and clay were successfully prepared。 Aniline trimer,4,4-oxydianiline (ODA) and 4,4-oxydiphthalic anhydride (OPDA) were employed to synthesize polyimide。 The polyimide/clay nancomposite materials were prepared by effectively dispersing the inorganic nanolayers of MMT clay in to the organic Polyimide matrix via an chemical imidization up to 300℃polymerization。 The as-synthesized polyimide/clay nanocomposite materials were characterized by FTIR、XRD and TEM。 The incorporation of MMT clay in polyimide matrix show better thermal properties、gas barrier properties and ionic conductivity。 The second part is the preparation and properties of organic/inorganic compound of polyimide/TiO2 nanocomposite materials。 TiO2 was introducedd to polyimide matrix by a chelating ligand which was different from traditional sol-gel process。 In this study,we also found the thermal and mechanic properties would will rise by increasing the content of inorganic oxide TiO2 through TGA,DMA and tensile test。 The permeability properties of H2O,O2 and N2 were obviously reduced as TiO2 content increased。
Lin, Hung-Ju, and 林弘儒. "The study of polyimide-silica hybrid derived from the 4,4-hexafluoroisopropylidene dianiline based polyimides." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/644ra5.
Full text中原大學
化學工程研究所
93
In this study, a series of 4,4-hexafluoroisopropylidene dianiline based polyimides were prepared using three different kinds of dianhydride. In addition, in order to promote the glass transfer temperature of polyimide, we will use the TEOS for Sol-Gel reaction to make the organic/inorganic hybrid materials. Our results are shown that 6FDA-6FDAm of these fluorinated polyimides have the lowest dielectric constant, it will be low for 2.7, this result is shown that more fluorinated groups will reduce dielectric constant substantially, besides our results are also shown that silica hybrid polyimide will promote the glass transfer temperature substantially, it will rise to 352℃(@ 30 wt% silica hybrid)from 328℃,but the dielectric constant still hold in 3.1, this result is shown that added silica particles will rise the glass transfer temperature of 6FDA-6FDAm. Finally, all of 4,4-hexafluoroisopropylidene dianiline based polyimides show good thermal stability (>480℃), good mechanical properties (Young modulus>1.2 GPa), and good diffusion barrier to resist copper penetration, this result is shown that these materials have good opportunity to be used as low-k materials in microelectronic process.
Chen, Yuan-Bao, and 陳源保. "Metallization of Polyimide Film." Thesis, 2009. http://ndltd.ncl.edu.tw/handle/34059526572317612293.
Full text國立高雄應用科技大學
化學工程與材料工程系
97
The film characterization of surface silvered polyimide film (PI-Ag film) based on self-synthesized PI film (s-BPDA/4,4’-ODA type) and commer-cial PI film (Du Pont® PI film, D-PI film, PMDA/ODA type) were suffi-ciently discussed. PI-Ag films were prepared by the base treatment, ion-exchange reaction and different reduction methods. There are four re-duction methods, including a method at elevated oven temperature at 300 oC (Method I), a method at 300 oC oven and nitrogen gas purged (Method II), in oven under the vacuum at 200 oC (Method III), and in reduction agent N,N-dimethylformamide (DMF) solution (Method IV). The PI-Ag films were characterized by X-ray diffraction (XRD), Energy dispersive X-ray spectroscopy (EDX), Scanning electron microscopy (SEM), four probe points, UV-Visible and cross-cut tester. A better surface properties for each PI film (self-synthesized, and com-mercialized) has been achieved by the reduction Method I. The reflectivity of these samples was higher than 75% and 70% respectively for PI film and D-PI film. Surface resistivity was 0.2 Ω/sq and 0.3 Ω/sq respectively for PI film and D-PI film. The silver layer thickness was 400 nm and 500 nm re-spectively for PI film and D-PI film. Cross-cut tester showed a good adhe-sion between PI film (or D-PI film) and silver layer on PI-Ag film.
Chang, Jen-Cheng, and 張鎮城. "Study on modified polyimide." Thesis, 1997. http://ndltd.ncl.edu.tw/handle/13933866263968453654.
Full textLai, Young-Woei, and 賴永偉. "Solvent Effect on the Imidization Kinetics During Reactive Blending of Polyimide / Polyimide Molecular Composites." Thesis, 1997. http://ndltd.ncl.edu.tw/handle/82603501582660003128.
Full textYuan, Yu-Cheng, and 袁宇呈. "Thermal Conductivity of Inorganic Fillers and Liquid Crystal Polyimide Blending with Commercial Polyimide Composites." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/76715271413056805064.
Full textTSAI, Tung-Ying, and 蔡東穎. "the study of soluble polyimide." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/18513217788266274675.
Full text國立成功大學
化學工程學系
86
Abstract The synthesis of soluble polyimide was carried out by 1,4-bis(4- aminophenoxy)-2-tert-butylbenzene (BATB) which containing pendent bulky tert-butyl substituent with 3,3'',4,4''-tetracarboxylic dianhydride (BTDA) via a solution imidization procedure in an organic solvant . The structures of soluble polyimides have been identified by the analysis of infrared spectra , 1H-NMR spectra and pattern of x-ray diffraction . Furthermore , TGA , DSC , TMA , and DMA measurements are used to evaluate the thermal stability , glass transition temperature , thermal expansion coefficient and thermal mechanical properties .The mechanical properties such as tensile strength of various polyimide films were also obtained by using universal testing instrument . The molecular weight of polymers were decreased sharply initial stage during solution imidization under high temperature , and then , the molecular weight increases with increasing reaction time . Finally , reached a maximum of steady state . A highly imidization rate (almost 100% imidization) of soluble polyimide may be obtained at 180℃ for 16 hours . The copper foil clad polyimide films was prepared by coating soluble polyimide and polyimide precursor (PAA) solution on the copper foil respectively , and then heated from 50℃ to 300℃ . From the observation of SEM , it can''t observed that any copper particles was diffused into the polyimide layer , the result will cause no change the characteristics of polyimide . In the contrast to the case of polyamic acid coating , it is observed that much more copper particles are migrated in polyimide film near the interface of copper foil , the result will cause most properties of polyimide to be reduced .