Relevant bibliographies by topics / Polyimide

Academic literature on the topic 'Polyimide'

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Published: 4 June 2021
Last updated: 4 May 2024

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Journal articles on the topic "Polyimide"

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Xiao, T. J., S. Q. Gao, A. J. Hu, X. C. Wang, and S. Y. Yang. "Thermosetting Polyimides with Improved Impact Toughness and Excellent Thermal and Thermo-Oxidative Stability." High Performance Polymers 13, no. 4 (December 2001): 287–99. http://dx.doi.org/10.1088/0954-0083/13/4/307.

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Thermoset polyimides were prepared by thermally curing B-staged endcapped polyimide resins that were obtained by thermally baking PMR polyimide matrix resins. The polyimide matrix resins were prepared by incorporating flexible ether-bridged aromatic segments [–Ar–O–Ar–] into PMR polyimide backbone to improve their processability and impact toughness. Experimental results indicated that the B-staged polyimide resins possessed adjustable and easily controllable thermal processability which ensure that thermoset polyimides are produced with improved impact strength and high glass transition temperature compared with PMR-15. Thermal and thermo-oxidative stability as well as hygrothermal resistance of the thermoset polyimides were also systemically investigated.
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Yamada, Yasuharu. "Siloxane Modified Polyimides for Microelectronics Coating Applications." High Performance Polymers 10, no. 1 (March 1998): 69–80. http://dx.doi.org/10.1088/0954-0083/10/1/009.

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Two types of siloxane modified polyimide were prepared as coating materials for microelectronics applications and their thermal, mechanical, electrical, adhesive and coating properties were characterized. The coatings prepared were classified as polysiloxane block (type A) polyimides and disiloxane modified (type B) polyimides. All of the polyimides showed excellent thermal, mechanical, electrical, adhesive and coating properties suitable for use in microelectronics coating applications. The type A polyimides have lower dielectric constants and good stress relaxation capability as compared with typical aromatic polyimides. The type B polyimides have excellent adhesive properties to silicon wafers. The polyimide prepared from 2, 2-bis[4-aminophenoxyphenyl]hexafluoropropane exhibited the lowest dielectric constant due to the presence of trifluoromethyl groups in the polymer backbone. Model encapsulated semiconductor devices coated with various polyimides were assembled, and the interface adherence between the polyimide and the encapsulant along with the reliability of the semiconductor devices were examined. Superior interface adherence between the polyimide passivant and the encapsulant was exhibited, resulting in improved reliability of integrated circuit chips. With the incorporation of siloxane moieties into the polyimide backbone these siloxane modified polyimides were shown to be good candidate materials for microelectronics coatings.
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Takeichi, Tsutomu, Kohji Nakajima, Min Zuo, and Rikio Yokota. "Polyimide/Polyimide Molecular Composite Films: Difference between Reactive Oligoimide and Reactive Polyimide as the Matrix Component." High Performance Polymers 10, no. 1 (March 1998): 111–20. http://dx.doi.org/10.1088/0954-0083/10/1/012.

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Polyimide/polyimide molecular composite (MC) films were prepared by blending precursor solutions of a rigid polyimide and a reactive oligoimide or a reactive polyimide that contains acetylene units in the backbone in a 7:3 ratio, followed by casting, drying and thermal imidization at 300 °C. 3, 3′, 4, 4′-Biphenyltetracarboxylic dianhydride (BPDA), pyromellitic dianhydride (PMDA), p-phenylenediamine (PDA), oxydianiline (ODA) and 3, 3′-diaminodiphenylacetylene ( m-intA) were used as acid dianhydride and diamine monomers for the preparation of polyimide. The rigid components were prepared from PMDA or BPDA and PDA. The matrix components were prepared from PMDA or BPDA and ODA or m-intA. The polyimide/polyimide MCs have exotherm on DSC due to the reaction of internal acetylene units, which indicates that the MC films are laminate processable. Tensile measurements revealed that the tensile modulus of the MCs utilizing reactive oligoimides is 20–30% higher than that of the MCs utilizing reactive polyimides. Viscoelastic analyses of the MC films showed that the crosslinking of the acetylene units gave polyimides that have a very high glass transition temperature.
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Araki, Hitoshi, Akira Shimada, Hisashi Ogasawara, Masaya Jukei, Takenori Fujiwara, and Masao Tomikawa. "Low Temperature Curable Low Dk & Df Polyimide for Antenna in Package." International Symposium on Microelectronics 2021, no. 1 (October 1, 2021): 000130–35. http://dx.doi.org/10.4071/1085-8024-2021.1.000130.

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Abstract In this paper, we developed novel low temperature curable (around 200~250 °C) low Dk (2.7) & Df (0.002) polyimide with high glass transition temperature (170 °C) and elongation (100%). We also developed negative tone photosensitive polyimide with low Dk (3.0) & Df (0.007) by photo initiator and cross linker. Material types of them are liquid or B-stage sheet materials. Patterning methods of the non-photosensitive polyimides were imprint and UV laser ablation. Resolution of those process were 10um via and 30um via respectively. Photosensitive polyimide was patterned by photolithographic tool. We fabricated fine patterned polyimide of photosensitive polyimide by photolithography. We investigated the frequency dependence of the novel low Dk & Df polyimide up to 95 GHz, and confirmed that Df gradually increased from 0.002 to 0.005 as the frequency increased. To confirm effect of the novel polyimide, insertion loss of micro-strip line whose length was 10 mm were measured using the new developed polyimide. Insertion loss (S21 parameter) of the novel polyimide was 0.8 and that was less than half of conventional polyimide. RDL structure was fabricated by novel low Dk and Df polyimide and we tested bump shear strength after thermal cycle test. All shear mode were ductile solder failure without polyimide delamination. Because our novel polyimides show excellent dielectric, thermal and mechanical properties, they are suitable to insulator of RDL for FO-AiP.
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Tomikawa, Masao, Kazuyuki Matsumura, Yu Shoji, Yoshiko Tatsuta, and Ryoji Okuda. "Fine Resolution Photosensitive Polyimide Dry Film with High Resistance to Electromigration under HAST condition." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000029–35. http://dx.doi.org/10.4071/isom-2017-tp15_126.

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Abstract We investigated the effects of photosensitive system (positive and negative) and polymer structures on Cu migration under bias HAST test. The HAST condition is 130C for 85% RH. Bias condition is 2MV/m. We found that there is polyimide structure shows big effect is big effect of no big difference between negative photosensitivity and positive photosensitivity in photo sensensitive polyimides. Polyimide structure effects significant difference on Cu migration under bias HAST condition. Cu migration of soft polyimide seems better than that of rigid polyimide. From these results, we developed good reliable photosensitive polyimide B-sheet having fine pattern capability successfully.
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Yuan, Yuan, Bing Xie, and Yu Wang. "An Interesting Result of Dielectric Property for Novel Polyimides with Fluorene Groups." Materials Science Forum 663-665 (November 2010): 511–14. http://dx.doi.org/10.4028/www.scientific.net/msf.663-665.511.

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A series of polyimide thin films were prepared successfully based on bis[3,5-dimethyl-4- (4-aminophenoxy)phenyl]methane （BDAPM）, 9,9-bis（4-（4-aminophenoxy）phenyl）fluorene (BAOFL) and different dianhydrides. And an interesting result of dielectric property for polyimide thin films was found that the polyimide thin film prepared with 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) exhibited high dielectric constants of 5.7 at 1MHz. Conversely, the other polyimides possessing fluorene groups showed low dielectric constants. The structures and the mechanical properties of polyimide films also proved the reason for results of dielectric properties.
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Rosolovsky, J., R. K. Boggess, A. F. Rubira, L. T. Taylor, D. M. Stoakley, and A. K. St. Clair. "Supercritical fluid infusion of silver into polyimide films of varying chemical composition." Journal of Materials Research 12, no. 11 (November 1997): 3127–33. http://dx.doi.org/10.1557/jmr.1997.0408.

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Polyimides can be infused with silver complexes by the use of supercritical fluids. Highly reflective polyimide films were formed by infusing (1,5-cyclooctadiene-1,1,1,5,5,5-hexafluoroacetylacetonato)silver(I) [Ag(COD) (HFA)] into a number of polyimides and then thermally curing those films at 300 °C for time intervals between 30 min and 3 h. Reflectivities of the films exhibited strong dependence on the infusion and cure conditions as well as on the type of polyimide used. The highest reflectivity of 67.1% was achieved with a silvered film prepared from 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride (BTDA) and oxydianiline (ODA) infused at 5000 psi, 100 °C, for 30 min and cured for 1 h at 300 °C. Reflectivities of silvered surfaces of other polyimides investigated varied from 39% to 61%. A strong correlation between the presence of a ketonic group in the polyimide structure and the formation of mirror surfaces was detected.
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Vaganov G. V., Didenko A. L., Myagkova L. A., Elohovsky V. Yu., Popova E. N., and Yudin V. Yu. "Viscoelastic properties of carbon plastics based on powdered polyimide binders." Technical Physics Letters 49, no. 5 (2023): 60. http://dx.doi.org/10.21883/tpl.2023.05.56031.19403.

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Carbon fiber reinforced plastics based on thermoplastic partially crystalline fusible polyimide R-BAPB and oligoimide IDA (diacetyl imide) have been obtained. The thermal, thermomechanical and mechanical properties of carbon plastics based on polyimides have been studied. It has been shown that carbon plastics based on the used polyimide binders have increased crack resistance, which makes it possible to operate them at temperatures up to ~ 400oC Keywords: carbon fiber reinforced plastic, polyimide binder, electrostatic spraying, interlaminar fracture toughness.
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Hsiao, Sheng-Huei, and Ying-Hsiu Hsiao. "Synthesis and electrochemical properties of new redox-active polyimides with (1-piperidinyl)triphenylamine moieties." High Performance Polymers 29, no. 4 (May 8, 2016): 431–40. http://dx.doi.org/10.1177/0954008316648005.

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A series of new electroactive aromatic polyimides with (1-piperidinyl)triphenylamine moieties were prepared from 4,4′-diamino-4″-(1-piperidinyl)triphenylamine and aromatic tetracarboxylic dianhydrides via the conventional two-step polycondensation technique. Flexible and strong polyimide films could be obtained via the thermal curing of their precursor poly(amic acid) films. The polyimides showed high glass transition temperatures between 288°C and 318°C, and they did not show significant decomposition before 500°C in air or nitrogen atmosphere. Cyclic voltammograms of the polyimide films on the indium–tin oxide-coated glass substrate exhibited a pair of reversible oxidation waves with low onset oxidation potentials of 0.45–0.49 V (vs. silver/silver chloride) in acetonitrile solution. Upon oxidation, the color of the polyimide films changes from pale yellow to yellowish green and finally to blue.
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Zhang, Yixiang, Masahiko Miyauchi, and Steven Nutt. "Structure and properties of a phenylethynyl-terminated PMDA-type asymmetric polyimide." High Performance Polymers 31, no. 3 (March 12, 2018): 261–72. http://dx.doi.org/10.1177/0954008318762592.

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A new polymerized monomeric reactant (PMR)-type polyimide, designated TriA X, was investigated to determine polymer structure, processability, thermal, and mechanical properties and establish the relationship between the molecular structure and those properties. TriA X is a PMR-type polyimide with an asymmetric, irregular, and nonplanar backbone. Both the imide oligomers and the cross-linked polyimides of TriA X exhibited loose-packed amorphous structures, independent of thermal processing. The peculiar structures were attributed to the asymmetric backbone, which effectively prevented the formation of closed-packed chain stacking typically observed in polyimides. The imide oligomers exhibited a lower melt viscosity than a control imide oligomer (symmetric and semi-crystalline), indicating a higher chain mobility above the glass transition temperature ( Tg). The cured polyimide exhibited a Tg = 362°C and a decomposition temperature = 550°C. The cross-linked TriA X exhibited exceptional toughness and ductility (e.g. 15.1% at 23°C) for a polyimide, which was attributed to the high-molecular-weight oligomer and loose-packed amorphous structure. The thermal and mechanical properties of TriA X surpass those of PMR-15 and AFR-PE-4.
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Dissertations / Theses on the topic "Polyimide"

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Gopalanarayanan, Bhaskar. "Analysis of Thermoplastic Polyimide + Polymer Liquid Crystal Blends." Thesis, University of North Texas, 1998. https://digital.library.unt.edu/ark:/67531/metadc279285/.

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Thermoplastic polyimides (TPIs) exhibit high glass transition temperatures (Tgs), which make them useful in high performance applications. Amorphous and semicrystalline TPIs show sub-Tg relaxations, which can aid in improving strength characteristics through energy absorption. The a relaxation of both types of TPIs indicates a cooperative nature. The semicrystalline TPI shows thermo-irreversible cold crystallization phenomenon. The polymer liquid crystal (PLC) used in the blends is thermotropic and with longitudinal molecular structure. The small heat capacity change (ACP) associated with the glass transition indicates the PLC to be rigid rod in nature. The PLC shows a small endotherm associated with the melting. The addition of PLC to the semicrystalline TPI does not significantly affect the Tg or the melting point (Tm). The cold crystallization temperature (Tc) increases with the addition of the PLC, indicating channeling phenomenon. The addition of PLC also causes a negative deviation of the ACP, which is another evidence for channeling. The TPI, PLC and their blends show high thermal stability. The semicrystalline TPI absorbs moisture; this effect decreases with the addition of the PLC. The absorbed moisture does not show any effect on the degradation. The addition of PLC beyond 30 wt.% does not result in an improvement of properties. The amorphous TPI + PLC blends also show the negative deviation of ACP from linearity with composition. The addition of PLC causes a decrease in the thermal conductivity in the transverse direction to the PLC orientation. The thermomechanical analysis indicates isotropic expansivity for the amorphous TPI and a small anisotropy for the semicrystalline TPI. The PLC shows large anisotropy in expansivity. Even 5 wt. % concentration of PLC in the blend induces considerable anisotropy in the expansivity. Thus, blends show controllable expansivity through PLC concentration. Amorphous TPI + PLC blends also show excellent film formability. The amorphous TPI blends show good potential for applications requiring high thermal stability, controlled expansivity and good film formability.
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Cano, Camilo I. "Polyimide Microstructures From Powdered Precursors: Phenomenological and Parametric Studies on Particle Inflation." Akron, OH : University of Akron, 2005. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=akron1123710711.

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Dissertation (Ph.D.)--University of Akron, Dept. of Polymer Engineering, 2005.
"August, 2005." Title from electronic dissertation title page (viewed 09/24/2005) Includes bibliographical references.
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Neuhaus, Herbert John. "Electrical conduction in polyimide." Thesis, Massachusetts Institute of Technology, 1989. http://hdl.handle.net/1721.1/14476.

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MOUANE, KHALID. "Polyimide thin-ply composite." Thesis, Luleå tekniska universitet, Institutionen för teknikvetenskap och matematik, 2018. http://urn.kb.se/resolve?urn=urn:nbn:se:ltu:diva-70118.

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Mechanical performance of composite structures is influenced by the accumulation of damage from the manufacturing process and throughout the whole service life. For instance, an aircraft is subjected to a combination of mechanical loading and the thermo-oxidative environment from the take-off to the landing. Therefore, this degree project consists of studying the damage initiation and evolution in carbon fibre reinforced polyimide composites and assesses the thickness effect of the laminated composites. After manufacturing, the level of residual thermal stresses occurring at room temperature lead to the occurrence of microcracks in bundles of the quasi-isotropic composites. Further cooling to cryogenic temperature creates new cracks were appearing. This reinforces the conclusion that cracks are created due to thermal stresses. Comparison between a baseline composite made of carbon fibre T650 8-harness satin weave with thermosetting polyimide resin (ply thickness= 190µm) and thin-ply textile laminate made of Textreme carbon fibre IMS65 (ply thickness=83µm) with the same resin shows that the ply thickness has a significant effect on suppressing or delaying the occurrence and the propagation of microcracks after mechanical loading. It is assumed that there are some edge effects leading to different damage state in 90° and ±45° layers.
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Cao, Yuanmei. "Antireflective Polyimide Based Films." University of Akron / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=akron1335501090.

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Dangarwala, Gaurav A. "A model of the change in viscosity of polyimide PMR-15 during cure." Ohio : Ohio University, 1993. http://www.ohiolink.edu/etd/view.cgi?ohiou1175284832.

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Wang, Jia. "Synthesis and properties of polyimide/organo clay and polyimide/polyaniline-modified clay nanocomposites." University of Cincinnati / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1282055379.

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Criss, Jim McRae. "Synthesis, characterization, and study of polyimide processing additives and their effect on polyimide properties." Thesis, Georgia Institute of Technology, 1993. http://hdl.handle.net/1853/20015.

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Bott, Richard H. "Characterization of modified polyimide adhesives." Diss., Virginia Polytechnic Institute and State University, 1988. http://hdl.handle.net/10919/53914.

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An addition polyisoimide prepolymer was modified through the incorporation of metal particles. The response of this metal/polymer composite to mechanical vibrations and the passage of electric current was measured. Model aluminum conductor bar joints containing this material were assembled and exposed to elevated temperatures for extended periods of time while the electrical properties of the composites were monitored. In the most favorable systems, no thermal degradation of the electrical properties was observed. Dynamic mechanical behavior of the metal/polymer composites indicated good adhesion between particles and the matrix and also a broadening of the glass transition region as well as a post Tg dispersion in the temperature spectrum. The adhesive properties of these metal/polymer composites to aluminum were studied and found to be influenced by the loading level of the metal in the composite. Chemical reactions occurring during the cure of a neat resin sample of the polyisoimide prepolymer were monitored using infrared spectrometry and differential scanning calorimetry. Both the crosslinking and isomerization reactions were found to be apparently first order with the isomerization having a lower activation energy than the crosslinking. Linear, high molecular weight, thermoplastic polyimides and poly(imide-siloxane) homo- and copolymers prepared by bulk and solution thermal imidization were investigated as structural adhesives for titanium. The solution thermal imidization procedure was found to result in favorable adhesive characteristics while the presence of siloxane segments in the polymer backbone improved the resistance of stressed specimens to moisture. Aluminum-sec-butoxide used as a primer was also found to improve the moisture durability of bonds prepared with these materials.
Ph. D.
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Rojahn, Martin. "Encapsulation of a retina implant /." [S.l. : s.n.], 2003. http://www.bsz-bw.de/cgi-bin/xvms.cgi?SWB10378693.

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Books on the topic "Polyimide"

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1942-, Kricheldorf Hans Rytger, and Abajo J. de, eds. Progress in polyimide chemistry. Berlin: Springer, 1999.

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Kricheldorf, H. R., ed. Progress in Polyimide Chemistry II. Berlin, Heidelberg: Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/3-540-49814-1.

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Kricheldorf, H. R., ed. Progress in Polyimide Chemistry I. Berlin, Heidelberg: Springer Berlin Heidelberg, 1999. http://dx.doi.org/10.1007/3-540-49815-x.

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W, Beltz N., Hergenrother P. M, and United States. National Aeronautics and Space Administration., eds. A new readily processable polyimide. [Washington, DC?: National Aeronautics and Space Administration, 1986.

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M, Reddy Rakasi, and Langley Research Center, eds. Thermoplastic polyimide new-TPI[trademark]. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1990.

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L, Mings S., and United States. National Aeronautics and Space Administration., eds. Fracture toughness of polyimide films. [Washington, D.C.?: National Aeronautics and Space Administration, 1990.

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L, St Clair Terry, and Langley Research Center, eds. LARC-IA: A flexible backbone polyimide. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1990.

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L, St Clair Terry, and Langley Research Center, eds. LARC-IA: A flexible backbone polyimide. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1990.

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McManus, Hugh L. N., 1958- and Lewis Research Center, eds. Long term degradation of polyimide composites. [Cleveland, Ohio]: National Aeronautics and Space Administration, Lewis Research Center, 1998.

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L, St Clair Terry, and Langley Research Center, eds. LARC-IA: A flexible backbone polyimide. Hampton, Va: National Aeronautics and Space Administration, Langley Research Center, 1990.

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Book chapters on the topic "Polyimide"

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Gooch, Jan W. "Polyimide." In Encyclopedic Dictionary of Polymers, 562. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_9101.

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Steiner, G., and C. Zimmerer. "Polyimide (PI)." In Polymer Solids and Polymer Melts – Definitions and Physical Properties I, 871–78. Berlin, Heidelberg: Springer Berlin Heidelberg, 2013. http://dx.doi.org/10.1007/978-3-642-32072-9_96.

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Meador, Mary Ann B., and Stephanie L. Vivod. "Polyimide Synthesis." In Encyclopedia of Polymeric Nanomaterials, 1–11. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-36199-9_275-1.

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Gooch, Jan W. "Polyimide Fiber." In Encyclopedic Dictionary of Polymers, 562. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_9102.

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Gooch, Jan W. "Polyimide Foam." In Encyclopedic Dictionary of Polymers, 562. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_9103.

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Gooch, Jan W. "Polyimide Resin." In Encyclopedic Dictionary of Polymers, 562. New York, NY: Springer New York, 2011. http://dx.doi.org/10.1007/978-1-4419-6247-8_9104.

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Pryde, Coralie A. "Polyimide Hydrolysis." In ACS Symposium Series, 57–66. Washington, DC: American Chemical Society, 1989. http://dx.doi.org/10.1021/bk-1989-0407.ch004.

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Meador, Mary Ann B., and Stephanie L. Vivod. "Polyimide Synthesis." In Encyclopedia of Polymeric Nanomaterials, 1841–50. Berlin, Heidelberg: Springer Berlin Heidelberg, 2015. http://dx.doi.org/10.1007/978-3-642-29648-2_275.

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Ohya, Haruhiko, Vladislav V. Kudryavtsev, and Svetlana I. Semenova. "Preparation of Polyimide Membranes." In Polyimide Membranes, 179–239. London: Routledge, 2022. http://dx.doi.org/10.1201/9780203742969-5.

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Ohya, Haruhiko, Vladislav V. Kudryavtsev, and Svetlana I. Semenova. "Introduction." In Polyimide Membranes, 1–8. London: Routledge, 2022. http://dx.doi.org/10.1201/9780203742969-1.

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Conference papers on the topic "Polyimide"

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Beuhler, Allyson J., David A. Wargowski, Kenneth D. Singer, Tony Kowalczyk, Paul A. Cahill, and Carl Seager. "Polyimide Optical Waveguides." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/otfa.1993.fa.1.

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Aromatic polyimides are of interest for integrated optics due to a combination of high thermal stability and easy processibility into planar structures. Polyimides can withstand chip attach and package assembly temperatures and are resistant to corrosive etchants and cleaning solvents making them compatible with a variety of substrates and metallization schemes. Waveguides from polyimide can be patterned by photobleaching1 or etching2 using standard semiconductor or printed circuit board technology and equipment. Polyimide properties are easily engineered by co-polymerization with co-diamines or dianhydrides to tailor the refractive indices or incorporate photosensitivity. Electro-optic polyimides have been demonstrated that incorporate non-linear optical chromophores by guest-host doping.3
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Liu, Hong-Che, and Chih Chen. "Low temperature polyimide-to-polyimide direct bonding." In 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D). IEEE, 2019. http://dx.doi.org/10.23919/ltb-3d.2019.8735216.

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Maruno, T., T. Sakata, T. Ishii, Y. Y. Maruo, S. Sasaki, and T. Tamamura. "Polyimide Optical Waveguides Fabricated by Direct Electron Beam Writing." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1995. http://dx.doi.org/10.1364/otfa.1995.ma.3.

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Polymer optical waveguides are attractive for fabricating economical and practical optoelectronic devices and interconnections in optical communication systems [1,2]. Channel waveguides, therefore, have been produced using several polymers such as poly(methyl methacrylate), polystylene, poly(organosiloxane), and polyimide [3-6]. One of the first priorities for polymer waveguides is high thermal stability so that soldering can be used in conventional device fabrication. Fluorinated polyimides are promising candidates for waveguide materials because they show high thermal stability and low optical loss near the IR wavelength region. We have previously developed novel fluorinated polyimides [7] and manufactured a single-mode optical waveguide for them by using conventional reactive ion etching (RIE) [8]. Moreover, we recently clarified that the refractive index of fluorinated polyimides can be controlled by electron beam irradiation [9], and that optical waveguides can thus be fabricated by direct electron beam writing (DEBW) [10,11]. This method is very useful because the fabrication process becomes simpler than when using RIE. In this paper, we propose a new optical waveguide fabricated by DEBW, which consists of a single material and a simple two-layer structure.
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Sun, Xuenan, Jiajing Zhang, Dan Sheng, and Chunhua Zhang. "Surface Modification of Polyimide Fibers and The Bending Property of Polyimide Fiber/Polyimide Composite." In ICBET 2022: 2022 12th International Conference on Biomedical Engineering and Technology. New York, NY, USA: ACM, 2022. http://dx.doi.org/10.1145/3535694.3535729.

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Tameev, Alek R., Aleksey A. Kozlov, Eugene I. Mal'tsev, Dmitry A. Lypenko, Vladimir V. Bobonkin, and Anatoly V. Vannikov. "Charge carrier transport in aromatic polyimides and polyimide/J-aggregate composites." In International Symposium on Optical Science and Technology, edited by Zakya H. Kafafi. SPIE, 2001. http://dx.doi.org/10.1117/12.416926.

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Chen, Shih-Shiung, Hung-Chih Chen, and Chen-Cheng Kuoe. "Polyimide defect reduction." In Microelectronic Manufacturing, edited by Anthony J. Toprac and Kim Dang. SPIE, 1998. http://dx.doi.org/10.1117/12.324355.

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Yang, Dongya, Qing Zhang, Fengxian Qiu, and Guorong Cao. "Synthesis and electro-optic property of intercalation polyimide and polyimide/ silica." In 2008 2nd IEEE International Nanoelectronics Conference. IEEE, 2008. http://dx.doi.org/10.1109/inec.2008.4585511.

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Tomikawa, Masao, Kazuyuki Matsumura, Yutaro Koyama, Yoshifumi Ikeda, Yoshiko Tatsuta, and Yu Shoji. "Photosensitive polyimide adhesive sheet." In 2016 IEEE CPMT Symposium Japan (ICSJ). IEEE, 2016. http://dx.doi.org/10.1109/icsj.2016.7801288.

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Franke, H., and J. D. Crow. "Optical Waveguiding in Polyimide." In 1986 International Symposium/Innsbruck, edited by Ralf T. Kersten. SPIE, 1986. http://dx.doi.org/10.1117/12.938136.

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Fujita, Shigetaka, Katsuyoshi Shinyama, and Makoto Baba. "Electrical properties of polyimide." In International Conference on Dielectric and Related Phenomena '98, edited by Andrzej Wlochowicz. SPIE, 1999. http://dx.doi.org/10.1117/12.373691.

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Reports on the topic "Polyimide"

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Lamb, R. N., M. Grunze, J. Baxter, C. W. Kong, and W. N. Unertl. Vapor Deposition of Polyimide and Polyimide Precursors on Copper. Fort Belvoir, VA: Defense Technical Information Center, August 1990. http://dx.doi.org/10.21236/ada225729.

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Moore, J. A., and Andrew N. Dasheff. A Soluble Photosensitive Polyimide. Fort Belvoir, VA: Defense Technical Information Center, June 1989. http://dx.doi.org/10.21236/ada209634.

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Maurer, M., A. Tooker, and S. Felix. Characterization of polyimide via FTIR analysis. Office of Scientific and Technical Information (OSTI), August 2014. http://dx.doi.org/10.2172/1165755.

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Saunders, R. S., J. H. Aubert, and W. F. McNamara. Microporous polyimide films for reduced dielectric applications. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/282789.

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Hoyle, C. E., E. T. Anzures, and P. Subramanian. Photodegradation of Polyimides. 5. An Explanation of the Rapid Photolytic Decomposition of a Selected Polyimide via Anhydride Formation. Fort Belvoir, VA: Defense Technical Information Center, May 1991. http://dx.doi.org/10.21236/ada236247.

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Cai, Sui X., M. N. Wybourne, and John F. Keana. A Novel Photosensitive Polyimide Resist Consisting of a Soluble Polyimide and a Bis(perfluorophenyl Azide) as a Cross-Linker. Fort Belvoir, VA: Defense Technical Information Center, June 1993. http://dx.doi.org/10.21236/ada265998.

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Kumosa, Maciej S., Kevin H. Searles, Greg Odegard, and V. Thirumalai. Biaxial Failure Analysis of Graphite Reinforced Polyimide Composites. Fort Belvoir, VA: Defense Technical Information Center, November 1996. http://dx.doi.org/10.21236/ada329883.

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Maseeh, Fariborz, and Stephen D. Senturia. Viscoelasticity and Creep Recovery of Polyimide Thin Films. Fort Belvoir, VA: Defense Technical Information Center, June 1990. http://dx.doi.org/10.21236/ada225475.

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Cook, R. Solution Based Deposition of Polyimide Ablators for NIF Capsules. Office of Scientific and Technical Information (OSTI), July 2002. http://dx.doi.org/10.2172/15004914.

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Dickens, Brian. Photoacoustic infrared spectroscopy of thin polyimide layers on glass substrates. Gaithersburg, MD: National Institute of Standards and Technology, 1997. http://dx.doi.org/10.6028/nist.ir.6097.

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