Relevant bibliographies by topics / Plasma deposition

Academic literature on the topic 'Plasma deposition'

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Published: 4 June 2021
Last updated: 22 June 2023

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Journal articles on the topic "Plasma deposition"

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Kuchakova, Iryna, Maria Daniela Ionita, Eusebiu-Rosini Ionita, Andrada Lazea-Stoyanova, Simona Brajnicov, Bogdana Mitu, Gheorghe Dinescu, et al. "Atmospheric Pressure Plasma Deposition of Organosilicon Thin Films by Direct Current and Radio-frequency Plasma Jets." Materials 13, no. 6 (March 13, 2020): 1296. http://dx.doi.org/10.3390/ma13061296.

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Thin film deposition with atmospheric pressure plasmas is highly interesting for industrial demands and scientific interests in the field of biomaterials. However, the engineering of high-quality films by high-pressure plasmas with precise control over morphology and surface chemistry still poses a challenge. The two types of atmospheric-pressure plasma depositions of organosilicon films by the direct and indirect injection of hexamethyldisiloxane (HMDSO) precursor into a plasma region were chosen and compared in terms of the films chemical composition and morphology to address this. Although different methods of plasma excitation were used, the deposition of inorganic films with above 98% of SiO2 content was achieved for both cases. The chemical structure of the films was insignificantly dependent on the substrate type. The deposition in the afterglow of the DC discharge resulted in a soft film with high roughness, whereas RF plasma deposition led to a smoother film. In the case of the RF plasma deposition on polymeric materials resulted in films with delamination and cracks formation. Lastly, despite some material limitations, both deposition methods demonstrated significant potential for SiOx thin-films preparation for a variety of bio-related substrates, including glass, ceramics, metals, and polymers.
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Guchenko, S. A., E. N. Eremin, V. M. Yurov, V. Ch Laurinas, S. S. Kasimov, and O. N. Zavatskaya. "AUTOWAVE PROCESSES IN DEPOSITION OF PLASMA COATINGS." Bulletin of the Karaganda University. "Physics Series" 92, no. 4 (December 30, 2018): 8–18. http://dx.doi.org/10.31489/2018phys4/8-18.

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Herman, Herbert. "Plasma Spray Deposition Processes." MRS Bulletin 13, no. 12 (December 1988): 60–67. http://dx.doi.org/10.1557/s0883769400063715.

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The concept of plasma is central to many scientific and engineering disciplines—from the design of neon advertisement lights to fusion physics. Plasmas vary from low density, slight states of ionization (outer space) to dense, thermal plasmas (for extractive metallurgy). And plasmas are prominent in a wide range of deposition processes — from nonthermal plasma-activated processes to thermal plasmas, which have features of flames and which can spray-deposit an enormous variety of materials. The latter technique, arc plasma spraying (or simply, plasma spraying) is evolving rapidly as a way to deposit thick films (>30 μm) and also freestanding forms.This article will review the technology of plasma spraying and how various scientific disciplines are contributing to both an understanding and improvement of this complex process.The plasma gun dates back to the 1950s, when it was introduced for the deposition of alloys and ceramics. Due to its high temperature flame it was quickly discovered that plasmas could be used for depositing refractory oxides as rocket nozzle liners or to fabricate missile nose cones. In the latter technique, the oxide (e.g., zirconia-based ceramics, spinel) was sprayed onto a mandrel and the deposited material was later removed as a free-standing form.The technique's versatility has attracted considerable industrial attention. Modern high performance machinery is commonly subjected to extremes of temperature and mechanical stress, to levels beyond the capabilities of present-day materials. It is becoming increasingly common to form coatings on such material surfaces to protect against high temperature corrosive media and to enhance mechanical wear and erosion resistance. Several thousand parts within an aircraft gas turbine engine have protective coatings, many of them plasma sprayed. In fact, plasma spraying has emerged as a major means to apply a wide range of materials on diverse substrates. The process can be readily carried out in air or in environmental chambers and requires very little substrate surface preparation. The rate of deposit buildup is rapid and the costs are sufficiently low to enable widening applications for an ever increasing variety of industries.
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Ray, M. A., J. Duarte, and G. E. McGuire. "Selective plasma deposition." Thin Solid Films 236, no. 1-2 (December 1993): 274–80. http://dx.doi.org/10.1016/0040-6090(93)90682-f.

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JangJian, Shiu-Ko, and Ying-Lang Wang. "Substrate Effect on Plasma Clean Efficiency in Plasma Enhanced Chemical Vapor Deposition System." Active and Passive Electronic Components 2007 (2007): 1–5. http://dx.doi.org/10.1155/2007/15754.

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The plasma clean in a plasma-enhanced chemical vapor deposition (PECVD) system plays an important role to ensure the same chamber condition after numerous film depositions. The periodic and applicable plasma clean in deposition chamber also increases wafer yield due to less defect produced during the deposition process. In this study, the plasma clean rate (PCR) of silicon oxide is investigated after the silicon nitride deposited on Cu and silicon oxide substrates by remote plasma system (RPS), respectively. The experimental results show that the PCR drastically decreases with Cu substrate compared to that with silicon oxide substrate after numerous silicon nitride depositions. To understand the substrate effect on PCR, the surface element analysis and bonding configuration are executed by X-ray photoelectron spectroscopy (XPS). The high resolution inductively coupled plasma mass spectrometer (HR-ICP-MS) is used to analyze microelement of metal ions on the surface of shower head in the PECVD chamber. According to Cu substrate, the results show that micro Cu ion and theCuOxbonding can be detected on the surface of shower head. The Cu ion contamination might grab the fluorine radicals produced byNF3ddissociation in the RPS and that induces the drastic decrease on PCR.
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Rossnagel, S. M., and J. J. Cuomo. "Ion-Beam-Assisted Deposition and Synthesis." MRS Bulletin 12, no. 2 (March 1987): 40–51. http://dx.doi.org/10.1557/s0883769400068391.

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Concurrent energetic particle bombardment during film deposition can strongly modify the structural and chemical properties of the resulting thin film. The interest in this technique, ion-assisted deposition, comes about because it can be used to produce thin films with properties not achievable by conventional deposition. Bombardment by low energy ions occurs during almost all plasma-based thin film deposition techniques. Bombardment of a growing film, particularly by accelerated ions, can also be combined with non-plasma-based deposition techniques, such as evaporation, to simulate some of the effects observed with sputtering. The bombarding particle flux is usually controllable so that the arrival rate, energy, and species can be independently varied from the depositing flux. Thus, a basic aspect of ion-beam-based deposition techniques is the “control” often absent in plasma-based techniques. In plasmas, the voltage, current, and pressure are all interdependent. The energetic bombardment at the substrate-film interface depends on the various properties of the plasma, as does the deposition rate. It is often difficult, or even impossible, to decouple these processes. With ion-beam-based deposition techniques, the ion bombardment is essentially independent of the deposition process, and both can be more easily controlled.The incident energetic particle contributes some of its energy or momentum to irreversibly change the dynamics of the film surface. The incident particle may also be incorporated into the growing film, changing the film's chemical nature. The changes induced by particle bombardment during deposition are often not characteristic of equilibrium thermodynamics because the incident particle's energy is often many times the local adsorption or binding energy.
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Kroesen, G. M. W., C. J. Timmermans, and D. C. Schram. "Expanding plasma used for plasma deposition." Pure and Applied Chemistry 60, no. 5 (January 1, 1988): 795–808. http://dx.doi.org/10.1351/pac198860050795.

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Vallée, Christophe, Marceline Bonvalot, Samia Belahcen, Taguhi Yeghoyan, Moustapha Jaffal, Rémi Vallat, Ahmad Chaker, et al. "Plasma deposition—Impact of ions in plasma enhanced chemical vapor deposition, plasma enhanced atomic layer deposition, and applications to area selective deposition." Journal of Vacuum Science & Technology A 38, no. 3 (May 2020): 033007. http://dx.doi.org/10.1116/1.5140841.

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Yang, Chu-Hao, Chun-Ping Hsiao, Jerry Chang, Hsin-Yu Lo, and Yun-Chien Cheng. "Large area, rapid, and protein-harmless protein–plasma-polymerized-ethylene coating with aerosol-assisted remote atmospheric-pressure plasma deposition." Journal of Physics D: Applied Physics 55, no. 19 (February 15, 2022): 195203. http://dx.doi.org/10.1088/1361-6463/ac5148.

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Abstract Our goal is to establish a remote-plasma-based aerosol-assisted atmospheric-pressure plasma deposition (RAAPD) system for depositing protein–plasma-polymerized-ethylene coatings. The method of RAAPD is using plasma to polymerize ethylene and add protein aerosol at downstream region to coat protein–plasma-polymerized-ethylene on substrate. We investigated effects of different mixing, mesh, deposition distance, gas flow, voltage, and frequency. Results showed that downstream-mixing method reduced heat effects on protein. The optimal coating was achieved when using mesh, at a close deposition distance, with high flow rate of protein aerosol, and under high voltage. Compared with current methods, impacts of RAAPD include reducing effects of plasma generated heat, reactive species, and UV on protein, and deposition will not be limited by electrode area and substrate material.
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Groza, Andreea, Dragana B. Dreghici, and Mihai Ganciu. "Calcium Phosphate Layers Deposited on Thermal Sensitive Polymer Substrates in Radio Frequency Magnetron Plasma Discharge." Coatings 9, no. 11 (October 30, 2019): 709. http://dx.doi.org/10.3390/coatings9110709.

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Calcium phosphate coatings were deposited on thermally sensitive polyprophylene substrates in radio frequency (rf) magnetron sputtering discharge. The steady state of the deposition plasma and its components were identified by deposition rate measurements and mass spectrometry. Low rf powers and deposition rates, with a 10 min plasma on/off temporal deposition scheme, were established as suitable experimental conditions for the deposition of calcium phosphate layers on the thermoplastic polymers. By scanning electron microscopy and atomic force microscopy, the influence of the polymer substrate heating to the surface coating topography was studied. The results showed that the thermal patterning of the polymers during the plasma deposition process favors the embedding of the calcium phosphate into the substrate, the increase of the coating surface roughness, and a good adherence of the layers. The layers generated in the 10 min plasma on/10 min plasma off deposition conditions were not cracked or exfoliated. The Fourier Transform Infrared spectra of the polyprophylene substrates presented similar molecular bands before and after the depositions of calcium phosphate layers.
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Dissertations / Theses on the topic "Plasma deposition"

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Rajendiran, Sudha. "Plasma enhanced pulsed laser deposition." Thesis, University of York, 2017. http://etheses.whiterose.ac.uk/20437/.

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This thesis introduces a novel deposition technique, Plasma-Enhanced Pulsed Laser Deposition (PE-PLD) that attempts to overcome limitations in traditional PLD by combining it with a background oxygen RF plasma instead of a neutral gas. Advantages of this novel technique for the deposition of metal-oxide films include, the use of simple, pure metal targets instead of metal-oxide composite targets and the lack of the necessity for substrate heating and post-annealing to obtain high-quality films. The feasibility of this method was studied both numerically and experimentally. Numerical simulations of the laser ablation process and an Inductively Coupled Plasma (ICP), i.e. the oxygen RF plasma, using different 2D hydrodynamic codes, found that the densities of the Cu plume and ICP were similar in front of the substrate, allowing the necessary interaction between them to oxidize the Cu and deposit a CuO film. Time-resolved optical emission spectroscopy provided electron temperatures and densities that were used to benchmark the modelling results as well as provide some insight into the process of slowing down of the plume due to the background gas. Also, the assumption of Local Thermodynamic Equilibrium (LTE), commonly used in these diagnostic techniques, was investigated and found to not be strictly full filled for most of the ablation process, meaning that further investigations are needed to confirm the validity of these diagnostics. Finally, copper oxide thin films were deposited using PE-PLD. Analysis of the composition showed that high-quality films could be formed and that at a low oxygen pressure stoichiometric, polycrystalline CuO was formed, while at a higher pressure stoichiometric, polycrystalline Cu2O was deposited.
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Haque, Yasmeen. "Deposition of plasma polymerized thin films /." Thesis, Connect to this title online; UW restricted, 1985. http://hdl.handle.net/1773/9848.

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Bao, Yuqing. "Plasma spray deposition of polymer coatings." Thesis, Brunel University, 1995. http://bura.brunel.ac.uk/handle/2438/5152.

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This work investigates the feasibility of the use of plasma spray deposition as a method of producing high performance polymer coatings. The work concentrates on the understanding of the processing of the plasma spraying of polymers, the behaviour of polymeric materials during deposition, and the study of process-structure-properties relationships. Processing modelling for the three stages of the evolution of a polymer deposit (droplet-splat-coating) has been carried out using heat transfer theory. A theoretical model is proposed which consists of three parts: the first part predicts the temperature profile of in-flight particles within plasma jet, the second part predicts the cooling of isolated splats impacting on a substrate and the third part, the heat transfer through the coating thickness. The heat transfer analysis predicts that the development of large temperature gradients within the particle is a general characteristics of polymers during plasma spraying. This causes difficulties for polymer particles to be effectively molten within the plasma jet without decomposition. The theoretical calculations have predicted the effect of processing parameters on the temperature, the degree of melting and decomposition of in-flight polymer particles. With the aid of the model, the conditions for the preparation of high integrity thermoplastic deposits have been established by the control of the plasma arc power, plasma spraying distance, feedstock powder injection, torch traverse speed and feedstock particle size. The optimal deposition conditions are designed to produce effective particle melting in the plasma, extensive flow on impact, and minimal thermal degradation. The experimental work on optimizing processing parameters has confirmed the theoretical predictions. Examination of polymer coating structures reveals that the major defects are unmelted particles, cracks and pores. Five major categories of pores have been classified. It also revealed a significant loss in crystallinity and the presence of a minor metastable phase in the plasma deposited polyamide coatings due to rapid solidification. The study has indicated that the molecular weight of a polymer plays an important role on the splat flow and coating structure. Under non-optimal deposition condition, substantial thermal degradation occurred for which a chain scission mechanism is proposed for plasma deposited polyamide coatings. There are difficulties in achieving cross-linking during plasma spray deposition of thermosets. The theoretical calculations predict that adequate cross-linking is unlikely in a coating deposited under normal conditions, but preheating the substrate to above the cross-linking temperature improves the degree of cross-linking of the coatings substantially. In addition, the coating thickness has a major effect on the degree of cross-linking of thermosets. The calculations also predict that lowering the thermal conductivity by applying a thermal barrier undercoat and using a faster curing agent to reduce time required for the cross-linking reaction can improve the degree of cross-linking of thermoset deposits. The experimental results for the degree of cross-linking and wear resistance confirmed these predictions.
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Ja'fer, Hussein Abidjwad. "Plasma-assisted deposition using an unbalanced magnetron." Thesis, Loughborough University, 1993. https://dspace.lboro.ac.uk/2134/27734.

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It is well known that ion bombardment of growing films can strongly influence their microstructure and consequently their physical properties. The available technology for ion assisted deposition, particularly where separate sources are used for the deposition flux and the ion flux, is difficult to implement in many production situations. The planar magnetron provides a controllable ion flux while retaining the many other desirable features of simplicity, high deposition rate, geometric versatility and tolerance of reactive gases. This assists in the implementation of ion beam assisted deposition in both research and production.
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Oberste, Berghaus Jörg. "Induction plasma deposition of diamond thin films." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1996. http://www.collectionscanada.ca/obj/s4/f2/dsk3/ftp04/MQ44100.pdf.

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Oberste, Berghaus Jürg. "Induction plasma deposition of diamond thin films." Thesis, McGill University, 1996. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=20153.

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Diamonds unrivaled properties generate an enormous potential in industrial applications for thin film diamond coatings. Diamond has the highest values of hardness, thermal conductivity and elastic modules of any known material. Polycrystalline diamond coatings can be produced from thermal plasmas by Chemical Vapor Deposition (CVD). The films created by this process are often very non uniform over the deposition area. The properties of the free flowing plasma above the deposition surface and the plasma chemistry in the boundary layer above the growing film are believed to play fundamental roles in the formation of the diamond film and its uniformity.
In this study, an Ar/H2/CH4 plasma (8.65% H 2, 0.25% CH4) was created by a rf inductively coupled plasma torch for the deposition of diamond thin films on a molybdenum substrate probe (5 mm diam.). With the probe surface oriented normal to the plasma flow, growth rates in the order of 70 gm/hr were obtained for highly crystalline continuous films. Temperature and electron density profiles in the plasma free flow were determined from measurements by emission spectroscopy. (Abstract shortened by UMI.)
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Hossain, Mohammad Mokbul. "Plasma technology for deposition and surface modification." Berlin Logos, 2008. http://d-nb.info/993574106/04.

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Oberste, Berghaus Jürg. "Substrate bias assisted RF thermal plasma diamond deposition." Thesis, McGill University, 2000. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=37803.

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Polycrystalline diamond films are produced by chemical vapor deposition (CVD) in a r.f.-induction thermal plasma system. A dc bias voltage between -400 V and +500 V is applied to the deposition substrate. This is made possible by maintaining the reactor environment at ground potential and introducing a high-impedance, high-power filter network, eliminating the r.f. voltage drop across the plasma-probe junction. The Ar, H2, CH4 plasma (8.45% H2, 0.21% CH4) impinges on a molybdenum substrate probe (5 mm in diameter) in stagnation point flow. The resulting diamond films are analyzed by Scanning Electron Microscopy (SEM) and Raman Spectroscopy. The initial nucleation density is enhanced at negative bias voltage. However, this comes at the expense of degradation in crystalline quality. Positive voltage improves the quality and augments the film growth rate. A threefold increase in linear growth rate is attained at +500 V as compared to the unbiased case. The growing diamond film is used as an electrical and thermal probe. Electron emission currents from the developing diamond structures are exploited to monitor the film evolution during deposition. Diamond nucleation and growth stages are identified, and the bias voltage is varied in-situ to adjust to the changing growth requirements. A numerical simulation and optical emission spectroscopic measurements are used to characterize the plasma free stream as well as the boundary layer region between the plasma and the substrate. Current-voltage characteristics of the substrate are interpreted, and electrical probe theory is applied. It is shown that at negative bias the plasma-substrate interface is described by an expanding collision-dominated sheath imbedded inside the chemically reacting thermal boundary layer. Contrary to dc arcjet CVD, there is no secondary discharge created in the r.f. system at positive bias voltage. Also, the role of ion bombardment at negative bias is shown to be of little importance. It is infer
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Liu, Junling. "Plasma spray deposition of silicon nitride composite coatings." Thesis, London South Bank University, 2003. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.288111.

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Kim, B., Ye M. Ko, and K. H. Kim. "Hydroxyapatite Nanocrystal Deposition on Plasma Modified Titanium Surface." Thesis, Sumy State University, 2012. http://essuir.sumdu.edu.ua/handle/123456789/34951.

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Hydroxyapatite (Ca10(PO4)6(OH)2, HAp) is materials mainly known for its special ability to contact bone tissue. Nanostructures on implant surfaces, a coating composed of nano-HAp particles on Ti, have aroused increasing research interest in the biomedical field. In this study, we prepared HAp nanocrystal coated Ti surface by plasma surface modification and wet chemical method and then evaluated biological behavior of MC3T3-E1 on the HAp coated on plasma modified Ti surface. Nano-size crystals of sintered HAp were uniformly coated on polyacrylic acid (PAA) deposited Ti surface through the ionic interaction between calcium ions on the HAp nanocrystal and carboxyl groups on the PAA/Ti. In vitro cell tests revealed surface modification of Ti surface with HAp nanocrystal significantly improved the proliferation and growth of the osteoblastic MC3T3-E1 cells and induced them to differentiate at an enhanced level. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/34951
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Books on the topic "Plasma deposition"

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Konuma, Mitsuharu. Film Deposition by Plasma Techniques. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84511-6.

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1950-, Konuma Mitsuharu, ed. Film deposition by plasma techniques. Berlin: Springer-Verlag, 1992.

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Konuma, Mitsuharu. Film deposition by plasma techniques. New York: Springer-Verlag, 1992.

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Konuma, Mitsuharu. Plasma techniques for film deposition. Harrow, U.K: Alpha Science International, 2005.

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Konuma, Mitsuharu. Film Deposition by Plasma Techniques. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992.

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Riccardo, D'Agostino, ed. Plasma deposition, treatment, and etching of polymers. Boston: Academic Press, 1990.

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Buuron, Adrianus Jacobus Maria. Plasma deposition of carbon materials: Proefschrift. Eindhoven: Technische Universiteit Eindhoven, 1993.

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Chemical vapor deposition: Thermal and plasma deposition of electronic materials. New York: Van Nostrand Reinhold, 1995.

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M, Rossnagel Stephen, Cuomo J. J, and Westwood William D. 1937-, eds. Handbook of plasma processing technology: Fundamentals, etching, deposition, and surface interactions. Park Ridge, N.J., U.S.A: Noyes Publications, 1990.

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Giovanni, Bruno, Capezzuto Pio, and Madan A, eds. Plasma deposition of amorphous silicon-based materials. Boston: Academic Press, 1995.

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Book chapters on the topic "Plasma deposition"

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Franz, Gerhard. "Plasma deposition processes." In Low Pressure Plasmas and Microstructuring Technology, 375–438. Berlin, Heidelberg: Springer Berlin Heidelberg, 2009. http://dx.doi.org/10.1007/978-3-540-85849-2_10.

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Sivaram, Srinivasan. "Fundamentals of Plasma Chemistry." In Chemical Vapor Deposition, 119–43. Boston, MA: Springer US, 1995. http://dx.doi.org/10.1007/978-1-4757-4751-5_6.

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Konuma, Mitsuharu. "Plasma Diagnostics." In Film Deposition by Plasma Techniques, 74–106. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84511-6_4.

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Koch, Alexander W. "Plasma Deposition: Processes and Diagnostics." In Plasma Technology, 109–23. Boston, MA: Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3400-6_8.

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Konuma, Mitsuharu. "The Plasma State." In Film Deposition by Plasma Techniques, 1–10. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84511-6_1.

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Kessels, Erwin, Harald Profijt, Stephen Potts, and Richard van de Sanden. "Plasma Atomic Layer Deposition." In Atomic Layer Deposition of Nanostructured Materials, 131–57. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2012. http://dx.doi.org/10.1002/9783527639915.ch7.

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Adachi, Motoaki, and Kikuo Okuyama. "Particle Deposition in Plasma." In Ultraclean Surface Processing of Silicon Wafers, 82–91. Berlin, Heidelberg: Springer Berlin Heidelberg, 1998. http://dx.doi.org/10.1007/978-3-662-03535-1_7.

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Perrin, J. "Deposition of Amorphous Silicon." In Plasma Processing of Semiconductors, 125–36. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-011-5884-8_7.

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Konstantinidis, Stephanos, F. Gaboriau, M. Gaillard, M. Hecq, and A. Ricard. "Optical Plasma Diagnostics During Reactive Magnetron Sputtering." In Reactive Sputter Deposition, 301–35. Berlin, Heidelberg: Springer Berlin Heidelberg, 2008. http://dx.doi.org/10.1007/978-3-540-76664-3_9.

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Konuma, Mitsuharu. "Generation of Cold Plasma." In Film Deposition by Plasma Techniques, 49–73. Berlin, Heidelberg: Springer Berlin Heidelberg, 1992. http://dx.doi.org/10.1007/978-3-642-84511-6_3.

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Conference papers on the topic "Plasma deposition"

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Hafiz, J., R. Mukherjee, X. Wang, P. H. McMurry, J. V. R. Heberlein, and S. L. Girshick. "Hypersonic Plasma Particle Deposition – A Hybrid between Plasma Spraying and Vapor Deposition." In ITSC2006, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, R. S. Lima, and J. Voyer. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.itsc2006p1323.

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Abstract In the hypersonic plasma particle deposition process, vapor phase reactants are injected into a plasma and rapidly quenched in a supersonic nozzle, leading to nucleation of nanosize particles. These particles impact a substrate at high velocity, forming a coating with grain sizes of 10 to 40 nm. As previously reported, coatings of a variety of materials have been obtained, including silicon, silicon carbide, titanium carbide and nitride, and composites of these, all deposited at very high rates. Recent studies have shown that slight modifications of the process can result in nanosize structures consisting of single crystal silicon nanowires covered with nanoparticles. These nanowires are believed to grow in a vapor deposition process, catalyzed by the presence of titanium in the underlying nanoparticle film. However, simultaneously nanoparticles are nucleated in the nozzle and deposited on the nanowires, leading to structures that are the result of a plasma CVD process combined with a nanoparticle spray process. The combination of these two process paths opens new dimensions in nanophase materials processing.
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Gupta, M., M. Shen, Z. Tchir, and Y. Y. Tsui. "Applications of laser plasma deposition." In 2016 IEEE International Conference on Plasma Science (ICOPS). IEEE, 2016. http://dx.doi.org/10.1109/plasma.2016.7534320.

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Umstattd, R., T. Pi, N. Luhmann, G. Scheitrum, G. Caryotakis, and G. Miram. "Plasma deposition of oxide cathodes." In High energy density microwaves. AIP, 1999. http://dx.doi.org/10.1063/1.59041.

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Olmer, L. J., and E. R. Lory. "Intermetal dielectric deposition by plasma enhanced chemical vapor deposition." In Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle. IEEE, 1988. http://dx.doi.org/10.1109/emts.1988.16157.

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Pershin, L., and J. Mostaghimi. "Yttria Deposition by a Novel Plasma Torch." In ITSC2010, edited by B. R. Marple, A. Agarwal, M. M. Hyland, Y. C. Lau, C. J. Li, R. S. Lima, and G. Montavon. DVS Media GmbH, 2010. http://dx.doi.org/10.31399/asm.cp.itsc2010p0038.

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Abstract Carbon dioxide (CO2) and hydrocarbons (such as CH4) gas mixtures generate plasmas with much higher enthalpy and thermal conductivity, leading to higher spray process efficiency and improved heat transfer to the sprayed powder. We have employed a DC plasma torch operated with CO2+CH4 gas mixture, which has been developed at the Centre for Advanced Coating Technologies (CACT) at the University of Toronto, to deposit various coatings. This study was focused on the effect of this plasma gas mixture on the in-flight particle parameters during plasma spraying of Yttria (Y2O3). The results were compared with a similar coating applied by the SG-100 torch (Praxair) with Ar+He gas mixture. The particulate plume scans show that with the CACT torch, all particles in measured volume were overheated at a distance of 120 mm. Cross-sections through the sprayed coatings were polished and examined under a scanning electron microscope. The dielectric properties of the two coatings were also compared with each other.
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Lawrence, R., Chris Oldham, and Art Fortini. "Atomic Layer Deposition and Chemical Vapor Deposition of Multipactor Suppression Coatings." In 2021 IEEE International Conference on Plasma Science (ICOPS). IEEE, 2021. http://dx.doi.org/10.1109/icops36761.2021.9588643.

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Demirel, Lutfi Oksuz Suleyman, and Aysegul Gok Suleyman Demirel. "Atmospheric Pressure Plasma Deposition of Polyfuran." In 2007 IEEE Pulsed Power Plasma Science Conference. IEEE, 2007. http://dx.doi.org/10.1109/ppps.2007.4346154.

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Nourshargh, N., E. M. Starr, and J. S. McCormack. "Plasma Deposition Of Integrated Optical Waveguides." In 1985 Cambridge Symposium, edited by Sriram Sriram. SPIE, 1985. http://dx.doi.org/10.1117/12.950753.

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Schulz, Christian, and Ilona Rolfes. "Plasma diagnostics in dielectric deposition processes." In 2016 IEEE SENSORS. IEEE, 2016. http://dx.doi.org/10.1109/icsens.2016.7808810.

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Hollis, K., B. Bartram, J. Withers, R. Storm, and J. Massarello. "Plasma Transferred Arc Deposition of Beryllium." In ITSC2006, edited by B. R. Marple, M. M. Hyland, Y. C. Lau, R. S. Lima, and J. Voyer. ASM International, 2006. http://dx.doi.org/10.31399/asm.cp.itsc2006p1177.

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Abstract The exceptional properties of beryllium (Be) including low density and high elastic modulus, make it the material of choice in many defense and aerospace applications. However, health hazards associated with Be material handling limit the applications that are suited for its use. Innovative solutions that enable continued use of Be in critical applications while addressing worker health concerns are highly desirable. Plasma Transferred Arc solid freeform fabrication is being evaluated as a Be fabrication technique for civilian and military space based components. Initial experiments producing beryllium deposits are reported here. Deposit shape, microstructure and mechanical properties are reported.
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Reports on the topic "Plasma deposition"

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Hollis, K., B. Bartram, R. Strom, J. Withers, and J. Massarello. Plasma Transferred Arc Deposition of Beryllium (Preprint). Fort Belvoir, VA: Defense Technical Information Center, January 2005. http://dx.doi.org/10.21236/ada442194.

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Rudder, R. A. Large-Area, Plasma-Assisted, Halogen-Based Diamond Deposition. Fort Belvoir, VA: Defense Technical Information Center, March 1992. http://dx.doi.org/10.21236/ada247423.

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Ray, E. R., C. J. Spengler, and H. Herman. Solid oxide fuel cell processing using plasma arc spray deposition techniques. Office of Scientific and Technical Information (OSTI), July 1991. http://dx.doi.org/10.2172/7102027.

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Berry, L. A., S. M. Gorbatkin, and R. L. Rhoades. Cu deposition using a permanent magnet electron cyclotron resonance microwave plasma source. Office of Scientific and Technical Information (OSTI), September 1994. http://dx.doi.org/10.2172/10178692.

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Saravanan, Kolandaivelu. Plasma enhanced chemical vapor deposition of ZrO2 thin films. Office of Scientific and Technical Information (OSTI), December 1993. http://dx.doi.org/10.2172/10120497.

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Chen, Xing. High-Density Plasma Source for Large-Area Chemical Vapor Deposition of Diamond Films. Fort Belvoir, VA: Defense Technical Information Center, December 1994. http://dx.doi.org/10.21236/ada289053.

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Robbins, Joshua, and Michael Seman. Electrochromic Devices Deposited on Low-Temperature Plastics by Plasma-Enhanced Chemical Vapor Deposition. Office of Scientific and Technical Information (OSTI), September 2005. http://dx.doi.org/10.2172/850233.

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Ray, E. R., C. J. Spengler, and H. Herman. Solid oxide fuel cell processing using plasma arc spray deposition techniques. Final report. Office of Scientific and Technical Information (OSTI), July 1991. http://dx.doi.org/10.2172/10169590.

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Woodall, D. M., and E. C. Lemmon. Magnetically controlled deposition of metals using gas plasma. Quarterly progress report, July--September 1996. Office of Scientific and Technical Information (OSTI), November 1996. http://dx.doi.org/10.2172/418387.

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Markunas, R. J., and G. G. Fountain. Development of a Ge/GaAs HMT Technology Based on Plasma Enhanced Chemical Vapor Deposition. Fort Belvoir, VA: Defense Technical Information Center, January 1992. http://dx.doi.org/10.21236/ada246991.

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