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Journal articles on the topic 'Plasma Circuits'

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Author: Grafiati

Published: 10 December 2022

Last updated: 28 January 2023

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1

Bierer, P., A. W. Holt, A. D. Bersten, J. L. Plummer, and A. H. Chalmers. "Haemolysis Associated with Continuous Venovenous Renal Replacement Circuits." Anaesthesia and Intensive Care 26, no. 3 (June 1998): 272–75. http://dx.doi.org/10.1177/0310057x9802600307.

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Extracorporeal circuits can cause haemolysis resulting in an increase in plasma-free haemoglobin (PFHb). High pressures and clots within the circuit have been identified as factors increasing the likelihood of haemolysis. Continuous venovenous haemodiafiltration (CVVHD) is associated with high circuit pressures as the pump-driven circuit clots over a period of time. PFHb was measured during CVVHD to determine if circuit life, maximum circuit pressure or the clotting of the haemofilter was associated with evidence of haemolysis. Circuit life up to 50 hours, circuit pressures or haemofilter clotting had no significant effect on PFHb. There was a small rise in PFHb in the circuits lasting beyond 50 hours. CVVHD circuits can be run up to 50 hours without concern for haemolysis.

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2

Berry, Lee A. "Plasma processing for integrated circuits." Journal of Fusion Energy 12, no. 4 (December 1993): 365–69. http://dx.doi.org/10.1007/bf01054814.

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3

Mathad, G. S., D. W. Hess, and M. Meyyappan. "Plasma Processing for Silicon-Based Integrated Circuits." Electrochemical Society Interface 8, no. 2 (June 1, 1999): 34–40. http://dx.doi.org/10.1149/2.f07992if.

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During the last quarter century or so, plasma processing has become a critical industrial technology for the development and manufacture of semiconductor devices. Gaseous plasmas have been used for sputter and chemical vapor deposition of thin films, pattern transfer in mask fabrication, etching of thin films, resist stripping, surface modification and as an ion source in ion implantation. It is the most pervasive technology in the manufacture of silicon-based integrated circuits.

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4

Yoshizaki, T., N. Tabuchi, W. Van Oeveren, A. Shibamiya, T. Koyama, and M. Sunamori. "PMEA Polymer-Coated PVC Tubing Maintains Anti-Thrombogenic Properties during in vitro Whole Blood Circulation." International Journal of Artificial Organs 28, no. 8 (August 2005): 834–40. http://dx.doi.org/10.1177/039139880502800809.

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Poly(2-methoxyethylacrylate) (PMEA) is a new coating material that appears to reduce protein and platelet adsorption. However, the exact performance of PMEA coated circuit remains to be revealed in well-controlled experiments. Therefore, we compared its hemocompatibility with covalent-bound heparin-, and non-coated circuits during 6 hours of in vitro circulation, using donor blood from six volunteers. In our model, simple tubing circuits containing one-way ball valve were placed on the rotary table, which moved alternatively to generate pulsatile recirculation of heparinized human blood inside the tubing. Using this model, we expected fine assessment of the material surface, because we could reduce blood damage by avoiding air and a blood pump. Moreover, the small capacity of circuit allowed us to compare three kinds of circuits using a single unit of donor blood, eliminating effects by possible variations between blood donors. The anti-thrombin capacity of the PMEA-coated circuits was maintained even after six hours blood circulation, whereas surface thrombin generation increased markedly after use in non-coated circuits (P<0.05). Deposition of fibrin onto PMEA circuits was reduced more than 30% compared with heparin and non-coated circuits (P<0.05). However, the increase of plasma Factor XIIa was similar in all circuits. Increase of CD11b expression on circulating leukocytes and of plasma C3a was ameliorated in the heparin- and PMEA-coated circuits (P<0.05). PMEA-coated circuits appear to maintain their anti-thrombogenicity during use, otherwise PMEA-coated and heparin-coated circuits showed a similar character in hemocompatibility. This long-standing anti-thrombogenicity might be attributable to less adsorption of activated blood components onto the surface.

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5

Raveu, Nathalie, Gaetan Prigent, Thierry Callegari, and Henri Baudrand. "WCIP APPLIED TO ACTIVE PLASMA CIRCUITS." Progress In Electromagnetics Research Letters 21 (2011): 89–98. http://dx.doi.org/10.2528/pierl11010703.

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6

Tikhonov, V. N., S. A. Gorbatov, I. A. Ivanov, and A. V. Tikhonov. "A new type of non-thermal atmospheric pressure plasma source based on a waveguide bridge." Journal of Physics: Conference Series 2064, no. 1 (November 1, 2021): 012131. http://dx.doi.org/10.1088/1742-6596/2064/1/012131.

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Abstract A new type of microwave source of non-thermal atmospheric pressure plasmas, presented earlier by the authors, has both the characteristics of a dielectric barrier discharge (in terms of the configuration and low gas temperature) and an ability to form a “clean” plasma jet like a classical microwave plasma torch. However, the need to use a circulator leads to a significant increase in complexity, cost and weight of the installation as a whole. The basis of the presented plasma source is a three-decibel waveguide bridge with connection through a narrow wall. Both output arms of the bridge are loaded on identical short-circuited segments of waveguides. The discharge tube passes across the waveguides at a distance of a quarter of the wavelength from the short circuit. Since the output arms of the bridge are always loaded symmetrically, the generator’s power which is reflected from the short circuits or not be absorbed in the microwave discharge, enters the decoupled arm of the bridge that is connected to the matched load. Thus, the magnetron is protected from the reflected wave without the need for an expensive circulator, in any case.

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7

Pai, Pradeep, and Massood Tabib-Azar. "Plasma interconnects and circuits for logic gates and computer sub-circuits." Applied Physics Letters 104, no. 24 (June 16, 2014): 244104. http://dx.doi.org/10.1063/1.4884421.

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8

Lepla, Keith C., and Gary Horlick. "Photodiode Array Systems for Inductively Coupled Plasma-Atomic Emission Spectrometry." Applied Spectroscopy 43, no. 7 (September 1989): 1187–95. http://dx.doi.org/10.1366/0003702894203462.

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Details are presented for the construction of photodiode array (PDA) measurement systems from commercial components. The PDA systems described include the Hamamatsu S2304–1024Q, a Reticon 1024S using the RC1000 and RC1001 circuit boards, and a Reticon 1024S using the RC1024S circuit board. Detals are presented for computer-controlled clocking and timing circuits, ADC sub-systems, and Peltier cooling subsystems. The measurement characteristics (sensitivity and detection limits) for all arrays are intercompared with the use of analyte emission signals from an inductively coupled plasma.

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9

Gottscho, Richard A., Maria E. Barone, and Joel M. Cook. "Use of Plasma Processing in Making Integrated Circuits and Flat-Panel Displays." MRS Bulletin 21, no. 8 (August 1996): 38–42. http://dx.doi.org/10.1557/s0883769400035697.

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The ever-shrinking dimensions of microelectronic devices has mandated the use of plasma processing in integrated circuit (IC) factories worldwide. Today the plasma-processing industry has grown to over $3 billion in revenues per year, well in excess of predictions made only a few years ago. Plasma etching and deposition systems are also found throughout flat-panel-display (FPD) factories despite the much larger dimensions of thin-film transistors (TFTs) that are used to switch picture elements (pixels) on and off. Besides the use of plasma in etching and depositing thin films, other processes include the following: removal of photoresist remnants after development (descumming), stripping developed photoresist after pattern transfer (ashing), and passivating defects in polycrystalline material. Why are plasma processes so prevalent?In etching, plasmas are used for high-fidelity transfer of the photolithographically defined pattern that defines the device or circuit. More generally, plasma provides the means to taper sidewalls. In Si processing, the sidewalls must be nearly vertical to obtain high density integration and faster performance. However in making FPDs, sidewalls are tapered to obtain uniform step coverage and reduce shorting. In deposition, plasmas are used to enable processing at low temperature. For both etching and deposition, only plasma processing provides an economically viable means for processing large area substrates: 300 mm for Si and more than 550 × 650 mm for FPDs. It is the ability to scale uniform reactant generation to larger areas that sets plasma apart from beam-based processes that might otherwise offer the desired materials modifications. The nonequilibrium characteristics of plasma further distinguish this processing method. Energetic electrons break apart reactant precursors while ions bombard the surface anisotropically.

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10

Meyyappan, M., and T. R. Govindan. "Plasma Process Modeling for Integrated Circuits Manufacturing." VLSI Design 6, no. 1-4 (January 1, 1998): 409–12. http://dx.doi.org/10.1155/1998/27636.

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A reactor model for plasma-based deposition and etching is presented. Two-dimensional results are discussed in terms of plasma density, ion flux, and ion energy. Approaches to develop rapid CAD-type models are discussed.

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11

Hu, Ye Lin, Zhi Wen Du, and Zhao Quan Chen. "Development of a Pulsed DC Power Supply for Generating Cold Plasma Jet." Advanced Materials Research 791-793 (September 2013): 1841–44. http://dx.doi.org/10.4028/www.scientific.net/amr.791-793.1841.

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This paper discusses a lithium battery-driven cold plasma jet at atmospheric pressure with a pulsed power supply of design and its simulation. H.V. DC(High voltage directed current) and pulsed discharge circuit comprise of the entire pulse power system. H.V. DC circuit using TIs TMS320F28335 chips as the core of the circuit control module, the chip improves the stability of the H.V.DC circuits. Pulsed discharge circuit design plays a crucial impact on the formation of the narrowed pulses. A new double pulsed discharge circuit is designed by the proposed program. As discharge experiment shown finally, the steep narrowed pulse of pulsed power supply can be used to stabilize the output of the pulsed front.

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12

Lindberg, L. "High-frequency probe circuits for plasma diagnostics." Journal of Physics E: Scientific Instruments 18, no. 3 (March 1985): 214–17. http://dx.doi.org/10.1088/0022-3735/18/3/011.

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13

Armacost, M., P. D. Hoh, R. Wise, W. Yan, J. J. Brown, J. H. Keller, G. A. Kaplita, et al. "Plasma-etching processes for ULSI semiconductor circuits." IBM Journal of Research and Development 43, no. 1.2 (January 1999): 39–72. http://dx.doi.org/10.1147/rd.431.0039.

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14

Brunner, Robert J. "Oxygen-Plasma Cleaning of Hybrid Integrated Circuits." AT&T Technical Journal 71, no. 2 (March 4, 1992): 52–58. http://dx.doi.org/10.1002/j.1538-7305.1992.tb00158.x.

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15

Skogby, Maria, Lars Göran Friberg, Lilian Tengborn, Hans Wadenvik, and Karin Mellgren. "The Influence of a Serine Protease Inhibitor, Nafamostat Mesilate, on Plasma Coagulation, and Platelet Activation during Experimental Extracorporeal Life Support (ECLS)." Thrombosis and Haemostasis 79, no. 02 (1998): 342–47. http://dx.doi.org/10.1055/s-0037-1614989.

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SummaryIntroduction: During extracorporeal circulation the contact between blood and the artificial surface of the circuit induces several changes in the hemostatic system. The objective of the present study was to assess the effect of a serine protease inhibitor – Nafamostat mesilate (FUT-175) – on coagulation and on platelets during experimental extracorpo-real circulation. Methods: Two identical Extra Corporeal Life Support (ECLS) circuits were primed with fresh, heparinized human blood and circulated for 24 h. FUT-175 was added to one of the paired circuits and the other was used as a control. The following FUT-175 concentrations were employed: (1) 7.1 mg/l/h, (2) 14.2 mg/l/h, (3) 14.2 mg/l/h + 85.5 mg given as an initial bolus, (4) 28.5 mg/l/h + 171 mg given as an initial bolus. Blood samples were collected from the circuits before the start of the perfusion and at 0.5, 1, 3, 12, and 24 h of perfusion, and analysed for platelet count, plasma betathromboglobulin ( -TG), platelet membrane glycoprotein (GP) Ib and GPIIb/IIIa expression, thrombin/ antithrombin III complex (TAT), prothrombin fragment 1+2 (F1+2), fibrinogen, D-dimer, and plasminogen activator inhibitor 1 activity (PAI-1). Results: Significantly higher platelet membrane GPIb expression and lower plasma -thromboglobulin levels were observed in the circuits holding FUT-175, suggesting a lower degree of platelet activation. Also, a reduced activation of the coagulation system was observed in the “FUT-circuits”, as reflected by the levels of F1+2 and TAT, and the PAI-1 activity that was rapidly inactivated. Conclusion: FUT-175 reduces the activation of platelets and plasma coagulation in an in vitro ECLS model.

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16

Law, V. J., and S. D. Anghel. "Compact atmospheric pressure plasma self-resonant drive circuits." Journal of Physics D: Applied Physics 45, no. 7 (February 1, 2012): 075202. http://dx.doi.org/10.1088/0022-3727/45/7/075202.

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17

Hakki, A., and N. F. Kashapov. "Isolated Ignition circuits for High Power DC Plasma." Journal of Physics: Conference Series 1588 (July 2020): 012067. http://dx.doi.org/10.1088/1742-6596/1588/1/012067.

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18

Yoshizako, Yuji, and Daisuke Matsuno. "Design of Automatic Matching System for Very High Frequency Plasma-Enhanced Processes." Materials Science Forum 512 (April 2006): 239–42. http://dx.doi.org/10.4028/www.scientific.net/msf.512.239.

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Since it can change electron energy distribution functions, very high frequency (VHF) plasma has gained significant attention as a promising new class of plasma. We demonstrate an automatic matching system for VHF plasma, that works in very wide ranges. A matching system was prepared using conventional variable capacitors. Reflection coefficient at the input of the matching circuits was measured with a directional coupler. A new calculation method for automatic matching based on numerical models for the circuit was developed, and the performance of the automatic matching system was evaluated using a load emulator. These results revealed that the system has an automatic matching capability for the entire range of the covering load area.

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19

VOSHCHENKOV, A. M. "PLASMA ETCHING PROCESSES FOR GIGAHERTZ SILICON INTEGRATED CIRCUITS (Part 2)." International Journal of High Speed Electronics and Systems 02, no. 01n02 (March 1991): 45–88. http://dx.doi.org/10.1142/s0129156491000041.

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In the preceding paper of this series, “Fundamentals of plasma etching for silicon technology (Part 1)”,1 a historical perspective of the evolution of plasma etching, its relationship to lithography needs, basic characteristics of plasma etching, advantages over wet chemical processing, and a practical viewpoint of the underlying fundamental concepts of plasma physics and chemistry were presented. In this paper, original work in plasma etcher design and a variety of process applications to multigigahertz rate silicon technology as practiced in Bell Laboratories, Holmdel, are described.

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20

Lawson, D. Scott, Derek Eilers, Suzanne Osorio Lujan, Maria Bortot, and James Jaggers. "Hemolysis generation from a novel, linear positive displacement blood pump for cardiopulmonary bypass on a six kilogram piglet: a preliminary report." Perfusion 32, no. 4 (November 18, 2016): 264–68. http://dx.doi.org/10.1177/0267659116679881.

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Background: Current blood pumps used for cardiopulmonary bypass generally fall into two different pump design categories; non-occlusive centrifugal pumps and occlusive, positive-displacement roller pumps. The amount of foreign surface area of extracorporeal circuits correlates with post-operative morbidity due to systemic inflammation, leading to a push for technology that reduces the amount of foreign surfaces. Current roller pumps are bulky and the tubing forms an arc in the pumping chamber (raceway), positioning the inlet 360 degrees from the outlet, making it very difficult to place the pump closer to the patient and to efficiently reduce tubing length. These challenges put existing roller pumps at a disadvantage for use in a compact cardiopulmonary bypass circuit. Centrifugal blood pumps are easier to incorporate into miniature circuit designs. However, the prime volumes of current centrifugal pump designs are large, especially for pediatric extracorporeal circuits where the prime volumes are too great to be of clinical value. Method: We describe a preliminary report on a novel, occlusive, linear, single-helix, positive-displacement blood pump which allows for decreased prime volume and surface area of the extracorporeal circuit. This new experimental pump design was used to perfuse a 6 kilogram piglet with a pediatric cardiopulmonary bypass circuit for two hours of continuous use. Blood samples were obtained every thirty minutes and assayed for plasma free hemolysis generation. Conclusions: The results from this initial experiment showed low plasma free hemoglobin generation and encourages the authors to further develop this concept.

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21

Weerwind, P. W., F. H. Van Der Veen, T. Lindhout, D. S. De Jong, and P. T. Cahalan. "Ex Vivo Testing of Heparin-Coated Extracorporeal Circuits: Bovine Experiments." International Journal of Artificial Organs 21, no. 5 (May 1998): 291–98. http://dx.doi.org/10.1177/039139889802100511.

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In this study the intrinsic thrombogenicity of the extracorporeal circuits and the benefit of heparin-bonded circuits in an extracorporeal life support system without full systemic heparinization and with minimal interference of the so called material-independent factors was tested in four calves. In two circuits (group A) all blood-contacting surfaces were coated with end-point-attached heparin and the other two were non-coated (group B). Under standardized conditions the calves were perfused at a blood flow rate of 2 L/min. After only one bolus injection of heparin (250 IU/kg body weight) before cannulation, plasma heparin activity rapidly decreased in both groups: half life of about 55 minutes. This decrease of the heparin activity was accompanied by a fall of the activated clotting time (ACT) level to baseline values. The experiments using a heparin-coated circuit, had a runtime of more than 360 minutes, whereas the experiments using a non-coated circuit had to be terminated after a runtime of 255 minutes, because massive fibrin formation was noticed in the circuit. This formation was accompanied by a rapid increase in the line pressure, measured just before the inlet of the oxygenator. The macroscopic inspections after terminating the experiments and rinsing the circuit showed a clean circuit in group A. The fibrinopeptide A (FPA) level increased faster during perfusion with the non-coated circuit than in the heparin coated circuit. Lung histopathological examinations of the lungs of the animals in group A showed no fibrin deposition, whereas most of the blood vessels of the lung preparations of the animals in group B were partially or completely occluded with fibrin. These results suggest that heparin-bonding greatly reduces the thrombogenicity of the extracorporeal circuit, and therefore it can reduce the need for systemic heparinization in an extracorporeal life support system.

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22

Johnson, Raymond F., Norman Herman, Timothy L. Arney, Herbert Gonzalez, Vernetta H. Johnson, and John W. Downing. "Bupivacaine Transfer across the Human Term Placenta." Anesthesiology 82, no. 2 (February 1, 1995): 459–68. http://dx.doi.org/10.1097/00000542-199502000-00016.

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Background Bupivacaine is widely used for obstetric analgesia, yet published information on the mechanism of human placental bupivacaine transfer is sparse. The dual perfused human placental model was used to elucidate the factors governing the placental transfer of bupivacaine. Methods Bupivacaine transfer was studied using the recirculating (closed) model and the single pass (open) model. Single placental cotyledons were perfused with either heparinized Krebs-Ringer's buffer (KRB) supplemented with human albumin (fetal and maternal circuits) or 100% fresh frozen plasma (maternal circuit) to control the bupivacaine protein binding in those circuits. In the open model, bupivacaine clearance was compared before and after being subjected to either increasing concentrations of bupivacaine or its structural analog, mepivacaine. Results For those studies in which the maternal and fetal protein binding was equal, the maternal to fetal (M-->F) transfer was significantly greater (P < 0.05) than that in the fetal to maternal (F-->M) direction. When the perfusates were modified to simulate actual in vivo plasma protein concentrations, bupivacaine transfer was shown to be related to the degree of protein binding found in the two circuits. In the open studies, bupivacaine transfer was similar at all concentrations investigated, unaffected by mepivacaine, and related to the pH of the fetal perfusate. A concentration effect was seen within the placental tissue at the end of the experiment. Conclusions Bupivacaine placental transfer characteristics suggest passive diffusion rather than active drug transport and appear to be influenced by the maternal and fetal plasma protein binding, fetal pH, and placental uptake.

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23

Principe, E. L., Navid Asadizanjani, Domenic Forte, Mark Tehranipoor, Robert Chivas, Michael DiBattista, and Scott Silverman. "Plasma FIB Deprocessing of Integrated Circuits from the Backside." EDFA Technical Articles 19, no. 4 (November 1, 2017): 36–44. http://dx.doi.org/10.31399/asm.edfa.2017-4.p036.

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Abstract Deprocessing of ICs is often the final step for defect validation in FA cases with limited fault-isolation information. This article presents a workflow for deprocessing ICs from the backside using automated thinning and large-area plasma FIB delayering. Advantages to this approach include a reduction in manual planarization and depackaging and a higher degree of precision and repeatability.

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Zheng, K., D. Kowsari, N. J. Thobaben, X. Du, X. Song, S. Ran, E. A. Henriksen, D. S. Wisbey, and K. W. Murch. "Nitrogen plasma passivated niobium resonators for superconducting quantum circuits." Applied Physics Letters 120, no. 10 (March 7, 2022): 102601. http://dx.doi.org/10.1063/5.0082755.

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Microwave loss in niobium metallic structures used for superconducting quantum circuits is limited by a native surface oxide layer formed over a timescale of minutes when exposed to an ambient environment. In this work, we show that nitrogen plasma treatment forms a niobium nitride layer at the metal–air interface, which prevents such oxidation. X-ray photoelectron spectroscopy confirms the doping of nitrogen more than 5 nm into the surface and a suppressed oxygen presence. This passivation remains stable after aging for 15 days in an ambient environment. Cryogenic microwave characterization shows an average filling-factor-adjusted two-level-system loss tangent [Formula: see text] of [Formula: see text] for resonators with a 3 [Formula: see text]m center strip and [Formula: see text] for a 20 [Formula: see text]m center strip, exceeding the performance of unpassivated samples by a factor of four.

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Aleksandrov, A. F., M. V. Kuzelev, and A. A. Rukhadze. "On the theory of electric circuits with plasma elements." Journal of Communications Technology and Electronics 55, no. 7 (July 2010): 773–90. http://dx.doi.org/10.1134/s1064226910070089.

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26

Harding, Angus S., and John F. Hancock. "Using plasma membrane nanoclusters to build better signaling circuits." Trends in Cell Biology 18, no. 8 (August 2008): 364–71. http://dx.doi.org/10.1016/j.tcb.2008.05.006.

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Barcellona, Concetta, Arturo Buscarino, Claudia Corradino, and Luigi Fortuna. "Hybrid circuits to model and control fusion plasma instabilities." IFAC-PapersOnLine 51, no. 33 (2018): 27–31. http://dx.doi.org/10.1016/j.ifacol.2018.12.080.

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Allen, Stephen, William T. McBride, Ian S. Young, Simon W. MacGowan, Terence J. McMurray, Sachin Prabhu, S. Prasad Penugonda, and Marilyn A. Armstrong. "A clinical, renal and immunological assessment of Surface Modifying Additive Treated (SMART™) cardiopulmonary bypass circuits." Perfusion 20, no. 5 (September 2005): 255–62. http://dx.doi.org/10.1191/0267659105pf815oa.

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Biocompatible cardiopulmonary bypass (CPB) circuits aim to reduce contact activation and its physiological consequences. We investigated the hypothesis that use of Surface Modifying Additive (SMA)-treated circuits (Sorin Group Ltd) compared with non-SMA circuits would be associated with preservation of blood pressure during CPB and modulation of perioperative subclinical renal function (urinary α-1-microglobulin (α-1-m)) and plasma and urinary cytokine changes. In a study of low-risk CABG patients ( n=40), randomized to SMA ( n=20) versus non-SMA circuits ( n=20), we found better preserved blood pressure at CPB initiation in SMA patients (p <0.05), particularly in ACE-inhibited SMA patients ( n=11) versus ACE-inhibited non-SMA patients ( n=10) (p <0.05). Plasma anti-inflammatory IL-10, as well as urinary α-1-m, were elevated 48 hours postoperatively (p <0.05). SMA patients also had lower blood loss (p <0.05). SMA circuits have some clinical benefit, especially in ACE-inhibited patients.

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Peek, Giles J., Richard Scott, Hilliary M. Killer, and Richard K. Firmin. "An in vitro method for comparing biocompatibility of materials for extracorporeal circulation." Perfusion 17, no. 2 (March 2002): 125–32. http://dx.doi.org/10.1191/0267659102pf546oa.

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We measured the response of fresh heparinized human blood to recirculation through circuits made of LVA (Portex Industries, Hythe, Kent, UK), SRT (Rehau UK, Langley, Slough, UK) and Tygon® S-65-HL (Norton Performance Plastics, Corby, Northants, UK), as control. Circuit construction: 1/2 in. tubing, heat exchanger (Dideco D-720P), Stockert roller pump, just underoccluded, Cincinnati Sub Zero heater, circuit volume of 500 ml. Flow 3.45 l/min, 37°C. Samples: at 10 min, 1, 2, 4 and 6 h. n= 5 in each group; 2/5 SRT experiments were stopped at 45 and 60 min due to overpressurization. Results: Baseline activated clotting time (ACT) of 300 s, increasing in all groups as fibrinogen fell to zero with SRT and LVA. Minimum fibrinogen was 1 g/l for Tygon. Absolute thrombocytopenia occurred (SRT and LVA 60 min and Tygon 240 min). International normalized ratio (INR) in both the SRT and LVA circuits increased, but mean increase for Tygon (0.56) was smaller than the other two materials. Plasma free haemoglobin increased in all three materials; the increase was greater in the LVA circuits compared to the control. C5b9 levels increased equally in all groups. Lactoferrin levels rose equally in all groups to a maximum at 150 min. The neutrophil counts fell, mirroring the lactoferrin. The total white cell counts also fell in all groups; in the LVA circuits, the fall was significantly lower than in the control. Rapid disappearance of platelets and fibrinogen from the blood in the SRT and LVA circuits excludes them both from extracorporeal use. Paradoxically, SRT caused the least complement activation of the three materials. This method can be used to compare biocompatibility.

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30

Herr, Quentin, Alex Braun, Andrew Brownfield, Ed Rudman, Dan Dosch, Trent Josephsen, and Anna Herr. "Measurement and data-assisted simulation of bit error rate in RQL circuits." Superconductor Science and Technology 35, no. 2 (January 14, 2022): 025017. http://dx.doi.org/10.1088/1361-6668/ac45a1.

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Abstract A circuit-simulation-based method is used to determine the thermally-induced bit error rate of superconducting Single Flux Quantum logic circuits. Simulations are used to evaluate the multidimensional Gaussian integral across noise current sources attached to the active devices. The method is data-assisted and has predictive power. Measurement determines the value of a single parameter, effective noise bandwidth, for each error mechanism. The errors in the distributed networks of comparator-free Reciprocal Quantum Logic nucleate across multiple Josephson junctions, so the effective critical current is about three times that of the individual devices. The effective noise bandwidth is only 6%–23% of the junction plasma frequency at a modest clock rate of 3.4 GHz, which is 1% of the plasma frequency. This analysis shows the ways measured bit error rate comes out so much lower than simplistic estimates based on isolated devices.

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Kocsis, E., A. Lukács, and I. Szalai. "Impact of plasma treatment on solderability of printed circuit boards." IOP Conference Series: Materials Science and Engineering 1246, no. 1 (August 1, 2022): 012013. http://dx.doi.org/10.1088/1757-899x/1246/1/012013.

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Abstract Flux is essential in the process of soldering. White flux residues are not only an aesthetic issue, but the inactivated components can cause severe problems. With miniaturization of products in the electronics industry, the short circuits caused by ion migration are more likely to occur during the lifetime of the product. Plasma treatment has been proved to be effective in improving the wettability in case of metal and polymer surfaces. The aim of this study is to investigate the possibility of promoting wettability of pads on printed circuit boards by plasma treatment. PCBs with three different types of surface finishes were investigated before and after plasma treatment. Wettability and solderability were examined by contact angle measurement and wetting balance tester. This method has the potential to reduce the usage of flux during soldering as an alternative surface treatment to create oxide-free metal surfaces.

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Wile, A. G., E. A. Stemmer, P. A. Andrews, M. P. Murphy, I. S. Abramson, and S. B. Howell. "Pharmacokinetics of 5-fluorouracil during hyperthermic pelvic isolation-perfusion." Journal of Clinical Oncology 3, no. 6 (June 1985): 849–52. http://dx.doi.org/10.1200/jco.1985.3.6.849.

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The pharmacokinetics of 5-fluorouracil (5-FU) injected into a surgically isolated pelvic circuit during hyperthermic perfusion was studied in five patients with local recurrence of anorectal cancer. 5-FU doses ranged from 11 to 23 mg/kg. The geometric mean ratio of peak plasma 5-FU in the isolated to systemic circuits was 10, the ratio at the end of the 45-minute perfusion was 12.5. The mean half-life of 5-FU in the isolated circuit was 18.5 minutes. Total drug exposure for the isolated circuit was 7.8-fold greater than for the systemic compartment. These results demonstrate a large pharmacologic advantage for the use of the isolation-perfusion technique.

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Seo, Hojun, Sang Yeon Lee, Jeongsu Lee, Sunjin Kim, Onejae Sul, Hyungtak Seo, and Seung-Beck Lee. "Low-temperature n-type doping of insulating ultrathin amorphous indium oxide using H plasma-assisted annealing." Nanotechnology 33, no. 20 (February 21, 2022): 205201. http://dx.doi.org/10.1088/1361-6528/ac51ac.

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Abstract Low-temperature process compatibility is a key factor in successfully constructing additional functional circuits on top of pre-existing circuitry without corrupting characteristics thereof, a technique that typically requires die-to-die (wafer-to-wafer) stacking and interconnecting. And against thermal annealing, which is mandatory and is possible only globally for activating amorphous oxide semiconductors, the selective control of electrical characteristics of the oxide thin-films for integrated circuit applications is challenging. Here, a low-temperature process that enables n-type doping of the designed region of insulating In2O3 thin-film is demonstrated. A short hydrogen plasma treatment followed by low-temperature annealing is used to increase interstitial and substitutional hydrogen associated bond states creating shallow donor levels in the insulating In2O3 surface to transform the thin-film into an n-type semiconductor. As a result, an In2O3 thin-film transistor with a high on/off current ratio (>108), a field-effect mobility of 3.8 cm2 V−1 s−1, and a threshold voltage of ∼3.0 V has been developed. Compared to performing just thermal annealing, the H-plasma assisted annealing process resulted in an n-type In2O3 thin-film transistor showing similar characteristics, while the processing time was reduced by ∼1/3 and the plasma-untreated area still remained insulating. With further development, the hydrogen plasma doping process may make possible a monolithic planar process technology for amorphous oxide semiconductors.

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Zushi, Takahiro, Hirotsugu Kojima, and Hiroshi Yamakawa. "One-chip analog circuits for a new type of plasma wave receiver on board space missions." Geoscientific Instrumentation, Methods and Data Systems 6, no. 1 (March 31, 2017): 159–67. http://dx.doi.org/10.5194/gi-6-159-2017.

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Abstract. Plasma waves are important observational targets for scientific missions investigating space plasma phenomena. Conventional fast Fourier transform (FFT)-based spectrum plasma wave receivers have the disadvantages of a large size and a narrow dynamic range. This paper proposes a new type of FFT-based spectrum plasma wave receiver that overcomes the disadvantages of conventional receivers. The receiver measures and calculates the whole spectrum by dividing the observation frequency range into three bands: bands 1, 2, and 3, which span 1 Hz to 1 kHz, 1 to 10 kHz, and 10 to 100 kHz, respectively. To reduce the size of the receiver, its analog section was realized using application-specific integrated circuit (ASIC) technology, and an ASIC chip was successfully developed. The dimensions of the analog circuits were 4.21 mm × 1.16 mm. To confirm the performance of the ASIC, a test system for the receiver was developed using the ASIC, an analog-to-digital converter, and a personal computer. The frequency resolutions for bands 1, 2, and 3 were 3.2, 32, and 320 Hz, respectively, and the average time resolution was 384 ms. These frequency and time resolutions are superior to those of conventional FFT-based receivers.

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Covaci, Mihnea Antoniu, and Lorant Andras Szolga. "Low-Voltage Plasma Generator Based on Standing Wave Voltage Magnification." Sustainability 14, no. 5 (March 2, 2022): 2890. http://dx.doi.org/10.3390/su14052890.

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The applied electronics domain has great importance due to many applications, such as energy conversion, directly influencing specific processes involving renewable energy. The development of newer manufacturing processes for many integrated components allows for better overall efficiency in certain switching DC/DC converters used for implementing such low-voltage electric field or X-ray generators. Hence, the work presented in this paper involves the development of a helical resonator using a complex DC/DC low-voltage power supply and other required high-voltage conversion circuits. It also follows that there is a possibility of improving this design using only renewable energy supplies. Following two different approach methods, using a circuit model compared to transmission line mathematics, the standing wave propagation mathematics yields multiple scenarios for building a model that predicts the secondary side natural frequency. Moreover, standing wave occurrence conditions in various-dimensioned conductors were further investigated.

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Li, Jie, Xiaoying He, Shen Xu, and Weifeng Sun. "A Review of Energy Recovery Circuits for Plasma Display Panels." IETE Technical Review 28, no. 1 (2011): 40. http://dx.doi.org/10.4103/0256-4602.74504.

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Kwak, Sangshin. "An overview of entire driving circuits for plasma display panels." IEEE Transactions on Consumer Electronics 55, no. 4 (November 2009): 2114–21. http://dx.doi.org/10.1109/tce.2009.5373776.

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38

Voshchenkov, Alexander M. "Plasma etching: An enabling technology for gigahertz silicon integrated circuits." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11, no. 4 (July 1993): 1211–20. http://dx.doi.org/10.1116/1.578495.

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Riley, Paul E. "Plasma Etching of Aluminum Metallizations for Ultralarge Scale Integrated Circuits." Journal of The Electrochemical Society 140, no. 5 (May 1, 1993): 1518–22. http://dx.doi.org/10.1149/1.2221589.

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40

Scholz, Tim, Rigmor Solberg, Cecilie Okkenhaug, Vibeke Videm, Michael J. Gallimore, Øystein Mathisen, Tom E. Mollnes, et al. "The significance of heparin-coated veno-venous bypass circuits in liver transplantation." Perfusion 17, no. 1 (January 2002): 45–50. http://dx.doi.org/10.1191/0267659102pf523oa.

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We studied the effects of veno-venous bypass (VVBP) circuit surface heparinization on the activation of the plasma defence systems (coagulation, fibrinolysis, kallikrein-kinin and complement) and leukocyte activation in a prospective randomized study in 20 patients during and 1 day after liver transplantation (OLT). To our knowledge, this is the first study of this kind where the possible benefits of surface heparinization of the VVBP circuit in OLT have been investigated. Twenty patients were randomized to either heparin-coated (HC) VVBP equipment or to otherwise identical noncoated (NC) circuits. Five blood samples were drawn during the OLT procedure: one just before VVBP, three during VVBP and one 5 min after portal venous reperfusion (PVR). A further sample was taken 1 day after the operation. Components of the blood coagulation, fibrinolytic and kallikrein-kinin systems were analysed using functional assays (chromogenic peptide substrate assays) or enzyme immunoassays (EIA). Complement system factors and granulocyte activation, represented by myeloperoxidase (MPO) release, were analyzed by EIA. Activation of the plasma defence systems occurred in both groups at an early stage during OLT and a further activation occurred 5 min after PVR. MPO levels were slightly elevated 5 min after PVR. However, no significant differences between the two groups were observed. Significant activation of the humoral defense systems was found in both groups during OLT. A considerably larger study, including at least 330 patients, is necessary to fully assess the possible benefits of surface heparinization of the VVBP circuit.

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Ongaro, C., A. Betti, B. Zardin, V. Siciliani, L. Orazi, J. Bertacchini, and M. Borghi. "An Alternative Solution for Microfluidic Chip Fabrication." Journal of Physics: Conference Series 2385, no. 1 (December 1, 2022): 012029. http://dx.doi.org/10.1088/1742-6596/2385/1/012029.

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Abstract This paper focuses on microfluidic devices, widely used in bioengineering. Their fabrication for research is almost entirely made of PDMS (a silicone), using photolithography and replica molding technologies, which involve many processing steps, sealed with a glass layer by plasma bonding. Our solution fabricates devices in just two steps, laser ablation of a glass layer, technology already extensively tested, and sealing with a commercial silicone layer by plasma bonding, drastically reducing skilled human operations and lead time. The paper describes the technologies with PDMS and with our solution, the design of a microfluidic test chip, the laser ablation and assessment by a confocal microscope of the microfluidic circuit in the glass layer of the chip, the plasma bonding of glass layers with PDMS and two other commercial silicones utilizing a grid of different plasma parameters, the qualitative assessment of the plasma bonding and choosing of a silicone as PDMS substitute, the extensive test on the bonding quality by two different pressure circuits on a batch of microfluidic chips realized with our proposed technology.

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42

Peng, Shanglong, Desheng Wang, Fuhua Yang, Zhanguo Wang, and Fei Ma. "Grown Low-Temperature Microcrystalline Silicon Thin Film by VHF PECVD for Thin Films Solar Cell." Journal of Nanomaterials 2015 (2015): 1–5. http://dx.doi.org/10.1155/2015/327596.

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Hydrogenated microcrystalline silicon thin films can be used to fabricate stable thin film solar cell, which were deposited by very high frequency plasma-enhanced chemical vapor deposition at low temperatures (~200°C). It has been found that the obtained film presented excellent structural and electrical properties, such as high growth rate and good crystallinity. With the decreasing of silane concentration, the optical gap and the dark conductivity increased, whereas the activation energy decreased. A reasonable explanation was presented to elucidate these phenomena. In addition, we fabricated p-i-n structure solar cells using the optimum microcrystalline silicon thin films, and preliminary efficiency of 4.6% was obtained for 1 μm thick microcrystalline silicon thin film solar cells with open-circuits voltage of 0.773 V and short-circuits current density of 12.28 mA/cm2. Future scope for performance improvement lies mainly in further increasing the short-circuit current.

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43

Popović, I., and M. Zlatanović. "Equivalent Circuits of Unipolar Pulsed Plasma System for Electrical and Optical Signal Analysis." Materials Science Forum 555 (September 2007): 89–94. http://dx.doi.org/10.4028/www.scientific.net/msf.555.89.

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Matching of pulse plasma generators to various gas discharges for surface treatment of materials depends on plasma processing equipment. In order to investigate the influence of pulse plasma generator and gas discharge parameters on electrical signal waveforms during the process of unipolar pulse plasma nitriding, equivalent electrical circuit was introduced. The influence of parasitic inductance of interconnection lines and vacuum chamber physical properties was also included in the given equivalent circuit. Gas discharge characteristics at different process parameters were investigated. It was found that the gas discharge and pulse plasma generator properties, as well as the electrical characteristics of interconnecting lines determined the system electrical signal response. From the analysis of optical signals emitted by the gas discharge it was found that the optical signal response might be represented by a typical RC integrator circuit response with the time constant higher than that of the equivalent electrical circuit of generator load. The conclusion was drawn that the process of charge particles generation is followed by the process of active species generation responsible for thermo-chemical processes on the cathode surface. Thus, the increase of the pulse plasma frequency is limited by the thermo-chemical process efficiency, and not only by the generator switching characteristics or by gas discharge electrical properties.

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44

Lee, Jeongsu, and Sangjeen Hong. "Dual-Frequency RF Impedance Matching Circuits for Semiconductor Plasma Etch Equipment." Electronics 10, no. 17 (August 27, 2021): 2074. http://dx.doi.org/10.3390/electronics10172074.

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The change in electrode impedance of semiconductor equipment due to repetitive processes is a major issue that creates process drift. In the current plasma etch chamber with a dual-frequency power system, the high-powered radio frequency (RF) source contributes to the enhancement of the plasma density, and the low-frequency bias power at the bottom electrode is adopted to enhance the injected ion energy in the plasma. The impedance control of the top electrode in dual-frequency capacity coupled plasma limits the impedance matching capability of the RF matching system because it only considers the high-frequency RF source. To control the precise impedance in dual-frequency semiconductor equipment, independent impedance control is required for each frequency. In this study, the impedance corresponding to a specific frequency was independently controlled using L (inductor) and C (capacitor). A 60 MHz stop filter and VVC were used to control 2 MHz impedance at a specific point, and a 2 MHz stop filter and VVC were used to control 60 MHz impedance. In the case of 2 MHz impedance control, the 2 MHz impedance changed from 10.9−j893 to 0.3−j62 and the 60 MHz impedance did not change. When controlling the 60 MHz impedance, the 60 MHz impedance changed from 0.33 + j26.53 to 0.2 + j190 and the 2 MHz impedance did not change. The designed LC circuits cover the impedance of 60 and 2 MHz separately and are verified by the change in the capacitance of the vacuum variable capacitors implemented in the RF impedance matching system.

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Kornev, V. I., N. M. Kalinina, D. A. Shelukhin, and O. N. Startseva. "Fibrinolysis system indicators during aorto-coronary bypass surgery in terms of cardiopulmonary bypass with minimized circuit." Medical alphabet 1, no. 4 (February 6, 2019): 58–65. http://dx.doi.org/10.33667/2078-5631-2019-1-4(379)-58-62.

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Introduction. The problem of irregularities in the fibrinolysis system during extracorporeal circulation is investigated closely and does not lose its relevance. The aim of research. To research and identify fibrinolysis system violations performed in cardiac surgical patients undergoing cardiopulmonary bypass surgery with minimized extracorporeal circuit (MiECC). Materials and methods. 50 patients were examined with coronary artery bypass grafting: 15 ones operated with MiECC (main group); 35 ones operated with heparin-coated extracorporeal bypass circuits (control group). Performance evaluation of fibrinolytic system was carried out prior to surgery, after protamine, 12 hours after operation, 7 days later, on discharge and one month after surgery. Results. Balance of fibrinolytic system after the operation shifts to the side of the oppression. Structural parameters of a fibrin clot (size CS and D density) according to thrombodynamics test correlate well with Xll-dependent fibrinolysis. Patients after surgery with MiECC in comparison with the conventional circuit have lower thrombinemia, minimal number of activated platelets, faster recovery of plasma fibrinolytic capacity, and accordingly lower risks of thrombotic complications. Conclusion. Fibrinolysis system indicators show the advantage of usage at aorto-coronary bypass with minimized heparin-coated extracorporeal bypass circuits.

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Murmantsev, A., A. Veklich, V. Boretskij, A. Shapovalov, and A. Kalenyuk. "Optical Emission Spectroscopy of Magnethron Discharge Ar/Cu Plasma." PLASMA PHYSICS AND TECHNOLOGY 6, no. 1 (2019): 87–90. http://dx.doi.org/10.14311/ppt.2019.1.87.

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Plasma parameters (excitation temperature and electron density) of pulsing magnetron discharge is studied by optical emission spectroscopy. Such discharges are usually used as effective sources in sputtering or deposition processes. Vapor admixtures in argon plasma define mainly the temperature and electron density in such discharges. This is the feature, which is typically takes place in plasma of discharge between contacts/electrodes in switching devices of electric technology circuits.

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Nikitović, Željka, O. Šašić, Z. Lj Petrović, G. N. Malović, A. Strinić, S. Dujko, Z. Raspopović, and M. Radmilović-Radjenović. "Data Bases for Modeling Plasma Devices for Processing of Integrated Circuits." Materials Science Forum 453-454 (May 2004): 15–20. http://dx.doi.org/10.4028/www.scientific.net/msf.453-454.15.

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Millard, D. L., K. R. Umstadter, and R. C. Block. "Noncontact testing of circuits via a laser-induced plasma electrical pathway." IEEE Design & Test of Computers 9, no. 1 (March 1992): 55–63. http://dx.doi.org/10.1109/54.124517.

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Thompson, Kyle, Jennifer Zirnheld, Kevin Burke, and Shoshanna N. Zucker. "Comparison of circuits for generating nonthermal plasma to treat melanoma cells." IEEE Transactions on Dielectrics and Electrical Insulation 24, no. 4 (2017): 2241–47. http://dx.doi.org/10.1109/tdei.2017.006288.

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Jung, Sun-Tae, Hyung-Seung Song, Dong-Su Kim, and Hyoun-Soo Kim. "Inductively coupled plasma etching of SiO2 layers for planar lightwave circuits." Thin Solid Films 341, no. 1-2 (March 1999): 188–91. http://dx.doi.org/10.1016/s0040-6090(98)01553-3.

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