Books on the topic 'Plasma Circuits'
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Samukawa, Seiji. Feature profile evolution in plasma processing using on-wafer monitoring system. Tokyo: Springer, 2014.
Find full text1955-, Bozhevolnyi Sergey I., ed. Plasmonic nanoguides and circuits. Singapore: Distributed by World Scientific Pub., 2009.
Find full textDanilin, B. S. Primenenie nizkotemperaturnoĭ plazmy dli͡a︡ nanesenii͡a︡ tonkikh plenok. Moskva: Ėnergoatomizdat, 1989.
Find full textZaĭt︠s︡ev, F. S. Matematicheskoe modelirovanie ėvoli︠u︡t︠s︡ii toroidalʹnoĭ plazmy. Moskva: MAKS Press, 2005.
Find full textTan, Cher Ming. Electromigration Modeling at Circuit Layout Level. Singapore: Springer Singapore, 2013.
Find full textRoosmalen, A. J. van. Dry etching for VLSI. New York: Plenum Press, 1991.
Find full textR, Viswanathan. Environmentally-induced discharge transient coupling to spacecraft. [Washington, DC]: National Aeronautics and Space Administration, 1985.
Find full textR, Viswanathan. Environmentally-induced discharge transient coupling to spacecraft. [Washington, DC]: National Aeronautics and Space Administration, 1985.
Find full textS, Grabowski Kenneth, ed. Materials modification by energetic atoms and ions: Symposium held April 28-30, 1992, San Francisco, California, USA. Pittsburgh, PA: Materials Research Society, 1992.
Find full textSymposium on Dry Process (9th 1987 Honolulu, Hawaii). Proceedings of the Symposium on Dry Process. Pennington, NJ (10 S. Main St., Pennington 08534-2896): Electrochemical Society, 1988.
Find full textSymposium on Interconnect and Contact Metallization (1997 Paris, France). Proceedings of the Symposium on Interconnect and Contact Metallization. Edited by Rathore Harzara S, Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and Electrochemical Society Electrodeposition Division. Pennington, NJ: Electrochemical Society, 1998.
Find full textBlaikley, David Charles William. Chemical studies of plasma etchants used in integrated circuit manufacture. Birmingham: AstonUniversity. Department of Chemical Engineering and Applied Chemistry, 1991.
Find full textS, Mathad G., Rathore Harzara S, and Arita Y, eds. Interconnect and contact metallization for ULSI: Proceedings of the international symposium. Pennington, N.J: Electrochemical Society, 2000.
Find full text1955-, Bozhevolnyi Sergey I., ed. Plasmonic nanoguides and circuits. Singapore: Distributed by World Scientific Pub., 2009.
Find full text1955-, Bozhevolnyi Sergey I., ed. Plasmonic nanoguides and circuits. Singapore: Pan Stanford, 2009.
Find full textSamukawa, Seiji. Feature Profile Evolution in Plasma Processing Using on-Wafer Monitoring System. Springer London, Limited, 2014.
Find full textEinspruch, Norman G., and Dale M. Brown. Plasma Processing for VLSI. Elsevier Science & Technology Books, 2014.
Find full text(Editor), R. J. Shul, and S. J. Pearton (Editor), eds. Handbook of Advanced Plasma Processing Techniques. Springer, 2000.
Find full textApplications of plasma processes to VLSI technology. New York: Wiley, 1985.
Find full textA, Orlikovskiĭ A., ed. Problemy submikronnoĭ tekhnologii. Moskva: Nauka, 1996.
Find full textA, Orlikovskiĭ A., ed. Problemy submikronnoĭ tekhnologii. Moskva: "Nauka", 1993.
Find full textLucovsky, Gerald, Dale E. Ibbotson, and Dennis W. Hess. Characterization of Plasma-Enhanced CVD Processes: Volume 165. University of Cambridge ESOL Examinations, 2014.
Find full textW, York Kenneth, Bowers Glen E, and United States. National Aeronautics and Space Administration., eds. Integration issues of a plasma contactor power electronics unit. [Washington, D.C.]: National Aeronautics and Space Administration, 1995.
Find full textRoosmalen, A. J. Van. Dry Etching for Vlsi. Springer, 2013.
Find full textS, Mathad G., Electrochemical Society. Dielectric Science and Technology Division., Electrochemical Society Electronics Division, and International Symposium on Plasma Etching Processes for Sub-Quarter Micron Devices (1999 : Honolulu, Hawaii), eds. Plasma etching processes for sub-quarter micron devices: Proceedings of the International Symposium. Pennington, New Jersey: Electrochemical Society., 2000.
Find full textG, Sabnis Anant, Raaijmakers Ivo J, Society of Photo-optical Instrumentation Engineers., and Semiconductor Equipment and Materials International., eds. Process, equipment, and materials control in integrated circuit manufacturing: 25-26 October 1995, Austin, Texas. Bellingham, Wash: SPIE, 1995.
Find full textArmando, Iturralde, Lin Te-Hua, Society of Photo-optical Instrumentation Engineers., and Semiconductor Equipment and Materials International., eds. Process, equipment, and materials control in integrated circuit manufacturing II: 16-17 October 1996, Austin, Texas. Bellingham, Wash., USA: SPIE, 1996.
Find full textAbe, Ghanbari, Toprac Anthony J, and Society of Photo-optical Instrumentation Engineers., eds. Process, equipment, and materials control in integrated circuit manufacturing III: 1-2 October 1997, Austin, Texas. Bellingham, Washington: SPIE, 1997.
Find full textE, Chen Fusen, Murarka S. P, and Society of Photo-optical Instrumentation Engineers., eds. Microelectronics technology and process integration: 20-21 October 1994, Austin, Texas. Bellingham, Wash., USA: SPIE, 1994.
Find full text1955-, Toprac Anthony J., Dang Kim, Society of Photo-optical Instrumentation Engineers., and Solid State Technology (Organization), eds. Process, equipment, and materials control in integrated circuit manufacturing IV: 22-24 September, 1998, Santa Clara, California. Bellingham, Washington: SPIE, 1998.
Find full textG, Lucovsky, Ibbotson Dale E, and Hess Dennis W, eds. Characterization of plasma-enhanced CVD processes: Symposium held Novermber 27-28, 1989, Boston, Massachusetts, U.S.A. Pittsburgh, Pa: Materials Research Society, 1990.
Find full textBaggerman, J. A. G., S. J. H. Brader, and A. J. van Roosmalen. Dry Etching for VLSI. Springer, 2013.
Find full text1955-, Toprac Anthony J., Dang Kim, Society of Photo-optical Instrumentation Engineers., and Electrochemical Society, eds. Process, equipment, and materials control in integrated circuit manufacturing V: 22-23 September, 1999, Santa Clara, California. Bellingham, Wash., USA: SPIE, 1999.
Find full textTan, Cher Ming, and Feifei He. Electromigration Modeling at Circuit Layout Level. Springer, 2013.
Find full textDry etch technology, 9-10 September 1991, San Jose, Calif. Bellingham, Wash: SPIE--The International Societyfor Optical Engineering, 1991.
Find full textDeepak, Ranadive, and Society of Photo-optical Instrumentation Engineers., eds. Dry etch technology: 9-10-September 1991, San Jose, California. Bellingham, Wash: SPIE, 1992.
Find full textJames, Bondur, and Society of Photo-optical Instrumentation Engineers., eds. Microelectronic processes, sensors, and controls: 27-29 September 1993, Monterey, California. Bellingham, Wash: SPIE, 1994.
Find full text2001 IEEE Radiation Effects Data Workshop: IEEE Nuclear and Plasma Sciences Society : The Institute of Electrical and Electronics Engineers, Inc, : Workshop Record (IEEE Conference Proceedings). Inst Elect & Electronic Engineers, 2001.
Find full textLucovsky, Gerald, Dale E. Ibbotson, and Dennis W. Hess. Characterization of Plasma-Enhanced Cvd Processes: Symposium Held November 27-28, 1989, Boston, Massachusetts, U.S.A. (Materials Research Society Symposium Proceedings). Materials Research Society, 1990.
Find full textN, Patel Divyesh, Graef Mart, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Electrochemical Society, eds. Multilevel interconnect technology: 1-2 October 1997, Austin, Texas. Bellingham, Wash: SPIE, 1997.
Find full textRossnagel, Stephen M., Kenneth S. Grabowski, Scott A. Barnett, and Kiyotaka Wasa. Materials Modification by Energetic Atoms and Ions: Volume 268. University of Cambridge ESOL Examinations, 2014.
Find full textGrabowski, Kenneth S., and Scott A. Barnett. Materials Modification by Energetic Atoms and Ions: Symposium Held April 28-30, 1992, San Francisco, California, USA (Materials Research Society Symposium Proceedings). Materials Research Society, 1992.
Find full textMart, Graef, Patel Divyesh N, Society of Photo-optical Instrumentation Engineers., and Electrochemical Society, eds. Multilevel interconnect technology III: 22-23 September 1999, Santa Clara, California. Bellingham, Wash., USA: SPIE, 1999.
Find full textGeng, Hwaiyu. Semiconductor Manufacturing Handbook (McGraw-Hill Handbooks). McGraw-Hill Professional, 2005.
Find full textGeng, Hwaiyu. Semiconductor Manufacturing Handbook (McGraw-Hill Handbooks). McGraw-Hill Professional, 2005.
Find full textMart, Graef, Patel Divyesh N, Society of Photo-optical Instrumentation Engineers., Solid State Technology (Organization), Electrochemical Society, and American Vacuum Society, eds. Multilevel interconnect technology II: 23-24 September, Santa Clara, California. Bellingham, Washington: SPIE, 1998.
Find full textCoaxial microwave electrothermal thruster performance in hydrogen: W. Richardson and J. Asmussen. [Washington, DC: National Aeronautics and Space Administration, 1994.
Find full textGarcía, Miguel A., and Gloria Beatriz Chicote. Voces de tinta. Editorial de la Universidad Nacional de La Plata (EDULP), 2008. http://dx.doi.org/10.35537/10915/90795.
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