Journal articles on the topic 'Planar spiral inductors'

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1

Pacurar, Claudia, Vasile Topa, Adina Giurgiuman, Calin Munteanu, Claudia Constantinescu, Marian Gliga, and Sergiu Andreica. "High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits." Electronics 10, no. 23 (November 23, 2021): 2897. http://dx.doi.org/10.3390/electronics10232897.

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This paper deals with high frequency analysis of spiral inductors, used in microelectronics circuits, to optimize their configuration. Software developed, designed, and implemented by the authors for nano and micrometre spiral inductor high frequency analysis, named ABSIF, is presented in this paper. ABSIF determines the inductance, quality factor, and electrical parameters for square, hexagonal, octagonal, and circular spiral inductors and their configuration optimization for energy efficiency. ABSIF is a good tool for spiral inductor design optimization in high frequency applications and takes into account the imposed technological limits and/or the designers’ constraints. A set of spiral inductors are considered and analysed for high frequency values using ABSIF, and the results are presented in the paper. The validation of ABSIF was completed by comparing the results with those obtained using a similar commercial software, Sonnet LiteTM, which is dedicated to high frequency electromagnetic analysis.
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2

Muneeswaran, Dhamodaran, Jegadeesan Subramani, Thanapal Pandi, Navaneethan Chenniappan, and Meenatchi Shanmugam. "Modelling of Different On-chip Inductors for Radio Frequency Integrated Circuits." Proceedings of the Bulgarian Academy of Sciences 75, no. 10 (October 30, 2022): 1491–98. http://dx.doi.org/10.7546/crabs.2022.10.12.

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This paper presents a typical frequency-dependent modelling of different on-chip inductors for RFICs design problems. Modern RF circuits often feature on-chip inductors required by modern circuit design. A comparison of different inductor geometrics includes a planar spiral inductor and novel multilayer inductors are analyzed. An electromagnetic model with fewer assumptions than empirical equations and higher efficiency than full-field solvers would be welcome. So would facile comparisons of different inductor structures. This paper describes recent work on the electromagnetic modelling of on-chip inductor structures, applied to the comparison of inductor geometries, including the traditional spiral inductor and a novel multilayer inductor. The electromagnetic modelling of the investigative model is also presented.
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3

Haddad, Elias, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan, Mihai Lazar, Cyril Buttay, and Beatrice Payet-Gervy. "Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates." Advanced Materials Research 324 (August 2011): 294–97. http://dx.doi.org/10.4028/www.scientific.net/amr.324.294.

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This paper presents the design, fabrication, and characterization of micro planar inductors on a microwave magnetic material (YIG). Planar spiral inductors were designed for monolithic DC-DC converters in System-In-Package with 100 MHz switching frequency (1 W, Vin= 3.6 V, Vout= 1 V). A microwave magnetic substrate (YIG) serves as mechanical support, and also presents a double purpose by increasing inductance value and reducing electromagnetic interferences (EMI). This last point is critical to improve the behavior of a switching mode power supply (SMPS). In order to obtain an optimal design for the inductor, geometrical parameters were studied using Flux2D simulator and an optimized 30 to 40 nH spiral inductor with expected 25 mΩ RDC, 3 mm2 footprint area was designed. Subsequently, samples have been fabricated by electroplating technique, and tested using a vector network analyzer in the 10 MHz to 100 MHz frequency range. Results were then compared to the predicted response of simulated equivalent model.
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4

Lopez-Villegas, J. M., N. Vidal, and Jesus A. del Alamo. "Optimized Toroidal Inductors Versus Planar Spiral Inductors in Multilayered Technologies." IEEE Transactions on Microwave Theory and Techniques 65, no. 2 (February 2017): 423–31. http://dx.doi.org/10.1109/tmtt.2016.2645571.

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5

Marić, Andrea, Goran Radosavljević, Nelu Blaž, Walter Smetana, and Ljiljana Živanov. "Embedded Ferrite LTCC Inductors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000388–93. http://dx.doi.org/10.4071/cicmt-2012-wa48.

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This paper presents for the first time one realization of simple planar inductor realized inside the stack of ferrite LTCC (Low Temperature Co-fired Ceramic) tapes. Presented inductor is one layer square spiral fabricated in the LTCC technology. In order to point out benefits of implementation of ferrite material on inductor inductance, the same inductor geometry was fabricated between two dielectric LTCC tapes. Commercially available LTCC material (both ferrite and dielectric) were implemented for the realization of proposed inductors. Designed structures were characterized and obtained experimental results show that even implementation of a very thin layer of ferrite material around inductor lines drastically increases its inductance. For the same inductor design that occupies the same chip area the inductance enhancement over 11 times is achieved. In addition this enhancement is followed with maintenance of good performance of the inductor.
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6

Ribas, R. P., J. Lescot, J. L. Leclercq, J. M. Karam, and F. Ndagijimana. "Micromachined microwave planar spiral inductors and transformers." IEEE Transactions on Microwave Theory and Techniques 48, no. 8 (2000): 1326–35. http://dx.doi.org/10.1109/22.859477.

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7

Zhang, Yaojiang, Erping Li, Haibo Long, and Zhenghe Feng. "Accurate model for micromachined microwave planar spiral inductors." International Journal of RF and Microwave Computer-Aided Engineering 13, no. 3 (May 2003): 229–38. http://dx.doi.org/10.1002/mmce.10077.

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8

Tounsi, Fares, Mohamed Hadj Said, Margo Hauwaert, Sinda Kaziz, Laurent A. Francis, Jean-Pierre Raskin, and Denis Flandre. "Variation Range of Different Inductor Topologies with Shields for RF and Inductive Sensing Applications." Sensors 22, no. 9 (May 5, 2022): 3514. http://dx.doi.org/10.3390/s22093514.

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In this study, different planar inductor topologies were studied to evaluate their characteristic parameters’ variation range upon approaching Fe- and Cu-based shield plates. The use of such materials can differently alter the electrical properties of planar inductors such as the inductance, resonant frequency, resistance, and quality factor, which could be useful in multiple devices, particularly in inductive sensing and radio-frequency (or RF) applications. To reach an optimal design, five different square topologies, including spiral, tapered, non-spiral, meander, and fractal, were built on a printed circuit board (PCB) and assessed experimentally. At the working frequency of 1 MHz, the results showed a decrease in the inductance value when approaching a Cu-based plate and an increase with Fe-based plates. The higher variation range was noticeable for double-layer topologies, which was about 60% with the Cu-based plate. Beyond an intrinsic deflection frequency, the inductance value began to decrease when approaching the ferromagnetic plate because of the ferromagnetic resonance (FMR). It has been shown that the FMR frequency depends on the inductor topology and is larger for the double-layer spiral one. The Q-factor was decreasing for all topologies but was much faster when using ferromagnetic plates because of the FMR, which intensely increases the track resistance. The resonant frequency was increasing for all double-layer topologies and decreasing for single-layer ones, which was mainly due to the percentage change in the stray capacitance compared to the inductance variation. The concept of varying inductors by metal shielding plates has great potential in a wide range of nondestructive sensing and RF applications.
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9

Barinov, A. E., and S. A. Zhgoon. "Planar superconducting lumped element bandpass filter with spiral inductors." Superconductor Science and Technology 15, no. 7 (May 22, 2002): 1040–42. http://dx.doi.org/10.1088/0953-2048/15/7/308.

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10

Barinov, A. E., S. A. Zhgoon, and V. A. Sukhov. "Planar superconducting lumped element bandpass filter with spiral inductors." Physica C: Superconductivity 355, no. 3-4 (June 2001): 257–59. http://dx.doi.org/10.1016/s0921-4534(01)00032-6.

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11

Palson, C. L., D. D. Krishna, B. R. Jose, J. Mathew, and M. Ottavi. "Memristor Based Planar Tunable RF Circuits." Journal of Circuits, Systems and Computers 28, no. 13 (February 11, 2019): 1950225. http://dx.doi.org/10.1142/s0218126619502256.

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Memristors have been recently proposed as an alternative to incorporate switching along with traditional CMOS circuits. Adaptive impedance and frequency tuning are an essential and challenging aspect in communication system design. To enable both, a matching network based on switchable capacitors with fixed inductors is proposed in this paper where the switching is done by memristive switches. This paper analyzes the operation of memristors as a switch and a matching network based on memristors which adaptively tunes with impedance and frequency. With three capacitor banks of each 0.5 pF resolution and two fixed inductors, matching for antenna impedance ranging from 20 to 200[Formula: see text]Ohms and for frequencies ranging from 0.9 to 3.2[Formula: see text]GHz is reported. Thereafter, an adaptive planar band-pass filter is implemented on CMOS technology with two metal layers. This adaptive frequency tunable band-pass filter uses a [Formula: see text] network with resonator tanks in both arms that operates at 2.45 GHz. It is tunable from 2.8[Formula: see text]GHz to 7.625[Formula: see text]GHz range. This tunability is achieved using tunable spiral inductor based on memristive switches. The proposed filter layout is implemented and simulated in ANSYS Designer. The initialization and the programming circuitry to enable adaptive switching of the memristive devices has to be addressed. Since RF memristive devices are not commercially available, circuit level simulations are done as a proof of concept to validate the expected results.
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12

Klejwa, N., R. Misra, J. Provine, R. T. Howe, and S. J. Klejwa. "Laser print patterning of planar spiral inductors and interdigitated capacitors." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 27, no. 6 (2009): 2745. http://dx.doi.org/10.1116/1.3264673.

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13

Avitabile, G., A. Cidronali, and C. Salvador. "Equivalent circuit model of GaAs MMIC-coupled planar spiral inductors." International Journal of Microwave and Millimeter-Wave Computer-Aided Engineering 7, no. 4 (July 1997): 318–26. http://dx.doi.org/10.1002/(sici)1522-6301(199707)7:4<318::aid-mmce5>3.0.co;2-g.

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14

Kim, GyoungBum, Seung-Yong Cha, Eun-Kyung Hyun, YoungChai Jung, YoonSuk Choi, Jae-Sung Rieh, Seong-Rae Lee, and SungWoo Hwang. "Integrated planar spiral inductors with CoFe and NiFe ferromagnetic layer." Microwave and Optical Technology Letters 50, no. 3 (2008): 676–78. http://dx.doi.org/10.1002/mop.23180.

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15

Lin, Chen, Teng Zhan, Junxi Wang, Jinmin Li, Zhiqiang Liu, and Xiaoyan Yi. "Investigations about Al and Cu-Based Planar Spiral Inductors on Sapphire for GaN-Based RF Applications." Applied Sciences 11, no. 11 (June 2, 2021): 5164. http://dx.doi.org/10.3390/app11115164.

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Conventionally, Cu is preferred over Al to fabricate integrated inductors with higher quality factors on either silicon or sapphire substrates, profiting from its lower resistivity. However, after investigating and comparing these two kinds of metal multilayers in terms of fabrication process, electrical conductivity, in-depth profile analysis and performance of actual inductors, the Al-based metal multilayer exhibits competitive ability in fabricating thin-film inductors on sapphire compared to Cu-based multilayers. This is attributed to the degradation in electrical conductivity out of oxidation of Cu-based metal sublayers or forming alloys between them. Furthermore, in order to avoid complicated de-embedding procedures in the characterization of the on-chip inductors, a six-element equivalent physical model, which takes the parasitic effect of radio-frequency (RF) test structures into account, is proposed and validated by matching well with embedded measurement results.
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16

Sandrolini, Leonardo, Ugo Reggiani, and Giovanni Puccetti. "ANALYTICAL CALCULATION OF THE INDUCTANCE OF PLANAR ZIG-ZAG SPIRAL INDUCTORS." Progress In Electromagnetics Research 142 (2013): 207–20. http://dx.doi.org/10.2528/pier13071105.

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17

Fujii, Tomoharu, Kazutaka Kobayashi, Hiroshi Shimizu, Shinji Nakazawa, Toshiro Sato, Fumihiro Sato, and Hiroki Kobayashi. "Planar Power Inductor with Magnetic Film for Embedded LSI Package." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000464–72. http://dx.doi.org/10.4071/isom-2012-tp62.

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A power inductor component is relatively very thick and large shape. Therefore, these components are not appropriate feature to be embedded into a LSI package and mounted nearby a LSI chip, it is challengeable to make the embedded application. However, LSI power delivery system is going for low voltage and large current, and losses between power supply and loads impacts on the power supply efficiency characteristic. In order to solve this problem, miniaturization for a power inductor is needed to realize the embedded applications. As one of approaches to realize the power delivery systems, the planar power inductor with Zn-Ferrite film has been studied for the next generations. A structure of planar power inductor was designed to be configured 2-turn inner copper spiral coil covered with top and bottom magnetic core. The Zn-Ferrite film used as a magnetic core has a high resonance frequency around 300MHz and high saturation magnetization of 0.6T or more, and this film can be formed in low temperature, which can be handled in parallel way to fabricate an organic package. We have developed the organic package with employing the power inductors covered with Zn-Ferrite as prototype of the embedded application, and evaluated the electrical and magnetic characterizations. The thickness of embedded planar power inductor covered with Zn-ferrite film is 50um, and the size is 850um squares. Q factor is 10 to 13 in 30MHz to 100MHz. The degradation of inductance caused by the superimposed current does not happen without changing until 3A.
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18

Aebischer, H. A. "Inductance Formula for Rectangular Planar Spiral Inductors with Rectangular Conductor Cross Section." Advanced Electromagnetics 9, no. 1 (February 7, 2020): 1–18. http://dx.doi.org/10.7716/aem.v9i1.1346.

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In modern technology, inductors are often shaped in the form of planar spiral coils, as in radio frequency integrated circuits (RFIC’s), 13.56 MHz radio frequency identification (RFID), near field communication (NFC), telemetry, and wireless charging devices, where the coils must be designed to a specified inductance. In many cases, the direct current (DC) inductance is a good approximation. Some approximate formulae for the DC inductance of planar spiral coils with rectangular conductor cross section are known from the literature. They can simplify coil design considerably. But they are almost exclusively limited to square coils. This paper derives a formula for rectangular planar spiral coils with an aspect ratio not exceeding a value between 2.5 and 4.0, depending on the number of turns, and having a cross-sectional aspect ratio of height to width not exceeding unity. It is valid for any dimension and inductance range. The formula lowers the overall maximum error from hitherto 28 % down to 5.6 %. For specific application areas like RFIC’s and RFID antennas, it is possible to reduce the domain of definition, with the result that the formula lowers the maximum error from so far 18 % down to 2.6 %. This was tested systematically on close to 140000 coil designs of exactly known inductance. To reduce the number of dimensions of the parameter space, dimensionless parameters are introduced. The formula was also tested against measurements taken on 16 RFID antennas manufactured as PCB’s. The derivation is based on the idea of treating the conductor segments of all turns as if they were parallel conductors of a single-turn coil. It allows the inductance to be calculated with the help of mean distances between two arbitrary points anywhere within the total cross section of the coil. This leads to compound mean distances that are composed of two types of elementary ones, firstly, between a single rectangle and itself, and secondly, between two displaced congruent rectangles. For these elementary mean distances, exact expressions are derived. Those for the arithmetic mean distance (AMD) and one for the arithmetic mean square distance (AMSD) seem to be new. The paper lists the source code of a MATLAB® function to implement the formula on a computer, together with numerical examples. Further, the code for solving a coil design problem with constraints as it arises in practical engineering is presented, and an example problem is solved.
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19

Ortego, I., N. Sanchez, J. Garcia, F. Casado, D. Valderas, and J. I. Sancho. "Inkjet Printed Planar Coil Antenna Analysis for NFC Technology Applications." International Journal of Antennas and Propagation 2012 (2012): 1–6. http://dx.doi.org/10.1155/2012/486565.

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The aim of this paper is to examine the potential of inkjet printing technology for the fabrication of Near Field Communication (NFC) coil antennas. As inkjet printing technology enables deposition of a different number of layers, an accurate adjustment of the printed conductive tracks thickness is possible. As a consequence, input resistance andQfactor can be finely tuned as long as skin depth is not surpassed while keeping the same inductance levels. This allows the removal of the typical damping resistance present in current NFC inductors. A general methodology including design, simulation, fabrication, and measurement is presented for rectangular, planar-spiral inductors working at 13.56 MHz. Analytical formulas, computed numerical models, and measured results for antenna input impedance are compared. Reflection coefficient is designated as a figure of merit to analyze the correlation among them, which is found to be below −10 dB. The obtained results demonstrate the suitability of this technology in the fabrication of low cost, environmentally friendly NFC coils on flexible substrates.
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20

Aebischer, H. A. "Inductance Formula for Square Spiral Inductors with Rectangular Conductor Cross Section." Advanced Electromagnetics 8, no. 4 (September 10, 2019): 80–88. http://dx.doi.org/10.7716/aem.v8i4.1074.

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Planar spiral coils are used as inductors in radio frequency (RF) microelectronic integrated circuits (IC’s) and as antennas in both radio frequency identification (RFID) and telemetry systems. They must be designed to a specified inductance. From the literature, approximate analytical formulae for the inductance of such coils with rectangular conductor cross section are known. They yield the direct current (DC) inductance, which is considered as a good approximation for inductors in RF IC’s up to the GHz range. In principle, these formulae can simplify coil design considerably. But a recent comparative study of the most cited formulae revealed that their maximum relative error is often much larger than claimed by the author, and too large to be useful in circuit design. This paper presents a more accurate formula for the DC inductance of square planar spiral coils than was known so far. It is applicable to any design of such coils with up to windings. Owing to its scalability, this holds irrespectively of the coil size and the inductance range. It lowers the maximum error over the whole domain of definition from so far down to . This has been tested by the same method used in the comparative study mentioned above, where the precise reference inductances were computed with the help of the free standard software FastHenry2. A comparison to measurements is included. Moreover, the source code of a MATLAB® function to implement the formula is given in the appendix.
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21

Li, Yan Lin, and Sheng Sun. "FULL-WAVE SEMI-ANALYTICAL MODELING OF PLANAR SPIRAL INDUCTORS IN LAYERED MEDIA." Progress In Electromagnetics Research 149 (2014): 45–54. http://dx.doi.org/10.2528/pier14072404.

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22

Lin, Yo-Sheng, Jia-Lun Chen, and Ke-Hou Chen. "Variable inductance planar spiral inductors and CMOS wideband amplifiers with inductive peaking." Microwave and Optical Technology Letters 47, no. 4 (2005): 305–9. http://dx.doi.org/10.1002/mop.21153.

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23

Wang, Jingchen, Mark Paul Leach, Eng Gee Lim, Zhao Wang, Rui Pei, Zhenzhen Jiang, and Yi Huang. "Printed Split-Ring Loops with High Q-Factor for Wireless Power Transmission." Electronics 10, no. 22 (November 22, 2021): 2884. http://dx.doi.org/10.3390/electronics10222884.

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The use of printed spiral coils (PSCs) as inductors in the construction of Wireless Power Transmission (WPT) circuits can save space and be integrated with other circuit boards. The challenges and issues of PSCs present for WPT mainly relate to maintaining an inductive characteristic at frequencies in Ultra High Frequency (UHF) band and to maximising the power transfer efficiency (PTE) between primary and secondary circuits. A new technique is proposed to increase the Q-factor relative to that offered by the PSC, which is shown to enhance WPT performance. This paper provides four-turn planar split-ring loops with high Q-factor for wireless power transmission at UHF bands. This design enhances the power transfer efficiency more than 12 times and allows for a greater transfer distance from 5 mm to 20 mm, compared with a conventional planar rectangular spiral coil.
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24

Acero, J., R. Alonso, L. A. Barragan, and J. M. Burdio. "Modeling of Planar Spiral Inductors Between Two Multilayer Media for Induction Heating Applications." IEEE Transactions on Magnetics 42, no. 11 (November 2006): 3719–29. http://dx.doi.org/10.1109/tmag.2006.882308.

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25

Goni, Amaya, Javier del Pino, Benito Gonzalez, and Antonio Hernandez. "An Analytical Model of Electric Substrate Losses for Planar Spiral Inductors on Silicon." IEEE Transactions on Electron Devices 54, no. 3 (March 2007): 546–53. http://dx.doi.org/10.1109/ted.2006.890366.

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26

Aebischer, H. A. "Comparative Study of the Accuracy of Analytical Inductance Formulae for Square Planar Spiral Inductors." Advanced Electromagnetics 7, no. 5 (September 19, 2018): 37–48. http://dx.doi.org/10.7716/aem.v7i5.862.

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In the design of radio frequency (RF) microelectronic integrated circuits (IC’s) and of antennas for short-wave radio frequency identification (RFID) and telemetry systems, planar spiral coils are important components. Many approximate analytical formulae for calculating the inductance of such coils can be found in the literature. They can simplify the problem of designing inductors to a predefined inductance considerably. But the error statistics given by different authors cannot be compared because they are based on different or unknown domains of definition. Hence, it is not possible to decide which formula is best in a given case by merely studying the literature. This paper compares the maximum relative errors of six of some of the most cited formulae in the literature. To all formulae, the same domains of definition are applied. Each of them spans all four dimensions of the parameter space. Precise inductances are obtained numerically with the help of the free scientific and industrial standard software FastHenry2 and used as reference values to calculate the errors of the formulae. It has been found that the alleged maximum errors reported by some authors are far too optimistic. Only two formulae feature small enough errors to be useful in circuit design. The method and the domains of definition applied in the present study may also prove useful for the assessment of future formulae.
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27

Tanigawa, K., H. Hirano, T. Sato, and N. Tanaka. "Electrical characteristics of spiral coil planar inductors using amorphous alloy ribbons as magnetic layers." Journal of Applied Physics 75, no. 10 (May 15, 1994): 5788–90. http://dx.doi.org/10.1063/1.355563.

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28

Park, J. W., F. Cros, and M. G. Allen. "Planar Spiral Inductors With Multilayer Micrometer-Scale Laminated Cores for Compact-Packaging Power Converter Applications." IEEE Transactions on Magnetics 40, no. 4 (July 2004): 2020–22. http://dx.doi.org/10.1109/tmag.2004.832159.

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29

Xiong, Jijun, Tanyong Wei, Tao Luo, Qiulin Tan, Chenyang Xue, Jun Liu, and Wendong Zhang. "Coupling Influence on Signal Readout of a Dual-Parameter LC Resonant System." Advances in Mathematical Physics 2015 (2015): 1–9. http://dx.doi.org/10.1155/2015/437869.

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Dual-parameter inductive-capacitive (LC) resonant sensor is gradually becoming the measurement trend in complex harsh environments; however, the coupling between inductors greatly affects the readout signal, which becomes very difficult to resolve by means of simple mathematical tools. By changing the values of specific variables in a MATLAB code, the influence of coupling between coils on the readout signal is analyzed. Our preliminary conclusions underline that changing the coupling to antenna greatly affects the readout signal, but it simultaneously influences the other signal. Whenf01=f02, it is better to broaden the difference between the two coupling coefficientsk1andk2. On the other side, whenf01is smaller thanf02, it is better to decrease the coupling between sensor inductorsk12, in order to obtain two readout signals averaged in strength. Finally, a test system including a discrete capacitor soldered to a printed circuit board (PCB) based planar spiral coil is built, and the readout signals under different relative inductors positions are analyzed. All experimental results are in good agreement with the results of the MATLAB simulation.
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30

Gao, Wei, Chao Jiao, and Zhiping Yu. "Efficient inductance calculation for planar spiral inductors and transformers based on analytical concentric half-turn formulas." International Journal of RF and Microwave Computer-Aided Engineering 16, no. 6 (November 2006): 565–72. http://dx.doi.org/10.1002/mmce.20178.

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31

Abdelbagi, Selma, and Grant A. Ellis. "Study on the effects of variation in line width on the planar spiral inductors on GaAs." International Journal of RF and Microwave Computer-Aided Engineering 20, no. 4 (May 11, 2010): 458–64. http://dx.doi.org/10.1002/mmce.20451.

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32

Ren, Zhong, Qiu Lin Tan, Chen Li, Tao Luo, Ting Cai, and Ji Jun Xiong. "The Design and Simulation of Wide Range Pressure Sensor Based on HTCC for High-Temperature Applications." Key Engineering Materials 609-610 (April 2014): 1053–59. http://dx.doi.org/10.4028/www.scientific.net/kem.609-610.1053.

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A wide range pressure sensor is designed based on the theoretical basis of LC series resonance circuit model to realize the wireless passive measurement in the harsh environment, such as high temperature and high pressure. The capacitive pressure sensitive device is devised by the technology of high-temperature co-fired ceramics (HTCC) to form nine density cavities in zirconia ceramic substrates, and thick film technology to print capacitance plates and planar spiral inductors. The theoretical calculation and simulation analysis of the designed sensor are made respectively under high pressure (10MPa) and temperature (600 °C), the results of which verify the feasibility of the design in a wide range of pressure for high-temperature applications, and provide the reliable theory basis for the fabrication of wide range pressure sensor.
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33

Bonmassar, Giorgio, Laleh Golestanirad, and Jiangdong Deng. "Enhancing Coil Design for Micromagnetic Brain Stimulation." MRS Advances 3, no. 29 (2018): 1635–40. http://dx.doi.org/10.1557/adv.2018.155.

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ABSTRACTThis work further advances the micromagnetic stimulation (μMS) technology, which has shown the capability of stimulating the nervous system using magnetic induction in a focal region of tissue by discharging a time-varying current through a sub-millimeter size coil. However, μMS was originally based on commercial off the shelf (COTS) inductors, which are designed to maximize efficiency and minimize its losses albeit shielding off the magnetic field from reaching the neural tissue. In this work, we study and fabricate microscale coil structures for next-generation μMS devices. The coil was designed to optimize the flux injected into the tissue by using a planar square spiral coil geometry, which was previously shown to be optimal for neuronal stimulation. The results of the electromagnetic Finite Elements Method (FEM) simulations of the proposed μMS device show that even though the spiral has a fully symmetric design, it nonetheless exhibits an asymmetry in the induced electric field in the tissue that can potentially be used for activating neurons with a specific axonal orientation. Such devices could become the brain and heart stimulators of the future with their contactless ability to deliver the neuronal stimulation needed for therapeutic efficacy in patients in need of implantable cardioverter-defibrillators or pace-makers, or patients with Parkinson’s disease, epilepsy.
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Hadj Said, M., F. Tounsi, SG Surya, B. Mezghani, M. Masmoudi, and VR Rao. "A MEMS-based shifted membrane electrodynamic microsensor for microphone applications." Journal of Vibration and Control 24, no. 1 (March 31, 2016): 208–22. http://dx.doi.org/10.1177/1077546316637298.

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In this paper we present a multidisciplinary modeling of a MEMS-based electrodynamic microsensor, when an additional vertical offset is defined, aiming acoustic applications field. The principle is based on the use of two planar inductors, fixed outer and suspended inner. When a DC current is made to flow through the outer inductor, a magnetic field is produced within the suspended inner one, located on a membrane top. In our modeling, the magnetic field curve, as a function of the vertical fluctuation magnitude, shows that the radial component was maximum and stationary for a specific vertical location. We demonstrate in this paper that the dynamic response of the electrodynamic microsensor was very appropriate for acting as a microphone when the membrane is shifted to a certain vertical position, which represents an improvement of the microsensor's basic design. Thus, a proposed technological method to ensure this offset of the inner inductor, by using wafer bonding method, is discussed. On this basis, the mechanical and electrical modeling for the new microphone design was performed using both analytic and Finite Element Method. Firstly, the resonance frequency was set around 1.6 kHz, in the middle of the acoustic band (20 Hz – 20 kHz), then the optimal location of the inner average spiral was evaluated to be around 200µm away from the diaphragm edge. The overall dynamic sensitivity was evaluated by coupling the lumped elements from different domains interfering during the microphone function. Dynamic sensitivity was found to be 6.3 μV/Pa when using 100 µm for both gap and vertical offset. In conclusion, a bandwidth of 37.6 Hz to 26.5 kHz has been found which is wider compared to some conventional microphones.
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35

Tian, Lei, Limei Song, Yu Zheng, and Jinhai Wang. "Design and evaluation of magnetic field strength detection devices for millimeter-sized planar square inductors based on a mutual coupling model." Review of Scientific Instruments 93, no. 9 (September 1, 2022): 094102. http://dx.doi.org/10.1063/5.0075990.

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Micro-magnetic stimulation is a research hotspot in the field of neuromodulation. However, it is difficult to measure the weak magnetic field produced by a millimeter-sized inductor. In this study, a mutual inductance model considering different positions and sizes was established for a common planar square spiral coil micro-magnetic stimulator. A physical model was simulated using the Comsol finite element method to verify the accuracy of the mutual inductance model. A weak magnetic field detection system was constructed using the TI AD8130 and NE5532 chips, and the magnetic field strengths of excitation micro-coils sized 3.612 × 3.612 and 5.55 × 5.55 mm2 were measured. The results show that when the size ratio of the detection coil (DC) to the excitation coil (EC) is under a specific ratio (DC:EC = 1:1, 2:1, 1.53:1,2.36:1), the measurement range of the magnetic field strength is in the range 0–3.06 mT with an error of 0.05 mT, and the frequency is in the range 1–120 kHz. The measurement accuracy rate reaches 97.62%. The results of this study have potential application in the measurement of the weak magnetic field.
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36

Sonehara, Makoto, Kenji Ikeda, and Toshiro Sato. "Control of Magnetic Moment in Uniaxial Anisotropy Magnetic Thin Film Taking Leakage Flux in RF Planar Spiral Inductors with Closed-Magnetic Core into Account." IEEJ Transactions on Fundamentals and Materials 132, no. 10 (2012): 822–26. http://dx.doi.org/10.1541/ieejfms.132.822.

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37

Sonehara, Makoto, Kenji Ikeda, and Toshiro Sato. "Control of Magnetic Moment in Uniaxial Anisotropy Magnetic Thin Film Taking Leakage Flux in RF Planar Spiral Inductors with Closed-Magnetic Core into Account." Electrical Engineering in Japan 191, no. 2 (January 5, 2015): 1–6. http://dx.doi.org/10.1002/eej.22693.

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38

Pares, G., J. P. Michel, E. Deschaseaux, V. Pernin, A. Giry, P. Ferris, and A. Serhan. "INDUCTORS USING 2.5D SILICON INTERPOSER WITH THICK RDL AND TSV-LAST TECHNOLOGIES." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000072–77. http://dx.doi.org/10.4071/isom-2017-tp32_061.

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Abstract Silicon interposers represents an interesting alternatives to organic packages for the fabrication of complex System In Package (SIP) modules especially for RF application. Among the advantages of this technology are the capability to fabricate fine-pitch redistribution layers and also to embed high quality passive components inside the interposer. This allows the passive components to be very close to the active chips resulting in highly integrated and high performance systems. To keep the technology at a reasonable cost these last add-on features need to be fabricated with no or minor additional process steps that the ones needed for the fabrication of the interposer itself. In this work we present the design and the fabrication of various design of planar and 3D inductor devices fully compatible with the realization of a silicon interposer that is used to host an RF transmitter system operating in the 0.4 to 1 GHz frequency range. The inductors are built using two thick levels of copper RDL, on both sides of a high resistive silicon substrate and connected by through silicon via-last (TSV-last). This later doesn't require additional metallization to be realized. A dedicated test vehicle was designed to study various inductor types including planar spirals, 3D solenoids and 3D torus. To facilitate the design work, parameterized cells were built for each type of inductors. The structures geometry are designed and optimized, using electromagnetic simulator, to target inductance values in the range of 0.5 to 10 nH while addressing a quality factor greater than 20. The second part of the paper focuses on the process used to build the test vehicle, especially the realization of thick copper RDL layers on both sides of the interposer silicon wafer and the TSV-last module. Physical and DC electrical characterizations are presented to assess the integrity of the individual technology modules like thick copper RDL and TSV. The last part of the work is dedicated to the electrical characterization of the inductor devices in the targeted RF frequency range. Experimental results are presented and discussed in order to give some insight on the impact of the different design parameters on the performances of the inductors.
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39

Kim, Jae-Wook. "Frequency Characteristics of Octagonal Spiral Planar Inductor." Journal of the Korea Academia-Industrial cooperation Society 13, no. 3 (March 31, 2012): 1284–87. http://dx.doi.org/10.5762/kais.2012.13.3.1284.

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40

Pun, A. L. L., T. Yeung, J. Lau, J. R. Clement, and D. K. Su. "Substrate noise coupling through planar spiral inductor." IEEE Journal of Solid-State Circuits 33, no. 6 (June 1998): 877–84. http://dx.doi.org/10.1109/4.678650.

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41

Rabia, Melati, Hamid Azzedine, and Adda Benattia Tekkouk. "Thermal Modeling of a Spiral Planar Inductor." Journal of Low Power Electronics 13, no. 1 (March 1, 2017): 114–21. http://dx.doi.org/10.1166/jolpe.2017.1474.

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42

Kim, Jae-Wook, and Chang-Keun Ryu. "Frequency Characteristics of 2-Layer Spiral Planar Inductor." Journal of the Korea Academia-Industrial cooperation Society 12, no. 9 (September 30, 2011): 4101–6. http://dx.doi.org/10.5762/kais.2011.12.9.4101.

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43

Kim, Jae-Wook. "Study on Frequency Characteristics of Rectangle Spiral Planar Inductor." Journal of the Korea Academia-Industrial cooperation Society 15, no. 4 (April 30, 2014): 2330–34. http://dx.doi.org/10.5762/kais.2014.15.4.2330.

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44

Ahn, C. H., and M. G. Allen. "A planar micromachined spiral inductor for integrated magnetic microactuator applications." Journal of Micromechanics and Microengineering 3, no. 2 (June 1, 1993): 37–44. http://dx.doi.org/10.1088/0960-1317/3/2/001.

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45

Ribas, R. P., J. Lescot, J. L. Leclercq, N. Bennouri, J. M. Karam, and B. Courtois. "Micromachined planar spiral inductor in standard GaAs HEMT MMIC technology." IEEE Electron Device Letters 19, no. 8 (August 1998): 285–87. http://dx.doi.org/10.1109/55.704401.

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46

Telli, A., S. Demir, and M. Askar. "CMOS planar spiral inductor modeling and low noise amplifier design." Microelectronics Journal 37, no. 1 (January 2006): 71–78. http://dx.doi.org/10.1016/j.mejo.2005.06.019.

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47

Zheng, Hong-Xing, and Dao-Yin Yu. "An Efficient Numerical Model for Planar Spiral Inductor On-Chip." International Journal of Infrared and Millimeter Waves 26, no. 9 (August 8, 2005): 1343–53. http://dx.doi.org/10.1007/s10762-005-7608-3.

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48

Kaziz, Sinda, Pietro Romano, Antonino Imburgia, Guido Ala, Halim Sghaier, Denis Flandre, and Fares Tounsi. "PCB-Based Planar Inductive Loops for Partial Discharges Detection in Power Cables." Sensors 23, no. 1 (December 27, 2022): 290. http://dx.doi.org/10.3390/s23010290.

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Partial discharge (PD) diagnosis tests, including detecting, locating, and identifying, are used to trace defects or faults and assess the degree of aging in order to monitor the insulation condition of medium- and high-voltage power cables. In this context, an experimental evaluation of three different printed circuit board (PCB)-based inductive sensor topologies, with spiral, non-spiral, and meander shapes, is performed. The aim is to assess their capabilities for PD detection along a transmission power cable. First, simulation and experimental characterization are carried out to determine the equivalent electrical circuit and the quality factor of the three sensors. PD activity was studied in the lab on a 10-m-long defective MVAC cable. The three PCB-based sensors were tested in three different positions: directly on the defective cable (P1), at a separation distance of 10 cm to 3 m (P2), and on the ground line (P3). For the three positions, all sensors’ outputs present a damped sine wave signal with similar frequencies and durations. Experimental results showed that the best sensitivity was given by the non-spiral inductor, with a peak voltage of around 500 mV in P1, 428 mV in P2, and 45 mV in P3, while the meander sensor had the lowest values, which were approximately 80 mV in P1. The frequency spectrum bandwidth of all sensors was between 10 MHz and 45 MHz. The high sensitivity of the non-spiral inductor could be associated with its interesting properties in terms of quality factor and SFR, which are due to its very low resistivity. To benchmark the performance of the designed three-loop sensors, a comparison with a commercial high-frequency current transformer (HFCT) is also made.
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49

Goñi, Amaya, Javier del Pino, Benito González, Sunil Khemchandani, and Antonio Hernández. "Accurate planar spiral inductor simulations with a 2.5-D electromagnetic simulator." International Journal of RF and Microwave Computer-Aided Engineering 18, no. 3 (2008): 242–49. http://dx.doi.org/10.1002/mmce.20283.

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50

Lee, C. K., and S. Y. R. Hui. "Experimental comparison of traditional and alternating winding method for planar spiral inductor." Electronics Letters 46, no. 3 (2010): 238. http://dx.doi.org/10.1049/el.2010.2760.

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