Relevant bibliographies by topics / Planar spiral inductors

Academic literature on the topic 'Planar spiral inductors'

Author: Grafiati
Published: 10 December 2022
Last updated: 21 February 2023

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Journal articles on the topic "Planar spiral inductors"

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Pacurar, Claudia, Vasile Topa, Adina Giurgiuman, Calin Munteanu, Claudia Constantinescu, Marian Gliga, and Sergiu Andreica. "High Frequency Analysis and Optimization of Planar Spiral Inductors Used in Microelectronic Circuits." Electronics 10, no. 23 (November 23, 2021): 2897. http://dx.doi.org/10.3390/electronics10232897.

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This paper deals with high frequency analysis of spiral inductors, used in microelectronics circuits, to optimize their configuration. Software developed, designed, and implemented by the authors for nano and micrometre spiral inductor high frequency analysis, named ABSIF, is presented in this paper. ABSIF determines the inductance, quality factor, and electrical parameters for square, hexagonal, octagonal, and circular spiral inductors and their configuration optimization for energy efficiency. ABSIF is a good tool for spiral inductor design optimization in high frequency applications and takes into account the imposed technological limits and/or the designers’ constraints. A set of spiral inductors are considered and analysed for high frequency values using ABSIF, and the results are presented in the paper. The validation of ABSIF was completed by comparing the results with those obtained using a similar commercial software, Sonnet LiteTM, which is dedicated to high frequency electromagnetic analysis.
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Muneeswaran, Dhamodaran, Jegadeesan Subramani, Thanapal Pandi, Navaneethan Chenniappan, and Meenatchi Shanmugam. "Modelling of Different On-chip Inductors for Radio Frequency Integrated Circuits." Proceedings of the Bulgarian Academy of Sciences 75, no. 10 (October 30, 2022): 1491–98. http://dx.doi.org/10.7546/crabs.2022.10.12.

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This paper presents a typical frequency-dependent modelling of different on-chip inductors for RFICs design problems. Modern RF circuits often feature on-chip inductors required by modern circuit design. A comparison of different inductor geometrics includes a planar spiral inductor and novel multilayer inductors are analyzed. An electromagnetic model with fewer assumptions than empirical equations and higher efficiency than full-field solvers would be welcome. So would facile comparisons of different inductor structures. This paper describes recent work on the electromagnetic modelling of on-chip inductor structures, applied to the comparison of inductor geometries, including the traditional spiral inductor and a novel multilayer inductor. The electromagnetic modelling of the investigative model is also presented.
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Haddad, Elias, Christian Martin, Charles Joubert, Bruno Allard, Maher Soueidan, Mihai Lazar, Cyril Buttay, and Beatrice Payet-Gervy. "Modeling, Fabrication, and Characterization of Planar Inductors on YIG Substrates." Advanced Materials Research 324 (August 2011): 294–97. http://dx.doi.org/10.4028/www.scientific.net/amr.324.294.

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This paper presents the design, fabrication, and characterization of micro planar inductors on a microwave magnetic material (YIG). Planar spiral inductors were designed for monolithic DC-DC converters in System-In-Package with 100 MHz switching frequency (1 W, Vin= 3.6 V, Vout= 1 V). A microwave magnetic substrate (YIG) serves as mechanical support, and also presents a double purpose by increasing inductance value and reducing electromagnetic interferences (EMI). This last point is critical to improve the behavior of a switching mode power supply (SMPS). In order to obtain an optimal design for the inductor, geometrical parameters were studied using Flux2D simulator and an optimized 30 to 40 nH spiral inductor with expected 25 mΩ RDC, 3 mm2 footprint area was designed. Subsequently, samples have been fabricated by electroplating technique, and tested using a vector network analyzer in the 10 MHz to 100 MHz frequency range. Results were then compared to the predicted response of simulated equivalent model.
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Lopez-Villegas, J. M., N. Vidal, and Jesus A. del Alamo. "Optimized Toroidal Inductors Versus Planar Spiral Inductors in Multilayered Technologies." IEEE Transactions on Microwave Theory and Techniques 65, no. 2 (February 2017): 423–31. http://dx.doi.org/10.1109/tmtt.2016.2645571.

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Marić, Andrea, Goran Radosavljević, Nelu Blaž, Walter Smetana, and Ljiljana Živanov. "Embedded Ferrite LTCC Inductors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, CICMT (September 1, 2012): 000388–93. http://dx.doi.org/10.4071/cicmt-2012-wa48.

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This paper presents for the first time one realization of simple planar inductor realized inside the stack of ferrite LTCC (Low Temperature Co-fired Ceramic) tapes. Presented inductor is one layer square spiral fabricated in the LTCC technology. In order to point out benefits of implementation of ferrite material on inductor inductance, the same inductor geometry was fabricated between two dielectric LTCC tapes. Commercially available LTCC material (both ferrite and dielectric) were implemented for the realization of proposed inductors. Designed structures were characterized and obtained experimental results show that even implementation of a very thin layer of ferrite material around inductor lines drastically increases its inductance. For the same inductor design that occupies the same chip area the inductance enhancement over 11 times is achieved. In addition this enhancement is followed with maintenance of good performance of the inductor.
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Ribas, R. P., J. Lescot, J. L. Leclercq, J. M. Karam, and F. Ndagijimana. "Micromachined microwave planar spiral inductors and transformers." IEEE Transactions on Microwave Theory and Techniques 48, no. 8 (2000): 1326–35. http://dx.doi.org/10.1109/22.859477.

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Zhang, Yaojiang, Erping Li, Haibo Long, and Zhenghe Feng. "Accurate model for micromachined microwave planar spiral inductors." International Journal of RF and Microwave Computer-Aided Engineering 13, no. 3 (May 2003): 229–38. http://dx.doi.org/10.1002/mmce.10077.

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Tounsi, Fares, Mohamed Hadj Said, Margo Hauwaert, Sinda Kaziz, Laurent A. Francis, Jean-Pierre Raskin, and Denis Flandre. "Variation Range of Different Inductor Topologies with Shields for RF and Inductive Sensing Applications." Sensors 22, no. 9 (May 5, 2022): 3514. http://dx.doi.org/10.3390/s22093514.

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In this study, different planar inductor topologies were studied to evaluate their characteristic parameters’ variation range upon approaching Fe- and Cu-based shield plates. The use of such materials can differently alter the electrical properties of planar inductors such as the inductance, resonant frequency, resistance, and quality factor, which could be useful in multiple devices, particularly in inductive sensing and radio-frequency (or RF) applications. To reach an optimal design, five different square topologies, including spiral, tapered, non-spiral, meander, and fractal, were built on a printed circuit board (PCB) and assessed experimentally. At the working frequency of 1 MHz, the results showed a decrease in the inductance value when approaching a Cu-based plate and an increase with Fe-based plates. The higher variation range was noticeable for double-layer topologies, which was about 60% with the Cu-based plate. Beyond an intrinsic deflection frequency, the inductance value began to decrease when approaching the ferromagnetic plate because of the ferromagnetic resonance (FMR). It has been shown that the FMR frequency depends on the inductor topology and is larger for the double-layer spiral one. The Q-factor was decreasing for all topologies but was much faster when using ferromagnetic plates because of the FMR, which intensely increases the track resistance. The resonant frequency was increasing for all double-layer topologies and decreasing for single-layer ones, which was mainly due to the percentage change in the stray capacitance compared to the inductance variation. The concept of varying inductors by metal shielding plates has great potential in a wide range of nondestructive sensing and RF applications.
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Barinov, A. E., and S. A. Zhgoon. "Planar superconducting lumped element bandpass filter with spiral inductors." Superconductor Science and Technology 15, no. 7 (May 22, 2002): 1040–42. http://dx.doi.org/10.1088/0953-2048/15/7/308.

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Barinov, A. E., S. A. Zhgoon, and V. A. Sukhov. "Planar superconducting lumped element bandpass filter with spiral inductors." Physica C: Superconductivity 355, no. 3-4 (June 2001): 257–59. http://dx.doi.org/10.1016/s0921-4534(01)00032-6.

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Dissertations / Theses on the topic "Planar spiral inductors"

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Kavimandan, Mandar Dilip. "Integrated Inductors." Wright State University / OhioLINK, 2008. http://rave.ohiolink.edu/etdc/view?acc_num=wright1229637343.

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Capwell, John. "Characterization and Modeling of Planar Spiral Inductors and Pad Stack Parasitic Effects." [Tampa, Fla.] : University of South Florida, 2003. http://purl.fcla.edu/fcla/etd/SFE0000144.

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Walker, Ross. "Characterisation and integration of materials and processes for planar spiral microinductors with permalloy cores." Thesis, University of Edinburgh, 2016. http://hdl.handle.net/1842/20979.

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The increasing density of electronics within portable electronic devices provides the motivation to develop more compact power electronics, such as DC-DC converters. Typically, integrated circuits and each passive component, such as inductors, are discreetly packaged and mounted on printed circuit board (PCB), to implement the converter. Hence for further size reduction there has been growing interest for integration schemes such as Power supply in package (PwrSiP). However, the ultimate goal is the monolithic integration of the power supply solution, in an integration scheme known as Power Supply on Chip (PwrSoC). The economic effectiveness of the converter will be determined by the device footprint and number of processing steps required to fabricate the inductor. Hence, the motivation behind this thesis is the need for microinductors with large inductance density (inductance per device footprint) while maintaining low losses, which can be integrated with silicon IC. Furthermore, the need for thick layers will result in issues with yield and reliability of the fabricated device. Hence there is a need to identify, characterise and integrate materials with low residual stress into the microinductor fabrication process. A typical choice of inter-coil dielectric is the photo-definable epoxy SU-8. However, SU-8 suffers from intrinsic issues with high residual stress and adhesion. One possible replacement for SU-8 as a structural and dielectric layer is Parylene-C. The first objective of this thesis proposes a test-bed inductor process, which incorporates Parylene as a structural and dielectric layer and has a short turnaround time of one week. This fabrication process involves the filling of high aspect ratio gaps between copper structures with Parylene and subsequent chemical mechanical planarisation, and a test chip has been designed to characterise these processes. Additionally, Scotch-tape testing has been used to confirm suitable Parylene adhesion to patterned and unpatterned films used in this process. Subsequently, complete microinductors, with magnetic cores, have been fabricated, characterised and benchmarked against other inductor technologies and architectures reported in the literature. Parylene is expected to produce films with low residual stress due to its room temperature deposition process. However, the test-bed inductor process requires thermal treatments up to 140°C. Hence it was necessary to characterise the stress in Parylene films as a result of processing temperature and compare this to stress levels in SU-8 5 and 3005 films. This study has determined the spatial variation of residual stress in Parylene-C and SU-8 films, by combining automated measurements of strain indicator test structures and local nanoindentation measurements of Young’s modulus. These measurements have been used to wafer map strain, Young’s modulus, and subsequently residual stress in these films, as a result of processing parameter variation. It is well known that placing ferromagnetic material in close proximity to current carrying coils can further enhance the measured inductance value. However, the conductive magnetic core is also a source of loss for the microinductor. Hence, magnetic permeability, electrical resistivity and mechanical stress in the magnetic core influence the inductance value, eddy current losses and reliability of the fabricated microinductor, respectively. The ability to characterise these properties on wafer is essential for process control and verification measurements. This thesis details a test chip capable of routine measurements on NiFe films to characterise the spatial variation of these properties. Furthermore, wafer mapping measurements are reported to identify the correlation between high frequency permeability, electrical resistivity, mechanical strain and the chemical composition of two-component Permalloy film (NixFe(100-x)) electroplated on the surface of 100mm silicon wafers. Finally, MEMS-based inductor fabrication processes typically require a number of electrodeposition steps, which require conductive seed layers for the deposition of the coils and magnetic core material. A typical choice of seed layer is copper. However, due to copper’s paramagnetic behaviour (μ = 1) and low electrical resistivity (ρ=6.69μΩ.cm) this layer contributes to eddy current losses, while acting as a thin ‘screening layer’. It is very likely that using a magnetic seed layer, within the magnetic core, will noticeably reduce eddy current related losses. However, detailed systematic experimental studies on any such improvement have not been documented in the literature. This study involves compositional, structural, electrical and magnetic characterisation of Ni80Fe20 films electro-deposited on non-magnetic and magnetic seed layers (i.e. copper and nickel respectively). Mechanical strain test structures and X-ray analysis have been used to characterise the stress levels and structural properties of Ni80Fe20 films electro-deposited on both copper and nickel seed layers. In addition, planar spiral micro-inductors, both with and without patterned magnetic cores, have been fabricated to determine the effect of patterning on their performance. This is in addition to quantifying the improvement in the electrical performance resulting from the enhanced magnetic and resistive contribution provided by magnetic seed layers.
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Sindoni, Salvatore. "Ottimizzazione di dispositivi planari con avvolgimenti a spirale per applicazioni di compatibilità elettromagnetica." Doctoral thesis, Università di Catania, 2012. http://hdl.handle.net/10761/1099.

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Il presente lavoro di tesi ha preso spunto dalla necessità di sviluppare metodologie efficienti e precise per valutare correttamente il comportamento di un filtro EMI Planare in modo da effettuarne la progettazione ottimale sfruttando gli effetti parassiti per ottenere un dispositivo di dimensioni quanto più ridotte possibili e con le prestazioni desiderate. È stata proposta una metodologia di calcolo che consente di determinare le caratteristiche del filtro con precisione sufficientemente elevata svincolandosi sia dal calcolo analitico dei parametri, sia dall utilizzo di modelli circuitali a componenti concentrati. In particolare la metodologia proposta utilizza due analisi ad elementi finiti (2D assialsimmetriche) che, opportunamente accoppiate, consentono di calcolare le grandezze elettriche in ingresso e in uscita dal filtro in maniera efficiente e precisa. Inoltre, il codice di calcolo ad elementi finiti è stato abbinato ad un algoritmo di ottimizzazione stocastica, il PSO, che ha consentito di individuare in maniera automatica e con tempi ragionevoli - i parametri geometrici di un filtro, definito ottimo , in grado di fornire la massima attenuazione delle emissioni di modo comune e di modo differenziale. Il filtro, nella sua configurazione ottima, è stato, infine, realizzato ed il suo corretto funzionamento è stato verificato mediante una campagna di misure in laboratorio. Il confronto tra i dati ottenuti sperimentalmente e quelli calcolati con le simulazioni ha fornito una corrispondenza soddisfacente dimostrando la validità del metodo proposto.
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Tokgoz, Korkut Kaan. "Broadband Phase Shifter Realization With Surface Micromachined Lumped Components." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614652/index.pdf.

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Phase Shifters are one of the most important building cells of the applications in microwave and millimeter-wave range, especially for communications and radar applications
to steer the main beam for electronic scanning. This thesis includes all of the stages starting from the theoretical design stage to the measurements of the phase shifters. In detail, all-pass network phase shifter configuration is used to achieve broadband and ultra wide-band differential phase characteristics. For these reasons, 1 to 2 GHz, 2 to 4 GHz, and 3 to 6 GHz 4-bit, 22.5°
phase resolution phase shifter realization with surface micromachined lumped components are designed, simulated, fabricated and measured. Basic building blocks of the phase shifters, i.e., surface micromachined lumped components, square planar spiral inductors and Metal-Insulator-Metal capacitors are designed with EM simulation and lumped equivalent model extractions. The validation of the designed square planar spiral inductors is done with fabrication and measurement steps, very low error, below 1%, between the designs and fabricated samples are observed. Using this knowledge on lumped elements finally phase shifters are designed with surface micromachined lumped components, fabricated using an in house technology provided by METU-MEMS facilities, RF MEMS group. Low phase rms error, good return and insertion loss considerations are aimed, and achieved. In addition to the main work of this thesis, a generalized theoretical calculation method for 2n-1 number of stages all-pass network phase shifters is presented for the first time in literature. A different, new, broadband, and combined phase shifter topology using two-stage all-pass filters is presented. Moreover, the implementation of this idea is proved to be practical to 3 to 6 GHz 5.625°
and 11.25°
combined phase shifter. A new approach for stage numbers other than power of 2 is indicated, which is different from what is already presented in the literature. An example practical implementation results are provided for the three-stage 4-bit 1 to 6 GHz phase shifter. Also, a small improvement in SRF of the high inductance valued inductors is achieved with the mitering of the corners of square planar spiral inductors. Comparison of the measured data between the normal inductors and mitered versions shows that the first SRF of the inductors are increased about 80 MHz, and second SRF of the inductors are increased about 200 MHz.
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Korkmaz, Hakan. "Hmic Miniaturization Techniques And Application On An Fmcw Range Sensor Transceiver." Master's thesis, METU, 2010. http://etd.lib.metu.edu.tr/upload/12611813/index.pdf.

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This thesis includes the study of hybrid microwave integrated circuits (HMIC), miniaturization techniques applied on HMICs and its application on a frequency modulated continuous wave (FMCW) range sensor transceiver. In the scope of study, hybrid and monolithic microwave integrated circuits (HMIC and MMIC) are introduced, advantages and disadvantages of these two types are discussed. Large size of HMICs is the main disadvantage especially for military and civil applications requiring miniature volumes. This thesis is mainly devoted on miniaturization work of HMICs in order to cope with this problem. In this scope, miniaturization techniques of some HMICs such as 3 dB hybrid couplers and stubs are examined and analyzed. Their simulation and measurement results cohere with original circuit results. Nevertheless, considerable size reduction up to 80% is achieved. Moreover, planar interdigital capacitors (IDC), spiral inductors (SI) and their equivalent circuit models are introduced. Design technique is discussed with illustrative electromagnetic (EM) simulations. Furthermore, FMCW radar is introduced with its basic operation principles, brief history and usage areas. In addition, FMCW range sensor transceiver is designed with its sub&
#8208
parts
power amplifier, low noise amplifier (LNA), coupler and front end. Multi technology based on chip transistors, interdigital capacitors, spiral inductors and hybrid couplers with wire&
#8208
bond connections is used in the design. As the result of using hybrid miniaturized components small layout size is achieved for the transceiver system with its all components.
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Temocin, Engin Ufuk. "Design And Implementation Of Microwave Lumped Components And System Integration Using Mems Technology." Master's thesis, METU, 2006. http://etd.lib.metu.edu.tr/upload/2/12607519/index.pdf.

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This thesis presents the design and fabrication of coplanar waveguide to microstrip transitions and planar spiral inductors, and the design of metal-insulator-metal capacitors, a planar band-pass, and a low-pass filter structures as an application for the inductors and capacitors using the RF MEMS technology. This thesis also includes a packaging method for RF MEMS devices with the use of benzocyclobutene as bonding material. The transition structures are formed by four different methods between coplanar waveguide end and microstrip end, and they are analyzed in 1-20 GHz. Very low loss transitions are obtained by maintaining constant characteristic impedance which is the same as the port impedance through the transition structures. The planar inductors are formed by square microstrip spirals on a glass substrate. Using the self-inductance propery of a conductive strip and the mutual inductance between two conductor strips in a proper arrangement, the inductance value of each structure is defined. Inductors from 0.7 nH up to 20 nH have been designed and fabricated. The metal-insulator-metal capacitors are formed by two coplanar waveguide structures. In the intersection, one end of a coplanar waveguide is placed on top of the end of the other coplanar waveguide with a dielectric layer in between. Using the theory of parallel plate capacitors, the capacitance of each structure is adjusted by the dimensions of the coplanar waveguides, which obviously adjust the area of intersection. Capacitors from 0.3 pF up to 9.8 pF have been designed. A low-pass filter and a band-pass filter are designed using the capacitors and inductors developed in this thesis. In addition to lumped elements, the interconnecting transmission lines, junctions and input-output lines are added to filter topologies. The RF MEMS packaging is realized on a coplanar waveguide structure which stands on a silicon wafer and encapsulated by a silicon wafer. The capping chip stands on the BCB outer ring which promotes adhesion and provides semi hermeticity. Keywords: Transition between transmission lines, planar spiral inductor, metal-insulator-metal capacitor, RF MEMS packaging, surface micromachining.
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Shih, Chun-Yang, and 施俊仰. "A Research of Symmetric Planar Spiral Inductors." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/75427554283107016922.

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碩士
國立交通大學
電信工程系
91
The thesis focuses on the simulations of spiral inductors on silicon of modern IC’s technology. The shape of inductors is not the same as usual, but it is symmetric ones. What should be known before simulating inductors is presented. The equivalent circuit model of spiral inductors is discussed. On the side, the relations between the structure parameters and the performance of inductors, as well as the substrate noise phenomenon are investigated on the last of the paper.
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曾嵩弼. "Study of Planar Spiral Inductors on Ultra-Thin SOI Substrate." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/c9xq6n.

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碩士
國立清華大學
電子工程研究所
92
On-chip spiral inductor is one important component of RFIC, and suffers from low quality factor which is a figure of merit for performance comparison. There are many factors that affect the quality factor of spiral inductor, and one of the critical factors is the substrate effects. Consequently, understanding the behavior of on-ship spiral inductors on PD (partially depleted) SOI is a necessary step before designing a SOI RFIC. Four design parameters of spiral inductors and four different substrates were studied in this research by adopting a statistical method – Design of Experiment (DOE). Number of turns has most significant effect on the performance of an inductor, and is followed by inner diameter, spacing, and width. Inductor on high resistive wafer has better performance than it on low resistive wafer because the currents induced in the substrate are reduced. The impact of SOI wafers is minor to the performance of an inductor because small displacement current and small eddy current are induced in the thin silicon layer. High resistive SOI wafer will provide better performance for planar spiral inductors, and it is also IC compatible. By applying Taguchi method, maximum quality factor at 2.4GHz was predicted and verified to be 14.2, but the maximum quality factor over 0.1GHz to 20.1GHz is not as expected.
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Lutz, Richard D. "Analysis and modeling of planar microstrip spiral inductors on lossy substrates." Thesis, 1998. http://hdl.handle.net/1957/33613.

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The advent of low-cost RFIC's fabricated in Silicon-based technologies has led to the use of monolithic lumped elements which are located on-die. While it is clearly advantageous to have a high degree of integration and thus fewer off chip elements, parasitic losses due to semiconducting substrate effects can be a performance-limiting factor. Microstrip spiral inductors are key components in many high frequency circuit designs, including MMIC's, RFIC's, and mixed-signal modules. However, the losses associated with spirals fabricated in a lossy substrate environment, such as in CMOS and bipolar technologies, are not accurately modeled by the current conventional techniques. This thesis presents a complete modeling technique for spiral inductors over such 'high-loss' substrates. The quasi-static solution for single and coupled Metal-Insulator-Substrate (MIS) microstrip structures has led to the development of methods for calculating the self and mutual line parameters r, l, g, and c, which are in turn utilized in the model for the microstrip spiral inductors in the same environment. The equivalent circuit model for the spiral inductors is based on the conventional low-loss spiral models with the inclusion of frequency-dependent losses due to semiconducting substrates. The distributed model for spirals in CMOS-based RFICs incorporates inductance calculations by the Partial Element Equivalent Circuit (PEEC) method, augmented by inductance and resistance calculations for the so-called skin effect mode by the spectral domain technique. In addition, the capacitances and shunt conductances can be computed by a Poisson solver for layered lossy media; both network analog and spectral domain methods are also used to find the shunt admittance per unit length for the microstrip structure as a fundamental element of the spiral. Simulations for typical structures have been performed to validate the modeling techniques via comparison with a commercial simulator and network analyzer measurements for a 9.5 turn spiral in CMOS for RFIC applications.
Graduation date: 1999
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Books on the topic "Planar spiral inductors"

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Banerjee, Amal. Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-08778-3.

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Lutz, Richard D. Analysis and modeling of planar microstrip spiral inductors on lossy substrates. 1998.

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Banerjee, Amal. Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers: SPICE-Based Design and Performance Evaluation for Wireless Communications. Springer International Publishing AG, 2022.

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Book chapters on the topic "Planar spiral inductors"

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Banerjee, Amal. "SPICE Based Design and Analysis of Planar Spiral Inductors and Embedded|Integrated Planar Spiral Inductor Transformers and Planar Antennas." In Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers, 89–185. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-08778-3_3.

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Banerjee, Amal. "Fundamental Physics of Planar Inductors, Embedded Planar Transformers, and Planar (Patch) Antennas." In Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers, 9–88. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-08778-3_2.

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Banerjee, Amal. "Introduction and Problem Statement." In Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers, 1–8. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-08778-3_1.

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"Substrate Noise Coupling through Planar Spiral Inductor." In Phase-Locking in High-Performance Systems. IEEE, 2009. http://dx.doi.org/10.1109/9780470545492.ch15.

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Conference papers on the topic "Planar spiral inductors"

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Ammouri, Aymen, Hamed Belloumi, Tarek Ben Salah, and Ferid Kourda. "Experimental analysis of planar spiral inductors." In 2014 International Conference on Electrical Sciences and Technologies in Maghreb (CISTEM). IEEE, 2014. http://dx.doi.org/10.1109/cistem.2014.7076937.

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Vanek, Jan, Ivan Szendiuch, and Jiri Hladik. "Optimization of Properties of Planar Spiral Inductors." In 2007 30th International Spring Seminar on Electronics Technology. IEEE, 2007. http://dx.doi.org/10.1109/isse.2007.4432854.

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Issakov, V., A. Thiede, M. Wojnowski, K. Buyuktas, and W. Simburger. "Fast analytical parameters fitting of planar spiral inductors." In 2008 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS). IEEE, 2008. http://dx.doi.org/10.1109/comcas.2008.4562827.

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Ribas, Renato P., Jerome Lescot, Jean Louis Leclercq, and Bernard Courtois. "Thermal and mechanical evaluation of micromachined planar spiral inductors." In Design, Test, Integration, and Packaging of MEMS/MOEMS 2001, edited by Bernard Courtois, Jean Michel Karam, Steven P. Levitan, Karen W. Markus, Andrew A. O. Tay, and James A. Walker. SPIE, 2001. http://dx.doi.org/10.1117/12.425369.

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Pacurar, Claudia, Vasile Topa, Adina Racasan, and Calin Munteanu. "Inductance calculation and layout optimization for planar spiral inductors." In 2012 13th International Conference on Optimization of Electrical and Electronic Equipment (OPTIM). IEEE, 2012. http://dx.doi.org/10.1109/optim.2012.6231846.

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Zolog, Monica, Dan Pitica, and Ovidiu Pop. "Characterization of Spiral Planar Inductors Built on Printed Circuit Boards." In 2007 30th International Spring Seminar on Electronics Technology. IEEE, 2007. http://dx.doi.org/10.1109/isse.2007.4432869.

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Zhong, Lin, Lingling Sun, Jun Liu, and Huang Wang. "Scalable modeling based on fill ratio for planar spiral inductors." In 2011 International Symposium on Integrated Circuits (ISIC). IEEE, 2011. http://dx.doi.org/10.1109/isicir.2011.6131987.

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Pacurar, Claudia, Vasile Topa, Adina Giurgiuman, Calin Munteanu, Claudia Constantinescu, Marian Gliga, and Sergiu Andreica. "The Construction of a Wireless Power Supply System using Planar Spiral Inductors." In 2019 8th International Conference on Modern Power Systems (MPS). IEEE, 2019. http://dx.doi.org/10.1109/mps.2019.8759779.

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V, Raghunadh M., and Abhay Narasimha K. S. "Geometry Optimization of Planar Spiral Inductors operating at 5G mid-band frequencies." In 2020 IEEE International Conference for Innovation in Technology (INOCON). IEEE, 2020. http://dx.doi.org/10.1109/inocon50539.2020.9298443.

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Caratelli, D., R. Cicchetti, and A. Faraone. "Circuital and electromagnetic performances of planar microstrip spiral inductors for wireless applications." In 2006 IEEE Antennas and Propagation Society International Symposium. IEEE, 2006. http://dx.doi.org/10.1109/aps.2006.1710658.

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