Log in

Relevant bibliographies by topics / Place-bonding / Journal articles

Journal articles on the topic 'Place-bonding'

To see the other types of publications on this topic, follow the link: Place-bonding.

Author: Grafiati

Published: 4 June 2021

Last updated: 12 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 50 journal articles for your research on the topic 'Place-bonding.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Nielsen-Pincus, Max, Troy Hall, Jo Ellen Force, and J. D. Wulfhorst. "Sociodemographic effects on place bonding." Journal of Environmental Psychology 30, no. 4 (December 2010): 443–54. http://dx.doi.org/10.1016/j.jenvp.2010.01.007.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Qingjiu, Sun, and Nor Zarifah Maliki. "Place Attachment and Place Identity: Undergraduate Students’ Place Bonding on Campus." Procedia - Social and Behavioral Sciences 91 (October 2013): 632–39. http://dx.doi.org/10.1016/j.sbspro.2013.08.463.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Lewicka, Maria. "Place inherited or place discovered? Agency and communion in people-place bonding." Estudios de Psicología 34, no. 3 (January 2013): 261–74. http://dx.doi.org/10.1174/021093913808295154.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Cheng, Chia-Kuen, and Huei-Yu Kuo. "Bonding to a new place never visited: Exploring the relationship between landscape elements and place bonding." Tourism Management 46 (February 2015): 546–60. http://dx.doi.org/10.1016/j.tourman.2014.08.006.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Kyle, Gerard T., Jinhee Jun, and James D. Absher. "Repositioning Identity in Conceptualizations of Human–Place Bonding." Environment and Behavior 46, no. 8 (May 31, 2013): 1018–43. http://dx.doi.org/10.1177/0013916513488783.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Dunbar, Helena. "P-72 ‘Place bonding’ in children’s hospice care." BMJ Supportive & Palliative Care 7, Suppl 1 (March 2017): A27.2—A27. http://dx.doi.org/10.1136/bmjspcare-2017-00133.72.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Hammitt, William E., Erik A. Backlund, and Robert D. Bixler. "Place Bonding for Recreation Places: Conceptual and Empirical Development." Leisure Studies 25, no. 1 (January 2006): 17–41. http://dx.doi.org/10.1080/02614360500098100.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Dunbar, Helena, Bernie Carter, and Jayne Brown. "‘Place bonding’ in children’s hospice care: a qualitative study." BMJ Supportive & Palliative Care 10, no. 3 (August 14, 2018): e25-e25. http://dx.doi.org/10.1136/bmjspcare-2018-001543.

Full text

Abstract:

BackgroundLimited knowledge exists of parents’ perceptions and experiences of children’s hospices and how these contribute to the varied access and uptake of services.AimThis study aimed to explore parents’ perspectives and experiences of a hospice, to understand the barriers and/or facilitators to accessing a hospice, and what characteristics parents wanted from hospice provision.MethodsA two-phase qualitative study underpinned by a constructivist grounded theory methodology was employed. Phase 1 used focus groups to collect data from parents of children already accessing the hospice (n=24). Phase 2 used in-depth semistructured interviews with parents of children who did not use the hospice (n=7) and with parents who had previous experience of using a hospice (n=7).ResultsA grounded theory of place bonding was developed which illustrates the cognitive journey taken by parents of children with life-limiting conditions considering/receiving hospice care for their child.ConclusionsFinding a place where they belonged and felt at ‘home’ made the decision to accept help in caring for their child with a life-limiting condition more acceptable. The theory of place bonding offers children’s hospices a new perspective from which to view how parents access, accept and build relationships at the hospice.

APA, Harvard, Vancouver, ISO, and other styles

9

Hammitt, William E., Gerard T. Kyle, and Chi-Ok Oh. "Comparison of Place Bonding Models in Recreation Resource Management." Journal of Leisure Research 41, no. 1 (March 2009): 57–72. http://dx.doi.org/10.1080/00222216.2009.11950159.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Zhu, Z. H., Y. C. Zhou, D. Crouse, and Y. H. Lo. "Pick-and-place multi-wafer bonding for optoelectronic integration." Electronics Letters 34, no. 12 (1998): 1256. http://dx.doi.org/10.1049/el:19980889.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

AJAYI, Omolola O., and Tembi M. TICHAAWA. "EXPLORING THE RELATIONSHIPS BETWEEN SATISFACTION, PLACE ATTACHMENT AND LOYALTY IN NIGERIAN ZOOS." GeoJournal of Tourism and Geosites 37, no. 3 (September 30, 2021): 861–72. http://dx.doi.org/10.30892/gtg.37317-719.

Full text

Abstract:

Surveys exploring satisfaction, place attachment and loyalty in a zoo context are scarce despite the prevalence of such studies vis a vis other tourism destinations, and their valued importance in understanding travel behaviour and contributions to destinations’ success. This study explores the relationships between visitors’ satisfaction, place attachment (place identity, place dependence, place affect and place social bonding) and loyalty in one of Nigeria’s prominent zoos. This study adoped a qunatitative research approach, with data obtained from a sample of 395 visitors through a structured questionnaire. Using structural equation modeling, we found that the most important causal factor of loyalty is satisfaction, either directly or indirectly through some dimensions of place attachment. In addition, it was revealed that place social bonding can act as either a predictor or an outcome of visitors’ satisfaction. Satisfaction was found to be a significant and positive mediator between place attachment (place identity and place social bonding) while place attachment was found not to mediate the relationship between satisfaction and loyalty. The findings were discussed and practical applications were drawn, particularly aimed at optimizing and providing satisfying experiences which enhances place attachment as well as loyalty.

APA, Harvard, Vancouver, ISO, and other styles

12

Astuti, Susy Budi Budi, Lisani Husna, and Elvira Pramesvari. "Place Bonding on Campus Interior Design ITS: Attachment and Identity." Jurnal Desain Interior 4, no. 1 (June 20, 2019): 61. http://dx.doi.org/10.12962/j12345678.v4i1.5283.

Full text

APA, Harvard, Vancouver, ISO, and other styles

13

Cohen, G. M., P. M. Mooney, V. K. Paruchuri, and H. J. Hovel. "Dislocation-free strained silicon-on-silicon by in-place bonding." Applied Physics Letters 86, no. 25 (June 20, 2005): 251902. http://dx.doi.org/10.1063/1.1949284.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

Cheng, Chia-Kuen, and Shu-Farn Chou. "The Influence of Place Change on Place Bonding: A Longitudinal Panel Study of Renovated Park Users." Leisure Sciences 37, no. 5 (May 19, 2015): 391–414. http://dx.doi.org/10.1080/01490400.2015.1021883.

Full text

APA, Harvard, Vancouver, ISO, and other styles

15

Al-Emran, Sulaiman, and Rakan Barakati. "A Method for Stabilizing a Lingual Fixed Retainer in Place Prior to Bonding." Journal of Contemporary Dental Practice 8, no. 7 (2007): 108–13. http://dx.doi.org/10.5005/jcdp-8-7-108.

Full text

Abstract:

Abstract Aim The objective of this article is to present a simple technique for stabilizing a lingual fixed retainer wire in place with good adaptation to the teeth surfaces and checking for occlusal interferences prior to the bonding procedure. Background Bonding of an upper or lower fixed lingual retainer using stainless steel wires of different sizes and shapes is a common orthodontic procedure. The retainer can be constructed in a dental laboratory, made at chair side, or it can be purchased in prefabricated form. All three ways of creating a fixed retainer are acceptable. However, the method of holding the retainer wire in place adjacent to the lingual surfaces of the teeth before proceeding with the bonding process remains a problem for some practitioners. Report The lingual fixed retainer was fabricated using three pieces of .010” steel ligature wire which were twisted into a single strand wire. Another four to five 0.010” pieces of steel ligature wires were twisted in the same way to serve as an anchor wire from the labial side of the teeth. The retainer wire was bonded using the foible composite. Summary The technique presented here for stabilizing the retainer wire prior to bonding provides good stabilization, adaptation, and proper positioning of the retainer wire while eliminating contamination of etched surfaces which might arise during wire positioning before bonding. This technique also allows the clinician the opportunity to check the occlusion and adjust the retainer wire to avoid occlusal interference prior to bonding maxillary retainers. This same clinical strategy can be used to stabilize wires for splinting periodontally affected teeth and traumatized teeth. Citation Al-Emran S, Barakati R. A Method for Stabilizing a Lingual Fixed Retainer in Place Prior to Bonding. J Contemp Dent Pract 2007 November; (8)7:108-113.

APA, Harvard, Vancouver, ISO, and other styles

16

Dunbar, Helena, Bernie Carter, and Jayne Brown. "Coming ‘Home’: Place bonding for parents accessing or considering hospice based respite." Health & Place 57 (May 2019): 101–6. http://dx.doi.org/10.1016/j.healthplace.2019.03.004.

Full text

APA, Harvard, Vancouver, ISO, and other styles

17

Liu, Peng, Jian Ping Jiang, and Bai Lian Sun. "Interface and Bonding Strength of Explosively Welded T2/DT4C Laminate." Advanced Materials Research 785-786 (September 2013): 1051–54. http://dx.doi.org/10.4028/www.scientific.net/amr.785-786.1051.

Full text

Abstract:

T2 red copper plate and DT4C electrical pure iron plate were cladded by explosive welding. Microcosmic analysis and bonding strength of the bonding interface were also studied. Results indicate that the welded zone appears periodical wavy metallurgical interface and obvious element diffusion occurs in the interfacial zone. In addition, no separation happens after the bonding strength test and tension-shear test and the broken zone takes place in the T2 red copper part of the samples, indicating that the bonding strength of the welded interface can get no less than the strength of T2 red copper.

APA, Harvard, Vancouver, ISO, and other styles

18

Saha, Indranil, Sarat Kanrar, Kaushik Gupta, Bibhutibhushan Show, Debabrata Nandi, Krishna Biswas, Biswaranjan Manna, Debashis Chatterjee, and Uday Chand Ghosh. "Tuned synthesis and characterizational insight into β-cyclodextrin amended hydrous iron-zirconium hybrid oxide: a promising scavenger of fluoride in aqueous solution." RSC Advances 6, no. 96 (2016): 93842–54. http://dx.doi.org/10.1039/c6ra16567b.

Full text

APA, Harvard, Vancouver, ISO, and other styles

19

Stankovic, Danica. "Space in the function of psychological stability of a child." Facta universitatis - series: Architecture and Civil Engineering 6, no. 2 (2008): 229–33. http://dx.doi.org/10.2298/fuace0802229s.

Full text

Abstract:

The problem researched in this paper concerns establishing specific relations in child-space relationship. The concepts of child-space relation are here presented and defined in architectural context as: concept of 'awareness' of a specific place, concept of child's bonding to some place in space, identification with and a feeling of belonging to a certain place, and then the phenomenon of a favorite place.

APA, Harvard, Vancouver, ISO, and other styles

20

Crockett, William G. "Critical Barriers Associated with Copper Wire." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000394–98. http://dx.doi.org/10.4071/isom-2015-wp31.

Full text

Abstract:

Since around 2008, the shift from Gold (Au) bonding wire to Copper (Cu) bonding wire has been taking place, full scale, with the aim of reducing costs. When compared with Au, Cu wire presents challenges in reliability and repeatable bonding characteristics in terms of chemical stability, which is required in high reliability applications. Therefore Cu wire adoption in automotive and industrial semiconductors has been limited. Conventionally the market for Cu bonding wires has been divided into two types: bare Cu wires (high purity) and Palladium coated copper (PCC) bonding wires. These wires have yet to satisfy the required characteristics for high reliability products such as industrial and automotive electronics. A new breed of alternative bonding wires has been developed to offer performance advantages for high reliability applications compared to bare copper wire and PCC wire. Cu alloy wire and Ag alloy wires continue their market introduction for advanced bonding applications, where bare Cu and PCC wires have known limitations.

APA, Harvard, Vancouver, ISO, and other styles

21

Charles, Sarah J., Valerie van Mulukom, Jennifer E. Brown, Fraser Watts, Robin I. M. Dunbar, and Miguel Farias. "United on Sunday: The effects of secular rituals on social bonding and affect." PLOS ONE 16, no. 1 (January 27, 2021): e0242546. http://dx.doi.org/10.1371/journal.pone.0242546.

Full text

Abstract:

Religious rituals are associated with health benefits, potentially produced via social bonding. It is unknown whether secular rituals similarly increase social bonding. We conducted a field study with individuals who celebrate secular rituals at Sunday Assemblies and compared them with participants attending Christian rituals. We assessed levels of social bonding and affect before and after the rituals. Results showed the increase in social bonding taking place in secular rituals is comparable to religious rituals. We also found that both sets of rituals increased positive affect and decreased negative affect, and that the change in positive affect predicted the change in social bonding observed. Together these results suggest that secular rituals might play a similar role to religious ones in fostering feelings of social connection and boosting positive affect.

APA, Harvard, Vancouver, ISO, and other styles

22

Owen, D. L., D. Lackner, O. J. Pitts, S. P. Watkins, and P. M. Mooney. "In-place bonding of GaAs/InGaAs/GaAs heterostructures to GaAs (0 0 1)." Semiconductor Science and Technology 24, no. 3 (February 16, 2009): 035011. http://dx.doi.org/10.1088/0268-1242/24/3/035011.

Full text

APA, Harvard, Vancouver, ISO, and other styles

23

Peng, Wei Dong, and Zhi Wei Wu. "Static Stiffness Analysis for the Parallel Bonding Mechanism of IC Chip Die." Advanced Materials Research 490-495 (March 2012): 3531–35. http://dx.doi.org/10.4028/www.scientific.net/amr.490-495.3531.

Full text

Abstract:

Based on the parallel bonding mechanism of IC chip die designed, the static stiffness model is established. Static stiffness characteristic curves are drawn in whole working place through Matlab software, the infection which created by the left/right driving parts and connecting rods are analyzed. It proves that the parallel bonding mechanism designed meets the working requirements of IC chip die by these characteristic curves.

APA, Harvard, Vancouver, ISO, and other styles

24

Zhou, Mingyong, Xiang Xiong, Dietmar Drummer, and Bingyan Jiang. "Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip." Polymers 11, no. 3 (March 24, 2019): 557. http://dx.doi.org/10.3390/polym11030557.

Full text

Abstract:

Thermal bonding technology is the most commonly used approach in bonding injection-molded microfluidic chips. Although the bonding mechanism is still under debate, the molecular dynamics (MD) method can provide insight into the bonding process on a macromolecular level. In this study, MD simulations for thermal bonding of PMMA substrate and cover sheet were performed. The molecule configuration and density distribution during the thermal bonding process were studied. The effects of bonding pressure on the equivalent strain, joining energy and diffusion coefficient were investigated. The debonding process was simulated to analyze the bonding strength and failure mechanism. Simulation results show that penetration mainly takes place near the interface area. Although the final density increases slightly with increasing pressure, the bonding interface is still insufficiently filled. The equivalent strain grows faster than that in the later stage because of the gap at the interface. The bonding pressure shows clear effects on the joining energy, diffusion coefficient and stress–strain behavior. Tensile failure occurs at the interface, with PMMA chains stretched between two layers. The majority of the change in potential energy is correlated with the change in non-bonded energy. At yield strain, the low-density defect at the interface weakens the tensile strength of bonded chip.

APA, Harvard, Vancouver, ISO, and other styles

25

Müller, M., and P. Valášek. "Degradation medium of agrocomplex – adhesive bonded joints interaction." Research in Agricultural Engineering 58, No. 3 (August 16, 2012): 83–91. http://dx.doi.org/10.17221/27/2011-rae.

Full text

Abstract:

Research of degradation medium occurring in agrocomplex at the current interaction with bonded joints strength and lifetime is desired owing to the possibilities of bonding applications in this dynamically developing field. The bonding technology is used in construction of machines, lines and devices of agriculture, forestry and food industry. Among the perspectives of bonding technologies the adhesive bonding can be considered thanks to its predominant pluses. At the bonding technology or more precisely adhesive bonding technology application the limits must be characterized, which occur in the process of application in the concrete medium. On the basis of characteristics and analyses the countermeasures eliminating the negative factors can be taken. Published results set themselves the goal to know degradation processes taking place in bonded joints contemporarily with taking account of adhesive/adherend interaction with accent on application in agriculture. Experimentally found results confirm the presumption of a significant portion of the adhesive layer on the adhesive bond strength decrease in the practice due to the degradation processes.

APA, Harvard, Vancouver, ISO, and other styles

26

Qiu, Jianjian, Yihua Liu, Shi Xian, Longjian Song, and Xiaolin Ru. "‘Plural Reciprocity’ vs. ‘Acquaintance Society’: Place Attachment and Residential Satisfaction under Development-Induced Resettlement Differences in Guangzhou, China." Sustainability 12, no. 16 (August 10, 2020): 6444. http://dx.doi.org/10.3390/su12166444.

Full text

Abstract:

In the context of urban expansion and regeneration, development-induced resettlement has had inevitable impacts on place attachment and residential satisfaction of residents. However, insufficient attention has been paid to the social-psychological performances of both attachment and satisfaction, and the possible influences of the former on the latter. Such deficiency also emerges when considering different resettlement patterns in peripheral urban China. This study conducted a semi-structural survey on two neighborhoods affected by the construction of Higher Mega Education Center (HEMC) in Guangzhou with different resettlement patterns. Based on multidimensional measurement, residents in relocated subsidized housing expressed higher attachment and satisfaction through the remaining social bonding as ‘acquaintance society’ than those in in-situ urban villages relying on self-identified clan-kinship and stable reciprocity. Hukou status is found to be fundamental in building attachment and life fulfillment, especially for the urban villages with plural population structure. Significances are found in the impacts of place dependence, social bonding and place identification on residential satisfaction in in-situ neighborhoods while only social bonding was found to be significant in the relocated ‘enclave’ one. However, deeper integration with affective connections are insufficient for both. The findings generally indicate that positive outcomes are also achieved for self-regeneration after resettlement.

APA, Harvard, Vancouver, ISO, and other styles

27

Akhtar, Faheem Nake, Abdullah Jan, Sana Tariq, Mehwish Khan, and Munazza Saeed. "COMPARISON OF CLINICAL FAILURES OF LINGUAL RETAINERS BONDED WITH PRIMERLESS FLOWABLE ADHESIVES VERSUS CONVENTIONAL BONDING ADHESIVES." PAFMJ 71, no. 2 (April 30, 2021): 681–85. http://dx.doi.org/10.51253/pafmj.v71i2.3575.

Full text

Abstract:

Objective: To compare the frequency of clinical failure of lingual retainers bonded with primerless flowable adhesives and conventional bonding adhesives. Study Design: Quasi experimental study. Place and Duration of Study: Department of Orthodontics, Armed Forces Institute of Dentistry Rawalpindi, from Jul 2017 to Jun 2018. Methodology: As per selection criteria, 76 patients were selected by non-probability consecutive sampling technique. Patients were divided into two groups: the conventional bonding adhesive and the primerless flowable adhesive group with 38 patients in each group. Retainers were bonded using standardized procedure with conventional bonding adhesive in one group and primerless flowable adhesive for bonding in the other group. After bonding of retainers, patients were recalled after 3 months and any bonding failures were recorded. Results: Failure rate with conventional bonding adhesive was 10.5% while on the other hand, failure with primerless flowable adhesive was 31.6% with a p-value of 0.047 which showed a statistically significant difference. Conclusion: There was a statistically significant difference of clinical failure rate of lingual retainers bonded with conventional bonding adhesive versus primerless flowable adhesive with greater failure rate of the primerless flowable adhesive.

APA, Harvard, Vancouver, ISO, and other styles

28

Holmes, Marcus, and Nicholas J. Wheeler. "Social bonding in diplomacy." International Theory 12, no. 1 (November 13, 2019): 133–61. http://dx.doi.org/10.1017/s1752971919000162.

Full text

Abstract:

AbstractIt is widely recognized among state leaders and diplomats that personal relations play an important role in international politics. Recent work at the intersection of psychology, neuroscience, and sociology has highlighted the critical importance of face-to-face interactions in generating intention understanding and building trust. Yet, a key question remains as to why some leaders are able to ‘hit it off,’ generating a positive social bond, while other interactions ‘fall flat,’ or worse, are mired in negativity. To answer, we turn to micro-sociology – the study of everyday human interactions at the smallest scales – an approach that has theorized this question in other domains. Drawing directly from US sociologist Randall Collins, and related empirical studies on the determinants of social bonding, we develop a model of diplomatic social bonding that privileges interaction elements rather than the dispositional characteristics of the actors involved or the material environment in which the interaction takes place. We conclude with a discussion of how the study of interpersonal dyadic bonding interaction may move forward.

APA, Harvard, Vancouver, ISO, and other styles

29

Han, Wen Bo, D. Z. Wu, Guo Feng Wang, and M. J. Tong. "Superplastic Forming and Diffusion Bonding for Four-Layer Sheets Structure of Nickel-Base Superalloy." Materials Science Forum 551-552 (July 2007): 163–68. http://dx.doi.org/10.4028/www.scientific.net/msf.551-552.163.

Full text

Abstract:

The superplastic forming and diffusion bonding (SPF/DB) is applied in aviation and space flight field. The SPF/DB process with gas pressure control for dissimilar superalloy structure was studied. Diffusion bonding parameters, including bonding temperature T, pressure P, time t, affect the joining mechanism. When the bonded specimen with 50&m thick nickel foil interlayer was tensile at room temperature, shear fracture of the joints with nickel foil interlayer takes place at the GH4141 superalloy part. The SPF/DB of four-layer sheets structure was investigated. The optimum parameters for the SPF/DB process are: forming temperature T=1243K, forming pressure P=1MPa, forming time t=35min. The microstructure of the bonded samples was characterized. The microstructure shows an excellent bonding at the interfaces. The distribution of thickness after SPF/DB was investigated.

APA, Harvard, Vancouver, ISO, and other styles

30

Choi, S. T., Jun Yeob Song, Jae Hyun Kim, S. Lee, and Y. Y. Earmme. "Strength Design and Minimization of Residual Stresses in Reversible GaAs Wafer Bonding Process." Key Engineering Materials 306-308 (March 2006): 1337–42. http://dx.doi.org/10.4028/www.scientific.net/kem.306-308.1337.

Full text

Abstract:

The GaAs wafer bonding process is investigated to reduce the mechanical failures of GaAs wafer based on strength design concept. Three-point bending experiment is performed to measure the fracture strength of GaAs wafer, of which cleavage takes place on (110) plane. We propose a simple method for minimizing the thermal residual stress in a three-layer structure, of which the basic idea is to use an appropriate steady-state temperature gradient to the wafer bonding process. The optimum bonding condition of GaAs/wax/sapphire structure is determined based on the proposed method. The effect of material anisotropy on the thermal residual stress is also analyzed by finite element method.

APA, Harvard, Vancouver, ISO, and other styles

31

Raczyńska, Ewa D., Christian Laurence, and Michel Berthelot. "Basicité de liaison hydrogène de formamidines substituées sur l'azote imino." Canadian Journal of Chemistry 70, no. 8 (August 1, 1992): 2203–8. http://dx.doi.org/10.1139/v92-276.

Full text

Abstract:

The basicity of the hydrogen bonds of formamidines 1–19 was measured by means of the formation constant KHB of their complexes with p-fluorophenol and the frequency shift Δν(OH) of methanol hydrogen-bonded to 1–19. The study of the ν(C=N) band shows that hydrogen bonding takes place with the imino nitrogen atom. On the hydrogen-bonding basicity scale, the formamidines appear to be more basic than the corresponding amides and pyridines, and as basic as the imidazoles. The field effect of electron-withdrawing substituents and the steric effect of bulky alkyl groups on the imino nitrogen atom markedly decrease the hydrogen-bonding basicity.

APA, Harvard, Vancouver, ISO, and other styles

32

Dai, Jiahong, Bin Jiang, Qiong Yan, Hongmei Xie, Zhongtao Jiang, Qingshan Yang, Qiaowang Chen, Cheng Peng, and Fusheng Pan. "Microstructures and Mechanical Properties of Mg-9Al/Ti Metallurgical Bonding Prepared by Liquid-Solid Diffusion Couples." Metals 8, no. 10 (September 29, 2018): 778. http://dx.doi.org/10.3390/met8100778.

Full text

Abstract:

Microstructures and mechanical properties of Mg-9Al/Ti metallurgical bonding prepared by liquid-solid diffusion couples were investigated. The results indicate that a metallurgical bonding was formed at the interface Mg-9Al/Ti, and the Mg17Al12 phase growth coarsening at the interfaces with the increase in heat treatment time. Push-out testing was used to investigate the shear strength of the Mg-9Al/Ti metallurgical bonding. It is shown that the shear strength presents an increasing tendency with the increased heat treatment time. The sequence is characterized, and the results show that the fracture takes place along the Mg-9Al matrix at the interface. The diffusion of Al and Ti elements play a dominant role in the interface reaction of Mg-9Al/Ti metallurgical bonding. By energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD) and thermodynamic analysis, it was found that Al3Ti is the only intermetallic compound at the interface of Mg-9Al/Ti metallurgical bonding. These results clearly show that chemical interaction at the interface formation of Al3Ti improves the mechanical properties of Mg-9Al/Ti metallurgical bonding.

APA, Harvard, Vancouver, ISO, and other styles

33

Fathy, Adel, Dalia Ibrahim, Omayma Elkady, and Mohammed Hassan. "Evaluation of mechanical properties of 1050-Al reinforced with SiC particles via accumulative roll bonding process." Journal of Composite Materials 53, no. 2 (June 19, 2018): 209–18. http://dx.doi.org/10.1177/0021998318781462.

Full text

Abstract:

Accumulative roll bonding was successfully used as a severe plastic deformation method to produce Al–SiC composite sheets. The effect of the addition of SiC particles on the microstructural evolution and mechanical properties of the composites during accumulative roll bonding was studied. The Al–1, 2 and 4 vol.% SiC composite sheets were produced by accumulative roll bonding at room temperature. Monolithic Al sheets were also produced by the accumulative roll bonding process to compare with the composite samples. Field emission scanning electron microscopy revealed that the particles had a random and uniform distribution in the matrix by the last accumulative roll bonding cycles, and strong mechanical bonding takes place at the interface of the particle matrix. This microstructural evolution led to improvement in the hardness, strength and elongation during the accumulative roll bonding process. It is also shown that by increasing the volume fraction of particles up to 4 vol.% SiC, the yield and tensile strengths of the composite sheets increased more than 1.2 and 1.3 times the accumulative roll-bonded aluminum sheets, respectively. Field emission scanning electron microscopy observation of fractured surface showed that the failure broken of composite was shear ductile rupture.

APA, Harvard, Vancouver, ISO, and other styles

34

Hauser, Andreas W., and María Pilar de Lara-Castells. "Spatial quenching of a molecular charge-transfer process in a quantum fluid: the Csx–C60 reaction in superfluid helium nanodroplets." Physical Chemistry Chemical Physics 19, no. 2 (2017): 1342–51. http://dx.doi.org/10.1039/c6cp06858h.

Full text

Abstract:

The embedding of two reactants in superfluid helium nanodroplets, here a heliophilic fullerene and a heliophobic cesium dimer, raises the question whether ionic bonding including an electron transfer can take place or not.

APA, Harvard, Vancouver, ISO, and other styles

35

Kim, Byungsuk, and Jina Park. "Effects of Commercial Activities by Type on Social Bonding and Place Attachment in Neighborhoods." Sustainability 10, no. 6 (May 29, 2018): 1771. http://dx.doi.org/10.3390/su10061771.

Full text

APA, Harvard, Vancouver, ISO, and other styles

36

Gündoğdu, Didem, Pietro Panzarasa, Nuria Oliver, and Bruno Lepri. "The bridging and bonding structures of place-centric networks: Evidence from a developing country." PLOS ONE 14, no. 9 (September 5, 2019): e0221148. http://dx.doi.org/10.1371/journal.pone.0221148.

Full text

APA, Harvard, Vancouver, ISO, and other styles

37

Hammitt, William E., Erik A. Backlund, and Robert D. Bixler. "Experience Use History, Place Bonding and Resource Substitution of Trout Anglers During Recreation Engagements." Journal of Leisure Research 36, no. 3 (September 2004): 356–78. http://dx.doi.org/10.1080/00222216.2004.11950028.

Full text

APA, Harvard, Vancouver, ISO, and other styles

38

Li, Shichang, Shiping Yin, Congcong Wang, and Yuhou Yang. "Research on the bonding performance of TRC permanent formwork and cast-in-place concrete." Engineering Structures 235 (May 2021): 112021. http://dx.doi.org/10.1016/j.engstruct.2021.112021.

Full text

APA, Harvard, Vancouver, ISO, and other styles

39

Refaat Mahmoud, Dr Mahmoud. "Women Bonding as Means of Survival in Gloria Naylor’s The Women of Brewster Place." مجلة کلية الآداب 49, no. 1 (October 1, 2018): 29–75. http://dx.doi.org/10.21608/bfa.2018.188121.

Full text

APA, Harvard, Vancouver, ISO, and other styles

40

Khaledi, Kavan, Stephan Wulfinghoff, and Stefanie Reese. "Finite Element Modeling of Bond Formation in Cold Roll Bonding Processes." Key Engineering Materials 767 (April 2018): 323–30. http://dx.doi.org/10.4028/www.scientific.net/kem.767.323.

Full text

Abstract:

The paper aims to present a finite element model for the bond strength evolution in cold roll bonding processes. To accomplish this, first, the micro-mechanisms taking place along the cold welded joint interfaces are explained. Then, based on the microscopic description of cold welding processes, a bonding interface model is employed to describe the bond formation between the rolled metallic layers. The obtained bond strength is calculated based on the governing parameters of the bonding such as the degree of plastic deformation and the surface cleanness. The numerical simulation given in this paper includes the modelling of joining during cold roll bonding followed by the debonding process in Double Cantilever Beam (DCB) peeling test. Finally, the effects of two important factors on the bond formation, i.e. (1) the degree of plastic deformation and (2) the surface cleanness, are numerically investigated.

APA, Harvard, Vancouver, ISO, and other styles

41

Yi, Chenglin, Hong Liu, Shaoyi Zhang, Yiqun Yang, Yan Zhang, Zhongyuan Lu, Eugenia Kumacheva, and Zhihong Nie. "Self-limiting directional nanoparticle bonding governed by reaction stoichiometry." Science 369, no. 6509 (September 10, 2020): 1369–74. http://dx.doi.org/10.1126/science.aba8653.

Full text

Abstract:

Nanoparticle clusters with molecular-like configurations are an emerging class of colloidal materials. Particles decorated with attractive surface patches acting as analogs of functional groups are used to assemble colloidal molecules (CMs); however, high-yield generation of patchy nanoparticles remains a challenge. We show that for nanoparticles capped with complementary reactive polymers, a stoichiometric reaction leads to reorganization of the uniform ligand shell and self-limiting nanoparticle bonding, whereas electrostatic repulsion between colloidal bonds governs CM symmetry. This mechanism enables high-yield CM generation and their programmable organization in hierarchical nanostructures. Our work bridges the gap between covalent bonding taking place at an atomic level and colloidal bonding occurring at the length scale two orders of magnitude larger and broadens the methods for nanomaterial fabrication.

APA, Harvard, Vancouver, ISO, and other styles

42

Ujang, Norsidah. "Place Attachment and Continuity of Urban Place Identity." Asian Journal of Environment-Behaviour Studies 2, no. 2 (January 1, 2017): 117–32. http://dx.doi.org/10.21834/aje-bs.v2i2.182.

Full text

Abstract:

This paper focused on place attachment and its significance in defining place identity with reference to three main shopping streets in the city center of Kuala Lumpur, Malaysia. Place identity refers to the identification of emotion and feelings to a particular place and the distinctive characteristics of the place in which human-place bonding is developed. The weakening of place identity has been identified as one of the urban design issues for contemporary cities. This paper identified the issues concerning place identity; concepts of place and place attachment constructs, the identification of place attachment constructs and place attributes that could be used as assessment indicators for future redevelopment of local urban places. A questionnaire survey and interviews were conducted to examine place attachment and to identify the characteristics of the places that exerted influence and would then benefit in terms of securing place identity which in turn sustained attraction and thus brought greater economic and tourism advantages to the city. Keywords: Place, Attachment, Identity, Kuala Lumpur City Centre. © 2017 The Authors. Published for AMER ABRA by e-International Publishing House, Ltd., UK. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). Peer–review under responsibility of AMER (Association of Malaysian Environment-Behaviour Researchers), ABRA (Association of Behavioural Researchers on Asians) and cE-Bs (Centre for Environment-Behaviour Studies), Faculty of Architecture, Planning & Surveying, UniversitiTeknologi MARA, Malaysia.

APA, Harvard, Vancouver, ISO, and other styles

43

Löhner, Martin, and Dietmar Drummer. "Experimental Studies on the Bonding Strength and Fracture Behavior of Incompatible Materials Bonded by Mechanical Adhesion in Multilayer Rotational Molding." Journal of Polymers 2016 (November 22, 2016): 1–11. http://dx.doi.org/10.1155/2016/5768453.

Full text

Abstract:

Rotational molding is a plastic processing method that allows for the production of seamless, hollow parts. Defined shaping of the polymeric material only takes place on the outer surface where contact to the tooling is given. The inner surface forms by surface tension effects. By sequential adding of materials, complex multilayer build-up is possible. Besides pure, single materials, filled, or multiphase systems can be processed as well. In this work, possibilities to generate bonding between supposedly incompatible materials by adding a mix-material interlayer are investigated. Interlock mechanisms on a microscale dimension occur and result in mechanical bonding between the used materials, polyethylene (PE) and thermoplastic polyurethane (TPE-U). The bonding strength between the materials was investigated to reveal the correlations between processing parameters, resulting layer build-up, and bonding strength. The failure behavior was analyzed and inferences to the influence of the varied parameters were drawn.

APA, Harvard, Vancouver, ISO, and other styles

44

Sebastiani, Gerd, Sebastian Pfeifer, Lars Röber, Jun Katoh, Zenzo Yamaguchi, and Satoru Takada. "Bonding Strength of FRP-Metal Hybrids." Technologies for Lightweight Structures (TLS) 3, no. 1 (January 28, 2020): 1–8. http://dx.doi.org/10.21935/tls.v3i1.123.

Full text

Abstract:

The lightweight credo “the right material in the right place” raises an interesting concern once different materials are meant to provide a watertight bond. Therefore, we investigate the bonding behavior of metals with Fiber-Reinforced-Plastic (FRP) materials. In order to optimize the bond, the major influencing factors and their interactions are studied.In order to identify the above interactions, FRP-metal hybrid specimens were investigated with regard to peel forces and shear strengths. During manufacturing the influencing factors such as sheet metal and FRP type, surface treatments, and bonding processes were varied.Considering the peel force, a thermoset plastic matrix adhesively bonded to steel provided the best results, along with the use of a novel surface etching method by Kobelco. The latter yielded the highest shear strengths within this investigation. No bond could be obtained applying thermoset plastic matrices for in-operandi connections.Using adhesives or surface treatments introduced additional production costs. Hence, in-operandi bonding would be a favorable option, however, one requiring further research. Compared to the material costs, the additional production costs could prove to be insignificant once the bonding process has been properly robustified and automated.

APA, Harvard, Vancouver, ISO, and other styles

45

Brown, Keith C., Muhsin El-Bermani, and John A. Weil. "Chemical-shift link to the KamletTaft β parameter." Canadian Journal of Chemistry 82, no. 12 (December 1, 2004): 1707–11. http://dx.doi.org/10.1139/v04-149.

Full text

Abstract:

In investigating liquid-phase proton NMR spectra of 2,2-dimethyl-1-(2,4,6-trinitrophenyl)hydrazine in various solvents, we have found an interesting correlation, at sufficiently low temperatures T, between the chemical-shift difference (splitting) of the picryl proton peaks, measured as f(T), and the KamletTaft hydrogen-bonding basicity parameter β. The observed solvolytic effect offers a convenient way of determining and checking the value of the empirical parameter β. The phenomenon discloses that the molecular geometric configuration is affected vividly by hydrogen bonding with the surrounding solvent molecules. It follows that the internal conformation interchange taking place (in a higher T range) is not in fact solely a unimolecular property.Key words: picryl proton NMR, chemical shift, solvent effects, hydrogen bonding, KamletTaft β.

APA, Harvard, Vancouver, ISO, and other styles

46

Kącka-Zych, Agnieszka. "Understanding the Molecular Mechanism of the Rearrangement of Internal Nitronic Ester into Nitronorbornene in Light of the MEDT Study." Molecules 24, no. 3 (January 28, 2019): 462. http://dx.doi.org/10.3390/molecules24030462.

Full text

Abstract:

The characterization of the structure of nitronic esters and their rearrangement into nitronorbornene reactions has been analyzed within the Molecular Electron Density Theory (MEDT) using Density Functional Theory (DFT) calculations at the B3LYP/6-31G(d) computational level. Quantum-chemical calculations indicate that this rearrangement takes place according to a one-step mechanism. The sequential bonding changes received from the Bonding Evolution Theory (BET) analysis of the rearrangement of internal nitronic ester to nitronorbornene allowed us to distinguish seven different phases. This fact clearly contradicts the formerly-proposed concerted pericyclic mechanism.

APA, Harvard, Vancouver, ISO, and other styles

47

Kliauga, Andrea Madeira, Renan P. de Godoi, Vitor Luiz Sordi, and Raul E. Bolmaro. "Dynamic Recrystallization during Warm Accumulative Asymmetric Roll Bonding (AARB) of the AA1050 Aluminium." Materials Science Forum 941 (December 2018): 1342–47. http://dx.doi.org/10.4028/www.scientific.net/msf.941.1342.

Full text

Abstract:

In this work asymmetric accumulative roll bonding (AARB) was applied to a AA1050 aluminum up to ten cycles at 350 and 400°C. The texture was measured by x ray diffraction and EBSD. Hardness and tensile tests characterized the strain distribution and bonding efficiency. At 350 °C the microstructural refinement was stabilized after four cycles and mean grain sizes of one micron and a saturation yield strength of 160 MPa was achieved. At 400°C grain growth took place yielding a bimodal microstructure with mean grain size of 9 microns. During repeated bonding cycles recovery and dynamic recrystallization were observed and extra shear in the interfacial region yielded a fairly well homogeneous strain distribution and weak shear texture across the sheet for both temperatures. The strongest component in both cases was the rotated cube orientation. The last bonding surface was the weakest bond but adding an extra 50% reduction step to the process increased the interfacial strength considerably.

APA, Harvard, Vancouver, ISO, and other styles

48

Huffman, Alan, Jason Reed, Matthew Lueck, Christopher Gregory, Dorota Temple, and Russ Stapleton. "Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration Using a Fluxing Adhesive." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 001726–42. http://dx.doi.org/10.4071/2010dpc-wp15.

Full text

Abstract:

The study of copper-based bump structures for interconnects in 3D integration applications has been ongoing for several years. Typically, an array of Cu bumps is bonded to an array of Sn-capped Cu bumps or another Cu bump array using a thermocompression bonding process. These processes rely on high pressures and temperatures to facilitate bonding between the bump arrays. In order for this bonding to take place, some method of oxide removal is normally required for the Cu and/or Cu/Sn bump surfaces before bonding. A number of different methods have been investigated by a number of groups, including chemical cleaning, plasma cleaning, self-assembled monolayers, and no-flow underfill (NUF) materials. The use of NUFs is particularly intriguing, since these materials can be formulated with fluxing agents which could reduce surface oxides on Cu and Sn and can be deposited immediately prior to the thermocompression bonding process. In addition, the material provides a protective encapsulant to the interconnect array, protecting it from environmental damage and adding mechanical strength to the assembly. We will present the results of a study to evaluate new fluxing NUF materials in thermocompression bonding processes on full area array test devices with 25 micron bump pitch. The test devices are fabricated with either Cu or Cu/Sn bumps to provide two different bonding options (Cu to Cu or Cu/Sn to Cu). We will compare the NUF bonding process and resulting bonded interfaces to assemblies fabricated using our standard bonding processes, which rely on both chemical and plasma pretreatment processes to prepare the bump arrays before bonding. Mechanical and electrical data will be used to compare the two bonding processes, as well as SEM cross-section analysis of the bonded interfaces.

APA, Harvard, Vancouver, ISO, and other styles

49

Lewicka, Maria. "Localism and Activity as two dimensions of people–place bonding: The role of cultural capital." Journal of Environmental Psychology 36 (December 2013): 43–53. http://dx.doi.org/10.1016/j.jenvp.2013.07.002.

Full text

APA, Harvard, Vancouver, ISO, and other styles

50

Najmabadi, Afsaneh. "The Erotic Vaṭan [Homeland] as Beloved and Mother: To Love, To Possess, and To Protect." Comparative Studies in Society and History 39, no. 3 (July 1997): 442–67. http://dx.doi.org/10.1017/s0010417500020727.

Full text

Abstract:

Modern nations have often been explicitly imagined through familial metaphors. In particular, the construction of the national community as a brotherhood (a fraternity) has pointed both to the centrality of male bonding in the production of nationalist sentiment and to the exclusion of women from the social contract. Within that contract not only were women “subject to men's power; it also implied complementary bonds between men;… women had no place in the new political and social order except as markers of social relations between men.”Hunt's observation recalls Sedgwick's analysis of how male bonding is mediated through the figure of woman. In nationalist discourse representing the homeland as a female body has often been used to construct a national identity based on male bonding among a nation of brothers.

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!