Dissertations / Theses on the topic 'Pitch dimensions'

Whilst smaller pitches have become the norm in junior football, they may still be too large for certain ages and levels of skill. To date there has been no research into the relationships between size of the pitch and the technical kicking ability (distance and accuracy) of young players (8 - 14 years of age). The purpose of this investigation was to examine variables that influence actual kicking distance and accuracy and also to measure what differences in play behaviour (passing and dribbling) emerge from self-selected changes in pitch size for different age groups (9 and 10 years of age). Data were collected on 120 (N=120) junior football players: Playing experience (M=2.85 years, SD=2.56), Height (M=1.44 m, SD=1.08), Weight (M=37.8 kg, SD=7.69), Lengths of lower limbs (knee/ankle: M=35.54 cm, SD=4.27; hip/knee: M=35.54 cm, SD=5.25), Step lengths (M=37.66 cm, SD=8.693), Estimated kicking distance (M=31.13 m, SD=16.63). Participants performed a series of three kicks along the ground, using the inside of the foot, and aiming for a target (25 m away). The distance (M=18.04 m; SD=6.56) and accuracy (M=8.32 m; SD=4.38) of each kick were measured. The children (9 and 10 years of age) were then assigned to teams and asked to construct a small-sided game on two different pitch sizes. The first pitch size used was the recommended regulation size. The second pitch size was self-selected by the players. Any changes to the playing dimensions (e.g., width of the pitch) and playing behaviours (e.g., total number of passes, dribbling) were measured and analysed. Kicking distance is best predicted by the player’s height (20.0%, P < 0.000), or a combination of the player’s height and estimated kicking distance (30.0%, P = 0.002). Kicking accuracy can be attributed to the influence of the player’s step lengths (8.1%, P = 0.016) and both their step lengths and estimated kicking distance (15.1%, P = 0.020). Furthermore, our findings demonstrate that the increase in pitch size (18.5% and 25%) resulted in a greater amount of dribbling (63% and 33%) and passing (12%). In general, our results support the idea that young children in New Zealand should be playing on a pitch and at a skill level which matches their football abilities. Grouping young players on a pitch according to their physical (e.g., height) and technical kicking ability (e.g., distance, accuracy) instead of their chronological age, seems to be the key factor to any other set of proposals. The findings of this thesis have important messages that could enhance the effectiveness of coaching, competitive game-play (pitch sizes) and consequently performance at all junior levels of football in New Zealand. Further research should manipulate the number of players per team to see if this factor affects competitive game-play in junior football. Additionally, the mean distances maintained between players in the same team (team-mates) during game play needs to be considered (with regard to the ‘beehive effect’). Further studies should examine different age groups of equivalent skill level and assess their performance in relation to their technical kicking ability on different pitches.

The dropped objects are identified as one of the top ten causes of fatalities and serious injuries in the oil and gas industry. It is of importance to understand dynamics of dropped objects under water in order to accurately predict the motion of dropped objects and protect the underwater structures and facilities from being damaged. In this thesis, we study nondimensionalization of dynamic equations of dropped cylindrical objects. Nondimensionalization helps to reduce the number of free parameters, identify the relative size of effects of parameters, and gain a deeper insight of the essential nature of dynamics of dropped cylindrical objects under water. The resulting simulations of dimensionless trajectory confirms that drop angle, trailing edge and drag coefficient have the significant effects on dynamics of trajectories and landing location of dropped cylindrical objects under water.

Small form-factor packages with high integration density are driving the innovations in chip-to-package interconnections. Metallurgical interconnections have evolved from the conventional eutectic and lead-free solders to fine pitch copper pillars with lead-free solder cap. However, scaling down the bump pitch below 50-80µm and increasing the interconnect density with this approach creates a challenge in terms of accurate solder mask lithography and joint reliability with low stand-off heights. Going beyond the state of the art flip-chip interconnection technology to achieve ultra-fine bump pitch and high reliability requires a fundamentally- different approach towards highly functional and integrated systems. This research demonstrates a low-profile copper-to-copper interconnect material and process approach with less than 20µm total height using adhesive bonding at lower temperature than other state-of-the-art methods. The research focuses on: (1) exploring a novel solution for ultra-fine pitch (< 30µm) interconnections, (2) advanced materials and assembly process for copper-to-copper interconnections, and (3) design, fabrication and characterization of test vehicles for reliability and failure analysis of the interconnection. This research represents the first demonstration of ultra-fine pitch Cu-to-Cu interconnection below 200°C using non-conductive film (NCF) as an adhesive to achieve bonding between silicon die and organic substrate. The fabrication process optimization and characterization of copper bumps, NCF and build-up substrate was performed as a part of the study. The test vehicles were studied for mechanical reliability performance under unbiased highly accelerated stress test (U-HAST), high temperature storage (HTS) and thermal shock test (TST). This robust interconnect scheme was also shown to perform well with different die sizes, die thicknesses and with embedded dies. A simple and reliable, low-cost and low-temperature direct Cu-Cu bonding was demonstrated offering a potential solution for future flip chip packages as well as with chip-last embedded active devices in organic substrates.

In this paper we develop a mathematical model of a two-dimensional aeroelastic airfoil. This model is used to design a flutter suppression controller. Flutter is a vibration in a wing caused by airstream energy being absorbed by the lifting surface. Flutter increases with increasing speed. For simplicity, we consider a flat plate in a two-dimensional flow. The model is developed in the frequency domain and then transformed into the time domain. The uncontrolled model is numerically simulated using MATLAB. Linear Quadratic Regulator (LQR) theory is used to design a state feedback controller. The LQR control scheme consists of using a full state feedback controller of the form u=-Kx, where K is a control gain matrix. The goal is to use LQR theory to supress flutter and to maintain stability of the closed loop system.
Master of Science

Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.
Includes bibliographical references (p. 133-135).
This thesis addresses the problem of obtaining an accurate spectral representation of speech formant structure when the voicing source exhibits a high fundamental frequency. Our work is inspired by auditory perception and physiological modeling studies implicating the use of temporal changes in speech by humans. Specifically, we develop and evaluate signal processing schemes that exploit temporal change of pitch as a basis for high-pitch formant estimation. As part of our development, we assess the source-filter separation capabilities of several two-dimensional processing schemes that utilize both standard spectrographic and auditory-based time-frequency representations. Our methods show quantitative improvements under certain conditions over representations derived from traditional and homomorphic linear prediction. We conclude by highlighting potential benefits of our framework in the particular application of speaker recognition with preliminary results indicating a performance gender-gap closure on subsets of the TIMIT corpus.
by Tianyu Tom Wang.
S.M.

This research reports for the first time conductive anodic filament reliability of copper plated-through-vias with spacing of 75 – 200 µm in thin glass fiber reinforced organic packaging substrates with advanced epoxy-based and cyclo-olefin polymer resin systems. Reliability studies were conducted in halogenated and halogen-free substrates with improved test structure designs including different conductor spacing and geometry. Accelerated test condition (temperature, humidity and DC bias voltage) was used to investigate the effect of conductor spacing and substrate material influence on insulation reliability behavior. Characterization studies included gravimetric measurement of moisture sorption, extractable ion content analysis, electrical resistance measurement, impedance spectroscopy measurement, optical microscopy and scanning electron microscopy analysis and elemental characterization using energy dispersive x-ray spectroscopy. The accelerated test results and characterization studies indicated a strong dependence of insulation failures on substrate material system, conductor spacing and geometry. This study presents advancements in the understanding of failure processes and chemical nature of failures in fine-pitch copper plated-through-vias in newly developed organic substrates and demonstrates potential methods to mitigate failures for high density organic packages.

Multi-chip integration with emerging technologies such as a 3D IC stack or 2.5D interposer is primarily enabled by the off-chip interconnections. The I/O density, speed and bandwidth requirements for emerging mobile and high-performance systems are projected to drive the interconnection pitch to less than 20 microns by 2015. A new class of low-temperature, low-pressure, high-throughput, cost-effective and maufacturable technologies are needed to enable such fine-pitch interconnections. A range of interconnection technologies are being pursued to achieve these fine-pitch interconnections, most notably direct Cu-Cu interconnections and copper pillars with solder caps. Direct Cu-Cu bonding has been a target in the semiconductor industry due to the high electrical and thermal conductivity of copper, its high current-carrying capability and compatibility with CMOS BEOL processes. However, stringent coplanarity requirements and high temperature and high pressure bonding needed for assembly have been the major barriers for this technology. Copper-solder interconnection technology has therefore become the main workhouse for off-chip interconnections, and has recently been demonstrated at pitches as low as 40 microns. However, the current interconnection approaches using copper-solder structures are not scalable to finer feature sizes due to electromigration, and reliability issues arising with decreased solder content. Solid Liquid Inter-Diffusion (SLID) bonding is a promising solution to achieve ultra-fine-pitch and ultra-short interconnections with a copper-solder system, as it relies on the conversion of the entire solder volume into thermally-stable and highly electromigration-resistant intermetallics with no residual solder. Such a complete conversion of solders to stable intermetallics, however, relies on a long assembly time or a subsequent post-annealing process. To achieve pitches lower than 30 micron pitch, this research aims to study two ultra-short copper-solder interconnection approaches: (i) copper pillar and solder cap technology, and (ii) a novel technology which will enable interconnections with improved electrical performance by fast and complete conversion of solders to stable intermetallics (IMCs) using Solid Liquid Diffusion (SLID) bonding approach. SLID bonding, being a liquid state diffusion process, combined with a novel, alternate layered copper-solder bump structure, leads to higher diffusion rates and a much faster conversion of solder to IMCs. Moreover this assembly bonding is done at a much lower temperature and pressure as compared to that used for Cu-Cu interconnections. FEM was used to study the effect of various assembly and bump-design characteristics on the post-assembly stress distribution in the ultra-short copper-solder joints, and design guidelines were evolved based on these results. Test vehicles, based on these guidelines, were designed and fabricated at 50 and 100 micron pitch for experimental analysis. The bumping process was optimized, and the effect of current density on the solder composition, bump-height non-uniformity and surface morphology of the deposited solder were studied. Ultra-short interconnections formed using the copper pillar and solder cap technology were characterized. A novel multi-layered copper-solder stack was designed based on diffusion modeling to optimize the bump stack configuration for high-throughput conversion to stable Cu3Sn intermetallic. Following this modeling, a novel bumping process with alternating copper and tin plating layers to predesigned thicknesses was then developed to fabricate the interconnection structure. Alternate layers of copper and tin were electroplated on a blanket wafer, as a first demonstration of this stack-technology. Dies with copper-solder test structures were bonded using SLID bonding to validate the formation of stable intermetallics.

För vindkraftverk i mindre skala används i huvudsak två sätt att avlasta vid höga vindhastigheter, stallreglering och girning ur vind. En tredje metod är att pitcha rotorbladet till en mindre attackvinkel. Då minskar belastningen på rotorbladet samtidigt som effektgenerering kan bibehållas. Arbetet redovisar en konstruktion för en fjädrande passiv mekanisk pitch som avgränsats till att enbart dimensionera en vridfjäder och tre lager. Konstruktionen riktas mot horisontalaxlade vindkraftverk med tre rotorblad med en rotordiameter upp till 20m. Ett idealt rotorblad modelleras matematiskt för att ta fram dimensionerande krafter och moment. Utifrån detta kan sedan vridfjäder och lager dimensioneras. Konstruktionen tillsammans med dimensioneringen visar att belastning av rotorbladet kan reduceras samt att krafter som är kopplad till effekten kan hållas mer eller mindre konstant för vindhastigheter 16 till 24 m/s. Resultat av dimensionering visar att både vridfjäder och lager kan relativt enkelt anpassas till olika axeldiametrar. Slutsatserna blir att om dimensionering görs enligt arbetet är det, åtminstone i teorin, möjligt att uppnå det önskade beteendet för pitchen. För vidare arbete och verifiering rekommenderas bland annat att göra reella tester för vridfjädern för att bestämma dess precision på grund av fjäderns små vinkelutslag.
For small-scale wind turbines, there are mainly two ways of reducing loads at high wind speeds, stall regulation and yaw the rotor out of wind. A third method is to pitch the rotor blade to a smaller angle of attack. This reduces the load on the rotor blade while maintaining power generation. The following work presents a design for a spring based passive mechanical pitch that is limited to only dimensioning a torsion spring and three bearings. The design is aimed at horizontal axis wind turbines with three rotor blades with a rotor diameter up to 20m. An ideal rotor blade is mathematically modeled to produce the forces and torques needed in order to properly dimension the torsion spring and bearings. The design shows that the load of the rotor blade can be reduced and that forces connected to the power can be kept more or less constant for wind speeds 16 to 24 m / s. The results of sizing show that both the torsion spring and bearings can be adapted to different shaft diameters relatively easy. The conclusions are that if dimensioning is done according to the presented results, it is possible, at least in theory, to achieve the desired behaviour. For further development and verification it is recommended to do real tests for the torsion spring to determine its precision due to small angle displacement in the spring.

Nine experiments were conducted to explore pitch-time integration in music. In Experiments 1-6, listeners heard a musical context followed by probe events that varied in pitch class and temporal position. When evaluating the goodness-of-fit of the probe (Experiment 1), listeners’ ratings showed more influence of pitch class than of temporal position. The tonal and metric hierarchies contributed additively to ratings. Listeners again rated goodness-of-fit in Experiment 2, but with instructions to ignore pitch. Temporal position dominated ratings, but an effect of pitch consistent with the tonal hierarchy remained. Again, these two factors contributed additively. A speeded classification task in Experiments 3 and 4 revealed asymmetric interference. When making a temporal judgment (Experiment 3), listeners exhibited a response bias consistent with the tonal hierarchy, but the metric hierarchy did not affect their pitch judgments (Experiment 4). Experiments 5 and 6 ruled out alternative explanations based on the presence of pitch classes and temporal positions in the context, unequal numbers of pitch classes and temporal positions in the probe events, and differential difficulty of pitch versus temporal classification. Experiments 7-9 examined the factors that modulate the effect of temporal variation on pitch judgments. In Experiment 7, a standard tone was followed by a tonal context and then a comparison tone. Participants judged whether the comparison tone was in the key of the context or whether it was higher or lower than the standard tone. For both tasks, the comparison tone occurred early, on time, or late with respect to temporal expectancies established by the context. Temporal variation did not affect accuracy in either task. Experiment 8 used the pitch height comparison task, and had either a tonal or an atonal context. Temporal variation affected accuracy only for atonal contexts. Experiment 9 replicated these results and controlled for potential confounds. The findings imply that the tonal contexts found in typical Western music bias attention toward pitch, increasing the salience of this dimension at the expense of time. Pitch salience likely arises from long-term exposure to the statistical properties of Western music and is not linked to the relative discriminability of pitch and time.

碩士
國立中興大學
機械工程研究所
83
The flow structure over an NACA0012 airfoil oscillating sinusoidally in pitch will be investigated experimentally in a recirculation water channel. It is intended to understand the insight of hte flow physics and characteristics of the perturbed shear layer leading to higher lift at post-stall angle of attack. Flow visualizations are performed by hydrogen bubbles as well as the laser sheet methods; moreover, velocity informations are acquired by LDV system through phase-averaged technique. The evolution of small scale vortices in perturbed shear layer leading to coalescence and formation of large scale vortex above but closer to the airfoil. Neverthless, appropriate perturbation at the leading edge would lead to the most effective separation control when the forcing frequency matched with the subharmonic of the Klevin-Helmholtz shear layer instability frequency. Consequently, the significant improvements of pressure distribution on the upper surface are achieved in the post-stall angle of attack.

碩士
大同大學
材料工程研究所
88
Carbon/carbon composites, carbon fibers reinforced carbon matrix composites, are unique materials which combine the excellent mechanical properties of carbon fibers and the characteristics of graphitized carbon matrix. Carbon/carbon composites possess high specific strength and stiffness, excellent high temperature mechanical properties, low thermal expansion, high vibration damping capability, good wear resistance, good anti-corrosion, and well biocompatibility. Therefore, applications were found as high temperature structure materials, refractory materials, brakes and biomedical materials, for example, the nozzle of aerospaceplane, heat-resisting brick of high temp furnace, brake lining for high speed vehicles, and joint replacements. The decomposition and shrinkage of phenolic resin matrix results in a lot of cracks and pores in the carbonized composites. For this reason, densification by pitch impregnation/carbonization cycles was studied in this investigation. The variations of density, open porosity, and pore size distribution after each densification cycle were measured using mercury porosimetry and Archimedes’ method. The mechanical behavior after densification was investigated using three-point bending test. Four densification cycles were performed, and bulk density and flexural strength were found to increase gradually after each densification cycle. On the other hand, open porosity decreased significantly. Better flexural strength was obtained after one densification cycle. When a lower temperature increase rate of carbonization was used. However, a flexural strength lower than that before densification was obtained when using a higher carbonization rate. The reasons were probably due to the incomplete carbonization and generation of new cracks during recarbonization for a higher carbonization rate. It was also found that the composites could be densified more efficiently when adding an intermediate graphitization between densification cycles. As a result, a much higher flexural strength was also measured.

Coal can be converted to different chemical products through processes such destructive distillation. The destructive distillation of coal yields coke as the main product with byproducts such as coal tar pitch (CTP). CTP has a wide range of applications, especially in the carbon-processing industries. Typical applications include the manufacture of anodes used in many electrochemical processes, as well as Söderberg electrodes used in different ferroalloy processes. Söderberg electrodes are made from the thermal treatment of Söderberg electrode paste. The Söderberg electrode paste is a mixture of CTP (binding material) and coke/calcined anthracite (filler). Söderberg electrodes are characterised by a baking isotherm temperature. This temperature is located in the baking zone of the Söderberg electrode system. In the baking zone, the liquid paste is transformed into a solid carbonaceous material. Knowing the baking isotherm temperature is essential as it will ensure the safe, profitable and continuous operation of submerged arc furnaces. Thermomechanical analysis (TMA) was used in this study to determine the baking isotherm temperature of CTP samples. The baking isotherm temperature for all samples was found to lie between 450 and 475 °C irrespective of the initial chemical and physical composition of the CTP. TMA was also used to measure the dimensional changes that take place in the binding material (CTP) at temperatures above the baking isotherm. The dimensional changes of 12 CTP samples when heated from room temperature up to a maximum of 1300 °C were measured. The results indicated that all CTP samples shrank by approximately 14% in the first heating and cooling cycle. The second and third heating and cooling cycles gave a small change in dimensions of approximately 2% for all samples. The significant change in dimensions observed for all CTP samples during the first TMA thermal treatment cycle was attributed to the structural rearrangement that takes place within the carbonaceous material. The structural ordering of all CTP samples thermally treated was evaluated by X-ray diffractometry (XRD). XRD is widely used in the determination of crystallinity/amorphousness of carbonaceous materials, interlayer distance (d-spacing), as well as the degree of ordering (DOG) in a given material. For comparison of structural ordering, XRD analysis was also performed on raw (as-received) CTPs, as well as CTPs thermally treated at 475 and 1300 °C. Prebaked electrode graphite was also analysed. From the XRD results, raw CTP was found to be amorphous with no significant ordering. The interlayer spacing (d002) for all raw CTP samples averaged 3.70 Å, compared to 3.37 Å for prebaked electrode graphite. CTPs thermally treated at 1300 °C had a d-spacing of 3.51 Å. The DOG of raw samples was found to be negative which was indicative of the amorphousness of the raw CTP. The DOG increased with an increase in thermal treatment temperature, as was seen from the DOG of CTPs thermally treated at 1300 °C, which was calculated to be approximately -81% for all 12 samples. The calculated DOG for prebaked electrode graphite was 81%. Prior to determining the baking isotherm temperature, as well as the changes in dimensions during thermal treatment, the chemical compositions of the 12 CTP samples were determined. In the chemical composition determination, fundamental properties such as softening point (SP), coking value (CV), toluene and quinoline insolubles (TI and QI, respectively) were evaluated. This was in addition to proximate and ultimate analysis. The information obtained from this diverse characterisation showed significant differences in the chemical composition of the 12 CTPs. By making use of multi-linear regression analysis (MLR), it was possible to predict or calculate less commonly determined characteristics (CV, TI and QI) from the more commonly obtained parameters (proximate and ultimate analysis parameters). It was found that MLR could be used successfully to calculate CV and TI, but less so for QI. Additional chemical composition of CTP was determined by analytical techniques such as Fourier Transform Infra-Red spectroscopy (FT-IR) and Nuclear Magnetic Resonance spectroscopy (NMR). Results from the FT-IR analysis showed that the spectra for all 12 raw CTPs were similar, with differences only being in the FT-IR band intensities. The differences in FT-IR band intensities were supported by NMR analysis data, which gave quantitative information on the different structural parameters found in all CTPs. The structural composition of CTPs changed during thermal treatment, as was shown by the FT-IR analysis performed on raw CTPs samples, CTPs thermally treated at 475, 700, 1000 and 1300 °C, as well as prebaked electrode graphite.
PhD (Chemistry), North-West University, Potchefstroom Campus, 2014

碩士
國立成功大學
機械工程研究所
83
This thesis presents an analytical methodology on the NC data eneration for automation measurement of variable pitch lead screw on coordinate measuring machine and mutli-axis machine tools.he desired probe location and the ability functions of 4-axisMM and two multiaxis machine tools are derived by a modified notation. NC data equations are obtained by solving the machine''sink variables through equations of its ability function and theesired probe location matrices.This methodlogy is a general onend is applicable for various mechanical element measuring. Itlso combines the activities of design and quality control, thusaking the production process more flexible, automatic and controllable.