Relevant bibliographies by topics / Photonic Integrated Circuits (PICs)

Academic literature on the topic 'Photonic Integrated Circuits (PICs)'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Photonic Integrated Circuits (PICs)"

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Baier, Moritz, Axel Schoenau, Francisco M. Soares, and Martin Schell. "Polarimetry for Photonic Integrated Circuits." Applied Sciences 9, no. 15 (July 25, 2019): 2987. http://dx.doi.org/10.3390/app9152987.

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Photonic integrated circuits (PICs) play a key role in a wide range of applications. Very often, the performance of PICs depends strongly on the state of polarization of light. Classically, this is regarded as undesirable, but more and more applications emerge that make explicit use of polarization dependence. In either case, the characterization of the polarization properties of a PIC can be a nontrivial task. We present a way of characterizing PICs in terms of their full Müller matrix, yielding a complete picture of their polarization properties. The approach is demonstrated by carrying out measurements of fabricated PICs.
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Piramidowicz, R., S. Stopiński, K. Ławniczuk, K. Welikow, P. Szczepański, X. J. M. Leijtens, and M. K. Smit. "Photonic integrated circuits – a new approach to laser technology." Bulletin of the Polish Academy of Sciences: Technical Sciences 60, no. 4 (December 1, 2012): 683–89. http://dx.doi.org/10.2478/v10175-012-0079-5.

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Abstract In this work a brief review on photonic integrated circuits (PICs) is presented with a specific focus on integrated lasers and amplifiers. The work presents the history of development of the integration technology in photonics and its comparison to microelectronics. The major part of the review is focused on InP-based photonic integrated circuits, with a short description of the potential of the silicon technology. A completely new way of fabrication of PICs, called generic integration technology, is presented and discussed. The basic assumption of this approach is the very same as in the case of electronic circuits and states that a limited set of standard components, both active and passive, enables designing of a complex, multifunctional PIC of every type. As a result, functionally advanced, compact, energy efficient and cost-optimized photonic devices can be fabricated. The work presents also selected examples of active PICs like multiwavelength laser sources, discretely tunable lasers, WDM transmitters, ring lasers etc.
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Zhang, Chuang, Chang-Ling Zou, Yan Zhao, Chun-Hua Dong, Cong Wei, Hanlin Wang, Yunqi Liu, Guang-Can Guo, Jiannian Yao, and Yong Sheng Zhao. "Organic printed photonics: From microring lasers to integrated circuits." Science Advances 1, no. 8 (September 2015): e1500257. http://dx.doi.org/10.1126/sciadv.1500257.

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A photonic integrated circuit (PIC) is the optical analogy of an electronic loop in which photons are signal carriers with high transport speed and parallel processing capability. Besides the most frequently demonstrated silicon-based circuits, PICs require a variety of materials for light generation, processing, modulation, and detection. With their diversity and flexibility, organic molecular materials provide an alternative platform for photonics; however, the versatile fabrication of organic integrated circuits with the desired photonic performance remains a big challenge. The rapid development of flexible electronics has shown that a solution printing technique has considerable potential for the large-scale fabrication and integration of microsized/nanosized devices. We propose the idea of soft photonics and demonstrate the function-directed fabrication of high-quality organic photonic devices and circuits. We prepared size-tunable and reproducible polymer microring resonators on a wafer-scale transparent and flexible chip using a solution printing technique. The printed optical resonator showed a quality (Q) factor higher than 4 × 105, which is comparable to that of silicon-based resonators. The high material compatibility of this printed photonic chip enabled us to realize low-threshold microlasers by doping organic functional molecules into a typical photonic device. On an identical chip, this construction strategy allowed us to design a complex assembly of one-dimensional waveguide and resonator components for light signal filtering and optical storage toward the large-scale on-chip integration of microscopic photonic units. Thus, we have developed a scheme for soft photonic integration that may motivate further studies on organic photonic materials and devices.
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Soref, Richard. "Reconfigurable Integrated Optoelectronics." Advances in OptoElectronics 2011 (May 4, 2011): 1–15. http://dx.doi.org/10.1155/2011/627802.

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Integrated optics today is based upon chips of Si and InP. The future of this chip industry is probably contained in the thrust towards optoelectronic integrated circuits (OEICs) and photonic integrated circuits (PICs) manufactured in a high-volume foundry. We believe that reconfigurable OEICs and PICs, known as ROEICs and RPICs, constitute the ultimate embodiment of integrated photonics. This paper shows that any ROEIC-on-a-chip can be decomposed into photonic modules, some of them fixed and some of them changeable in function. Reconfiguration is provided by electrical control signals to the electro-optical building blocks. We illustrate these modules in detail and discuss 3D ROEIC chips for the highest-performance signal processing. We present examples of our module theory for RPIC optical lattice filters already constructed, and we propose new ROEICs for directed optical logic, large-scale matrix switching, and 2D beamsteering of a phased-array microwave antenna. In general, large-scale-integrated ROEICs will enable significant applications in computing, quantum computing, communications, learning, imaging, telepresence, sensing, RF/microwave photonics, information storage, cryptography, and data mining.
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Mukherjee, Amlan Kusum, Mingjun Xiang, and Sascha Preu. "Broadband Terahertz Photonic Integrated Circuit with Integrated Active Photonic Devices." Photonics 8, no. 11 (November 3, 2021): 492. http://dx.doi.org/10.3390/photonics8110492.

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Present-day photonic terahertz (100 GHz–10 THz) systems offer dynamic ranges beyond 100 dB and frequency coverage beyond 4 THz. They yet predominantly employ free-space Terahertz propagation, lacking integration depth and miniaturisation capabilities without sacrificing their extreme frequency coverage. In this work, we present a high resistivity silicon-on-insulator-based multimodal waveguide topology including active components (e.g., THz receivers) as well as passive components (couplers/splitters, bends, resonators) investigated over a frequency range of 0.5–1.6 THz. The waveguides have a single mode bandwidth between 0.5–0.75 THz; however, above 1 THz, these waveguides can be operated in the overmoded regime offering lower loss than commonly implemented hollow metal waveguides, operated in the fundamental mode. Supported by quartz and polyethylene substrates, the platform for Terahertz photonic integrated circuits (Tera-PICs) is mechanically stable and easily integrable. Additionally, we demonstrate several key components for Tera-PICs: low loss bends with radii ∼2 mm, a Vivaldi antenna-based efficient near-field coupling to active devices, a 3-dB splitter and a filter based on a whispering gallery mode resonator.
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Yi, Ailun, Chengli Wang, Liping Zhou, Yifan Zhu, Shibin Zhang, Tiangui You, Jiaxiang Zhang, and Xin Ou. "Silicon carbide for integrated photonics." Applied Physics Reviews 9, no. 3 (September 2022): 031302. http://dx.doi.org/10.1063/5.0079649.

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Photonic integrated circuits (PICs) based on lithographically patterned waveguides provide a scalable approach for manipulating photonic bits, enabling seminal demonstrations of a wide range of photonic technologies with desired complexity and stability. While the next generation of applications such as ultra-high speed optical transceivers, neuromorphic computing and terabit-scale communications demand further lower power consumption and higher operating frequency. Complementing the leading silicon-based material platforms, the third-generation semiconductor, silicon carbide (SiC), offers a significant opportunity toward the advanced development of PICs in terms of its broadest range of functionalities, including wide bandgap, high optical nonlinearities, high refractive index, controllable artificial spin defects and complementary metal oxide semiconductor-compatible fabrication process. The superior properties of SiC have enabled a plethora of nano-photonic explorations, such as waveguides, micro-cavities, nonlinear frequency converters and optically-active spin defects. This remarkable progress has prompted the rapid development of advanced SiC PICs for both classical and quantum applications. Here, we provide an overview of SiC-based integrated photonics, presenting the latest progress on investigating its basic optoelectronic properties, as well as the recent developments in the fabrication of several typical approaches for light confinement structures that form the basic building blocks for low-loss, multi-functional and industry-compatible integrated photonic platform. Moreover, recent works employing SiC as optically-readable spin hosts for quantum information applications are also summarized and highlighted. As a still-developing integrated photonic platform, prospects and challenges of utilizing SiC material platforms in the field of integrated photonics are also discussed.
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Meyer, Jerry R., Chul Soo Kim, Mijin Kim, Chadwick L. Canedy, Charles D. Merritt, William W. Bewley, and Igor Vurgaftman. "Interband Cascade Photonic Integrated Circuits on Native III-V Chip." Sensors 21, no. 2 (January 16, 2021): 599. http://dx.doi.org/10.3390/s21020599.

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We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which incorporate both the sensing waveguide and detector into a laser cavity defined by two high-reflectivity cleaved facets. We also describe an edge-emitting laser configuration that optimizes stability by minimizing parasitic feedback from external optical elements, and which can potentially operate with lower drive power than any mid-IR laser now available. While ICL-based PICs processed on GaSb serve to illustrate the various configurations, many of the proposed concepts apply equally to quantum-cascade-laser (QCL)-based PICs processed on InP, and PICs that integrate III-V lasers and detectors on silicon. With mature processing, it should become possible to mass-produce hundreds of individual PICs on the same chip which, when singulated, will realize chemical sensing by an extremely compact and inexpensive package.
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Letko, Edvins, Arturs Bundulis, and Gatis Mozolevskis. "Theoretical Development of Polymer-Based Integrated Lossy-Mode Resonance Sensor for Photonic Integrated Circuits." Photonics 9, no. 10 (October 12, 2022): 764. http://dx.doi.org/10.3390/photonics9100764.

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A promising phenomenon such as lossy-mode resonance (LMR) is of great interest in sensor applications. Until now, this phenomenon has been shown only in fibers or planar waveguides; however, given the rapid development of such an important technological area as photonic integrated circuits (PICs), it is important to transfer LMR technology specifically to PICs. In this article, we propose the theoretical development of an integrated polymer-based LMR sensor that will also contribute to the development of hybrid organic–inorganic PICs. This work theoretically shows that LMR can be achieved using polymer SU-8 waveguides on a glass substrate, on top of which TiO2 is deposited. In addition, the paper shows that multiple resonances can be achieved in the developed integrated sensor. The highest sensor sensitivity (about 1400 nm/RIU) was achieved with 40 nm of TiO2. The effect of the waveguide and coating geometries, as well as the polarizations of propagating modes, is studied in this paper.
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Borovytsky, V. M., I. I. Avdieionok, S. E. Tuzhanskyi, and H. L. Lysenko. "Photonic integrated circuits for optical matrix-vector multiplication." Optoelectronic Information-Power Technologies 43, no. 1 (December 28, 2022): 11–18. http://dx.doi.org/10.31649/1681-7893-2022-43-1-11-18.

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The article proposes a classification of photonic integrated circuits (PICs) for optical multiplication of vectors on matrices. According to this classification, such PIC can be divided into two groups. The first group combines multilayer photonic integrated circuits, in which active elements that perform multiplication are located in one layer, and optical waveguides for input and output signals are located in other layers. The second group covers planar PIC, in which active elements are placed in one layer together with optical waveguides. The article describes the construction, principles of operation of FIS of both groups and contains an analysis of their advantages and disadvantages.
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Takenaka, Mitsuru, Ziqiang Zhao, Chong Pei Ho, Takumi Fujigaki, Tipat Piyapatarakul, Yuto Miyatake, Rui Tang, Kasidit Toprasertpong, and Shinichi Takagi. "Ge-on-insulator Platform for Mid-infrared Photonic Integrated Circuits." ECS Transactions 109, no. 4 (September 30, 2022): 47–58. http://dx.doi.org/10.1149/10904.0047ecst.

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Since mid-infrared (MIR) wavelengths have a great potential for optical communication, sensing, and quantum information, Si-based MIR photonic integrated circuits (PICs) have been developed by leveraging Si photonics technology for near-infrared wavelengths. However, the transparency wavelength window of Si is from 1.2 μm to 8 μm, limiting the available wavelengths in the MIR spectrum. Ge is emerging as a waveguide material to overcome this difficulty because Ge is transparent in the entire MIR spectrum. We have developed a Ge-on-insulator (GeOI) platform for MIR integrated photonics. The strong optical confinement in a GeOI waveguide enables an ultracompact MIR PIC. Using wafer bonding and Smart-cut, a GeOI wafer was successfully fabricated. As a result, we have demonstrated various Ge passive devices, thermo-optic phase shifters, modulators, and photodetectors on a GeOI platform.
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Dissertations / Theses on the topic "Photonic Integrated Circuits (PICs)"

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Neto, Hugo Daniel Barbosa. "Packaging of photonic integrated circuits." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23552.

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Mestrado em Engenharia Eletrónica e Telecomunicações
With the continuous evolution of optical communication systems, emerged a need for high-performance optoelectronic elements at lower costs. Photonic packaging plays a key role for the next-generation of optical devices. In this work a standard packaging design rules is described, covering both the electrical and optical-packaging exploring both active and passive adjusting techniques, as well as the thermal management of the photonic integrated circuit (PIC). First a process for fiber-to-chip coupling with custom made ball-lensed fibers, is performed and tested initially in a testing-chip and thereafter in a manufactured practical study-case composed by a silicon holder with an InP distributed feedback (DFB) laser. The process of manufacturing etched V-grooves for fiber alignment is approached in detail. After this, for electrical interconnects and radio frequency (RF) packaging, both wire-bonding and flip-chip technique are discussed, and a characterization of the s-parameters in a PIC with wire-bonding is presented. A technique based on ruthenium-based sensors and platinum and titanium-based sensors for thermal control of the PIC is studied and the tested using a custom made PCB designed exclusively for that purpose.
Com a constante evolução dos sistemas de comunicação óticos veio a necessidade de componentes optoelectrónicos de elevada performance a custos relativamente baixos. O encapsulamento ótico tem um papel chave nos dispositivos óticos de última geração. Neste trabalho são descritas as regras de um processo de encapsulamento padrão, que abrange tanto o encapsulamento elétrico e ótico onde são exploradas técnicas de ajustamento ativas e passivas bem como o controlo térmico do circuito ótico integrado (PIC). No início foi efetuado um processo de acoplamento da fibra ao chip com fibras de lente esférica personalizadas, numa primeira usando um chip de teste e de seguida num caso de estudo prático que consiste numa estrutura composta por um holder de silício com um laser de realimentação distribuída (DFB). É abordado em detalhe o processo de fabricação de V-grooves para o alinhamento da fibra com o chip. De seguida são apresentadas e discutidas as técnicas de wire-bonding e flip-chip para o encapsulamento elétrico e ligação dos conectores de radiofrequência (RF), é feito um estudo onde são apresentados os resultados da caraterização dos parâmetros S de um PIC com wire-bonding. Para o controlo térmico do módulo é apresentada uma técnica baseada em sensores de temperatura de ruténio e sensores de Platina e titânio testada numa PCB personalizada
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Morgado, Tiago Manuel Coelho. "Photonic integrated circuits for use in NG-PON2 networks." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/18520.

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Mestrado em Engenharia Electrónica e Telecomunicações
Nos dias que correm com a adoção generalizada de smartphones, conteúdos de vídeo, computação em nuvem e redes sociais, o volume de tráfego não para de aumentar. Assim, existe uma procura constante para melhorar a largura de banda das redes existentes. Neste contexto surgiu a Next Generation Passive Optical Network Phase (NG-PON) 2 a qual é um novo standard que vai permitir um aumento da largura de banda que pode chegar aos 80Gbps. O conhecimento dos requisitos do standard NG-PON 2 é importante, para que se possam produzir equipamentos que possam vir a ser utilizados nestas redes. Atualmente existe uma grande evolução nas comunicações óticas. Esta evolução tecnológica levou ao aparecimento de Photonic Integrated Circuits(PICs). Os PICs permitem a integração no mesmo chip de diversos componentes óticos permitindo assim construir circuitos com maior desempenho e fiabilidade. Cada vez mais, existe um grande investimento nesta área, estão inclusivamente a aparecer softwares cujo propósito é permitir aos utilizadores criar e simular PICs, para que estes possam ser posteriormente construídos. É então importante o conhecimento das caraterísticas mais importantes dos blocos que estes softwares permitem simular. Neste trabalho serão testados alguns blocos do “VPItoolkit PDK HHI” que é um toolkit que quando adicionado no software VPItransmissionMaker™, permite simular os componentes produzidos pelo Heinrich Hertz Institute (HHI). Com estes componentes, serão ainda feitas simulações visando a sua utilização em uma rede NG-PON2. Foi também dada grande atenção ao estudo dos Multimode Interference Devices (MMI) dos quais foi feito um modelo em MATLAB. E ao mach Zehnder Modulator (MZM) do qual foi realizada uma animação a demostrar dinamicamente a propagação da Luz dentro dele. Foram ainda sugeridas duas arquiteturas possíveis para um tranceiver a ser utilizado no Optical Network Unit (ONU) em redes NG-PON 2.
Nowadays with the widespread adoption of smartphones, video content, cloud computing and social networks, the volume of traffic is constantly increasing. Therefore, it exists a constant demand to improve the bandwidth of the existing networks. In this context emerged the Next Generation Passive Optical Network Phase (NG-PON 2), which is a new standard that will allow an increase in the bandwidth up to 80 Gbps. The knowledge of the requirements of the standard NG-PON 2 is important, to allow the production of equipment that can be used in these networks. Currently there is a major evolution in optical communications. This technological evolution has led to the emergence of Photonic Integrated Circuits (PICs). By using PICs various optical components can be integrated on the same chip, allowing to build circuits with higher performance and reliability. Currently there is a large investment in this area, software whose purpose is to allow users to create and simulate PICs are starting to appear, to subsequently allow a correct manufacturing of the PICs. It is important to know the most important features of these software blocks and what do they allow to simulate. During this work some blocks from "VPItoolkit PDK HHI" will be tested. "VPItoolkit PDK HHI" is a toolkit that when added in VPItransmissionMaker ™ software allows the simulation of the components produced by the Heinrich Hertz Institute (HHI). With these components, simulations were made to test their use in a NG-PON2 network. It was also given attention to the study of the Multimode Interference Devices (MMI) from which was created a model in MATLAB. And to the Mach Zehnder Modulator (MZM) from which was made an animation to dynamically demonstrate the propagation of light inside him. It was also suggested two possible architectures for a transceiver to be used on the Optical Network Unit (ONU) in NG-PON 2 networks.
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Rodrigues, Carla Iolanda Costa. "Photonic integrated circuits for NG-EPON." Master's thesis, Universidade de Aveiro, 2016. http://hdl.handle.net/10773/22732.

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Mestrado em Engenharia Electrónica e Telecomunicações
Along with privacy and security, the growth of demand from the consumer for higher bandwidth presents one of the most important modern challenges in telecommunications infrastructures. The researchers were encouraged to nd not only e cient but also the economically viable solutions capable of meeting the growing needs of the consumer. Optical communications are the way that can accompany this growth. The Passive Optical Network (PON) is an architecture that shares the ber bandwidth among several users. There has been a constant study under this topic for the purpose of using all the ber abilities and to nd new solutions to keep the access network simple. Photonic Integrated Circuits (PICs) are a technology that emerged to help the complexity of the hardware that exists nowadays. It is a single chip capable of integrating numerous optical components, which leads to a reduced complexity, size and power consumption. These are the important characteristics that make the PICs a powerful tool to use in several applications. This dissertation presents a monolithic PIC transceiver in the context of Next Generation of Ethernet Passive Optical Network (NG-EPON) which aims to design and implement integrated optical circuits for future access networks. The transceiver architecture is able to be used as an Optical Network Unit (ONU) with a 4 channels approach for 100 Gb/s solutions. The present work contributed for the FUTPON project supported by P2020.
Em par com a privacidade e segurança, a crescente procura do consumidor por maiores larguras de banda apresenta um dos mais importantes desafios modernos das infraestruturas de telecomunicações. Esta procura incentiva assim a investigação de novas soluções não são eficientes, mas também economicamente viáveis, capazes de satisfazer as crescentes necessidades do consumidor. As comunicações óticas apresentam ser o meio apropriado para acompanhar este crescimento. A Rede Óptica Passiva (PON) e uma arquitectura usada para distribuição de fibra ótica ate ao consumidor final. Esta tecnologia permite dividir a largura de banda de uma única fibra por diferentes clientes. Tem havido um estudo constante no âmbito deste tópico para conseguir tirar máximo partido das capacidades da fibra e de modo a encontrar novas soluções para tornar este método mais simples. Os Circuitos Oticos Integrados (PIC) sao uma tecnologia que surge para ajudar na complexidade do hardware existente hoje em dia. Consiste num único chip capaz de integrar vários componentes óticos, o que leva a uma diminuição da complexidade, tamanho e redução do consumo de energia. Estas características fazem com que seja uma tecnologia vantajosa para uso em diferentes aplicações. O desenho e a implementação da arquitectura do transrecetor em formato PIC no contexto da Next Generation of Ethernet Passive Optical Network (NG-EPON), e o principal objectivo desta dissertação onde visa o desenvolvimento circuitos óticos integrados para redes oticas de acesso futuras. Esta arquitectura devera ser utilizada como Optical Network Unit (ONU) contendo 4 canais para atingir 100 Gb/s. Este trabalho contribuiu para o projecto FUTPON suportado pelo P2020.
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Franco, Eduardo Vala. "Photonic integrated circuits for next generation PONs." Master's thesis, Universidade de Aveiro, 2017. http://hdl.handle.net/10773/23473.

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Mestrado em Engenharia Eletrónica e Telecomunicação
We are living in a time where communications became essential for most of our lives, whether it's in the business world, or in our own homes. The increasing need of higher bandwidth inhibits other networks other than optical ber based ones. Nowadays communications are responsible for a substantial percentage of our energetic footprint, hence Passive Optical Network(PON) are a strong contender for the next step of network implementation. These networks present a low energy consumption because between the transmitter and the receiver the signal stays in the optical domain. Although the increasing needs of bandwidth is almost across the communication world, certain services/identities need more bandwidth whether is download or upload. It's easy to understand that di erent consumers have unique needs. It's necessary to develop an architecture that serves all the costumers, in other words, there is a need for a network that provides high bitrate tra c to the users that needs it but also a network that serves the low end user that is not interested in this increase of bandwidth and therefore price in ation. There is today technologies yet to be widely implemented like NG-PON2 that were not implemented in a large scale because they dont represent a nancial return to the telecom operators simply because there is not enough user that requires the high bandwidth delivered by NG-PON2. It's necessary to nd a solution that includes not only the modern technologies but also the already implemented ones. With the objective of nding a solution for the problems mentioned before, this dissertation has the objective of designing a Photonic Integrated Circuit(PIC) that aims to be a transceiver of a Multitech Network that will be composed by the following technologies: Video-Overlay, XG-PON e NG-PON2. This dissertation presents an approach on Passive Optical Networks( PON) and the standards of the said technologies as well as a study of the components needed to assemble the transceiver using the programs ASPIC and VPI Photonics . In the end, there will be presented an architecture for the transceiver to be used in a Optical Network Unit(ONU), and the respective mask Layout.
Vivemos numa época em que as comunicações se tornaram essenciais para grande parte da nossa vida, seja no mundo empresarial, seja nas nossas habitações. A crescente necessidade de aumento de largura de banda inviabiliza outras redes que não baseadas em braotica. Actualmente as comunicações são responsáveis por uma percentagem substancial dos nossos gastos energéticos, justamente por este facto Passive Optical Networks(PON) sao as principais candidatas ao próximo passo no desenvolvimento de redes. Estas apresentam menor consumo energético, pois entre o emissor e o receptor todo o sinal permanece no domínio óptico. Apesar da necessidade de largura de banda estar a aumentar de um modo transversal no mundo das telecomunicações, certos serviços/entidades necessitam de maiores velocidades tanto em termos de download como em termos de upload. E então fácil de perceber que consumidores diferentes têm necessidades diferentes. E necessário encontrar uma arquitectura que agrade a quem necessita de maiores larguras de banda mas também a quem não necessita de um aumento significativo e que, não está disposto a pagar por este. Existem neste momento tecnologias que ainda não foram implementadas em grandes escalas, como o caso de Next Generation Passive Optical Network (NG-PON2), porque não simbolizam um retorno financeiro para as grande operadores, uma vez que o número de potenciais consumidores de tais velocidades ainda não e substancialmente grande. E necessário encontrar uma solução que não so englobe as novas tecnologias como também as já existentes. Com o objectivo de se encontrar um solução para os problemas acima referidos, este trabalho assenta na elaboração de um Circuito integrado fotonico que visa ser um transrecetor de uma arquitetura multi-tecnologia em que irão ser incorporadas tecnologias como Video-Overlay, 10 Gigabit-capable Passive Optical Network (XG-PON) e NG-PON2. Esta dissertação apresenta uma abordagem as Redes Oticas Passivas e também um estudo feito aos componentes usados no transreceptor usando os programas Aspic e VPI Photonics . Porém ser a apresentado o desenho final do transreceptor que ser a usado numa Optical Network Unit(ONU).
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Ferreira, Ana Rita Rodrigues. "Photonic integrated circuits development: a universal transceiver for NG-PON2." Master's thesis, Universidade de Aveiro, 2015. http://hdl.handle.net/10773/15974.

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Mestrado em Engenharia Eletrónica e Telecomunicações
In the last years there has been a clear evolution in the world of telecommunications, which goes from new services that need higher speeds and higher bandwidth, until a role of interactions between people and machines, named by Internet of Things (IoT). So, the only technology able to follow this growth is the optical communications. Currently the solution that enables to overcome the day-by-day needs, like collaborative job, audio and video communications and share of les is based on Gigabit-capable Passive Optical Network (G-PON) with the recently successor named Next Generation Passive Optical Network Phase 2 (NG-PON2). This technology is based on the multiplexing domain wavelength and due to its characteristics and performance becomes the more advantageous technology. A major focus of optical communications are Photonic Integrated Circuits (PICs). These can include various components into a single device, which simpli es the design of the optical system, reducing space and power consumption, and improves reliability. These characteristics make this type of devices useful for several applications, that justi es the investments in the development of the technology into a very high level of performance and reliability in terms of the building blocks. With the goal to develop the optical networks of future generations, this work presents the design and implementation of a PIC, which is intended to be a universal transceiver for applications for NG-PON2. The same PIC will be able to be used as an Optical Line Terminal (OLT) or an Optical Network Unit (ONU) and in both cases as transmitter and receiver. Initially a study is made of Passive Optical Network (PON) and its standards. Therefore it is done a theoretical overview that explores the materials used in the development and production of this PIC, which foundries are available, and focusing in SMART Photonics, the components used in the development of this chip. For the conceptualization of the project di erent architectures are designed and part of the laser cavity is simulated using Aspic™. Through the analysis of advantages and disadvantages of each one, it is chosen the best to be used in the implementation. Moreover, the architecture of the transceiver is simulated block by block through the VPItransmissionMaker™ and it is demonstrated its operating principle. Finally it is presented the PIC implementation.
Nos últimos anos tem existido uma evidente evolução no mundo das telecomunicações, que vai desde novos serviços que requerem maiores velocidades e maior largura de banda, a um role de interações entre pessoas e máquinas, designada por Internet of Things (IoT). Assim, a única tecnologia capaz de acompanhar este crescimento são as comunicações óticas. Atualmente a solução que permite colmatar as necessidades do dia-a-dia, tais como trabalhar colaborativamente, comunicar por áudio e vídeo, e partilhar ficheiros, é baseada no Gigabit-capable Passive Optical Network (G-PON) com a mais recente evolução designada por Next Generation Passive Optical Network Phase 2 (NG-PON2). Esta tecnologia baseia-se na multiplexagem no domínio do comprimento de onda e devido às suas características e desempenho torna-se a tecnologia mais vantajosa. Um dos principais focos das comunicações óticas são os Photonic Integrated Circuits (PICs). Estes conseguem englobar num único dispositivo vários componentes, o que simplifica o desenho do sistema ótico, reduzindo o espaço e o consumo de energia e melhora a confiabilidade. Estas caracteristicas tornam este tipo de dispositivos vantajosos para uma série de aplicações, justificando os investimentos no desenvolvimento da tecnologia para um nível muito elevado de desempenho e fiabilidade ao nível dos blocos de construção. Com o objetivo de desenvolver as redes óticas passivas de futuras gerações, este trabalho apresenta o desenho e a implementação de um PIC que visa ser um transrecetor universal para aplicações para NG-PON2. O mesmo PIC pode ser usado como Optical Line Terminal (OLT) ou como Optical Network Unit (ONU) e em ambos os casos como transmissor e recetor. Inicialmente é feito um estudo das redes óticas passivas e os seus standards. Seguidamente é feita uma abordagem teórica que explora um pouco dos materiais usados no desenvolvimento e produção de um PIC, quais as fábricas existentes, focando na SMART Photonics e os componentes usados no desenvolvimento deste chip. Com vista à concetualização do projeto, diferentes arquiteturas são desenhadas e a parte da cavidade do laser é simulada usando o Aspic™. Partindo da análise das vantagens e desvantagens de cada uma delas, é escolhida a melhor para utilizar na implementação. De seguida, a arquitetura do transrecetor é simulada bloco a bloco através do VPItransmissionMaker™ e é demonstrado o seu princípio de funcionamento. Finalmente é apresentada a implementação do PIC.
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Piqueras, Ruipérez Miguel Ángel. "Photonic Vector Processing Techniques for Radiofrequency Signals." Doctoral thesis, Universitat Politècnica de València, 2016. http://hdl.handle.net/10251/63264.

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[EN] The processing of radiofrequency signals using photonics means is a discipline that appeared almost at the same time as the laser and the optical fibre. Photonics offers the capability of managing broadband radiofrequency (RF) signals thanks to its low transmission attenuation, a variety of linear and non-linear phenomena and, recently, the potential to implement integrated photonic subsystems. These features open the door for the implementation of multiple functionalities including optical transportation, up and down frequency conversion, optical RF filtering, signal multiplexing, de-multiplexing, routing and switching, optical sampling, tone generation, delay control, beamforming and photonic generation of digital modulations, and even a combination of several of these functionalities. This thesis is focused on the application of vector processing in the optical domain to radiofrequency signals in two fields of application: optical beamforming, and photonic vector modulation and demodulation of digital quadrature amplitude modulations. The photonic vector control enables to adjust the amplitude and phase of the radiofrequency signals in the optical domain, which is the fundamental processing that is required in different applications such as beamforming networks for direct radiating array (DRA) antennas and multilevel quadrature modulation. The work described in this thesis include different techniques for implementing a photonic version of beamforming networks for direct radiating arrays (DRA) known as optical beamforming networks (OBFN), with the objectives of providing a precise control in terrestrial applications of broadband signals at very high frequencies above 40 GHz in communication antennas, optimizing the size and mass when compared with the electrical counterparts in space application, and presenting new photonic-based OBFN functionalities. Thus, two families of OBFNs are studied: fibre-based true time delay architectures and integrated networks. The first allow the control of broadband signals using dispersive optical fibres with wavelength division multiplexing techniques and advanced functionalities such as direction of arrival estimation in receiving architectures. In the second, passive OBFNs based on monolithically-integrated Optical Butler Matrices are studied, including an ultra-compact solution using optical heterodyne techniques in silicon-on-insulator (SOI) material, and an alternative implementing a homodyne counterpart in germanium doped silica material. In this thesis, the application of photonic vector processing to the generation of quadrature digital modulations has also been investigated. Multilevel modulations are based on encoding digital information in discrete states of phase and amplitude of an electrical signal to enhance spectral efficiency, as for instance, in quadrature modulation. The signal process required for generating and demodulating this kind of signals involves vector processing (phase and amplitude control) and frequency conversion. Unlike the common electronic or digital implementation, in this thesis, different photonic based signal processing techniques are studied to produce digital modulation (photonic vector modulation, PVM) and demodulation (PVdM). These techniques are of particular interest in the case of broadband signals where the data rate required to be managed is in the order of gigabit per second, for applications like wireless backhauling of metro optical networks (known as fibre-to-the-air). The techniques described use optical dispersion in optical fibres, wavelength division multiplexing and photonic up/down conversion. Additionally, an optical heterodyne solution implemented monolithically in a photonic integrated circuit (PIC) is also described.
[ES] El procesamiento de señales de radiofrecuencia (RF) utilizando medios fotónicos es una disciplina que apareció casi al mismo tiempo que el láser y la fibra óptica. La fotónica ofrece la capacidad de manipular señales de radiofrecuencia de banda ancha, una baja atenuación, procesados basados en una amplia variedad de fenómenos lineales y no lineales y, recientemente, el potencial para implementar subsistemas fotónicos integrados. Estas características ofrecen un gran potencial para la implementación de múltiples funcionalidades incluyendo transporte óptico, conversión de frecuencia, filtrado óptico de RF, multiplexación y demultiplexación de señales, encaminamiento y conmutación, muestreo óptico, generación de tonos, líneas de retardo, conformación de haz en agrupaciones de antenas o generación fotónica de modulaciones digitales, e incluso una combinación de varias de estas funcionalidades. Esta tesis se centra en la aplicación del procesamiento vectorial en el dominio óptico de señales de radiofrecuencia en dos campos de aplicación: la conformación óptica de haces y la modulación y demodulación vectorial fotónica de señales digitales en cuadratura. El control fotónico vectorial permite manipular la amplitud y fase de las señales de radiofrecuencia en el dominio óptico, que es el procesamiento fundamental que se requiere en diferentes aplicaciones tales como las redes de conformación de haces para agrupaciones de antenas y en la modulación en cuadratura. El trabajo descrito en esta tesis incluye diferentes técnicas para implementar una versión fotónica de las redes de conformación de haces de en agrupaciones de antenas, conocidas como redes ópticas de conformación de haces (OBFN). Se estudian dos familias de redes: arquitecturas de retardo en fibra óptica y arquitecturas integradas. Las primeras permiten el control de señales de banda ancha utilizando fibras ópticas dispersivas con técnicas de multiplexado por división de longitud de onda y funcionalidades avanzadas tales como la estimación del ángulo de llegada de la señal en la antena receptora. En la segunda, se estudian redes de conformación pasivas basadas en Matrices de Butler ópticas integradas, incluyendo una solución ultra-compacta utilizando técnicas ópticas heterodinas en silicio sobre aislante (SOI), y una alternativa homodina en sílice dopado con germanio. En esta tesis, también se han investigado técnicas de procesado vectorial fotónico para la generación de modulaciones digitales en cuadratura. Las modulaciones multinivel codifican la información digital en estados discretos de fase y amplitud de una señal eléctrica para aumentar su eficiencia espectral, como por ejemplo la modulación en cuadratura. El procesado necesario para generar y demodular este tipo de señales implica el procesamiento vectorial (control de amplitud y fase) y la conversión de frecuencia. A diferencia de la implementación electrónica o digital convencional, en esta tesis se estudian diferentes técnicas de procesado fotónico tanto para la generación de modulaciones digitales (modulación vectorial fotónica, PVM) como para su demodulación (PVdM). Esto es de particular interés en el caso de señales de banda ancha, donde la velocidad de datos requerida es del orden de gigabits por segundo, para aplicaciones como backhaul inalámbrico de redes ópticas metropolitanas (conocida como fibra hasta el aire). Las técnicas descritas se basan en explotar la dispersión cromática de la fibra óptica, la multiplexación por división de longitud de onda y la conversión en frecuencia. Además, se presenta una solución heterodina implementada monolíticamente en un circuito integrado fotónico (PIC).
[CAT] El processament de senyals de radiofreqüència (RF) utilitzant mitjans fotònics és una disciplina que va aparèixer gairebé al mateix temps que el làser i la fibra òptica. La fotònica ofereix la capacitat de manipular senyals de radiofreqüència de banda ampla, una baixa atenuació, processats basats en una àmplia varietat de fenòmens lineals i no lineals i, recentment, el potencial per implementar subsistemes fotònics integrats. Aquestes característiques ofereixen un gran potencial per a la implementació de múltiples funcionalitats incloent transport òptic, conversió de freqüència, filtrat òptic de RF, multiplexació i demultiplexació de senyals, encaminament i commutació, mostreig òptic, generació de tons, línies de retard, conformació de feix en agrupacions d'antenes i la generació fotònica de modulacions digitals, i fins i tot una combinació de diverses d'aquestes funcionalitats. Aquesta tesi es centra en l'aplicació del processament vectorial en el domini òptic de senyals de radiofreqüència en dos camps d'aplicació: la conformació òptica de feixos i la modulació i demodulació vectorial fotònica de senyals digitals en quadratura. El control fotònic vectorial permet manipular l'amplitud i la fase dels senyals de radiofreqüència en el domini òptic, que és el processament fonamental que es requereix en diferents aplicacions com ara les xarxes de conformació de feixos per agrupacions d'antenes i en modulació multinivell. El treball descrit en aquesta tesi inclou diferents tècniques per implementar una versió fotònica de les xarxes de conformació de feixos en agrupacions d'antenes, conegudes com a xarxes òptiques de conformació de feixos (OBFN), amb els objectius de proporcionar un control precís en aplicacions terrestres de senyals de banda ampla a freqüències molt altes per sobre de 40 GHz en antenes de comunicacions, optimitzant la mida i el pes quan es compara amb els homòlegs elèctrics en aplicacions espacials, i la presentació de noves funcionalitats fotòniques per agrupacions d'antenes. Per tant, s'estudien dues famílies de OBFNs: arquitectures de retard en fibra òptica i arquitectures integrades. Les primeres permeten el control de senyals de banda ampla utilitzant fibres òptiques dispersives amb tècniques de multiplexació per divisió en longitud d'ona i funcionalitats avançades com ara l'estimació de l'angle d'arribada del senyal a l'antena receptora. A la segona, s'estudien xarxes de conformació passives basades en Matrius de Butler òptiques en fotònica integrada, incloent una solució ultra-compacta utilitzant tècniques òptiques heterodinas en silici sobre aïllant (SOI), i una alternativa homodina en sílice dopat amb germani. D'altra banda, també s'ha investigat en aquesta tesi tècniques de processament vectorial fotònic per a la generació de modulacions digitals en quadratura. Les modulacions multinivell codifiquen la informació digital en estats discrets de fase i amplitud d'un senyal elèctric per augmentar la seva eficiència espectral, com ara la modulació en quadratura. El processat necessari per generar i desmodular aquest tipus de senyals implica el processament vectorial (control d'amplitud i fase) i la conversió de freqüència. A diferència de la implementació electrònica o digital convencional, en aquesta tesi s'estudien diferents tècniques de processament fotònic tant per a la generació de modulacions digitals (modulació vectorial fotònica, PVM) com per la seva demodulació (PVdM). Això és de particular interès en el cas de senyals de banda ampla, on la velocitat de dades requerida és de l'ordre de gigabits per segon, per a aplicacions com backhaul sense fils de xarxes òptiques metropolitanes (coneguda com fibra fins l'aire). Les tècniques descrites es basen en explotar la dispersió cromàtica de la fibra òptica, la multiplexació per divisió en longitud d'ona i la conversió en freqüència. A més, es prese
Piqueras Ruipérez, MÁ. (2016). Photonic Vector Processing Techniques for Radiofrequency Signals [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/63264
TESIS
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Chong, Harold Meng Hoon. "Photonic crystal and photonic wire structures for photonic integrated circuits." Thesis, University of Glasgow, 2004. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.407719.

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Marinins, Aleksandrs. "Polymer Components for Photonic Integrated Circuits." Doctoral thesis, KTH, Skolan för teknikvetenskap (SCI), 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-219556.

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Optical polymers are a subject of research and industry implementation for many decades. Optical polymers are inexpensive, easy to process and flexible enough to meet a broad range of application-specific requirements. These advantages allow a development of cost-efficient polymer photonic integrated circuits for on-chip optical communications. However, low refractive index contrast between core and cladding limits light confinement in a core and, consequently, integrated polymer device miniaturization. Also, polymers lack active functionality like light emission, amplification, modulation, etc. In this work, we improved a performance of integrated polymer waveguides and demonstrated active waveguide devices. Also, we present novel Si QD/polymer optical materials. In the integrated device part, we demonstrate optical waveguides with enhanced performance. Decreased radiation losses in air-suspended curved waveguides allow low-loss bending with radii of only 15 µm, which is far better than >100 µm for typical polymer waveguides. Another study shows a positive effect of thermal treatment on acrylate waveguides. By heating higher than polymer glass transition temperature, surface roughness is reflown, minimizing scattering losses. This treatment method enhances microring resonator Q factor more than 2 times. We also fabricated and evaluated all-optical intensity modulator based on PMMA waveguides doped with Si QDs. We developed novel hybrid optical materials. Si QDs are encapsulated into PMMA and OSTE polymers. Obtained materials show stable photoluminescence with high quantum yield. We achieved the highest up to date ~65% QY for solid-state Si QD composites. Demonstrated materials are a step towards Si light sources and active devices. Integrated devices and materials presented in this work enhance the performance and expand functionality of polymer PICs. The components described here can also serve as building blocks for on-chip sensing applications, microfluidics, etc.

QC 20171207

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Alipour, Motaallem Seyed Payam. "Reconfigurable integrated photonic circuits on silicon." Diss., Georgia Institute of Technology, 2014. http://hdl.handle.net/1853/51792.

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Integrated optics as a platform for signal processing offers significant benefits such as large bandwidth, low loss, and a potentially high degree of reconfigurability. Silicon (Si) has unique advantages as a material platform for integration, as well as properties such as a strong thermo-optic mechanism that allows for the realization of highly reconfigurable photonic systems. Chapter 1 is devoted to the discussion of these advantages, and Chapter 2 provides the theoretical background for the analysis of integrated Si-photonic devices. The thermo-optic property of Si, while proving extremely useful in facilitating reconfiguration, can turn into a nuisance when there is a need for thermally stable devices on the photonic chip. Chapter 3 presents a technique for resolving this issue without relying on a dynamic temperature stabilization process. Temperature-insensitive (or “athermal”) Si microdisk resonators with low optical loss are realized by using a polymer overlayer whose thermo-optic property is opposite to that of Si, and TiO2 is introduced as an alternative to polymer to deal with potential CMOS-compatibility issues. Chapter 4 demonstrates an ultra-compact, low-loss, fully reconfigurable, and high-finesse integrated photonic filter implemented on a Si chip, which can be used for RF-photonic as well as purely optical signal processing purposes. A novel, thermally reconfigurable reflection suppressor is presented in Chapter 5 for on-chip feedback elimination which can be critical for mitigating spurious interferences and protecting lasers from disturbance. Chapter 6 demonstrates a novel device for on-chip control of optical fiber polarization. Chapter 7 deals with select issues in the implementation of Si integrated photonic circuits. Chapter 8 concludes the dissertation.
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Liu, Weilin. "Ultra-Fast Photonic Signal Processors Based on Photonic Integrated Circuits." Thesis, Université d'Ottawa / University of Ottawa, 2017. http://hdl.handle.net/10393/36446.

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Photonic signal processing has been considered a promising solution to overcome the inherent bandwidth limitations of its electronic counterparts. Over the last few years, an impressive range of photonic integrated signal processors have been proposed with the technological advances of III-V and silicon photonics, but the signal processors offer limited tunability or reconfigurability, a feature highly needed for the implementation of programmable photonic signal processors. In this thesis, tunable and reconfigurable photonic signal processors are studied. Specifically, a photonic signal processor based on the III-V material system having a single ring resonator structure for temporal integration and Hilbert transformation with a tunable fractional order and tunable operation wavelength is proposed and experimentally demonstrated. The temporal integrator has an integration time of 6331 ps, which is an order of magnitude longer than that provided by the previously reported photonic integrators. The processor can also provide a continuously tunable fractional order and a tunable operation wavelength. To enable general-purpose signal processing, a reconfigurable photonic signal processor based on the III-V material system having a three-coupled ring resonator structure is proposed and experimentally demonstrated. The reconfigurability of the processor is achieved by forward or reverse biasing the semiconductor optical amplifiers (SOAs) in the ring resonators, to change the optical geometry of the processor which allows the processor to perform different photonic signal processing functions including temporal integration, temporal differentiation, and Hilbert transformation. The integration time of the signal processor is measured to be 10.9 ns, which is largely improved compared with the single ring resonator structure due to a higher Q-factor. In addition, 1st, 2nd, and 3rd of temporal integration operations are demonstrated, as well as a continuously tunable order for differentiation and Hilbert transformation. The tuning range of the operation wavelength is 0.22 nm for the processor to perform the three functions. Compared with the III-V material system, the CMOS compatible SOI material system is more cost effective, and it offers a smaller footprint due to the strong refractive index contrast between silicon and silica. Active components such as phase modulators (PMs) can also be implemented. In this thesis, two photonic temporal differentiators having an interferometer structure to achieve active and passive fractional order tuning are proposed and experimentally demonstrated. For both the active and passive temporal differentiators, the fractional order can be tuned from 0 to 1. For the active temporal differentiator, the tuning range of the operation wavelength is 0.74 nm. The use of the actively tunable temporal differentiator to perform high speed coding with a data rate of 16 Gbps is also experimentally demonstrated.
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Books on the topic "Photonic Integrated Circuits (PICs)"

1

Lacoursiere, Catherine. Photonic integrated circuits: New directions. Norwalk, CT: Business Communications Co., 2005.

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Lacoursiere, Catherine. Photonic integrated circuits: New directions. Norwalk, CT: Business Communications Co., 2002.

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Osgood, Richard, and Xiang Meng. Principles of Photonic Integrated Circuits. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-65193-0.

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Corzine, S. W. (Scott W.) and Mashanovitch Milan 1974-, eds. Diode lasers and photonic integrated circuits. 2nd ed. Hoboken, N.J: Wiley, 2012.

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W, Corzine S., ed. Diode lasers and photonic integrated circuits. New York: Wiley, 1995.

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Coldren, Larry A., Scott W. Corzine, and Milan L. Mašanović. Diode Lasers and Photonic Integrated Circuits. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118148167.

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1932-, Suematsu Yasuharu, and Adams A. R, eds. Handbook of semiconductor lasers and photonic integrated circuits. Tokyo: Chapman & Hall, 1994.

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Righini, Giancarlo C. Silicon photonics and photonic integrated circuits: 7-10 April 2008, Strasbourg, France. Bellingham, Wash: SPIE, 2008.

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Righini, Giancarlo C. Silicon photonics and photonic integrated circuits: 7-10 April 2008, Strasbourg, France. Edited by SPIE Europe, Alsace international, Association française des industries de l'optique et de la photonique, and SPIE (Society). Bellingham, Wash: SPIE, 2008.

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Vivien, Laurent. Silicon photonics and photonic integrated circuits III: 16-19 April 2012, Brussels, Belgium. Edited by SPIE (Society), B.-PHOT-Brussels Photonics Team, and Comité belge d'optique. Bellingham, Washington: SPIE, 2012.

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Book chapters on the topic "Photonic Integrated Circuits (PICs)"

1

Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Interconnects." In Integrated Circuits and Systems, 11–26. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_2.

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Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Network Architectures III: Advanced Photonic Architectures." In Integrated Circuits and Systems, 173–202. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_7.

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Muller, Paul, and Yusuf Leblebici. "Integrated Photonic Systems." In Analog Circuits and Signal Processing, 5–11. Dordrecht: Springer Netherlands, 2007. http://dx.doi.org/10.1007/978-1-4020-5912-4_2.

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Baets, Roel, Wim Bogaerts, Bart Kuyken, Abdul Rahim, Günther Roelkens, Thijs Spuesens, Joris Van Campenhout, and Dries Van Thourhout. "Silicon Photonic Integrated Circuits." In Springer Series in Optical Sciences, 673–737. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-42367-8_14.

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Asakawa, K., and K. Inoue. "Application to Ultrafast Optical Planar Integrated Circuits." In Photonic Crystals, 261–84. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. http://dx.doi.org/10.1007/978-3-540-40032-5_12.

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Zimmermann, Horst. "Circuits for Electronic-Photonic Integration." In Silicon Optoelectronic Integrated Circuits, 407–33. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-05822-7_7.

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Bergman, Keren, Luca P. Carloni, Aleksandr Biberman, Johnnie Chan, and Gilbert Hendry. "Photonic Simulation and Design Space." In Integrated Circuits and Systems, 79–99. New York, NY: Springer New York, 2013. http://dx.doi.org/10.1007/978-1-4419-9335-9_4.

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Wakao, Kiyohide. "Optoelectronic and Photonic Integrated Circuits." In Waveguide Optoelectronics, 205–23. Dordrecht: Springer Netherlands, 1992. http://dx.doi.org/10.1007/978-94-011-1834-7_10.

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Agrawal, Govind P., and Niloy K. Dutta. "Photonic and Optoelectronic Integrated Circuits." In Semiconductor Lasers, 530–46. Boston, MA: Springer US, 1993. http://dx.doi.org/10.1007/978-1-4613-0481-4_12.

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Koren, Uziel. "Waveguide Based Photonic Integrated Circuits." In Optoelectronic Integration: Physics, Technology and Applications, 233–72. Boston, MA: Springer US, 1994. http://dx.doi.org/10.1007/978-1-4615-2686-5_7.

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Conference papers on the topic "Photonic Integrated Circuits (PICs)"

1

Coldren, Larry A. "High-Performance Photonic Integrated Circuits (PICs)." In Optical Fiber Communication Conference. Washington, D.C.: OSA, 2010. http://dx.doi.org/10.1364/ofc.2010.owd1.

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Pruessner, Marcel W., Todd H. Stievater, Nathan F. Tyndall, Dmitry A. Kozak, and William S. Rabinovich. "A MEMS-Tunable Polarization Rotator for PICs." In Integrated Photonics Research, Silicon and Nanophotonics. Washington, D.C.: Optica Publishing Group, 2022. http://dx.doi.org/10.1364/iprsn.2022.im4b.6.

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We describe a micromechanically-tunable polarization rotator for photonic integrated circuits. A suspended micro-mechanical (MEMS) beam enables symmetry-breaking mode perturbation and polarization rotation. Vertical actuation results in tunable rotation over 90 degrees and full TE-TM conversion.
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Juodawlkis, Paul W., Jason J. Plant, Mark A. Hollis, Douglas C. Oakley, Antonio Napoleone, William Loh, Jonathan Klamkin, Frederick J. O'Donnell, and Sivasubramaniam Yegnanarayanan. "Slab-coupled optical waveguide (SCOW) devices and photonic integrated circuits (PICs)." In 2013 IEEE Photonics Conference (IPC). IEEE, 2013. http://dx.doi.org/10.1109/ipcon.2013.6656496.

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Hickey, Se´amus, Jeff Punch, John Daly, and Nicholas Jeffers. "The Influence of Heat Spreading on the Thermal Control of Photonics Integrated Circuits." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-63697.

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Photonics Integrated Circuits (PICs), a feature of contemporary optical communications technologies, can represent a stringent packaging challenge, particularly in terms of their requirements for thermal control. Devices such as laser arrays can demonstrate tight temperature limits, sub-ambient operating temperatures, moderate heat loads but high device-level heat fluxes. A key feature of many hybrid PICs is a multilayer substrate which offers mechanical support, electrical interconnection and heat spreading for the devices that it carries; such substrates are typically mounted on a thermoelectric (TE) module (TEM) to achieve thermal control. The objective of this paper is to examine the influence of heat spreader structures on the thermal behavior of PICs, with particular attention on maximizing TEM efficiency. To this end, closed-form analytical and numerical models are developed for a representative laser array PIC which captures the conductive heat transfer within the spreader, coupled with a constitutive representation of the TEM. A parametric study is conducted to illustrate the influence of the following parameters on the source temperature of the PIC for the application: effective conductivities and dimensions of the heat spreader; thermal interface resistances; and thermal resistance between the TEM and the ambient. The outcome of the paper is an enhanced understanding of the role of heat spreading in the stable and efficient operation of contemporary PICs. This paper represents the initial results of an extensive programme of work on packaging-related aspects of next-generation PICs.
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Arellano, C., S. Mingaleev, I. Koltchanov, A. Richter, J. Pomplun, S. Burger, and F. Schmidt. "Efficient design of photonic integrated circuits (PICs) by combining device- and circuit- level simulation tools." In SPIE OPTO, edited by Jean Emmanuel Broquin and Gualtiero Nunzi Conti. SPIE, 2013. http://dx.doi.org/10.1117/12.2004378.

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Krishnamurthy, Vivek, Koustuban Ravi, and Seng-Tiong Ho. "Novel design framework for photonic integrated circuits (PICs) with active and passive sections." In International Conference on Fibre Optics and Photonics. Washington, D.C.: OSA, 2012. http://dx.doi.org/10.1364/photonics.2012.m2c.3.

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Arellano, C., S. Mingaleev, E. Sokolov, I. Koltchanov, and A. Richter. "Design of complex large-scale photonic integrated circuits (PICs) based on ring-resonator structures." In SPIE OPTO, edited by Bernd Witzigmann, Fritz Henneberger, Yasuhiko Arakawa, and Alexandre Freundlich. SPIE, 2011. http://dx.doi.org/10.1117/12.874711.

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Carver, Christian, Austen Probst, Benjamin Arnesen, Benjamin Fisher, Tyler Stowell, and Ryan M. Camacho. "Device-Aware Quantum Photonic Simulator for Gaussian States." In Frontiers in Optics. Washington, D.C.: Optica Publishing Group, 2022. http://dx.doi.org/10.1364/fio.2022.jtu4a.32.

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We demonstrate the ability to simulate Gaussian quantum photonic circuits using compact models of real devices and open-source PIC simulation tools. This allows rapid iteration of integrated quantum photonic circuit designs before fabrication.
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Richardson, Niamh, Jeff Punch, Eric Dalton, and Marian Carroll. "IR imaging of laser structures for thermal control of Photonics Integrated circuits (PICs)." In 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, 2017. http://dx.doi.org/10.1109/eurosime.2017.7926228.

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Daunis, Trey B., Jennifer C. Dussor, Bach Le, Kimari Hodges, Kevin P. Clark, Dennis I. Robbins, and Katy Roodenko. "Towards infrared photonic integrated circuits (PICs) in biochemical analysis: implementation of quantum cascade lasers (QCLs) in analysis of fluids." In Optical Fibers and Sensors for Medical Diagnostics, Treatment and Environmental Applications XXII, edited by Israel Gannot and Katy Roodenko. SPIE, 2022. http://dx.doi.org/10.1117/12.2615367.

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Reports on the topic "Photonic Integrated Circuits (PICs)"

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Sullivan, C. T. GaAs Photonic Integrated Circuit (PIC) development for high performance communications. Office of Scientific and Technical Information (OSTI), March 1998. http://dx.doi.org/10.2172/607505.

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Shakouri, Ali, Bin Liu, Patrick Abraham, and John E. Bowers. 3D Photonic Integrated Circuits for WDM Applications. Fort Belvoir, VA: Defense Technical Information Center, January 1998. http://dx.doi.org/10.21236/ada461796.

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Adibi, Ali. PECASE: All-Optical Photonic Integrated Circuits in Silicon. Fort Belvoir, VA: Defense Technical Information Center, January 2011. http://dx.doi.org/10.21236/ada559908.

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Englund, Dirk, Karl Berggren, Jeffrey Shapiro, Chee W. Wong, Franco Wong, and Gregory Wornell. High-Speed Quantum Key Distribution Using Photonic Integrated Circuits. Fort Belvoir, VA: Defense Technical Information Center, January 2013. http://dx.doi.org/10.21236/ada606948.

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Englund, Dirk, Karl Berggren, Jeffrey Shapiro, Chee W. Wong, Franco Wong, and Gregory Wornell. High-Speed Large-Alphabet Quantum Key Distribution Using Photonic Integrated Circuits. Fort Belvoir, VA: Defense Technical Information Center, January 2014. http://dx.doi.org/10.21236/ada603763.

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