Relevant bibliographies by topics / Packing, 1953

Academic literature on the topic 'Packing, 1953'

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Published: 26 July 2024
Last updated: 28 July 2024

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Journal articles on the topic "Packing, 1953"

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Pirogov, Andrey V., Marina V. Chernova, Dar'ya S. Nemtseva, and Oleg A. Shpigun. "Sulfonated and sulfoacylated poly(styrene?divinylbenzene) copolymers as packing materials for cation chromatography." Analytical and Bioanalytical Chemistry 376, no. 5 (July 1, 2003): 745–52. http://dx.doi.org/10.1007/s00216-003-1953-7.

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Heyding, R. D., K. E. Russell, T. L. Varty, and D. St-Cyr. "The Normal Paraffins Revisited." Powder Diffraction 5, no. 2 (June 1990): 93–100. http://dx.doi.org/10.1017/s0885715600015414.

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The low temperature modifications of the normal paraffins n-CnH2n+2crystallize in three groups (Broadhurst, 1962). The structure is triclinic for n even, 6 < n < 26 (Muller and Lonsdale, 1948; Nyburg and Luth, 1972); orthorhombic for n odd, 11 < n < 39 (Smith, 1953; Teare, 1959); and monoclinic for n even, 28 < n < 36 (Shearer and Vand, 1956). In all of these structures the hydrocarbon chains are linear and in trans configuration. The chains are parallel to one another, the terminal methyl groups forming the surfaces of lamella which are more or less perpendicular to the chain axis. For n < ca.36, it is apparently the interlamellar interaction between end methyl groups which dictates the symmetry. For longer chains the structure is usually orthorhombic and comparable to the structure of highly crystalline polyethylenes. Chains do not fold (as they undoubtedly do in polyethylenes) unless n is greater than 102 (Bidd and Whiting, 1985; Ungar and Keller, 1986).The several crystal forms differ in the manner in which the nearest neighbor chains are related to one another. In the triclinic lattices the packing is such that a triclinic sublattice containing one methylene group is evident. In the other modifications the sublattice is orthorhombic and contains four methylene groups. If the overall symmetry is orthorhombic the long chain axes are perpendicular to the interlamellar surface; the x and y translations, perpendicular to the long axis, are common to both cells. If the nearest neighbor chains are displaced by two or four methylene groups along the chain axis, overall monoclinic symmetry results (Sullivan and Weeks (1970)).
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Mitchell, Rory, Eibe Frank, and Geoffrey Holmes. "GPUTreeShap: massively parallel exact calculation of SHAP scores for tree ensembles." PeerJ Computer Science 8 (April 5, 2022): e880. http://dx.doi.org/10.7717/peerj-cs.880.

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SHapley Additive exPlanation (SHAP) values (Lundberg & Lee, 2017) provide a game theoretic interpretation of the predictions of machine learning models based on Shapley values (Shapley, 1953). While exact calculation of SHAP values is computationally intractable in general, a recursive polynomial-time algorithm called TreeShap (Lundberg et al., 2020) is available for decision tree models. However, despite its polynomial time complexity, TreeShap can become a significant bottleneck in practical machine learning pipelines when applied to large decision tree ensembles. Unfortunately, the complicated TreeShap algorithm is difficult to map to hardware accelerators such as GPUs. In this work, we present GPUTreeShap, a reformulated TreeShap algorithm suitable for massively parallel computation on graphics processing units. Our approach first preprocesses each decision tree to isolate variable sized sub-problems from the original recursive algorithm, then solves a bin packing problem, and finally maps sub-problems to single-instruction, multiple-thread (SIMT) tasks for parallel execution with specialised hardware instructions. With a single NVIDIA Tesla V100-32 GPU, we achieve speedups of up to 19× for SHAP values, and speedups of up to 340× for SHAP interaction values, over a state-of-the-art multi-core CPU implementation executed on two 20-core Xeon E5-2698 v4 2.2 GHz CPUs. We also experiment with multi-GPU computing using eight V100 GPUs, demonstrating throughput of 1.2 M rows per second—equivalent CPU-based performance is estimated to require 6850 CPU cores.
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Mante-Khurpade, Jyoti, Megha Dhotay, Prerna Patil, Sanjivani Kulkarni, Shilpa Budhavale, and Sharayu Ikhar. "Enhancing data privacy in wireless sensor network using homomorphic encryption." Journal of Discrete Mathematical Sciences and Cryptography 27, no. 2-B (2024): 833–42. http://dx.doi.org/10.47974/jdmsc-1959.

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From environmental monitoring to healthcare, WSN are essential. The extensive use of these networks to gather sensitive data requires strong data privacy mechanisms. Cryptographic homomorphic encryption may solve this problem. This study uses CKKS encryption and ciphertext packing to improve Wireless Sensor Network data privacy. CKKS is a fully homomorphic encryption scheme that allows complex data operations. This makes it ideal for data analytics and computations. Ciphertext packing improves computational efficiency, making this combination a good choice for data protection in WSN environments with limited resources. Performance efficiency is crucial to evaluation. This parameter evaluates CKKS encryption with ciphertext packing’s computational resource and execution time efficiency. This study examines how this approach affects WSN node and network performance, revealing its feasibility and practicality in real-world situations. The Data Security parameter highlights CKKS encryption with ciphertext packing’s data security. This comprehensive assessment determines data confidentiality and integrity in the Wireless Sensor Network. The system’s ability to withstand data breaches and unauthorized access is crucial for protecting sensitive data. Any WSN solution must consider energy consumption. This parameter evaluates data encryption and processing energy usage, taking sensor node energy constraints into account. The assessment of CKKS encryption with ciphertext packing in WSN sheds light on its potential to improve data confidentiality while addressing WSN challenges. This research strengthens WSN data protection efforts and lays the groundwork for future advances in this vital field.
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Neale, Nathan R. "Packing heat." Nature Chemistry 6, no. 5 (April 22, 2014): 385–86. http://dx.doi.org/10.1038/nchem.1933.

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Dzarnoski, John, and Susie Johansson. "Embedding Active and Passive Devices in Medical Electronics." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000786–814. http://dx.doi.org/10.4071/2014dpc-tp16.

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Efforts to increase the packaging efficiency of microelectronic systems have been extensive and continuous over the past few decades. Evidence of this can be seen even before the expansion of the space program by the United States in 1961 and the race to the moon; one of the first settings where size was truly limited and miniaturization of electronics was a necessity. In the 1950's the world saw its first major size reduction of electronic component with the phase out of the vacuum tube in favor of the transistor. The transistor saw its first major commercial use in 1952 via hybrid vacuum tube transistor technology. While many industries benefitted from the shift, in 1954 the hearing aid industry specifically experienced major improvements owing to the implementation of transistors, becoming smaller, requiring less power and having better functionality. The first 4-transistor AM radio product followed shortly thereafter. Much of today's effort since 1978 has been driven by the telecommunications industry that has succeeded in reducing cell phone size while simultaneously increasing functionality. Just as in the 1950's, hearing aid technology continues to be at the forefront when it comes to miniaturization. The hearing aid business has always had the need to use extremely small electronic packaging. The first completely in the canal (CIC) hearing aids were produced in 1993 and required all electronic components to be small enough that they fit entirely inside the ear canal. The introduction of wireless systems into hearing aids has sharply increased component count. Due to the size and shape of a multitude of types of hearing aids, flexible circuits need to be folded and bent to fit inside hearing aid cases, with essentially all available space being used. More powerful processors and more memory are enabling sophisticated algorithms that are able to greatly improve sound quality. There is also a strong market desire to add more features to hearing products while at the same time making them smaller and less visible. The latest hearing aids have succeeded in the later demand, constructed so small they are not visible and consequently are called invisible in the canal (IIC). In order to continue meeting the markets want for smaller and more features, a new packaging method needed to be developed. One such option is embedded die packaging. This paper will examine the use of embedded die packaging (or chip-in-flex) to drive significant further size reduction in custom and standard hearing instruments over what can be achieved using chip-on-flex or traditional ceramic hybrid based technologies. The historical drivers, available circuit board technologies, use of integrated passive devices, performance improvement, size reduction, device reliability, changes in supply chain, impact on wafer test, impact on device test, and challenges of working with wafers instead of die will be discussed.
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Chang, Ning Jennifer. "Vertical Integration, Business Diversification, and Firm Architecture: The Case of the China Egg Produce Company in Shanghai, 1923–1950." Enterprise & Society 6, no. 3 (September 2005): 419–51. http://dx.doi.org/10.1017/s1467222700014610.

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This article is a case study of a Chinese indigenous firm in the refrigerated egg-packing industry during the interwar period. I argue that the China Egg Produce Company (CEPC) was quick to grasp Western management in terms of vertical integration and business diversification. In addition, this firm took advantage of embedded social relations and social networks to construct a strong “internal architecture.” As a result, CEPC not only rivaled some six to eight British and American enterprises, but also took the lead in persuading them to form an international cartel during the 1930s. The data presented in this case study shows the surprising vitality and adaptability of Chinese businesses and suggests that China was in the process of developing a modern business system prior to the chaotic events of the late 1940s.
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Cowan, Richard. "A constraint on the random packing of disks." Journal of Applied Probability 30, no. 1 (March 1993): 263–68. http://dx.doi.org/10.2307/3214639.

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This paper addresses random packing of equal-sized disks in a manner such that no disk has a gap on its circumference large enough to accommodate an extra touching neighbour. This structure generalises the deterministic packing models discussed in classical geometry (Coxeter (1961), Hilbert and Cohn-Vossen (1952)). Relationships with the dual mosaic formed by joining the centres of touching disks are established. Constraints on the neighbourhood of disks and on the packing density are established.
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Cowan, Richard. "A constraint on the random packing of disks." Journal of Applied Probability 30, no. 01 (March 1993): 263–68. http://dx.doi.org/10.1017/s002190020004417x.

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This paper addresses random packing of equal-sized disks in a manner such that no disk has a gap on its circumference large enough to accommodate an extra touching neighbour. This structure generalises the deterministic packing models discussed in classical geometry (Coxeter (1961), Hilbert and Cohn-Vossen (1952)). Relationships with the dual mosaic formed by joining the centres of touching disks are established. Constraints on the neighbourhood of disks and on the packing density are established.
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Schissler, Jakob. "Die USA und ihre Kriegskonstruktionen." Politisches Lernen 40, no. 3-4 (December 21, 2022): 24–26. http://dx.doi.org/10.3224/pl.v40i3-4.07.

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Die Alliierten stützten ihre Argumentation bei den Kriegsverbrecherprozessen gegen das Deutsche Reich 1946 auf die Tatsache des Angriffskrieges durch Nazi-Deutschland. Damit schufen sie indirekte Legitimationen für andere Kriegsformen. Dies war anscheinend gewollt. Jedoch traten „nach Nürnberg“ andere Faktoren in den Vordergrund: vor allem die Tatsache der „hohen Kollateralschäden“. Die USA haben in der Folge nur bedingt völkerrechtliche Regelungen in ihre Politik aufgenommen. Seit dem Koreakrieg (1950–1953) bauten die USA ihre überdimensionale Kriegswirtschaft auf. In den Blick gerieten vor allem sogenannte „low intensity conflicts“. Diese hatten während der Entkolonialisierung Konjunktur. E. Tammy Kim nannte diese Kriegsführung der USA den „forever war“ oder auch den „permanenten Krieg“. Mit dem Übergang zum „unipolaren Moment“ in der Weltpolitik, hat „The war against terror“ diese Form der Kriegsführung ganz offen angenommen. Man bezeichnet amerikanischerseits diese Kriegsform auch als „intra war“. Seit kurzem aber wird die neue Form des allumfassenden Krieges wieder theoretisiert – der „inter war“. Diese Strategie ist gegen China gerichtet. Es ist fraglich ob man Kriege so scheinpräzise in Formeln packen kann: Sie sind ihrer Natur nach soziale Aktionen, die man durch Friedensstrategien beenden sollte. Woran es gegenwärtig mangelt.
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Dissertations / Theses on the topic "Packing, 1953"

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Qiao, Wenxin. "An algorithm for crew scheduling problem with bin packing features." College Park, Md.: University of Maryland, 2008. http://hdl.handle.net/1903/8818.

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Thesis (M.S.) -- University of Maryland, College Park, 2008.
Thesis research directed by: Dept. of Civil and Environmental Engineering . Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Hodges, Adam J. "The Industrial Workers of the World and the Oregon Packing Company Strike of July 1913." PDXScholar, 1996. https://pdxscholar.library.pdx.edu/open_access_etds/5290.

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This study builds upon the notion of a Wobbly 'sensibility' established by Salvatore Salemo and relates it to John Townsend's analysis of conflict between that group's adherents and western Progressives. The latter scholar, by concentrating on middle-class economic anxiety, failed to deal with the virtual unanimity of opposition to the IWW in western towns. Salerno's assertion that a 'sensibility' within the IWW was more binding than ideology raises the possibility that individuals and organizations of varying beliefs could be similarly united within a single cultural sphere with a directed purpose. Such an analysis can apply to factions of Progressivism and radical labor alike. The first chapter begins with a brief account of the historical context, origins, and organizational history of the IWW. This second section discusses the internal dynamic of the IWW, particularly the relationship between the leadership and rank-and-file. The third section briefly explicates the purpose of the thesis. The second chapter recounts important episodes of IWW activity that occurred on the West Coast concurrently with the strike in order to set the regional context of the conflict. The third chapter begins with a section discussing the development of Progressivism and urbanization in a national context and emphasizes cultural conflict. The second section is a brief survey of Progressive era Portland, Oregon. The third and fourth sections discuss the cultural repercussions of women entering industrial life on a mass scale. The chapter concludes with a brief demographic survey of cannery women. The fourth chapter is a chronological narrative of the strike, and is followed by a concluding fifth chapter of analysis. The first section suggests a Progressive 'sensibility' arrayed specifically against radical labor, while the next section discusses a radical 'sensibility' hostile to varying aspects of the cultural norms of Progressivism. The final section asserts the importance of analysis of cultural values, above even notions of class, in addition to economic analysis in order to obtain a more useful synthesis of Wobbly conflict than now exists.
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Loh, Kok-Hua. "Weight annealing heuristics for solving bin packing and other combinatorial optimization problems concepts, algorithms and computational results /." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3980.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2006.
Thesis research directed by: Business and Management. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Valentine, Theresa Michelle. "Fabrication and packaging optimization for polymer-based microfluidics." College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/1412.

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Thesis (M.S.) -- University of Maryland, College Park, 2004.
Thesis research directed by: Dept. of Material Science and Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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DiSabatino, Ronald J. "Packaging of an iron-gallium nanowire acoustic sensor." College Park, Md. : University of Maryland, 2006. http://hdl.handle.net/1903/3765.

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Thesis (M.S.) -- University of Maryland, College Park, 2006.
Thesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Fung, Kar Ho Herman. "Biophysical and structural characterisation of the bacteriophage HK97 DNA packaging system." Thesis, University of York, 2017. http://etheses.whiterose.ac.uk/19153/.

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DNA packaging is a key step in the assembly of dsDNA viruses such as tailed bacteriophages and herpes viruses, whereby empty capsids are filled with a copy of the viral genome. The task is mediated by a DNA packaging motor, made of terminase proteins interacting with the portal vertex of a capsid. Cos phages use a defined signal recognised by the terminase machinery to mark the beginning and end of their genome in newly replicated, concatemeric DNA. For cos phages, the structures of assemblies that initiate, perform and terminate packaging are unknown. The structures of individual terminase proteins are also unknown. To further elucidate the mechanisms of DNA packaging in cos phages, a new packaging motor was assembled in vitro based on Escherichia coli bacteriophage HK97. Structural, biochemical and biophysical evidence suggests that cos, pac and φ29-like motors share a common mechanism for DNA translocation, despite their different initiation and termination behaviours.
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Deeds, Michael Andrew. "Qualification of metallized optical fiber connections for chip-level MEMS packaging." College Park, Md. : University of Maryland, 2004. http://hdl.handle.net/1903/1941.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2004.
Thesis research directed by: Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Hung, Chi-Wei. "RNA packaging and gene delivery using Tobacco mosaic virus pseudo virions." College Park, Md. : University of Maryland, 2008. http://hdl.handle.net/1903/8175.

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Thesis (Ph. D.) -- University of Maryland, College Park, 2008.
Thesis research directed by: Dept. of Chemical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Jain, Rupal. "Design and packaging of an iron-gallium (Galfenol) nanowire acoustic sensor for underwater applications." College Park, Md.: University of Maryland, 2007. http://hdl.handle.net/1903/7605.

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Thesis (M.S.) -- University of Maryland, College Park, 2007.
Thesis research directed by: Dept. of Mechanical Engineering. Title from t.p. of PDF. Includes bibliographical references. Published by UMI Dissertation Services, Ann Arbor, Mich. Also available in paper.
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Grau, Peter F. "Analysis of high density interconnect alternatives in multichip module packaging using the analytic hierarchy process." Master's thesis, This resource online, 1993. http://scholar.lib.vt.edu/theses/available/etd-03172010-020042/.

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Books on the topic "Packing, 1953"

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Pressure Vessels and Piping Conference (1993 Denver, Colo.). Packages for transportation and storage of radioactive materials: Presented at the 1993 Pressure Vessels and Piping Conference, Denver, Colorado, July 25-29, 1993. Edited by Carlson R. W, Fischer L. E, Chou C. K, and American Society of Mechanical Engineers. Pressure Vessels and Piping Division. New York: ASME, 1993.

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Han'guk p'ojang yŏksa 50-yŏn: Since 1963-2013. Sŏul-si: Tosŏ Ch'ulp'an (Sa) Han'guk P'ojang Hyŏphoe, 2013.

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Consortium, British Retail. Guidance notes on retail packaging: 1993 update. London: British Retail Consortium, 1993.

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ASME International Electronics Packaging Conference n(2nd :1993 Binghamton, N.Y.). Advances in electronic packaging, 1993: Proceedings of the 1993 ASME International Electronics Packaging Conference : presented at the ASME International Electronics Packaging Conference, Binghamton, New York, September 29-October 2, 1993. New York: American Society of Mechanical Engineers, 1993.

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International Symposium on Microelectronics (1993 Dallas, Tex.). Proceedings: Of the 1993 International Symposium on Microelectronics, November 9-11, 1993, Dallas Convention Center, Dallas, Texas. Reston, Va: ISHM - The Microelectronics Society, 1993.

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Yung-Cheng, Lee, Chen William T, Yih Y, American Society of Mechanical Engineers. Winter Meeting, American Society of Mechanical Engineers. Production Engineering Division., and American Society of Mechanical Engineers. Electrical and Electronic Packaging Division., eds. Manufacturing aspects in electronic packaging 1993: Presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993. New York: American Society of Mechanical Engineers, 1993.

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International Conference and Exhibition on Multichip Modules. (2nd 1993 Denver, Colo.). Multichip modules: International conference and exhibition : 14-16 April 1993, Denver, Colorado. Bellingham, Wash., USA: Published by ISHM and IEPS in cooperation with SPIE--the International Society for Optical Engineering, 1993.

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Topical, Meeting on Electrical Performance of Electronic Packaging (2nd 1993 Monterey Calif ). Electrical performance of electronic packaging : October 20-22, 1993. Monterey, Calif: Institute of Electrical and Electronics Engineers, 1993.

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Klöckner, Helmut. Verpackung, Fluch oder Segen?: Verpackungswirtschaft der BRD 1950-2000 ; Grundlagen und Fakte über Entwicklung, volkswirtschaftliche Bedeutung, Verpackungsverordnung und Ökologie-Ökonomie-Problematik der Verpackung. Heusenstamm: M. Klöckner, 1992.

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Great Britain. Health and Safety Executive., ed. CHIP for everyone: Chemicals (hazard information and packaging) regulations 1993. Sudbury, Suffolk: HSE Books, 1993.

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Book chapters on the topic "Packing, 1953"

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De Jonghe, L. C., M. N. Rahaman, and M. Lin. "The Role of Powder Packing in Sintering." In Ceramic Microstructures ’86, 447–54. Boston, MA: Springer US, 1987. http://dx.doi.org/10.1007/978-1-4613-1933-7_46.

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Keith, Mike, and Merrick Schnicariol. "Packaging and Deployment." In Pro JPA 2, 407–28. Berkeley, CA: Apress, 2009. http://dx.doi.org/10.1007/978-1-4302-1957-6_13.

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Jitianu, Andrei, Louis Gambino, and Lisa C. Klein. "Sol-Gel Packaging for Electrochemical Devices." In Sol-Gel Processing for Conventional and Alternative Energy, 375–92. Boston, MA: Springer US, 2012. http://dx.doi.org/10.1007/978-1-4614-1957-0_17.

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Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Introduction to Thermal Management in Microelectronics Packaging." In Advanced Thermal Management Materials, 1–10. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_1.

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Bhat, K. N., M. M. Nayak, Vijay Kumar, Linet Thomas, S. Manish, Vijay Thyagarajan, Pandian, et al. "Design, Development, Fabrication, Packaging, and Testing of MEMS Pressure Sensors for Aerospace Applications." In Springer Tracts in Mechanical Engineering, 3–17. New Delhi: Springer India, 2014. http://dx.doi.org/10.1007/978-81-322-1913-2_1.

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Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials, 89–98. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_6.

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Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper." In Advanced Thermal Management Materials, 123–40. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_9.

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Jiang, Guosheng, Liyong Diao, and Ken Kuang. "Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications." In Advanced Thermal Management Materials, 99–107. New York, NY: Springer New York, 2012. http://dx.doi.org/10.1007/978-1-4614-1963-1_7.

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Karamouzi, Eugenia, Eleni Tsironi, and Panopoulos Panagiotis. "Study Cases (web)." In Manuali – Scienze Tecnologiche, 57. Florence: Firenze University Press, 2020. http://dx.doi.org/10.36253/978-88-5518-044-3.57.

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REZOS BRANDS is a food focused SME, with expertise in superfoods. The company is established in Patras, back in 1983, with main activity the distribution and development of national sales networks of imported and local food & beverages products, operating in the Greek market. Over the years REZOS BRANDS has extended its operations to all activities of the vertical business model: from the farm to the fork, which includes cultivation, harvesting, research, process, packaging, warehouse storing, marketing, distribution. Having own multifunctional farm, the super foods are cultivated and grown up with the principles of sustainable precision farming in order to develop, monitoring & analysing high nutritional value crops. The crops have been processed with novel processing techniques, such as osmotic dehydration.
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Lovell, Simon C. "Gene Function and Molecular Evolution." In Evolutionary Genetics Concepts and Case Studies, 193–210. Oxford University PressNew York, NY, 2006. http://dx.doi.org/10.1093/oso/9780195168174.003.0013.

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Abstract Francis Crick (1916-2004), along with James Watson, is best known for predicting the structure of DNA, probably the greatest success in the history of molecular modeling. He also published important work on virus structure where he and Watson argue that the only way a stretch of DNA can encapsulate itself with protein is if multiple repeating subunits are used, he published a paper on helix packing in proteins where he suggests the reader should knock nails into broom-handles to visualize the point being made (Crick 1953; Figure 13.1), he suggested that “selfish DNA” may exist and be “the ultimate parasite,” he suggested that there must be “adaptors” in protein synthesis (now known to be transfer RNAs) and, arguably most importantly, suggested the “sequence hypothesis” and the central dogma of molecular biology.
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Conference papers on the topic "Packing, 1953"

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Lall, Pradeep, Nokibul Islam, Kaysar Rahim, and Jeff Suhling. "Prognosis Methodologies for Health Management of Electronics and MEMS Packaging." In ASME 2004 International Mechanical Engineering Congress and Exposition. ASMEDC, 2004. http://dx.doi.org/10.1115/imece2004-62319.

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The current state-of-art in managing system reliability is geared towards the development of life-prediction models for unaged pristine materials under known loading conditions based on relationships such as the Paris’s Power Law [Paris, et. al 1960, 1961], Coffin-Manson Relationship [Coffin 1954; Tavernelli, et. al. 1959; Smith, et. al. 1964; Manson, et. al. 1964] and the S-N Diagram. There is need for methods and processes which will allow interrogation of complex systems and sub-systems to determine the remaining useful life prior to repair or replacement. This capability of determination of material or system state is called “prognosis”. In this paper, a methodology for prognosis-of-electronics has been demonstrated with data of leading indicators of failure for accurate assessment of product damage significantly prior to appearance of any macro-indicators of damage. Proxies for leading indicators of failure have been developed including – micro-structural evolution characterized by average phase size and interfacial stresses at interface of silicon structures. Structures examined include – electronics package, MEMS Packages and interconnections on a metal backed printed circuit board typical of electronics deployed in harsh environments. Since, an aged material knows its state the research presented in this paper focuses on enhancing the understanding of material damage to facilitate proper interrogation of material state. Mathematical relationship has been developed between phase growth rate and time-to-1-percent failure to enable the computation of damage manifested and a forward estimate of residual life.
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Joshi, V. S., H. A. Grebe, N. N. Thadhani, and Z. Iqbal. "Effect of packing density on shock consolidation of diamond powders." In High-pressure science and technology—1993. AIP, 1994. http://dx.doi.org/10.1063/1.46473.

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Raghunath, M. T., and A. Ranade. "Designing interconnection networks for multi-level packaging." In the 1993 ACM/IEEE conference. New York, New York, USA: ACM Press, 1993. http://dx.doi.org/10.1145/169627.169832.

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Katsura, Kohsuke. "Packaging technology for multigigabit optoelectronics." In Optical Fiber Communication Conference. Washington, D.C.: OSA, 1993. http://dx.doi.org/10.1364/ofc.1993.ff1.

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Sason, Igal, and Gil Wiechman. "Log-Domain Calculation of the 1959 Sphere-Packing Bound with Application to M-ary PSK Block Coded Modulation." In 2006 IEEE 24th Convention of Electrical & Electronics Engineers in Israel. IEEE, 2006. http://dx.doi.org/10.1109/eeei.2006.321097.

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Chin, Siew-Wei, Subramaniam D. Rajan, Ben K. Nagaraj, and Mali Mahalingam. "Automated Design Tool for Examining Microelectronic Packaging Design Alternatives." In ASME 1993 Design Technical Conferences. American Society of Mechanical Engineers, 1993. http://dx.doi.org/10.1115/detc1993-0080.

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Abstract Microelectronic packaging design issues have been given greater attention mainly because the performance, reliability and cost of semiconductor chips are increasingly dictated by the choice and design of the package. The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to other design alternatives. Two packaging design examples serve to illustrate the functionalities of the automated design optimization tool.
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Ashwell, G. J., P. D. Jackson, D. Lochun, G. S. Bahra, and C. R. Brown. "Second Harmonic Generation from Langmuir-Blodgett Films: Interleaved and Z-type Multilayers." In Organic Thin Films for Photonic Applications. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/otfa.1993.pd.1.

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Langmuir-Blodgett (LB) film-forming materials which comprise a hydrophilic head and a hydrophobic tail tend to form centrosymmetric Y-type structures in which the layers pack head-to-head and tail-to-tail, whereas materials with hydrophobic tails at opposite ends of the chromophore form non-centrosymmetric Z-type films in which interlayer packing is head-to-tail. Here, we report the second harmonic generation (SHG) from both the interleaved and the homomolecular LB films.
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SHALKHAUSER, K., K. LI, and Y. SHIH. "High-performance packaging for monolithic microwave and millimeter-wave integrated circuits." In 14th International Communication Satellite Systems Conference and Exhibit. Reston, Virigina: American Institute of Aeronautics and Astronautics, 1992. http://dx.doi.org/10.2514/6.1992-1935.

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Acklin, Bruno, and Jürgen Jahns. "Packaging considerations for planar optical systems." In Optical Computing. Washington, D.C.: Optica Publishing Group, 1993. http://dx.doi.org/10.1364/optcomp.1993.othb.4.

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Scozzafava, Joseph J., Timothy Stephens, and John A. Sultana. "Environmental packaging of fiber optic integrated circuits." In SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, edited by Daniel Vukobratovich, Paul R. Yoder, Jr., and Victor L. Genberg. SPIE, 1993. http://dx.doi.org/10.1117/12.156629.

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Reports on the topic "Packing, 1953"

1

Hodges, Adam. The Industrial Workers of the World and the Oregon Packing Company Strike of July 1913. Portland State University Library, January 2000. http://dx.doi.org/10.15760/etd.7163.

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2

Willis, C., F. Jorgensen, S. A. Cawthraw, H. Aird, S. Lai, M. Chattaway, I. Lock, E. Quill, and G. Raykova. A survey of Salmonella, Escherichia coli (E. coli) and antimicrobial resistance in frozen, part-cooked, breaded or battered poultry products on retail sale in the United Kingdom. Food Standards Agency, May 2022. http://dx.doi.org/10.46756/sci.fsa.xvu389.

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Frozen, breaded, ready-to-cook chicken products have been implicated in outbreaks of salmonellosis. Some of these outbreaks can be large. For example, one outbreak of Salmonella Enteritidis involved 193 people in nine countries between 2018 and 2020, of which 122 cases were in the UK. These ready-to-cook products have a browned, cooked external appearance, which may be perceived as ready-to-eat, leading to mishandling or undercooking by consumers. Continuing concerns about these products led FSA to initiate a short-term (four month), cross-sectional surveillance study undertaken in 2021 to determine the prevalence of Salmonella spp., Escherichia coli and antimicrobial resistance (AMR) in frozen, breaded or battered chicken products on retail sale in the UK. This study sought to obtain data on AMR levels in Salmonella and E. coli in these products, in line with a number of other FSA instigated studies of the incidence and nature of AMR in the UK food chain, for example, the systematic review (2016). Between the beginning of April and the end of July 2021, 310 samples of frozen, breaded or battered chicken products containing either raw or partly cooked chicken, were collected using representative sampling of retailers in England, Wales, Scotland and Northern Ireland based on market share data. Samples included domestically produced and imported chicken products and were tested for E. coli (including extended-spectrum beta-lactamase (ESBL)-producing, colistin-resistant and carbapenem-resistant E. coli) and Salmonella spp. One isolate of each bacterial type from each contaminated sample was randomly selected for additional AMR testing to determine the minimum inhibitory concentration (MIC) for a range of antimicrobials. More detailed analysis based on Whole Genome Sequencing (WGS) data was used to further characterise Salmonella spp. isolates and allow the identification of potential links with human isolates. Salmonella spp. were detected in 5 (1.6%) of the 310 samples and identified as Salmonella Infantis (in three samples) and S. Java (in two samples). One of the S. Infantis isolates fell into the same genetic cluster as S. Infantis isolates from three recent human cases of infection; the second fell into another cluster containing two recent cases of infection. Countries of origin recorded on the packaging of the five Salmonella contaminated samples were Hungary (n=1), Ireland (n=2) and the UK (n=2). One S. Infantis isolate was multi-drug resistant (i.e. resistant to three different classes of antimicrobials), while the other Salmonella isolates were each resistant to at least one of the classes of antimicrobials tested. E. coli was detected in 113 samples (36.4%), with counts ranging from <3 to >1100 MPN (Most Probable Number)/g. Almost half of the E. coli isolates (44.5%) were susceptible to all antimicrobials tested. Multi-drug resistance was detected in 20.0% of E. coli isolates. E. coli isolates demonstrating the ESBL (but not AmpC) phenotype were detected in 15 of the 310 samples (4.8%) and the AmpC phenotype alone was detected in two of the 310 samples (0.6%) of chicken samples. Polymerase Chain Reaction (PCR) testing showed that five of the 15 (33.3%) ESBL-producing E. coli carried blaCTX-M genes (CTX-M-1, CTX-M-55 or CTX-M-15), which confer resistance to third generation cephalosporin antimicrobials. One E. coli isolate demonstrated resistance to colistin and was found to possess the mcr-1 gene. The five Salmonella-positive samples recovered from this study, and 20 similar Salmonella-positive samples from a previous UKHSA (2020/2021) study (which had been stored frozen), were subjected to the cooking procedures described on the sample product packaging for fan assisted ovens. No Salmonella were detected in any of these 25 samples after cooking. The current survey provides evidence of the presence of Salmonella in frozen, breaded and battered chicken products in the UK food chain, although at a considerably lower incidence than reported in an earlier (2020/2021) study carried out by PHE/UKHSA as part of an outbreak investigation where Salmonella prevalence was found to be 8.8%. The current survey also provides data on the prevalence of specified AMR bacteria found in the tested chicken products on retail sale in the UK. It will contribute to monitoring trends in AMR prevalence over time within the UK, support comparisons with data from other countries, and provide a baseline against which to monitor the impact of future interventions. While AMR activity was observed in some of the E. coli and Salmonella spp. examined in this study, the risk of acquiring AMR bacteria from consumption of these processed chicken products is low if the products are cooked thoroughly and handled hygienically.
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[Band electronic structures and crystal packing forces]. Progress report, [March 1992--February 1993]. Office of Scientific and Technical Information (OSTI), March 1993. http://dx.doi.org/10.2172/10133766.

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