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Journal articles on the topic 'Packaging of real estate'

Author: Grafiati

Published: 29 June 2021

Last updated: 1 February 2022

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1

Tettsoeva, Ekaterina. "Challenges of logistic processing of the transport package selected by suppliers for international carriage of construction goods by road." Upravlenie 7, no. 1 (May 7, 2019): 96–104. http://dx.doi.org/10.26425/2309-3633-2019-1-96-104.

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The purpose of the article is to identify the general situations emerging in the practice of road carriers and importing companies that relate to increased risk of damage and destruction of the goods and also to delivery delays because of the mismatch between the transport packaging which is provided by foreign suppliers of construction materials and the goods itself. The article gives pride of place to the recommendations on minimizing of the risks that are connected with transport and consumer packaging of construction materials delivered in Russia from abroad by truck. It has been noted noted that in the face of declining of effective demand for commercial and residential real estate one of the most widespread ways to reduce the costs of construction and, as a result, real estate value is cutting procurement expenditures. The author draws attention to the fact that one of the reasons for occurrence of additional expenses at the stage of procurement of the goods for construction needs could be total or partial incompatibility between, on the one hand, packing and wrapping materials and, on the other hand, both the materials carried and vehicles that are planned to transport the cargo. The article considers the features of general nomenclature groups of imported from Europe construction materials, gives the detailed analysis of the characteristics of the transport and consumer packaging and also the wrapping used in the process of its transportation. The author suggests the algorithm of coordinated actions of suppliers, buyers, local carriers from countries of consignment and logistics operators, which could be applied for reducing of the quantity of the incidents during the logistics handling connected with packing.

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Ranti, Gadih, Mutiara Eka Puspita, Iyus Hendrawan, and Abdul Haris Lahudin. "PENDAMPINGAN PENGENDALIAN KUALITAS DAN STRATEGI PEMASARAN ANEKA PRODUK KRIPIK ‘MPOK NOUNTJI’ DESA RAWA KALONG KEC.GN SINDUR KABUPATEN BOGOR." Empowerment in the Community 1, no. 2 (August 19, 2020): 46. http://dx.doi.org/10.31543/ecj.v1i2.405.

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Rawakalong Village, Gunung Sindur Subdistrict, Bogor Regency, is a village at the end of the border between Bogor Regency and South Tangerang. This region has not been touched by the development of the community, especially the general public outside real estate developer. The village of Rawakalong borders directly with the city of South Tangerang, almost rarely gets the attention of the Regency Government so that some residents feel sectoral jealousy over the progress received by their neighboring Villages in South Tangerang. One community partner who has problems is Mpok Noncih who has been supporting his family by selling banana chips. However, the lack of awareness of the quality of the product and the importance of productivity made the team decide to create a campus circle building program in this place. Quality control is needed to reach consumers through production systems and packaging systems that are safe and attractive, storage systems so that quality is maintained, productivity to meet demand, and marketing for the branding image of premium quality local products. The outputs of the campus ring building program that have been implemented are premium product packaging with logos and brands “mpok nountjih” as product identity, improved product quality with the use of plastic zipper packaging systems and the use of sealer machines, increased productivity by providing large capacity pans and improving the environment by beautifying business locations. The outcome obtained from the campus circumference development grant is the increased brand image of the product making it easier to sell and more durable durability due to improved packaging quality.

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Sadri, Sam, Tri Le, and Stephanie A. Althouse. "A Systematic Approach for Creating a System-In-Package (SIP)." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000494–97. http://dx.doi.org/10.4071/isom-2010-wa4-paper6.

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Over the past several decades the quest to design electronics that boast ever increasing capabilities while continuously decreasing their size and weight has led to the development of a series of new packaging solutions. As the need for more functionality in less real estate increased, Multiple Chip Modules (MCM) were no longer satisfactory in many applications. Today, these applications call for a highly integrated packaging approach which often incorporates multiple functionalities into one package. In situations where time to the market for SOC (System on a Chip) is too slow or too costly the approach of System-in-a-package (SIP) can be the ideal solution. One element in modern packaging is the use of new 3D structures and high-k dielectric materials. The second element is advanced packaging methods. New technologies such as chip-on-chip assemblies have been developed. The third element has been the progression in design tools that allow engineers to seamlessly design an overall, highly integrated system. The forth element, testing, is often an expensive part of product development. With SIP technology that cost can be significantly lowered, making new product development economically more feasible. In this paper we present a systematic approach to designing highly integrated and miniaturized SIP packages. This approach enables rapid design, prototyping and time to production while achieving a new level of integration, miniaturization and reliability. Finally, a case study is presented to demonstrate a typical maturity cycle of a SIP, in this case for a wireless application.

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Vincent, Michael, Doug Mitchell, Jason Wright, Yap Weng Foong, Alan Magnus, Zhiwei (Tony) Gong, Scott Hayes, and Navjot Chhabra. "3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000447–51. http://dx.doi.org/10.4071/isom-2013-wa14.

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Fan-out wafer level packaging (FO-WLP) has shifted from standard single die, single sided package to more advanced packages for System-in-Package (SiP) and 3D applications. Freescale's FO-WLP, Redistributed Chip Package (RCP), has enabled Freescale to create novel SiP solutions not possible in more traditional packaging technologies or Systems-on-Chip (SoC). Simple SiP's using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or substrate based multi-chip module (MCM). More complex 3D SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMD's, CMOS, GaAs, MEMS, imaging sensors or IPD's gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. To enable this ever increasing system integration and volumetric efficiency, novel technologies have been developed to utilize the full package space. Technologies such as through package via (TPV) and double sided redistribution are currently proving successful. For this discussion, an emerging technology for 3D RCP package stacking that can further enhance design flexibility and system performance is presented. This technology, package side connect, utilizes the vertical sides of packages and stacked packages to capture a normally unused piece of package real-estate. Mechanical and electrical characterization of successful side connects will be presented as well as reliability results of test vehicle packages using RCP packaging technology.

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5

O'Toole, Eoin, Steffen Kroehnert, José Campos, Virgilio Barbosa, and Leonor Dias. "Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000305–8. http://dx.doi.org/10.4071/isom-2016-wp31.

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Abstract NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer-Level Ball Grid Array technology eWLB of Infineon Technologies [1]. Since it′s invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution of KGD (known good die) from incoming device wafer, independent of wafer diameter and material, to recon wafer format of active semiconductor dies or other active/passive components separated by mold compound applied through compression molding on a temporary mold carrier. The resulting recon wafer can be processed in standard wafer processing equipment. One of the challenges for the future of semiconductor packaging is reduction of the board level volume real estate occupied by each component. With the drive towards lower profile end user devices incorporating large display area and battery life the three dimensional space available for semiconductor packages is diminishing. It is well known that WLFO single die packaging but even more significant system integration enables the shrinkage of the XY footprint of the package through flexible very dense heterogeneous system-in-package integration [2]. But one of the disruptive advantages of the substrate-less WLFO technology is to also permit significant reduction of the overall package height (Z). A total package height for a BGA package including solder balls <500um and for a LGA package with solder land pads only <300um is achievable today, and further development towards even thinner packages is on the way.

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La Porta, Antonio, Jonas Weiss, Roger Dangel, Daniel Jubin, Norbert Meier, Folkert Horst, and Bert Jan Offrein. "Broadband and scalable optical coupling for silicon photonics using polymer waveguides." Advanced Optical Technologies 7, no. 1-2 (April 25, 2018): 107–13. http://dx.doi.org/10.1515/aot-2017-0064.

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AbstractWe present optical coupling schemes for silicon integrated photonics circuits that account for the challenges in large-scale data processing systems such as those used for emerging big data workloads. Our waveguide based approach allows to optimally exploit the on-chip optical feature size, and chip- and package real-estate. It further scales well to high numbers of channels and is compatible with state-of-the-art flip-chip die packaging. We demonstrate silicon waveguide to polymer waveguide coupling losses below 1.5 dB for both the O- and C-bands with a polarisation dependent loss of <1 dB. Over 100 optical silicon waveguide to polymer waveguide interfaces were assembled within a single alignment step, resulting in a physical I/O channel density of up to 13 waveguides per millimetre along the chip-edge, with an average coupling loss of below 3.4 dB measured at 1310 nm.

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Vallabhajosyula, Phani. "Stencil Print solutions for Advance Packaging Applications." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000646–51. http://dx.doi.org/10.4071/isom-2017-poster1_124.

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Abstract This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high-performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um–40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package. Cavity technology can be an effective solution in reducing the total assembled PCB thickness (Z-height), most importantly, on designs utilizing taller - stacked devices. Traditionally, dipping process or dispensing process was used to deposit solder paste, flux, or glue on uneven surfaces. However, this takes a longer time when compared to printing using a stencil printer. Reservoir printing using a stencil printer has greater potential in such application. Extensive work has been done in the past to print glue, solder paste and/or flux into cavities using reservoir printing. This paper focuses on printing solder paste into multiple cavities (stencil pockets) with depths ranging from 355 microns to 450 microns, and with varying cavity size, wall angles and various stencil thicknesses ranging from 100 microns to 150 microns. Apertures varying in area ratio were placed in these cavities and experiments were conducted to analyze the print performance of the stencils. As the size of the components and boards/substrates gets smaller - closer placement of components to the cavity (stencil pocket) walls needed to be assessed as well. These applications, the associated stencil design and print results were discussed in detail in this paper.

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8

Narasimhan, Susheela, Herman Chu, Mudasir Ahmad, and Li Li. "Thermal Challenges in 3D Stacks." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001354–72. http://dx.doi.org/10.4071/2012dpc-wa11.

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Thermal Management of high performance 3D SiP Modules is gaining momentum in telecommunication and networking applications. With increasing need for bandwidth and reduced real estate on boards, there is an acute need for 3D SiP modules. At the same time, the stacked modules come with a host of new challenges in terms of thermal management, packaging, thermo-mechanical stresses etc. This study looks at one such module with stacked dies for memories along with another high performance silicon all under a single lid. The study focuses on the effect of underfill materials on thermal performance, effect of through silicon vias, effect of non-uniform heat source on hot spots on the die etc. It will also focus on thermal management of a single module as well as a series of modules in a networking application. The effect of thermo-mechanical stresses will also be investigated and conclusions drawn on the effect of each of these parameters.

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9

Kummerl, Steven, Charles Devries, Usman Chaudhry, and Chong Han Lim. "Increase Power Density and Simplify Designs Using 3-D SiP Modules." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000326–30. http://dx.doi.org/10.4071/2380-4505-2018.1.000326.

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Abstract Today, designers are demanding an overall form-factor reduction to save board space, increase functionality, and allocate more circuit board real estate toward end-user applications – all with less space allocated to power management where not just the X–Y shrink but the 3D volumetric shrink is required. For example, in today's Telecommunications Cloud Infrastructure systems, board space and power density are challenging particularly in power supply designs where several high-current point-of-load rails are present. End equipment such as enterprise servers and switches, workstations, base stations, network attached storage, FPGA testers, network testers, and other test and measurement equipment employ several high-current CPUs, ASICs, FPGAs, and DDR memory – all of which need high power, while the available board area is steadily decreasing. This paper will discuss volumetric co-design methodology and packaging construction trade-offs for 3D SiP power modules and also introduce the straddle mounted inductor assembly technique. Also provided are details around the SiP eco-system, co-design, construction, materials, and circuit topology.

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Kelly, Michael, and Rick Reed. "ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000665–93. http://dx.doi.org/10.4071/2014dpc-tp11.

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Through-silicon-via (TSV) package construction offers several silicon integration advantages that are being validated by leading technology providers. This paper will describe a System in Package (SiP) design utilizing two functional system-on-chip (SoC) ARM dual-core Cortex-A9 processors connected across a 2.5D silicon interposer. The test vehicle was designed to demonstrate high speed and high bandwidth communication between multiple chips. The two logic chips were designed by Open Silicon, Inc. and fabricated by GLOBALFOUNDRIES on their 28nm-SLP (Super Low Power) process technology. GLOBALFOUNDRIES also fabricated the 2.5D interposer using their 65nm manufacturing flow. Amkor Technology provided the final assembly utilizing advanced TSV packaging technologies such as copper pillar bumping and mass reflow bonding. This is a pivotal demonstration of the heterogeneous die integration approach. A silicon process node or package interconnect density can either preserve or limit inter-chip communication when comparing SoC versus SiP approaches. Connecting two dual-core Cortex-A9 processors within a single package illustrated the expansion of function through multiple die. The test vehicle also implies that a large IC can be re-architected into smaller constituents to increase yield or design flexibility. By utilizing the best technology node for price and performance, 2.5D packaging can lower overall system cost of ownership or conversely, can expand overall performance through multiple high performance ICs. Chip designers are facing increased complexity and higher costs in order to move to smaller IC geometries and the adoption of 2.5D TSV technology will increase the options of construction (one vs. multiple die/SoCs). Having the flexibility to design with one or multiple die while maintaining high performance levels can offset the real estate costs of advanced nodes, permit silicon die reuse, improve yield and decrease overall product risk. The designer must choose the most appropriate silicon and assembly processes that satisfy the needs of each of the major functions in the overall system. Amkor's assembly process for this key product construction has been demonstrated on a range of products for the communications, graphics and the mobile markets. Process flexibility has been a key factor in addressing different markets and package complexity.

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11

Canavan, Tony, C. E. B. Brett, Michael O'Connell, Terence Brown, Nessa Roche, and Patrick McAfee. "Real Estate." Books Ireland, no. 230 (2000): 103. http://dx.doi.org/10.2307/20632068.

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12

Firstenberg, Paul M., Stephen A. Ross, and Randall C. Zisler. "Real estate." Journal of Portfolio Management 14, no. 3 (April 30, 1988): 22–34. http://dx.doi.org/10.3905/jpm.1988.409154.

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13

Adcock, Fleur. "Real Estate." Ploughshares 41, no. 1 (2015): 13. http://dx.doi.org/10.1353/plo.2015.0010.

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14

Willis, P. "Real Estate." Interdisciplinary Studies in Literature and Environment 4, no. 1 (April 1, 1997): 111–12. http://dx.doi.org/10.1093/isle/4.1.111.

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Straw, Joseph. "Real Estate." Journal of Business & Finance Librarianship 8, no. 3-4 (March 2003): 265–70. http://dx.doi.org/10.1300/j109v08n03_13.

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Gorringe, Hugo, and D. Karthikeyan. "Real Estate." South Asia: Journal of South Asian Studies 40, no. 2 (December 21, 2016): 389–91. http://dx.doi.org/10.1080/00856401.2016.1238057.

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ADACHI, Motohiro. "Real Estate Finance Technology and Real Estate Securitization." Japanese Journal of Real Estate Sciences 16, no. 3 (2002): 78–84. http://dx.doi.org/10.5736/jares1985.16.3_78.

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Anderson, Randy I., Sebastian Krautz, and Nico B. Rottke. "Is real estate private equity real estate? - Dynamic interactions between real estate private equity funds, non-real estate private equity funds, and direct real estate investments." Journal of Property Research 33, no. 3 (July 2, 2016): 252–68. http://dx.doi.org/10.1080/09599916.2016.1209781.

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19

Gholipour Fereidouni, Hassan, and Tajul Ariffin Masron. "Real estate market factors and foreign real estate investment." Journal of Economic Studies 40, no. 4 (August 30, 2013): 448–68. http://dx.doi.org/10.1108/jes-05-2011-0066.

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20

Ma, Yukun, Bin Xu, and Xiaofei Xu. "Real Estate Confidence Index Based on Real Estate News." Emerging Markets Finance and Trade 54, no. 4 (October 25, 2017): 747–60. http://dx.doi.org/10.1080/1540496x.2016.1232193.

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21

Likos, Mustafa, Mahir Nakip, and Aytaç Gökmen. "Real Estate Marketing and Factors Impacting Real Estate Purchasing." International Journal of Applied Management Sciences and Engineering 6, no. 2 (July 2019): 15–35. http://dx.doi.org/10.4018/ijamse.2019070102.

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The purpose of the study is to introduce factors impact on purchasing behavior in real estate marketing. The seven factors analyzed—location, structural factor, neighborhood, social factor, reference group, financial, advertising—have a direct effect on real estate purchasing behavior. A questionnaire prepared for this purpose was applied to 235 randomly selected people and the collected data were analyzed by variance analysis method. According to the results of the statistical analysis, factors such as location, structural factor, social factor, neighborhood, financial, advertising factor influence the purchasing behavior of the real estate, and it is observed that the reference groups do not affect the purchasing behavior.

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22

Bouillon, Marvin, and Richard Carter. "University Real Estate Programs and Local Real Estate Economies." Journal of Real Estate Practice and Education 12, no. 2 (January 1, 2009): 123–36. http://dx.doi.org/10.1080/10835547.2009.12091663.

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Giliberto, Michael. "Equity Real Estate Investment Trusts and Real Estate Returns." Journal of Real Estate Research 5, no. 2 (January 1, 1990): 259–63. http://dx.doi.org/10.1080/10835547.1990.12090615.

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Sackley, William H. "Why Real Estate?" CFA Digest 32, no. 2 (May 2002): 95. http://dx.doi.org/10.2469/dig.v32.n2.1097.

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Miller, Daren E. "Why Real Estate?" CFA Digest 34, no. 2 (May 2004): 16–17. http://dx.doi.org/10.2469/dig.v34.n2.1407.

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Hudson-Wilson, Susan. "Why Real Estate?" Journal of Portfolio Management 28, no. 1 (October 31, 2001): 20–32. http://dx.doi.org/10.3905/jpm.2001.319820.

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Hudson-Wilson, Susan, Frank J. Fabozzi, and Jacques N. Gordon. "Why Real Estate?" Journal of Portfolio Management 29, no. 5 (January 31, 2003): 12–25. http://dx.doi.org/10.3905/jpm.2003.319902.

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Hudson-Wilson, Susan, Jacques N. Gordon, Frank J. Fabozzi, Mark J. P. Anson, and S. Michael Giliberto. "Why Real Estate?" Journal of Portfolio Management 31, no. 5 (September 30, 2005): 12–21. http://dx.doi.org/10.3905/jpm.2005.593883.

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Ruff, Jon. "Commercial Real Estate." Journal of Portfolio Management 33, no. 5 (September 30, 2007): 27–36. http://dx.doi.org/10.3905/jpm.2007.698903.

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NAKAJO, Yasuhiko. "Real Estate Management." Japanese Journal of Real Estate Sciences 23, no. 2 (2009): 33. http://dx.doi.org/10.5736/jares.23.2_33.

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Goebel, Paul R., and C. F. Sirmans. "Real Estate Finance." Journal of Finance 40, no. 5 (December 1985): 1511. http://dx.doi.org/10.2307/2328129.

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Dale-Johnson, David, and Sherman J. Maisel. "Real Estate Finance." Journal of Finance 43, no. 1 (March 1988): 261. http://dx.doi.org/10.2307/2328336.

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Meehan, James. "Reinventing Real Estate." Journal of Applied Social Science 8, no. 2 (August 19, 2013): 113–33. http://dx.doi.org/10.1177/1936724413497480.

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Sell, Zach. "Real Estate Questions." History of the Present 10, no. 1 (April 1, 2020): 46–66. http://dx.doi.org/10.1215/21599785-8221416.

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Abstract Historians of the United States have often described slavery as guided by the chattel principle. Yet in Black Reconstruction, W. E. B. Du Bois wrote, “No matter how degraded the factory hand, he is not real estate.” This article builds upon Du Bois’s description of slavery’s real estate basis and considers real estate as central to both slavery and territorial expansion in the nineteenth-century United States. Real estate formed the basis of slaveholder family stability and also enabled the intergenerational transfer of wealth. The article also considers the continuing influence of real estate after black emancipation. Real estate enabled post-slavery black dispossession and also facilitated the continuation of the United States as a settler empire.

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Hayes, Brian. "Semiconductor Real Estate." American Scientist 96, no. 2 (2008): 167. http://dx.doi.org/10.1511/2008.70.167.

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Grayson, Michael M. "Real estate accounting." Critical Perspectives on Accounting 15, no. 8 (November 2004): 1036. http://dx.doi.org/10.1016/s1045-2354(03)00061-3.

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Wilkinson, Sara Jane, and Sarah Sayce. "Decarbonising real estate." Journal of European Real Estate Research 13, no. 3 (April 6, 2020): 387–408. http://dx.doi.org/10.1108/jerer-11-2019-0045.

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Purpose About 27 per cent of the total UK carbon emissions are attributed to residential buildings; therefore, improvements to the energy efficiency of the stock offers great potential. There are three main ways to achieve this. First is a mandatory approach, minimum energy efficiency standards are set and applied to new and existing buildings. Option 2 is voluntary, using energy ratings that classify performance to stimulate awareness and action. Third, financial measures, incentives and taxes, are applied to “nudge” behaviours. Most westernised countries have adopted a combination of Options 2 and 3, with the belief that the market will incentivize efficient properties. The belief is voluntary measures will stimulate demand, leading to value premiums. This paper aims to seek a deeper understanding of the relationship between energy efficiency and the value of residential property in Europe and, by so doing, to determine whether stronger policies are required to realise decarbonisation. Design/methodology/approach This paper reviews the current academic literature and large-scale quantitative studies conducted in Europe, mostly using hedonic pricing analysis to seek a relationship between energy performance certificates (EPCs) and either capital or rental values. It compares these to the reported findings of three case study projects that take a variety of different research approaches, all of which have the ambition to understand market behaviours and stimulate occupier or/and owner demand for energy efficient buildings. Findings The large-scale academic study results generally show a positive relationship between observed market prices and EPCs, which are commonly taken as surrogates for efficiency; however, outcomes are variable. One large study found energy upgrades may increase value, but not to the point where costs outweigh the value gain. Other studies found high returns on investment in energy efficiency technologies. The case study projects, however, revealed a more nuanced set of arguments in terms of the relationship between energy efficiency and market behaviours. Whilst there is some evidence that energy efficiency is beginning to impact on value, it is small compared to other value drivers; other drivers, including health, well-being and private sector finance deals, may prove more powerful market drivers. Further, the empirical findings reported point towards the emergence of a “brown” discount being more likely to be the long-term trend than a green premium. It is concluded that the current levels of action are unlikely to deliver the levels of decarbonisation urgently needed. Research limitations/implications This is a desktop study of other European studies that may have collected data on slightly different variables. Practical implications This study shows that more action is required to realise decarbonisation in new and existing residential property in the European states considered. The sector offers potential for substantial reductions, and other mandatory approaches need to be considered. Originality/value This is a timely review of the current outcomes of European programmes (EPCs) adopted in several countries to increase energy efficiency in the residential sector through a voluntary mechanism. The results show that more action is needed.

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Wilson, Marvin R. "‘Real Estate’ Theology." Transformation: An International Journal of Holistic Mission Studies 2, no. 4 (October 1985): 12–18. http://dx.doi.org/10.1177/026537888500200407.

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39

Francis, Jack Clark, and Roger G. Ibbotson. "Real Estate Returns." Journal of Alternative Investments 23, no. 2 (August 21, 2020): 111–26. http://dx.doi.org/10.3905/jai.2020.1.111.

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Syms, Paul. "Real Estate Economics." Journal of Urban Design 18, no. 2 (May 2013): 306–8. http://dx.doi.org/10.1080/13574809.2013.772848.

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Johnson, Don T. "Real estate investing." Managerial Finance 32, no. 12 (December 2006): 953–54. http://dx.doi.org/10.1108/03074350610710445.

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Deisenrieder, Barbara. "Real Estate Controlling." Controlling & Management 50, no. 6 (December 2006): 346–53. http://dx.doi.org/10.1365/s12176-006-0569-0.

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Hoxley, Mike, Joanna Poon, and Willow Fuchs. "Real estate employability." Journal of European Real Estate Research 4, no. 3 (October 25, 2011): 243–58. http://dx.doi.org/10.1108/17539261111183434.

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DeLisle, James, Terry Grissom, and Lovisa Högberg. "Sustainable real estate." Journal of Property Investment & Finance 31, no. 1 (February 2013): 10–40. http://dx.doi.org/10.1108/14635781311292953.

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Salzman, Diego, and Remco C. J. Zwinkels. "Behavioral Real Estate." Journal of Real Estate Literature 25, no. 1 (January 1, 2017): 77–106. http://dx.doi.org/10.1080/10835547.2017.12090455.

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Farzanegan, Mohammad Reza, and Hassan Gholipour Fereidouni. "DOES REAL ESTATE TRANSPARENCY MATTER FOR FOREIGN REAL ESTATE INVESTMENTS?" International Journal of Strategic Property Management 18, no. 4 (December 8, 2014): 317–31. http://dx.doi.org/10.3846/1648715x.2014.969793.

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The purpose of this paper is to examine the impact of real estate transparency (RET) on foreign real estate investments (FREI). Most of the previous studies have argued that the free flow of information and the fair and consistent application of local property laws could attract greater amounts of FREI. Using observations from 32 countries covering 2004, 2006, 2008 and 2010 and applying fixed-effect and the generalized method of moments (GMM) techniques, our empirical results reveal that RET is not a major determinant of FREI. However, we find that the effect of RET on FREI is dependent on its interaction with the level of income implying that the higher the level of income in the host country, the higher the effect of RET on FREI. Finally, the results show that foreign direct investment (FDI) in other sector, market size and property prices are important determinants of FREI.

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Olaleye, Abel, and Benjamin Ekemode. "Integration between real estate equity and non-real estate equity." Journal of Property Investment & Finance 32, no. 3 (April 1, 2014): 244–55. http://dx.doi.org/10.1108/jpif-10-2013-0063.

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Purpose – The paper examined the long-run relationship between real estate equity (property listed stock) and non-real estate equity (common stock) in the Nigerian capital market and established the integration between the investments. The paper aims to discuss these issues. Design/methodology/approach – The data collected comprised quarterly returns on property listed stock and All Share Index for the period of January 1999-December 2011. The calculated quarterly returns of the investments were subjected to the Philip-Person unit root test after which the integration between the investments was analysed using the Johansson integration test. Findings – The results showed that real estate equity performed better the non-real estate equity but with corresponding higher risk level. Also, real estate equity had a slightly lower performance when compared with non-real estate equity on return/risk ratio basis. The findings showed that property listed stock (real estate equity) was integrated with common stock or non-real estate equity and suggest that the Nigerian listed property stock, by nature, was similar to REITs. This result negates the belief that property listed stock's returns are integrated with direct real estate market and are often influenced by the returns of the underlying direct real estate assets. Practical implications – The paper implied that while investors could consider investing in real estate equity and earn better return than investing in common equity in the Nigerian capital market, the inclusion of both in a domestic portfolio could be expected to bring little or no diversification benefit. Originality/value – The paper is one of the few attempts at assessing the long-run relationship between property listed stock as a form of real estate equity and non-real estate equity and especially from African emerging market perspective.

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Lee, Ming-Long, Ming-Te Lee, and Kevin C. H. Chiang. "Real Estate Risk Exposure of Equity Real Estate Investment Trusts." Journal of Real Estate Finance and Economics 36, no. 2 (July 11, 2007): 165–81. http://dx.doi.org/10.1007/s11146-007-9058-2.

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Veuger, Jan. "Digitalization Real Estate on American Real Estate Society 2018: A Dramatic and Irreversible Shift in Real Estate Systems." Journal of Business and Economics 10, no. 5 (May 20, 2019): 380–86. http://dx.doi.org/10.15341/jbe(2155-7950)/05.10.2019/002.

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The 34th annual congress of April 10-14 this year took place in Bonita Springs (Florida) where the professionals in real-estate education and research discussed six themes: global economy and capital flows, real estate market cycles, demographic effects, future-proof real estate, disruption in technology and future educational models.

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Sack, Paul. "Recognizing Real Estate Value and Managing Real Estate for Maximum Return." ICFA Continuing Education Series 1986, no. 1 (January 1986): 18–25. http://dx.doi.org/10.2469/cp.v1986.n1.3.

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