Relevant bibliographies by topics / Packaging of real estate

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Packaging of real estate'

Author: Grafiati
Published: 29 June 2021
Last updated: 1 February 2022

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Journal articles on the topic "Packaging of real estate"

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Tettsoeva, Ekaterina. "Challenges of logistic processing of the transport package selected by suppliers for international carriage of construction goods by road." Upravlenie 7, no. 1 (May 7, 2019): 96–104. http://dx.doi.org/10.26425/2309-3633-2019-1-96-104.

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The purpose of the article is to identify the general situations emerging in the practice of road carriers and importing companies that relate to increased risk of damage and destruction of the goods and also to delivery delays because of the mismatch between the transport packaging which is provided by foreign suppliers of construction materials and the goods itself. The article gives pride of place to the recommendations on minimizing of the risks that are connected with transport and consumer packaging of construction materials delivered in Russia from abroad by truck. It has been noted noted that in the face of declining of effective demand for commercial and residential real estate one of the most widespread ways to reduce the costs of construction and, as a result, real estate value is cutting procurement expenditures. The author draws attention to the fact that one of the reasons for occurrence of additional expenses at the stage of procurement of the goods for construction needs could be total or partial incompatibility between, on the one hand, packing and wrapping materials and, on the other hand, both the materials carried and vehicles that are planned to transport the cargo. The article considers the features of general nomenclature groups of imported from Europe construction materials, gives the detailed analysis of the characteristics of the transport and consumer packaging and also the wrapping used in the process of its transportation. The author suggests the algorithm of coordinated actions of suppliers, buyers, local carriers from countries of consignment and logistics operators, which could be applied for reducing of the quantity of the incidents during the logistics handling connected with packing.
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Ranti, Gadih, Mutiara Eka Puspita, Iyus Hendrawan, and Abdul Haris Lahudin. "PENDAMPINGAN PENGENDALIAN KUALITAS DAN STRATEGI PEMASARAN ANEKA PRODUK KRIPIK ‘MPOK NOUNTJI’ DESA RAWA KALONG KEC.GN SINDUR KABUPATEN BOGOR." Empowerment in the Community 1, no. 2 (August 19, 2020): 46. http://dx.doi.org/10.31543/ecj.v1i2.405.

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Rawakalong Village, Gunung Sindur Subdistrict, Bogor Regency, is a village at the end of the border between Bogor Regency and South Tangerang. This region has not been touched by the development of the community, especially the general public outside real estate developer. The village of Rawakalong borders directly with the city of South Tangerang, almost rarely gets the attention of the Regency Government so that some residents feel sectoral jealousy over the progress received by their neighboring Villages in South Tangerang. One community partner who has problems is Mpok Noncih who has been supporting his family by selling banana chips. However, the lack of awareness of the quality of the product and the importance of productivity made the team decide to create a campus circle building program in this place. Quality control is needed to reach consumers through production systems and packaging systems that are safe and attractive, storage systems so that quality is maintained, productivity to meet demand, and marketing for the branding image of premium quality local products. The outputs of the campus ring building program that have been implemented are premium product packaging with logos and brands “mpok nountjih” as product identity, improved product quality with the use of plastic zipper packaging systems and the use of sealer machines, increased productivity by providing large capacity pans and improving the environment by beautifying business locations. The outcome obtained from the campus circumference development grant is the increased brand image of the product making it easier to sell and more durable durability due to improved packaging quality.
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Sadri, Sam, Tri Le, and Stephanie A. Althouse. "A Systematic Approach for Creating a System-In-Package (SIP)." International Symposium on Microelectronics 2010, no. 1 (January 1, 2010): 000494–97. http://dx.doi.org/10.4071/isom-2010-wa4-paper6.

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Over the past several decades the quest to design electronics that boast ever increasing capabilities while continuously decreasing their size and weight has led to the development of a series of new packaging solutions. As the need for more functionality in less real estate increased, Multiple Chip Modules (MCM) were no longer satisfactory in many applications. Today, these applications call for a highly integrated packaging approach which often incorporates multiple functionalities into one package. In situations where time to the market for SOC (System on a Chip) is too slow or too costly the approach of System-in-a-package (SIP) can be the ideal solution. One element in modern packaging is the use of new 3D structures and high-k dielectric materials. The second element is advanced packaging methods. New technologies such as chip-on-chip assemblies have been developed. The third element has been the progression in design tools that allow engineers to seamlessly design an overall, highly integrated system. The forth element, testing, is often an expensive part of product development. With SIP technology that cost can be significantly lowered, making new product development economically more feasible. In this paper we present a systematic approach to designing highly integrated and miniaturized SIP packages. This approach enables rapid design, prototyping and time to production while achieving a new level of integration, miniaturization and reliability. Finally, a case study is presented to demonstrate a typical maturity cycle of a SIP, in this case for a wireless application.
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Vincent, Michael, Doug Mitchell, Jason Wright, Yap Weng Foong, Alan Magnus, Zhiwei (Tony) Gong, Scott Hayes, and Navjot Chhabra. "3D RCP Package Stacking: Side Connect, An Emerging Technology for System Integration and Volumetric Efficiency." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000447–51. http://dx.doi.org/10.4071/isom-2013-wa14.

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Fan-out wafer level packaging (FO-WLP) has shifted from standard single die, single sided package to more advanced packages for System-in-Package (SiP) and 3D applications. Freescale's FO-WLP, Redistributed Chip Package (RCP), has enabled Freescale to create novel SiP solutions not possible in more traditional packaging technologies or Systems-on-Chip (SoC). Simple SiP's using two dimensional (2D), multi-die RCP solutions have resulted in significant package size reduction and improved system performance through shortened traces when compared to discretely packaged die or substrate based multi-chip module (MCM). More complex 3D SiP solutions allow for even greater volumetric efficiency of the packaging space. 3D RCP is a flexible approach to 3D packaging with complexity ranging from Package-on-Package (PoP) type solutions to systems including ten or more multi-sourced die with associated peripheral components. Perhaps the most significant SiP capability of the RCP technology is the opportunity for heterogeneous integration. The combination of various system elements including, but not limited to SMD's, CMOS, GaAs, MEMS, imaging sensors or IPD's gives system designers the capability to generate novel systems and solutions which can then enable new products for customers. To enable this ever increasing system integration and volumetric efficiency, novel technologies have been developed to utilize the full package space. Technologies such as through package via (TPV) and double sided redistribution are currently proving successful. For this discussion, an emerging technology for 3D RCP package stacking that can further enhance design flexibility and system performance is presented. This technology, package side connect, utilizes the vertical sides of packages and stacked packages to capture a normally unused piece of package real-estate. Mechanical and electrical characterization of successful side connects will be presented as well as reliability results of test vehicle packages using RCP packaging technology.
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O'Toole, Eoin, Steffen Kroehnert, José Campos, Virgilio Barbosa, and Leonor Dias. "Package Thickness - Ultrathin WLFO (Wafer-Level Fan-Out)." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000305–8. http://dx.doi.org/10.4071/isom-2016-wp31.

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Abstract NANIUM's Fan-Out Wafer-Level Packaging technology WLFO (Wafer-Level Fan-Out) is based on embedded Wafer-Level Ball Grid Array technology eWLB of Infineon Technologies [1]. Since it′s invention almost 10 years ago, it became the leading technology for Fan-Out Wafer-Level packages. The WLFO technology is based upon the reconstitution of KGD (known good die) from incoming device wafer, independent of wafer diameter and material, to recon wafer format of active semiconductor dies or other active/passive components separated by mold compound applied through compression molding on a temporary mold carrier. The resulting recon wafer can be processed in standard wafer processing equipment. One of the challenges for the future of semiconductor packaging is reduction of the board level volume real estate occupied by each component. With the drive towards lower profile end user devices incorporating large display area and battery life the three dimensional space available for semiconductor packages is diminishing. It is well known that WLFO single die packaging but even more significant system integration enables the shrinkage of the XY footprint of the package through flexible very dense heterogeneous system-in-package integration [2]. But one of the disruptive advantages of the substrate-less WLFO technology is to also permit significant reduction of the overall package height (Z). A total package height for a BGA package including solder balls <500um and for a LGA package with solder land pads only <300um is achievable today, and further development towards even thinner packages is on the way.
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La Porta, Antonio, Jonas Weiss, Roger Dangel, Daniel Jubin, Norbert Meier, Folkert Horst, and Bert Jan Offrein. "Broadband and scalable optical coupling for silicon photonics using polymer waveguides." Advanced Optical Technologies 7, no. 1-2 (April 25, 2018): 107–13. http://dx.doi.org/10.1515/aot-2017-0064.

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AbstractWe present optical coupling schemes for silicon integrated photonics circuits that account for the challenges in large-scale data processing systems such as those used for emerging big data workloads. Our waveguide based approach allows to optimally exploit the on-chip optical feature size, and chip- and package real-estate. It further scales well to high numbers of channels and is compatible with state-of-the-art flip-chip die packaging. We demonstrate silicon waveguide to polymer waveguide coupling losses below 1.5 dB for both the O- and C-bands with a polarisation dependent loss of <1 dB. Over 100 optical silicon waveguide to polymer waveguide interfaces were assembled within a single alignment step, resulting in a physical I/O channel density of up to 13 waveguides per millimetre along the chip-edge, with an average coupling loss of below 3.4 dB measured at 1310 nm.
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Vallabhajosyula, Phani. "Stencil Print solutions for Advance Packaging Applications." International Symposium on Microelectronics 2017, no. 1 (October 1, 2017): 000646–51. http://dx.doi.org/10.4071/isom-2017-poster1_124.

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Abstract This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high-performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um–40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package. Cavity technology can be an effective solution in reducing the total assembled PCB thickness (Z-height), most importantly, on designs utilizing taller - stacked devices. Traditionally, dipping process or dispensing process was used to deposit solder paste, flux, or glue on uneven surfaces. However, this takes a longer time when compared to printing using a stencil printer. Reservoir printing using a stencil printer has greater potential in such application. Extensive work has been done in the past to print glue, solder paste and/or flux into cavities using reservoir printing. This paper focuses on printing solder paste into multiple cavities (stencil pockets) with depths ranging from 355 microns to 450 microns, and with varying cavity size, wall angles and various stencil thicknesses ranging from 100 microns to 150 microns. Apertures varying in area ratio were placed in these cavities and experiments were conducted to analyze the print performance of the stencils. As the size of the components and boards/substrates gets smaller - closer placement of components to the cavity (stencil pocket) walls needed to be assessed as well. These applications, the associated stencil design and print results were discussed in detail in this paper.
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Narasimhan, Susheela, Herman Chu, Mudasir Ahmad, and Li Li. "Thermal Challenges in 3D Stacks." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001354–72. http://dx.doi.org/10.4071/2012dpc-wa11.

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Thermal Management of high performance 3D SiP Modules is gaining momentum in telecommunication and networking applications. With increasing need for bandwidth and reduced real estate on boards, there is an acute need for 3D SiP modules. At the same time, the stacked modules come with a host of new challenges in terms of thermal management, packaging, thermo-mechanical stresses etc. This study looks at one such module with stacked dies for memories along with another high performance silicon all under a single lid. The study focuses on the effect of underfill materials on thermal performance, effect of through silicon vias, effect of non-uniform heat source on hot spots on the die etc. It will also focus on thermal management of a single module as well as a series of modules in a networking application. The effect of thermo-mechanical stresses will also be investigated and conclusions drawn on the effect of each of these parameters.
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Kummerl, Steven, Charles Devries, Usman Chaudhry, and Chong Han Lim. "Increase Power Density and Simplify Designs Using 3-D SiP Modules." International Symposium on Microelectronics 2018, no. 1 (October 1, 2018): 000326–30. http://dx.doi.org/10.4071/2380-4505-2018.1.000326.

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Abstract Today, designers are demanding an overall form-factor reduction to save board space, increase functionality, and allocate more circuit board real estate toward end-user applications – all with less space allocated to power management where not just the X–Y shrink but the 3D volumetric shrink is required. For example, in today's Telecommunications Cloud Infrastructure systems, board space and power density are challenging particularly in power supply designs where several high-current point-of-load rails are present. End equipment such as enterprise servers and switches, workstations, base stations, network attached storage, FPGA testers, network testers, and other test and measurement equipment employ several high-current CPUs, ASICs, FPGAs, and DDR memory – all of which need high power, while the available board area is steadily decreasing. This paper will discuss volumetric co-design methodology and packaging construction trade-offs for 3D SiP power modules and also introduce the straddle mounted inductor assembly technique. Also provided are details around the SiP eco-system, co-design, construction, materials, and circuit topology.
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Kelly, Michael, and Rick Reed. "ARM Dual Core Product Demonstration with 2.5D Through-Silicon-Via (TSV)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2014, DPC (January 1, 2014): 000665–93. http://dx.doi.org/10.4071/2014dpc-tp11.

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Through-silicon-via (TSV) package construction offers several silicon integration advantages that are being validated by leading technology providers. This paper will describe a System in Package (SiP) design utilizing two functional system-on-chip (SoC) ARM dual-core Cortex-A9 processors connected across a 2.5D silicon interposer. The test vehicle was designed to demonstrate high speed and high bandwidth communication between multiple chips. The two logic chips were designed by Open Silicon, Inc. and fabricated by GLOBALFOUNDRIES on their 28nm-SLP (Super Low Power) process technology. GLOBALFOUNDRIES also fabricated the 2.5D interposer using their 65nm manufacturing flow. Amkor Technology provided the final assembly utilizing advanced TSV packaging technologies such as copper pillar bumping and mass reflow bonding. This is a pivotal demonstration of the heterogeneous die integration approach. A silicon process node or package interconnect density can either preserve or limit inter-chip communication when comparing SoC versus SiP approaches. Connecting two dual-core Cortex-A9 processors within a single package illustrated the expansion of function through multiple die. The test vehicle also implies that a large IC can be re-architected into smaller constituents to increase yield or design flexibility. By utilizing the best technology node for price and performance, 2.5D packaging can lower overall system cost of ownership or conversely, can expand overall performance through multiple high performance ICs. Chip designers are facing increased complexity and higher costs in order to move to smaller IC geometries and the adoption of 2.5D TSV technology will increase the options of construction (one vs. multiple die/SoCs). Having the flexibility to design with one or multiple die while maintaining high performance levels can offset the real estate costs of advanced nodes, permit silicon die reuse, improve yield and decrease overall product risk. The designer must choose the most appropriate silicon and assembly processes that satisfy the needs of each of the major functions in the overall system. Amkor's assembly process for this key product construction has been demonstrated on a range of products for the communications, graphics and the mobile markets. Process flexibility has been a key factor in addressing different markets and package complexity.
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Dissertations / Theses on the topic "Packaging of real estate"

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Karoumi, Maria. "Paketering av Fastigheter : Innebär paketeringsutredningen ett hot mot den svenska fastighetsmarknaden?" Thesis, KTH, Fastigheter och byggande, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-211437.

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Den svenska fastighetsmarknaden är attraktiv. På senare år har branschen upplevt stora framgångar, samt lyckats leverera goda resultat. Det är något som både främjats till följd av vårt överlag låga ränteläge, samt då branschen kännetecknats av en god lönsamhet. Det har även speglats av antalet avslutade fastighetsaffärer, som år efter år resulterat i nya transaktionsrekord. Bara under 2016 bytte fastigheter till ett värde om ca 200 miljarder kronor ägare.  Majoriteten av de transaktioner som sker bolag emellan sker i form av en fastighetspaketering. Orsakerna till detta är flera, men den mest avgörande är de speciella skatteregler som går att utnyttja vid detta avyttringsförfarande.  Möjligheterna till att paketera fastigheter har funnits sedan 2003. Genom införandet av nya regler gällande överlåtelser av s.k. näringsbetingade andelar, skapade man även en möjlighet att ta ut en skattefri kapitalvinst vid överlåtelse av andelstypen. Reglerna var aldrig specifikt riktade mot fastighetsöverlåtelser, utan skulle kunna användas för överlåtelser av alla typer av tillgångar. Dock visade sig reglerna speciellt fördelaktiga för tillgångar med lång avskrivningstid, varav fastigheter är en av dessa.  Genom att ett bolag som avser att avyttra en fastighet gör det i form av en paketering innebär således att man kan undgå att skatta på den kapitalvinst som avyttringen resulterar i. Förfarandet det sker genom kan se ut på flertalet olika sätt, varav detta arbete undersökt den vanligaste formen. Att en majoritet av alla kommersiella fastighetsägare använder sig av avyttringsmetoden innebär, förutom skattefördelar för dem, även kostnader. Dock uppstår majoriteten för samhället i form av stora statliga skattebortfall.  I juni 2015 tillsatte regeringen en utredning som kom att benämnas som paketeringsutredningen. Utredningen syftade främst till att kartlägga den skattemässiga situationen för bolag inom fastighetsbranschen, samt undersöka huruvida fastighetsbranschen kunde anses vara skattemässigt gynnad eller ej. Man avsåg även att undersöka huruvida fastighetspaketeringar har använts som ett verktyg för skatteplanering. Utredningens resultat presenterades den 30 mars 2017.  Detta examensarbete har undersökt hur förändringarna kan komma att slå mot den svenska fastighetsmarknaden och dess aktörer. Arbetet har även syftat till att klarlägga hur paketeringarna i dagsläget sker, samt hur de kommer påverkas om förslagen leder till författningsändringar. Detta genom att både genomföra en djupgående litteraturanalys, samt flertalet intervjuer.  De förslag som presenterats har än så länge bidragit till oro, ovisshet och en ökad misstro. Kritiken från fastighetsbranschen har varit enorm, och vissa som intervjuats har antytt att aktörer på marknaden finner det svårt att veta hur man ska agera. Man har även angett att utredningen innehåller flertalet brister, och att man inte samordnat den med andra kommande förändringar. Flertalet aktörer har även ansett det som mycket upprörande att vissa av förslagen förväntas bidra till höjda bokostnader och ett minskat bostadsbyggande.       Betänkandet är för tillfället (juni 2017) ute på remiss. Svaren ska ha inkommit den 14 augusti, och därefter återstår det att se hur man fortskrider. Utifrån de slutsatser arbetet resulterat i kommer förslagen aldrig antas i sin nuvarande form, men det råder fortfarande en viss ovisshet kring detta. Frågan som avgör bör dock grundas i huruvida man vågar riskera fastighetsmarknadens attraktivitet, och i viss mån då även den finansiella stabiliteten.  Den ovisshet som i nuläget råder på marknaden, samtidigt som transaktionsvolymerna är på rekordnivåer, är ingenting vi klarar av långsiktigt. Inte om vi samtidigt strävar efter en välmående marknad. Aktörer på fastighetsmarknaden har all rätt att vara oroliga. Vi står inför en tid av förändring, dock är det omöjligt att förutspå hur den kommer se ut eller slå. Dock kan vi vara säkra på att marknaden kommer se annorlunda ut än den vi ser idag.
The Swedish real estate market is attractive. In recent years, the industry has experienced great success as well as managed to deliver good results. This is both a consequence of the generally low interest rates, and the fact that the industry is characterized by good profitability. Its attractiveness can also be confirmed by the number of completed property transactions, which seems to set new records year after year. Just in 2016, properties of a value of 200 billion kronor changed owners.  The majority of the transactions between Swedish companies are in form of a property packaging, in which the property is placed within a holding company. There are several reasons for this choice of method, even though the most decisive one is due to taxation purposes. The packaging procedure can be done in several different ways, from which this master thesis has examined the most common one. The possibility to use this divestment method has existed since 2003. This year new tax legislation was introduced, which allowed for capital gains on shares that were held for business purposes to be tax exempt. This made it possible for any company, which intended to transfer a certain property and did this in form of packaging, to automatically avoid taxing the capital gain the transfer resulted in. The legislation was never solely intended for real estate transactions, yet the legislator whished to ease the transaction of any kind of asset. However, the legislation proved to be particularly beneficial for assets with a long depreciation period, of which real estate is one of these. The fact that a majority of all commercial property owners make use of this method results in, besides the tax benefits for them, also costs. However aren’t these anything they will be affected by directly, but will instead arise for society in the form of state tax losses.  In June 2015 the Swedish government appointed an inquiry, which was referred to as the “packaging inquiry”. Its primary aim was to map the tax situation for companies in the real estate industry, as well as investigating whether the real estate industry could be considered tax-benefit or not. The government also had a plan for the investigators to examine whether real estate packaging has been used as a tool for tax planning. The results from the inquiry were presented on March 30, 2017.  This master’s thesis has, based on the inquiry’s results, investigated how upcoming measures may affect the Swedish real estate market and its actors. It has also aimed at clarifying how real estate packaging is currently taking place, and how the method will be affected if the proposed measures will lead to constitutional changes. This by conducting an in-depth literature analysis and several interviews.  The measures presented have so far only contributed to concern, uncertainty and an increased distrust. The criticism from the real estate industry has been huge, and according to interviewees does many market actors find it hard to know how to act in response to the possible upcoming changes. Some has also claimed that the inquiry has been conducted in a faulty way and thus contains several deficiencies. Similarly has some stated that it hasn’t been coordinated with the forthcoming interest rate deduction rules. Criticism has also been received regarding the fact that some of the proposals may imply increased housing costs and a decline in housing construction. This has been seen as very worrying.  The report that the inquiry resulted in is currently (May 2017) submitted for comment. The answers must be submitted no later than August 14, and thereafter it remains to be seen how to proceed. Based on the conclusions this thesis has resulted in, the proposed measures will never be implemented in their present form. However is there still some uncertainty about this. Anyhow, the question that should determine how it all ends should mainly be based on whether or not the government dares to risk the attractiveness of the Swedish real estate market, and to some extent also the financial stability.  The uncertainty that currently characterizes the market, while the transaction volumes are at record levels, is nothing we can manage in the long term. Not if we, at the same time, want to maintain a prosperous market. Change may in the long run be inevitable, but it’s important to remember that it should be implemented correctly and observe the interests of all involved parties. Actors in the real estate market have every right to be worried. We face a time of change, but it’s impossible to predict how it will end. However, we can be sure of that the market will definitely look different from how it is today.
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Fröberg, Ida, and Maria Hellsten. "Aktiebolags syn på fastighetsöverlåtelser genom köpehandling." Thesis, Högskolan i Gävle, Avdelningen för Industriell utveckling, IT och Samhällsbyggnad, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:hig:diva-19795.

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Olika aktörer på fastighetsmarknaden har svårigheter att värdesätta kommersiella fastigheter på grund av den minskade transparensen på marknaden. Den minskade transparensen är ett resultat av att färre fastigheter överlåts genom köpehandling idag. Syftet med denna studie är att skapa en ökad förståelse på fastighetsmarknaden och på så vis underlätta för olika aktörer på fastighetsmarknaden att genomföra marknadsanalyser. Målet är att utreda varför vissa bolag väljer att överlåta sina fastigheter med köpehandling istället för att överlåta fastigheter genom att paketera den i ett dotterbolag. Två rättsfall har studerats för att få rättsväsendets bedömningar. Genom rättsfallen kunde det konstateras att det råder en viss osäkerhet i hur beskattningen ska genomföras vid fastighetsöverlåtelser. Denna osäkerhet kan leda till att bolagen väljer att överlåta fastigheterna genom köpehandling där rättsläget är mycket tydligare.   För att utreda varför bolag väljer att överlåta kommersiella fastigheter genom köpehandling har en intervjustudie genomförts. Intervjustudien påvisade att bolagens val av överlåtelseform är beroende av de för- och nackdelar samt de skattemässiga konsekvenser som överlåtelsen medför. Intervjustudien visar även att enklare överlåtelseprocesser föredras av bolagen samt att de säljande bolagen vill uppnå en ekonomisk vinning genom överlåtelserna av fastigheterna.   Slutsatsen är att säljarens val av överlåtelseform är beroende på utfallet av kalkyleringsmetoden, köparens påverkan på överlåtelseformen samt hur komplicerad överlåtelseprocessen får vara. Den ökade transparensen som överlåtelser genom köpehandling bidrar till gör att de olika aktörernas marknadsanalyser på fastighetsmarknaden kan förenklas och bli mer tillförlitliga. Utöver detta avser regeringen att tillsätta en utredning angående skatteplanering i samband med då fastigheter paketeras i bolag. Beroende på vad regeringens utredning får för utfall kan antalet överlåtelser på fastighetsmarknaden ändras vilket skulle kunna vara intressant att undersöka i en framtida studie.
Different participants in the real estate market have difficulty in valuing commercial real estate due to reduced market transparency. The reduced transparency is a result of fewer properties being transferred by way of document of purchase today. The purpose of this study is to create a better understanding of the property market and be able to provide market participant with an improved understanding how to analyze this market. The objective is to investigate why some companies choose to sell properties by way of document of purchase instead of transferring the property by using a limited company structure. Two legal cases have been reviewed for judicial assessments. The court cases analysis showed the degree of turnover of property transfers can lead to uncertainty in terms of possible tax implications. This uncertainty might lead to companies choosing to transfer properties by way of document of purchase due to the much clearer legal position.   An interview study has been conducted to investigate why companies transfer commercial properties through the use of purchase document. The study showed that companies’ choice of transfer form is dependent on the advantages and disadvantages of the form together with possible tax implications. The interview study also showed a simple transfer process is preferred together with financial gains when selling properties.   The conclusion is that the seller’s preferred choice of transfer form is dependent on the outcome of the project models, the purchasers’ impact and how complicated the transfer process may be. The increased level of transparency achieved by using document of purchase makes it easier for participants in the real estate market to conduct market analysis and also to make the results more reliable. In addition to this the Swedish government intends to launch an investigation into potential effects of tax planning in connection with the use of limited corporate structures. The number of transferals in the property market could potentially change dependent on the outcome of the government’s investigation and if so this could be an interesting topic for a future study.
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Wåhlin, Johannes. "Real Estate Tokenizing : Blockchain Technology in Real Estate." Thesis, KTH, Fastigheter och byggande, 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-298315.

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Real estate assets are often considered as illiquid due to capital and transaction barriers. As a response, real estate tokenizing is a rising phenomenon. Real estate tokenizing combines the benefits from the private and the public real estate market, by creating a product with direct real estate commitment to low capital requirements and efficient transaction processes. The product is called real estate token, a digital share of an asset. Real estate tokens enable hypothetical fractionalization of properties with means of blockchain technology and smart contracts. This study investigate the pros and cons of real estate tokenizing as well as the financial performance of publicly traded US residential real estate tokens. The study states that fractionalization of properties increases access and customizability of real estate investments. Furthermore, the blockchain technology and the smart contracts enable automatization of transaction processes and asset management. Altogether, the benefits may result in a higher liquidity. However, the study also states several drawbacks with real estate tokenizing, such as lack of management and deeds, scalability problems and liquidity paradoxes. Furthermore, this study shows that US residential real estate tokens underperform both S&P 500 and housing index in terms of risk-adjusted return. Moreover, the real estate token market seems to correlate more with the S&P 500 than with the housing market. The study concludes that the cons with real estate tokenizing exceed the pros, although the phenomenon has great potential in a more mature market. However, real estate tokenizing will face implementation obstacles when converting the real estate industry to blockchain technology. As such, the success of real estate tokenizing is dependent on the global view of blockchain technology.
Fastigheter betraktas ofta som illikvida på grund av kapital- och transaktionsbarriärer. Som svar på den bristande likviditeten är blockchainteknologi inom fastigheter, även känt som ”real estate tokenizing”, ett växande fenomen. Real estate tokenizing ämnar till att kombinera fördelarna från den privata och den publika fastighetsmarknaden genom att skapa en produkt med direkt fastighetsexponering till låga kapitalkrav och effektiva transaktionsprocesser. Produkten kallas ”real estate token”, en digital andel av en tillgång. Real estate tokens möjliggör hypotetisk fraktionering av fastigheter med hjälp av blockchainteknologi och smarta kontrakt. Denna studie undersöker för- och nackdelar med real estate tokenizing såväl som finansiell prestation av publikt handlade real estate tokens inom det amerikanska bostadssegmentet. Studien konstaterar att fraktionering av fastigheter ökar tillgängligheten och anpassningsbarheten i fastighetsinvesteringar. Vidare möjliggör blockchainteknologi och smarta kontrakt automatisering av transaktionsprocesser och förvaltning. Sammantaget kan fördelarna med real estate tokenizing leda till högre likviditet. Studien konstaterar emellertid också flera nackdelar med real estate tokenizing, såsom brist på management och panträtt, storskalbarhetsproblem och likviditetsparadoxer. Vidare visar studien på att publikt handlade real estate tokens inom det amerikanska bostadssegmentet underpresterar både S&P 500 och bostadsindex i termer av riskjusterad avkastning. Dessutom verkar marknaden för publikt handlade real estate tokens inom det amerikanska bostadssegmentet korrelera mer med S&P 500 än med bostadsmarknaden. Studien konkluderar att nackdelarna med real estate tokenizing överstiger fördelarna i dagsläget, även om fenomenet har stor potential på en mer mogen marknad. Real estate tokenizing riskerar dock att möta implementeringshinder när fastighetsbranschen ska konverteras till blockchainteknologi. Således är framgången för real estate tokenizing beroende av den globala synen på blockchainteknologi.
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Juan, He. "China's real estate policies and real estate market responses." View electronic thesis, 2008. http://dl.uncw.edu/etd/2008-3/r3/juanh/hejuan.pdf.

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Boos, Erik, Ludwig Wahlqvist, and Daniel Maman. "Fastighetspaketering : Det populära förfarandets effekt för mindre fastighetsbolag." Thesis, Malmö universitet, Institutionen för Urbana Studier (US), 2021. http://urn.kb.se/resolve?urn=urn:nbn:se:mau:diva-43052.

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Det populära förfarandet fastighetspaketering som idag är branschnorm, innebär att det ägande bolaget överlåts och utseendet på transaktionsprocessen förändras. Förändringen innebär en utökad undersökningsprocess, i form av en Due Diligence. Due Diligence innebär vanligtvis en undersökning av fastighetens tekniska, ekonomiska och juridiska aspekter. Fastighetspaketeringar medför däremot en ytterligare undersökning parallellt av bolaget. Syftet med studien är att undersöka hur mindre aktörers transaktionsprocess påverkas vid förvärv av paketerade fastigheter samt vilka konsekvenser deras Due Diligence får. För att uppnå studiens syfte har en kvalitativ metod använts för att begrunda det empiriska materialet. Det empiriska materialet grundar sig på fyra semistrukturerade intervjuer med respondenter från mindre fastighetsbolag.  Studien visar att transparensen på den svenska fastighetsmarknaden är högre än genomsnittet, trots detta förekommer asymmetrisk information. Den asymmetriska informationen kan däremot motverkas genom en Due Diligence. Därav krävs det att informationen i en Due Diligence bearbetas på ett korrekt och kontrollerat sätt, om så inte vore fallet utmynnar det i en kostsam process. På så vis är mindre fastighetsbolag villiga att betala kostnaden för informationen i en Due Diligence. Bearbetas inte informationen fullständigt kan det leda till lägre lönsamhet, vilket studien påvisar vara en avgörande faktor för mindre fastighetsbolag.
Packaging of Real Estate is today considered a popular transaction method and an industry norm. A result of the procedure is that the owning company is transferred in the transaction, however this means that the appearance of the transaction process changes. The change involves an extended investigation process, in the form of a Due Diligence. Due Diligence usually refers to an investigation of the property’s technical, financial and legal aspects. Packaging of real estate, on the other hand, entails an added parallel investigation of the company. The purpose of this study is to investigate how the transaction process affects smaller real estate companies by the acquisition of packaged properties, and what consequences it has on their Due Diligence. To achieve the purpose of this study, a qualitative method has been used to gather our empirical data. The empirical material is based on four semi-structured interviews with four different interviewees from smaller real estate companies. The study shows that transparency in the Swedish real estate market is above average, despite this, asymmetric information occurs. The asymmetric information, on the other hand, can be counteracted by Due Diligence. Therefore, it is required that the information in a Due Diligence is processed in a correct and controlled manner, otherwise it results in a costly process. Therefore, smaller real estate companies are willing to pay the cost of information in a Due Diligence. Failure to process the information completely can lead to lower profitability, which the study shows is a decisive factor for smaller real estate companies.
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Gunnelin, Åke. "Real options in real estate." Doctoral thesis, KTH, Fastigheter och byggande, 2000. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-2982.

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This is a doctoral dissertation presented to the FacultyBoard of the Royal Institute of Technology. The dissertationconsists of three self-contained essays on real option pricing.Essay I, written in Swedish, was presented at seminar andaccepted as fulfilling the requirement for a Licentiate Degreein Engineering thesis in 1995. Essay I: This essay studies the option to develop vacantland when the landowner simultaneously determines the optimaldensity and timing of a development. Williams (1991) andCapozza and Li (1994) have recently studied the landdevelopment decision from a realoptions perspective. Bothpapers assume that the production technology is of the commonlyused Cobb-Douglas type, but they use different assumptionsabout uncertainty over future rents and construction costs. Ananalysis of these models and their limitations is carried outand as a result valuation models based on other productiontechnologies than the Cobb-Douglas technology are derived. Essay II: McDonald and Siegel (1996) show that when thebenefit from an investment and the investment cost are assumedto follow correlated geometric Brownian motions, the optimalinvestment policy is given by a simple rule: Invest the firsttime the benefit-cost ratio reaches a certain level. In thisessay, which models the decision to change the use ofaproperty, the investment rule is found to be more complicated.Optimal redevelopment will take place for differentbenefit-cost ratios depending on the relative sizes of thevalue of the property in the different uses and the cost ofchanging the use. Also, for a given current benefit-cost ratiothe value of the option to change use will vary significantlydepending on the relative sizes of the state variables. Essay III: The relationship between the option to choose thecapacity of a real estate development and deliberateoverbuilding is studied in a simple model of investment underuncertainty. The model provides an intuitive measure ofdeliberate overbuilding: the difference between the number ofrental units the owner of an undeveloped site optimally choosesto produce and the number of units expected to be leased at thetime of the building's completion. Numerical simulations withreasonable parameter values show that in some economicenvironments, the optimal production strategy can be to producemore units than are expected to be leased at completion of thedevelopment.

QC 20100611

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Björklund, Kicki. "Real estate performance." Doctoral thesis, KTH, Real Estate and Construction Management, 1999. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-2885.

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This dissertation consists of five papers addressing variousreal estate performance issues (see full titles in italicsbelow). The dissertation is empirical in nature and the dataused in most of the empirical sections consist of figures forincome-producing property returns. Paper 1 was presented atseminar and accepted as a Licentiate Degree in Engineeringthesis. Papers 2 to 5 were all written jointly with others (thenames of the co-authors appear later in the dissertation).Paper 3 has been published in theJournal of Real Estate Research, and Papers 2, 4, and 5,are also intended for publication in academic journals.

The objective of Paper 1, entitledCapital Recovery and Long-run Profitability, was to findempirical and scientific support for adopting measurements ofprofitability featuring stability, simplicity and reliability,that could easily be implemented into existing administrativeroutines, and which could also support effectivedecision-making. The model was empirically tested throughanalysing the profitability of individual properties andproperty portfolios. The portfolios studied were put togetherfeaturing variation in property location, usage and initialperformance expectations.

Paper 2, entitledAn Investigation of Property Price Studies, constitutesan untraditional literature review covering articles whereprice equations in the real estate market have been estimatedusing regression techniques. This paper examines the degree towhich these studies follow good scientific practice whenreporting on the econometric issues. It also presents adescriptive overview of the prevalence of these articles in theliterature, and the significance of the various topicsaddressed by these studies. This paper was prepared in 1996 andexamines 145 articles published between 1990 and 1995 from 12highly regarded (see later) research journals on real estate,housing and urban economics.

Paper 3,entitledProperty Cycles, Speculative Bubbles and the Gross IncomeMultiplier, addresses the issue of whether or not theoccurrence of significant price increases during the upturn ina property cycle can be attributed to a speculative bubble. Thefindings of this study indicate that a speculative bubble mayhave driven the Swedish income-producing real estate marketduring the 1980s. This conclusion is based on an analysis ofpanel data where the state of the property cycle has beenmirrored by the value of the Gross Income Multiplier (GIM).

In Paper 4, entitledAnalysing Performance in a Constant Sample of Mixed-useProperties, property performance was analysed using annualtotal rate of return (TRR) data for a sample of 138 mixed-useincome-producing properties from 1979 to 1997. The empiricalanalysis using panel data models involve three-step analyses.In step 1, various different TRR definitions were compared andfound to provide almost identical results at the portfoliolevel. In step 2, regression analyses were used to explain thevariation in the TRR. The percentage of commercial space inparticular was found to have an important and cycle-dependentimpact. Regression has also been used for explaining theindividual deviation from the mean TRR. In step 3, maintenancecosts and investments were found to have a significanteffect.

In Paper 5, entitledRent Determinant and Rent Drift in a Housing Market underRent Control, residential rent 1990− 1997, wasstudied from an investor’s point of view. Estimations wereconducted using rent equations to analyse whether or not rentlevels varied between locations while other rent-affectingvariables were held constant, and found evidence suggestingthat they did. Annual increases in the effective rent chargedfor privately owned residential properties were compared withthe official increases set via official negotiation formunicipality owned residential housing to see whether excessiverent increases (indicating rent drift) could be found. Evidencewas found to support the existence of rent drift, and also thatthis rent drift is partly explainable in terms of investmentand maintenance.

Keywords: Depreciation, gross income multiplier, netoperating income, property performance, real estateprofitability, profitability, residential rent, total rate ofreturn,

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Eichholtz, Petrus Mattheüs Alphonse. "Real estate diversification." Maastricht : Maastricht : Rijksuniversiteit Limburg ; University Library, Maastricht University [Host], 1994. http://arno.unimaas.nl/show.cgi?fid=5759.

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Knapp, Eric A. "Real estate acquisition." Thesis, Massachusetts Institute of Technology, 1986. http://hdl.handle.net/1721.1/75515.

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Luque, Arancibia Paula, and Ureta Gonzalo Andrés Román. "Real estate consultants." Tesis, Universidad de Chile, 2014. http://www.repositorio.uchile.cl/handle/2250/117599.

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Tesis para optar al grado de Magíster en Administración
No trae autorizaciones, para ser publicada en el Portal de Tesis Electrónicas de la U. de Chile.
Luque Arancibia, Paula [Parte I Análisis estratégico y de mercado],Román Ureta, Gonzalo Andrés [Parte II Análisis organizativo-financiero]
rescon es una consultora pensada para evitar o solucionar problemas de propiedad común, que afecten a inmobiliarias, comunidades y gestores de negocios inmobiliarios, en un mercado donde hay clientes insatisfechos y empoderados para legalizar sus requerimientos, lo cual conlleva a los oferentes a proteger su marca, en una ciudad donde la escasez de espacio incrementa la cantidad de proyectos en comunidad (ver anexo n°17). Agregar valor a los activos de los clientes, disminuir costos ocultos, evitar compensaciones y mejorar la imagen de marca, son algunos de los beneficios que el grupo objetivo podrá obtener, mediante una propuesta fundamentada en compromiso y profesionalismo. Con experiencia y know-how, la empresa responderá a una nueva necesidad, siendo pioneros en un incipiente mercado estimado de MM$1.100, donde obtener una participación del 20% al quinto año en la Región Metropolitana es factible, ya que el servicio no existe y se trata de un sector específico con escasos profesionales. Para cumplir con los objetivos de la compañía, se ha diseñado un plan de marketing multisegmento para proyectos en gestación y en marcha, que ofrece rapidez y profesionalismo a un precio competitivo, a través de una fuerza de ventas cercana y especializada. El modelo contempla una estructura de costos basada en colaboradores externos en función de las ventas, con tecnologías de gestión de clientes, y un centro de operaciones con una ubicación estratégica, que permitirá entregar un servicio de calidad optimizando el tiempo. El capital humano, su formación continua, y las relaciones con las instituciones que validan la información de la industria, son los factores críticos para el éxito de un proyecto fundamentado en el conocimiento, la empatía de sus personas y la calidad de servicio. Evaluado a 8 años, para llevar a cabo el negocio se requiere una inversión inicial de MM$30, la cual se estima recuperar al cuarto año de operación. Con bajos costos fijos y bajas barreras de salida, los flujos del modelo arrojan una TIR de 34,3%, mientras que el VAN es de MM$28 con una tasa de descuento de un 17,9%.
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Books on the topic "Packaging of real estate"

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Harkin, Allana. Real estate. Toronto: Playwrights Canada Press, 2007.

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Wofford, Larry E. Real estate. 3rd ed. New York: Wiley, 1992.

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Wetherington, Donald L. Real estate. Charlottesville, Va: Michie Co., 1986.

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1962-, Hainsworth-Straus Christine L., ed. Real estate. Vero Beach, FL: Rourke Publications, 1997.

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Real estate. New York: S. French, 1985.

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1952-, Smith James Charles, ed. Real estate. New York: Aspen Publishers, 2006.

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Wofford, Larry E. Real estate. 2nd ed. New York: Wiley, 1986.

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1952-, Smith James Charles, ed. Real estate. Gaithersburg: Aspen Law & Business, 2000.

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Stoebuck, William B. Real estate. St. Paul, Minn: West Pub. Co., 1995.

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Dasso, Jerome J. Real estate. Englewood Cliffs, N.J: Prentice Hall, 1995.

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Book chapters on the topic "Packaging of real estate"

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Kakushadze, Zura, and Juan Andrés Serur. "Real Estate." In 151 Trading Strategies, 229–40. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-030-02792-6_16.

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Abate, Guido. "Real Estate." In Asset Management and Institutional Investors, 403–31. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-32796-9_14.

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Russell, James S. "Real Estate." In The Agile City, 57–82. Washington, DC: Island Press/Center for Resource Economics, 2011. http://dx.doi.org/10.5822/978-1-61091-027-9_3.

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Suárez, José Luis. "Commercial Real Estate." In European Real Estate Markets, 50–81. London: Palgrave Macmillan UK, 2009. http://dx.doi.org/10.1057/9780230582460_3.

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Scarrett, Douglas, and Jan Wilcox. "Corporate real estate." In Property Asset Management, 243–62. Fourth edition. | Abingdon, Oxon ; New York, NY : Routledge, 2018.: Routledge, 2018. http://dx.doi.org/10.1201/9781315628943-8.

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Borges, Mariano S., Steven A. Klett, Mark R. Molepske, and Michael E. Straneva. "Real Estate Litigation." In Litigation Services Handbook, 1–31. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2015. http://dx.doi.org/10.1002/9781119204794.ch29.

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Mourouzi-Sivitanidou, Rena, and Petros Sivitanides. "Real estate economics." In Market Analysis for Real Estate, 19–52. First Edition. | New York: Routledge, 2020.: Routledge, 2020. http://dx.doi.org/10.4324/9780429279409-3.

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Mourouzi-Sivitanidou, Rena, and Petros Sivitanides. "Real estate economics." In Market Analysis for Real Estate, 19–52. First Edition. | New York: Routledge, 2020.: Routledge, 2020. http://dx.doi.org/10.1201/9780429279409-3.

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Armstrong-Taylor, Paul. "Real Estate Market." In Debt and Distortion, 145–57. London: Palgrave Macmillan UK, 2016. http://dx.doi.org/10.1057/978-1-137-53401-9_12.

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Pöll, Eleonore. "Public Real Estate." In Management for Professionals, 451–71. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-32031-1_29.

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Conference papers on the topic "Packaging of real estate"

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Ahmad, Mudasir, and Susheela Narasimhan. "Reverse Mount Packages and Their Cooling." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35231.

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The density of packaging in electronic enclosures is increasing rapidly and the real estate available for packaging high power ASICs and processors is decreasing very rapidly as well. This work presents a study where packages are mounted below the board and the ASICs are cooled using the sheet metal tray as the heat spreader. The heat is transferred from the processor or the chip to the sheet metal tray through metallic blocks or heat spreaders by conduction and then the sheet metal tray is cooled convectively by airflow between two successive boards. There are various issues to be encountered when we do such a design for reverse mount packages like the maximum stress exerted on the ASIC, the kind of interface material that should be used to minimize the stress induced on the ASIC and also keeping in mind the thermal impedance of the interface material. The study presents simulation and experimental results that illustrate the concept of using the sheet metal tray as a heat spreader and also discuss potential applications of this concept. Considerations and precautions to be taken while executing this concept are also addressed.
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Lau, John, Heng-Chieh Chien, and Ray Tain. "TSV Interposers With Embedded Microchannels for 3D IC and LED Integration." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52204.

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A low-cost (with bare chips), high cooling ability and very low pressure drop 3D IC integration system-in-package (SiP) is designed and described. This system consists of a silicon interposer with through-silicon vias (TSV) and embedded fluidic microchannels, which carries all the Moore’s law chips and optical devices on its top and bottom surfaces. TSVs in the Moore’s law chips are optional but should be avoided. This novel structural design offers potential solutions for high-power, high-performance, high pin-count, ultra fine-pitch, small real-estate, and low-cost 3D IC SiP applications.
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Orozco, A., J. Gaudestad, N. E. Gagliolo, C. Rowlett, E. Wong, A. Jeffers, B. Cheng, F. C. Wellstood, A. B. Cawthorne, and F. Infante. "3D Magnetic Field Imaging for Non-Destructive Fault Isolation." In ISTFA 2013. ASM International, 2013. http://dx.doi.org/10.31399/asm.cp.istfa2013p0189.

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Abstract While transistor gate lengths may continue to shrink for some time, the semiconductor industry faces increasing difficulties to satisfy Moore’s Law. One solution to satisfying Moore’s Law in the future is to stack transistors in a 3-dimensional (3D) formation. In addition, the need for expanding functionality, real-estate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques. We describe in this paper innovations in Magnetic Field Imaging for FI which have the potential to allow 3D characterization of currents for non-destructive fault isolation at every chip level in a 3D stack.
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Kamgaing, Telesphor, Jiangqi He, and Rockwell Hsu. "Embedded RF Filters for WLAN and Bluetooth Applications." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73319.

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This paper discusses the design and integration of RF filters in multilayer organic substrate. Using a methodic approach, several low-pass and band-pass filters have been designed, fabricated and fully characterized. The electrical analysis clearly indicates, which of the low-pass filters is less susceptible to process variations and therefore more appropriate for high volume manufacturing. It is shown that these filters provide electrical performance similar to their commercially available ceramic counterparts while using relatively smaller real estate. All filters are fabricated in the innermost layers of a multilayer organic package substrate with embedded passives capability.
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Sahan, Ridvan A., Rahima K. Mohammed, Amy Xia, and Ying-Feng Pang. "Advanced Liquid Cooling Technology Evaluation for High Power CPUs and GPUs." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52225.

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Increasing thermal design power (TDP) trends with shrinking form factor requirements creates the need for advanced cooling technology development. This investigation proposes multiple innovative water cooler technologies to achieve higher thermal performance liquid-cooling (LC) solutions addressing the limitations of air-cooling (AC). High performance water cooler design options will also meet the miniaturization trends of computing market by providing scalable solution to address smaller board real-estate. This investigation serves multi-fold advantages: 1) introduces four water cooler technologies employing different fin base plate designs, diamond fins, micro-fins, skived micro-fins, and twisted diamond fins, along with an optimized flow distribution path design accompanying each cooler, 2) provides scalable thermal solutions, 3) addresses particle clogging via fin base plate as well as flow distribution path optimization, 4) addresses galvanic corrosion by eliminating the use of two dissimilar metals and introducing acrylic housing, 5) introduces acrylic housing for weight management. Results show that twisted diamond fin, micro-fin and skived micro-fin coolers provide up to 5°C performance improvement resulting in lower pressure drop across water cooler compared to diamond fin cooler and about 37°C improvement compared to air-cooled active heatsink solution.
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Chaparala, Satish C., Frank E. Andros, Bill Infantolino, Bahgat G. Sammakia, Satish C. Guttikonda, Julia Zhao, and Dipak Sengupta. "Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)." In ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. ASMEDC, 2005. http://dx.doi.org/10.1115/ipack2005-73085.

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As board real estate becomes more precious and market demand for increased functional density in modules rises, engineers are looking at 3-dimensional packaging to provide the solutions. Stacked die technology, which involves stacking the die one above another, is fast becoming the preferred packaging option for memory applications in handheld consumer products where board space is a premium. The current study focuses on the stacked die wire bonded CSP (SCSP). The CSP offers reduced package size while the vertical stacking provides a smaller form for multi-chip integration compared to a horizontal layout. In some test chip designs, it has been observed that passivation cracks occur on the functional surface of the top die as a result of thermal cycling. Stress analysis using the finite element method has been carried out to understand the effect of package parameters on die stress under cycling conditions. The distribution of the stress components that may cause this passivation cracking are discussed. The stress magnitudes observed in the SCSP are compared with those of a single die package where no passivation cracks have been observed to obtain a quantitative perspective of the stress. Results reported for parametric studies include the effect of variation of die thickness, spacer size and thickness, and thickness of overmold compound above the die. Finally, design considerations for two-die, over-molded, wire-bond, stacked die packages are presented based on the above study.
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Rottke, Nico, Randy Anderson, and Sebastian Krautz. "Is Real Estate Private Equity Real Estate?" In 22nd Annual European Real Estate Society Conference. European Real Estate Society, 2015. http://dx.doi.org/10.15396/eres2015_73.

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Xu, Lin. "Linkage Analysis among the Real Estate Tax, Real Estate Investment and Real Estate Price." In 2nd International Conference on Education Technology and Economic Management (ICETEM 2017). Paris, France: Atlantis Press, 2017. http://dx.doi.org/10.2991/icetem-17.2017.12.

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"Real Estate Options: taking real Estate Risk Analysis Forward." In 10th European Real Estate Society Conference: ERES Conference 2003. ERES, 2003. http://dx.doi.org/10.15396/eres2003_148.

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Constable, J. H. "Analysis of ACF Contact Resistance." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35061.

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An analysis of the electrical resistance of an anisotropic conducting film (ACF) bond is presented. The electrical circuit for the bond resistance is divided into its different geometric regions for analysis. While the analysis of the resistance resulting from the bond pads is more complex than other regions because of the multiple random contact points, it is argued that the formula developed by Greenwood gives an adequate estimate of this contribution. A comparison is made of this estimate with evaluations in the literature, and the importance of the disagreement between methods is discussed. The magnitude of the contact resistance between the contact pad and particle (including film and constriction resistance), and the resistance of the deformed particle, are still contentious issues, and evidence is presented addressing this issue. In all previous reported results, excluding the author’s, the implicit assumption is that the apparent physical area of contact between the deformed particle and the bond pad is equal to the real area of electrical contact. This work reinforces the author’s contention that the electrical contact area is only a small fraction of the mechanical contact area, just as it is in separable contacts. A calculation is presented that evaluates the effect of electrically heating the ACF bond in order to separate the contact resistance from the remaining bulk resistance of the interconnect. In this technique, the small metal asperities (a-spots) on the surface of the apparent contact region are preferentially electrically heated due to their much higher current density, which in turn changes the resistance of the a-spot. Previous calculations of this effect have been carried out only for conductors that obey the Wiedemann-Franz law, and calculations in this work have extended the results to materials used in ACF bonds that depart significantly from the Wiedemann-Franz law. Further, it is argued that the observed larger than expected contact resistance in ACA bonds is likely due to a high resistivity temperature independent film resistance.
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Reports on the topic "Packaging of real estate"

1

Wickham, John A., Delandro Jr., and Donald J. Real Estate: Disposal of Real Estate. Fort Belvoir, VA: Defense Technical Information Center, May 1985. http://dx.doi.org/10.21236/ada403048.

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Liu, Chang, and Wei Xiong. China's Real Estate Market. Cambridge, MA: National Bureau of Economic Research, November 2018. http://dx.doi.org/10.3386/w25297.

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Sullivan, Gordon R., and Milton H. Hamilton. Real Estate: Homeowners Assistance Program. Fort Belvoir, VA: Defense Technical Information Center, June 1992. http://dx.doi.org/10.21236/ada403031.

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Glaeser, Edward. Real Estate Bubbles and Urban Development. Cambridge, MA: National Bureau of Economic Research, December 2016. http://dx.doi.org/10.3386/w22997.

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Engel, Eduardo, Ronald Fischer, and Alexander Galetovic. Highway Franchising and Real Estate Values. Cambridge, MA: National Bureau of Economic Research, February 2002. http://dx.doi.org/10.3386/w8803.

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Grenadier, Steven. An Equilibrium Analysis of Real Estate. Cambridge, MA: National Bureau of Economic Research, February 2003. http://dx.doi.org/10.3386/w9475.

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Vorobyov, V. S., I. V. Yanshina, I. A. Repina, and O. B. Bolbat. Fundamentals of project and real estate management. OFERNIO, April 2020. http://dx.doi.org/10.12731/ofernio.2020.24505.

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Glaeser, Edward, Wei Huang, Yueran Ma, and Andrei Shleifer. A Real Estate Boom with Chinese Characteristics. Cambridge, MA: National Bureau of Economic Research, October 2016. http://dx.doi.org/10.3386/w22789.

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Watkins, Gary Steven. Air Monitoring Stations Preliminary Real Estate Plan. Office of Scientific and Technical Information (OSTI), June 2019. http://dx.doi.org/10.2172/1529522.

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Case, Bradford, William Goetzmann, and K. Geert Rouwenhorst. Global Real Estate Markets - Cycles and Fundamentals. Cambridge, MA: National Bureau of Economic Research, February 2000. http://dx.doi.org/10.3386/w7566.

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