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Journal articles on the topic 'Packaging center'
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Wang, Wei, Wei Ping Yang, and Ge Yi Liu. "Application of DEA Model Based on FCE in the Cigarette Packaging System Mode Evaluation." Advanced Materials Research 1006-1007 (August 2014): 472–76. http://dx.doi.org/10.4028/www.scientific.net/amr.1006-1007.472.
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With the development of modern logistics system, the automatic logistics distribution centers have been built in most tobacco enterprises. The packaging system plays important role in the distribution center, it is necessary to construct a set of scientific method to evaluate the packaging system mode. According to the real situation of tobacco logistics distribution center, the cost and benefit are set to the general goal. For these three modes of packaging system, packaging by hand, automatic packaging and packaging by heat-shrinkable material, the evaluation index system and hierarchical structure are built. Refer to the hierarchical chart and the principle of AHP, the weight of each index is calculated. On the basis of weight that worked out by AHP, the final evaluation result can be found and analyzed follow the principle of fuzzy comprehensive evaluation. Finally, reference the consequences of the FCE, the DEA model based on FCE is used to enhance the integrality and systematic of the evaluate result.
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Hsu, Hsiang-Chen. "Advanced IC Packaging Center in I-Shou University." Journal of The Japan Institute of Electronics Packaging 17, no. 1 (2014): 78. http://dx.doi.org/10.5104/jiep.17.78.
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Spanu, Simone, David Mosna, and Giuseppe Vignali. "CFD Analysis of Coffee Packaging in Capsules using Gas Flushing Modified Atmosphere Packaging." International Journal of Food Engineering 12, no. 9 (November 1, 2016): 875–87. http://dx.doi.org/10.1515/ijfe-2016-0047.
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Abstract The aim of this work is to analyze, by means of CFD (Computational Fluid Dynamics), the gas flow in a packaging machine used to fill polymeric capsules with coffee. The final goal is to optimize the geometric shape of some mechanical components in the machine’s sealing station in order to reduce the inert gas consumption achieving an O2 residual which is constantly equal or below 1 % by mass in the center of the capsule. The fluid domain has been obtained starting from the 3D CAD model of the sealing station of the packaging machine. The CAD software SolidWorks has been used to design the system, while Ansys CFX 14.5 software has been used for the CFD analysis. The CFD model has been validated by comparing its results with those obtained by experimental tests. The modified solution allows reducing the average O2 residual from about 3 % to less than 1 %.
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Sui, Guo-rong, Bao-xue Chen, Jian-zhong Zhou, Chang-song Fu, and Mamoru Iso. "Automatic optic waveguide chip packaging system based on center-integration algorithm." Optics Communications 281, no. 6 (March 2008): 1515–21. http://dx.doi.org/10.1016/j.optcom.2007.11.017.
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Stevens, Alan, and Houchang Khatamian. "COMPARISON OF MARKETING SURVEY RESPONSES BETWEEN GARDEN SHOW AND GARDEN CENTER SAMPLES." HortScience 27, no. 6 (June 1992): 659c—659. http://dx.doi.org/10.21273/hortsci.27.6.659c.
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Correctly anticipating consumer preferences for goods and services can have a large impact on profitability. Surveying patrons at individual retail outlets does insure the sampling is taken from a customer base, but such surveys are time and labor intensive. A survey sample, taken from attendees at Flower, Lawn and Garden Shows, offers the possibility of large sample sizes, of potential purchasers of horticultural goods and services, with reduced time and labor requirements. A survey to measure the influence of plant size, packaging and price on consumer purchasing habits was conducted at garden shows and garden centers. On the criteria of price and quality of nursery plant materials responses from the two samples were similar. Plant size and packaging appeared to be more influential criteria to the garden show sample.
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Flemming, Jeb, Roger Cook, Kevin Dunn, and James Gouker. "Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000791–810. http://dx.doi.org/10.4071/2012dpc-tp12.
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Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.
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Flemming, Jeb H., Kevin Dunn, James Gouker, Carrie Schmidt, and Roger Cook. "Cost effective 3D Glass Microfabrication for Advanced Packaging Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000781–84. http://dx.doi.org/10.4071/isom-2012-wp14.
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Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest for interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles. In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others. In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX™ Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX™ Glass ceramic and the comparisons of wet etching of APEX™ Glass vs. laser ablation.
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Wibowo, Arining, Aquarini Priyatna, and Cece Sobarna. "The Malangese Mask Wayang:The Process of Art Commodification at Asmorobangun Art Center, Pakisaji, Malang." KOMUNITAS: INTERNATIONAL JOURNAL OF INDONESIAN SOCIETY AND CULTURE 11, no. 1 (April 23, 2019): 149–57. http://dx.doi.org/10.15294/komunitas.v11i1.18478.
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The article aims to describe the process of commodification of the Malangese Mask Wayang Art at Asmorobangun Art Center, Pakisaji Sub-district, Malang, Indonesia. Asmorobangun Art Center is one of the surviving art centers engaged in the efforts to preserve and develop the Malangese mask wayang art. The data used in this qualitative study were collected by means of interview, observation, and examination of relevant documents. The results show that the process of commodification of the Malangese mask wayang art manifests in three practices namely the gebyak senin-legian mask wayang performances, art tourism packaging, and mask production. Commodification has transformed the art into commodities/products that are part of the local tourism industry.
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Hatakeyama, Keiichi. "Hitachi Chemical Co., Ltd, Advanced Performance Materials Operational Headquarters, Packaging Solution Center." Journal of Japan Institute of Electronics Packaging 18, no. 2 (2015): 124. http://dx.doi.org/10.5104/jiep.18.124.
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Knorr, David B. "Electronic packaging activities at the Rensselaer Polytechnic Institute’s Center for Integrated Electronics." JOM 44, no. 7 (July 1992): 54–55. http://dx.doi.org/10.1007/bf03222277.
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Gao, De, and Fu De Lu. "Study on Shock Response of Cushion Packaging System Based on Combined Model Using Hyperbolic Tangent and Tangent Functions with Consideration of Rotation Effect." Applied Mechanics and Materials 101-102 (September 2011): 1161–66. http://dx.doi.org/10.4028/www.scientific.net/amm.101-102.1161.
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This paper proposes to model cushioning materials by combining hyperbolic tangent function and tangent function together. Based on the proposed model, the kinetics equations for cushion packaging system under excitation of half-sine acceleration pulse shock have been derived, where the rotation due to product’s eccentricity in center of mass has been taken into account. The law for coupling between rotation and translation is discussed. Numerical analysis shows that it may lead to a certain degree’s excessive packaging and thus causes waste if the rotation effect is not considered in design. The proposed model and the established kinetics equations with consideration of coupling between translation and rotation provide much better description regarding the characteristics of practical cushion packaging systems, and thus can be taken as reference in design optimization for packaging structure. The proposed approach can also be directly applied in analyzing the shock responses of packaging systems with multiple degrees of freedom.
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Deckert, Martin, Michael Lippert, Kentaroh Takagaki, Andreas Brose, Frank Ohl, and Bertram Schmidt. "Fabrication of MEMS-based 3D-μECoG-MEAs." Current Directions in Biomedical Engineering 2, no. 1 (September 1, 2016): 83–86. http://dx.doi.org/10.1515/cdbme-2016-0021.
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AbstractThe microfabrication and packaging of novel, three-dimensional, polyimide-based, highly flexible, microscale electrocorticography multi-electrode arrays for enhanced epicortical recording of local field potentials is presented. A polyimide foil embeds metallic structures relating to 32 taper-type electrode sites, contact pads as well as interconnecting conductor paths which are integrated in the planar portion of the electrode substrate material. Circular exposed and, thus, active electrode sites are 50 μm in diameter and employed center-to-center pitches range from 250 μm to 1 mm, respectively. As-fabricated 3D-μECoG-MEAs provide taper heights of approximately 4 μm as well as 59 μm being distinguished by characteristic impedances of about 368.9 kΩ at 1 kHz measured in saline electrolyte. The applied packaging strategies favor flip-chip bonding and vapor phase soldering of the polymer substrates to customized printed circuit boards.
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Lin, C. M., T. C. Lin, H. M. Chu, and Y. L. Chen. "Injection Molding Simulation of 3D Stacked-Chip Assembly Packaging with Different Entrances." Journal of Mechanics 23, no. 1 (March 2007): 31–39. http://dx.doi.org/10.1017/s1727719100001052.
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AbstractThis paper adopts a three-dimensional (3D) finite element method to simulate the injection molding of organic 3D stacked-chip assemblies. The geometry model of the assembly is simplified to a five-layered structure of stacked-chips with no solder bumps. The injection molding process incorporates 3D stacked-chip packaging and encapsulation techniques, and comprises primarily of multi-layer cavity-filling and reactive-thermosetting curing processes. The current investigation considers the effects of specifying different entrances on the resultant flow fronts, air-traps, and weld-lines. In general, the present results confirm the value of performing numerical simulations of the 3D stacked-chip packaging process to support the injection molding CAE approaches which are commonly applied nowadays to improve the packaging assembly design and to facilitate the rapid set up of mass-production conditions. The simulation results indicate that the best packaging results are obtained when the melt is introduced either at the center of the periphery side of the stacked-chip modulus or at its corner.
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Guo, Xiang Hui, Chun Guang Xu, Liu Yang, and Kai Peng. "Detection Resolution Analysis of Scanning Acoustic Microscopy Used in Electronic Packaging." Applied Mechanics and Materials 536-537 (April 2014): 272–75. http://dx.doi.org/10.4028/www.scientific.net/amm.536-537.272.
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Scanning Acoustic Microscopy (SAM) has been a powerful non-destructive testing tool used in electronic packaging and material characterization. With the development of 3D electronic packaging, internal dimensions of electronic packaging are getting more and more smaller, and the detection accuracy of existing non-destructive testing technology is far behind the requirements of manufacturing technology. In this study, a set of practical SAM system was developed independently by our Lab. And its detection resolution was analyzed using high frequency focused transducers with center frequency ranging from 20 MHz to 100MHz. The experimental results show that the lateral resolution of the ultrasonic transducer with 100MHz central frequency can reach about 40 microns, which is consistent with calculated resolution. Comparing with Sparrow criteria, Rayleigh criteria is more coherent with the experimental results.
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Chen, Liang-Yu, Glenn M. Beheim, and Roger D. Meredith. "Packaging Technology for High Temperature Capacitive Pressure Sensors." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000367–72. http://dx.doi.org/10.4071/hitec-lchen-tha23.
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High temperature pressure sensors are critical sensing elements for the next generation of intelligent aerospace engine technology, as well as long-term exploration missions to Venus, where the surface temperature is 485°C. Various high temperature pressure sensors based on different sensing mechanisms are under development at the NASA Glenn Research Center. In order to test long-term performance and reliability of these sensors in a high temperature environment, and eventually commercialize these sensors, high temperature durable and long-term reliable packaging is essential. A prototype packaging technology for micro-sensors designated for applications in high temperature and high differential pressure environments has been developed and reported previously. Packaged high temperature silicon carbide pressure sensors have been successfully tested between room temperature and 500°C. This paper reports an improved version of this packaging technology and testing results of a packaged commercial Si capacitive pressure sensor at elevated temperatures. The parasitic parameters of the packaging are electrically characterized from room temperature to 500°C at 120Hz, 1kHz, 10kHz, and 100kHz. This packaging is primarily designed for high temperature capacitive pressure sensors, but it also applies to other high temperature sensors, especially those for high differential pressure environments.
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Flemming, Jeb H., Kevin Dunn, James Gouker, Carrie Schmidt, and Colin Buckley. "Cost effective Precision 3D Glass Microfabrication for Electronic Packaging." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000199–201. http://dx.doi.org/10.4071/isom-2011-tp1-paper3.
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The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.
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Brock, Alice, and Ian D. Williams. "Life Cycle Assessment of Beverage Packaging." Detritus, no. 13 (October 5, 2020): 47–61. http://dx.doi.org/10.31025/2611-4135/2020.14025.
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Global plastic production has been increasing annually since World War II and is currently 380 million tonnes. Global concern about pollution from plastics in the seas and the environmental costs of plastics manufacture is rising. This study aimed to: i) review the costs, benefits, advantages / disadvantages of plastics as packaging materials and ii) use life cycle assessment to determine if there is less environmentally impactful beverage packaging than plastic bottles. As different beverages have different packaging needs, three categories were used: commonly used containers for milk, fruit juice and pressurised ‘fizzy’ drinks. The packaging types included in the assessment were glass bottles, aluminium cans, milk cartons, Tetra Pak, polyethylene terephthalate (PET) bottles and high-density polythene (HDPE) bottles. The ISO 14040:2006 and ISO 14044:2006 standards for life cycle assessment formed the basis of the methodology. The open source software openLCA was used to conduct the assessments. Data was assembled from LCA databases such as the European reference Life Cycle Database of the Joint Research Center (ELCD), existing life cycle assessments, scientific reports and peer reviewed literature. The functional unit was set at a container that held one litre of fluid. The results found that in each category there was a less impactful beverage packaging than plastic bottles. In the Pressurised Beverage Category, 100% recycled aluminium cans would be the least impactful option, in the Fruit Juice Beverage Category Tetra Pak would be the least impactful option and in the Milk Beverage Category milk cartons would be the least impactful option.
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Kostenko, W. P., J. G. Torok, and D. W. Demetriou. "IBM z15: Improved data center density and energy efficiency, new system packaging, and modeling." IBM Journal of Research and Development 64, no. 5/6 (September 2020): 16:1–16:10. http://dx.doi.org/10.1147/jrd.2020.3008100.
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Wen, Yin, Bo Zhang, Yuan Lu, Liao Anmou, Du Tianmin, and Lixi Wan. "The Reliability Study of a High density Multi Chip Packaging with Folding Flexible Substrate." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001846–969. http://dx.doi.org/10.4071/2013dpc-tha13.
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In this century, the IC packaging technology continues to make progress at astounding rate to meet the increasing requirements in many fields[1]. High density packaging is normally achieved by using various chip and/or package staking. Due to itsunique bending characteristics, flex substrate has become an ideal candidate for high density 3D packaging, especially applied for the packaging of medical products[2,3]. In this paper, we focus on the process development details of a flexible package, and investigate the main reliability problems through a series of reliability tests. There were three chips in the 3D flexible packaging structure used in our experiments. The center chip had a larger size of 5.95à —4.35mm2, while the edge ones were smaller and had the same size of 1.95à —1.95mm2. The thickness of all the three chips was the same, 200ÃŽ ¼m. All the chips had daisy chain testing structure. The ball diameter and pitch of the bumps were 250ÃŽ ¼m and 400ÃŽ ¼m, respectively. The substrate was a double-layer non-gel flexible substrate, which had polyimide as the core material (dielectric constantâ ‰ ˆ4). The substrate had a dimension of 16.9mmà —5.5mm2, and a total thickness of 80ÃŽ ¼m. Differential transmission line and DC test pads were designed in the testing circuit for high frequency signal and DC electric test. The dimension of the 3D package after folding was about 6à —6.6à —1.3mm3. The assembly process flow is as follows: All the chips were connected to a flexible substrate by using flip-chip bonding process. After underfilling was applied and cured, the two edge chips were folded and stacked onto the center chip. Then encapsulation and BGA ball dropping were followed. By flexible folding and chip stacking, the overall package size was reduced. We chose an epoxy based material as underfilling and encapsulation. X-ray check and c-scan test showed that the encapsulation had no voids in most samples. Autoclave (RH 95%, 125Ã’ °C, 96 hours) and multireflow (260â „ ƒ for 5 times) test were designed to assess the flexible structure and check the package reliability. Electrical measurements were performed to monitor and check the REL output. Some of the important electrical test results are summarized below: (1) After the multireflow test, some of the 2D unfolding samples showed open circuit in DC test, especially around the vicinity of the larger chip in the center. The DC test results of 3D samples showed no significant change after multireflow, while cross-section image showed no delamination in these area. (2) After the autoclave test, open circuit could be observed in most 2D unfolding samples near the region of the larger chip in the center, while open circuit could be seen in some smaller chip region too. For the other good parts, resistance showed an increase of 150–200% than before. The DC test results of 3D samples showed no significant change after autoclave, and the cross-section image showed no delamination in these area. (3) It could be presumed that the center region of the large chip was the weakest link of this package. 3D folding and encapsulation had reinforcement action on the flexible substrate.
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Holanda, V. B., A. D. F. Lins, M. E. R. M. C. Mata, M. E. M. Duarte, and R. M. Feitosa. "Análise sensorial e desenvolvimento de embalagem para aguardente de algaroba." Revista Verde de Agroecologia e Desenvolvimento Sustentável 10, no. 4 (October 16, 2015): 06. http://dx.doi.org/10.18378/rvads.v10i4.3496.
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<p class="CorpodoresumoIVCBM">Objetivou-se com esse estudo realizar análise sensorial da aguardente de algaroba, desenvolver uma embalagem para sua comercialização e verificar a preferência de embalagem pelo seu aspecto visual. De acordo com a análise sensorial através do teste afetivo com 30 voluntários, detectou-se que quanto ao sabor não houve diferença para os avaliadores e a embalagem de vidro teve uma maior aceitação quanto à preferência em razão de conservar melhor as qualidades organolépticas da bebida que a embalagem PET, sendo este, portanto, o melhor material para o acondicionamento da aguardente. Para o processo de criação da embalagem fez-se uma pesquisa de campo, geração de conceitos e posteriormente uma análise de preferência visual dos conceitos, sendo o conceito 1 o escolhido para a embalagem da aguardente de algaroba , e a embalagem que confere maior requinte com formas arredondadas que remetem à vagem da algaroba, apresentou uma diferença de apenas 3,1% de preferência.</p><p align="center"><strong><em>Sensory analysis and packaging development for brandy mesquite</em></strong></p><pre><strong>Abstract: </strong>The aim of this study perform sensory analysis of mesquite brandy, develop packaging for its commercialization and check the preferred packaging for its visual appearance. According to the sensory analysis through affective test with 30 volunteers , it was detected that in taste no difference to the evaluators, being that the glass packaging had a greater acceptance as the preferred due to better conserve the organoleptic qualities of the drink that PET packaging and this is the best material for the packaging of spirits. For the process of creating the package was made a field research, generating concepts and further preferably a visual analysis of the concepts, being the chosen concept for the packaging of mesquite brandy was the first concept , the packaging that gives greater refinement with rounded shapes that refer to mesquite pod , It showed a difference of only 3.1% preferably </pre>
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Ikegaya, Atsushi, Mai Mochizuki, Hiromu Amaike, Tomoaki Kawata, Toru Ikari, Seiji Ohba, Takashi Takeuchi, Seiko Ito, and Eiko Arai. "Development and Performance Evaluation of Strawberry Class Sorting Apparatus for Improvement of Packaging Center Efficiency." Horticultural Research (Japan) 18, no. 1 (2019): 73–79. http://dx.doi.org/10.2503/hrj.18.73.
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Mäntysalo, Matti, and Pekka Heino. "Analysis of Embedded Baluns in 3D Packages." Journal of Microelectronics and Electronic Packaging 3, no. 4 (October 1, 2006): 201–8. http://dx.doi.org/10.4071/1551-4897-3.4.201.
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The requirements for electronic packaging are continually increasing, since the trend is towards more personal and highly integrated products. The demands for electronic packaging are lower cost, lighter weight, lower power consumption, and higher integration rate. These requirements can be addressed with System-in-Package (SiP) technologies, which is a powerful concept for system integration. SiP, together with embedded passives, provides an attractive option to solve future packaging challenges. It has a huge potential especially with small portable electronics, such as, wireless headsets and portable terminals. This paper describes the design of embedded stripline baluns for 2.4 GHz low-range radio applications. We will discuss the design, implementation, and layout of three-dimensional baluns. The effect of a balun's layout was studied with a three-dimensional electromagnetic simulator, which is based on the finite-integration technique. Good impedance match and excellent amplitude and phase balances between output ports were achieved. In addition, several prototypes were also manufactured and measured. The correlation between the simulation and experimental results was excellent. The error between modeled and measured center frequencies was less than three percent.
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Wardhani, Yustiana, and Muhammad Ibrahim. "ANALISIS PENGARUH PERUBAHAN KEMASAN PRODUK TERHADAP PREFENSI PEMBELIAN PADA PT. BAKRIE TELECOM CABANG BOGOR." Jurnal Ilmiah Binaniaga 4, no. 1 (December 12, 2018): 29. http://dx.doi.org/10.33062/jib.v4i1.205.
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Environmental change always occurs continuously in the process of development of a country. This development is directly orindirectly will affect the order of social life, economy, culture, technology and lifestyle community. The changes in the economic, social community of course affect the marketing system in the country. A very rapid technological developments lately has affected all areas of human activity. The development of this technology has tightened competition in the marketing system in the marketing world, where the procedures must innovate continuously in order to win and retain the loyalty of its customers. Currently in Indonesia there are nine mobile operators include (indosat, Telkomsel, XL, Mobile-8, Three, Flexi, Esia, Smart and Axis). When walking in the center of mobile sales, mobile phones can be seen many types of operators who have their own packaging designs appeal to consumers. Display a bundle is now realized by the manufacturer is no longer only have the function of protecting and wrapping products but products that increasingly tight competition in the market requires manufactures to think hard in improving the function of packaging to be able to provide attraction to consumers through the artistic aspect, color, graphic, from or the design. The results of simple correlation analysis found a correlation between changes in the new packaging with the purchase of consumer preferences is 0.293. this suggests that there is a strong relationship between the new packaging Esia with consumer purchasing preferences. While the relationship is positive because it is positive. This means that the new packaging Esia has a strong positive relationship towards the purchase of consumer preferences. This relationship is positive where this Esia packaging changes increase consumer purchasing preferences of Esia. Analytical results obtained coefficient of determination coefficient of determination between the change in the new packaging with the purchase of consumer preferences is the 0086 (8.6%). This suggests that the level of consumer preferences towards new product packaging can be influenced by the old product by 8.6%, the remaining 91.4%influenced by other factors. The coclusion is that between the old and new packaging packaging there is a correlation effect on customer preferences in choosing which 8.6% can be seen that the old product is still influencing new product, and the remaining 91.4% is another factor affecting.
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Neudeck, Philip G., and David J. Spry. "Towards Making SiC ICs Durable and Accessible for Use in the Most Extreme Environments (Including Venus)." Materials Science Forum 1004 (July 2020): 1057–65. http://dx.doi.org/10.4028/www.scientific.net/msf.1004.1057.
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The prospects for beneficial application of integrated circuit (IC) capabilities in ambient environments above 450 °C have been significantly improved by recent long-term demonstrations of SiC chips and packaging by NASA Glenn Research Center. This invited paper reviews and updates development of durable SiC IC technology aspects relevant to engineering infusion into beneficial applications, including the first long-duration low-mass Venus lander missions
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Cahyaningrum, Deltaningtyas Tri, Nurhadi Siswanto, and Hendy Firmanto. "Penentuan Tenaga Kerja Optimal pada Packaging Kopi dengan Menggunakan Analisis Beban Kerja Metode Work Sampling." Jurnal Ilmiah Inovasi 21, no. 1 (April 30, 2021): 46–49. http://dx.doi.org/10.25047/jii.v21i1.2634.
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The effectiveness, efficiency, and productivity of the company are very much determined by the workload. By knowing the workload, a company can find out the optimum number of workers needed to meet the target. This is also important for the Indonesian Coffee and Cocoa Research Center, especially in the processing of coffee in the packaging section. Therefore a workload analysis will be carried out using the Work Sampling Method. From the results of the work sampling method, it can be seen that worker productivity is 0.90697, as well as a rating factor of 0.09 and an allowance of 22.With these results it can be calculated that the standard time needed by workers in coffee packaging is 10.98 minutes and the optimum number of workers required 2.06 people.
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Parrales, Gloria Santana, Beatriz Irene Caballero Giler, and Maria Shirlendy Guerrero Alcivar. "Packaging sixto duran ballen and the dam la esperanza." International journal of physical sciences and engineering 2, no. 3 (September 19, 2018): 43–50. http://dx.doi.org/10.29332/ijpse.v2n3.199.
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The dam is a reservoir that stores about 450,000,000 cubic meters of water, has multiple purposes allowing flood control, produces irrigation water, for human consumption and shrimp farming in the area center of the province of Manabí. The first studies for the construction of the dam were carried out in the years 1970 to 1975 as a result of the hydrological/economic feasibility plan of the Province of Manabí, and of the integral hydro-agricultural area of the Carrizal Chone Basin. After several preliminary studies with different international firms and with changes of designs in 1992, the Dragados and Constructions SA Company was in charge of the construction of what is now the Manabí water project. It is located in the parish of Quiroga approximately 12 kilometers from the cantonal canton of Bolívar Canton, Calceta, with an extension of 2,500 hectares, with a construction area of 120 hectares and will allow irrigation of 17,000 hectares of the central area of Manabí. The objective of the work is to make an analysis of the construction of the La Esperanza dam. For this, the logical historical method was used, as well as the bibliography search to know the historical construction of the dam, as well as the observation method.
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Shao, Jiang, Hongjian Zhang, and Bo Chen. "Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading." Electronics 8, no. 3 (March 2, 2019): 279. http://dx.doi.org/10.3390/electronics8030279.
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Plastic Ball Grid Array (PBGA) one of the most important electronic packaging methods, is widely used in aeronautical industry field. According to the JEDEC standard, shock tests of PBGA assemblies are conducted under different loading conditions. Several important parameters, such as the fatigue life of PBGA assemblies, the relationship between solder joint positions and fatigue life, the relationship between strain energy density and fatigue life, are analyzed based on experiment results. The failure modes of PBGA assemblies are studied by optical microscope (OM). The results show that during the shock tests, the strains of the solder joints near the center of the specimen are larger than other positions, and these solder joints are prone to form micro cracks. With the increase of the shock times, these micro cracks extend rapidly which will eventually cause the failure of the PBGA electronic packaging.
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Denoyelle, Dirk. "Up Close: The Interuniversity Microelectronics Center (IMEC), Leuven, Belgium." MRS Bulletin 14, no. 6 (June 1989): 35–38. http://dx.doi.org/10.1557/s0883769400062692.
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The Interuniversity Microelectronics Center, Leuven, Belgium (IMEC) is one of the world's largest independent research centers for microelectronics. It was established in 1984 by the Flemish government as a part of a comprehensive program to promote high technology in Flanders, Belgium. Benefiting from existing experience available mainly at the University of Leuven, IMEC moved into its present facilities in 1986 (Figure 1).The Center covers a wide range of research topics in the microelectronics domain—VLSI systems design methodologies, advanced semiconductor processing, materials, packaging, and more.About 50 people work on computer-aided design, developing a series of “true” silicon compilers: CATHEDRAL. With this software, ASIC (application specific integrated circuit) design becomes extremely attractive, since CATHEDRAL covers design from the high system level down to layout.INVOMEC, the training division of IMEC, supports universities in ASIC design. It trains people for both educational institutes and industry in chip design, makes available the necessary software, and has a well-established Multi Project Chip—Multi Project Wafer service.The Processing Technologies and Materials Divisions involve about 200 people and have a 3,600 m2 clean room at their disposal. The clean room consists of a 20% class 10 area with a fast-turnaround prototyping line and an 80% class 1000 area.IMEC's objectives are: to perform research in the microelectronics field, supporting both industry and universities, and to stimulate the microelectronics industry in Flanders.IMEC performs research on both silicon and III-V technologies.
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Hirata, Roli K., and David W. Russell. "Design and Packaging of Adeno-Associated Virus Gene Targeting Vectors." Journal of Virology 74, no. 10 (May 15, 2000): 4612–20. http://dx.doi.org/10.1128/jvi.74.10.4612-4620.2000.
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ABSTRACT Adeno-associated virus (AAV) vectors can transduce cells by several mechanisms, including (i) gene addition by chromosomal integration or episomal transgene expression or (ii) gene targeting by modification of homologous chromosomal sequences. The latter process can be used to correct a variety of mutations in chromosomal genes with high fidelity and specificity. In this study, we used retroviral vectors to introduce mutant alkaline phosphatase reporter genes into normal human cells and subsequently corrected these mutations with AAV gene targeting vectors. We find that increasing the length of homology between the AAV vector and the target locus improves gene correction rates, as does positioning the mutation to be corrected in the center of the AAV vector genome. AAV-mediated gene targeting increases with time and multiplicity of infection, similar to AAV-mediated gene addition. However, in contrast to gene addition, genotoxic stress did not affect gene targeting rates, suggesting that different cellular factors are involved. In the course of these studies, we found that (i) vector genomes less than half of wild-type size could be packaged as monomers or dimers and (ii) packaged dimers consist of inverted repeats with covalently closed hairpins at either end. These studies should prove helpful in designing AAV gene targeting vectors for basic research or gene therapy.
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Zhang, Chi, Yifan Tan, Zhizhao Huang, Cai Chen, and Yong Kang. "Reliability analysis of bonding wire based on stacked substrate packaging structure." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000603–8. http://dx.doi.org/10.4071/2380-4505-2019.1.000603.
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Abstract The stacked substrate packaging technology is a new 3D power loop structure utilizing multiple layer DBC to achieve ultra-low parasitic for the fast switching SiC device. This structure has a different geometry on interconnection between chips and substrate contrasting to the conventional module design, which needs optimization on the interconnection for the reliability consideration of this new structure. Analytical models of different bonding wire shapes and DBC structures were developed to calculate the von-mise stress on each model under thermal cycling simulation. The simulation results show that the stress on bonding wire reaches minimum when welding point located at the center of the top DBC substrate and the stress decreases when DBC top copper layer thickness increases or ceramic layer thickness decreases. Moreover, bonding wires with smaller diameter, certain peak height and width show lower stress and strain. Furthermore, thermal cycling tests were done on samples with same geometries of analytical models, and the wire pull test results showed consistency with the stress calculation results which verifying the optimum wire shape and DBC structure for the stacked substrate packaging.
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Chou, Ding-Chin, Shang-Hui Yang, Jian-Shian Lin, Fuh-Shyang Juang, and Yoshimi Takeuchi. "Using Ultraprecision Machining to Fabricate LED Packaging Exhibiting High Luminous Intensity." International Journal of Automation Technology 13, no. 3 (May 5, 2019): 397–406. http://dx.doi.org/10.20965/ijat.2019.p0397.
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In this study, a phosphor was coated on a microstructured film to achieve light control. This process resulted in a large-area phosphor film and enabled the microstructure to be packaged directly into the LED body. Thus, the LEDs retain their air and water barrier functions, control light, achieve higher forward luminous intensity, and have a wider scope of applications. Roll-to-roll processing was performed to mold a microstructure and phosphor on polyethylene terephthalate (PET) film by applying ultraviolet light. This approach expedited the preparation of a large-area phosphor film and enabled the precise control of the thickness and evenness of the phosphor layer, thus ensuring uniform light distribution and eliminating the yellow halo within the light body induced by the uneven thickness of the phosphor layer. The experimental results revealed that the luminous intensity of the LED to which the microstructured PET film was attached at 0° (center) increased by 11.88% relative to the luminous intensity of the LED without the film. Moreover, at 30° to −30°, the luminous intensity of the LED with the film improved by 10.36%. Therefore, the device retained its color uniformity and achieved higher forward luminous intensity.
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Bonah, Christian. "Packaging BCG: Standardizing an Anti-Tuberculosis Vaccine in Interwar Europe." Science in Context 21, no. 2 (June 2008): 279–310. http://dx.doi.org/10.1017/s0269889708001725.
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ArgumentUsing the example of the anti-tuberculosis vaccine BCG during the 1920s and 1930s, this article asks how a labile laboratory-modified bacteria was transformed into a genuine standard vaccine packaged and commercialized as a pharmaceutical product. At the center of the analysis lies the notion of standardization inquiring why and how a local laboratory process with standard operating procedures (SOPs) reached its limits and was transformed when the product faced international distribution. Moving from Paul Ehrlich's initial technological notion ofWertbestimmungreferring to a practice physiologically testing the effects of ill-defined antitoxins, the concept of standardization is extended to pharmaceutical and economical meanings implying quality control for biological therapeutic agents produced by a variety of industrial entrepreneurs. Following the request for product uniformity, two ways to maintain levels of compatibility and commonality are depicted opposing SOPs and end-product control. Furthermore, standardization is understood as a spiral, never ending process where progressive transformation of the vaccine in its production and medical uses periodically recreated the necessity of standardization. Developments analyzed are thus understood as a stabilization process aligning laboratory settings, products, and practices with medical theories and practices through technical, bureaucratic, and organizational systems. A paradox of the analysis is that standardization as a historical phenomenon and moment in the history of drug development was initially linked to a problem of under-determination of what was to be standardized and to a knowledge gap before it could become a central concept for quality control.
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Chen, Qing Hua, Miao Gang Su, Yi Bin He, Ying Jun Chen, and Wen Gang Wu. "A Novel Fabrication Technology of Hot Stamping Film." Applied Mechanics and Materials 610 (August 2014): 998–1001. http://dx.doi.org/10.4028/www.scientific.net/amm.610.998.
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This paper proposes an environmentally friendly energy-saving high-quality laser stamping foil film with particular seam-free feature. The whole idea is to meet the country's high-end anti-counterfeiting technology, consumer products packaging appearance, high-end gifts demand for the target material. The State Quality Supervision and Testing Center (Guangzhou) detection results shows that it includes many merits such as functionality, security, reliability, ease of use, flexibility, stability and other indicators, the performance meets or exceeds the requirements of enterprise technical conditions.
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Sousa, A. S. P., R. Sales Júnior, A. M. P. Negreiros, and T. S. Oliveira. "Recolhimento de embalagens vazias de agrotóxicos no Rio Grande do Norte de 2006 a 2014." Revista Verde de Agroecologia e Desenvolvimento Sustentável 10, no. 2 (December 16, 2015): 01. http://dx.doi.org/10.18378/rvads.v10i5.3890.
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<p>Os agrotóxicos são substâncias utilizadas para o controle de agentes biológicos não desejáveis a produção agrícola, e o descarte inadequado de suas embalagens podem contaminar o meio ambiente e ainda colocar em risco a saúde pública. Sendo assim, este trabalho tem por objetivo quantificar o volume de tipos de embalagens que foram processadas e encaminhadas para incineração e reciclagem pela Central de Recebimento de Embalagens Vazias de Agrotóxicos de Mossoró – RN nos anos de 2006 a 2014. Neste período deram entrada na central um total de 488.76 t de embalagens vazias de agrotóxicos e até o final de 2014, 450.53 t desse material foram processados e transportados para recicladoras ou incineradoras, totalizando aproximadamente 92% das embalagens recebidas pela Central. As embalagens de Polietileno de Alta Densidade e papelão foram as que representaram o maior percentual de processamento e retirada da Central 40,36 e 28,10%, respectivamente. Em contrapartida, os menores valores percentuais de retirada foram para o aço e as tampas das embalagens 2,16 e 4,03%, respectivamente. As embalagens contaminadas ou não laváveis representaram 11,44% do valor total processado.</p><p align="center"><strong><em>Collecting empty containers of pesticides in Rio Grande do Norte 2006-2014</em></strong></p><p><strong>Abstract</strong><strong>: </strong>Pesticides are substances used to control unwanted biological agents agricultural production, and improper disposal of its packaging can contaminate the environment, and endanger public health. Thus, this study aims to quantify the volume of packaging types that have been processed and sent for incineration and recycling by Empties Receiving Center of Pesticide Mossoro - RN in the years 2006 to 2014. In this period were received at central a total of 488.76 tons of empty pesticide containers and by the end of 2014, 450.53 t of this material were processed and transported to recycling or incineration, totaling approximately 92% of packages received by the Central. Packaging of High Density Polyethylene and cardboard were those that represented the highest percentage of processing and withdrawal of Central 40.36 and 28.10%, respectively. In contrast, smaller percentages were taken from the steel and to the lids of containers 2.16 and 4.03%, respectively. Contaminated or not cleanable packaging accounted for 11.44% of the total amount processed.</p>
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Saris, Nur Najahatul Huda, Osamu Mikami, Azura Hamzah, Sumiaty Ambran, and Chiemi Fujikawa. "A V-Shape Optical Pin Interface for Board Level Optical Interconnect." Photonics Letters of Poland 10, no. 1 (March 31, 2018): 20. http://dx.doi.org/10.4302/plp.v10i1.786.
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This paper introduces a new interface of an optical pin for Printed Circuit Boards (PCBs), the V-shape cut type which is an innovation from the 90-degree cut type optical pin. The effectiveness is determined by optical characteristics through OptiCAD and by experiment. The simulation used a model of ray tracing analysis which is a one to two (split) connection function model. For the experiment, a Polymer Optical Fibre (POF) V-shape optical pin has been fabricated. It was found that the V-shaped optical pin has a multi-branched function and is applicable to optical interconnection. Full Text: PDF ReferencesMikami, O., et al. Optical pin interface for 90-deg optical path conversion coupling to Printed Wiring Board. in Region 10 Conference (TENCON), 2016 IEEE. 2016. IEEE. CrossRef DeCusatis, C., Data center architectures, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 3-41. CrossRef Duranton, M., D. Dutoit, and S. Menezo, Key requirements for optical interconnects within data centers, in Optical Interconnects for Data Centers. 2017, Elsevier. p. 75-94. CrossRef ITOH, Y., et al., Optical Coupling Characteristics of Optical Pin with 45° Micro Mirror for Optical Surface Mount Technology. Journal of The Japan Institute of Electronics Packaging, 2001. 4(6): p. 497-503. CrossRef Uchida, T. and O. Mikami, Optical surface mount technology. IEICE Transactions on Electronics, 1997. 80(1): p. 81-87. CrossRef Papakonstantinou, I., et al., Low-cost, precision, self-alignment technique for coupling laser and photodiode arrays to polymer waveguide arrays on multilayer PCBs. IEEE Transactions on Advanced Packaging, 2008. 31(3): p. 502-511. CrossRef Nakama, K., et al., Optical connection device. 2006, Google Patents. DirectLink Ramaswami, R., K. Sivarajan, and G. Sasaki, Optical networks: a practical perspective. 2009: Morgan Kaufmann. DirectLink Tong, X.C., Advanced materials for integrated optical waveguides. 2014: Springer. CrossRef
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Brown, Alan S. "Where the Engineers Are." Mechanical Engineering 127, no. 06 (June 1, 2005): 26–31. http://dx.doi.org/10.1115/1.2005-jun-1.
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This article appreciates the powerful pull of low-cost offshore engineering services. Elkay, a privately held company, employs 3800 workers at 14 manufacturing sites. For most of its 85-year history, it has made stainless steel sinks and plumbing accessories from two-dimensional drawings. In many ways, Elkay’s case highlights the forces behind the new shift to offshore engineering. While multinationals have shuffled work among remote engineering centers for decades, small and medium-size companies are just starting to tap foreign engineering talent. Access to offshore services makes many companies more competitive. Barry-Wehmiller used its Indian center to cut the cost of customizing packaging machines. Elkay used the same engineers to build a library of 3D CAD models that let it design products faster and cheaper. The auto industry is already adapting a new business model that involves collaborating in real time across nontraditional boundaries.
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Aisyah, Esy Nur, Maretha Ika Prajawati, and Didik Wahyudi. "Pelatihan Sertifikasi Halal sebagai Strategi Membangun Kepercayaan Konsumen bagi Masyarakat Desa Gadingkulon, Kecamatan Dau, Kabupaten Malang." J-ABDIPAMAS (Jurnal Pengabdian Kepada Masyarakat) 4, no. 2 (October 22, 2020): 103. http://dx.doi.org/10.30734/j-abdipamas.v4i2.1275.
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This activity is motivated by the products of the Gadingkulon villagers who have low bargaining power, their lack of ability in packaging and selling products is also an obstacle. Besides, many business actors have not pocketed and are not sufficiently knowledgeable about halal certification from MUI for the products they produce, so they will find it difficult to market their products to souvenir centers, supermarkets, and other markets. Guaranteed halal products through halal product certificates will provide comfort, safety, safety, and certainty of the availability of halal products for people in consuming and using halal products and can increase added value for business actors to produce and sell halal products. Therefore, they need to be equipped with knowledge and training on halal certification steaming. This service activity consists of 4 stages, namely preparation, meeting, training, and monitoring and evaluation. The community service activities carried out in Gading Kulon Village, Dau District, Malang Regency are going well. The result of community service activities is that people who have joint products with the Halal Center of UIN Maulana Malik Ibrahim Malang help meet and identify all the requirements needed and will then be bridged by the Halal Center of UIN Maulana Malik Ibrahim Malang until the issuance of halal certificates.
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Mudayana, Ahmad Ahid, and Niska Yustiana. "Evaluasi Manajemen Central Sterille Suply Departement (CSSD) dalam Meminimalisir Terjadinya Healthcare Associated Infectiomn (HAIs) di RSDU Dr. Darsono Pacitan." Jurnal Kesehatan Poltekkes Ternate 10, no. 2 (December 27, 2017): 58. http://dx.doi.org/10.32763/juke.v10i2.41.
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Central Sterile Supply Department (CSSD) or Sterilization Center Installation is a strategic service unit in preventing infection. And has the main function of preparing clean and sterile tools for the purposes of patient care at the hospital. The research method used descriptive qualitative and research design used case study. Techniques of collecting data using interviews, checklist and document review. The results show that 1) CSSD planning is well planned, 2) CSSD organizing has not been fully structured, 3) Implementation consists of receiving tools, packaging, labeling, sterilization, distribution, and storage, 4) supervision done every 6 months.
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Yeung, Dickson T. S., David C. C. Lam, and Matthew M. F. Yuen. "Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages." Journal of Electronic Packaging 122, no. 1 (December 9, 1999): 67–72. http://dx.doi.org/10.1115/1.483137.
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A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]
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Zhang, Jie, Yan Xie, Zehua Zhang, Le Lv, and Zhencheng Tan. "Research on Optical Fiber Sensor for Environmental Temperature and Humidity of Transmission Line." E3S Web of Conferences 252 (2021): 02014. http://dx.doi.org/10.1051/e3sconf/202125202014.
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The operation environment of the transmission line directly affects the operation safety of the transmission line. This article studied a FBG temperature and humidity sensor based on optical fiber sensing technology for transmission lines. Firstly, this paper studies the packaging method of the sensor, then designs the corresponding installation fixture, and gives its installation diagram. Finally, the performance of the FBG is tested in the experimental box and the national optoelectronic information product quality supervision and inspection center, and the test results show that the performance of the FBG temperature and humidity sensor is better.
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Sujan, D., T. K. Piaw, and Dereje Engida Woldemichael. "Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer." Applied Mechanics and Materials 465-466 (December 2013): 50–54. http://dx.doi.org/10.4028/www.scientific.net/amm.465-466.50.
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Interfacial stress due to thermal mismatch in layered structure has been considered as one of the major causes of mechanical failure in electronic packaging. The mismatch due to the differences in coefficient of thermal expansion (CTE) of the materials in multi-layered structure may induce severe stress concentration to the electronic composites namely interfacial delamination and die cracking. Therefore, the studies and evaluation of interfacial stress in electronic packaging become significantly important for optimum design and failure prediction of the electronic devices. The thermal mismatch shear stress for bi-layered assembly can be analyzed by using the mathematical models based on beam theory. In this study, Finite Element Method (FEM) simulation was performed to an electronic package by using ANSYS. The shear stress growth behavior at the interface of the bonded section was studied with the considerations of continuous and partial bond layers in the interfaces. Based on the analysis, it can be observed that the partial bond layer with small center distances can be simplified as a continuous bond layer for bi-layered shearing stress model analysis.
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Hunter, Gary W., Philip G. Neudeck, Robert S. Okojie, Glenn M. Beheim, J. A. Powell, and Liangyu Chen. "An Overview of High-Temperature Electronics and Sensor Development at NASA Glenn Research Center." Journal of Turbomachinery 125, no. 4 (October 1, 2003): 658–64. http://dx.doi.org/10.1115/1.1579508.
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This paper gives a brief overview of the status of high-temperature electronics and sensor development at NASA Glenn Research Center supported in part or in whole by the Ultra Efficient Engine Technology Program. These activities contribute to the long-term development of an intelligent engine by providing information on engine conditions even in high temperature, harsh environments. The technology areas discussed are: 1) high-temperature electronics, 2) sensor technology development (pressure sensor and high-temperature electronic nose), 3) packaging of harsh environment devices and sensors, and 4) improved silicon carbide electronic materials. A description of the state-of-the-art and technology challenges is given for each area. It is concluded that the realization of a future intelligent engine depends on the development of both hardware and software including electronics and sensors to make smart components. When such smart components become available, an intelligent engine composed of smart components may become a reality.title
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McElrea, Simon, and Vern Solberg. "3D Packaging Solution Providing DDR & LPDDR Co-Support for Ultrabooks and Next Generation Servers." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 002285–315. http://dx.doi.org/10.4071/2012dpc-tha16.
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Effective 3D stacking of DRAM devices can offer many benefits; improved performance, increased component density and greater surface area utilization. To enable the new generations of processors to reach their performance potential many manufacturers have developed more efficient interface formats that enable greater memory bandwidth. This revolution in performance driven electronic systems continues to challenge the IC packaging industry. The challenge is clear. To ensure that the memory functions are able to support the increased signal speed, product developers will need to explore more innovative 3D package assembly techniques and process refinement methodologies. The methodology selected for package assembly, however, must consider process complexity, the costs associated with each process, overall package assembly yield and, from the users perspective, end product reliability. For some applications companies have had limited success in stacking die elements directly onto an interposer substrate using wire-bond processes. High performance DRAM die, however, is especially difficult to stack. This is due to the center positioned wire-bond sites. This factor has complicated the DRAM die stacking process and because of the excessively long wire-bond interface, functional signal speed is significantly degraded. Stacking individually packaged DRAM (package-on-package) has had considerable success but the package outline dimension and package height can be excessive. In this paper the authors will introduce a very innovative and very thin 3D package developed specifically for center-bond pad DRAM die. The package assembly methodology promises to remain economical because it requires no special die level process steps and it can utilize the existing package assembly infrastructure. Additionally, data compiled during extensive performance and reliability modeling will be presented along with the results from actual physical qualification testing.
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Masykuri, Nurul Candrasari. "Peran Public Relation Tak Sekedar Fungsi Teknis." Humaniora 2, no. 1 (April 30, 2011): 353. http://dx.doi.org/10.21512/humaniora.v2i1.3024.
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Article explored many functions of Public Relations (PR). It is one department in an organization that is responsible for matters relating to community relations and has responsibility for the company image. PR is also responsible for inter-departmental relationships that exist within the organization. So, not only outward, but inward. PR bridges all the problems that occur between departments. In maintaining and improving the quality of image, PR will create a lot of programs to promote the company to the center of the community. The essence of PR must prepare and obtain more data concerning these trends through surveys, research, and observation in the intensive and continuous. The function of PR is essential in every point of planning and corporate development. PR should know the effects of packaging a product that will be offered to customers which will become regular customers of these products. In fact, a PR should be able to maintain such image what would happen if the packaging is yellow and what effect if replaced by a red color.
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Sucipto, Sucipto, Nastiti Putri Ayu Kusumastuti, Fenti Nur Addina Islami, and Riska Septifani. "Pengaruh keberadaan logo halal dan kualitas keripik tempe terhadap keputusan pembelian konsumen [Influence of halal logo existence and quality of tempe chips on consumer purchasing decisions]." Jurnal Teknologi & Industri Hasil Pertanian 26, no. 1 (February 10, 2021): 11. http://dx.doi.org/10.23960/jtihp.v26i1.11-24.
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Halal food demand rises in line with the increasing Muslim population. Sanan Industrial Center in Malang City produces tempe chips, both halal- certified and not halal-certified. Generally, the purchase of a product is influenced by the halal logo and its quality. The research objective was to determine halal logo existence and tempe chips' quality on purchasing decisions and provide alternative improvements. The research used the Partial Least Square (PLS) method. The results showed that the existence of the halal logo and product quality affected the purchase decision of both halal-certified and not halal-certified tempe chips. The most influencing variables on halal-certified tempe chips' purchase decision were conformance, aesthetics, halal logo, and performance. The order of the most influencing variables on purchasing decisions for tempe chips products that were not certified halal was conformance, performance, and the existence of a halal logo. Tempe chips business needed to carry out halal certification or halal recertification to include the halal logo on the packaging. Product performance could be improved by innovation and packaging design to make it more attractive.
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Whalen, D. Joel. "Selections From the ABC 2017 Annual Conference, Dublin, Ireland: Finding a Pedagogical Pot o’ Gold." Business and Professional Communication Quarterly 81, no. 2 (May 4, 2018): 244–65. http://dx.doi.org/10.1177/2329490618766637.
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This article, the first of a two-part series, offers readers 13 teaching innovations debuted at the 2017 Association for Business Communication’s annual conference in Dublin, Ireland. Assignment topics presented here include communication strategy and message-packaging skills, deep communication insights, and career and personal development. Additional assignment support materials—instructions to students, stimulus materials, slides, grading rubrics, frequently asked questions, and sample student projects—are downloadable from the Association for Business Communication and DePaul University Center for Sales Leadership websites: http://www.businesscommunication.org/page/assignments and https://salesleadershipcenter.com/research/business-professional-communication-quarterly-my-favorite-assignment
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Raghavan, Madhusudan. "Suspension Design for Linear Toe Curves: A Case Study in Mechanism Synthesis." Journal of Mechanical Design 126, no. 2 (March 1, 2004): 278–82. http://dx.doi.org/10.1115/1.1667933.
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We present an algorithm for synthesizing the attachment point locations of the tie-rod of an automotive suspension, to achieve linear toe change characteristics with jounce and rebound of the wheel. This behavior is considered desirable for achieving good ride and handling. The algorithm reduces the synthesis problem to the computation of the center and normal of a circle, given the coordinates of 3 points on the circle. This procedure is significant because it eliminates numerous cycles of design iterations in traditional analysis-based design methods. Furthermore, the locus of acceptable solutions allows the designer to comply with suspension packaging constraints.
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Gasparovic, M. L., G. V. Gee, and W. J. Atwood. "JC Virus Minor Capsid Proteins Vp2 and Vp3 Are Essential for Virus Propagation." Journal of Virology 80, no. 21 (November 1, 2006): 10858–61. http://dx.doi.org/10.1128/jvi.01298-06.
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ABSTRACT Virus-encoded capsid proteins play a major role in the life cycles of all viruses. The JC virus capsid is composed of 72 pentamers of the major capsid protein Vp1, with one of the minor coat proteins Vp2 or Vp3 in the center of each pentamer. Vp3 is identical to two-thirds of Vp2, and these proteins share a DNA binding domain, a nuclear localization signal, and a Vp1-interacting domain. We demonstrate here that both the minor proteins and the myristylation site on Vp2 are essential for the viral life cycle, including the proper packaging of its genome.
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Завертанний, Б. С., О. П. Манойленко, and О. О. Акимов. "ДОСЛІДЖЕННЯ ВПЛИВУ ЗМІЩЕННЯ ПАКУВАННЯ ВЗДОВЖ ОСІ БОБІНОТРИМАЧА НА КРИТИЧНІ ШВИДКОСТІ." Bulletin of the Kyiv National University of Technologies and Design. Technical Science Series 144, no. 2 (October 14, 2020): 13–23. http://dx.doi.org/10.30857/1813-6796.2020.2.1.
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Creation of a mathematical model of the mechanism of winding of rewinding machines, research of influence of size of shift of packing on critical speeds and development of recommendations for the decision of the set task. Method. When working out the thread for packaging, high-speed winding mechanisms are subject to high requirements, both for the quality of the resulting packaging and for the speed of the bobbin holder. When installing the spool on the spool holder, it is possible to shift it in the axial direction from the design position, which leads to a change in the position of the center of mass of the package with the spool, and in accordance with changes in dynamic loads on the spool holder. Therefore, there is a need to determine the magnitude of the impact of the displacement of the package along the axis of the bobbin holder on the operating speeds of the equipment and the quality of the resulting packages. In the winding process, the placement of the package on the bobbin holder of the winding mechanism of the rewinding machine plays an important role. The displacement of the center of mass of the package affects both the operating speed of the equipment and the quality of the package. In rewinding machines, a mechanism for controlling the thickness of the package is installed, which controls the speed processes during winding. When the coil is shifted towards the top of the cone, incomplete packing (less weight) is developed. When shifted to the side opposite the top of the packing cone, on the contrary, the weight of the packing increases. In addition, the magnitude of the displacement of the package affects the dynamic loads of the winding mechanism. Results. The influence of the magnitude of the packing displacement along the axis of the bobbin holder on the critical speeds of the winding mechanism and the quality of packing is determined. Scientific novelty. The study and analysis of the influence of the magnitude of the displacement of the bobbin with packaging on the critical speeds of the winding mechanism are conducted. The magnitude of the influence of the position of the masses of the center of the coil with packing relative to the bobbin holder on the value of the critical speeds of the winding mechanism is determined. The obtained results allow to control the range of working speeds of the winding mechanism depending on the parameters of the position of the spool on the spool holder, which can be used to adjust the speed of the winding process when packing the spool and make changes when designing the rewinding equipment. The method of determining the maximum possible speeds in the process of rewinding textile material on rewinding machines with direct drive of the bobbin, taking into account the position of the bobbin on the bobbin holder, which can be used in the design of new mechanisms or modernization of existing ones. Practical significance. A dynamic model of the winding mechanism has been developed. The magnitude of the influence of packing displacement on critical speeds is shown. Methods and designs for improving the quality of packaging and stable operation of equipment are proposed.
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Harisudin, Mohamad, Arip Wijianto, and Widiyanto Widiyanto. "STRATEGI PEMERINTAH KABUPATEN WONOGIRI DALAM MENGEMBANGKAN SENTRA AGROINDUSTRI BREM PUTIH." Caraka Tani: Journal of Sustainable Agriculture 27, no. 1 (September 11, 2017): 44. http://dx.doi.org/10.20961/carakatani.v27i1.14352.
Full textAbstract:
<p>This study aims to analyze condition of white brem agroindustrial center inWonogiri, Identifying internal and external environmental conditions, Determiningalternative strategies and priorities determining the most appropriate strategy appliedWonogiri Government in developing agro-industry white brem centers. This study is adescriptive analytical study using primary and secondary data. Primary data to explain thewhite brem conditions agroindustry, strategic factors and alternative strategies anddetermination of the strategy through surveys, observation and focus group discussion.Secondary data in the form of monographs and the potential economic data in Wonogiriregency. Tools Analysis used is the SWOT matrix and the matrix QSP. The studyconcluded that the centers of agroindustrial white brem in Wonogiri is the average revenuein May 2011 amounted to Rp 17,634,375, -; cost needed is Rp 16,103,678, - and therevenue of Rp 1,530,697, -. Strength strategic factors are ease of exchanging information,ease of making sales of products, experience and skills sought a long labor. Strategicfactors are drawbacks: The employers are less innovative, less promotional efforts, piecesof white brem uninteresting, unattractive packaging, the center has not been managed well,the strategic factor market opportunities is a high demand, the development of servicesuppliers of raw materials, the presence of community agencies (bakul), alignments ofgovernment policies, developments in food processing technology, development ofinformation technology. Strategic factor is the threat of price fluctuations of raw materials,competitors' similar product innovation, the presence of product substitution, governmentpolicies that are less integrated, bright sun /weather. Priority strategies are recommended sothat the development of agro-industry centers in the white brem Wonogiri can runeffectively is to Improve togetherness among employers to boost innovation in order toincrease profits.</p>