Books on the topic 'Packaging center'
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International Symposium on Microelectronics (1993 Dallas, Tex.). Proceedings: Of the 1993 International Symposium on Microelectronics, November 9-11, 1993, Dallas Convention Center, Dallas, Texas. Reston, Va: ISHM - The Microelectronics Society, 1993.
Find full textIPC, Printed Circuits Expo 2000 (2000 San Diego Calif ). IPC Printed Circuits Expo: IPC Printed Circuits Expo 2000 : technical proceedings, April 2-6, 2000, San Diego Convention Center, San Diego, CA. Northbrook, Illinois: IPC, 2000.
Find full textIEEE International Symposium on Polymeric Electronics Packaging (1st 1997 Norrköping, Sweden). Proceedings : PEP '97: The First IEEE International Symposium on Polymeric Electronics Packaging : October 26-30, 1997, Louis De Geer Congress Center, Norrköping, Sweden. Piscataway, N.J: IEEE Service Center, 1997.
Find full textInternational, Symposium on Microelectronics (1992 San Francisco Calif ). Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California. Reston, VA: International Society for Hybrid Microelectronics, 1992.
Find full textW, Roman John, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2000: International Symposium on Microelectronics : September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. Reston, Va: IMAPS, 2000.
Find full textO, Tay Andrew A., Lim Thiam Beng, and IEEE Reliability/CPMT/ED Singapore Chapter, eds. Proceedings of 2nd Electronic Packaging Technology Conference: [8-10 December, 1998, Raffles City Convention Center, Singapore]. Piscataway, New Jersey: IEEE, 1998.
Find full textRichard, Charbonneau, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. 2002 International Symposium on Microelectronics: IMAPS : proceedings : September 4-6, 2002, Colorado Convention Center, Denver, CO. Washington, D.C: IMAPS, 2002.
Find full textInternational Symposium on Microelectronics (2003 Boston, Mass.). Proceedings 2003: International Symposium on Microelectronics : IMAPS : November 18-20, 2003, Hynes Convention Center, Boston, MA. Washington, D.C: IMAPS, 2003.
Find full textBruce, Romenesko, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2001: International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, Maryland. Washington, D.C: IMAPS, 2001.
Find full textInternational Microelectronics and Packaging Society., CMP Media, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California. Washington, DC: IMAPS, 2001.
Find full textCoburn, Randall D. Staff report to Assemblymember Maurice D. Hinchey, chairman, Legislative Commission on Solid Waste Management: Subject: packaging and solid waste management, A.6804/S.5732, public hearing, Wednesday, November 18, 1987, Two World Trade Center, New York, New York, 10:00 A.M. [Albany, N.Y: The Commission, 1988.
Find full textHoliday camps in twentieth-century Britain: Packaging pleasure. Manchester: Manchester University Press, 2011.
Find full textHaley Sharpe Associates and Design Limited. Haleysharpe designers. Leicester: Haley Sharpe Associates and Design Limited, 1997.
Find full textOtago, University of, ed. Pills & potions at the Cotter Medical History Trust. Dunedin: Otago University Press, 2014.
Find full textElectronic Packaging Technology Conference (2nd : 1998 : Singapore) and Thiam Beng Lim. Proceedings of 2nd Electronics Packaging Technology Conference: 8-10 December, 1998, Raffles City Convention Center, Singapore. Institute of Electrical & Electronics Enginee, 1998.
Find full textProceedings of 2nd Electronic Packaging Technology Conferenc: [8-10 December, 1998, Raffles City Convention Center, Singapore]. IEEE, 1998.
Find full textProceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California (SPIE proceedings series). Published in cooperation with SPIE, 2001.
Find full text2002 Troubleshooting Short Course for Extrusion Coating and Flexible Packaging Converters: Radisson Hotel & Conference Center, Green Bay, Wisconsin, June 3-6, 2002. Tappi Pr, 2002.
Find full textReinarz, Jonathan. Fragrant Lucre. University of Illinois Press, 2017. http://dx.doi.org/10.5406/illinois/9780252034947.003.0003.
Full textGuins, Raiford. Atari Design. Bloomsbury Publishing Plc, 2020. http://dx.doi.org/10.5040/9781474284561.
Full textCoffman, Chris. Gertrude Stein's Transmasculinity. Edinburgh University Press, 2018. http://dx.doi.org/10.3366/edinburgh/9781474438094.001.0001.
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