Relevant bibliographies by topics / Packaging center

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Packaging center'

Author: Grafiati
Published: 28 June 2021
Last updated: 1 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Packaging center.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Packaging center"

1

Wang, Wei, Wei Ping Yang, and Ge Yi Liu. "Application of DEA Model Based on FCE in the Cigarette Packaging System Mode Evaluation." Advanced Materials Research 1006-1007 (August 2014): 472–76. http://dx.doi.org/10.4028/www.scientific.net/amr.1006-1007.472.

Full text
Abstract:
With the development of modern logistics system, the automatic logistics distribution centers have been built in most tobacco enterprises. The packaging system plays important role in the distribution center, it is necessary to construct a set of scientific method to evaluate the packaging system mode. According to the real situation of tobacco logistics distribution center, the cost and benefit are set to the general goal. For these three modes of packaging system, packaging by hand, automatic packaging and packaging by heat-shrinkable material, the evaluation index system and hierarchical structure are built. Refer to the hierarchical chart and the principle of AHP, the weight of each index is calculated. On the basis of weight that worked out by AHP, the final evaluation result can be found and analyzed follow the principle of fuzzy comprehensive evaluation. Finally, reference the consequences of the FCE, the DEA model based on FCE is used to enhance the integrality and systematic of the evaluate result.
APA, Harvard, Vancouver, ISO, and other styles
2

Hsu, Hsiang-Chen. "Advanced IC Packaging Center in I-Shou University." Journal of The Japan Institute of Electronics Packaging 17, no. 1 (2014): 78. http://dx.doi.org/10.5104/jiep.17.78.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Spanu, Simone, David Mosna, and Giuseppe Vignali. "CFD Analysis of Coffee Packaging in Capsules using Gas Flushing Modified Atmosphere Packaging." International Journal of Food Engineering 12, no. 9 (November 1, 2016): 875–87. http://dx.doi.org/10.1515/ijfe-2016-0047.

Full text
Abstract:
Abstract The aim of this work is to analyze, by means of CFD (Computational Fluid Dynamics), the gas flow in a packaging machine used to fill polymeric capsules with coffee. The final goal is to optimize the geometric shape of some mechanical components in the machine’s sealing station in order to reduce the inert gas consumption achieving an O2 residual which is constantly equal or below 1 % by mass in the center of the capsule. The fluid domain has been obtained starting from the 3D CAD model of the sealing station of the packaging machine. The CAD software SolidWorks has been used to design the system, while Ansys CFX 14.5 software has been used for the CFD analysis. The CFD model has been validated by comparing its results with those obtained by experimental tests. The modified solution allows reducing the average O2 residual from about 3 % to less than 1 %.
APA, Harvard, Vancouver, ISO, and other styles
4

Sui, Guo-rong, Bao-xue Chen, Jian-zhong Zhou, Chang-song Fu, and Mamoru Iso. "Automatic optic waveguide chip packaging system based on center-integration algorithm." Optics Communications 281, no. 6 (March 2008): 1515–21. http://dx.doi.org/10.1016/j.optcom.2007.11.017.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Stevens, Alan, and Houchang Khatamian. "COMPARISON OF MARKETING SURVEY RESPONSES BETWEEN GARDEN SHOW AND GARDEN CENTER SAMPLES." HortScience 27, no. 6 (June 1992): 659c—659. http://dx.doi.org/10.21273/hortsci.27.6.659c.

Full text
Abstract:
Correctly anticipating consumer preferences for goods and services can have a large impact on profitability. Surveying patrons at individual retail outlets does insure the sampling is taken from a customer base, but such surveys are time and labor intensive. A survey sample, taken from attendees at Flower, Lawn and Garden Shows, offers the possibility of large sample sizes, of potential purchasers of horticultural goods and services, with reduced time and labor requirements. A survey to measure the influence of plant size, packaging and price on consumer purchasing habits was conducted at garden shows and garden centers. On the criteria of price and quality of nursery plant materials responses from the two samples were similar. Plant size and packaging appeared to be more influential criteria to the garden show sample.
APA, Harvard, Vancouver, ISO, and other styles
6

Flemming, Jeb, Roger Cook, Kevin Dunn, and James Gouker. "Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000791–810. http://dx.doi.org/10.4071/2012dpc-tp12.

Full text
Abstract:
Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.
APA, Harvard, Vancouver, ISO, and other styles
7

Flemming, Jeb H., Kevin Dunn, James Gouker, Carrie Schmidt, and Roger Cook. "Cost effective 3D Glass Microfabrication for Advanced Packaging Applications." International Symposium on Microelectronics 2012, no. 1 (January 1, 2012): 000781–84. http://dx.doi.org/10.4071/isom-2012-wp14.

Full text
Abstract:
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest for interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles. In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others. In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX™ Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX™ Glass ceramic and the comparisons of wet etching of APEX™ Glass vs. laser ablation.
APA, Harvard, Vancouver, ISO, and other styles
8

Wibowo, Arining, Aquarini Priyatna, and Cece Sobarna. "The Malangese Mask Wayang:The Process of Art Commodification at Asmorobangun Art Center, Pakisaji, Malang." KOMUNITAS: INTERNATIONAL JOURNAL OF INDONESIAN SOCIETY AND CULTURE 11, no. 1 (April 23, 2019): 149–57. http://dx.doi.org/10.15294/komunitas.v11i1.18478.

Full text
Abstract:
The article aims to describe the process of commodification of the Malangese Mask Wayang Art at Asmorobangun Art Center, Pakisaji Sub-district, Malang, Indonesia. Asmorobangun Art Center is one of the surviving art centers engaged in the efforts to preserve and develop the Malangese mask wayang art. The data used in this qualitative study were collected by means of interview, observation, and examination of relevant documents. The results show that the process of commodification of the Malangese mask wayang art manifests in three practices namely the gebyak senin-legian mask wayang performances, art tourism packaging, and mask production. Commodification has transformed the art into commodities/products that are part of the local tourism industry.
APA, Harvard, Vancouver, ISO, and other styles
9

Hatakeyama, Keiichi. "Hitachi Chemical Co., Ltd, Advanced Performance Materials Operational Headquarters, Packaging Solution Center." Journal of Japan Institute of Electronics Packaging 18, no. 2 (2015): 124. http://dx.doi.org/10.5104/jiep.18.124.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Knorr, David B. "Electronic packaging activities at the Rensselaer Polytechnic Institute’s Center for Integrated Electronics." JOM 44, no. 7 (July 1992): 54–55. http://dx.doi.org/10.1007/bf03222277.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Packaging center"

1

Obatoyinbo, Adesunloye. "Supply chain packaging : packaging for optimal inter-region distribution center operations and damage prevention." Thesis, Massachusetts Institute of Technology, 2006. http://hdl.handle.net/1721.1/37238.

Full text
Abstract:
Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Civil and Environmental Engineering; in conjunction with the Leaders for Manufacturing Program at MIT, 2006.
Includes bibliographical references (p. 65).
Honeywell International Corporation is a $27.5 billion [1] conglomerate with a diverse portfolio of businesses covering Aerospace, Automation and Controls, Specialty Materials and Transportation. Honeywell's Automation and Controls Solutions (ACS) business is the second largest business group with $9.4 billion in sales in 2005. This business group is further divided into the following strategic business units: * Security (Facilities) * Life Safety * Building Solutions * Process Solutions * Sensing and Control * Environmental and Combustion Controls The Environmental and Combustion Controls (ECC) business unit of Honeywell ACS maintains a global manufacturing and distribution presence. ECC delivers complex systems that control air, water and combustion for both homes and industrial customers. Historically, ECC plants in the EMEA (Europe, Middle East and Africa) region have either had their own warehouses or had a captive third party provider that provided warehousing services offsite. However, recent initiatives in the region have culminated in the adoption of a regional distribution center model. Essentially, clusters of plants are grouped into regions that are served by the same warehouse or distribution center.
(cont.) The regional warehouse in Heilbronn Germany (ERD) is the pilot for such a system. Plants in Emmen in the Netherlands, Brno in the Czech Republic, Nagykanisza in Hungary and Schoenaich and Mosbach in Germany, as well as some small Low Risk Distribution (LRD) centers - which stock emergency volumes - in western Europe will all be consolidated and served from the distribution center in Heilbronn. This essentially means that instead of storing their own inventory, all the affected plants will truck all production to the Heilbronn warehouse on a daily basis. The Heilbronn warehouse, which commenced operation in May, 2005 subsequently fulfills all customer orders associated with the locations listed above. During the consolidation exercise, while planning for receipt of goods from the different plants, it became clear that there were multiple packaging standards in use throughout Europe. There thus arose the need to consolidate the different standards into a coherent well-defined standard to enable the new distribution center established at Heilbronn, Germany, to properly handle goods from the different plants.
(cont.) Additionally, the newly built ERD had a need for an established set of packing guidelines that may include procedural changes or the establishment of new procedures, changes to the physical setup of the outbound lines (freight and parcel), presentation and replenishment of packaging material and suggestions for improvement for the long term. Receiving guidelines have also been newly instituted for products arriving at the ERD, which also creates a case for compliance for goods being shipped from suppliers including a counterpart warehouse - the Louisville Distribution Center (LDC) - in Louisville, Kentucky. In addition, the LDC had been having difficulty receiving freight from the European plants. The major problems included inadequate labeling, lack of overpacking, inconsistency in packing of mixed pallets and the non-usage of Honeywell 40" X 32" pallets. Since all European plant shipments that formerly shipped directly from each plant would be shipping from ERD in Heilbronn going forward, it became imperative that appropriate packaging standards be developed (in Europe) in order to ensure compliance with receiving guidelines in Louisville at the LDC. Fulfillment through the distribution centers is what drives customer satisfaction.
(cont.) No matter how efficient the plants may be, transit through the distribution centers is the proverbial "last mile" that delivers all the efforts of the firm to the customers. I have developed and recommended a packaging standard, which outlines the levels to which packaged products must be tested in preparation for safe shipping. I analyzed current packing practice at the ERD showing relevant cost drivers and made recommendations on ways to pack in order to improve service to the downstream distribution center while keeping costs contained. I developed a framework to guide warehouse management with regards to pallet shipping decisions between the ERD and LDC. Finally, I developed a carton replenishment framework for the ERD that can be adopted for other appropriate ECC warehouses.
by Adesunloye Obatoyinbo.
S.M.
M.B.A.
APA, Harvard, Vancouver, ISO, and other styles
2

Jamialahmadi, Arsalan. "Experimental and numerical analysis of the dynamic load distribution in a corrugated packaging system." Thesis, KTH, Solid Mechanics (Div.), 2008. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-11385.

Full text
Abstract:

It is well known that transportation means high and varying loads for products as well as packages. To develop corrugated boxes with optimal design and efficient use of raw materials is crucial. Vibrations and shocks acting on pallets during transportation are transferred to the corrugated boxes and considerably reduce the integrity and life time of the boxes. The development of experimental and analytical tools for measurement and prediction of the influence of dynamic loads on the box performance, such as stacking strength and conservation of stacking pattern would therefore be of large practical importance. In order to develop such tools, it is important to know the load distribution between different boxes. This master thesis presents a technique for investigating these stresses based on a pressure sensitive film, which gives many data points. A series of tests using random and sinusoidal vibration testing have been done utilising this technique and results are presented for different positions on the pallet and for different box filling methods. Investigations performed on the vibrations of the boxes also demonstrate a pitch type of motion. A level-crossing study on the forces existing between the boxes shows a Rayleigh force distribution. A mathematical model is also proposed for simulation of a stacking system. Advantages and disadvantages with this technique and with the model are described. Comparison between the experimental and numerical results shows a proper correlation. Using the pressure sensitive film as a quantitative sensor and applying the recorded data for the statistical study of the contact forces existing in a stack of boxes gives useful and important results for further analysis of the fatigue life and vulnerable positions of boxes.

 

APA, Harvard, Vancouver, ISO, and other styles
3

Angelini, Philippe. "Contribution à l'étude de nouvelles technologies de co-packaging et de co-design appliquées à la réalisation de modules photorécepteurs pour les systèmes de télécommunications de prochaine génération." Thesis, Limoges, 2017. http://www.theses.fr/2017LIMO0023/document.

Full text
Abstract:
Les travaux présentés dans cette thèse s'inscrivent dans le cadre des télécommunications optiques à haut-débit sur courtes distances. L'ère numérique dans laquelle nous vivons pousse les architectures actuelles à évoluer aussi rapidement que le besoin en débit. Les réseaux d'accès et data-centers doivent d'ores et déjà évoluer, notamment au niveau des composants et sous-systèmes chargés de détecter les signaux optiques après leur transmission : les photorécepteurs. La montée en débit à 40 Gb/s et au-delà est limitée par l'architecture actuelle des photorécepteurs dont l'interfaçage entre ses deux fonctions primaires (photodétection[PD]/amplification[TIA]) limite la bande passante. Les solutions présentées, visant à limiter la parallélisation multi-longueurs d'onde des composants et ainsi les coût de déploiement, proposent d'augmenter la rapidité des modules photorécepteurs en optimisant leur architecture. Deux axes d'optimisation sont alors proposés au niveau du photorécepteur : Une approche co-packaging ayant pour objectif de considérer les deux fonctions clés du photorécepteur comme des boîtes noires auxquelles il convient d'ajouter un circuit externe permettant d'augmenter la bande passante, et une approche co-design visant à concevoir un nouveau circuit amplificateur transimpédance (TIA) intégrant directement une fonction de pré-égalisation adaptée à la photodiode permettant de repousser la fréquence de coupure du récepteur
This thesis falls within the scope of high-speed short-reach optical communication where the growing need in data transfer forces the current architectures to evolve as quickly. Acces network and data-center components and subsystems must follow this growth, especially on the photoreceiver side. 40 Gb{s and beyond high-speed communications are limited by the current photoreceiver architecture, which, due to the integration of both of its main functions (photodetection[PD]/amplification[TIA]), limits the maximum achievable bandwitdh. In order to reduce the amount of components and price caused by multi-architectures, photoreceivers bandwidth must be increased. Two solutions are proposed so that the photoreceiver performances can be optimized : A co-packaging approach in which both main functions of the photoreceiver are considered as black boxes to which must be added an external circuit allowing to increase the bandwidth, and a co-design approach in which a new transimpedance amplifier (TIA) is designed, integrating a pre-equalizing function based on the photodiode characteristics, allowing an enhancement of the photoreceiver bandwitdh
APA, Harvard, Vancouver, ISO, and other styles
4

Pardessi, Rishikaysh Ravindrra, and Mikael Hagsten-Nielsen. "Work process improvementsin a distribution centerfor a case company." Thesis, KTH, Industriell produktion, 2020. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-280836.

Full text
Abstract:
In an increasingly competitive market, it is important for companies with distribution centers to have efficient processes limiting non-value adding time as much as possible while still being able to deliver what the customer expects. The purpose of the thesis was to investigate the operating processes at the distribution center at Volvo – Eskilstuna. It services the Scandinavian market with multiple departures per day, supplying directly to end customers and retailers. The goal was to increase the efficiency of the distribution center and increase consolidation of multiple parts ordered by the same customer. Currently, multiple packages get delivered to the same customer who has ordered parts the same day. While investigating this inefficiency, we monitored orders through it registering in the system, assignment to picking lists to be picked by operators, packaging and sorting. There were constraints associated with the layout, IT system and traffic safety laws without compromising on delivery efficiency, quality, implementation costs, and organizational regulations. Observations were carried out on the job floor, interviews were conducted with the management or better: with managers / management team, and an independent analysis was conducted of the historical data collected from the warehouse management system. The main results suggest rearranging the inventory according to consumption frequency classification (Paretto principle). Additional results suggest implementing slotting and postpone packaging to consolidate higher order percentage. Multiple strategies have been put forth which need trials to test the implications.
I en ökad konkurrenskraftig marknad är det viktigt för företag med distributionscenter att få effektivare processer och minimera icke värdeskapande aktiviteter. Detta är nödvändigt för att möta kundernas förväntningar och leverera det som kunderna begär. Syftet med uppsatsen var att undersöka hur processerna fungerade på Volvos distributioncentret i Eskilstuna. Volvo levererar reservdelar till hela den skandinaviska marknaden och har flertal leveranser som lämnar distributioncentret dagligen. Målet var att öka effektiviteten i distributionscentret och möjliggöra konsolideringen när en kund beställt flera varor så att de kommer i samma paket. För närvarande levereras de olika varor i separata paket istället för att komma i en och samma. För att undersöka detta fenomen så samlades data in genom det som registrerades i systemet. Det fanns begränsningar i samband med lagstiftningen, IT-systemet och trafiksäkerhetslagar samt att lösningarna inte skulle kompromissa med leveranseffektivitet, kvalitet, implementeringskostnader och organisatoriska föreskrifter. Observationer genomfördes på arbetsplatsen, intervjuer genomfördes med ledningsgruppen eller relevanta chefer och en oberoende analys genomfördes av de historiska data som samlats in från lagerhanteringssystemet. De viktigaste resultaten föreslår att reservdelar bör förvaras efter Paretto principen som har med konsumtion frekvensen att göra. Ytterligare resultat föreslår att man ändrar på hur varor paketeras samt skjuter upp förpackningar för att konsolidera högre orderprocent.
APA, Harvard, Vancouver, ISO, and other styles
5

Plodková, Zuzana. "Posouzení spolehlivosti procesu balení optických kabelů." Master's thesis, Vysoké učení technické v Brně. Fakulta strojního inženýrství, 2021. http://www.nusl.cz/ntk/nusl-443156.

Full text
Abstract:
The diploma thesis deals with the assessment of the reliability of processes at the packaging center in the company CommScope Czech Republic s.r.o. The first part of the work is research about options for quality management using ISO 9000 standards, but also TQM approaches. At the same time, methods and analytical techniques are discussed, which will be further used in the practical part of this thesis. The following section introduces CommScope Inc. and its main product - optical fiber. The practical part contains an introduction to the packaging center and its processes, it also describes the analysis of the reliability of the original state and proposals for corrective measures that were designed within the Kaizen event. The rest of the work is then devoted to the implementation of the proposed changes and their economic assessment. Finally, an evaluation of the methods used, the results achieved and other recommendations are given.
APA, Harvard, Vancouver, ISO, and other styles
6

Gouveia, Miguel Bruno Lemos de. "Arquitectura semântica para a integração de sistemas no domínio do turismo." Master's thesis, Universidade da Madeira, 2007. http://hdl.handle.net/10400.13/109.

Full text
Abstract:
A indústria do turismo caracteriza-se pela sua heterogeneidade e pelo grande volume de transacções realizadas on-line. Cada vez mais os pequenos operadores turísticos optam por desenvolver os seus pequenos sistemas de reservas, para não terem de estar submetidos ao pagamento de comissões às entidades que gerem os grandes sistemas de informação turística. Devido a este facto, têm surgido um grande número de novas fontes de informação turística na Internet. A proliferação de informação turística torna complexo o planeamento das férias por parte do turista. A implementação de sistemas de integração de informação turística torna-se uma necessidade urgente. Ao mesmo tempo que ajudam o turista no planeamento das férias, também permitem aos operadores implementarem novas estratégias de marketing. Uma destas novas estratégias de marketing passa pela implementação do conceito de “Dynamic Packaging”. O “Dynamic Packaging” permite ao turista, ou ao agente turístico, a construção de pacotes que incluem produtos turísticos escolhidos por este sem qualquer limitação. Aos operadores turísticos, permite a criação de regras de negócio sobre a constituição de um pacote. As regras são depois aplicadas dinamicamente à medida que os pacotes são definidos. A arquitectura SEED define a implementação de um sistema de integração de informação turística. Pretende também disponibilizar a base para a implementação de sistemas que suportem o “Dynamic Packaging”. A integração da informação é realizada através da utilização das tecnologias associadas à Web Semântica. A implementação do “Dynamic Packaging” é suportada pela utilização de motores de inferência que permitem a definição e interpretação de regras semânticas.
Orientador: António Jorge Silva Cardoso
APA, Harvard, Vancouver, ISO, and other styles
7

Dolan, Alice Claire. "The fabric of life : linen and life cycle in England, 1678-1810." Thesis, University of Hertfordshire, 2016. http://hdl.handle.net/2299/17196.

Full text
Abstract:
'The Fabric of Life: Linen and Life Cycle in England, 1678-1810' is structured around the human life cycle to draw out the social and cultural importance of linen for all ranks of society. Human and object life cycles are juxtaposed in the thesis to analyse co-dependent activities and processes rather than focusing on one facet of daily life. For thousands of years flax was a staple fibre, used for textile production in many parts of the globe. Cotton only overtook linen as the most popular textile in England at home and on the body during the nineteenth century. This thesis examines the preceding century to reveal why linen remained a daily necessity in England between 1678 and 1810, a period which encompassed a series of significant changes in the production, trade and use of linen. Linen was ubiquitous as underwear, sheets, table linens and for logistical purposes therefore it provides a unique insight into the early-modern world; a means of understanding the multifaceted experiences of daily life, of integrating understandings of the body, domestic, social, cultural and commercial activities. This thesis is social history through the lens of linen, reading a society through its interactions with a textile.
APA, Harvard, Vancouver, ISO, and other styles
8

Moriya, Giovana Abrahão de Araujo. "Prazo de validade de esterilização de materiais utilizados na assistência à saúde: um estudo experimental." Universidade de São Paulo, 2012. http://www.teses.usp.br/teses/disponiveis/7/7139/tde-23082012-154144/.

Full text
Abstract:
Diversos países vêm adotando diretrizes que relacionam prazo de validade de esterilidade de materiais críticos utilizados na assistência à saúde com a ocorrência de eventos relacionados. Pesquisas têm validado a manutenção da esterilidade do material durante o transporte e armazenamento por longos intervalos de tempo. O racional teórico já refutava o antigo paradigma de prazo de validade de esterilidade, baseado no tempo relógio/calendário justificado pela eficiência das embalagens com características de barreira microbiana, selagem hermética e a teoria da ausência de geração espontânea dos micro-organismos. No entanto, no Brasil, pode-se afirmar que os Centros de Material e Esterilização ainda praticam o controle de materiais esterilizados, baseado em data arbitrariamente atribuída, sendo esta prática incentivada por recomendações de documentos elaborados por órgãos oficiais normatizadores e fiscalizadores nacionais. Na crença de que realizar uma investigação experimental in vitro, produzindo evidências científicas robustas contribuiria no fortalecimento da quebra do antigo paradigma, propôs-se avaliar a manutenção da esterilidade de materiais armazenados por até 6 meses, após as embalagens diversas sofrerem contaminação intencional em suas superfícies externas. O experimento consistiu em embalar corpos de prova que simulassem instrumental cirúrgico (cilindros de porcelana) em quatro diferentes tipos de invólucros: algodão tecido, papel crepado, tecido nãotecido (SMS) e papel grau-cirúrgico. Todos os pacotes foram previamente autoclavados em um mesmo ciclo de esterilização. Posteriormente, as superfícies externas dos pacotes foram intencionalmente manipuladas com mãos contaminadas com Serratia marcescens (106 U.F.C./mL). Após intervalos predeterminados de armazenamento (0, 7, 14, 28, 90 e 180 dias), uma quantidade determinada de pacotes de cada tipo de embalagem foi aberta e os corpos de prova foram semeados diretamente em meio de cultura caseína-soja. Os pacotes com corpos de prova com tempo zero de armazenamento foram considerados como grupo controle negativo. Com a finalidade de garantir a viabilidade do micro-organismo-teste na superfície externa das embalagens foram realizados semanalmente, até 180 dias, cultivos das amostras de cada uma das embalagens contaminadas com o micro-organismo-teste, constituindo-se o grupo controle positivo. Para cada intervalo de tempo de armazenamento, foram analisados 600 corpos de prova (150 para cada tipo de embalagem). Considerando o intervalo de confiança exato para distribuição binomial, o tamanho de amostra calculado na pesquisa garantiu um intervalo de confiança de 95% com probabilidade de 0 a 0,006 de se encontrar uma amostra contaminada. Como resultado, não foram recuperados micro-organismos-teste Serratia marcescens em nenhum dos intervalos de tempo de armazenamento. Todos os testes realizados no grupo controle positivo apresentaram recuperação do micro-organismo-teste. Com base nos resultados deste estudo, observou-se que pacotes embalados em invólucros com propriedades de barreiras microbianas e selados hermeticamente são capazes de proteger Resumo Giovana Abrahão de Araújo Moriya o conteúdo esterilizado por até 6 meses. Este estudo contribui para a prática em Centros de Material e Esterilização, impedindo o reprocessamento desnecessário dos materiais, ao mesmo tempo, alerta para que os eventos relacionados sejam controlados e que cada material, antes da sua utilização, seja inspecionado quanto à integridade da embalagem e selagem.
Many countries have adopted guidelines that relate sterility validity period of health care critical materials with the occurrence of related events. Research has validated the maintenance of sterility of the material during transportation and storage for long periods of time. The theoretical rationale has already refuted the old paradigm of sterility validity period based on the time clock/calendar (time-related) due to the efficiency of packaging with microbial barrier characteristics, hermetic seal and the theory of absence of spontaneous generation of micro-organisms. However, in Brazil, it can be stated that the Central Supply and Sterilization Departments still practice the control of sterilized materials based on arbitrarily assigned deadlines, this practice is encouraged by recommendation documents drawn up by official national entities of standardizing and supervising. In the belief that performing an experimental investigation in vitro, producing robust scientific evidence, would help in strengthening the breaking of the old paradigm, we proposed to evaluate the maintenance of sterility of materials stored for up to 6 months after the packages suffer intentional contamination of their external surfaces. The experiment consisted of packing the specimens that simulate surgical instrument (porcelain cylinders) in four different types of wrappers: cotton, crepe paper, nonwoven fabric (SMS) and paper-plastic pouches. All packages have previously been autoclaved at the same sterilization cycle. Subsequently, the external surfaces of the packages were intentionally manipulated with hands contaminated with Serratia marcescens (106 C.F.U./mL). After storage at predetermined intervals (0, 7, 14, 28, 90 and 180 days), a specific quantity of packages of each type of packaging has been opened and the samples were seeded directly in soybean-casein culture medium. The packages with samples with zero time of storage were considered as negative controls. In order to ensure the viability of the test micro-organism on the outer surface of the packages, cultivation of samples of each package contaminated with the test microorganism were made weekly up to 180 days, constituting the positive control group. For each interval of time of storage, 600 samples were analyzed (150 for each type of package). Considering the confidence interval for the exact binomial distribution, the sample size calculated in the study ensured a confidence interval of 95% with 0 to 0.006 probability of finding a contaminated sample. As result, there were no recovered test micro-organism Serratia marcescens in any of the time intervals of storage. Based on the results of this study, it was observed that packages wrapped in wrappers with microbial barrier properties and hermetically sealed are capable of protecting the sterile contents up to 6 months. This study contributes to the clinical practice in Central Supply and Sterilization Department, preventing unnecessary reprocessing of the material, while warns that the related events should be monitored and each material, before use, must be inspected for its integrity of the packaging and sealing.
APA, Harvard, Vancouver, ISO, and other styles
9

楊鎮宇. "Production Scheduling of Capacity Allocation Center to Integrate Packaging and Testing Plants." Thesis, 2012. http://ndltd.ncl.edu.tw/handle/69070781669430713709.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Chou, Yeh-Chih, and 周業值. "The Study on The Promotional Activity and Its Influence of " China Industrial Design & Packaging Center " in 1970." Thesis, 2005. http://ndltd.ncl.edu.tw/handle/46066363666362976745.

Full text
Abstract:
碩士
國立雲林科技大學
工業設計系碩士班
93
Through literature collecting and interview, this study investigated the influences to Taiwan’s industrial design field of CIDPC’s establishment process and promotion activity model. Established in 1973 under China Productivity Center’s direction, CIDPC is a design center belongs to the government. Through CIDPC’s magazine “Industrial Design and Packaging,” issue 1-18, the activity information of CIDPC provided by the manager Kuo-Chwan Yuan and the interview of the director, manager and designers, the author have verified the activities and the outcome of the interview to clarify the fact of every activity. The result of this study reveals that the development goal of ”A Proposal on The Promotion of Industrial and Training of Design in China” in 1963 such as industrial summer workshop and establishment of formal industrial design department in college not only enlightened Taiwan’s industrial design, but also boost CIDPC’s establishment.“Industrial Design Development Forum”in 1967 further contributed to CIDPC”s establishment, and help CIDPC earned more attention from the society. Subsidization from“Bureau of Foreign Trade”is another critical factor which promote CIDPC’s establishment. CIDPC’s business is divided into two parts, one is to design product to earn their working capital. Another one is to hold seminar, workshop, Joint Exhibition of College Graduate Commercial Design, and Product Packaging Golden Star Award along with promoting activities with industrial circle, the government and academic circle. During the time conducting the study, we learned that CIDPC closed due to insufficient budget, but the model of numerous design promotion activities they established have set good foundation for Taiwan’s design field. All the workshops of the academic circle and industrial technique exchange, annually held product design selection and design exhibition have been affected by CIDPC. Therefore, for our industrial design development, CIDPC’s development experience is the most value.
APA, Harvard, Vancouver, ISO, and other styles

Books on the topic "Packaging center"

1

International Symposium on Microelectronics (1993 Dallas, Tex.). Proceedings: Of the 1993 International Symposium on Microelectronics, November 9-11, 1993, Dallas Convention Center, Dallas, Texas. Reston, Va: ISHM - The Microelectronics Society, 1993.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

IPC, Printed Circuits Expo 2000 (2000 San Diego Calif ). IPC Printed Circuits Expo: IPC Printed Circuits Expo 2000 : technical proceedings, April 2-6, 2000, San Diego Convention Center, San Diego, CA. Northbrook, Illinois: IPC, 2000.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
3

IEEE International Symposium on Polymeric Electronics Packaging (1st 1997 Norrköping, Sweden). Proceedings : PEP '97: The First IEEE International Symposium on Polymeric Electronics Packaging : October 26-30, 1997, Louis De Geer Congress Center, Norrköping, Sweden. Piscataway, N.J: IEEE Service Center, 1997.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

International, Symposium on Microelectronics (1992 San Francisco Calif ). Proceedings of the 1992 International Symposium on Microelectronics, October 19-21, 1992, Moscone Center, San Francisco, California. Reston, VA: International Society for Hybrid Microelectronics, 1992.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

W, Roman John, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2000: International Symposium on Microelectronics : September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. Reston, Va: IMAPS, 2000.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

O, Tay Andrew A., Lim Thiam Beng, and IEEE Reliability/CPMT/ED Singapore Chapter, eds. Proceedings of 2nd Electronic Packaging Technology Conference: [8-10 December, 1998, Raffles City Convention Center, Singapore]. Piscataway, New Jersey: IEEE, 1998.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Richard, Charbonneau, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. 2002 International Symposium on Microelectronics: IMAPS : proceedings : September 4-6, 2002, Colorado Convention Center, Denver, CO. Washington, D.C: IMAPS, 2002.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

International Symposium on Microelectronics (2003 Boston, Mass.). Proceedings 2003: International Symposium on Microelectronics : IMAPS : November 18-20, 2003, Hynes Convention Center, Boston, MA. Washington, D.C: IMAPS, 2003.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Bruce, Romenesko, International Microelectronics and Packaging Society, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings 2001: International Symposium on Microelectronics, October 9-11, 2001, Baltimore Convention Center, Baltimore, Maryland. Washington, D.C: IMAPS, 2001.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

International Microelectronics and Packaging Society., CMP Media, and Society of Photo-optical Instrumentation Engineers., eds. Proceedings: 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California. Washington, DC: IMAPS, 2001.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Packaging center"

1

Gossin, Peter C., and Ryan C. LaBrie. "Data Center Waste Management." In Green Technologies and Business Practices, 226–35. IGI Global, 2013. http://dx.doi.org/10.4018/978-1-4666-1972-2.ch014.

Full text
Abstract:
As the world’s content becomes further digitized and consumers, corporations, and governments turn to cloud computing platforms – specifically the data center – for their storage and application needs, managing data center waste becomes increasingly important. Less than near full utilization rates for the computing resources, rising energy costs, and e-waste management are just a few of the reasons why a focused attention on practicing sustainable management in the data center is essential. This research identifies several key foci of waste within the management of data centers, including: power, emissions, computing resource lifespan, facilities, and packaging methods. Furthermore this research identifies four roadblocks, or challenges, facing sustainability improvements within the data center. These challenges include: IT prioritization pressures, (lack of) governmental regulation, consumption-oriented cultures, and lagging academic support and innovation. By first recognizing these forms of waste and then coming up with innovative ways to address the technological, regulatory, and managerial challenges faced in data centers across the globe, data center management can move from a position of lagging to a position of leadership in the sustainability movement.
APA, Harvard, Vancouver, ISO, and other styles
2

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Thermal Modeling of Data Centers." In Encyclopedia of Thermal Packaging, 43–95. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0018.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Thermal Modeling of Data Centers." In Encyclopedia of Thermal Packaging, 43–95. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814678070_0002.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Lopez, Clara, Franz Jäeger, Karina Ramirez, and Mario Chong. "A Plan to Improve Recycled Raw Material Supply in a Production Company of RPET." In Handbook of Research on Industrial Applications for Improved Supply Chain Performance, 27–45. IGI Global, 2020. http://dx.doi.org/10.4018/978-1-7998-0202-0.ch002.

Full text
Abstract:
The world is facing a problem caused by the management of polyethylene terephthalate (PET) packaging. In the Peruvian context, the studied company is the only local company that has a factory which is able to process post-consumer plastic bottles in order to transform them into recycled resin; this is why it performs a fundamental role. This recycled resin is used for elaborating new packages, generating a circular economy into line with the new global paradigm of switching to a model that seeks to reduce, reuse, and recycle. Finally, it was concluded that the collection center implementation will allow the recycling unit to purchase an average of 76 TN additional annual raw materials. The project would have a cost of US$ 151,383, generating a Net Present Value (NPV) of US$ 144,500 with a 25.9% of Internal Rate of Return (IRR), making it viable in a moderate scenario with a recovery period of five years.
APA, Harvard, Vancouver, ISO, and other styles
5

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Data Centers and Thermal Management Approaches." In Encyclopedia of Thermal Packaging, 1–42. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0017.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Dynamic Thermal Modeling of Data Centers." In Encyclopedia of Thermal Packaging, 97–154. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0019.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Data Centers and Thermal Management Approaches." In Encyclopedia of Thermal Packaging, 1–42. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814678070_0001.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Dynamic Thermal Modeling of Data Centers." In Encyclopedia of Thermal Packaging, 97–154. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814678070_0003.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Thermal Measurements and Their Use in Data Centers." In Encyclopedia of Thermal Packaging, 239–87. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814327664_0022.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Sammakia, Bahgat, Yogendra Joshi, Dereje Agonafer, Emad Samadiani, and Avram Bar-Cohen. "Thermal Measurements and Their Use in Data Centers." In Encyclopedia of Thermal Packaging, 239–87. World Scientific Publishing Company, 2014. http://dx.doi.org/10.1142/9789814678070_0006.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Packaging center"

1

Guggari, Shrishail, Dereje Agonafer, Christian Belady, and Lennart Stahl. "A Hybrid Methodology for the Optimization of Data Center Room Layout." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35273.

Full text
Abstract:
Today’s data centers are designed for handling heat densities of 1000W/m2 at the room level. Trends indicate that these heat densities will exceed 3000W/m2 in the near future. As a result, cooling of data centers has emerged as an area of increasing importance in electronics thermal management. With these high heat loads, data center layout and design cannot rely on intuitive design of air distribution and requires analytical tools to provide the necessary insight to the problem. These tools can also be used to optimize the layout of the room to improve energy efficiency in the data center. In this paper, first an under floor analysis is done to find an optimized layout based on flow distribution through perforated tiles, then a complete Computational Fluid Dynamics (CFD) model of the data center facility is done to check for desired cooling and air flow distribution throughout the room. A robust methodology is proposed which helps for fast, easy, efficient modeling and analysis of data center design. Results are displayed to provide some guidance on the layout and design of data center. The resulting design approach is very simple and well suited for the energy efficient design of complex data centers and server farms.
APA, Harvard, Vancouver, ISO, and other styles
2

"The small scale systems integration and packaging center - a New York State Center of Excellence [Advertisement]." In 2012 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2012. http://dx.doi.org/10.1109/itherm.2012.6231403.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Zhang, Xuanhang Simon, and James W. VanGilder. "Real-Time Data Center Transient Analysis." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52088.

Full text
Abstract:
A software tool was developed to predict the transient cooling performance of data centers and to explore various alternatives in real-time for data center design and management purposes. Cooling performance can be affected by factors such as room architecture, rack population and layout, connections between cooler fans and UPSs, chilled water pumps and UPSs, the size of the chilled water storage tank, etc. The available transient cooling runtime is mainly dictated by the system stored cooling capacity and the total load in the data center. This paper discusses the transient response of data centers to different design and failure scenarios and details a comprehensive and efficient approach for simulating this performance.
APA, Harvard, Vancouver, ISO, and other styles
4

Bodhuin, Thierry, Massimiliano Di Penta, and Luigi Troiano. "A search-based approach for dynamically re-packaging downloadable applications." In the 2007 conference of the center for advanced studies. New York, New York, USA: ACM Press, 2007. http://dx.doi.org/10.1145/1321211.1321215.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Fulpagare, Yogesh, Xin Xiong, and Poh Seng Lee. "Thermal Characterization of Vortex Flow Layout for Data Center." In 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC). IEEE, 2019. http://dx.doi.org/10.1109/eptc47984.2019.9026570.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Hoover, Christopher, Niru Kumari, Carlos Felix, and Cullen Bash. "A Data Center Environmental Advisory System." In ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems. ASMEDC, 2011. http://dx.doi.org/10.1115/ipack2011-52128.

Full text
Abstract:
We present Avatar, a data center environmental advisory system for raised floor data centers. Using limited information such as inlet and reference temperatures for IT equipment and basic floor plan geometry, Avatar produces recommendation to adjust the operation of computer room air conditioners (CRACs) and the configuration of vent tiles in a data center so as to reducing excess provisioning of cooling and to remove hot spots. Avatar reduces operating expenses by cooling the same load with less energy. Avatar reduces capital expenses by recovering stranded cooling capacity that would otherwise have to be replaced.
APA, Harvard, Vancouver, ISO, and other styles
7

Rambo, Jeffrey D., and Yogendra K. Joshi. "Multi-Scale Modeling of High Power Density Data Centers." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35297.

Full text
Abstract:
Data center facilities, which house thousands of servers, storage devices and computing hardware, arranged in 2 meter high racks are providing many thermal challenges. Each rack can dissipate 10–15 kW, and with facilities as large as tens of thousands of square feet, the net power dissipated is typically on the order of several MW. The cost to power these facilities alone can be millions of dollars a year, with the cost to provide adequate cooling not far behind. Significant savings can be realized for the end user by improved design methodology of these high power density data centers. The fundamental need for improved characterization is motivated by inadequacies of simple energy balances to identify local ‘hot spots’ and ultimately provide a reliable modeling framework by which the data centers of the future can be designed. Recent attempts in computational fluid dynamics (CFD) modeling of data centers have been based around a simple rack model, either as a uniform heat generator or specified temperature rise across the rack. This desensitizes the solution to variations of heat load and corresponding flow rate needed to cool the servers throughout the rack. Heat generated at the smaller scales (the chip level) produces changes in the larger length scales of the data center. Accurate simulations of these facilities should attempt to resolve the range of length scales present. In this paper, a multi-scale model where each rack is subdivided into a series of sub-models to better mimic the behavior of individual servers inside the data center is proposed. A Reynolds-averaged Navier-Stokes CFD model of a 110 m2 (1,200 ft2) representative data center with the raised floor cooling scheme was constructed around this multi-scale rack model. Each of the 28 racks dissipated 4.23 kW, giving the data center a power density of 1076 W/m2 (100 W/ft2) based on total floor space. Parametric studies of varying heat loads within the rack and throughout the data center were performed to better characterize the interactions of the sub-rack scale heat generation and the data center. Major results include 1) the presence of a nonlinear thermal response in the upper portion of each rack due to recirculation effects and 2) significant changes in the surrounding racks (up to 10% increase in maximum temperature) observed in response to changes in rack flow rate (50% decrease).
APA, Harvard, Vancouver, ISO, and other styles
8

Wijaya, Ratnasari, Kurnia Setiawan, and Herlina Kartaatmadja. "The Analysis of Packaging Design Product Organic Food Eco Spirit Center." In International Conference on Economics, Business, Social, and Humanities (ICEBSH 2021). Paris, France: Atlantis Press, 2021. http://dx.doi.org/10.2991/assehr.k.210805.096.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Ohata, Nobuo, Mizuki Shirao, Yosuke Kawamoto, Tadashi Murao, Masashi Binkai, Hayato Sano, and Kiyotomo Hasegawa. "High-speed optical devices and packaging techniques for data centers." In Metro and Data Center Optical Networks and Short-Reach Links III, edited by Madeleine Glick, Atul K. Srivastava, and Youichi Akasaka. SPIE, 2020. http://dx.doi.org/10.1117/12.2544190.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Parida, Pritish R., Timothy J. Chainer, Mark D. Schultz, and Milnes P. David. "Cooling Energy Reduction During Dynamically Controlled Data Center Operation." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73208.

Full text
Abstract:
Data Center power usage has been growing rapidly as new internet applications are developed, requiring computing resources such as high-density cloud computing server farms. All of the electricity consumed by data centers is ultimately turned into heat. This heat is removed using fans, pumps, chillers and air conditioning equipment, which comprise roughly a quarter of the total data center power consumption. As part of a US Department of Energy cost shared grant, a data center test facility was designed and constructed with the goal to demonstrate the potential to reduce cooling energy use to less than 5% of the total IT and facilities energy usage by utilizing liquid cooling of the electronics rack. The system was characterized to develop temperature-based energy-aware servo control algorithms for further cooling energy reductions. These algorithms were implemented to dynamically reduce the data center cooling power consumption while controlling to a specified temperature under varying outdoor temperature and workload conditions. This work illustrates the energy-centric controls that were implemented to achieve dynamic system control in the most energy efficient manner.
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Packaging center"

1

Schwartz, Steven, W. Ratphitagsanti, L. E. Rodriguez-Saona, and V. M. Balasubramaniam. Participation in the Center for Advanced Processing and Packaging Studies. Fort Belvoir, VA: Defense Technical Information Center, November 2009. http://dx.doi.org/10.21236/ada520642.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Schwartz, Steven J. Final Report for the Center for Advanced Processing and Packaging Studies (CAPPS). Fort Belvoir, VA: Defense Technical Information Center, November 2010. http://dx.doi.org/10.21236/ada545999.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Bruder, Brittany L., Katherine L. Brodie, Tyler J. Hesser, Nicholas J. Spore, Matthew W. Farthing, and Alexander D. Renaud. guiBath y : A Graphical User Interface to Estimate Nearshore Bathymetry from Hovering Unmanned Aerial System Imagery. Engineer Research and Development Center (U.S.), February 2021. http://dx.doi.org/10.21079/11681/39700.

Full text
Abstract:
This US Army Engineer Research and Development Center, Coastal and Hydraulics Laboratory, technical report details guiBathy, a graphical user interface to estimate nearshore bathymetry from imagery collected via a hovering Unmanned Aerial System (UAS). guiBathy provides an end-to-end solution for non-subject-matter-experts to utilize commercia-off-the-shelf UAS to collect quantitative imagery of the nearshore by packaging robust photogrammetric and signal-processing algorithms into an easy-to-use software interface. This report begins by providing brief background on coastal imaging and the photogrammetry and bathymetric inversion algorithms guiBathy utilizes, as well as UAS data collection requirements. The report then describes guiBathy software specifications, features, and workflow. Example guiBathy applications conclude the report with UAS bathymetry measurements taken during the 2020 Atlantic Hurricane Season, which compare favorably (root mean square error = 0.44 to 0.72 m; bias = -0.35 to -0.11 m) with in situ survey measurements. guiBathy is a standalone executable software for Windows 10 platforms and will be freely available at www.github.com/erdc.
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Packaging center' for particular source types:
Journal articles Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography