Journal articles on the topic 'On-Wafer characterization'
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Saedon, Juri B., Siti Musalmah Md Ibrahim, Amir Radzi Abd Ghani, and Muhammad Hafizi Bin Abd Razak. "Dicing Characterization on Optical Silicon Wafer Waveguide." Applied Mechanics and Materials 899 (June 2020): 163–68. http://dx.doi.org/10.4028/www.scientific.net/amm.899.163.
Koolen, M. C. A. M. "On-wafer high-frequency device characterization." Microelectronic Engineering 19, no. 1-4 (September 1992): 679–86. http://dx.doi.org/10.1016/0167-9317(92)90521-r.
Lau, J. H., P.-J. Tzeng, C.-K. Lee, C.-J. Zhan, M.-J. Dai, Li Li, C.-T. Ko, et al. "Wafer Bumping and Characterizations of Fine-Pitch Lead-Free Solder Microbumps on 12” (300mm) wafer for 3D IC Integration." International Symposium on Microelectronics 2011, no. 1 (January 1, 2011): 000650–56. http://dx.doi.org/10.4071/isom-2011-wa6-paper2.
Teixeira, Jorge, Mário Ribeiro, and Nélson Pinho. "Advanced warpage characterization for FOWLP." International Symposium on Microelectronics 2013, no. 1 (January 1, 2013): 000641–46. http://dx.doi.org/10.4071/isom-2013-wp21.
Kerepesi, Péter, Bernhard Rebhan, Matthias Danner, Karin Stadlmann, Heiko Groiss, Peter Oberhumer, Jiri Duchoslav, and Kurt Hingerl. "Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization." ECS Transactions 112, no. 3 (September 29, 2023): 159–72. http://dx.doi.org/10.1149/11203.0159ecst.
Deleniv, Anatoly, Andrei Vorobiev, and Spartak Gevorgian. "On-Wafer Characterization of Varactor Using Resonating Microprobes." IEEE Transactions on Microwave Theory and Techniques 56, no. 5 (May 2008): 1105–11. http://dx.doi.org/10.1109/tmtt.2008.921283.
Laskar, J., J. J. Bautista, M. Nishimoto, M. Hamai, and R. Lai. "Development of accurate on-wafer, cryogenic characterization techniques." IEEE Transactions on Microwave Theory and Techniques 44, no. 7 (July 1996): 1178–83. http://dx.doi.org/10.1109/22.508659.
Moore, B., M. Margala, and C. Backhouse. "Design of wireless on-wafer submicron characterization system." IEEE Transactions on Very Large Scale Integration (VLSI) Systems 13, no. 2 (February 2005): 169–80. http://dx.doi.org/10.1109/tvlsi.2004.840780.
CHEN, CHIH-HUNG. "ACCURACY ISSUES OF ON-WAFER MICROWAVE NOISE MEASUREMENTS." Fluctuation and Noise Letters 08, no. 03n04 (December 2008): L281—L303. http://dx.doi.org/10.1142/s0219477508005136.
Seong, Inho, Jinho Lee, Sijun Kim, Youngseok Lee, Chulhee Cho, Jangjae Lee, Wonnyoung Jeong, Yebin You, and Shinjae You. "Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma." Nanomaterials 12, no. 22 (November 10, 2022): 3963. http://dx.doi.org/10.3390/nano12223963.
Hong, Hao-Chiao, and Long-Yi Lin. "Accurate and Fast On-Wafer Test Circuitry for Device Array Characterization in Wafer Acceptance Test." IEEE Transactions on Circuits and Systems I: Regular Papers 66, no. 9 (September 2019): 3467–79. http://dx.doi.org/10.1109/tcsi.2019.2924251.
Kerepesi, Péter, Bernhard Rebhan, Matthias Danner, Karin Stadlmann, Heiko Groiss, Peter Oberhumer, Jiri Duchoslav, and Kurt Hingerl. "Oxide-Free SiC-SiC Direct Wafer Bonding and Its Characterization." ECS Meeting Abstracts MA2023-02, no. 33 (December 22, 2023): 1603. http://dx.doi.org/10.1149/ma2023-02331603mtgabs.
Field, Daniel E., James W. Pomeroy, Farzan Gity, Michael Schmidt, Pasqualino Torchia, Fan Li, Peter M. Gammon, Vishal A. Shah, and Martin Kuball. "Thermal characterization of direct wafer bonded Si-on-SiC." Applied Physics Letters 120, no. 11 (March 14, 2022): 113503. http://dx.doi.org/10.1063/5.0080668.
Liu, Kai, YongTaek Lee, HyunTai Kim, MaPhooPwint Hlaing, Susan Park, and Billy Ahn. "Electrical Characterization on a High-Speed Wafer-Level Package." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2013, DPC (January 1, 2013): 001937–62. http://dx.doi.org/10.4071/2013dpc-tha23.
Kazemi Esfeh, Babak, Khaled Ben Ali, and Jean-Pierre Raskin. "Compact On-Wafer Test Structures for Device RF Characterization." IEEE Transactions on Electron Devices 64, no. 8 (August 2017): 3101–7. http://dx.doi.org/10.1109/ted.2017.2717196.
Dunleavy, L. P., J. Randa, D. K. Walker, R. Billinger, and J. Rice. "Characterization and applications of on-wafer diode noise sources." IEEE Transactions on Microwave Theory and Techniques 46, no. 12 (1998): 2620–28. http://dx.doi.org/10.1109/22.739255.
Imai, M., Y. Miyamura, D. Murata, and A. Ogi. "Characterization of SiGe Layer on Insulator by In-Plane Diffraction Method." Solid State Phenomena 108-109 (December 2005): 451–56. http://dx.doi.org/10.4028/www.scientific.net/ssp.108-109.451.
Hoff, A. M., and E. Oborina. "Fast Non-Contact Dielectric Characterization for SiC MOS Processing." Materials Science Forum 527-529 (October 2006): 1035–38. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.1035.
Caddemi, Alina, Emanuele Cardillo, Giovanni Crupi, Luciano Boglione, and Jason Roussos. "Microwave Linear Characterization Procedures of On-Wafer Scaled GaAs pHEMTs for Low-Noise Applications." Electronics 8, no. 11 (November 18, 2019): 1365. http://dx.doi.org/10.3390/electronics8111365.
Cavaco, Celso, Lan Peng, Koen De Leersnijder, Stefano Guerrieri, Deniz S. Tezcan, and Haris Osman. "Copper Oxide Direct Bonding of 200mm CMOS Wafers: Morphological and Electrical Characterization." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000594–97. http://dx.doi.org/10.4071/isom-2015-tha26.
Marino, Nobuaki, Kiichirou Murai, and Yoshinori Kataora. "Characterization of Surface Contaminants by a Silver Film-Enhanced IR—Johnson Method." Applied Spectroscopy 51, no. 10 (October 1997): 1460–63. http://dx.doi.org/10.1366/0003702971939226.
Chun, C., A. Pham, J. Laskar, and B. Hutchison. "Development of microwave package models utilizing on-wafer characterization techniques." IEEE Transactions on Microwave Theory and Techniques 45, no. 10 (1997): 1948–54. http://dx.doi.org/10.1109/22.641800.
Simons, R. N., and R. Q. Lee. "On-wafer characterization of millimeter-wave antennas for wireless applications." IEEE Transactions on Microwave Theory and Techniques 47, no. 1 (1999): 92–96. http://dx.doi.org/10.1109/22.740086.
Russell, Damon, Kieran Cleary, and Rodrigo Reeves. "Cryogenic probe station for on-wafer characterization of electrical devices." Review of Scientific Instruments 83, no. 4 (April 2012): 044703. http://dx.doi.org/10.1063/1.3700213.
Descamps, Philippe, Dolphin Abessolo-Bidzo, and Patrick Poirier. "Improved test structure for on-wafer microwave characterization of components." Microwave and Optical Technology Letters 53, no. 2 (December 15, 2010): 249–54. http://dx.doi.org/10.1002/mop.25738.
Fresquet, Gilles, and Jean-Philippe Piel. "Optical Characterization and Defect inspection for 3D stacked IC technology." International Symposium on Microelectronics 2014, no. 1 (October 1, 2014): 000630–34. http://dx.doi.org/10.4071/isom-wp17.
Kim, Taehyun, Sangwug Han, Jubum Lee, Yeeun Na, Joontaek Jung, Yun Chang Park, Jaesub Oh, Chungmo Yang, and Hee Yeoun Kim. "Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter." Micromachines 14, no. 2 (February 14, 2023): 448. http://dx.doi.org/10.3390/mi14020448.
Majeed, Bivragh, Chengxun Liu, Erik Sohn, Lut Van Acker, Koen De Wijs, Deniz Sabuncuoglu, and Liesbet Lagae. "Silicon based cell sorting device: Fabrication, characterization and applications." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000019–24. http://dx.doi.org/10.4071/isom-2016-tp15.
Haisu, M., Uda Hashim, and Q. Humayun. "Micro-Gap Electrodes Fabrication by Low Cost Conventional Photo Lithography Technique and Surface Characterization by Nanoprofiler." Advanced Materials Research 925 (April 2014): 635–40. http://dx.doi.org/10.4028/www.scientific.net/amr.925.635.
Cakmak, Erkan, Bioh Kim, and Viorel Dragoi. "Characterization of Wafer Level Metal Thermo-Compression Bonding." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, DPC (January 1, 2010): 002326–60. http://dx.doi.org/10.4071/2010dpc-tha34.
INABA, Michihiko. "Present and Future of Surface Characterization. Surface Characterization on Si Wafer for Semiconductor Devices." Journal of the Japan Society for Precision Engineering 61, no. 11 (1995): 1511–15. http://dx.doi.org/10.2493/jjspe.61.1511.
Tajima, Michio, E. Higashi, Toshihiko Hayashi, Hiroyuki Kinoshita, and Hiromu Shiomi. "Characterization of SiC Wafers by Photoluminescence Mapping." Materials Science Forum 527-529 (October 2006): 711–16. http://dx.doi.org/10.4028/www.scientific.net/msf.527-529.711.
Yu, Hengshu, Junbo Wang, Yulan Lu, Bo Xie, Yanlong Shang, and Zhao Liu. "A silicon resonant pressure sensor based on thermal stresses matched structures." Journal of Physics: Conference Series 2740, no. 1 (April 1, 2024): 012041. http://dx.doi.org/10.1088/1742-6596/2740/1/012041.
Ferrero, A., and U. Pisani. "An improved calibration technique for on-wafer large-signal transistor characterization." IEEE Transactions on Instrumentation and Measurement 42, no. 2 (April 1993): 360–64. http://dx.doi.org/10.1109/19.278582.
Archer, J. W., and R. A. Batchelor. "Fully automated on-wafer noise characterization of GaAs MESFETs and HEMTs." IEEE Transactions on Microwave Theory and Techniques 40, no. 2 (1992): 209–16. http://dx.doi.org/10.1109/22.120092.
Scholz, M., D. Linten, S. Thijs, S. Sangameswaran, M. Sawada, T. Nakaei, T. Hasebe, and G. Groeseneken. "ESD On-Wafer Characterization: Is TLP Still the Right Measurement Tool?" IEEE Transactions on Instrumentation and Measurement 58, no. 10 (October 2009): 3418–26. http://dx.doi.org/10.1109/tim.2009.2017657.
Tiemeijer, Luuk F., Ralf M. T. Pijper, and Edwin van der Heijden. "Complete On-Wafer Noise-Figure Characterization of 60-GHz Differential Amplifiers." IEEE Transactions on Microwave Theory and Techniques 58, no. 6 (June 2010): 1599–608. http://dx.doi.org/10.1109/tmtt.2010.2049167.
Caddemi, A., and N. Donato. "Temperature-dependent noise characterization and modeling of on-wafer microwave transistors." Microelectronics Reliability 42, no. 3 (March 2002): 361–66. http://dx.doi.org/10.1016/s0026-2714(02)00004-5.
Linz, Sarah, Florian Oesterle, Stefan Lindner, Sebastian Mann, Robert Weigel, and Alexander Koelpin. "Test Method for Contactless On-Wafer MEMS Characterization and Production Monitoring." IEEE Transactions on Microwave Theory and Techniques 64, no. 11 (November 2016): 3918–26. http://dx.doi.org/10.1109/tmtt.2016.2612664.
Terayama, Yuki, Motoyasu Kobayashi, Sono Sasaki, Osami Sakata, and Atsushi Takahara. "Structural Characterization of Surface-grafted Poly (Vinyl Alcohol) on Silicon Wafer." Transactions of the Materials Research Society of Japan 32, no. 1 (2007): 259–62. http://dx.doi.org/10.14723/tmrsj.32.259.
Stake, Jan, and Hans Grönqvist. "An on-wafer method for C-V characterization of heterostructure diodes." Microwave and Optical Technology Letters 9, no. 2 (June 5, 1995): 63–66. http://dx.doi.org/10.1002/mop.4650090202.
Lederer, Dimitri, and Jean-Pierre Raskin. "On-wafer wideband characterization: a powerful tool for improving the IC technologies." Journal of Telecommunications and Information Technology, no. 2 (June 25, 2023): 69–77. http://dx.doi.org/10.26636/jtit.2007.2.811.
Torimi, Satoshi, Norihito Yabuki, Takuya Sakaguchi, Masato Shinohara, Yoji Teramoto, Satoru Nogami, Makoto Kitabatake, and Junji Senzaki. "Characterization of pn-Diode Fabricated from Surface Damage-Free 4H-SiC Wafer Using Si-Vapor Etching Process." Materials Science Forum 924 (June 2018): 349–52. http://dx.doi.org/10.4028/www.scientific.net/msf.924.349.
Wang, Yibang, Xingchang Fu, Aihua Wu, Chen Liu, Peng Luan, Faguo Liang, Wei Zhao, and Xiaobang Shang. "Development of gallium-arsenide-based GCPW calibration kits for on-wafer measurements in the W-band." International Journal of Microwave and Wireless Technologies 12, no. 5 (December 12, 2019): 367–71. http://dx.doi.org/10.1017/s1759078719001521.
Zhu, Liang, Biao Mei, Weidong Zhu, and Wei Li. "Laser-based Thickness Control in a Double-Side Polishing System for Silicon Wafers." Sensors 20, no. 6 (March 13, 2020): 1603. http://dx.doi.org/10.3390/s20061603.
Chan, Mu-Hsuan, Yu-Po Wang, Ivan Chang, James Chiang, George Pan, Nicholas Kao, and David Wang. "Development and Challenges of Warpage for Fan-Out Wafer-Level Package Technology." International Symposium on Microelectronics 2016, no. 1 (October 1, 2016): 000524–28. http://dx.doi.org/10.4071/isom-2016-poster4.
Han, Chansu, Yoonsung Koo, Jaehwan Kim, Kwangwook Choi, and Sangjeen Hong. "Wafer Type Ion Energy Monitoring Sensor for Plasma Diagnosis." Sensors 23, no. 5 (February 22, 2023): 2410. http://dx.doi.org/10.3390/s23052410.
Marzouk, Jaouad, Steve Arscott, Abdelhatif El Fellahi, Kamel Haddadi, Tuami Lasri, Christophe Boyaval, and Gilles Dambrine. "MEMS probes for on-wafer RF microwave characterization of future microelectronics: design, fabrication and characterization." Journal of Micromechanics and Microengineering 25, no. 7 (June 24, 2015): 075024. http://dx.doi.org/10.1088/0960-1317/25/7/075024.
Arias, Abraham, Nicola Nedev, Mario Curiel, Diana Nesheva, Emil Manolov, Benjamin Valdez, David Mateos, Oscar Contreras, Oscar Raymond, and Jesus M. Siqueiros. "Electrical Characterization of Interface Defects in MOS Structures Containing Silicon Nanoclusters." Advanced Materials Research 976 (June 2014): 129–32. http://dx.doi.org/10.4028/www.scientific.net/amr.976.129.
Neudeck, Philip G., Liang Yu Chen, David J. Spry, Glenn M. Beheim, and Carl W. Chang. "Electrical Characterization of a 4H-SiC JFET Wafer: DC Parameter Variations for Extreme Temperature IC Design." Materials Science Forum 821-823 (June 2015): 781–84. http://dx.doi.org/10.4028/www.scientific.net/msf.821-823.781.