Relevant bibliographies by topics / O2 plasma treated polyimide

Academic literature on the topic 'O2 plasma treated polyimide'

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Published: 4 June 2021
Last updated: 20 February 2023

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Journal articles on the topic "O2 plasma treated polyimide"

1

Suzuki, Takeharu, Philip Tanner, and David V. Thiel. "O2 plasma treated polyimide-based humidity sensors." Analyst 127, no. 10 (August 27, 2002): 1342–46. http://dx.doi.org/10.1039/b205085d.

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IWAMORI, Satoru, Shigeki NAKAHARA, Noriyuki YANAGAWA, and Mitsuru SADAMOTO. "Dry Etching of Polyimide Film with NF3-O2 Plasma." SHINKU 43, no. 1 (2000): 48–53. http://dx.doi.org/10.3131/jvsj.43.48.

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Lamontagne, B., O. M. Küttel, and M. R. Wertheimer. "Etching of polymers in microwave/radio-frequency O2–CF4 plasma." Canadian Journal of Physics 69, no. 3-4 (March 1, 1991): 202–6. http://dx.doi.org/10.1139/p91-033.

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We have studied O2–CF4 plasma etching of commercial polymers, particularly KaptonR polyimide, using a reactor in which the plasma can be excited by radio-frequency (rf, 13.56 MHz), microwave power (MW, 2.45 GHz), or mixed frequency (MW/rf) excitation. For the case of rf plasma etching of polyimide, a marked effect of dc self-bias voltage Vb on the etch rate R has been observed; Vb is found to vary systematically with pressure and with CF4 concentration in the etch gas, [CF4]. Beside the well-documented maximum in R at low-[CF4] values, the measurement of ion flux allows us to attribute a second peak in R (near [CF4] = 65%) to ion bombardment. We also report observations regarding the dependence of R on polymer structure.
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Egitto, F. D. "Plasma etching of organic materials. I. Polyimide in O2–CF4." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 3, no. 3 (May 1985): 893. http://dx.doi.org/10.1116/1.583078.

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Gawdzik, Barbara, and Magdalena Sobiesiak. "Chemical composition of plasma treated polyimide microspheres." Applied Surface Science 214, no. 1-4 (May 2003): 52–57. http://dx.doi.org/10.1016/s0169-4332(03)00353-2.

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Lin, Fangbing, Wei Li, Yusi Tang, Huiqi Shao, Chuanli Su, Jinhua Jiang, and Nanliang Chen. "High-Performance Polyimide Filaments and Composites Improved by O2 Plasma Treatment." Polymers 10, no. 7 (June 22, 2018): 695. http://dx.doi.org/10.3390/polym10070695.

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Wu, Shien‐Yang, Denice D. Denton, and Ressano De Souza‐Machado. "Dielectric behavior of O2/CF4 plasma etched polyimide exposed to humid environments." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11, no. 2 (March 1993): 291–300. http://dx.doi.org/10.1116/1.578728.

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8

Chen, Chih-Cheng, Fang-Hsing Wang, Sheng-Cheng Chang, and Cheng-Fu Yang. "Using Oxygen Plasma Pretreatment to Enhance the Properties of F-Doped ZnO Films Prepared on Polyimide Substrates." Materials 11, no. 9 (August 22, 2018): 1501. http://dx.doi.org/10.3390/ma11091501.

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In this study, a radio frequency magnetron sputtering process was used to deposit F-doped ZnO (FZO) films on polyimide (PI) substrates. The thermal expansion effect of PI substrates induces distortion and bending, causing FZO films to peel and their electrical properties and crystallinity to deteriorate. To address these shortcomings, oxygen (O2) plasma was used to pretreat the surface of PI substrates using a plasma-enhanced chemical vapor deposition system before the FZO films were deposited. The effects of O2 plasma pretreatment time on the surface water contact angle, surface morphologies, and optical properties of the PI substrates were investigated. As the pretreatment time increased, so did the roughness of the PI substrates. After the FZO films had been deposited on the PI substrates, variations in the surface morphologies, crystalline structure, composition, electrical properties, and optical properties were investigated as a function of the O2 plasma pretreatment time. When this was 30 s, the FZO films had optimal optical and electrical properties. The resistivity was 3.153 × 10−3 Ω-cm, and the transmittance ratios of all films were greater than 90%. The X-ray photoelectron spectroscopy spectra of the FZO films, particularly the peaks for O1s, Zn 2p1/2, and Zn 2p3/2, were determined for films with O2 plasma pretreatment times of 0 and 30 s. Finally, a HCl solution was used to etch the surfaces of the deposited FZO films, and silicon-based thin-film solar cells were fabricated on the FZO/PI substrates. The effect of O2-plasma pretreatment time on the properties of the fabricated solar cells is thoroughly discussed.
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Momose, Y., T. Ohaku, H. Chuma, S. Okazaki, T. Saruta, M. Masui, and M. Takeuchi. "Electrical properties of O2 plasma treated solid surfaces." Journal of Applied Polymer Science 46 (1990): 153–72. http://dx.doi.org/10.1002/app.1990.070460009.

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Lee, Su Bin, and Yoon-Kee Kim. "Adhesion Improvement of Polyimide/Metal Interface by He/O2 /NF3 Atmospheric Pressure Plasma." Plasma Processes and Polymers 6, S1 (June 2009): S525—S529. http://dx.doi.org/10.1002/ppap.200931111.

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Dissertations / Theses on the topic "O2 plasma treated polyimide"

1

Suzuki, Takeharu, and n/a. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring." Griffith University. School of Microelectronic Engineering, 2004. http://www4.gu.edu.au:8080/adt-root/public/adt-QGU20040813.131206.

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The humidity, temperature, wind speed/direction micro sensors can be manufactured individually, resulting in three individual substrates. The integration of the three sensors into a single substrate is a vital challenge to achieve an integrated intelligent sensor so called a multiple sensor. This requires the integration of process flows and is a major challenge because adequate sensor performance must be maintained. Polyimide was selected as a humidity sensing material for its compatibility with conventional integrated circuit fabrication technology, negligible temperature dependence and good resistance against contamination. Nickel was selected for the temperature and wind speed/direction sensor because of its useful temperature coefficient and the advantage of its cost. Since the known wet etchant for nickel requires hard-baked photoresist, a method which does not attack the polyimide while removing the photoresist must be developed. The method developed for etching nickel employs hard-bake-free photoresist. Other challenge was ensuring good thermal isolation for the wind speed/direction sensor fabricated on a silicon nitride layer preformed on top of a silicon wafer. Since silicon acts as a good heat sink, the silicon under the sensor was etched entirely away until the silicon nitride layer was reached. This structure achieved good thermal isolation resulting in small power consumption. This low power feature is essential for sensors deployed in fields where power access or replacement of power sources is restricted. This structure was compared with the structure created by polyimide plateau on a silicon nitride layer coated on a silicon substrate as a function of power consumption. Based on the examination of thermal isolation, the multiple sensor utilizing a MEMS technique was fabricated with a single-sided mask aligner. The characteristics of humidity sensors fabricated with polyimide were examined in detail with respect to variations of electrode structures, improvement of sensitivity, effect of process temperature, temperature and frequency dependence, and stability. The humidity sensor constructed with O2 plasma treated polyimide resulted an improvement in sensitivity and hysteresis. The investigation using XPS, FTIR and AFM concluded the chemical modification of polyimide played an important role in this improvement. The design, fabrication and results of a series of humidity sensors are quantified. There is always no unique packaging solution for sensors because of the application-specific nature of the sensors. This intelligent environmental monitoring system was designed to accommodate both an environmental sensor and its signal conditioning electronics circuitry (SICONEC) into a single package. The environmental sensors need direct exposure to the environment while SICONEC needs a sealed encapsulation to avoid environmental damage. A new style of packaging addressing these requirements was demonstrated using a hot embossing machine. The hot embossing machine was used to embed an integrated circuit (IC) in a bare die condition into a polycarbonate (PC) sheet. In this case, the IC was flipped down against the PC, which protects the front side of the IC from the environmental damages. In a test phase, a die containing operational amplifiers was embossed into the PC. A humidity sensor and surface mount resisters were placed on the same surface of the PC to test the validity of this new technique. Interconnection between the embossed die and the humidity sensor was established using bonding wires. Copper tracks were also used to ensure all electrical connections for the die, the humidity sensor and the resistors. The results clarified the method developed. Details of process methods, issues and further potential improvement are reported.
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2

Suzuki, Takeharu. "Integrated, Intelligent Sensor Fabrication Strategies for Environmental Monitoring." Thesis, Griffith University, 2004. http://hdl.handle.net/10072/367295.

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The humidity, temperature, wind speed/direction micro sensors can be manufactured individually, resulting in three individual substrates. The integration of the three sensors into a single substrate is a vital challenge to achieve an integrated intelligent sensor so called a multiple sensor. This requires the integration of process flows and is a major challenge because adequate sensor performance must be maintained. Polyimide was selected as a humidity sensing material for its compatibility with conventional integrated circuit fabrication technology, negligible temperature dependence and good resistance against contamination. Nickel was selected for the temperature and wind speed/direction sensor because of its useful temperature coefficient and the advantage of its cost. Since the known wet etchant for nickel requires hard-baked photoresist, a method which does not attack the polyimide while removing the photoresist must be developed. The method developed for etching nickel employs hard-bake-free photoresist. Other challenge was ensuring good thermal isolation for the wind speed/direction sensor fabricated on a silicon nitride layer preformed on top of a silicon wafer. Since silicon acts as a good heat sink, the silicon under the sensor was etched entirely away until the silicon nitride layer was reached. This structure achieved good thermal isolation resulting in small power consumption. This low power feature is essential for sensors deployed in fields where power access or replacement of power sources is restricted. This structure was compared with the structure created by polyimide plateau on a silicon nitride layer coated on a silicon substrate as a function of power consumption. Based on the examination of thermal isolation, the multiple sensor utilizing a MEMS technique was fabricated with a single-sided mask aligner. The characteristics of humidity sensors fabricated with polyimide were examined in detail with respect to variations of electrode structures, improvement of sensitivity, effect of process temperature, temperature and frequency dependence, and stability. The humidity sensor constructed with O2 plasma treated polyimide resulted an improvement in sensitivity and hysteresis. The investigation using XPS, FTIR and AFMconcluded the chemical modification of polyimide played an important role in this improvement. The design, fabrication and results of a series of humidity sensors are quantified. There is always no unique packaging solution for sensors because of the application-specific nature of the sensors. This intelligent environmental monitoring system was designed to accommodate both an environmental sensor and its signal conditioning electronics circuitry (SICONEC) into a single package. The environmental sensors need direct exposure to the environment while SICONEC needs a sealed encapsulation to avoid environmental damage. A new style of packaging addressing these requirements was demonstrated using a hot embossing machine. The hot embossing machine was used to embed an integrated circuit (IC) in a bare die condition into a polycarbonate (PC) sheet. In this case, the IC was flipped down against the PC, which protects the front side of the IC from the environmental damages. In a test phase, a die containing operational amplifiers was embossed into the PC. A humidity sensor and surface mount resisters were placed on the same surface of the PC to test the validity of this new technique. Interconnection between the embossed die and the humidity sensor was established using bonding wires. Copper tracks were also used to ensure all electrical connections for the die, the humidity sensor and the resistors. The results clarified the method developed. Details of process methods, issues and further potential improvement are reported.
Thesis (PhD Doctorate)
Doctor of Philosophy (PhD)
School of Microelectronic Engineering
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3

Ma, Jong-Bong. "Adhesion of sputtered copper to plasma-treated polyimide substances /." Online version of thesis, 1991. http://hdl.handle.net/1850/11023.

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4

Liu, Chia-Chun, and 劉佳浚. "Atmospheric-pressure plasma treated polyimide films for liquid crystal devices." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/qbav26.

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碩士
國立交通大學
照明與能源光電研究所
107
In this study, we investigate the characteristics of polyimide (PI) films treated by atmospheric-pressure (AP) plasma for liquid crystal devices (LCDs). By changing the irradiation time of AP plasma, the LCs can be effectively oriented on the PI films and the pretilt angle can be controlled. In order to find out how the AP plasma cause the orientation of the liquid crystal, we use atomic force microscope (AFM) and X-ray photoelectron spectroscopy (XPS) to analyze the morphology and chemical features of AP plasma treated PI films, respectively. From AFM results, we do not observe anisotropic topography changes of PI films after AP plasma treatment. The XPS results show that the change of C 1s components before and after plasma irradiation are possibly the main reason of liquid crystal orientation in azimuthal plane.
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Tsai, Han-Chang, and 蔡瀚章. "Study on shear strength of the PC injection molding adhesion on the O2 plasma treated surface PPS." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/hvab9d.

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碩士
國立高雄應用科技大學
化學工程與材料工程系碩士在職專班
103
The experiment illustrates the melted PC(Polycarbonate) through injection machine is successfully jointed with PPS(Polyphenylene sulfide). The PPS needs to be sandblasted and treated with O2 Plasma, and preheated to the constant temperature. The joint strength of PC and PPS could achieve above 500kg which is the best strength of joint, measured by homemade shear strength tester. The experiment also proves advantage of PPS surface treatment: 1. sandblasting can remove impurities on surface. 2. O2 plasma treating on surface can increase surface roughness, cleaning and modification of functional group on polymeric substrates. The experiment improves traditional epoxy bonding of Retaining Ring that usually takes longer time. It can save time and cost of processing without considering the quality of epoxy glue. The joint strength 500kg of this experiment is greater than that of traditional epoxy bonding 350~400kg.
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Huang, Meng Chiou, and 黃孟秋. "Study on the mechanism of controlling the pretilt angle of liquid crystals on the plasma-treated polyimide film surface and the magnetic nanoparticles." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/4b6zk9.

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碩士
國立交通大學
電子物理系所
96
The widely-used mechanical rubbing method in the liquid crystal display industries has some drawbacks such as leaving the dust, static charges, and scratches on the treated surfaces. Besides, it is also difficult to satisfy the demands for multi-domain pattern and high pretilt angle. To overcome these limitations, a non-contact surface treatment on the polyimide film by using a diode type plasma system has been studied. A capability of inducing high pretilt angle is found in this work. The influences of treating time and plasma energy on the alignment effect are discussed. A significant amount of maghemite nanoparticles are deposited on the polyimide surfaces treated by the plasma beam at the same time. To find out the mechanism of surface alignment with high pretilt angle, the relation between the surface roughness and the size of coated nanoparticles has been characterized by using scanning electron microscope (SEM) and atomic force microscope (AFM). Further investigations on the change of chemical bonds on the treated surfaces have also been carried out by using x-ray photoelectron spectroscopy (XPS).
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Conference papers on the topic "O2 plasma treated polyimide"

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Xiaoliang, Tang, Qiu Gao, Chen Xiaoli, and Ren Zhongfu. "Dyeing Behavior of Atmospheric Dielectric Barrier Discharge Ar-O2 Plasma Treated Poly(ethylene terephthalate) Fabric." In 2007 IEEE Pulsed Power Plasma Science Conference. IEEE, 2007. http://dx.doi.org/10.1109/ppps.2007.4346135.

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Zhang, Letao, Xiaoliang Zhou, Hongyang Zuo, Hongyu He, Mengda Xu, and Kunpeng He. "Post-Oven Induced Surface Hydrophobicity Degradation of CF4 Plasma Treated Polyimide Photo Resistance." In 2021 IEEE 4th International Conference on Electronics Technology (ICET). IEEE, 2021. http://dx.doi.org/10.1109/icet51757.2021.9450974.

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Chou, Shang-Chih, Yao-Yi Cheng, Pi-Sheng Ku, and Hung-Han Ko. "Study on NH3 plasma-treated polyimide/MWNT composites on electrical and surface properties." In 2011 IEEE 4th International Nanoelectronics Conference (INEC). IEEE, 2011. http://dx.doi.org/10.1109/inec.2011.5991705.

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Lu, Q., Y. Liu, G. Han, C. Fang, Y. Shao, J. Zhang, and Y. Hao. "Experimental Investigation of the Contact Resistance of Graphene/MoS2 Interface Treated with O2 Plasma." In 2017 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2017. http://dx.doi.org/10.7567/ssdm.2017.ps-13-20.

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Kim, Donginn, Hyeong-Sang Lee, Kwang Min Chun, Jung-Ho Hwang, Kyo Seung Lee, and Bae-Hyeock Chun. "Comparison of Soot Oxidation by NO2 Only and Plasma-Treated Gas Containing NO2, O2, and Hydrocarbons." In SAE Powertrain & Fluid Systems Conference & Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2002. http://dx.doi.org/10.4271/2002-01-2704.

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Ma, Shenglin, Ying Li, Xin Sun, Xiaomei Yu, and Yufeng Jin. "Study of polyimide as sacrificial layer with O2 plasma releasing for its application in MEMS capacitive FPA fabrication." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270696.

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Yoo, Ha Jin, Chang Gil Son, Eun Ha Choi, Guangsup Cho, Gi Chung Kwon, Won Tea Cho, and Sang Gi Park. "Influence of O2 plasma treatment on H2 post-treated BZO thin films for TCO of a-Si solar cell." In 2010 IEEE 37th International Conference on Plasma Sciences (ICOPS). IEEE, 2010. http://dx.doi.org/10.1109/plasma.2010.5534131.

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KADOCHNIKOV, I. N., and I. V. ARSENTIEV. "STATE-TO-STATE MODEL FOR HYDROGEN€AIR COMBUSTION." In 9th International Symposium on Nonequilibrium Processes, Plasma, Combustion, and Atmospheric Phenomena. TORUS PRESS, 2020. http://dx.doi.org/10.30826/nepcap9b-04.

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Novel kinetic models considering ignition and combustion of the H2—air mixture with the account of vibrational nonequilibrium of N2, O2, H2, and OH molecules was developed. The vibrational excitation of the molecules was treated using either state-to-state or mode approximation approaches. The numerical study of the physicochemical processes in H2—air mixture behind shock wave front with Mach numbers up to M=6 were conducted and the results from state-to-state and mode approximation approaches were compared according to the predicted impacts of thermal nonequilibrium on the ignition delay time.
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Lu, Dong, Vanissa Lim, B. Ramana Murthy, Rakesh Kumar, Du An Yan, Alastair D. Trigg, and Ping Yang. "Study of Porous Organic Ultra Low K Materials After Treatment With Various Etching and Cleaning Plasma." In ISTFA 2004. ASM International, 2004. http://dx.doi.org/10.31399/asm.cp.istfa2004p0423.

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Abstract In the selection of ultra low k materials, process compatibility is a very important factor. Plasma processing plays a critical role in enhanced interconnect integration. It is therefore important to study plasma interaction with the ultra low k materials and its effects on the structure and property of these materials. X-ray reflectivity (XRR) measurement can be used to measure film thickness, density and interface roughness, which are important parameters to check for after plasma treatments. In the current study, porous SiLK (p-SiLK) was treated with various plasmas, such as O2, O2/N2, H2/N2, CH2F2/Ar and CF4/O2. XRR results indicate that the density of the p-SiLK films remains unchanged after various plasma treatments. Surface roughening occurs during the plasma treatments, accompanied by the decrease in film thickness. Plasma-induced surface roughening was also observed using atomic force microscope (AFM). Such roughening is more severe for plasma treatments using oxygen-containing plasmas. FTIR analysis indicates that the chemical structure of the p-SiLK films is not significantly affected by plasma treatment. It is reasonable to conclude that oxidation of the surface plays a major role in the plasma-induced change in surface roughness and film thickness.
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Han, Jeahyeong, Daniel Joe, Rich I. Masel, and Mark A. Shannon. "AFM Verification of CFn Surface Treatment Effect and Its Correlation to Stiction Reduction in Microvalves." In ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. ASMEDC, 2008. http://dx.doi.org/10.1115/detc2008-49842.

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The purpose of this paper is to show AFM verification of adhesion reduction between valve seat/membrane interfaces by surface coatings from a C4F8/Ar plasma in an ICP DRIE. Our check valves utilize a polyimide (PI, Polyimide 5878G, HD Microsystem) membrane on a Si/SiO2 valve seat. These valves form a seal between a polished Si/SiO2 substrate and a smooth polymer membrane. PI absorbs moisture up to 3.4% wt per volume, and the SiO2 surface also has an affinity to water. The smooth PI membrane touches the SiO2 surface, giving rise to relatively strong van der Waals adhesion. Under humid conditions, hydrogen-bonded stiction can occur at the interface between the PI and SiO2 during the drying step. The C4F8/Ar plasma coating is utilized for the actual device in order to lower the interface adhesion between Si/SiO2 and PI film. The opening pressures of devices with/without CFn film are measured. The valves without non-stiction coating did not open with inlet pressures up to 210 KPa. With a non-stiction coating, the valves showed an initial opening pressure of 32.5±11 KPa. AFM pull-off measurements using nano-sized tips and micro sized tips are performed to quantify the effect of the CFn film-treated surface between solid-solid surface pairs. The original surface pair for the microvalve membrane and seat surface is Si/SiO2 and PI film. The CFn film treatment is possible on one or both sides of the surfaces. AFM pull-off testing has been performed to measure the work of adhesion between four possible surface combinations, including SiO2/PI, CFn/PI, CFn/SiO2, and CFn/CFn. The work of adhesion of the surface pairs is obtained using the Johnson-Kendall-Roberts (JKR) theory. Two types of AFM probes were used, a regular nano-sized AFM probe and a one micron particle AFM probe. The work of adhesions obtained for the pairs above are 257.6±37.1, 59.4±29.2, 89.6±18.2, and 41.0±8.2 [mJ/m2] from regular tips, and 159.48±4.0, 41.9±2.0, 65.7±12.2, and 37.4±3.7 [mJ/m2] from the particle tips. The CFn film treatment reduced the adhesion energy up to 84% for the regular AFM tip results, and up to 76.7% from the particle AFM tip results. The static contact angle of CFn film with respect to de-ionized water is 116.4 ± 0.9°. The surface coatings from a C4F8/Ar plasma in an ICP DRIE can reduce the contact adhesion forces and capillary forces during the fabrication process preventing stiction.
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