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1

Sethuraman, A. R., R. J. De Angelis, and P. J. Reucroft. "Diffraction studies on Ni–Co and Ni–Cr alloy thin films." Journal of Materials Research 6, no. 4 (April 1991): 749–54. http://dx.doi.org/10.1557/jmr.1991.0749.

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Alloy films of Ni–Co and Ni–Cr of compositional ratios 1:1, 1:3, and 3:1 deposited by vapor deposition were studied by Transmission Electron Microscopy (TEM) and X-Ray Diffraction (XRD). Results of TEM analysis on the Ni–Co alloy films indicated that the films were face-centered cubic (fcc) in structure. XRD results confirmed the TEM observations. TEM analysis of Ni–Cr alloy films showed that the films were body-centered cubic (bcc) in structure. With increase in the Cr content more than 25%, the material contained a higher fraction of an amorphous phase. XRD studies provide limited information owing to the quasi-amorphous structure of the films of high Cr content.
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2

YAN, JIANWU, and JICHENG ZHOU. "THE OXIDATION AND THE ELECTRICAL PROPERTIES OF Ni–Cr THIN FILM AFTER RAPID THERMAL ANNEALING." International Journal of Modern Physics B 21, no. 26 (October 20, 2007): 4561–74. http://dx.doi.org/10.1142/s0217979207037934.

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By controlling the sputtering power, rotational speed of the substrate and sputtering time, Ni – Cr thin films with appropriate composition were fabricated by double-target magnetron co-sputtering techniques. The homogeneity and oxidation of Ni – Cr thin film has been studied by Auger electron spectroscopy (AES). The structures of Ni – Cr thin films were determined by an X-ray diffractometer (XRD). The oxidation and the resistance stability of the Ni – Cr thin film after rapid thermal process (RTP) have been studied. The relations between TCR and RTP techniques of Ni – Cr thin films were discussed.
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3

Lin, Ruei-Cheng, Tai-Kuang Lee, Der-Ho Wu, and Ying-Chieh Lee. "A Study of Thin Film Resistors Prepared Using Ni-Cr-Si-Al-Ta High Entropy Alloy." Advances in Materials Science and Engineering 2015 (2015): 1–7. http://dx.doi.org/10.1155/2015/847191.

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Ni-Cr-Si-Al-Ta resistive thin films were prepared on glass and Al2O3substrates by DC magnetron cosputtering from targets of Ni0.35-Cr0.25-Si0.2-Al0.2casting alloy and Ta metal. Electrical properties and microstructures of Ni-Cr-Si-Al-Ta films under different sputtering powers and annealing temperatures were investigated. The phase evolution, microstructure, and composition of Ni-Cr-Si-Al-Ta films were characterized by X-ray diffraction (XRD), transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). When the annealing temperature was set to 300°C, the Ni-Cr-Si-Al-Ta films with an amorphous structure were observed. When the annealing temperature was at 500°C, the Ni-Cr-Si-Al-Ta films crystallized into Al0.9Ni4.22, Cr2Ta, and Ta5Si3phases. The Ni-Cr-Si-Al-Ta films deposited at 100 W and annealed at 300°C which exhibited the higher resistivity 2215 μΩ-cm with −10 ppm/°C of temperature coefficient of resistance (TCR).
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4

Stearns, M. B., and C. H. Lee. "Dimensional effects in Ni‐Cr multilayered thin films." Journal of Applied Physics 61, no. 8 (April 15, 1987): 4064–66. http://dx.doi.org/10.1063/1.338528.

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5

Vollaro, M. B., and D. I. Potter. "Phase formation in coevaporated NiCr thin films." Thin Solid Films 239, no. 1 (February 1994): 37–46. http://dx.doi.org/10.1016/0040-6090(94)90105-8.

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6

Cho, Ki-Hyun, and Youngman Kim. "Elastic modulus measurement of multilayer metallic thin films." Journal of Materials Research 14, no. 5 (May 1999): 1996–2001. http://dx.doi.org/10.1557/jmr.1999.0269.

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Two- and three-layer composite models were developed using a beam vibration theory, and the models were applied for measuring Young's moduli of thin metallic films. The Cr, Ni, and Co-coated Si wafer composites (two-layer composite) and (Cr/Ti/Si) composites (three-layer composite) were produced by radio-frequency (rf) magnetron sputtering and used to test the developed models. Young's moduli of (Cr) films obtained by the three-layer composite model agree well with those of (Cr) films obtained by the two-layer composite model, considering (Ti/Si) as the one layer and (Cr) as the other layer. This suggests that moduli of multilayer films may be obtained by using a two-layer composite model repeatedly.
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7

Zhou, Ji Cheng, and Jian Wu Yan. "Microstructure and Electrical Properties of Nano Ni-Cr Thin-Films Fabricated by Magnetron Co-Sputtering Techniques." Materials Science Forum 561-565 (October 2007): 1201–4. http://dx.doi.org/10.4028/www.scientific.net/msf.561-565.1201.

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The nano Ni-Cr thin-film samples with different composition have been fabricated by a double-target magnetron co-sputtering equipment, through controlling the sputtering power, the substrate rotate speed, and the substrate temperature, The results showed that the grains sizes with polycrystalline microstructure were not greater than 10 nm. The crystal microstructure of Ni-Cr thin-films is Face Centered Cubic (FCC). The dominant texture in the Ni-Cr film was Ni (111) under this sputtering condition. The lattice parameters of Ni crystal and the inter-planar distances of Ni (111) increased by Cr solid-soluble in Ni crystal. The surface morphology of the thin-film samples is smooth and compact. The TCR (temperature coefficient of resistance) value of specimen 3 was 84~130 ppm/k, which show the specimen 3 was the most stable.
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8

Cho, Nam Ihn, Se Jong Lee, Yo Seung Song, and Deuk Yong Lee. "Thermal Properties of Cr- and Ni- Silicide Thin Films." Solid State Phenomena 124-126 (June 2007): 189–94. http://dx.doi.org/10.4028/www.scientific.net/ssp.124-126.189.

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9

Petley, Vijay, S. Sathishkumar, K. H. Thulasi Raman, G. Mohan Rao, and U. Chandrasekhar. "Microstructural and mechanical characteristics of Ni–Cr thin films." Materials Research Bulletin 66 (June 2015): 59–64. http://dx.doi.org/10.1016/j.materresbull.2015.02.002.

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10

Vinayak, Seema, H. P. Vyas, and V. D. Vankar. "Microstructure and electrical characteristics of Ni–Cr thin films." Thin Solid Films 515, no. 18 (June 2007): 7109–16. http://dx.doi.org/10.1016/j.tsf.2007.03.011.

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11

Abdul-Razzaq, W., and M. Amoruso. "Electron transport properties of Ni and Cr thin films." Physica B: Condensed Matter 253, no. 1-2 (October 1998): 47–51. http://dx.doi.org/10.1016/s0921-4526(98)00382-2.

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12

Klein, I. E., M. Hershkovich, and I. A. Goldberg. "The mechanism of oxidation of thin Ni−Cr films." Microelectronics Journal 19, no. 6 (November 1988): 17–23. http://dx.doi.org/10.1016/s0026-2692(88)80005-3.

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13

Petrovic, S., N. Bundaleski, M. Radovic, Z. Ristic, G. Gligoric, D. Perusko, and S. Zec. "Structure and surface composition of NiCr sputtered thin films." Science of Sintering 38, no. 2 (2006): 155–60. http://dx.doi.org/10.2298/sos0602155p.

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Thin films of nichrome were deposited by d.c. sputtering of a target (80%Ni 20%Cr w.t) by Ar+ions at a working pressure of 10-1 Pa and at room temperature. The phase composition and grain size were studied by X-ray Diffraction (XRD), while the surface chemical composition was determined by Low Energy Ion Scattering (LEIS). Analysis of phase composition showed that the NiCr thin films were a solid solution of chromium in a nickel matrix with increased nickel lattice parameters. LEIS analysis showed the presence of Ni Cr and O in the first atomic layer. There is a strong suspicion that surface passivation occurred by forming Cr2O3 oxide at the surface.
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14

Rai, A. K., and R. S. Bhattacharya. "Sputter-deposited and ion-mixed NiTi and NiCr thin films." Materials Science and Engineering 85 (January 1987): 139–45. http://dx.doi.org/10.1016/0025-5416(87)90475-7.

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15

Yu, Xin Gang, Hong Wen Ma, Fei Long, Hui Feng Zhao, Wenrue Bi, Wu Wen Luo, Li Wang, and Nanyun Liu. "XPS Studies on Composite TiO2-SiO2 Thin Films Deposited on Metal Substrate by Sol-Gel." Materials Science Forum 475-479 (January 2005): 1647–50. http://dx.doi.org/10.4028/www.scientific.net/msf.475-479.1647.

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Through X-ray photoelectron spectroscopy, by the aid of Ar+ sputtering, chemical composition and the valence state of elements on surface and at depth of TiO2-SiO2 thin films and metal substrates have been studied. Results show that: on surface, elements of Cr, Mn, Ti, Fe exist in the form of their respective stable state, but Si is unstable and exhibits stoichiometrical disturbance when heat treated at 800°C; at depth, after sputtering for 5 minutes and 17 minutes, elements of Cr, Mn, Ti and Ni exist in the form of their respective stable state, but Si and Fe are unstable and exhibit stoichiometrical disturbances; at depth, after sputtering for 57 minutes, all of the Cr, Mn, Ti, Si, Ni and Fe exist in the form of their respective stable state. Results of chemical composition and their content by weight percent of TiO2-SiO2 thin films and metal substrates reveal that: Fe, Cr, and Mn diffuse from metal substrates to the thin films in scale; Ni diffuses few and Si collects to the metal substrate surface
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16

Mengucci, P., M. Costato, and G. Majni. "Substrate effect on texturized microstructures in NiCr thin films." Thin Solid Films 209, no. 1 (March 1992): 67–72. http://dx.doi.org/10.1016/0040-6090(92)90011-y.

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17

Belu-Marian, A., R. Mǎnǎilǎ, G. Korony, C. Constantin, and A. Devenyi. "Electrical properties and structural defects of Ni-Cr thin films." Thin Solid Films 139, no. 1 (May 1986): 15–24. http://dx.doi.org/10.1016/0040-6090(86)90043-x.

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18

Huang, T. C., and J. K. Howard. "Characterization of Ni-Cr thin films by X-ray analysis." Thin Solid Films 148, no. 2 (April 1987): 209–18. http://dx.doi.org/10.1016/0040-6090(87)90159-3.

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19

Au, C. L., M. A. Jackson, and W. A. Anderson. "Structural and electrical properties of stable ni/cr thin films." Journal of Electronic Materials 16, no. 4 (July 1987): 301–6. http://dx.doi.org/10.1007/bf02653370.

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20

Goldsmith, C. C., and C. Van Buskirk. "Residual Stress Measurements on Cr/Ni Pads Evaporated on Polyimide Thin Films." Advances in X-ray Analysis 36 (1992): 203–12. http://dx.doi.org/10.1154/s0376030800018802.

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AbstractPolyimide films are becoming more important in multi-layer structures, acting as dielectric films to separate conductive layers. High thin film residual stresses can cause problems with the polyimide film, leading to loss of adhesion between the metal film and the polyimide or can cause cracking in the polyimide.In this paper, we examine the residual stresses in “as deposited” metal films evaporated onto BTDA-APB polyimide films and follow the change in residual stress of the nickel layer during subsequent thermal processing. We will show that the change in residual stresses can be correlated to the glass transition temperature of the polyimide film.
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21

Banovec, A., and A. Zalar. "Investigation of sliding contact resistance of Ni-Cr/Au and Ni-Cr/Au-SiO2 thin resistive films." Thin Solid Films 164 (October 1988): 129–33. http://dx.doi.org/10.1016/0040-6090(88)90122-8.

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22

Zhao, Di, Xuezheng An, Yaxian Sun, Guihua Li, Hongyan Liu, and Aichang Li. "Photocatalytic properties of p-n heterojunction Ag2CO3/Ag3PO4/Ni thin films under visible light." Functional Materials Letters 12, no. 06 (December 2019): 1950085. http://dx.doi.org/10.1142/s1793604719500851.

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p-n heterojunction Ag2CO3/Ag3PO4/Ni thin films were prepared by electrochemical co-deposition. The surface morphology and structural properties of the thin films were characterized using scanning electron microscopy (SEM), X-ray diffraction (XRD), and ultraviolet-visible diffuse reflectance spectroscopy (UV-Vis DRS). The photocatalytic (PC) properties of the Ag2CO3/Ag3PO4/Ni composite thin films were investigated by their ability to degrade rhodamine B (RhB) and Congo red (CR) under visible light irradiation. The results showed that the photodegradation efficiency of RhB by an Ag2CO3/Ag3PO4/Ni thin film under visible-light irradiation for 30[Formula: see text]min (98.84%) was 2.64 times higher than that of an Ag3PO4/Ni thin film and 3.44 times higher than of an Ag2CO3/Ni thin film. The presence of a [Formula: see text]-[Formula: see text] heterojunction greatly increased the charge conductivity of the film and its ability to photocatalytically reduce dissolved oxygen, which are the main reasons for the improved PC performance of the Ag2CO3/Ag3PO4/Ni films.
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23

Suzuki, Tsuneo, Jun Inoue, Hiroki Asami, Tomoya Ibi, Tadachika Nakayama, Hisayuki Suematsu, and Koichi Niihara. "Material Design of Transition Metal Nitrides for Hard Coatings by Metal and Nonmetal Atom Substitution." Key Engineering Materials 373-374 (March 2008): 122–25. http://dx.doi.org/10.4028/www.scientific.net/kem.373-374.122.

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Cr-Me-N-O (Me; Ni, Cu and Mg) thin films have been designed and successfully prepared by the pulsed laser deposition (PLD) method. It was found that Me, which form the monoxide MeO, are effective for hardening the Cr(N,O) thin films.
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24

Hono, K., B. G. Demczyk, and D. E. Laughlin. "Electron microdiffraction of faulted regions in Co‐Cr and Co‐Ni‐Cr thin films." Applied Physics Letters 55, no. 3 (July 17, 1989): 229–31. http://dx.doi.org/10.1063/1.101915.

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25

Danışman, M., and N. Cansever. "Effect of Cr content on mechanical and electrical properties of Ni–Cr thin films." Journal of Alloys and Compounds 493, no. 1-2 (March 2010): 649–53. http://dx.doi.org/10.1016/j.jallcom.2009.12.180.

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26

Kalnicky, Dennis J. "EDXRF Analysis of Thin Films and Coatings Using a Hybrid Alphas Approach." Advances in X-ray Analysis 29 (1985): 403–11. http://dx.doi.org/10.1154/s037603080001051x.

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In the semiconductor and electronics industries the processes Involved in producing integrated circuit soften require thin films such as P205/SiO2, Si/Al, Ni/Cr, Fe/Ni, or others to be deposited on a substrate wafer. It is critical to the performance and life time of the device that the composition and thickness of these films be precisely controlled. The ability to quickly analyze wafers provides data which can be used to adjust fabrication parameters before large quantities of devices are lost.
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27

Schippel, E. "Ternary alloy films of Ni-Cr-Al for thin film resistors." Thin Solid Films 146, no. 2 (January 1987): 133–38. http://dx.doi.org/10.1016/0040-6090(87)90214-8.

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28

Iida, Atsuko, and Shin-ichi Nakamura. "Orientation of Ni-Cr Thin Films with an Underlying Ti Layer." Japanese Journal of Applied Physics 35, Part 2, No. 3A (March 1, 1996): L335—L337. http://dx.doi.org/10.1143/jjap.35.l335.

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29

Yedong, He, and F. H. Stott. "The selective oxidation of Ni-15%Cr and Ni-10%Cr alloys promoted by surface-applied thin oxide films." Corrosion Science 36, no. 11 (November 1994): 1869–84. http://dx.doi.org/10.1016/0010-938x(94)90024-8.

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30

Dang, Nhat, Zhao-Ying Wang, Ti-Yuan Wu, Tra Nguyen, and Ming-Tzer Lin. "Measurement of Effects of Different Substrates on the Mechanical Properties of Submicron Titanium Nickel Shape Memory Alloy Thin Film Using the Bulge Test." Micromachines 12, no. 1 (January 15, 2021): 85. http://dx.doi.org/10.3390/mi12010085.

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This study investigated the effects of different substrates on the mechanical properties of Ti-60at%Ni shape memory alloys (SMA). Two types of samples were prepared for this experiment: (1) a Ti-60at%Ni deposited on SiNx, and (2) a Ti-60at%Ni deposited on SiNx/Cr; both had a 600 nm thick film of Ti-60at%Ni. Deposition was done using the physical vapor deposition (PVD) process, and the microstructural changes and crystallization phase changes were observed through scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results showed that the TiNi thin film with a Cr adhesion layer had better mechanical properties. The bulge test showed that TiNi thin film with a Cr adhesion had a higher Young’s modulus and lower residual stress. From the thermal cycling experiment, it was found that the Cr adhesion layer buffered the mismatch between TiNi and SiNx. Additionally, the thermal cycling test was also used to measure the thermal expansion coefficient of the films, and the fatigue test showed that the Cr layer significantly improved the fatigue resistance of the TiNi film.
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31

Kim, Tae-Yoo, Hwa-Jin Son, Seung-Kyu Lim, Kwang-Keun Lee, and Su-Jeong Suh. "Electrical and Structural Properties of Ni-60%Cr Thin Film in an Embedded Resistor." Korean Journal of Metals and Materials 52, no. 2 (February 5, 2014): 143–47. http://dx.doi.org/10.3365/kjmm.2014.52.2.143.

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32

Meena, S. P., and R. Ashokkumar. "Effect of different Current density on Properties of Electrodeposited Ni-Co-Cr Thin Films." Oriental Journal of Chemistry 34, no. 4 (July 31, 2018): 1884–89. http://dx.doi.org/10.13005/ojc/3404023.

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NiCoCr thin films were electroplated for different current density. FCC structured crystals were observed in XRD study. Coercive force and magnetization value exhibits soft magnetic nature. Electroplated NiCoCr films with electrolytic current density (2, 3, 4 and 5 mil.Amp/cm2) shows uniform deposition on the substrate. Cobalt composition was minimum as 21.31 wt% for current density 5 mA/cm2. The consistence of chromium and nickel increased while current density was improved. Thin films deposition with high current density shows low hysteresis loss and soft magnetic nature.The hardness of deposits increases when current density is increased.
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33

Benzitouni, Sara, Mourad Zaabat, Jean Ebothé, Abdelhakim Mahdjoub, and Meriem Guemini. "Effect of Transition Metals on the Mechanical Properties of ZnO Thin Films, Prepared by Sol-Gel Method." Journal of Nano Research 65 (December 2020): 27–38. http://dx.doi.org/10.4028/www.scientific.net/jnanor.65.27.

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Undoped and transition metals (TM = Cr, Ni, Mn and Cd) doped zinc oxide (ZnO) thin films were prepared by sol-gel dip-coating method on glass substrates at 300 °C. In this study, the effect of dopant material on the structural, morphological, optical, electrical and mechanical properties of ZnO thin films is investigated by using XRD, AFM, UV-Vis, Hall effect and nanoindentation techniques, respectively. Nanocrystalline films with a ZnO hexagonal wurtzite structure and two preferred orientations (002) and (103) were obtained. UV-Vis transmittance spectra showed that all the films are highly transparent in the visible region (> 80 %). Moreover, the optical band gap of the films decreased to 3.13 eV with an increasing orbital occupation number of 3d electrons. AFM-topography shows that the films are dense, smooth and uniform, except for the high roughness RMS =26.3 nm obtained for Cd-doped ZnO. Finally, the dopant material is found to have a significant effect on the mechanical behavior of ZnO as compared to the undoped material. For Ni and Cd dopants, analysis of load and unload data yields an increase in the hardness (8.96 ± 0.22 GPa) and Young’s modulus (122 ± 7.46 GPa) of ZnO as compared to Cr and Mn dopants. Therefore, Ni and Cd are the appropriate dopants for the design and application of ZnO-based nanoelectromechanical systems.
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34

YAN, JIANWU, and JICHENG ZHOU. "STRAIN SENSITIVITY AND TEMPERATURE INFLUENCE OF NICHROME (80/20 wt.%) THIN FILM FABRICATED BY MAGNETRON SPUTTERING." International Journal of Modern Physics B 21, no. 21 (August 20, 2007): 3719–31. http://dx.doi.org/10.1142/s0217979207037636.

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The electromechanical properties of nichrome ( Ni – Cr 80/20 wt.%) used as a common material for application in thin film strain gauges have been studied. The surface topography and chemical composition of Ni – Cr thin films grown on the glass substrate by magnetron sputtering have been analyzed by atomic force microscope (AFM) and energy dispersive spectroscopy (EDS), respectively. The temperature coefficient of resistance (TCR) has been determined by a Nano-volt/Micro ohm meter. The gauge factor (FG) has been determined by the cantilever method. Low stable TCR values (22 ppm to 46 ppm in the 50–150°C temperature range) have been obtained. Resistance stability is achieved by rapid thermal annealing (RTA) at 300°C for 10 min combined with a 24 h thermal annealing (TA) at 150°C. The desired 45 Ω/m sheet resistance and a gauge factor of 2.6 have been attained for 40-nm-thickness films. The films have very small roughness of 2.1~4.4 nm.
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35

Genut, M., and Y. Komem. "Diffusional processes in thin films of Au/CeO2 on NiCr superalloy." Thin Solid Films 144, no. 2 (November 1986): 211–22. http://dx.doi.org/10.1016/0040-6090(86)90414-1.

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36

Boubeker, B., J. P. Eymery, M. F. Denanot, and E. L. H. Sayouty. "A TEM and CEMS study of bcc Fe-Ni-Cr thin films." Journal of Magnetism and Magnetic Materials 133, no. 1-3 (May 1994): 470–73. http://dx.doi.org/10.1016/0304-8853(94)90598-3.

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37

Protsenko, I. Yu, O. V. Shovkoplyas, Yu M. Ovcharenko, and N. M. Opanasyuk. "The electrophysical properties of thin polycrystalline Cr, Cu, Ni and Ti films." Journal of Physical Studies 2, no. 1 (1998): 105–8. http://dx.doi.org/10.30970/jps.02.105.

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38

Bohne, Yvonne, Darina Manova, Stephan Mändl, Horst Neumann, and Bernd Rauschenbach. "Influence of Microstructure on Nitrogen Diffusion in Fe-Cr-Ni Thin Films." Plasma Processes and Polymers 4, S1 (April 2007): S660—S663. http://dx.doi.org/10.1002/ppap.200731605.

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39

Zalar, A., and S. Hofmann. "Redeposition in AES sputter depth profiling of multilayer Cr/Ni thin films." Surface and Interface Analysis 12, no. 2 (July 1988): 83–86. http://dx.doi.org/10.1002/sia.740120204.

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40

Draper, C. W., J. P. Franey, J. M. Gibson, T. E. Graedel, D. C. Jacobson, G. W. Kammlott, and J. M. Poate. "Microstructure and behavior of laser-mixed Cr/Ni films on Cu alloys." Journal of Materials Research 2, no. 1 (February 1987): 35–45. http://dx.doi.org/10.1557/jmr.1987.0035.

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Deposited thin films of Cr and Ni on Cu substrates have been melted and intermixed with a frequency-doubled Q-switched Nd:YAG laser. The laser pulses melt the thin films and a shallow portion of the substrate. Resolidification interface volocities are on the order of 1–10 m s−1. Rutherford backscattering, Auger spectroscopy, and energy dispersive x-ray mapping have been used to characterize the elemental distribution. Channeling and transmission electron microscopy were used to investigate the microstructure of the surfaces produced. In contrast to the binary Cr–Cu system, where extended solid solutions are produced, the Cr–Ni–Cu system results in a metallic glass surface. We have found that these metallic glass surfaces, which have been dubbed “stainless coppers,” exhibit excellent hydrogen sulfide corrosion resistance. Their contact resistance is low and stable over long periods of time and through tens of thousands of electronic dial switching cycles.
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41

Choi, J.-H., C. M. Sung, K. H. Shin, and L. F. Allard. "Effect of Pt content on compositional segregation in Co-Cr-P-Pt/Cr magnetic thin films." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 1022–23. http://dx.doi.org/10.1017/s0424820100167573.

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Co/Cr alloys are among the most prominent materials for ultra-high density longitudinal magnetic recording media. The recording and magnetic properties of the materials are related to their microstructure. It has been found that compositional segregation (CS) of the Co phase at the grain boundaries, and physical separation of Co/Cr phases are effective in producing low noise media due to low intergranular exchange coupling. A series of Co/Cr alloy magnetic thin films were prepared by DC sputtering and studied using high-resolution transmission electron microscopy (HRTEM) coupled with energy dispersive x-ray spectroscopy (EDS). CoxCryPzPtw/Cr alloy thin films were deposited on circumferentially textured Ni-P/Al substrate. This substrate geometry was used to get better magnetic properties without substrate bias. A Hitachi HF-2000 field emission TEM was used for imaging and to provide a 1 nm beam for high spatial resolution EDS analysis.
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42

Hou, Yang Lu, Xing Hua Fu, Wen Hong Tao, and Xin Jin. "Structure and Dielectric Properties of Mg, Cr-Doped LaSrFeO3 Films." Applied Mechanics and Materials 538 (April 2014): 11–14. http://dx.doi.org/10.4028/www.scientific.net/amm.538.11.

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Mg-doped LaFeO3 thin film and Mg, Cr-doped La0.5Sr0.5FeO3 thin films were prepared by the sol-gel method. The change rules of structure and dielectric properties of the films were studied by XRD, SEM, and Agilent. The dielectric properties of La0.5Sr0.5FeO3 and LaFeO3 films were improved by the substitute with Mg and Cr. The doping amount of Mg and Cr for the optimal dielectric properties of La0.5Sr0.5FeO3 films is 45mol%, 25mol%, respectively, and for LaFeO3, the doping amount of Mg is 8mol%. The observed pure perovskite phase of the doped films suggested the dissolution of Mn, Co, and Ni in La0.5Sr0.5FeO3 crystal lattice. Mg and Cr were integrate in the lattice of LaFeO3 and La0.5Sr0.5FeO3, and mineral is single perovskite phase. The surface of the film is smooth, without cracks, surface grain size distribution and had uniform grain size.
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43

HE, Y., and F. H. STOTT. "ChemInform Abstract: Selective Oxidation of Ni-15% Cr and Ni-10% Cr Alloys Promoted by Surface-Applied Thin Oxide Films." ChemInform 26, no. 5 (August 18, 2010): no. http://dx.doi.org/10.1002/chin.199505022.

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44

Krabac, Lubomir, Vladimir Pejaković, Vladislav Drinek, Nicole Dörr, and Ewald Badisch. "Tribology of Ge thin films on stainless steel." Industrial Lubrication and Tribology 69, no. 2 (March 13, 2017): 182–89. http://dx.doi.org/10.1108/ilt-06-2016-0128.

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Purpose The purpose of this paper is to study the friction and wear behavior of germanium (Ge) thin films deposited by low-pressure chemical vapor deposition method on a chromium (Cr)-nickel (Ni) stainless steel substrate after being exposed to relatively mild sliding conditions (low loads and sliding distances). Design/methodology/approach Wear and friction experiments were conducted with a 100Cr6 steel ball sliding against flat Ge thin-film-coated stainless steel sheets (ball-on-flat microtribometer, no lubricant, normal loads of 50-100 mN, initial Hertzian contact pressures of 385-485 MPa, total sliding distance up to 200 mm and room temperature). Findings Scanning electron microscopy results revealed that prepared Ge thin films consisted of two different morphologies: curved nanowires and cone-shaped nano-/microdroplets. Regarding friction and wear characteristics of the investigated samples, the substrates coated with Ge thin films did not affect the coefficient of friction significantly by load. The wear of the base material (Cr-Ni stainless steel) was not observed under the mentioned experimental conditions (see the “Design/methodology/approach” section); however, with increased sliding distance and/or applied load, a rupture of the Ge film and an exposure of the stainless steel substrate to the 100Cr6 ball can be expected. Furthermore, the observations suggest that the smearing of Ge nano- and microstructures, plastically deformed during tribotesting, over the surface exposed to the sliding contact is the dominant tribological process. Originality/value For the first time, the tribological interaction between Ge thin film and steel surface was investigated under dry sliding conditions using a ball-on-flat microtribometer, and the obtained results provide a useful base for the further research on tribology of Ge-based thin films.
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45

Ratner, E., A. Appelbaum, R. Brener, and M. Eizenberg. "Interactions of Thin Al Films with Ni–Cr Alloy and Bilayer Films Deposited on Si." physica status solidi (a) 94, no. 1 (March 16, 1986): 61–69. http://dx.doi.org/10.1002/pssa.2210940106.

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46

Lee, Seung-Woo, Soad Ahmed, Tao Wang, Yeawon Park, Sota Matsuzaki, Shinichi Tatsumi, Shigekiyo Matsumoto, Sergiy Korposh, and Steve James. "Label-Free Creatinine Optical Sensing Using Molecularly Imprinted Titanium Dioxide-Polycarboxylic Acid Hybrid Thin Films: A Preliminary Study for Urine Sample Analysis." Chemosensors 9, no. 7 (July 17, 2021): 185. http://dx.doi.org/10.3390/chemosensors9070185.

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Creatinine (CR) is a representative metabolic byproduct of muscles, and its sensitive and selective detection has become critical in the diagnosis of kidney diseases. In this study, poly(acrylic acid) (PAA)-assisted molecularly imprinted (MI) TiO2 nanothin films fabricated via liquid phase deposition (LPD) were employed for CR detection. The molecular recognition properties of the fabricated films were evaluated using fiber optic long period grating (LPG) and quartz crystal microbalance sensors. Imprinting effects were examined compared with nonimprinted (NI) pure TiO2 and PAA-assisted TiO2 films fabricated similarly without a template. In addition, the surface modification of the optical fiber section containing the LPG with a mesoporous base coating of silica nanoparticles, which was conducted before LPD-based TiO2 film deposition, contributed to the improvement of the sensitivity of the MI LPG sensor. The sensitivity and selectivity of LPGs coated with MI films were tested using CR solutions dissolved in different pH waters and artificial urine (near pH 7). The CR binding constants of the MI and NI films, which were calculated from the Benesi–Hildebrand plots of the wavelength shifts of the second LPG band recorded in water at pH 4.6, were estimated to be 67 and 7.8 M–1, respectively, showing an almost ninefold higher sensitivity in the MI film. The mechanism of the interaction between the template and the TiO2 matrix and the film composition was investigated via ultraviolet–visible and attenuated total reflectance Fourier-transform infrared spectroscopy along with X-ray photoelectron spectroscopy analysis. In addition, morphological studies using a scanning electron microscope and atomic force microscope were conducted. The proposed system has the potential for practical use to determine CR levels in urine samples. This LPG-based label-free CR biosensor is innovative and expected to be a new tool to identify complex biomolecules in terms of its easy fabrication and simplicity in methodology.
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47

Tsirlina, T., V. Lyakhovitskaya, S. Fiechter, and R. Tenne. "Study on preparation, growth mechanism, and optoelectronic properties of highly oriented WSe2 thin films." Journal of Materials Research 15, no. 12 (December 2000): 2636–46. http://dx.doi.org/10.1557/jmr.2000.0378.

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Recently, highly oriented WSe2 thin films, with the c axis of the crystallites perpendicular to the substrate, were reproducibly obtained by interposing a Ni/Cr thin layer between the substrate and a WO3 precursor film. In the present work the preparation conditions were varied to elucidate the growth mechanism of such films. A model for the growth mode is proposed. Based upon this analysis, WSe2 thin films with improved crystalline and electronic properties were obtained. The photoresponse spectrum for photoelectrochemical cells with the WSe2 electrode immersed into a selenosulfate solution was measured. Quantum efficiency of 0.1% was calculated from this spectrum.
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48

Martín-Palma, R. J., and J. M. Martínez-Duart. "Ni–Cr passivation of very thin Ag films for low-emissivity multilayer coatings." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17, no. 6 (November 1999): 3449–51. http://dx.doi.org/10.1116/1.582081.

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49

Sato, Yuichi, Masaya Watanabe, and Susumu Sato. "Electrical Properties of Ni–Cr–N Thin Films Deposited by Multitarget Reactive Sputtering." Japanese Journal of Applied Physics 40, Part 1, No. 8 (August 15, 2001): 5091–94. http://dx.doi.org/10.1143/jjap.40.5091.

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50

Lee, Ying-Chieh, Voon Choong Yen, Christian Pithan, and Jhen-Hau Jan. "Study of Ni–Cr / CrN bilayer thin films resistor prepared by magnetron sputtering." Vacuum 213 (July 2023): 112085. http://dx.doi.org/10.1016/j.vacuum.2023.112085.

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