Log in

Relevant bibliographies by topics / Multilayers printed circuit board

Contents

Journal articles
Dissertations / Theses
Books
Book chapters
Conference papers
Reports

Academic literature on the topic 'Multilayers printed circuit board'

Author: Grafiati

Published: 28 June 2021

Last updated: 2 February 2022

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Multilayers printed circuit board.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Multilayers printed circuit board"

1

Vorunichev, D. S., and K. Yu Vorunicheva. "Current capabilities of prototyping technologies for multilayer printed circuit boards on a 3D printer." Russian Technological Journal 9, no. 4 (2021): 28–37. http://dx.doi.org/10.32362/2500-316x-2021-9-4-28-37.

Full text

Abstract:

A new direction in 3D printing was investigated – prototyping of single-sided, double-sided and multilayer printed circuit boards. The current capabilities and limitations of 3D printed circuit board printing technology were identified. A comparative analysis of the characteristics of two desktop 3D printers presented in the industry for prototyping radio electronics, as well as the first professional machine DragonFly LDM 2020, which is a mini-factory for prototyping multilayer printed circuit boards, was carried out. The first practical experience of working and printing on DragonFly LDM 202

APA, Harvard, Vancouver, ISO, and other styles

2

G.W.A.D. "The multilayer printed circuit board handbook." Microelectronics Reliability 25, no. 6 (1985): 1157. http://dx.doi.org/10.1016/0026-2714(85)90488-3.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Sisoev, Oleg Yu, Sergey S. Sokolov, and Victor A. Tupik. "CHOOSING RATIONAL TRACING PROCEDURE BY CONSTRUCTIVE CRITERION." Journal of the Russian Universities. Radioelectronics, no. 6 (January 18, 2019): 5–12. http://dx.doi.org/10.32603/1993-8985-2018-21-6-5-12.

Full text

Abstract:

The analysis of autorouter efficiency in the known CAD systems under structural and technological constraints is carried out. The revealed significant constraints are related to the thermal strength of the wires and possible mutual influence through the electromagnetic field. When manually designing the designer guided by his own experience, can ignore these and other constraints. Unlike a person, the autorouter strictly fulfills all the specified constraints, which, given the topology of the printed circuit board, does not allow tracing to complete. On the other hand, giving greater freedom t

APA, Harvard, Vancouver, ISO, and other styles

4

Batutina, M. S., A. A. Kuzmin, and A. N. Mikhailov. "TRANSREFLECTOR ANTENNA DESIGN BASED ON FLAT MULTILAYER TRANSREFLECTOR." Issues of radio electronics, no. 2 (February 20, 2019): 26–30. http://dx.doi.org/10.21778/2218-5453-2019-2-26-30.

Full text

Abstract:

The paper considers an embodiment of the antenna design based on a flat non‑axis‑symmetrical transreflector made by using multilayer printed circuit board technology. The construction principle of a flat non‑axis‑symmetrical transreflector by cutting it from the flat polarizing structure is given. The form of the flat multi‑layer non‑axisymmetric transreflector board is determined by the projection of the non‑axisymmetric parabolic transflector onto a plane perpendicular to the focal axis. An electrodynamic model of the antenna with a flat non‑axis‑symmetrical reflector to study the radiation

APA, Harvard, Vancouver, ISO, and other styles

5

Kong, Fan, Weixing Sheng, Xiaofeng Ma, and Yubing Han. "Circuit model and signal integrity analysis for multilayer printed circuit board interconnection." International Journal of RF and Microwave Computer-Aided Engineering 24, no. 4 (2013): 478–89. http://dx.doi.org/10.1002/mmce.20789.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Bachmann, Friedrich. "Excimer Laser Drill for Multilayer Printed Circuit Boards: From Advanced Development to Factory Floor." MRS Bulletin 14, no. 12 (1989): 49–53. http://dx.doi.org/10.1557/s088376940006098x.

Full text

Abstract:

A novel excimer laser process has been developed for generating cylindrical via holes with an aspect ratio of about one. The fabrication process is being successfully run on a production line for a highly miniaturized printed circuit board used for the multichip module in the new Siemens 7500 H 90 mainframe computer. The process is outstanding in terms of reliability and reproducibility. To the best of our knowledge, this is the first that that excimer lasers have been put into large-scale use in an industrial environment.Since signal delay times for chips have decreased much more rapidly than

APA, Harvard, Vancouver, ISO, and other styles

7

Kuczynski, J. "Dynamic Mechanical Analysis of Printed Circuit Board Laminates." International Symposium on Microelectronics 2010, no. 1 (2010): 000630–37. http://dx.doi.org/10.4071/isom-2010-wp3-paper4.

Full text

Abstract:

Printed circuit boards must meet stringent requirements imposed by elevated temperature processes required for mixed-solder and/or Pb-free assembly. To meet these requirements, laminate manufacturers offer a variety of resin formulations, reactive additives, and glass styles designed to impart specific properties. Both the coefficient of thermal expansion (CTE) and the glass transition temperature (Tg) have received considerable attention with respect to design of high-temperature laminates. CTE mismatch between the copper and the laminate within a PCB results in stress upon the copper that ma

APA, Harvard, Vancouver, ISO, and other styles

8

Liu, Jingping, Cheng Yang, Haoyi Wu, et al. "Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment." Energy Environ. Sci. 7, no. 11 (2014): 3674–82. http://dx.doi.org/10.1039/c4ee01995d.

Full text

Abstract:

A multilayer printed circuit board (PCB) can be fabricated using commercially available printing paper, which shows comparable functionalities with the conventional organic PCBs but 100 times lower environmental impact.

APA, Harvard, Vancouver, ISO, and other styles

9

Takahashi, A., N. Ooki, A. Nagai, H. Akahoshi, A. Mukoh, and M. Wajima. "High density multilayer printed circuit board for HITAC M-880." IEEE Transactions on Components, Hybrids, and Manufacturing Technology 15, no. 4 (1992): 418–25. http://dx.doi.org/10.1109/33.159868.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Wang, Xiang, Wangping Wu, Dingkai Xie, Peng Jiang, Zhizhi Wang, and Yi Zhang. "Failure Analysis of Leakage Current for Multilayer Printed Circuit Board." Journal of Failure Analysis and Prevention 20, no. 5 (2020): 1621–27. http://dx.doi.org/10.1007/s11668-020-00971-1.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Dissertations / Theses on the topic "Multilayers printed circuit board"

1

Ambatipudi, Radhika. "Multilayered Coreless Printed Circuit Board (PCB) Step-down Transformers for High Frequency Switch Mode Power Supplies (SMPS)." Licentiate thesis, Mittuniversitetet, Institutionen för informationsteknologi och medier, 2011. http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-13967.

Full text

Abstract:

The Power Supply Unit (PSU) plays a vital role in almost all electronic equipment. The continuous efforts applied to the improvement of semiconductor devices such as MOSFETS, diodes, controllers and MOSFET drivers have led to the increased switching speeds of power supplies. By increasing the switching frequency of the converter, the size of passive elements such as inductors, transformers and capacitors can be reduced. Hence, the high frequency transformer has become the backbone in isolated AC/DC and DC/DC converters. The main features of transformers are to provide isolation for safety purp

APA, Harvard, Vancouver, ISO, and other styles

2

Galia, Jan. "Měnič s tranzistory GaN pro elektrický kompresor." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2021. http://www.nusl.cz/ntk/nusl-442787.

Full text

Abstract:

This master’s thesis deals with the design and realization of a functional sample power inverter for an electric compressor, which is used in hybrid cars. The electric compressor powered by the inverter is E-compressor by Garrett Advancing Motion. An inverter will be using modern High Electron Mobility Transistors which are based on gallium nitride (GaN). The purpose of this thesis is to find if GaN transistors can be used in E-boosting application.

APA, Harvard, Vancouver, ISO, and other styles

3

Tarvainen, T. (Timo). "Studies on via coupling on multilayer printed circuit boards." Doctoral thesis, University of Oulu, 1999. http://urn.fi/urn:isbn:951425189X.

Full text

Abstract:

Abstract Design and manufacturing techniques of printed circuit boards (PCB's) have advanced from early one or two-layer structures to the multilayer boards where ten or more layers are no longer uncommon. These give additional routing space, potential decrease in device size and various design possibilities like solid ground and power planes. Unfortunately multilayer boards are vulnerable to high coupling between signal vias especially due to PCB resonances. In this study via crosscoupling is investigated on multilayer PCB's. Special attention is given to the coupling due to resonanc

APA, Harvard, Vancouver, ISO, and other styles

4

Xu, Zhifei. "Tensorial analysis of multilayer printed circuit boards : computations and basics for multiphysics analysis." Thesis, Normandie, 2019. http://www.theses.fr/2019NORMR003.

Full text

Abstract:

Les cartes électroniques modernes nécessitent des analyses avancées d’intégrité du signal (IS), d’intégrité de puissance (IP), et de compatibilité électromagnétique (CEM). Face aux complexités des circuits imprimés, les méthodes de calcul classiques ne permettent ni de poser le problème ni de l’analyser théoriquement. Cependant, l’analyse tensorielle des réseaux (ATR) basée sur la méthode de Kron complétée du modèle de Branin (KB) laisse entrevoir une capacité d’analyse plus avancée des PCB. L’ATR appliquée à l’espace des mailles conduit à une modélisation compacte et une expression lagrangien

APA, Harvard, Vancouver, ISO, and other styles

5

Hickam, James William III 1956. "Paperless planning in printed circuit board manufacturing." Thesis, The University of Arizona, 1990. http://hdl.handle.net/10150/277250.

Full text

Abstract:

One of the aspects of Computer Integrated Manufacturing is the ability to provide current work instructions to the operator at their workstation on a terminal or graphic monitor. The problem is, today, paperless planning is displayed to the operator one page at a time, making the operator report the completion or not completion of that task before showing the next page. This allows the operator no freedom of choice in how to do the job, which leads to reduced productivity and quality. A possible solution is presented by structuring the planning instructions and enhancing the workstation. The o

APA, Harvard, Vancouver, ISO, and other styles

6

Kubik, Jan [Verfasser]. "Printed Circuit Board Fluxgate Sensors / Jan Kubik." Aachen : Shaker, 2009. http://d-nb.info/1161308342/34.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Moorhouse, Colin. "Laser processing of printed circuit board materials." Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/195.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Lim, Geok H. "Vibration analysis of a printed circuit board." Thesis, Aston University, 2000. http://publications.aston.ac.uk/15341/.

Full text

Abstract:

The reliability of the printed circuit board assembly under dynamic environments, such as those found onboard airplanes, ships and land vehicles is receiving more attention. This research analyses the dynamic characteristics of the printed circuit board (PCB) supported by edge retainers and plug-in connectors. By modelling the wedge retainer and connector as providing simply supported boundary condition with appropriate rotational spring stiffnesses along their respective edges with the aid of finite element codes, accurate natural frequencies for the board against experimental natural frequen

APA, Harvard, Vancouver, ISO, and other styles

9

Li, Weiping. "Large-area, low-cost via formation and metallization in multilayer thin film interconnection on Printed Wiring Boards (PWB)." Diss., Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/19641.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Cresci, David John. "On-wafer characterization of ground vias in multilayer FR-4 printed circuit boards at RF/microwave frequencies." Thesis, Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/15806.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Books on the topic "Multilayers printed circuit board"

1

Kirsch, F. William. Waste minimization assessment for multilayered printed circuit board manufacturing. U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, 1991.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

2

Kirsch, F. William. Waste minimization assessment for multilayered printed circuit board manufacturing. U.S. Environmental Protection Agency, Risk Reduction Engineering Laboratory, 1991.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

3

Noble, P. J. W. Printed circuit board assembly. Springer US, 1989. http://dx.doi.org/10.1007/978-1-4684-6234-0.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Castrovilla, Joseph A. The printed circuit board industry. Business Communications Co., 1985.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

5

Printed circuit board design with microcomputers. Intertext Publications, 1991.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

6

Prochnow, Dave. 50 powerful printed circuit board projects. Tab Books, 1988.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

7

Printed circuit board designer's reference: Basics. Prentice Hall Professional Technical Reference, 2004.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

8

Montrose, Mark I. EMC and the Printed Circuit Board. John Wiley & Sons, Inc., 1998. http://dx.doi.org/10.1002/047172310x.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Build your own printed circuit board. McGraw-Hill, 2004.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

10

Schroeder, Chris. Printed circuit board design using AutoCAD. Newnes, 1998.

Find full text

APA, Harvard, Vancouver, ISO, and other styles

Book chapters on the topic "Multilayers printed circuit board"

1

Zhang, Zhaohang, Weisheng Yang, Jinfeng Liu, Xu Chen, and Jianjun Zhu. "Advanced Manufacturing Technology of Microwave Multilayer Printed Circuit Board." In Lecture Notes in Electrical Engineering. Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-32-9441-7_16.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Weik, Martin H. "printed-circuit board." In Computer Science and Communications Dictionary. Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_14620.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Chilton, Neil. "Printed Circuit Board Fabrication." In Inkjet Technology for Digital Fabrication. John Wiley & Sons, Ltd, 2014. http://dx.doi.org/10.1002/9781118452943.ch8.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Foitzik, Andreas. "Printed Circuit Board Technologies." In The Electronic Design Automation Handbook. Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_24.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Kohlhammer, Bernd. "Printed Circuit Board Design." In The Electronic Design Automation Handbook. Springer US, 2003. http://dx.doi.org/10.1007/978-0-387-73543-6_25.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Archambeault, Bruce R. "Printed Circuit Board Layout." In PCB Design for Real-World EMI Control. Springer US, 2002. http://dx.doi.org/10.1007/978-1-4757-3640-3_11.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Seraphim, Donald P., Donald E. Barr, William T. Chen, George P. Schmitt, and Rao R. Tummala. "Printed-Circuit Board Packaging." In Microelectronics Packaging Handbook. Springer US, 1989. http://dx.doi.org/10.1007/978-1-4613-1069-3_12.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Mardiguian, Michel. "Printed Circuit Board Design." In Controlling Radiated Emissions by Design. Springer US, 1992. http://dx.doi.org/10.1007/978-1-4615-3102-9_6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Edwards, Phillip R. "Printed circuit board manufacture." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_5.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Edwards, Phillip R. "Printed circuit board assembly." In Manufacturing Technology in the Electronics Industry. Springer Netherlands, 1991. http://dx.doi.org/10.1007/978-94-011-3130-8_6.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Multilayers printed circuit board"

1

Tomimura, Toshio, Yoshihiro Shiotsu, Yasushi Koito, Masaru Ishizuka, and Tomoyuki Hatakeyama. "Evaluation of Effective Thermal Conductivity of Multilayer Printed Circuit Board." In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44232.

Full text

Abstract:

To perform a rational thermal design of a printed circuit board (PCB) with highly anisotropic heat transfer nature in its initial stage, effective thermal conductivities in thickness direction and in in-plane direction must be given depending on the electric circuit of the board. However, a simple evaluation method for the effective thermal conductivities of such PCB has not been developed yet. In this study, as the first step to propose a simple evaluation method, the heat transfer coefficient by natural convection around a horizontal disk, which is indispensable for measuring the effective t

APA, Harvard, Vancouver, ISO, and other styles

2

Cocchini, Matteo, Wheling Cheng, Jianmin Zhang, et al. "Differential vias transition modeling in a multilayer printed circuit board." In 2008 IEEE International Symposium on Electromagnetic Compatibility - EMC 2008. IEEE, 2008. http://dx.doi.org/10.1109/isemc.2008.4652164.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Hardock, Andreas, Renato Rimolo-Donadio, Heinz-Dietrich Bruns, and Christian Schuster. "Double stub matching in multilayered printed circuit board using vias." In 2012 IEEE 62nd Electronic Components and Technology Conference (ECTC). IEEE, 2012. http://dx.doi.org/10.1109/ectc.2012.6249124.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Wits, Wessel, Rob Legtenberg, Jan Mannak, and Bas van Zalk. "Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology." In 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium. IEEE, 2006. http://dx.doi.org/10.1109/iemt.2006.4456432.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Borland, William, John J. Felten, Lynne E. Dellis, et al. "Ceramic Resistors and Capacitors Embedded in Organic Printed Wiring Boards." In ASME 2003 International Electronic Packaging Technical Conference and Exhibition. ASMEDC, 2003. http://dx.doi.org/10.1115/ipack2003-35090.

Full text

Abstract:

Combining thick-film and printed wiring board processes allows thick-film ceramic resistors and capacitors to be embedded in printed wiring boards (PWB). The resistor materials are based on lanthanum boride and cover the range of 10 ohm/square to 10 Kohm/square resistivities. The capacitor material is based on doped barium titanate. Both systems are designed to be “thick-film” printed on copper foil in the locations desired in the circuit and the foil is then fired in nitrogen at 900°C to form the ceramic component on the copper foil. The foil is then laminated, component face down, to FR4 usi

APA, Harvard, Vancouver, ISO, and other styles

6

Mikami, Takao, and Takaya Kobayashi. "Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards." In ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASMEDC, 2009. http://dx.doi.org/10.1115/interpack2009-89266.

Full text

Abstract:

The rapid assembly of printed circuit boards to meet the desired goal of thinning the board creates more complexity in the reflow process, to control the occurrence of warpage in the board. Therefore, certain methods are preferred for simply yet accurately predicting the amount of warpage inevitable in the reflow process. Responding to such a need, the study was carried out aiming to provide a specific numerical method based on the multilayered plate theory, resulting in a simple procedure capable of supplying an accurate estimation of the warped deformation of the board. The estimation result

APA, Harvard, Vancouver, ISO, and other styles

7

Huang, Qingchou, Shu Zhang, and Wanshun Jiang. "A shielded microstrip-to-stripline vertical transition for multilayer printed circuit board." In 2012 International Conference on Microwave and Millimeter Wave Technology (ICMMT). IEEE, 2012. http://dx.doi.org/10.1109/icmmt.2012.6230045.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Ghosh, Avali, Sisir Kumar Das, and Annapurna Das. "Analysis of radiation coupling from via in multilayer printed circuit board traces." In 2016 International Conference on ElectroMagnetic Interference & Compatibility (INCEMIC). IEEE, 2016. http://dx.doi.org/10.1109/incemic.2016.7921461.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

You, Hee-Wook, and Jung-Hyuk Koh. "Simulation and fabrication of embedded capacitors in the multilayer printed circuit board." In 2007 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2007. http://dx.doi.org/10.7567/ssdm.2007.p-2-10.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Raj, L. David William, K. Roja, J. Sasi Theresa, M. Sathyavani, and M. Sumithra. "Elegant Way of Designing Printed Circuit Board via Multilayer Technique Using Ultiboard 12.0." In 2019 IEEE International Conference on System, Computation, Automation and Networking (ICSCAN). IEEE, 2019. http://dx.doi.org/10.1109/icscan.2019.8878826.

Full text

APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Multilayers printed circuit board"

1

Anderson, J. T. Document Template for Printed Circuit Board Layout. Office of Scientific and Technical Information (OSTI), 1998. http://dx.doi.org/10.2172/1032099.

Full text

APA, Harvard, Vancouver, ISO, and other styles

2

Holder, Darryl. Prototype and Short-Run Printed Circuit Board Creation. Defense Technical Information Center, 1993. http://dx.doi.org/10.21236/ada263245.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Edwards, H. W., M. F. Kostrzewa, and G. P. Looby. Pollution prevention assessment for a printed circuit board plant. Office of Scientific and Technical Information (OSTI), 1995. http://dx.doi.org/10.2172/125058.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Booth, Janice C., Tracy Hudson, Brian A. English, Michael R. Whitley, and Michael S. Kranz. Integrated Printed Circuit Board (PCB) Active Cooling With Piezoelectric Actuator. Defense Technical Information Center, 2012. http://dx.doi.org/10.21236/ada567661.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Bacon, L. D., and R. P. Toth. LineCAP (Line/Circuit Analysis Program): Cross-coupling on PC (printed circuit) board traces including discontinuities and circuit elements. Office of Scientific and Technical Information (OSTI), 1989. http://dx.doi.org/10.2172/6038898.

Full text

APA, Harvard, Vancouver, ISO, and other styles

6

Neilsen, Michael K., Kevin N. Austin, Douglas Brian Adolf, Scott W. Spangler, Matthew Aaron Neidigk, and Robert S. Chambers. Packaging strategies for printed circuit board components. Volume I, materials & thermal stresses. Office of Scientific and Technical Information (OSTI), 2011. http://dx.doi.org/10.2172/1022184.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

HEWITT AND ASSOCIATES INC ALBUQUERQUE NM. EM Visualization of Printed Circuit Board Assemblies. A Phase 1 SBIR on behalf of USAF; SA-ALC/LDAE. Defense Technical Information Center, 1994. http://dx.doi.org/10.21236/ada293355.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Oxley, J. E., and R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Final report, August 1, 1995--October 31, 1996. Office of Scientific and Technical Information (OSTI), 1997. http://dx.doi.org/10.2172/510548.

Full text

APA, Harvard, Vancouver, ISO, and other styles

9

Oxley, J. E., and R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 4, April 30, 1996--July 30, 1996. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/378168.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Oxley, J. E., and R. J. Smialek. Electrolytic regeneration of acid cupric chloride printed circuit board etchant. Quarterly report No. 3, February 1, 1996--April 30, 1996. Office of Scientific and Technical Information (OSTI), 1996. http://dx.doi.org/10.2172/239340.

Full text

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!