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Journal articles on the topic 'Micromachining'

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Published: 4 June 2021
Last updated: 30 July 2024

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1

FUJITA, Hiroyuki. "Micromachining." Tetsu-to-Hagane 78, no. 2 (1992): 195–99. http://dx.doi.org/10.2355/tetsutohagane1955.78.2_195.

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2

Piljek, Petar, Zdenka Keran, and Miljenko Math. "Micromachining." Interdisciplinary Description of Complex Systems 12, no. 1 (2014): 1–27. http://dx.doi.org/10.7906/indecs.12.1.1.

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3

Yu, Zhen, Quan-Jie Gao, and Ding-Fang Chen. "Study on mathematical model of cutting force in micromachining." International Journal of Modeling, Simulation, and Scientific Computing 06, no. 04 (December 2015): 1550039. http://dx.doi.org/10.1142/s1793962315500397.

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With the development of micromachining technology, it is very important to study the mechanism of micromachining, determine the micromachining parameters and ensure the products’ quality during the micromachining process. Combined with the micro-mechanism between tool and workpiece during micromachining process, the sources of the micro-cutting force were analyzed, the micro-cutting physical model was constructed, and the microstress model interacted between the cutting arc edge of the tool and the material of the workpiece was analyzed. Combined with the surface friction and elastic extrusion mechanism between the cutting tool and workpiece, the micro-cutting force model was constructed from two aspects. The micro-cutting depth is deeper than the minimum cutting depth and the micro-cutting depth is shallower than the minimum cutting depth, then the minimum cutting depth value was calculated. Combined with the dislocation properties and microcrystal structure of workpiece’s material, the internal stress of the micromachining force model based on the gradient plasticity theory was calculated, and the force model of the micro-cutting process was studied too. It is significant to control the precision of micromachining process during the micromachining process by constructing the micromachining process force model through studying the small deformation of the material and the mechanism of micromachining.
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4

KAJIKAWA, Toshikazu. "Laser micromachining." Journal of the Surface Finishing Society of Japan 40, no. 8 (1989): 874–79. http://dx.doi.org/10.4139/sfj.40.874.

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5

Loechel, Bernd. "Surface Micromachining." Electrochemical Society Interface 4, no. 3 (September 1, 1995): 43–47. http://dx.doi.org/10.1149/2.f08953if.

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6

Datta, Madhav. "Electrochemical Micromachining." Electrochemical Society Interface 4, no. 2 (June 1, 1995): 32–35. http://dx.doi.org/10.1149/2.f06952if.

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7

Smith, James H. "Surface Micromachining." Journal of Micro/Nanolithography, MEMS, and MOEMS 2, no. 4 (October 1, 2003): 247. http://dx.doi.org/10.1117/1.1616574.

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8

von Alvensleben, Ferdinand, Martin Gonschior, Heiner Kappel, and Peter Heekenjann. "LASER MICROMACHINING." Optics and Photonics News 6, no. 8 (August 1, 1995): 23. http://dx.doi.org/10.1364/opn.6.8.000023.

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9

Brevnov, Dmitri A., Thomas C. Gamble, Plamen Atanassov, Gabriel P. López, Todd M. Bauer, Zariff A. Chaudhury, Chris D. Schwappach, and Larry E. Mosley. "Electrochemical Micromachining." Electrochemical and Solid-State Letters 9, no. 8 (2006): B35. http://dx.doi.org/10.1149/1.2206007.

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10

French, P. J., P. T. J. Gennissen, and P. M. Sarro. "Epi-micromachining." Microelectronics Journal 28, no. 4 (May 1997): 449–64. http://dx.doi.org/10.1016/s0026-2692(96)00069-9.

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11

Schuster, R. "Electrochemical Micromachining." Science 289, no. 5476 (July 7, 2000): 98–101. http://dx.doi.org/10.1126/science.289.5476.98.

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12

Linder, C., L. Paratte, M. A. Gretillat, V. P. Jaecklin, and N. F. de Rooij. "Surface micromachining." Journal of Micromechanics and Microengineering 2, no. 3 (September 1, 1992): 122–32. http://dx.doi.org/10.1088/0960-1317/2/3/003.

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13

McDonald, JoAnn. "Micromachining biosensors." Biosensors and Bioelectronics 9, no. 6 (January 1994): xvii—xx. http://dx.doi.org/10.1016/0956-5663(94)90022-1.

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14

Jain, V. K., P. K. Jain, and P. V. Rao. "Editorial: Micromachining." International Journal of Advanced Manufacturing Technology 61, no. 9-12 (July 4, 2012): 1173–74. http://dx.doi.org/10.1007/s00170-012-4317-7.

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15

Jain, Vijay Kumar, R. Balasubramaniam, Rakesh Ganpat Mote, Manas Das, Anuj Sharma, Abhinav Kumar, Vivek Garg, and Bhaveshkumar Kamaliya. "Micromachining: An overview (Part I)." Journal of Micromanufacturing 3, no. 2 (March 17, 2020): 142–58. http://dx.doi.org/10.1177/2516598419895828.

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This article gives classification of micromanufacturing in general and micromachining processes in particular. For different micromachining processes, one can have different kinds of operations through which different features, shapes, accuracy, precision, and dimensions can be achieved. This article as Part I reports an overview of only three processes as diamond turn machining (a class of traditional micromachining processes), electrochemical micromachining, and focused-ion-beam micromachining (a class of advanced micromachining processes). About all these three processes, a brief introduction to the mechanisms of material removal is reported followed by the new developments in each process which are discussed independently. In various sections, some areas where research work needs to be done are identified and very briefly discussed.
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16

Mikoláš, Juraj, and Peter Šugár. "Micromachining of Austenitic Steel by Pulsed Nd:Yag Laser." Technological Engineering 9, no. 2 (December 1, 2012): 21–23. http://dx.doi.org/10.2478/teen-2012-0006.

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Abstract Laser micromachining presents a possibility to create new structures on the surface of any type of materials, typically with micron-range dimensions. Interaction mechanisms of laser micromachining is a complex process and it strongly depends both on laser input parameters and material properties. This article shows partial results of experimental research, focused on investigation of laser micromachining process of X5CrNi18-10 austenitic steel by pulsed Nd:YAG laser. The main goal was to evaluate laser micromachining process from the viewpoint of input parameters modification and reached surface quality
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17

Tangwarodomnukun, Viboon, and Jun Wang. "Laser Micromachining of Silicon Substrates." Advanced Materials Research 76-78 (June 2009): 416–21. http://dx.doi.org/10.4028/www.scientific.net/amr.76-78.416.

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Laser micromachining has been widely used for micro-component fabrication of various materials, such as silicon substrates where silicon wafer is ablated accurately and precisely through marking, scribing, drilling or dicing. Thermal damages can occur on the substrates when improper process parameters and methods are used. This paper presents a review on the micromachining of silicon substrates using conventional and novel lasers as well as water-assisted laser micromachining technologies. The basic concepts and approaches of the technologies are discussed along with the challenges to damage-free laser micromachining at commercially acceptable cutting rates.
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18

Esashi, Masayoshi. "Micromachining and Micromachines." IEEJ Transactions on Fundamentals and Materials 114, no. 7-8 (1994): 499–506. http://dx.doi.org/10.1541/ieejfms1990.114.7-8_499.

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19

Gruber, A. "Nanoparticle impact micromachining." Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures 15, no. 6 (November 1997): 2362. http://dx.doi.org/10.1116/1.589647.

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20

Esashi, Masayoshi. "Developments in Micromachining." Journal of the Society of Mechanical Engineers 97, no. 905 (1994): 286–89. http://dx.doi.org/10.1299/jsmemag.97.905_286.

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21

OBARA, Minoru. "Femtosecond Laser Micromachining." Journal of the Japan Society for Precision Engineering 72, no. 8 (2006): 943–46. http://dx.doi.org/10.2493/jjspe.72.943.

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22

GESSNER, T., A. BERTZ, C. LOHMANN, S. KURTH, and K. HILLER. "ADVANCED SILICON MICROMACHINING." International Journal of Computational Engineering Science 04, no. 02 (June 2003): 151–56. http://dx.doi.org/10.1142/s146587630300082x.

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23

Ihlemann, J., H. Schmidt, and B. Wolff-Rottke. "Excimer laser micromachining." Advanced Materials for Optics and Electronics 2, no. 1-2 (February 1993): 87–92. http://dx.doi.org/10.1002/amo.860020111.

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24

Dorman, Chris, and Matthias Schulze. "Picosecond Micromachining Update." Laser Technik Journal 5, no. 4 (June 2008): 44–47. http://dx.doi.org/10.1002/latj.200890044.

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25

Esashi, Masayoshi. "Sensors by micromachining." Electronics and Communications in Japan (Part II: Electronics) 74, no. 11 (1991): 76–83. http://dx.doi.org/10.1002/ecjb.4420741109.

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26

Hu, Z. J., S. G. Zhang, Xiu Hua Zheng, Yong Da Yan, T. Sun, Qing Liang Zhao, and Shen Dong. "Three-Dimensional Micromachining Based on AFM." Key Engineering Materials 315-316 (July 2006): 800–804. http://dx.doi.org/10.4028/www.scientific.net/kem.315-316.800.

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With the development of science and technology, Atomic Force Microscope is widely applied to the field of machining process in nanometer scale. Due to the limitation of the inventive purpose of AFM, only height mode and deflection mode can be applied in AFM-tip micromachining. It can’t control the machining depth during the micromachining process at present. In this paper, a new micromachining system is set up, which composed of a high precision three-dimensional stage, an AFM, a diamond probe and a special control device. By utilizing variation parameters PID algorithm and controlling the machining depth directly, the micromachining system can resolve the problem mentioned above.
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27

Gai, Xiao Chen, Zhi Wei Dong, Qing Liang Zhao, and Hong Bin Liu. "Femtosecond Laser Micromachining of SiC Ceramic Structures." Materials Science Forum 770 (October 2013): 21–24. http://dx.doi.org/10.4028/www.scientific.net/msf.770.21.

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Femtosecond laser micromachining technology shows abroad application background in the field of micro manufacturing due to its unique advantages, especially for micromachining of ultrahard materials such as Silicon carbide (SiC) ceramic. The femtosecond laser micromachining system was set up, by using the system, effects of scanning velocity and laser pulse energy on quality of micromachined features were evaluated. The optimized technological parameter was obtained as 8mW, 1mm/s with 1kHz repetition frequency respectively on the basis of the morphological characteristics and microstructure accuracy. Besides, V-shaped cavity of 300μm depth and 120°angle was generated with layer-by-layer scan machining. Thus femtosecond laser micromachining technology is an effective method for hard and brittle materials precision processing.
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28

Rihakova, L., and H. Chmelickova. "Laser Micromachining of Glass, Silicon, and Ceramics." Advances in Materials Science and Engineering 2015 (2015): 1–6. http://dx.doi.org/10.1155/2015/584952.

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A brief review is focused on laser micromachining of materials. Micromachining of materials is highly widespread method used in many industries, including semiconductors, electronic, medical, and automotive industries, communication, and aerospace. This method is a promising tool for material processing with micron and submicron resolution. In this paper micromachining of glass, silicon, and ceramics is considered. Interaction of these materials with laser radiation and recent research held on laser material treatment is provided.
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29

Samanta, Avik, Mahesh Teli, and Ramesh Singh. "Experimental characterization and finite element modeling of the residual stresses in laser-assisted mechanical micromachining of Inconel 625." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 231, no. 10 (November 2, 2015): 1735–51. http://dx.doi.org/10.1177/0954405415612677.

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Laser-assisted mechanical micromachining offers the ability to machine difficult-to-cut materials, like superalloys and ceramics, more efficiently and economically by laser-induced localized thermal softening prior to cutting. Laser-assisted mechanical micromachining is a micromachining process with localized laser heating which could affect the cutting forces and the machined surface integrity. The residual stresses obtained in the laser-assisted mechanical micromachining process depend on both mechanical loading and the laser heating. This article focuses on the experimental process characterization and prediction of the cutting forces and the residual stresses in a laser-assisted mechanical micromachining–based orthogonal machining of Inconel 625. The results show that the laser assistance reduces the mean cutting forces by ∼25% and enhances the normal compressive residual stress at the surface by ∼50%. Since microscale residual stress measurement is very time-intensive, a coupled-field thermo-mechanical finite element model of laser-assisted mechanical micromachining has been developed to predict the temperature, cutting forces and the residual stresses. The cutting forces and residual stresses’ predictions are in good agreement with the measured values during machining. In addition, parametric simulations have been carried out for laser power, cutting speed, cutting edge radius, rake angle, laser location and laser beam diameter to study their effect on cutting forces and surface residual stresses.
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30

Du, Kang, Rui Rong Wang, Meng Wei Li, Yun Bo Shi, and Jun Liu. "Fabrication and Structure Measurement of the Double-Barrier Nano Film Resonant Tunneling Gyroscope." Advanced Materials Research 97-101 (March 2010): 4225–29. http://dx.doi.org/10.4028/www.scientific.net/amr.97-101.4225.

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In this paper, a gyroscope with novel structure is designed and fabricated by the GaAs surface micromaching technology and GaAs bulk micromachining processes technology to achieve an integration of RTD and gyroscope structure. The structure and properties of RTD are tested by Transmission electron microscopy and Aglient 4156C semiconductor analyzer, and then the key parameters of gyroscope are measured by application of Scanning Electron Microscope. The effect of packaged gyroscope is tested by Polytec Micro-system analyzer. The problems in the fabrication process are analyzed and summarized, which have certain reference significance for the further study.
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31

Li, Kuan Ming. "Experimental Study on Minimum Quantity Lubrication in Mechanical Micromachining." Advanced Materials Research 579 (October 2012): 193–200. http://dx.doi.org/10.4028/www.scientific.net/amr.579.193.

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Mechanical micromachining is a promising technique for making complex microstructures. It is challenging to apply mechanical micromachining in the industry due to the low strength of micro tools. Therefore, it is not easy to accurately control the product dimension error and to raise the production rate. In this paper, the applications of minimum quantity lubrication (MQL) in micro-milling and micro-grinding are presented. MQL is considered as a green manufacturing technology in metal cutting due to its low impact on the environment and human health. This study compares the tool wear and surface roughness in MQL micromachining to completely dry condition based on experimental investigations. The supply of MQL in vibration-assisted grinding is also studied. It is found that the use of MQL results in longer tool life and better surface roughness in mechanical micromachining.
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32

Liu, Yang, Mingyi Wu, Chunfang Guo, Dong Zhou, Yucheng Wu, Zhaozhi Wu, Haifei Lu, Hongmei Zhang, and Zhaoyang Zhang. "A Review on Preparation of Superhydrophobic and Superoleophobic Surface by Laser Micromachining and Its Hybrid Methods." Crystals 13, no. 1 (December 23, 2022): 20. http://dx.doi.org/10.3390/cryst13010020.

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Functional wetting surfaces have excellent prospects in applications including self-cleaning, anti-fog, anti-icing, corrosion resistance, droplet control, and friction power generation. Laser micromachining technology is an advanced method for preparing such functional surfaces with high efficiency and quality. To fully exploit the potential of laser micromachining and the related hybrid methods, a wide spectrum of knowledge is needed. The present review systematically discusses the process capabilities and research developments of laser micromachining and its hybrid methods considering the research both in basic and practical fields. This paper outlines the relevant literature, summarizes the characteristics of functional wetting surfaces and also the basic scientific requirements for laser micromachining technology. Finally, the challenges and potential applications of superhydrophobic and superoleophobic surface are briefly discussed. This review fills the gap in the research literature by presenting an extended literature source with a wide coverage of recent developments.
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33

Yang, Li Jun, M. L. Wang, Yang Wang, J. Tang, and Yan Bin Chen. "Numerical Simulation on the Temperature Field of Water-Jet Guided Laser Micromachining." Advanced Materials Research 69-70 (May 2009): 333–37. http://dx.doi.org/10.4028/www.scientific.net/amr.69-70.333.

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Water-jet guided laser micromachining is the new development orientation of laser machining. This paper set up the numerical model on the action between the water-jet guided laser and the material. By using the software ANSYS, simulated the processing of the water-jet guided laser micromachining. This paper gave the investigation on the machining laws and the distributing of temperature fielding in processing of water-jet guided laser micromachining. And the results of the correlative experiment prove the model aright. The result provided the theoretical foundation for the next research on the water-jet guided laser machining.
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34

ESASHI, Masayoshi. "Sensor fabrication by micromachining." Journal of the Japan Society for Precision Engineering 55, no. 9 (1989): 1557–61. http://dx.doi.org/10.2493/jjspe.55.1557.

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35

Morgunov, Yu A., B. P. Saushkin, and N. V. Khomyakova. "Accuracy of Еlectrochemical Micromachining." Russian Engineering Research 40, no. 9 (September 2020): 736–40. http://dx.doi.org/10.3103/s1068798x20090129.

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36

Young, Darrin J. "Micromachining for rf Communications." MRS Bulletin 26, no. 4 (April 2001): 331–32. http://dx.doi.org/10.1557/mrs2001.74.

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The increasing demand for wireless communication applications, such as cellular and cordless telephones, wireless data networks, and global positioning systems, motivates a growing interest in building miniature radio transceivers that can support multistandard capabilities. Such transceivers will greatly enhance the convenience and accessibility of various wireless services.
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37

Takada, Hiroshi. "Micromachining with Synchrotron Radiation." Review of Laser Engineering 28, Supplement (2000): S1—S2. http://dx.doi.org/10.2184/lsj.28.supplement_s1.

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38

Esashi, Masayoshi. "Special Issue-Micromachine. Micromachining." Journal of the Japan Welding Society 63, no. 6 (1994): 449–53. http://dx.doi.org/10.2207/qjjws1943.63.449.

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39

Tilmans, Harrie A. C., Kris Baert, Agnes Verbist, and Robert Puers. "CMOS foundry-based micromachining." Journal of Micromechanics and Microengineering 6, no. 1 (March 1, 1996): 122–27. http://dx.doi.org/10.1088/0960-1317/6/1/030.

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40

Tas, Niels, Tonny Sonnenberg, Henri Jansen, Rob Legtenberg, and Miko Elwenspoek. "Stiction in surface micromachining." Journal of Micromechanics and Microengineering 6, no. 4 (December 1, 1996): 385–97. http://dx.doi.org/10.1088/0960-1317/6/4/005.

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41

Mileham, A. R. "Micromachining of engineering materials." Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 216, no. 4 (April 1, 2002): 607. http://dx.doi.org/10.1243/0954405021520094.

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42

Kovacs, G. T. A., N. I. Maluf, and K. E. Petersen. "Bulk micromachining of silicon." Proceedings of the IEEE 86, no. 8 (1998): 1536–51. http://dx.doi.org/10.1109/5.704259.

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43

Bhat, K. N. "Micromachining for Microelectromechanical Systems." Defence Science Journal 48, no. 1 (January 1, 1998): 5–19. http://dx.doi.org/10.14429/dsj.48.3863.

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44

KAWATA, Koichi. "Micromachining with Plastic Moulding." Kobunshi 44, no. 4 (1995): 248–49. http://dx.doi.org/10.1295/kobunshi.44.248.

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45

Lubecke, V. M., K. Mizuno, and G. M. Rebeiz. "Micromachining for terahertz applications." IEEE Transactions on Microwave Theory and Techniques 46, no. 11 (1998): 1821–31. http://dx.doi.org/10.1109/22.734493.

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46

Kamada, Kai, Kazuyoshi Izawa, Yuko Tsutsumi, Shuichi Yamashita, Naoya Enomoto, Junichi Hojo, and Yasumichi Matsumoto. "Solid-State Electrochemical Micromachining." Chemistry of Materials 17, no. 8 (April 2005): 1930–32. http://dx.doi.org/10.1021/cm0502929.

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47

Masuzawa, T., K. Okajima, T. Taguchi, and M. Fujino. "EDM-Lathe for Micromachining." CIRP Annals 51, no. 1 (2002): 355–58. http://dx.doi.org/10.1016/s0007-8506(07)61535-2.

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48

Tönshoff, H. K., D. Hesse, and J. Mommsen. "Micromachining Using Excimer Lasers." CIRP Annals - Manufacturing Technology 42, no. 1 (January 1993): 247–51. http://dx.doi.org/10.1016/s0007-8506(07)62436-6.

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49

Ricciardi, G., M. Cantello, F. Mariotti, P. Castelli, and P. Giacosa. "Micromachining with Excimer Laser." CIRP Annals 47, no. 1 (1998): 145–48. http://dx.doi.org/10.1016/s0007-8506(07)62804-2.

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50

Kruusing, Arvi, Seppo Leppävuori, Antti Uusimäki, Bronius Petrêtis, and Olga Makarova. "Micromachining of magnetic materials." Sensors and Actuators A: Physical 74, no. 1-3 (April 1999): 45–51. http://dx.doi.org/10.1016/s0924-4247(98)00343-4.

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