Dissertations / Theses on the topic 'Micromachining'
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Mian, Aamer Jalil. "Size effect in micromachining." Thesis, University of Manchester, 2011. https://www.research.manchester.ac.uk/portal/en/theses/size-effect-in-micromachining(91bf7280-a937-4509-9c40-4ff2e36d26c6).html.
Full textHobbs, Neil Townsend. "Anisotropic etching for silicon micromachining." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/40632.
Full textSilicon micromachining is the collective name for several processes by which three dimensional
structures may be constructed from or on silicon wafers. One of these
processes is anisotropic etching, which utilizes etchants such as KOH and ethylene
diamine pyrocatechol (EDP) to fabricate structures from the wafer bulk. This project is a
study of the use of KOH to anisotropically etch (lOO)-oriented silicon wafers. The thesis
provides a thorough review of the theory and principles of anisotropic etching as applied
to (100) wafers, followed by a few examples which serve to illustrate the theory. Next,
the thesis describes the development and experimental verification of a standardized
procedure by which anisotropic etching may be reliably performed in a typical research
laboratory environment. After the development of this procedure, several more etching
experiments were performed to compare the effects of various modifications of the etching
process. Multi-step etching processes were demonstrated, as well as simultaneous doublesided
etching using two different masks. The advantages and limitations of both methods
are addressed in this thesis. A comparison of experiments performed at different etchant
temperatures indicates that high temperatures (800 C) produces reasonably good results at
a very high etch rate, while lower temperatures (500 C) are more suited to high-precision
structures since they produce smoother, higher-quality surfaces.
Master of Science
Ozkeskin, Fatih Mert. "Feedback Controlled High Frequency Electrochemical Micromachining." Texas A&M University, 2008. http://hdl.handle.net/1969.1/86041.
Full textGreuters, Jako. "UV laser micromachining of photonics materials." Thesis, University of Hull, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.431044.
Full textKey, Philip Henry. "Excimer laser micromachining of inorganic materials." Thesis, University of Hull, 1989. http://hydra.hull.ac.uk/resources/hull:11090.
Full textBian, Qiumei. "Femtosecond laser micromachining of advanced materials." Diss., Kansas State University, 2012. http://hdl.handle.net/2097/15140.
Full textDepartment of Industrial and Manufacturing Systems Engineering
Shuting Lei
Shuting Lei
Femtosecond (fs) laser ablation possesses unique characteristics for micromachining, notably non-thermal interaction with materials, high peak intensity, precision and flexibility. In this dissertation, the potential of fs laser ablation for machining polyurea aerogel and scribing thin film solar cell interconnection grooves is studied. In a preliminary background discussion, some key literature regarding the basic physics and mechanisms that govern ultrafast laser pulse interaction with materials and laser micromachining are summarized. First, the fs laser pulses are used to micromachine polyurea aerogel. The experimental results demonstrate that high quality machining surface can be obtained by tuning the laser fluence and beam scanning speed, which provides insights for micromachining polymers with porous structures. Second, a new fs laser micro-drilling technique is developed to drill micro-holes in stainless steel, in which a hollow core fiber is employed to transmit laser pulses to the target position. The coupling efficiency between the laser and the fiber is investigated and found to be strongly related to pulse energy and pulse duration. Third, the fs laser with various energy, pulse durations, and scanning speeds has been utilized to pattern Indium Tin Oxide (ITO) glass for thin film solar cells. The groove width decreases with increasing pulse duration due to the shorter the pulse duration the more effective of the energy used to material removal. In order to fully remove ITO without damaging the glass, the beam scanning speed need to precisely be controlled. Fourth, fs laser has been utilized to scribe Molybdenum thin film on Polyimide (PI) flexible substrate for Copper Indium Gallium Selenide (CIGS) thin film solar cells. The experimental parameters and results including ablation threshold, single- and multiple-pulse ablation shapes and ablation efficiency were discussed in details. In order to utilize the advantages of the fs lasers, the fabrication process has to be optimized for thin film patterning and structuring applications concerning both efficiency and quality. A predictive 3D Two Temperature Model (TTM) was proposed to predict ablation characteristics and help to understand the fs laser metal ablation mechanisms. 3D temperature field evolution for both electrons and lattice were demonstrated. The ablation model provides an insight to the physical processes occurring during fs laser excitation of metals. Desired processing fluence and process speed regime can be predicted by calculating the ablation threshold, ablation rate and ablation crater geometry using the developed model.
Singh, Ramesh K. "Laser Assisted Mechanical Micromachining of Hard-to-Machine Materials." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19803.
Full textAlbri, Frank. "High precision laser micromachining for sensing applications." Thesis, Heriot-Watt University, 2014. http://hdl.handle.net/10399/2951.
Full textHaneveld, Jeroen. "Nanochannel fabrication and characterization using bond micromachining." Enschede : University of Twente [Host], 2006. http://doc.utwente.nl/51105.
Full textBostock, R. M. "Silicon micromachining for micro-optical device manufacture." Thesis, University of Cambridge, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.596797.
Full textOzdemir, C. Hakan. "Electrochemical behaviour of silicon for micromachining applications." Thesis, University of Southampton, 1992. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.315540.
Full textWu, Kenneth Chu-Chao. "Novel etch-stop materials for silicon micromachining." Thesis, Massachusetts Institute of Technology, 1997. http://hdl.handle.net/1721.1/9868.
Full textSpieser, Alexandre Frederic Jean. "Development of an electrochemical micromachining (μECM) machine." Thesis, Brunel University, 2015. http://bura.brunel.ac.uk/handle/2438/10659.
Full textCheng, Jian. "Ultrafast Picosecond Laser Micromachining of Metallic Materials." Thesis, University of Liverpool, 2010. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.526772.
Full textZdebski, Daniel. "The impact of tool performance on micromachining capability." Thesis, Cranfield University, 2012. http://dspace.lib.cranfield.ac.uk/handle/1826/7789.
Full textIsmail, Alyani. "Design of microwave waveguides and filters for micromachining." Thesis, University of Birmingham, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.433532.
Full textZhang, Hao. "INVESTIGATION TO A COST-EFFECTIVE 3D MICROMACHINING METHOD." The Ohio State University, 2013. http://rave.ohiolink.edu/etdc/view?acc_num=osu1372250848.
Full textAli, Arham. "Chemo-Thermal Micromachining of Glass: An Explorative Study." University of Cincinnati / OhioLINK, 2018. http://rave.ohiolink.edu/etdc/view?acc_num=ucin154392221273875.
Full textMuhammad, Noorhafiza Binti. "Laser micromachining of coronary stents for medical applications." Thesis, University of Manchester, 2012. https://www.research.manchester.ac.uk/portal/en/theses/laser-micromachining-of-coronary-stents-for-medical-applications(96e969b4-3fda-474c-ab3a-1eda44f9d968).html.
Full textMathai, George K. "Abrasive assisted brush deburring of micromilled features with application to a novel surgical device." Diss., Georgia Institute of Technology, 2012. http://hdl.handle.net/1853/47735.
Full textBorowiec, Andrzej Haugen Harold Kristen. "Ablation and micromachining of INP with femtosecond laser pulses /." *McMaster only, 2004.
Find full textMarinescu, Cristina. "A surface micromachining fabrication process for aluminium MEMS micromirrors /." Thesis, McGill University, 2006. http://digitool.Library.McGill.CA:80/R/?func=dbin-jump-full&object_id=98996.
Full textKota, Nithyanand. "Mechanical Micromachining-Effect of Crystallographic Anisotropy on Machining Forces." Research Showcase @ CMU, 2011. http://repository.cmu.edu/dissertations/70.
Full textProchaska, A. "Silicon micromachining technology for drop-on-demand liquid dispensers." Thesis, Queen's University Belfast, 2001. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.368466.
Full textCho, Seong-Ho 1966. "Laser micromachining of active and passive photonic integrated circuits." Thesis, Massachusetts Institute of Technology, 2003. http://hdl.handle.net/1721.1/30086.
Full textIncludes bibliographical references (leaves 149-158).
This thesis describes the development of advanced laser resonators and applications of laser-induced micromachining for photonic circuit fabrication. Two major advantages of laser-induced micromachining are direct patterning and writing on large areas of substrates at high speed following the exposure of laser light, without using complicated photomask steps. For passive photonic devices fabrication, a novel femtosecond laser with unprecedented low repetition rates of 4 MHz is demonstrated to generate high intensity pulses, as high as 1.25 MW with 100 nJ pulse energies and 80 fs pulse durations directly from this laser resonator, without using any active devices or amplifiers. These high intensity pulses are applied to transparent glass materials to demonstrate micromachining of waveguides, gratings, couplers, and three dimensional waveguides and their beam couplings. Active and passive semiconductor devices can be monolithically integrated by employing high energy laser pulses to locally disorder quantum well regions. The 45 nm bandgap shifts at 1.55 ptm with a standard Q-switched Nd:YAG laser at 535 nm are realized. Finally, unidirectional semiconductor ring lasers for high-density integration are developed as a potential application to photonic integrated circuits. Hybrid semiconductor S-crossover and retro-reflected ring lasers, as prototypes for unidirectional operation, are built and result in up to 21.5 dB and 24.5 dB of counter-mode suppression ratio, respectively, which is in good agreement with theoretical predictions.
by Seong-Ho Cho.
Ph.D.
Mlcak, Richard. "Electrochemical and photoelectrochemical micromachining of silicon in HF electroytes." Thesis, Massachusetts Institute of Technology, 1994. http://hdl.handle.net/1721.1/37526.
Full textWilliams, Eleri. "Experimental and theoretical investigations of nanosecond fibre laser micromachining." Thesis, Cardiff University, 2014. http://orca.cf.ac.uk/72916/.
Full textShah, Umer. "Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-143757.
Full textQC 20140328
Chen, Ta-Tung. "Electrochemical micromachining of microdevices from NiTi shape memory alloys." Thesis, Cranfield University, 1999. http://dspace.lib.cranfield.ac.uk/handle/1826/10697.
Full textГолобородько, Любов Вікторівна, Любовь Викторовна Голобородько, Liubov Viktorivna Holoborodko, Сергій Сергійович Некрасов, Сергей Сергеевич Некрасов, and Serhii Serhiiovych Nekrasov. "Особенности лезвийной микрообработки." Thesis, Издательство СумГУ, 2012. http://essuir.sumdu.edu.ua/handle/123456789/26847.
Full textFazal, Imran. "Development of a gas microvalve based on fine- and micromachining." Enschede : University of Twente [Host], 2007. http://doc.utwente.nl/58024.
Full textCampbell, Stuart. "Advances in femtosecond pulse laser micromachining and index waveguide inscription." Thesis, Heriot-Watt University, 2007. http://hdl.handle.net/10399/67.
Full textFanger, David J. (David James). "Variation reduction of a closed-loop precision ceramic micromachining process." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/41429.
Full textIncludes bibliographical references (p. 125-132).
by David J. Fanger.
S.M.
Balsamy, Kamaraj Abishek. "Study of Pulse Electrochemical Micromachining using Cryogenically Treated Tungsten Microtools." University of Cincinnati / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1352484381.
Full textKleine, Klaus. "Micromachining with single mode fibre lasers for medical device production." Thesis, University of Liverpool, 2009. http://livrepository.liverpool.ac.uk/1295/.
Full textJia, Chenping. "Mikromechanische Ultraschallwandler aus Silizium." Doctoral thesis, kostenfrei, 2005. http://archiv.tu-chemnitz.de/pub/2005/0175.
Full textSuzuki, Norikazu, Akihiro Nakamura, Eiji Shamoto, Kazuhiro Harada, Makoto Matsuo, and Michio Osada. "Ultraprecision Micromachining of Hardened Steel by Applying Ultrasonic Elliptical Vibration Cutting." IEEE, 2003. http://hdl.handle.net/2237/7305.
Full textKsouri, Sarah Isabelle [Verfasser], Andreas [Gutachter] Ostendorf, and Martin [Gutachter] Koch. "Optical micromachining tool / Sarah Isabelle Ksouri ; Gutachter: Andreas Ostendorf, Martin Koch." Bochum : Ruhr-Universität Bochum, 2017. http://d-nb.info/1129452395/34.
Full textLam, Eric W. (Eric Wing-Jing). "Fabrication and material characterization of silver cantilevers via direct surface micromachining." Thesis, Massachusetts Institute of Technology, 2008. http://hdl.handle.net/1721.1/45613.
Full textThis electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
Includes bibliographical references.
Microelectromechanical Systems (MEMS) rely heavily on the semiconductor industry's manufacturing paradigm. While the standardized process model allows semiconductor chips to benefit from economy of scale and be sold at low prices, MEMS devices use specialized processes and subsequently have to be sold at higher prices. This severely hinders MEMS development because it is not economically feasible to research and develop specialized devices where only small volumes are needed. As such, tools and processes which divorce MEMS fabrication from this paradigm are needed. Using Hewlett-Packard thermal inkjet technology mounted to an X-Y microcontroller stage, we present a mask-less, or direct, surface micromachining process flow with a 250°C thermal budget. The process uses Cabot Corp.'s silver-based conductive ink for the structural layer and PMMA for the sacrificial layer. Several other materials were tested for use as sacrificial inks in addition to PMMA. Silver cantilevers with dimensions of 200x50[mu]m and 200x100[mu]m were fabricated as a demonstration of the process. The silver cantilevers were mechanically characterized by using force-deflection measurements made by a P-10 contact profilometer or a Hysitron nanoindentor. We present findings of 21.9±1.50GPa or 22±1.5GPa for the silver ink's Young's modulus of elasticity, depending on the characterization method. These measurements were consistent with results measured by nanoindentating Cabot silver films. We hypothesize that the film's porosity is the cause of the silver's reduced material properties. Some preliminary data supporting this hypothesis is provided, and potential methods of improving the material properties and the surface micromachining process are discussed.
by Eric W. Lam.
S.M.
Dvorson, Leonard 1974. "Micromachining and modeling of focused field emitters for flat panel displays." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8215.
Full text"September 2001."
Includes bibliographical references (p. 120-126).
We present a comprehensive study of field emitter arrays with or without an integrated focus electrode. The former configuration is referred to as field emitter with integrated focus (IFE-FEA) or double-gate FEA (DG-FEA). The main application of IFE-FEA is to improve the resolution of field emission displays (FEDs). We developed the first analytical model of conical field emitters that captures all details of device geometry and produces quantitatively accurate closed-form expressions for the FN coefficients. A novel CMP-based process for making IFE-FEA is presented. We obtained devices with gate and focus apertures of 0.8 and 1.2 gm diameter, respectively, which is 1.5 times smaller than in any previously reported IFE-FEA. Single-gate FEAs whose gate was identical to the lower gate of the IFE-FEA were also fabricated. Their emission current was 100 nA/tip at 45 V; for IFE-FEAs with the gate and focus biased at the same potential (VG=VF) this figure was 100 nA/tip at 42 V, in agreement with the analytical model. It was deduced that the tip radius of curvature (ROC) is 2.4-3.6 nm. Analytical model, numerical simulation, and TEM micrographs all gave tip ROC values in this range. We generalized the FN equation to IFE-FEA and used 4-terminal measurements to determine gate and focus field factors, [3G and 13F. Their ratio was found to vary from 0.15 (emission current independent of focus voltage) to 2.7. We demonstrated via numerical simulation that this ratio is probably determined by the degree of gate shielding of the tip.
(cont.) We studied electron beam collimation with lowering VF at different values of VG. It was observed that the optimal VF is about 0.25VG. Beam collimation was also studied as a function of cathode-anode separation - a novel experiment. From these measurements we deduced horizontal velocity of electrons and determined that it is practically equal to zero when the beam is optimally collimated. Under optimal collimation, diameter of the spot size produced by a 5x5 array with a 40x40 ptm2 footprint on the phosphor screen biased at 5kV and located 15 mm away was at most 50 tm.
by Leonard Dvorson.
Ph.D.
Wlodarczyk, Krystian Lukasz. "Surface deformation mechanisms in laser smoothing and micromachining of optical glasses." Thesis, Heriot-Watt University, 2011. http://hdl.handle.net/10399/2430.
Full textArgyrakis, Petros. "Application of micromachining technology for bio-inspired and pressure sensing microsystems." Thesis, University of Edinburgh, 2007. http://hdl.handle.net/1842/11331.
Full textHeath, Daniel. "Digital micromirror devices and femtosecond laser pulses for rapid laser micromachining." Thesis, University of Southampton, 2017. https://eprints.soton.ac.uk/417275/.
Full textKumsa, Doe Wondwossen. "Theoretical Aspects of Selected Electrochemical Processes: Micromachining, Ohmic Microscopy and Electrocatalysis." Case Western Reserve University School of Graduate Studies / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=case1342191081.
Full textLim, Yong Chae. "Development and Demonstration of Femtosecond Laser Micromachining Processes for Biomedical Applications." The Ohio State University, 2011. http://rave.ohiolink.edu/etdc/view?acc_num=osu1313505193.
Full textJang, Shyh-Cherng, and 張世誠. "Development of Multifunctional Micromachining Center and Research of Micromachining." Thesis, 1995. http://ndltd.ncl.edu.tw/handle/15371399825742512095.
Full text國立雲林科技大學
機械工程技術研究所
83
If a microhole with diameter less than 50μm is fabricatedby traditional tooling system , the tiny tools are worn out or broken very often , and professional technicians are necessary. Especially ,it is extremel difficult to perform micromachining in some materials , e.g. SUS304 or Tungusten Carbide . The technique of electrodischarge machining E.D.M provides more advantages than traditional machining in this application area. By the heat produced by electrodischarge arc ,localized melting occurs on the surface of working parts.and the andesired mater- ials are removed . E.D.M , has been one of the most important manufaturing techniques for certain materials which are diffi- cult to fabricated . This research has an important contribu- tion in the field of precision micromachining , at the current sytage of progress in Taiwan manufacturing industry . In this research, a multifunctional micromachining center is established , by integrating E.D.M and servo control system , which can operate continuously from the preparation of microtools to the fabrication of micro f elements.The measuring microscope and SEM are used to investigate the parts made in the machine,in order to optimize the the machining conditions . In the machine developed in the laboratory microholes with diameter as 30SYMBOL 109 \f "Symbol"m and depth as 30μm have successfully fabricated . Besides promoting the technological level in the field , this research can extend vanious applications .
Hsu, Kuo-Yi, and 徐國益. "Fabrication of Si-based Suspending Antenna by Bulk-micromachining and Surface-micromachining Technologies." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/39492731827125651042.
Full text國立中山大學
電機工程學系研究所
98
For the application of 802.11a wireless communication system, this thesis aims to develop a novel suspending antenna with periodic structures to reduce electromagnetic wave from substrate using electrochemical deposition, surface micromachining and bulk micromachining technologies. This research presents two particular structures to increase the bandwidth and the radiation efficient and to reduce the return loss of the antenna, including: (i) the optimum design of periodic structures to restrain electromagnetic wave from substrate and to reduce the return loss of the antenna. To reduce the effective dielectric constant of the silicon substrate and to increase the bandwidth of the antenna, anisotropic etching the backside of the silicon substrate formed regular cavities using bulk-micromachining technology, (ii) to utilize a suspending structure to reduce the power loss through the substrate and to confirm the result using high frequency simulator. The implemented Si-based suspending antenna with periodic structures were characterized by a commercial network analyzer under 1~8 GHz testing frequency range. All the bandwidth and the return loss of the antenna proposed in this thesis are extracted by the commercial simulation software. Based on the measurement results, the center frequency is equal to 4.85 GHz, the return loss is around -35.5 dB and the bandwidth is equal to 42.9% (3.75~5.8 GHz). Eventually, this thesis successfully develops a low-loss and broadband antenna with novel structures using high frequency simulator and MEMS technologies for 802.11a wireless communication system.
Mayyas, Mohammad A. "Methodologies for automated microassembly /." 2007. http://hdl.handle.net/10106/900.
Full text翁炳國. "Silicon micromachining technique and applications." Thesis, 1992. http://ndltd.ncl.edu.tw/handle/05055598641774567988.
Full textLiu, Chia-Hung, and 劉嘉洪. "Surface Micromachining Capacitive Ultrasonic Transducers." Thesis, 2008. http://ndltd.ncl.edu.tw/handle/35783394327397040079.
Full text國立臺灣海洋大學
系統工程暨造船學系
96
This thesis presents the primary design, fabrication and measurement of the Capacitive Micromachined Ultrasonic Transducer (cMUT). Previous studies have investigated the bias effect, vibration behavior of the cMUT and optimum size of the top electrode; however, these studies did not analyze combining the resonant frequency drop of the cMUT with the effects of bias and added mass. In this thesis, reasonable boundary conditions for solving the modified Mason model, acoustic radiation impedance of medium, bias effect and added mass effect of the top electrode are all utilized to derive an accurate equivalent circuit for cMUT design. Computer simulations of the cMUT are performed and several numerical examples are computed. The modified cMUT model predicts behaviors of the cMUT’s membrane with increased accuracy, especially on the resonant frequency. The cMUT fabrication uses the full surface micromachining techniques of the Micro Electro Mechanical System (MEMS), which are compatible with integrated circuit fabrication processes, have been further developed over the recent decade. These techniques include Low Pressure Chemical Vapor Deposition (LPCVD), photolithography, Reactive Ion Etching System (RIE) dry etching, sacrificial layer wet etching, metal thermal evaporation coating and Plasma-Enhanced Chemical Vapor Deposition (PECVD). Several important issues regarding fabrication process that the bottom electrode, insulating layer, sacrificial layer, etching hole, etching channel, membrane particular, and metal electrode are discussed for optimizing the performance of the cMUT. Finally, the input impedance of the cMUT is measured and the measured result agrees with the theoretical prediction having simply supported membrane boundary conditions. The received signal has a 35 dB signal-to-noise ratio indicating that practical applications of the immersion cMUT are feasible and that the radiation pattern measurement of the cMUT array has good beamforming characteristics for underwater imaging.