Relevant bibliographies by topics / Micromachining

Academic literature on the topic 'Micromachining'

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Published: 4 June 2021
Last updated: 30 July 2024

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Journal articles on the topic "Micromachining"

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FUJITA, Hiroyuki. "Micromachining." Tetsu-to-Hagane 78, no. 2 (1992): 195–99. http://dx.doi.org/10.2355/tetsutohagane1955.78.2_195.

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Piljek, Petar, Zdenka Keran, and Miljenko Math. "Micromachining." Interdisciplinary Description of Complex Systems 12, no. 1 (2014): 1–27. http://dx.doi.org/10.7906/indecs.12.1.1.

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Yu, Zhen, Quan-Jie Gao, and Ding-Fang Chen. "Study on mathematical model of cutting force in micromachining." International Journal of Modeling, Simulation, and Scientific Computing 06, no. 04 (December 2015): 1550039. http://dx.doi.org/10.1142/s1793962315500397.

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With the development of micromachining technology, it is very important to study the mechanism of micromachining, determine the micromachining parameters and ensure the products’ quality during the micromachining process. Combined with the micro-mechanism between tool and workpiece during micromachining process, the sources of the micro-cutting force were analyzed, the micro-cutting physical model was constructed, and the microstress model interacted between the cutting arc edge of the tool and the material of the workpiece was analyzed. Combined with the surface friction and elastic extrusion mechanism between the cutting tool and workpiece, the micro-cutting force model was constructed from two aspects. The micro-cutting depth is deeper than the minimum cutting depth and the micro-cutting depth is shallower than the minimum cutting depth, then the minimum cutting depth value was calculated. Combined with the dislocation properties and microcrystal structure of workpiece’s material, the internal stress of the micromachining force model based on the gradient plasticity theory was calculated, and the force model of the micro-cutting process was studied too. It is significant to control the precision of micromachining process during the micromachining process by constructing the micromachining process force model through studying the small deformation of the material and the mechanism of micromachining.
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KAJIKAWA, Toshikazu. "Laser micromachining." Journal of the Surface Finishing Society of Japan 40, no. 8 (1989): 874–79. http://dx.doi.org/10.4139/sfj.40.874.

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Loechel, Bernd. "Surface Micromachining." Electrochemical Society Interface 4, no. 3 (September 1, 1995): 43–47. http://dx.doi.org/10.1149/2.f08953if.

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Datta, Madhav. "Electrochemical Micromachining." Electrochemical Society Interface 4, no. 2 (June 1, 1995): 32–35. http://dx.doi.org/10.1149/2.f06952if.

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Smith, James H. "Surface Micromachining." Journal of Micro/Nanolithography, MEMS, and MOEMS 2, no. 4 (October 1, 2003): 247. http://dx.doi.org/10.1117/1.1616574.

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von Alvensleben, Ferdinand, Martin Gonschior, Heiner Kappel, and Peter Heekenjann. "LASER MICROMACHINING." Optics and Photonics News 6, no. 8 (August 1, 1995): 23. http://dx.doi.org/10.1364/opn.6.8.000023.

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Brevnov, Dmitri A., Thomas C. Gamble, Plamen Atanassov, Gabriel P. López, Todd M. Bauer, Zariff A. Chaudhury, Chris D. Schwappach, and Larry E. Mosley. "Electrochemical Micromachining." Electrochemical and Solid-State Letters 9, no. 8 (2006): B35. http://dx.doi.org/10.1149/1.2206007.

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French, P. J., P. T. J. Gennissen, and P. M. Sarro. "Epi-micromachining." Microelectronics Journal 28, no. 4 (May 1997): 449–64. http://dx.doi.org/10.1016/s0026-2692(96)00069-9.

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Dissertations / Theses on the topic "Micromachining"

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Mian, Aamer Jalil. "Size effect in micromachining." Thesis, University of Manchester, 2011. https://www.research.manchester.ac.uk/portal/en/theses/size-effect-in-micromachining(91bf7280-a937-4509-9c40-4ff2e36d26c6).html.

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The world is experiencing a growing demand for miniaturised products. Micro-milling, using carbide micro tools has the potential for direct, economical manufacture of micro parts from a wide range of workpiece materials. However, in previous studies several critical issues have been identified that preclude the direct application of macro machining knowledge in the micro domain through simple dimensional analysis. The research presented in this thesis focused on some of the areas that require development of the scientific knowledge base to enable determining improved microscale cutting performance. In the mechanical micro machining of coarse grained materials, the programmed undeformed chip thickness can be lower than the length scale of the workpiece grains. Moreover, when the microstructure of such materials is composed of more than one phase, the micro cutting process can be undertaken at a length scale where this heterogeneity has to be considered. Driven by this challenge, the material microstructure 'size effect' on micro-machinability of coarse grain steel materials was investigated in this PhD. In this regard, a predominantly single phase ferritic workpiece steel material and another workpiece material with near balanced ferrite/pearlite volume fractions was studied over a range of feedrates. The results suggested that for micro machined parts, differential elastic recovery between phases leads to higher surface roughness when the surface quality of micro machined multiphase phase material is compared to that of single phase material. On the other hand, for single phase predominantly ferritic materials, reducing burr size and tool wear are major challenges. In micro machining the so called 'size effect' has been identified as critical in defining the process performance. However, an extensive literature search had indicated that there was no clear reported evidence on the effect of process variables on driving this size effect phenomenon. It is often assumed in literature that the un-deformed chip thickness was the main factor driving the size effect. This limit manufactures to only altering the feedrate to try and influence size effect. To explore the significance of a range of inputs variables and specifically, cutting variables on the size effect, micro cutting tests were conducted on Inconel 718 nickel alloy. Taguchi methodology along with signal processing techniques were applied to micro milling acoustic emission signals to identify frequency/energy bands and hence size effect specific process mechanism. The dominant cutting parameters for size effect characteristics were determined by analysis of variance. These findings show that despite most literature focussing on chip thickness as the dominant parameter on size effect, the cutting velocity is a dominant factor on size effect related process performance. This suggests that manipulating the cutting speed can also be a very effective strategy in optimising surface finish in micro machining and in breaking the lower limit of micro machining.In micro machining the lower limit of the process window is set by the minimum chip thickness. Identifying this limit is thus important for establishing the process window. Process windows are valuable guidelines for industrial selection of cutting conditions. Additionally, understanding factors that influence the value of minimum chip thickness is even more important for progressing micro machining capability to the nano-scale machining regime. For this reason, in this PhD study, acoustic emission signatures emanating from microscale milling of six different workpiece materials were characterised to identify the rubbing mode and this enabled the identification of the threshold conditions for occurrence of minimum chip thickness. The minimum chip thickness predicted by this novel approach compares reasonably well to the values that exist in published literature. Additionally, the decomposition of raw acoustic signal allowed the determination of energy levels corresponding to deformation mechanisms. The PhD work provides significant and new knowledge on the utility and importance of acoustic emission signals in characterising chip formation in micro machining. A novel method for determining the minimum chip thickness was developed, micro machining chip formation mechanisms were identified and the machinability of coarse grained multiphase material is presented.
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Hobbs, Neil Townsend. "Anisotropic etching for silicon micromachining." Thesis, Virginia Tech, 1994. http://hdl.handle.net/10919/40632.

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Silicon micromachining is the collective name for several processes by which three dimensional structures may be constructed from or on silicon wafers. One of these processes is anisotropic etching, which utilizes etchants such as KOH and ethylene diamine pyrocatechol (EDP) to fabricate structures from the wafer bulk. This project is a study of the use of KOH to anisotropically etch (lOO)-oriented silicon wafers. The thesis provides a thorough review of the theory and principles of anisotropic etching as applied to (100) wafers, followed by a few examples which serve to illustrate the theory. Next, the thesis describes the development and experimental verification of a standardized procedure by which anisotropic etching may be reliably performed in a typical research laboratory environment. After the development of this procedure, several more etching experiments were performed to compare the effects of various modifications of the etching process. Multi-step etching processes were demonstrated, as well as simultaneous doublesided etching using two different masks. The advantages and limitations of both methods are addressed in this thesis. A comparison of experiments performed at different etchant temperatures indicates that high temperatures (800 C) produces reasonably good results at a very high etch rate, while lower temperatures (500 C) are more suited to high-precision structures since they produce smoother, higher-quality surfaces.
Master of Science

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Ozkeskin, Fatih Mert. "Feedback Controlled High Frequency Electrochemical Micromachining." Texas A&M University, 2008. http://hdl.handle.net/1969.1/86041.

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Microsystem and integrated circuitry components are mostly manufactured using semiconductor technologies. Fabrication using high strength metals, for demanding aerospace, mechanical, or biomedical applications, requires novel technologies which are different from those for silicon. A promising mass production method for micro/meso scale components is electrochemical micromachining. The complex system, however, requires high precision mechanical fixtures and sophisticated instrumentation for proper process control. This study presents an electrochemical micromachining system with a closed-loop feedback control programmed using a conditional binary logic approach. The closed-loop control is realized using electrical current as the dynamic feedback signal. The control system improves material removal rate by 250% through optimizing inter electrode gap and provides robust automation reducing machining variation by 88%. The new system evokes production of higher quality microcomponents. Workpiece damage is reduced by 97% and increased feature sharpness is observed.
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Greuters, Jako. "UV laser micromachining of photonics materials." Thesis, University of Hull, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.431044.

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Key, Philip Henry. "Excimer laser micromachining of inorganic materials." Thesis, University of Hull, 1989. http://hydra.hull.ac.uk/resources/hull:11090.

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Bian, Qiumei. "Femtosecond laser micromachining of advanced materials." Diss., Kansas State University, 2012. http://hdl.handle.net/2097/15140.

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Doctor of Philosophy
Department of Industrial and Manufacturing Systems Engineering
Shuting Lei
Shuting Lei
Femtosecond (fs) laser ablation possesses unique characteristics for micromachining, notably non-thermal interaction with materials, high peak intensity, precision and flexibility. In this dissertation, the potential of fs laser ablation for machining polyurea aerogel and scribing thin film solar cell interconnection grooves is studied. In a preliminary background discussion, some key literature regarding the basic physics and mechanisms that govern ultrafast laser pulse interaction with materials and laser micromachining are summarized. First, the fs laser pulses are used to micromachine polyurea aerogel. The experimental results demonstrate that high quality machining surface can be obtained by tuning the laser fluence and beam scanning speed, which provides insights for micromachining polymers with porous structures. Second, a new fs laser micro-drilling technique is developed to drill micro-holes in stainless steel, in which a hollow core fiber is employed to transmit laser pulses to the target position. The coupling efficiency between the laser and the fiber is investigated and found to be strongly related to pulse energy and pulse duration. Third, the fs laser with various energy, pulse durations, and scanning speeds has been utilized to pattern Indium Tin Oxide (ITO) glass for thin film solar cells. The groove width decreases with increasing pulse duration due to the shorter the pulse duration the more effective of the energy used to material removal. In order to fully remove ITO without damaging the glass, the beam scanning speed need to precisely be controlled. Fourth, fs laser has been utilized to scribe Molybdenum thin film on Polyimide (PI) flexible substrate for Copper Indium Gallium Selenide (CIGS) thin film solar cells. The experimental parameters and results including ablation threshold, single- and multiple-pulse ablation shapes and ablation efficiency were discussed in details. In order to utilize the advantages of the fs lasers, the fabrication process has to be optimized for thin film patterning and structuring applications concerning both efficiency and quality. A predictive 3D Two Temperature Model (TTM) was proposed to predict ablation characteristics and help to understand the fs laser metal ablation mechanisms. 3D temperature field evolution for both electrons and lattice were demonstrated. The ablation model provides an insight to the physical processes occurring during fs laser excitation of metals. Desired processing fluence and process speed regime can be predicted by calculating the ablation threshold, ablation rate and ablation crater geometry using the developed model.
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Singh, Ramesh K. "Laser Assisted Mechanical Micromachining of Hard-to-Machine Materials." Diss., Georgia Institute of Technology, 2007. http://hdl.handle.net/1853/19803.

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There is growing demand for micro and meso scale devices with applications in the field of optics, semiconductor and bio-medical fields. In response to this demand, mechanical micro-cutting (e.g. micro-milling) is emerging as a viable alternative to lithography based micromachining techniques. Mechanical micromachining methods are capable of generating three-dimensional free-form surfaces to sub-micron level precision and micron level accuracies in a wide range of materials including common engineering alloys. However, certain factors limit the types of workpiece materials that can be processed using mechanical micromachining methods. For difficult-to-machine materials such as tool and die steels, limited machine-tool system stiffness and low tool flexural strength are major impediments to the use of mechanical micromachining methods. This thesis presents the design, fabrication and analysis of a novel Laser-assisted Mechanical Micromachining (LAMM) process that has the potential to overcome these limitations. The basic concept involves creating localized thermal softening of the hard material by focusing a solid-state continuous wave laser beam of diameter ranging from 70-120 microns directly in front of a miniature (300 microns-1 mm wide) cutting tool. By suitably controlling the laser power, spot size and speed, it is possible to produce a sufficiently large decrease in flow stress of the work material and, consequently, the cutting forces. This in turn will reduce machine/tool deflection and chances of catastrophic tool failure. The reduced machine/tool deflection yields improved accuracy in the machined feature. In order to use this process effectively, adequate thermal softening needs to be produced while keeping the heat affected zone in the machined surface to a minimum. This has been accomplished in the thesis via a detailed process characterization, modeling of process mechanics and optimization of process variables.
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Albri, Frank. "High precision laser micromachining for sensing applications." Thesis, Heriot-Watt University, 2014. http://hdl.handle.net/10399/2951.

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In this PhD thesis the development of laser-based processes for sensing applications is investigated. The manufacture of optical fibre sensors is of particular interest because fibre optics offers advantages in space constraint environments or in environments where electronic sensors fail. Laser micromilling of the transparent and mechanically challenging to machine materials sapphire and fused silica is investigated. An industrial picosecond laser providing 6 ps pulses with the ability to emit at 1030 nm (IR), 515 nm (green) and 343 nm (UV) is used for processing of these materials; providing a maximum laser pulse energy of 25 μJ at UV, 75 μJ at green and 125 μJ in IR. The UV wavelength is identified as the most reliable machining wavelength for these materials with the least amount of cracking and achieving a surface roughness Rq of just 300 nm compared to 1220 nm (green) and 1500 nm (IR) in fused silica. In sapphire the surface roughness is 420 nm using UV , with green it is 500 nm and using IR it is 800 nm. The material removal rates using this laser milling process are larger than with other micromachining techniques, hence it was applied to manufacture cantilever sensors on the end of an optical fibre. The monolithic fibre top sensor is carved out of conventional telecommunications optical fibre. The cantilever is a structure of less than 10 μm thickness, 20 μm width and 125 μm length. Using the Fabry-Perot interferometer method the sensor detects small movements with a resolution better than 15 nm. A technique is developed to correct for laser machining angles and hence generate parallel interferometer faces. An electric arc cleaning process of the laser manufactured cantilever sensors is investigated that reduces the surface roughness to 30 nm. The manufacturing process reduces manufacturing times by a factor of 100. A working sensor is demonstrated in a deflection experiment. Such short pulses are not always required to manufacture the highest resolution sensors. The manufacture of high precision optical encoder scales (pitch 8 μm, depth 200 nm) with two processes (i) ablative removal of a polyimide layer and (ii) a melt reflow process on nickel coated scales is demonstrated. Both processes are using 33 ns laser pulses at 355 nm generating a pulse energy of up to 1 mJ.
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Haneveld, Jeroen. "Nanochannel fabrication and characterization using bond micromachining." Enschede : University of Twente [Host], 2006. http://doc.utwente.nl/51105.

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Bostock, R. M. "Silicon micromachining for micro-optical device manufacture." Thesis, University of Cambridge, 1998. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.596797.

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All current laser pig-tailing methods employ either glue or a weld to secure the fibre in place. This leads to difficulty in attaining initial alignment; to movement during bonding and to instability throughout the service life. Precautions are also required to avoid device damage due to glue wicking. The approach taken in the present research is to adopt a mechanical solution, eliminating the use of either glue or a weld. In addition, this must be integrated in one part with rest of the optical system to form a compatible solution. A novel solution is developed using silicon nitride clips which hold the fibre, and are fabricated as part of the substrate. This requires the selection of a process compatible material for the clips and a method to manufacture features to allow insertion of the fibre and ensure precision alignment. The manufacture of these devices is described, both where the core of the optical fibre is below the level of the silicon substrate surface, and through the use of an extension to the process, where the fibre core is above the substrate surface. The first instance is ideal for fibre-fibre and fibre-detector connection, and the second case is required for fibre to device connection. The fabrication of these components uses innovative process steps developed through research in this work. Results of the mechanical characteristics of these devices, and of the performance under environmental testing are presented. These demonstrate that this fibre interconnection technique offers significant benefits over the current methods and that the technique meets the required environmental specifications for telecommunications components. In summary, this thesis is a description of the development of the fibre attach technique and the integration of a complete process. The research is brought to the stage where all of the steps of the complete process have been tested in practice. The results of these tests, and the results of testing working devices based on the process are presented.
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Books on the topic "Micromachining"

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H, Jansen, ed. Silicon micromachining. Cambridge: Cambridge University Press, 1998.

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A, Campbell S., and Lewerenz H. J, eds. Semiconductor micromachining. Chichester, England: Wiley, 1998.

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Davim, J. Paulo, and Mark J. Jackson, eds. Nano and Micromachining. London, UK: ISTE, 2009. http://dx.doi.org/10.1002/9780470611807.

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Osellame, Roberto, Giulio Cerullo, and Roberta Ramponi, eds. Femtosecond Laser Micromachining. Berlin, Heidelberg: Springer Berlin Heidelberg, 2012. http://dx.doi.org/10.1007/978-3-642-23366-1.

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Paulo, Davim J., and Jackson Mark J, eds. Nano and micromachining. Hoboken, NJ: John Wiley & Sons, 2008.

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Kibria, Golam, B. Bhattacharyya, and J. Paulo Davim, eds. Non-traditional Micromachining Processes. Cham: Springer International Publishing, 2017. http://dx.doi.org/10.1007/978-3-319-52009-4.

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Kunar, Sandip, Golam Kibria, and Prasenjit Chatterjee. Electro-Micromachining and Microfabrication. New York: Apple Academic Press, 2024. http://dx.doi.org/10.1201/9781003397793.

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A, McGeough J., ed. Micromachining of engineering materials. New York: Marcel Dekker, 2002.

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Jackson, Mark J. Micromachining with Nanostructured Cutting Tools. London: Springer London, 2013. http://dx.doi.org/10.1007/978-1-4471-4597-4.

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Johnstone, Robert W., and M. Parameswaran. An Introduction to Surface-Micromachining. Boston, MA: Springer US, 2004. http://dx.doi.org/10.1007/978-1-4020-8021-0.

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Book chapters on the topic "Micromachining"

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Mativenga, Paul. "Micromachining." In CIRP Encyclopedia of Production Engineering, 1–5. Berlin, Heidelberg: Springer Berlin Heidelberg, 2018. http://dx.doi.org/10.1007/978-3-642-35950-7_17-4.

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Jackson, Mark J. "Micromachining." In Micromachining with Nanostructured Cutting Tools, 1–5. London: Springer London, 2012. http://dx.doi.org/10.1007/978-1-4471-4597-4_1.

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Mativenga, Paul. "Micromachining." In CIRP Encyclopedia of Production Engineering, 873–77. Berlin, Heidelberg: Springer Berlin Heidelberg, 2014. http://dx.doi.org/10.1007/978-3-642-20617-7_17.

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Mativenga, Paul. "Micromachining." In CIRP Encyclopedia of Production Engineering, 1193–97. Berlin, Heidelberg: Springer Berlin Heidelberg, 2019. http://dx.doi.org/10.1007/978-3-662-53120-4_17.

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Juarez-Martinez, Gabriela, Alessandro Chiolerio, Paolo Allia, Martino Poggio, Christian L. Degen, Li Zhang, Bradley J. Nelson, et al. "Micromachining." In Encyclopedia of Nanotechnology, 1429. Dordrecht: Springer Netherlands, 2012. http://dx.doi.org/10.1007/978-90-481-9751-4_100434.

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Perla, Venkatasreenivasula Reddy, and K. J. Rathanraj. "Micromachining." In Advanced Manufacturing and Processing Technology, 67–110. First edition. | Boca Raton, FL : CRC Press, [2021] |: CRC Press, 2020. http://dx.doi.org/10.1201/9780429298042-4.

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El-Hofy, Hassan. "Micromachining." In Fundamentals of Machining Processes, 449–66. Third edition. | Boca Raton, FL: CRC Press/Taylor & Francis Group,: CRC Press, 2018. http://dx.doi.org/10.1201/9780429443329-16.

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Horn, Alexander, Ulrich Klug, Jan Düsing, Javier Gonzalez Moreno, Viktor Schütz, Oliver Suttmann, Ludger Overmeyer, Andreas Lenk, and Bodo Wojakowski. "Micromachining." In Springer Series in Optical Sciences, 155–73. Cham: Springer International Publishing, 2015. http://dx.doi.org/10.1007/978-3-319-17659-8_8.

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Lin, Che-Hsin. "Bulk Micromachining." In Encyclopedia of Microfluidics and Nanofluidics, 237–47. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4614-5491-5_138.

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Miao, Jianmin. "Silicon Micromachining." In Encyclopedia of Microfluidics and Nanofluidics, 3000–3010. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4614-5491-5_1412.

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Conference papers on the topic "Micromachining"

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"Silicon Micromachining." In Microprocesses and Nanotechnology '98. 1998 International Microprocesses and Nanotechnology Conference. IEEE, 1998. http://dx.doi.org/10.1109/imnc.1998.729908.

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Harvey, E. C. "Laser micromachining." In IEE Colloquium on Microengineering Technologies and How to Exploit Them. IEE, 1997. http://dx.doi.org/10.1049/ic:19970429.

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Momma, C., S. Nolte, and A. Tünnermann. "Femtosecond Micromachining." In The European Conference on Lasers and Electro-Optics. Washington, D.C.: Optica Publishing Group, 1998. http://dx.doi.org/10.1364/cleo_europe.1998.cwm1.

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For a variety of industrial micromachining applications, such as the production of injector nozzles, the machining of sophisticated medical implants and also direct medical applications (tissue removal), the highest achievable precision and a minimum invasion is required. In the past years it has been demonstrated that the ultrashort-pulse machining technique, applying solid-state femtosecond laser systems, can meet these requirements, even for very problematic, sensitive, and delicate materials, such as e g. metals [1,2] and organic tissues.
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Weinberg, Marc S., Jonathan J. Bernstein, Jeffrey T. Borenstein, J. Campbell, J. Cousens, Robert K. Cunningham, R. Fields, et al. "Micromachining inertial instruments." In Micromachining and Microfabrication '96, edited by Stella W. Pang and Shih-Chia Chang. SPIE, 1996. http://dx.doi.org/10.1117/12.251201.

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Lapshin, Konstantin E., Alexey Z. Obidin, and Sergey K. Vartapetov. "Excimer laser micromachining." In SPIE Proceedings, edited by Dan C. Dumitras, Maria Dinescu, and Vitally I. Konov. SPIE, 2007. http://dx.doi.org/10.1117/12.729649.

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Maxwell, G. "Micromachining future networks." In IEE Colloquium. Microengineering in Optics and Optoelectronics. IEE, 1999. http://dx.doi.org/10.1049/ic:19990863.

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Jahanmir, Said. "Ultrahigh Speed Micromachining." In ASME 2010 International Manufacturing Science and Engineering Conference. ASMEDC, 2010. http://dx.doi.org/10.1115/msec2010-34174.

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A new ultrahigh speed micro-spindle has been developed for micromachining that can be used at rotational speeds as high as 500,000 rpm. Since conventional ball bearings or fluid lubricated journal bearings cannot be used at speeds beyond 300,000 rpm for any extended period of time, the new spindle uses a set of journal and thrust foil bearings. The micro-spindle was integrated with a 3-axis micro-milling machine. Cutting experiments were performed on an aluminum alloy at speeds greater than 300,000 rpm using 50 and 300 micron end-mills. The increase in rotational speed to 450,000 rpm in micro-milling of aluminum alloy allowed an increase in feed rate to nearly 800 mm/min (the maximum feed rate available by the positioning stage), thus increasing the material removal rate by more than two orders of magnitude. The dimensional accuracy of several straight cuts made at different feed rates and depths of cut was measured. Theoretical models and research on machining of industrial ceramics have shown that high-speed machining allows for smaller depths of cut by each diamond grit, thus reducing the contact forces and resulting in a reduced possibility of detrimental chipping and subsurface machining damage. Therefore, micro-grinding was performed on dental ceramics to evaluate the feasibility ultrahigh speed machining. In these studies several ceramics used for preparation of dental restorations were cut with diamond tools. The propensity for generation of machining-related damage, such as surface and subsurface microcracks, were greatly reduced by machining at ultrahigh speeds and high feed rates. Micro-machining at such high speeds, and in combination with high feed rates, has never been achieved before.
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Dunare, C., W. Parkes, T. Stevenson, A. Michette, S. Pfauntsch, M. Shand, T. Button, et al. "Micromachining optical arrays." In 2010 International Semiconductor Conference (CAS 2010). IEEE, 2010. http://dx.doi.org/10.1109/smicnd.2010.5650215.

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Boogaard, Jerry. "Precision Laser Micromachining." In O-E/LASE'86 Symp (January 1986, Los Angeles), edited by Edward J. Swenson. SPIE, 1986. http://dx.doi.org/10.1117/12.956411.

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Ward, M. C. L. "Surface micromachining materials." In IEE Colloquium on Microengineering Technologies and How to Exploit Them. IEE, 1997. http://dx.doi.org/10.1049/ic:19970433.

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Reports on the topic "Micromachining"

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Alfredo M. Morales, Barry V. Hess, Dale R. Boehme, Jill M. Hruby, John S. Krafcik, Robert H. Nilson, Stewart K. Griffiths, and William D. Bonivert. LIGA Micromachining: Infrastructure Establishment. Office of Scientific and Technical Information (OSTI), February 1999. http://dx.doi.org/10.2172/5980.

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Lauf, R. J., R. F. Wood, P. H. Fleming, and M. L. Bauer. New applications of silicon micromachining. Office of Scientific and Technical Information (OSTI), June 1988. http://dx.doi.org/10.2172/7172402.

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Lippert, T. Laser micromachining of chemically altered polymers. Office of Scientific and Technical Information (OSTI), August 1998. http://dx.doi.org/10.2172/661708.

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Pellerin, J. G., D. Griffis, and P. E. Russell. Development of a focused ion beam micromachining system. Office of Scientific and Technical Information (OSTI), December 1988. http://dx.doi.org/10.2172/476649.

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Theppakuttaikomaraswamy, Senthil P. Laser Micromachining and Information Discovery Using a Dual Beam Interferometry. Office of Scientific and Technical Information (OSTI), January 2001. http://dx.doi.org/10.2172/803100.

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Campbell, Benjamin, and Jeremy Andrew Palmer. Investigation of temporal contrast effects in femtosecond pulse laser micromachining of metals. Office of Scientific and Technical Information (OSTI), June 2006. http://dx.doi.org/10.2172/887259.

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Abbott, Nicholas L., John P. Folkers, and George M. Whitesides. Manipulation of the Wettability of Surfaces on the 0.1 to 1 Micrometer Scale Through Micromachining and Molecular Self-Assembly. Fort Belvoir, VA: Defense Technical Information Center, July 1992. http://dx.doi.org/10.21236/ada254887.

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