Academic literature on the topic 'Microfluidic thermal management solution'
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Journal articles on the topic "Microfluidic thermal management solution"
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Yan, Zhibin, Mingliang Jin, Zhengguang Li, Guofu Zhou, and Lingling Shui. "Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices." Micromachines 10, no. 2 (January 25, 2019): 89. http://dx.doi.org/10.3390/mi10020089.
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Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.
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Mouskeftaras, Alexandros, Stephan Beurthey, Julien Cogan, Gregory Hallewell, Olivier Leroy, David Grojo, and Mathieu Perrin-Terrin. "Short-Pulse Laser-Assisted Fabrication of a Si-SiO2 Microcooling Device." Micromachines 12, no. 9 (August 30, 2021): 1054. http://dx.doi.org/10.3390/mi12091054.
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Thermal management is one of the main challenges in the most demanding detector technologies and for the future of microelectronics. Microfluidic cooling has been proposed as a fully integrated solution to the heat dissipation problem in modern high-power microelectronics. Traditional manufacturing of silicon-based microfluidic devices involves advanced, mask-based lithography techniques for surface patterning. The limited availability of such facilities prevents widespread development and use. We demonstrate the relevance of maskless laser writing to advantageously replace lithographic steps and provide a more prototype-friendly process flow. We use a 20 W infrared laser with a pulse duration of 50 ps to engrave and drill a 525 μm-thick silicon wafer. Anodic bonding to a SiO2 wafer is used to encapsulate the patterned surface. Mechanically clamped inlet/outlet connectors complete the fully operational microcooling device. The functionality of the device has been validated by thermofluidic measurements. Our approach constitutes a modular microfabrication solution that should facilitate prototyping studies of new concepts for co-designed electronics and microfluidics.
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Novikov, A., J. Maxa, M. Nowottnick, M. Heimann, and K. Jarchoff. "Investigation of phase change materials for efficient thermal management of electronic modules." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2019, HiTen (July 1, 2019): 000045–51. http://dx.doi.org/10.4071/2380-4491.2019.hiten.000045.
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Abstract Power electronics is a key technology for the advancement and spreading of electromobility applications and compact power supply devices on the market. The use of new WBG semiconductors (e.g. SiC, GaN) as well as highly integrated silicon-based power electronics enables a significant increase in power density with increasing integration. At the same time, however, this development requires costly thermal management solutions, since the power semiconductors generate considerable heat loss during operation. To ensure the robustness of the systems, the components must be protected from critical temperatures. Nowadays, a considerable effort for active and passive cooling by fans, microfluidic systems or heat pipes is operated. Compared with that, the usage of phase change materials (PCM) is a novel approach for sophisticated thermal management [1], [2]. In this paper some selected results of research project SWE-eT (Heat-retaining coatings for next-generation, efficient, compact power electronics) funded as part of KomroL program (Compact and robust power electronics of the next generation) of German Federal Ministry of Education and Research are presented. Main goal of this project is development, investigation and testing of efficient thermal management solutions based on heat-storing layer systems through phase transition processes. The research project was focused on investigation of sugar alcohols as PCM because of its wide range of melting temperature, high enthalpy of fusion and low cost.
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Flemming, Jeb, Roger Cook, Kevin Dunn, and James Gouker. "Cost-Effective Precision 3D Glass Microfabrication for Advanced Packaging Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 000791–810. http://dx.doi.org/10.4071/2012dpc-tp12.
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Today's packaging has become the limiting element in system cost and performance for IC development. Assembly and packaging technologies have become primary differentiators for manufactures of consumer electronics and the main enabler of small IC product development. Traditional packaging approaches to address the needs in these “High Density Portable” devices, including FR4, liquid crystal polymers, and Low Temperature Co-Fire Ceramics, are running into fundamental limits in packaging layer thinness, high density interconnects (HDI) size and density, and do not present solutions to in-package thermal management, and optical waveguiding. In this talk, 3D Glass Solutions will present on our efforts to create advanced microelectronic packing solutions using our APEX™ Glass ceramic which offers a single material capable of being simultaneously used for ultra-HDI through glass vias (TGVs), optical waveguiding, and in-package microfluidic cooling. In this talk we will discuss our latest results in wafer-level microfabrication of packaging solutions. We will present on our efforts for creating copper filled vias, surface metallization, and passivation. Furthermore, we will present our efforts in exploring this material to produce (1) ultra-HDI glass interposers, with TGVs as small as 12 microns, with 14 micron center –to-center, (2) advanced RF packages with unique surface architectures designed to minimize signal loss, and (3) creating wave guiding structures in HDI packages.
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N.S., Shashikumar, Gireesha B.J., B. Mahanthesh, and Prasannakumara B.C. "Brinkman-Forchheimer flow of SWCNT and MWCNT magneto-nanoliquids in a microchannel with multiple slips and Joule heating aspects." Multidiscipline Modeling in Materials and Structures 14, no. 4 (December 3, 2018): 769–86. http://dx.doi.org/10.1108/mmms-01-2018-0005.
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Purpose The microfluidics has a wide range of applications, such as micro heat exchanger, micropumps, micromixers, cooling systems for microelectronic devices, fuel cells and microturbines. However, the enhancement of thermal energy is one of the challenges in these applications. Therefore, the purpose of this paper is to enhance heat transfer in a microchannel flow by utilizing carbon nanotubes (CNTs). MHD Brinkman-Forchheimer flow in a planar microchannel with multiple slips is considered. Aspects of viscous and Joule heating are also deployed. The consequences are presented in two different carbon nanofluids. Design/methodology/approach The governing equations are modeled with the help of conservation equations of flow and energy under the steady-state situation. The governing equations are non-dimensionalized through dimensionless variables. The dimensionless expressions are treated via Runge-Kutta-Fehlberg-based shooting scheme. Pertinent results of velocity, skin friction coefficient, temperature and Nusselt number for assorted values of physical parameters are comprehensively discussed. Also, a closed-form solution is obtained for momentum equation for a particular case. Numerical results agree perfectly with the analytical results. Findings It is established that multiple slip effect is favorable for velocity and temperature fields. The velocity field of multi-walled carbon nanotubes (MWCNTs) nanofluid is lower than single-walled carbon nanotubes (SWCNTs)-nanofluid, while thermal field, Nusselt number and drag force are higher in the case of MWCNT-nanofluid than SWCNT-nanofluid. The impact of nanotubes (SWCNTs and MWCNTs) is constructive for thermal boundary layer growth. Practical implications This study may provide useful information to improve the thermal management of microelectromechanical systems. Originality/value The effects of CNTs in microchannel flow by utilizing viscous dissipation and Joule heating are first time investigated. The results for SWCNTs and MWCNTs have been compared.
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Batishcheva, KSENIA A., and ATLANT E. Nurpeiis. "WATER DROPLET EVAPORATION IN A CHAMBER ISOLATED FROM THE EXTERNAL ENVIRONMENT." Tyumen State University Herald. Physical and Mathematical Modeling. Oil, Gas, Energy 6, no. 3 (2020): 8–22. http://dx.doi.org/10.21684/2411-7978-2020-6-3-8-22.
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With an increase in the productivity of power equipment and the miniaturization of its components, the use of traditional thermal management systems becomes insufficient. There is a need to develop drip heat removal systems, based on phase transition effects. Cooling with small volumes of liquids is a promising technology for microfluidic devices or evaporation chambers, which are self-regulating systems isolated from the external environment. However, the heat removal during evaporation of droplets into a limited volume is a difficult task due to the temperature difference in the cooling device and the concentration of water vapor that is unsteady in time depending on the mass of the evaporated liquid. This paper presents the results of an experimental study of the distilled water microdrops’ (5-25 μl) evaporation on an aluminum alloy AMg6 with the temperatures of 298-353 K in an isolated chamber (70 × 70 × 30 mm3) in the presence of heat supply to its lower part. Based on the analysis of shadow images, the changes in the geometric dimensions of evaporating drops were established. They included the increase in the contact diameter, engagement of the contact line due to nano roughening and chemical composition inhomogeneous on the surface (90-95% of the total evaporation time) of the alloy and a decrease in the contact diameter. The surface temperature and droplet volume did not affect the sequence of changes in the geometric dimensions of the droplets. It was found that the droplet volume has a significant effect on the evaporation time at relatively low substrate temperatures. The results of the analysis of droplet evaporation rates and hygrometer readings have shown that reservoirs with salt solutions can be used in isolated chambers to control the concentration of water vapor. The water droplets evaporation time was determined. The analysis of the time dependences of the evaporation rate has revealed that upon the evaporation of droplets in an isolated chamber under the conditions of the present experiment, the air was not saturated with water vapor. The latter did not affect the evaporation rate.
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Kroehnert, Steffen, André Cardoso, Steffen Kroehnert, Raquel Pinto, Elisabete Fernandes, and Isabel Barros. "Integration of MEMS in Fan-Out Wafer-Level Packaging Technology based System-in-Package (WLSiP)." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2017, DPC (January 1, 2017): 1–23. http://dx.doi.org/10.4071/2017dpc-tp2_presentation6.
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The Internet of Things/ Everything (IoT/E) will require billions of single or multiple MEMS/Sensors integrated in modules together with other functional building blocks like processor, memory, connectivity, built-in security, power management, energy harvesting, and battery charging. The success of IoT/E will also depend on the selection of the right Packaging Technology. The winner will be the one achieving the following key targets: best electrical and thermal system performance, miniaturization by dense system integration, effective MEMS/Sensors fusion into the systems, manufacturability in high volume at low cost. MEMS/Sensors packaging in low cost molded packages on large manufacturing formats has always been a challenge, whether because of the parameter drift of the sensors caused by the packaging itself or, as in many cases, the molded packaging technology is not compatible to the way MEMS/Sensors are working. Wafer-Level Packaging (WLP), namely Fan-Out WLP (FOWLP) technologies such as eWLB, WLFO, RCP, M-Series and InFO are showing good potential to meet those requirements and offer the envisioned system solutions. FOWLP will grow with CAGR between 50–80% until 2020, forecasted by the leading market research companies in this field. System integration solutions (WLSiP and WL3D) will dominate FOWLP volumes in the future compared to current single die FOWLP packages for mobile communication. The base technology is available and has proven maturity in high volume production, but for dense system integration of MEMS/Sensors, additional advanced building blocks need to be developed and qualified to extend the technology platform. The status and most recent developments on NANIUM's WLFO technology, which is based on Infineon's/Intel's eWLB technology, aiming to overcome the current limits for MEMS/Sensors integration, will be presented in this paper. This will cover the processing of Keep-Out Zones (KOZ) for MEMS/Sensors access to environment in molded wafer-level packages, mold stress relief on dies for MEMS/Sensors die decoupling from internal package stress, thin-film shielding using PVD seed layer as functional layer, and heterogeneous dielectrics stacking, in which different dielectric materials fulfill different functions in the package, including the ability to integrate Microfluidic.
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Nieto, C., H. Power, and M. Giraldo. "Boundary element solution of thermal creep flow in microfluidic devices." Engineering Analysis with Boundary Elements 36, no. 7 (July 2012): 1062–73. http://dx.doi.org/10.1016/j.enganabound.2012.01.001.
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Guo, Gang, Xuanye Wu, Demeng Liu, Lingni Liao, Di Zhang, Yi Zhang, Tianjiao Mao, et al. "A Self-Regulated Microfluidic Device with Thermal Bubble Micropumps." Micromachines 13, no. 10 (September 28, 2022): 1620. http://dx.doi.org/10.3390/mi13101620.
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Currently, many microchips must rely on an external force (such as syringe pump, electro-hydrodynamic pump, and peristaltic pump, etc.) to control the solution in the microchannels, which probably adds manual operating errors, affects the accuracy of fluid manipulation, and enlarges the noise of signal. In addition, the reasonable integration of micropump and microchip remain the stumbling block for the commercialization of microfluidic technique. To solve those two problems, we designed and fabricated a thermal bubble micropump based on MEMS (micro-electro-mechanical systems) technique. Many parameters (voltage, pulse time, cycle delay time, etc.) affecting the performance of this micropump were explored in this work. The experimental results showed the flow rate of solution with the assistance of a micropump reached more than 15 μL/min in the optimal condition. Finally, a method about measuring total aflatoxin in Chinese herbs was successfully developed based on the integrated platform contained competitive immunoassay and our micropump-based microfluidics. Additionally, the limit of detection in quantifying total aflatoxin (AF) was 0.0615 pg/mL in this platform. The data indicate this combined technique of biochemical assays and micropump based microchip have huge potential in automatically, rapidly, and sensitively measuring other low concentration of biochemical samples with small volume.
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Sisó, Gonzalo, Joana Rosell-Mirmi, Álvaro Fernández, Gerard Laguna, Montse Vilarrubi, Jérôme Barrau, Manuel Ibañez, and Joan Rosell-Urrutia. "Thermal Analysis of a MEMS-Based Self-Adaptive Microfluidic Cooling Device." Micromachines 12, no. 5 (April 30, 2021): 505. http://dx.doi.org/10.3390/mi12050505.
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This study presents a thermal analysis of a temperature-driven microfluidic cell through a nonlinear self-adaptive micro valve that provides the mechanisms for the system to maintain a given critical temperature in an efficient way. For the description of the dynamics of the microfluidic cell, a system of two ordinary differential equations subjected to a nonlinear boundary condition, which describes the behavior of the valve, is proposed. The solution of the model, for determined conditions, shows the strong nonlinearity between the overall thermal resistance of the device and the heat flux dissipated due to the action of the thermostatic valve, obtaining a variable thermal resistance from 1.6 × 10−5 to 2.0 × 10−4 Km2/W. In addition, a stability analysis of the temperature-driven microfluidic cell is presented. The stability of the device is essential for its proper functioning and thus, to prevent its oscillating behavior. Therefore, this work focuses on assessing the range of design parameters of the self-adaptive micro valve to produce a stable behavior for the entire system. The stability analysis was performed by studying the linear perturbation around the stationary solution, with the model solved for various heat flows, flow rates, and critical temperatures. Finally, a map of the design parameters space, which specifies the region with asymptotic stability, was found. In this map, the critical temperature (temperature at which the valve initiates the buckling) plays and important role.
Dissertations / Theses on the topic "Microfluidic thermal management solution"
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Wang, Yong. "Microfluidic technology for integrated thermal management: micromachined synthetic jet." Diss., Georgia Institute of Technology, 2003. http://hdl.handle.net/1853/5438.
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Zhu, Yangying. "Magnetic tunable microstructured surfaces for thermal management and microfluidic applications." Thesis, Massachusetts Institute of Technology, 2013. http://hdl.handle.net/1721.1/82355.
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Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.Cataloged from PDF version of thesis.
Includes bibliographical references (p. 46-47).
Micro and nanostructured surfaces have broad applications including heat transfer enhancement in phase-change systems and liquid manipulation in microfluidic devices. While significant efforts have focused on fabricating static micro/nanostructured arrays, uniform arrays that can be dynamically tuned have not yet been demonstrated. In this work, we present a novel fabrication process for magnetically tunable microstructured surfaces, where the tilt angle can be controlled upon application of an external magnetic field. We also demonstrated this platform for droplet manipulation in heat transfer applications. The tunable surfaces consist of ferromagnetic nickel (Ni) pillars on a soft PDMS substrate. The pillars have diameters of 23-35 [mu]m, pitches of 60-70 [mu]m, and heights of 70-80 [mi]m. We used vibrating sample magnetometry to obtain hysteresis loops of the Ni pillar arrays which match well the properties of bulk Ni. With a field strength of 0.5 tesla and a field angle of 600, a uniform 10.5± 1 tilt angle of the pillar arrays was observed. Furthermore, we developed a model to capture the tilt angle as a function of the magnetic field, and showed that by replacing nickel to cobalt, the tilt angle could be increased to 30' with the same field. Meanwhile, simulations show good agreement with the experiments. Future work will focus on using these surfaces to actively transport water droplets and spread the liquid film via pillar movement. This work promises tunable surface designs for important device platforms in microfluidics, biological and optical applications.
by Yangying Zhu.
S.M.
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Yalcin, Fidan Seza. "Cfd Analysis Of A Notebook Computer Thermal Management Solution." Master's thesis, METU, 2008. http://etd.lib.metu.edu.tr/upload/12609483/index.pdf.
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In this study, the thermal management system of a notebook computer is investigated by using a commercial finite volume Computational Fluid Dynamics (CFD) software. After taking the computer apart, all dimensions are measured and all major components are modeled as accurately as possible. Heat dissipation values and necessary characteristics of the components are obtained from the manufacturer's specifications. The different heat dissipation paths that are utilized in the design are investigated. Two active fans and aluminum heat dissipation plates as well as the heat pipe system are modeled according to their specifications. The first and second order discretization schemes as well as two different mesh densities are investigated as modeling choices. Under different operating powers, adequacy of the existing thermal management system is observed. Average and maximum temperatures of the internal components are reported in the form of tables. Thermal resistance networks for five different operating conditions are obtained from the analysis of the CFD simulation results. Temperature distributions on the top surface of the chassis where the keyboard and touchpad are located are investigated considering the user comfort.
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Redmond, Matthew J. "Thermal management of 3-D stacked chips using thermoelectric and microfluidic devices." Thesis, Georgia Institute of Technology, 2013. http://hdl.handle.net/1853/50240.
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This thesis employs computational and experimental methods to explore hotspot cooling and high heat flux removal from a 3-D stacked chip using thermoelectric and microfluidic devices. Stacked chips are expected to improve microelectronics performance, but present severe thermal management challenges. The thesis provides an assessment of both thermoelectric and microfluidic technologies and provides guidance for their implementation in the 3-D stacked chips.
A detailed 3-D thermal model of a stacked electronic package with two dies and four ultrathin integrated TECs is developed to investigate the efficacy of TECs in hotspot cooling for 3-D technology. The numerical analysis suggests that TECs can be used for on demand cooling of hotspots in 3-D stacked chip architecture. A strong vertical coupling is observed between the top and bottom TECs and it is found that the bottom TECs can detrimentally heat the top hotspots. As a result, TECs need to be carefully placed inside the package to avoid such undesired heating. Thermal contact resistances between dies, inside the TEC module, and between the TEC and heat spreader are shown to significantly affect TEC performance.
TECs are most effective for cooling localized hotspots, but microchannels are advantageous for cooling large background heat fluxes. In the present work, the results of heat transfer and pressure drop experiments in the microchannels with water as the working fluid are presented and compared to the previous microchannel experiments and CFD simulations. Heat removal rates of greater than 100 W/cm2 are demonstrated with these microchannels, with a pressure drop of 75 kPa or less. A novel empirical correlation modeling method is proposed, which uses finite element modeling to model conduction in the channel walls and substrate, coupled with an empirical correlation to determine the convection coefficient. This empirical correlation modeling method is compared to resistor network and CFD modeling. The proposed modeling method produced more accurate results than resistor network modeling, while solving 60% faster than a conjugate heat transfer model using CFD.
The results of this work demonstrate that microchannels have the ability to remove high heat fluxes from microelectronic packages using water as a working fluid. Additionally, TECs can locally cool hotspots, but must be carefully placed to avoid undesired heating. Future work should focus on overcoming practical challenges including fabrication, cost, and reliability which are preventing these technologies from being fully leveraged.
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Cruz, Ethan E. "Coupled inviscid-viscous solution methodology for bounded domains: Application to data center thermal management." Diss., Georgia Institute of Technology, 2015. http://hdl.handle.net/1853/54316.
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Computational fluid dynamics and heat transfer (CFD/HT) models have been employed as the dominant technique for the design and optimization of both new and existing data centers. Inviscid modeling has shown great speed advantages over the full Navier-Stokes CFD/HT models (over 20 times faster), but is incapable of capturing the physics in the viscous regions of the domain. A coupled inviscid-viscous solution method (CIVSM) for bounded domains has been developed in order to increase both the solution speed and accuracy of CFD/HT models. The methodology consists of an iterative solution technique that divides the full domain into multiple regions consisting of at least one set of viscous, inviscid, and interface regions. The full steady, Reynolds-Averaged Navier-Stokes (RANS) equations with turbulence modeling are used to solve the viscous domain, while the inviscid domain is solved using the Euler equations. By combining the increased speed of the inviscid solver in the inviscid regions, along with the viscous solver’s ability to capture the turbulent flow physics in the viscous regions, a faster and potentially more accurate solution can be obtained for bounded domains that contain inviscid regions which encompass more than half of the domain, such as data centers.
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Wang, Qian. "Analysing and evaluating a thermal management solution via heat pipes for lithium-ion batteries in electric vehicles." Thesis, University of Nottingham, 2015. http://eprints.nottingham.ac.uk/29358/.
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Thermal management is crucial in many engineering applications because it affects the electrical, material, and other properties of the system. A recent study focuses on the use of heat pipes for battery thermal management in electric vehicles, which explores a new area for heat pipe applications. The battery, as one and only energy source in an EV, establishes a vital barrier for automotive industry because it can make the car more expensive and less reliable. The modelling methodology developed in this thesis is a one-dimensional electrochemical model, decoupled and coupled with a three-dimensional flow and heat transfer model. A prototype for 2-cell prismatic battery cooling and preheating using heat pipes is developed, and a full experimental characterisation has been performed. The experimental results characterised system thermal performance as well as validating material properties/parameters for simulation inputs. Two surrogate cells filled with atonal 324 were used in this experiment. The eligibility of substituting atonal 324 for lithium-ion battery electrolytes has been assessed and confirmed. The consistency demonstrated between the finite element analysis and the experiment facilitates BTM simulation at pack level, which is a scale-up model containing 30 lithium-ion batteries. The study shows that heat pipes can be very beneficial to reduce thermal stress on batteries leading to thermally homogenous packs. Additionally, an attempt of integrating biomimetic wicks for ultra-thin flat plate heat pipes is made in response to space limitations in microelectronics cooling. To date, no one has devised an ultra-thin FPHP with enough vapour space by constructing different wicks for each heat pipe segment, especially under anti-gravity condition. It is thus interesting to see whether a new type of wick structure can be made to achieve an optimum heat transfer potential.
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Wilson, Scott E. "Investigation of Copper Foam Coldplates as a High Heat Flux Electronics Cooling Solution." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/6944.
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Compact heat exchangers such as porous foam coldplates have great potential as a high heat flux cooling solution for electronics due to their large surface area to volume ratio and tortuous coolant path. The focus of this work was the development of unit cell modeling techniques for predicting the performance of coldplates with porous foam in the coolant path.
Multiple computational fluid dynamics (CFD) models which predict porous foam coldplate pressure drop and heat transfer performance were constructed and compared to gain insight into how to best translate the foam microstructure into unit cell model geometry. Unit cell modeling in this study was realized by applying periodic boundary conditions to the coolant entrance and exit faces of a representative unit cell. A parametric study was also undertaken which evaluated dissimilar geometry translation recommendations from the literature. The use of an effective thermal conductivity for a representative orthogonal lattice of rectangular ligaments was compared to a porosity-matching technique of a similar lattice. Model accuracy was evaluated using experimental test data collected from a porous copper foam coldplate using deionized water as coolant. The compact heat exchanger testing facility which was designed and constructed for this investigation was shown to be capable of performing tests with coolant flow rates up to 300 mL/min and heat fluxes up to 290 W/cm2. The greatest technical challenge of the testing facility design proved to be the method of applying the heat flux across a 1 cm2 contact area. Based on the computational modeling results and experimental test data, porous foam modeling recommendations and porous foam coldplate design suggestions were generated.
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Sinha, Ashish. "An adsorption based cooling solution for electronics used in thermally harsh environments." Diss., Georgia Institute of Technology, 2010. http://hdl.handle.net/1853/37077.
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Growing need for application of electronics at temperatures beyond their rated limit, (usually > 150 °C) and the non availability of high temperature compatible electronics necessitates thermal management solutions that should be compact, scalable, reliable and be able to work in environments characterized by high temperature (150 -250 °C), mechanical shock and vibrations. In this backdrop the proposed research aims at realization of an adsorption cooling system for evaporator temperatures in the range of 140 °C-150 °C, and condenser temperature in the range of 160 °C-200 °C. Adsorption cooling systems have few moving parts (hence less maintenance issues), and the use of Thermo-Electric (TE) devices to regenerate heat of adsorption in between adsorbent beds enhances the compactness and efficiency of the overall 'ThermoElectric-Adsorption' (TEA) system. The work presented identifies the challenges involved and respective solutions for high temperature application. An experimental set up was fabricated to demonstrate system operation and mathematical models developed to benchmark experimental results. Also, it should be noted that TEA system comprises TE and adsorption chillers. A TE device can be a compact cooler in its own right. Hence a comparison of the performance of TEA and TE cooling systems has also been presented.
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Prieto, herrera Rafael. "Développement d'une solution de répartition de la chaleur émise par les points chauds en co-intégration avec les technologies CMOS." Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT113/document.
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On assiste aujourd’hui au développement massif des technologies nomades. L’utilisation de boîtiers compacts est ainsi en plein croissance, non seulement à cause des téléphones portables et tablettes, mais aussi à cause de l’introduction massive de l’électronique dans les appareils portables de la vie quotidienne. La microélectronique embarquée dans ces appareils représente le principal outil d’information et de communication des personnes avec le monde extérieur. Le rythme de développement de ces technologies dans les dernières années est tel que les possibilités d’utilisation des appareils portables d’aujourd’hui étaient de la science-fiction il y a seulement 10 ans.Les fonctionnalités qui verront le jour dans les années à venir ne peuvent donc pas toutes être encore imaginées. Ces fonctionnalités vont toutefois très certainement impliquer une augmentation des performances de calcul des dispositifs, et par conséquent de la chaleur qu’ils dissipent.Aujourd’hui, on envisage des puces complexes comprenant plusieurs niveaux logiques et basées sur technologies hétérogènes. On demande également que ces technologies soient intégrées dans les appareils utilisés dans la vie quotidienne, qu’ils soient connectés entre eux et qu’ils réagissent de façon intelligente. Les stratégies de dissipation de la chaleur doivent donc être en adéquation avec la réduction des dimensions des dispositifs de la microélectronique.L’objectif de la thèse présentée dans ce manuscrit est ainsi d’étudier les stratégies de dissipation thermique des boîtiers compacts avec l’aide de répartiteurs de chaleur intégrés. Ce travail porte sur la caractérisation des performances et contraintes des répartiteurs thermiques avec matériaux carbonés. Les répartiteurs sont capables de dissiper sur sa surface la chaleur produite dans un point chaud.Afin d’étudier le phénomène de la dissipation avec un répartiteur, on a mis en place une méthodologie qui prend en compte le caractère multiniveau de la dissipation thermique. L’objectif est de pouvoir se concentrer sur l’interaction entre le répartiteur thermique et chacun des éléments de l’ensemble. On a réutilisé deux véhicules de test et on a désigné un véhicule de test spécifique pour l’étude de la thermique des puces imageurs.Les travaux sont basés sur deux axes : Les études d’intégration et les études thermiques. Les études d’intégration prennent en compte les contraintes dérivées de l’implémentation des couches répartiteurs dans des boitiers compactes. On se concentre d’abord sur les procès d’implémentation des couches répartiteurs au sein de l’ensemble dans un procès industriel. Ensuite on étudie les effets thermomécaniques et les effets sur l’intégrité des signaux à haute fréquence.Les études thermiques caractérisent le gain en performances dérivé de cette intégration. On analyse ces phénomènes thermiques avec des mesures et des simulations. Premièrement au niveau silicium et répartiteur, deuxièmement au niveau boitier et finalement on se concentre sur les effets dans une puce et boitier imageur.A la lumière des résultats on peut dire que les matériaux carbonés se présentent comme l’alternative plus intéressante pour l’implémentation à grande échelle de répartiteurs dans des boitiers compacts. Cette implémentation sera poussée par la recherche des prestations dans des boitiers de plus en plus complexes et hétérogènes, ou l’empreinte du répartiteur doit être minimale. La combination des couches de carbone a tous les niveaux du boitier, avec des TIMs des épaisseurs réduites sera la tendance dans les années à venir pour ce type de dispositifs.Cette thèse s’inscrit dans le cadre d’une collaboration tripartie entre le CEA-LETI de Grenoble, le laboratoire G2Elab de l’INP Grenoble et STMicroelectronics à CrollesWe witness today an explosion of nomadic technologies. Portable devices have become the main tool that people use to connect with the rest of the world. The microelectronics embedded in these devices is the technology that drives this process. The pace of development of these technologies is such that the versatility of portable devices today were science fiction only 10 years ago.The functionalities that will be integrated in the coming years cannot be imagined yet. These features will imply an increase of the computing demands, and consequently, of the heat dissipated inside them. The trend leads to complex stacks with heterogeneous modules of heat dissipating layers.These technologies will be integrated in everyday life. Internet of Things, as we call it, will demand an increasing amount of independent low footprint devices that will be connected. Heat dissipation strategies must therefore be compatible with increasingly smaller dimensions. Compact packages demand is growing rapidly, not only because of telephones and tablets, but also because of the massive introduction of electronics into in everyday life devices.The objective of the thesis is to study the integration of heat-spreaders in compact packages to enhance its thermal performance. This work goes deeply in the characterization of the thermal performance of carbon-base heat spreaders. Heat-spreaders are able to extract the heat produced in hot spots and transport it along its surface.In order to study the heat spreading phenomenon, a methodology that takes into account the multi-level nature of heat dissipation has been implemented. The objective is to be able to focus on the interaction between the heat-spreader and each one of the elements of the package stack. Two test vehicles have been re-used from previous works. A specific test vehicle was also design in order to emulate the thermal behavior of imaging sensors.The thesis is based on two main axes: Integration studies and thermal studies. The integration studies take into account the constraints derived from the implementation of heat spreaders in compact packages. Firstly, we focus on the implementation processes within an industrial process. Latelly, we study the thermomechanical effects of heat spreaders and the impact on the integrity of high frequency signals.Thermal studies are aimed to characterize the performance gain derived from this heat spreader integration. The thermal phenomena are analyzed with measurements and simulations. First at silicon and interface level, then at package level, finally we focus on the effects in image sensor die and package.In the light of the results it can be said that carbon based materials are the most interesting alternative for large-scale implementation of heat spreaders in compact packages. This implementation will be driven by the research of new functionalities and performances in compact packages. The heat spreader will have to perform while maintaining a minimal footprint. The combination of carbon layers at all package levels, along with reduced thermal interface thickness will be the trend in the coming years for this type of device.This thesis is part of a tripartite collaboration between the CEA-LETI of Grenoble, the G2Elab laboratory of the INP Grenoble and STMicroelectronics in Crolles
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Narayanan, Shankar. "Gas assisted thin-film evaporation from confined spaces." Diss., Georgia Institute of Technology, 2011. http://hdl.handle.net/1853/42780.
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A novel cooling mechanism based on evaporation of thin liquid films is presented for thermal management of confined heat sources, such as microprocessor hotspots. The underlying idea involves utilization of thin nanoporous membranes for maintaining microscopically thin liquid films by capillary action, while providing a pathway for the vapor generated due to evaporation at the liquid-vapor interface. The vapor generated by evaporation is continuously removed by using a dry sweeping gas keeping the membrane outlet dry. This thesis presents a detailed theoretical, computational and experimental investigation of the heat and mass transfer mechanisms that result in dissipating heat.
Performance analysis of this cooling mechanism demonstrates heat fluxes over 600W/cm2 for sufficiently thin membrane and film thicknesses (~1-5µm) and by using air jet impingement for advection of vapor from the membrane surface. Based on the results from this performance analysis, a monolithic micro-fluidic device is designed and fabricated incorporating micro and nanoscale features. This MEMS/NEMS device serves multiple functionalities of hotspot simulation, temperature sensing, and evaporative cooling. Subsequent experimental investigations using this microfluidic device demonstrate heat fluxes in excess of 600W/cm2 at 90 C using water as the evaporating coolant.
In order to further enhance the device performance, a comprehensive theoretical and computational analysis of heat and mass transfer at micro and nanoscales is carried out. Since the coolant is confined using a nanoporous membrane, a detailed study of evaporation inside a nanoscale cylindrical pore is performed. The continuum analysis of water confined within a cylindrical nanopore determines the effect of electrostatic interaction and Van der Waals forces in addition to capillarity on the interfacial transport characteristics during evaporation. The detailed analysis demonstrates that the effective thermal resistance offered by the interface is negligible in comparison to the thermal resistance due to the thin film and vapor advection. In order to determine the factors limiting the performance of the MEMS device on a micro-scale, a device-level detailed computational analysis of heat and mass transfer is carried out, which is supported by experimental investigation. Identifying the contribution of various simultaneously occurring cooling mechanisms at different operating conditions, this analysis proposes utilization of hydrophilic membranes for maintaining very thin liquid films and further enhancement in vapor advection at the membrane outlet to achieve higher heat fluxes.
Book chapters on the topic "Microfluidic thermal management solution"
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Zamora, William Rolando Miranda, Susana Soledad Chinchay Villarreyes, Nelly Luz Leyva Povis, Leandro Alonso Vallejos More, Manuel Jesús Sánchez Chero, Cynthia Milagros Apaza Panca, and María Verónica Seminario Morales. "A New Mathematical Solution for Packaged Food Thermal Processing." In Advances in Manufacturing, Production Management and Process Control, 383–87. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-51981-0_49.
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Banerjee, Sayan, and Koushik Ghosh. "Mixed Convection Condensation of Vapor with Non-condensable Gas Over a Vertical Plate: ODE-Based Integral Solution." In Advances in Thermal Engineering, Manufacturing, and Production Management, 101–15. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-2347-9_9.
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Pradhan, Tenzing Dorjee, B. B. Pradhan, and A. P. Tiwary. "Shifting the Focus from Macro- to Micro-waste to Energy (WTE) Plants as a Solution to the Solid Waste Management." In Advances in Thermal Engineering, Manufacturing, and Production Management, 171–79. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-2347-9_14.
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Brück, Rolf, Manuel Presti+, Mathias Keck, Johannes Dengler, and Manuel Faiß. "Thermal Management on Demand; the Exhaust Aftertreatment Solution for Future Heavy Duty Application." In Proceedings, 387–99. Wiesbaden: Springer Fachmedien Wiesbaden, 2021. http://dx.doi.org/10.1007/978-3-658-35588-3_22.
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van Erp, Remco, and Elison Matioli. "Microfluidic cooling for GaN electronic devices." In Thermal Management of Gallium Nitride Electronics, 407–39. Elsevier, 2022. http://dx.doi.org/10.1016/b978-0-12-821084-0.00013-5.
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Hilgers, T. "Thermally conductive plastics: a mineral solution – Thermal management in thermoplastics and thermosets." In Plastics in Automotive Engineering 2016, 193–204. VDI Verlag, 2016. http://dx.doi.org/10.51202/9783182443438-193.
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Satapathy, Suchismita, and Jitendra Narayan Biswal. "Thermal Power Sector Sustainability." In Handbook of Research on Ergonomics and Product Design, 381–401. IGI Global, 2018. http://dx.doi.org/10.4018/978-1-5225-5234-5.ch021.
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Sustainable supply chain management (SSCM) practices in thermal power plants is dependent on mostly three pillars: social factor, economic factor, and environmental factor. So, in this chapter, sustainable supply chain management of Indian thermal power sector is evaluated. Artificial neural network (ANN) method is implemented to measure whether the benefits of sustainable supply chain management are achieved after practices of sustainable supply chain management in Indian thermal power sector. This chapter also designs a framework by QFD (quality function deployment) method to find solution for some unsatisfactory measures (inputs in sustainable factors) that are not achieved against outputs. As sustainable supply chain management practices in thermal power plants are influenced by a significant number of interrelated enablers and barriers, the drivers or enablers of SSCM are taken as the design requirement to improve SSCM in thermal power industries, and the most important driver is prioritized against the unsatisfied measurands in thermal power sector.
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Akgün, Mustafa. "Magnetic Nanoparticles for Environmental Management." In Green Chemistry for the Development of Eco-Friendly Products, 174–89. IGI Global, 2022. http://dx.doi.org/10.4018/978-1-7998-9851-1.ch008.
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Magnetic nanoparticles are an emerging technique that has attracted attention in recent years in nanotechnology, biomedical, electronics, environmental science, and engineering applications. Nanoparticles have optical, electrical, catalytic, and thermal properties with their supermagnetic properties, large surface area, and biocompatibility. The major benefit of using nanoparticles is that due to their size, they can be accurately oriented and can be targeted and interacted with a specific biological entity or marker. In addition, it is easy to separate the magnetic property from the aqueous solution with the application of an external magnetic field. From an environmental perspective, MNPs have been used as catalysts in the purification of whey; removal of heavy toxic metals such as Arsenic (As), Lead (Pb), and toxic pollutants such as Fluoride (F) from contaminated water; and photocatalytic degradation of dyes and pollutants in water. In this study, types of magnetic nanoparticles, synthesis methods, properties, and environmental science and engineering applications are included.
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de la Luz Mora, María, Jorge Medina, Patricia Poblete-Grant, Rolando Demanet, Paola Durán, Patricio Barra, and Cecilia Paredes. "Innovative agriculture management to foster soil organic carbon sequestration." In Understanding and fostering soil carbon sequestration, 271–302. Burleigh Dodds Science Publishing, 2022. http://dx.doi.org/10.19103/as.2022.0106.30.
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There is a need to develop new strategies to maintain and increase food production on degraded agricultural soils while decreasing the environmental impact of agricultural production. These strategies can be based on the concept of soil as a ‘natural bioreactor”, including modulation of Al/Fe complexes and the microbial carbon pump. Utilization of organic residues in agriculture provides one solution. This chapter shows that transformation of these residues through composting, co-composting and/or thermal treatment can produce a new generation of innovative fertilizers able to foster SOC sequestration as well as improve plant nutrient use and reduce environmental impacts.
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Pais, Silvana, João Campos, Judit Lecina, and Adrián Regos. "Fire-smart management as nature-based solution to extreme wildfires in abandoned rural landscapes of Southern Europe." In Advances in Forest Fire Research 2022, 1634–39. Imprensa da Universidade de Coimbra, 2022. http://dx.doi.org/10.14195/978-989-26-2298-9_250.
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The continuous research and development regarding firefighters’ personal protective equipment (PPE) has led to significant improvements in recent decades. The findings that contributed the most to the firefighters’ protective clothing evolution, increasing the protection, were the use of high-performance fibers, flame-retardant polymer fibers and the changes on clothing structure namely the incorporation of a multi-layer system. Despite the evolution of firefighters PPE, every year an undesirable number of firefighters are seriously burned during firefighting operations with some of them eventually losing their life. Therefore, the need to proceed the research and development regarding thermal protective clothing arises, to increase firefighters’ protection and consequently minimize firefighters’ heat load and skin burn. Firefighters’ protection can be further increased with the incorporation of smart textiles in the personal protective equipment, such as integrated sensors to monitor parameters such as heart rate, oxygen saturation, carbon dioxide detector and setting real-time communication with a command post. In addition to the wearable electronics, regarding smart textiles alternatives for firefighters PPE, several studies have been conducted to incorporate phase change materials (PCM) in firefighters thermal protective clothing with satisfactory results. These advanced materials will absorb the heat from the fire leading to a reduction of the amount of heat to which firefighters are exposed to and an increase of the time that firefighters can be exposed to heat. The evolution of firefighters PPE has been followed by an evolution and update of the international and national standards that specify performance requirements for firefighters’ protective clothing for structural and wildland firefighting as well as technical rescue. In respect to structural firefighting, the applicable European standard is EN 469:2020: Protective clothing for firefighters – Performance requirements for protective clothing for firefighters’ activities and regarding the wildland firefighting, the international standard prevailing is EN ISO 15384:2020: Protective clothing for firefighters – Laboratory test methods and performance requirements for wildland firefighting clothing. For technical rescue the applicable European standard is EN 16689: 2017: Protective clothing for firefighters – Performance requirements for protective clothing for technical rescue. Given the growing trend towards the incorporation of smart materials in firefighters PPE is important to study and develop new standards to certify these innovative protective clothing for firefighters, regardless the efforts being done within CEN / TC 248/WG 31 - Smart Textiles. To preserve the protection of firefighters protective clothing there are some actions that must be taken during the protective garments’ life cycle. Therefore, recently was developed a technical report, a CEN/ TR1760:2021 that describes the guidelines for selection use, care and maintenance of smart garments protecting against heat and flame. This study will focus on the analysis of firefighters protective clothing evolution regarding the use and integration of advanced smart materials, namely phase change materials, taking in consideration the evolution and requirements of international and European standards as well as national legislation for firefighters’ protective clothing.
Conference papers on the topic "Microfluidic thermal management solution"
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Tang, G. Y., C. Yang, C. J. Chai, and H. Q. Gong. "Joule Heating Induced Thermal and Hydrodynamic Development in Microfluidic Electroosmotic Flow." In ASME 2004 2nd International Conference on Microchannels and Minichannels. ASMEDC, 2004. http://dx.doi.org/10.1115/icmm2004-2442.
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Joule heating is present in electrokinetically driven flow and mass transport in microfluidic systems. Specifically, in the cases of high applied voltages and concentrated buffer solutions, the thermal management may become a problem. In this study, a mathematical model is developed to describe the Joule heating and its effects on electroosmotic flow and mass species transport in microchannels. The proposed model includes the Poisson equation, the modified Navier-Stokes equation, and the conjugate energy equation (for the liquid solution and the capillary wall). Specifically, the ionic concentration distributions are modeled using (i) the general Nernst-Planck equation, and (ii) the simple Boltzmann distribution. These governing equations are coupled through temperature-dependent phenomenological thermal-physical coefficients, and hence they are numerically solved using a finite-volume based CFD technique. A comparison has been made for the results of the ionic concentration distributions and the electroosmotic flow velocity and temperature fields obtained from the Nernst-Planck equation and the Boltzmann equation. The time and spatial developments for both the electroosmotic flow fields and the Joule heating induced temperature fields are presented. In addition, sample species concentration is obtained by numerically solving the mass transport equation, taking into account of the temperature-dependent mass diffusivity and electrophoresis mobility. The results show that the presence of the Joule heating can result in significantly different electroosomotic flow and mass species transport characteristics.
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Paik, Phil, Vamsee K. Pamula, and Krishnendu Chakrabarty. "Adaptive Hot-Spot Cooling of Integrated Circuits Using Digital Microfluidics." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-81081.
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Thermal management is becoming an increasingly important issue in integrated circuit (IC) design. The ability to cool ICs is quickly reaching a limit with today’s package-level solutions. While a number of novel cooling methods have been introduced, many of which are microfluidic approaches, these methods are unable to adaptively address the uneven thermal profiles and hot-spots generated in high performance ICs. In this paper, we present a droplet-based digital microfluidic cooling system for ICs that can adaptively cool hot-spots through real-time reprogrammable flow. This paper characterizes the effectiveness of microliter-sized droplets for cooling by determining the heat transfer coefficient of a droplet shuttling back and forth in an open system over a hot-spot at various speeds. Cooling is found to be significantly enhanced at higher flow rates of droplets. In order to further enhance cooling, the effect of varying droplet aspect ratio (width/height) in a confined system was also studied.
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Wang, Tao, Lu Lv, JieJun Wang, Jian He, Qiuyan Li, Chuangui Wu, Wenbo Luo, Yao Shuai, and Wanli Zhang. "Applications of Microfluidic Devices for Electronics Thermal Management." In 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS). IEEE, 2018. http://dx.doi.org/10.1109/nems.2018.8557010.
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Wang, Evelyn N., Rong Xiao, and Kuang-Han Chu. "Nanoengineered surfaces for microfluidic-based thermal management devices." In MOEMS-MEMS, edited by Richard C. Kullberg and Rajeshuni Ramesham. SPIE, 2010. http://dx.doi.org/10.1117/12.842950.
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Laguna, Gerard, Manel Ibanez, Joan Rosell, Montse Vilarrubi, Amrid Amnache, Etienne Leveille, Rajesh Pandiyan, Luc G. Frechette, and Jerome Barrau. "Experimental Validation of a Smart Microfluidic Cell Cooling Solution." In 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm). IEEE, 2020. http://dx.doi.org/10.1109/itherm45881.2020.9190618.
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Tigner, Julaunica, and Tamara Floyd-Smith. "Feasibility Assessment of the Integration of Microfluidics and NEPCM for Cooling Microelectronics Systems." In ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/mnhmt2012-75107.
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The growing demand for microelectronic systems to be smaller and faster has increased the energy released by these devices in the form of heat. Microelectronic systems such as laptop computers and hand held devices are not exempted from these demands. The primary traditional technologies currently used to remove heat generated in these devices are fins and fans. In this study, traditional methods were compared to more novel methods like cooling using forced convection in microfluidic channels and stagnant nanoparticle enhanced phase change materials (NEPCM). For this study, the difference between the surface temperature of a simulated microelectronic system without any cooling and with a particular cooling method was compared for several cooling scenarios. Higher ΔT values indicate more effective cooling. The average ΔT values for fans, fins, NEPCM and microchannels with water were 2°C, 5°C, 3°C and 4°C respectively. These results suggest that, separately, microchannel cooling and NEPCM are promising methods for managing heat in microelectronic systems. Even more interesting than NEPCM or microchannel cooling alone is the potential cooling that can be achieved by combining the two methods to achieve multimode cooling first by the phase change of the NEPCM and then by circulating the nanofluid (melted NEPCM) through microchannels. A feasibility assessment, however, reveals that the combination of the two methods is not equal to the sum of the parts due to the viscosity and associated pumping power requirements for the melted phase change material. Nonetheless, the combination of the method still holds promise as a competitive alternative to existing thermal management solutions.
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Panepinto, D., and G. Genon. "Wastewater sewage sludge: the thermal treatment solution." In WASTE MANAGEMENT 2014. Southampton, UK: WIT Press, 2014. http://dx.doi.org/10.2495/wm140171.
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Bar-Cohen, Avram, Joseph J. Maurer, and Abirami Sivananthan. "Near-junction microfluidic thermal management of RF power amplifiers." In 2015 IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems (COMCAS). IEEE, 2015. http://dx.doi.org/10.1109/comcas.2015.7360498.
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Dong Liu and Suresh V. Garimella. "Microfluidic pumping based on dielectrophoresis for thermal management of microelectronics." In 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM). IEEE, 2008. http://dx.doi.org/10.1109/itherm.2008.4544315.
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Lohani, Bhushan, and Robert C. Roberts. "Metal Additive Microfabricated Microfluidic Packages for Integrated Thermal Management In Power Application." In 2022 21st International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS). IEEE, 2022. http://dx.doi.org/10.1109/powermems56853.2022.10007076.
Full textReports on the topic "Microfluidic thermal management solution"
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Ng, K. K. Airborne Sensor Thermal Management Solution. Office of Scientific and Technical Information (OSTI), June 2015. http://dx.doi.org/10.2172/1251091.
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