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Journal articles on the topic 'Microelectronics'

To see the other types of publications on this topic, follow the link: Microelectronics.

Author: Grafiati

Published: 4 June 2021

Last updated: 31 August 2024

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1

Liu, Pu. "Current development status and application analysis of microelectronics technology." Applied and Computational Engineering 11, no. 1 (September 25, 2023): 210–15. http://dx.doi.org/10.54254/2755-2721/11/20230235.

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With the rapid development of microelectronic technology in the 21st century, microelectronic technology has been widely used in various fields, which has promoted various fields and improved the level of industrialization in the world. But there are still many problems, so this paper will introduce the application of microelectronics technology, let readers understand that microelectronics technology has a strong research prospect. The research methods of this paper are as follows. Firstly, the importance and significance of microelectronic technology are described, and the development process of microelectronic technology is introduced. Then its applications in microelectronics automation and microelectronics packaging are introduced. It makes readers understand that there are many application scenarios of microelectronic technology and provides scholars with different research directions. This article will first describe the history of the development of microelectronic technology, and then explain its various applications. The future research directions of microelectronic technology in several industries are also highlighted.

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2

Fu, Boyuan. "Research on the application status of microelectronics technology in different fields." Applied and Computational Engineering 11, no. 1 (September 25, 2023): 216–23. http://dx.doi.org/10.54254/2755-2721/11/20230239.

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The main focus is on the current status of the application of microelectronics in different fields. The current state of research in microelectronics is shown more visually through two experiments with diodes and MOS transistors. Then through its application in integrated circuits and automatic control shows the importance of microelectronics in today's information age, and finally through the prospect of future prospects, rational analysis of the development trend in the field of artificial intelligence, and put forward certain ideas, microelectronics can make artificial intelligence more accurate calculation compared to the larger integrated circuit boards. The aim of this paper is to provide the reader with an understanding of the current state of microelectronic applications and to simulate the actual situation through physical experiments on semiconductors and experiments on microelectronics and integrated circuit processes. It also discusses the application of microelectronics in automatic control, and thus obtains the current status of microelectronics research and future development prospects.

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3

MANUSHIN, Dmitrii V., Guzel' R. TAISHEVA, and Shamil' I. ENIKEEV. "Russian microelectronics: Current state-of-the-art, logistics, management issues, crisis response measures." National Interests: Priorities and Security 19, no. 5 (May 16, 2023): 808–42. http://dx.doi.org/10.24891/ni.19.5.808.

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Subject. This article discusses the prospects for the development of Russian microelectronics and import substitution issues. Objectives. The article aims to develop measures to support Russian developers of microelectronic devices. Methods. For the study, we used the abstract-logical, computational-constructive, and case study methods. Results. The article proposes certain measures to support the microelectronics industry in Russia. Conclusions. The proposed measures can help prevent a crisis in the microelectronics industry in the face of sanctions imposed against Russia.

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4

Zhang, Ruolei. "Application and Development Trend of 5G Communication Technology in Microelectronics." International Journal of Computer Science and Information Technology 2, no. 1 (March 25, 2024): 397–402. http://dx.doi.org/10.62051/ijcsit.v2n1.42.

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This study delves into the synergistic relationship between 5G communication technology and microelectronics, and how it shapes the future of the scientific and technological landscape. Through a comprehensive blend of theoretical analysis and empirical research, we examine how 5G technology propels the advancement of microelectronics, and vice versa. Our findings reveal a symbiotic relationship between the two, driving the overall progress of the electronic information industry. The distinctive features of 5G technology—high speed, minimal delay, and extensive connectivity—demand that microelectronic chips exhibit superior processing capabilities and energy efficiency. This, in turn, fuels the relentless innovation in microelectronics. Simultaneously, advancements in microelectronics bolster the performance and cost-effectiveness of 5G equipment, facilitating its widespread adoption. Furthermore, this paper explores the convergent trends in 5G communication and microelectronics, along with the challenges and strategies for their integrated growth. It offers insights into potential avenues for innovation and development in these intertwined domains.

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5

Love, J. Christopher, Janelle R. Anderson, and George M. Whitesides. "Fabrication of Three-Dimensional Microfluidic Systems by Soft Lithography." MRS Bulletin 26, no. 7 (July 2001): 523–28. http://dx.doi.org/10.1557/mrs2001.124.

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Two-dimensional (2D) methods for transferring patterns to planar substrates have enabled the technological revolution in microfabrication that has marked the last 40 years. The overall trend toward increased miniaturization has led to the development of new types of devices in areas unrelated to conventional microelectronics: analytical tools, chemical reactors, microelectromechanical systems (MEMS), optical systems, and sensors. The widespread use and high level of technological development associated with photolithography has also made the methodologies for microelectronics—patterning photosensitive polymers, etching and deposition of thin films, and liftoff—ubiquitous in the fabrication of these new classes of microsystems. These new systems have specialized requirements, however, and are not simple extensions of microelectronics technologies. They often require materials—especially organic polymers—that are not commonly used in microelectronic systems, they must have low cost, and they may need 3D structures in order to implement complex designs. These requirements have stimulated the development of new methods for microfabrication.

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6

Wang, Yinghao. "Research Progress on Key Technologies of Microelectronics for Industry 4.0." Academic Journal of Science and Technology 2, no. 3 (August 26, 2022): 4–6. http://dx.doi.org/10.54097/ajst.v2i3.1434.

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With the continuous improvement of China's science and technology and economic development level, automatic control runs through all walks of life in China, and the Industry 4.0 era dominated by Internet of Things and intelligent manufacturing has gradually matured. Therefore, according to the changing market requirements, automatic control requirements have become higher and higher, and it is more and more common to integrate automatic control technology in the field of microelectronics. With the use of microelectronic technology, electrical control can be carried out more accurately, and the volume of equipment can be reduced, thus serving the future development of automatic control field. This paper analyzes the key technology of microelectronics.

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7

Frear, D. R., and S. Thomas. "Emerging Materials Challenges in Microelectronics Packaging." MRS Bulletin 28, no. 1 (January 2003): 68–74. http://dx.doi.org/10.1557/mrs2003.20.

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IntroductionThe trend for microelectronic devices has historically been, and will continue to be, toward a smaller feature size, faster speeds, more complexity, higher power, and lower cost. The driving force behind these advances has traditionally been microprocessors. With the tremendous growth of wireless telecommunications, rf applications are beginning to drive many areas of microelectronics that traditionally were led by developments in microprocessors. An increasingly dominant factor in rf microelectronics is electronic packaging, and the materials needed to create the package, because the package materials strongly affect the performance of the electronics. Many challenges remain for the packaging of microprocessors as well. These challenges include increased speed, the number of input/output interconnects, decreased pitch, and decreased cost. This article highlights the key issues facing the packaging of high-performance digital and rf electronics.

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8

Zhu, Bo. "Microelectronics innovation and implementation in intelligent transportation systems." Theoretical and Natural Science 9, no. 1 (November 13, 2023): 208–13. http://dx.doi.org/10.54254/2753-8818/9/20240751.

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Under the background of urbanization and rapid development of transportation, the innovation of intelligent transportation system has become the key to improving traffic efficiency, relieving traffic pressure, and solving traffic problems. With the continuous progress of microelectronics technology, its application in the field of intelligent transportation is becoming more and more eye-catching. This paper focuses on the innovation and realization of micro-electronic technology in intelligent transportation system, and discusses the application of micro-electronic technology in intelligent navigation, intelligent parking, traffic flow optimization, etc. Through a literature review approach, this study demonstrates how microelectronics technology can drive the development of intelligent transportation systems to improve the efficiency and sustainability of urban transportation. The research results show that microelectronics technology not only brings revolutionary changes to the field of intelligent transportation, but also provides accurate positioning and navigation functions in intelligent navigation systems, realizes more efficient parking process management in intelligent parking systems, and plays a key role in traffic flow optimization. Microelectronic technology has wide application prospects and a positive social influence in the field of intelligent transportation.

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9

Liu, Shiqian, Keith Sweatman, Stuart McDonald, and Kazuhiro Nogita. "Ga-Based Alloys in Microelectronic Interconnects: A Review." Materials 11, no. 8 (August 8, 2018): 1384. http://dx.doi.org/10.3390/ma11081384.

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Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry.

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10

Гусев, К. Ю., Д. В. Жильцов, В. Л. Бурковский, and П. Ю. Гусев. "THE PROBLEMS OF MONITORING AND CONTROL OF MICROCLIMATE PARAMETERS IN THE MICROELECTRONICS INDUSTRY." МОДЕЛИРОВАНИЕ, ОПТИМИЗАЦИЯ И ИНФОРМАЦИОННЫЕ ТЕХНОЛОГИИ 7, no. 2(25) (May 28, 2019): 265–74. http://dx.doi.org/10.26102/2310-6018/2019.25.2.016.

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В настоящее время всё большее внимание при стратегическом планировании развития промышленности в России уделяется предприятиям, работающим в сфере микроэлектроники. Подтверждением тому является большое число проводимых конференций, форумов и встреч на самом высоком государственном уровне по проблемам развития микроэлектроники в России. Основная часть предприятий, выпускающих микроэлектронную продукцию, начинали свою работу еще в советское время. То есть на сегодня имеются производственные цеха, которые по своим размерам и характеристикам не совпадают с современными производственными линиями выпуска микроэлектронной продукции. В статье приводится влияние параметров микроклимата на качество выпускаемой продукции. Рассматриваются как характеристики воздуха, поступающего и удаляемого из помещений, так и электростатические характеристики, несомненно оказывающие влияние на производство микроэлектроники и часто приводящие к браку, а также параметры воды, используемой в производстве. Результатом обзора существующего на сегодня в микроэлектронной промышленности уровня управления описанными выше параметрами является формулирование проблематики отсутствие системного подхода при постановке технического задания, разработки всех стадий проекта и реализации строительства или реконструкции предприятий микроэлектронной промышленности в ключе управления параметрами микроклимата цеха, электростатическими параметрами и характеристиками промышленной воды и газа. Currently, more and more attention in the strategic planning of industrial development in Russia is paid to enterprises working in the field of microelectronics. This is confirmed by a large number of conferences, forums and meetings at the highest state level on the development of microelectronics in Russia. The main part of the enterprises producing microelectronic products began their work in the Soviet period. That is, today there are production shops, which in their size and characteristics do not coincide with modern production lines of microelectronic products. The article presents the influence of microclimate parameters on the quality of products. Both the characteristics of the air entering and leaving the premises and the electrostatic characteristics undoubtedly affecting the production of microelectronics and often leading to marriage, as well as the parameters of the water used in the production are considered. The result of the review of the current level of control in the microelectronic industry described above parameters is the formulation of problems the lack of a systematic approach in the formulation of technical specifications, the development of all stages of the project and the construction or reconstruction of the microelectronic industry in the key management parameters of the microclimate shop, electrostatic parameters and characteristics of industrial water and gas.

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11

Sluckuvienė, Zita, and Lidija Božė. "Technologies and materials that have enabled the miniaturization of electronic elements." Applied Scientific Research 2, no. 2 (October 3, 2023): 151–59. http://dx.doi.org/10.56131/tmt.2023.2.2.178.

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This article introduces the technologies used in microelectronics manufacturing (integrated circuits, printed circuit boards, etc.) It reviews traditional semiconductor materials (germanium, silicon) and some of the best the most famous and promising, but currently still being researched, semiconductor materials (carbon nanotubes, graphene). The article briefly describes Lithuania's potential in the production of microelectronic devices. Key words: semiconductor, nanotubes, integrated circuits, printed circuit boards, PIC.

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12

Lanza, Mario. "Redefining microelectronics." Microelectronic Engineering 258 (April 2022): 111767. http://dx.doi.org/10.1016/j.mee.2022.111767.

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13

Kurzweil, Karel. "Microelectronics International." Microelectronics International 12, no. 1 (January 1995): 2–3. http://dx.doi.org/10.1108/eb044547.

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14

Thompson, David L. "Microelectronics Monographs." Electronic Systems News 1988, no. 1 (1988): 28. http://dx.doi.org/10.1049/esn.1988.0014.

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15

Szweda, Roy. "Microelectronics futures." III-Vs Review 13, no. 4 (July 2000): 47. http://dx.doi.org/10.1016/s0961-1290(00)80007-1.

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16

Baldi, L. "Microelectronics trends." Future Generation Computer Systems 7, no. 1 (October 1991): 3–13. http://dx.doi.org/10.1016/0167-739x(91)90011-l.

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17

Krstić, D. "RF microelectronics." Microelectronics Journal 29, no. 12 (December 1998): 1041–42. http://dx.doi.org/10.1016/s0026-2692(98)00059-7.

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18

Hurst, Stanley L. "Canadian microelectronics." Microelectronics Journal 24, no. 5 (August 1993): 461. http://dx.doi.org/10.1016/0026-2692(93)90114-t.

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19

Kanemaru, Seigo, and Junji Itoh. "Vacuum Microelectronics." Journal of the Institute of Television Engineers of Japan 45, no. 5 (1991): 612–17. http://dx.doi.org/10.3169/itej1978.45.612.

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20

Veselova, E. Sh. "Russian Microelectronics." Problems of Economic Transition 59, no. 1-3 (March 2017): 130–43. http://dx.doi.org/10.1080/10611991.2017.1319192.

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21

Sparkes, Bob. "Introducing Microelectronics." Electronics Education 1990, no. 1 (1990): 39. http://dx.doi.org/10.1049/ee.1990.0018.

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22

Криштоп, В. Г., Д. А. Жевненко, П. В. Дудкин, Е. С. Горнев, В. Г. Попов, С. С. Вергелес, and Т. В. Криштоп. "ТЕХНОЛОГИЯ И ПРИМЕНЕНИЕ ЭЛЕКТРОХИМИЧЕСКИХ ПРЕОБРАЗОВАТЕЛЕЙ." NANOINDUSTRY Russia 96, no. 3s (June 15, 2020): 450–55. http://dx.doi.org/10.22184/1993-8578.2020.13.3s.450.455.

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Электрохимические системы очень перспективны для разработки новой элементной базы для микроэлектроники и для использования в широком спектре инженерных задач. Мы разработали новую микроэлектронную технологию для изготовления электрохимических преобразователей (ЭХП) и новые приборы на основе новых электрохимических микроэлектронных чипов. Планарные электрохимические преобразователи могут использоваться в акселерометрах, сейсмических датчиках, датчиках вращения, гидрофонах и датчиках давления. Electrochemical systems are very promising for the development of a new element base for microelectronics, and for use in a wide range of engineering applications. We have developed a new microelectronic technology for manufacturing electrochemical transducers (ECP) and new devices based on new electrochemical microelectronic chips. Planar electrochemical transducers are used in accelerometers, seismic sensors, rotation sensors, hydrophones and pressure sensors.

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23

Angermann, Heike, Abdelazize Laades, U. Stürzebecher, E. Conrad, C. Klimm, T. F. Schulze, K. Jacob, A. Lawerenz, and L. Korte. "Wet-Chemical Preparation of Textured Silicon Solar Cell Substrates: Surface Conditioning and Electronic Interface Properties." Solid State Phenomena 187 (April 2012): 349–52. http://dx.doi.org/10.4028/www.scientific.net/ssp.187.349.

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The dominance of crystalline silicon (Si) in photovoltaics can be ascribed partly to the extensive knowledge about this material, which has been accumulated in microelectronics technology. Methods to passivate Si interfaces, which were developed for microelectronic device technologies, have been extended to solar cell manufacturing in the past. These methods, however, have been optimised for polished substrates, and do not work so effective with textured surfaces, which commonly used in the fabrication of high efficiency Si solar cells to enhance anti-reflection properties.

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24

Fan, Wenbo. "Analysis on the application and development of microelectronic technology." Applied and Computational Engineering 6, no. 1 (June 14, 2023): 209–13. http://dx.doi.org/10.54254/2755-2721/6/20230768.

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The advancement of science and technology, as well as the passage of time, have resulted in an increase in the use of high-tech products in our daily lives, with microelectronics playing an important role as a fundamental technology. Today, the microelectronics industry is the world's sunrise industry. China is rapidly expanding its microelectronics industry. Microelectronics technology is one of the world's fastest growing technologies, and it is the foundation of the information industry in the information age. Now, microelectronics technology has become a standard for measuring a country's level of science and technology. This paper, using a method of literature review, focuses on discussing and summarizing the development and application of microelectronics technology in China, as well as providing some possible correct solutions.

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25

Deligianni, H. "Electrodeposition and Microelectronics." Electrochemical Society Interface 15, no. 1 (March 1, 2006): 33–35. http://dx.doi.org/10.1149/2.f09061if.

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26

Ekekwe, Ndubuisi. "Nanotechnology and Microelectronics." International Journal of Nanotechnology and Molecular Computation 3, no. 4 (October 2011): 1–23. http://dx.doi.org/10.4018/ijnmc.2011100101.

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For many centuries, the gross world product was flat. But as technology penetrated many economies, over time, the world economy has expanded. Technology will continue to shape the future of commerce, industry and culture with likes of nanotechnology and microelectronics directly or indirectly playing major roles in redesigning the global economic structures. These technologies will drive other industries and will be central to a new international economy where technology capability will determine national competitiveness. Technology-intensive firms will emerge and new innovations will evolve a new dawn in wealth creation. Nations that create or adopt and then diffuse these technologies will profit. Those that fail to use technology as a means to compete internationally will find it difficult to progress economically. This article provides insights on global technology diffusion, the drivers and impacts with specific focus on nanotechnology and microelectronics. It also discusses the science of these technologies along with the trends, realities and possibilities, and the barriers which must be overcome for higher global penetration rates.

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Ekekwe, Ndubuisi. "Nanotechnology and Microelectronics:." International Journal of Nanotechnology and Molecular Computation 3, no. 4 (2011): 1–23. http://dx.doi.org/10.4018/ijnmc.2013100101.

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28

York, T. A. "Book Review: Microelectronics." International Journal of Electrical Engineering & Education 24, no. 3 (July 1987): 281. http://dx.doi.org/10.1177/002072098702400318.

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29

Tummala, Rao R., Eugene J. Rymaszewski, and Y. C. Lee. "Microelectronics Packaging Handbook." Journal of Electronic Packaging 111, no. 3 (September 1, 1989): 241–42. http://dx.doi.org/10.1115/1.3226540.

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30

Jonson, Mats, and Robert Shekhter. "Microelectronics goes nanomechanical." Physics World 16, no. 1 (January 2003): 21–22. http://dx.doi.org/10.1088/2058-7058/16/1/33.

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31

Willoughby, A. F. W., and J. R. Morante. "Materials for Microelectronics." Materials Science and Technology 11, no. 1 (January 1995): 1. http://dx.doi.org/10.1179/mst.1995.11.1.1.

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32

Alexander, Gary. "Learning about microelectronics." Electronic Systems News 1985, no. 1 (1985): 4. http://dx.doi.org/10.1049/esn.1985.0003.

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33

Nicholls, P. "Microelectronics and measurement." Electronic Systems News 1986, no. 1 (1986): 27. http://dx.doi.org/10.1049/esn.1986.0013.

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34

Dicello, J. F. "Microelectronics and microdosimetry." Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms 24-25 (April 1987): 1044–49. http://dx.doi.org/10.1016/s0168-583x(87)80308-7.

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35

Chi-Wah, Kok, and Tam Wing-Shan. "Microelectronics Engineering Editorial." Microelectronic Engineering 138 (April 2015): vii. http://dx.doi.org/10.1016/s0167-9317(15)00286-5.

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36

Maier, Gerhard. "Polymers for microelectronics." Materials Today 4, no. 5 (September 2001): 22–33. http://dx.doi.org/10.1016/s1369-7021(01)80253-4.

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37

JACOBY, MITCH. "SELF-ASSEMBLING MICROELECTRONICS." Chemical & Engineering News 78, no. 34 (August 21, 2000): 7. http://dx.doi.org/10.1021/cen-v078n034.p007.

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38

Pitt, Keg. "Microelectronics packaging handbook." Microelectronics Journal 20, no. 4 (July 1989): 48–49. http://dx.doi.org/10.1016/0026-2692(89)90114-6.

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39

Tummala, Rao R., Michael R. Haley, and George Czornyj. "Materials in microelectronics." Ceramics International 19, no. 3 (January 1993): 191–210. http://dx.doi.org/10.1016/0272-8842(93)90040-x.

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40

Hurst, S. L. "Microelectronics in Europe." Microelectronics Journal 25, no. 3 (May 1994): xxvi. http://dx.doi.org/10.1016/0026-2692(94)90006-x.

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41

Gurnett, Keith. "Microelectronics industry driver." Microelectronics Journal 25, no. 4 (June 1994): i. http://dx.doi.org/10.1016/0026-2692(94)90169-4.

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42

Busta, H. H. "Vacuum microelectronics-1992." Journal of Micromechanics and Microengineering 2, no. 2 (June 1, 1992): 43–74. http://dx.doi.org/10.1088/0960-1317/2/2/001.

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43

Vanner, K. C. "Lasers for microelectronics." Physics in Technology 19, no. 3 (May 1988): 122–24. http://dx.doi.org/10.1088/0305-4624/19/3/407.

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44

Chen, K. T., and G. Zorpette. "Microelectronics and computers." IEEE Spectrum 27, no. 6 (June 1990): 32–33. http://dx.doi.org/10.1109/6.58402.

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45

Martens, J. S., V. M. Hietala, T. A. Plut, D. S. Ginley, G. A. Vawter, C. P. Tigges, M. P. Siegal, J. M. Phillips, and S. Y. Kou. "Flux flow microelectronics." IEEE Transactions on Applied Superconductivity 3, no. 1 (March 1993): 2295–302. http://dx.doi.org/10.1109/77.233545.

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46

Tummala, Rao R. "Glasses in microelectronics." Journal of Non-Crystalline Solids 73, no. 1-3 (August 1985): 409–11. http://dx.doi.org/10.1016/0022-3093(85)90365-5.

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47

G.W.A.D. "Lithography in microelectronics." Microelectronics Reliability 30, no. 3 (1990): 606. http://dx.doi.org/10.1016/0026-2714(90)90419-n.

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48

Borgoni, Riccardo, Laura Deldossi, Luigi Radaelli, and Diego Zappa. "Statistics for microelectronics." Applied Stochastic Models in Business and Industry 29, no. 4 (July 2013): 315–18. http://dx.doi.org/10.1002/asmb.1994.

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Tummala, R. R., and R. B. Shaw. "Ceramics in microelectronics." Ceramics International 13, no. 1 (January 1987): 1–11. http://dx.doi.org/10.1016/0272-8842(87)90032-0.

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Knapp, Brian, and Paul A. Kohl. "Polymers for microelectronics." Journal of Applied Polymer Science 131, no. 24 (September 24, 2014): n/a. http://dx.doi.org/10.1002/app.41233.

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