Relevant bibliographies by topics / Microelectronics

Academic literature on the topic 'Microelectronics'

Author: Grafiati
Published: 4 June 2021
Last updated: 31 August 2024

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Contents

Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Microelectronics.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Journal articles on the topic "Microelectronics"

1

Liu, Pu. "Current development status and application analysis of microelectronics technology." Applied and Computational Engineering 11, no. 1 (September 25, 2023): 210–15. http://dx.doi.org/10.54254/2755-2721/11/20230235.

Full text
Abstract:
With the rapid development of microelectronic technology in the 21st century, microelectronic technology has been widely used in various fields, which has promoted various fields and improved the level of industrialization in the world. But there are still many problems, so this paper will introduce the application of microelectronics technology, let readers understand that microelectronics technology has a strong research prospect. The research methods of this paper are as follows. Firstly, the importance and significance of microelectronic technology are described, and the development process of microelectronic technology is introduced. Then its applications in microelectronics automation and microelectronics packaging are introduced. It makes readers understand that there are many application scenarios of microelectronic technology and provides scholars with different research directions. This article will first describe the history of the development of microelectronic technology, and then explain its various applications. The future research directions of microelectronic technology in several industries are also highlighted.
APA, Harvard, Vancouver, ISO, and other styles
2

Fu, Boyuan. "Research on the application status of microelectronics technology in different fields." Applied and Computational Engineering 11, no. 1 (September 25, 2023): 216–23. http://dx.doi.org/10.54254/2755-2721/11/20230239.

Full text
Abstract:
The main focus is on the current status of the application of microelectronics in different fields. The current state of research in microelectronics is shown more visually through two experiments with diodes and MOS transistors. Then through its application in integrated circuits and automatic control shows the importance of microelectronics in today's information age, and finally through the prospect of future prospects, rational analysis of the development trend in the field of artificial intelligence, and put forward certain ideas, microelectronics can make artificial intelligence more accurate calculation compared to the larger integrated circuit boards. The aim of this paper is to provide the reader with an understanding of the current state of microelectronic applications and to simulate the actual situation through physical experiments on semiconductors and experiments on microelectronics and integrated circuit processes. It also discusses the application of microelectronics in automatic control, and thus obtains the current status of microelectronics research and future development prospects.
APA, Harvard, Vancouver, ISO, and other styles
3

MANUSHIN, Dmitrii V., Guzel' R. TAISHEVA, and Shamil' I. ENIKEEV. "Russian microelectronics: Current state-of-the-art, logistics, management issues, crisis response measures." National Interests: Priorities and Security 19, no. 5 (May 16, 2023): 808–42. http://dx.doi.org/10.24891/ni.19.5.808.

Full text
Abstract:
Subject. This article discusses the prospects for the development of Russian microelectronics and import substitution issues. Objectives. The article aims to develop measures to support Russian developers of microelectronic devices. Methods. For the study, we used the abstract-logical, computational-constructive, and case study methods. Results. The article proposes certain measures to support the microelectronics industry in Russia. Conclusions. The proposed measures can help prevent a crisis in the microelectronics industry in the face of sanctions imposed against Russia.
APA, Harvard, Vancouver, ISO, and other styles
4

Zhang, Ruolei. "Application and Development Trend of 5G Communication Technology in Microelectronics." International Journal of Computer Science and Information Technology 2, no. 1 (March 25, 2024): 397–402. http://dx.doi.org/10.62051/ijcsit.v2n1.42.

Full text
Abstract:
This study delves into the synergistic relationship between 5G communication technology and microelectronics, and how it shapes the future of the scientific and technological landscape. Through a comprehensive blend of theoretical analysis and empirical research, we examine how 5G technology propels the advancement of microelectronics, and vice versa. Our findings reveal a symbiotic relationship between the two, driving the overall progress of the electronic information industry. The distinctive features of 5G technology—high speed, minimal delay, and extensive connectivity—demand that microelectronic chips exhibit superior processing capabilities and energy efficiency. This, in turn, fuels the relentless innovation in microelectronics. Simultaneously, advancements in microelectronics bolster the performance and cost-effectiveness of 5G equipment, facilitating its widespread adoption. Furthermore, this paper explores the convergent trends in 5G communication and microelectronics, along with the challenges and strategies for their integrated growth. It offers insights into potential avenues for innovation and development in these intertwined domains.
APA, Harvard, Vancouver, ISO, and other styles
5

Love, J. Christopher, Janelle R. Anderson, and George M. Whitesides. "Fabrication of Three-Dimensional Microfluidic Systems by Soft Lithography." MRS Bulletin 26, no. 7 (July 2001): 523–28. http://dx.doi.org/10.1557/mrs2001.124.

Full text
Abstract:
Two-dimensional (2D) methods for transferring patterns to planar substrates have enabled the technological revolution in microfabrication that has marked the last 40 years. The overall trend toward increased miniaturization has led to the development of new types of devices in areas unrelated to conventional microelectronics: analytical tools, chemical reactors, microelectromechanical systems (MEMS), optical systems, and sensors. The widespread use and high level of technological development associated with photolithography has also made the methodologies for microelectronics—patterning photosensitive polymers, etching and deposition of thin films, and liftoff—ubiquitous in the fabrication of these new classes of microsystems. These new systems have specialized requirements, however, and are not simple extensions of microelectronics technologies. They often require materials—especially organic polymers—that are not commonly used in microelectronic systems, they must have low cost, and they may need 3D structures in order to implement complex designs. These requirements have stimulated the development of new methods for microfabrication.
APA, Harvard, Vancouver, ISO, and other styles
6

Wang, Yinghao. "Research Progress on Key Technologies of Microelectronics for Industry 4.0." Academic Journal of Science and Technology 2, no. 3 (August 26, 2022): 4–6. http://dx.doi.org/10.54097/ajst.v2i3.1434.

Full text
Abstract:
With the continuous improvement of China's science and technology and economic development level, automatic control runs through all walks of life in China, and the Industry 4.0 era dominated by Internet of Things and intelligent manufacturing has gradually matured. Therefore, according to the changing market requirements, automatic control requirements have become higher and higher, and it is more and more common to integrate automatic control technology in the field of microelectronics. With the use of microelectronic technology, electrical control can be carried out more accurately, and the volume of equipment can be reduced, thus serving the future development of automatic control field. This paper analyzes the key technology of microelectronics.
APA, Harvard, Vancouver, ISO, and other styles
7

Frear, D. R., and S. Thomas. "Emerging Materials Challenges in Microelectronics Packaging." MRS Bulletin 28, no. 1 (January 2003): 68–74. http://dx.doi.org/10.1557/mrs2003.20.

Full text
Abstract:
IntroductionThe trend for microelectronic devices has historically been, and will continue to be, toward a smaller feature size, faster speeds, more complexity, higher power, and lower cost. The driving force behind these advances has traditionally been microprocessors. With the tremendous growth of wireless telecommunications, rf applications are beginning to drive many areas of microelectronics that traditionally were led by developments in microprocessors. An increasingly dominant factor in rf microelectronics is electronic packaging, and the materials needed to create the package, because the package materials strongly affect the performance of the electronics. Many challenges remain for the packaging of microprocessors as well. These challenges include increased speed, the number of input/output interconnects, decreased pitch, and decreased cost. This article highlights the key issues facing the packaging of high-performance digital and rf electronics.
APA, Harvard, Vancouver, ISO, and other styles
8

Zhu, Bo. "Microelectronics innovation and implementation in intelligent transportation systems." Theoretical and Natural Science 9, no. 1 (November 13, 2023): 208–13. http://dx.doi.org/10.54254/2753-8818/9/20240751.

Full text
Abstract:
Under the background of urbanization and rapid development of transportation, the innovation of intelligent transportation system has become the key to improving traffic efficiency, relieving traffic pressure, and solving traffic problems. With the continuous progress of microelectronics technology, its application in the field of intelligent transportation is becoming more and more eye-catching. This paper focuses on the innovation and realization of micro-electronic technology in intelligent transportation system, and discusses the application of micro-electronic technology in intelligent navigation, intelligent parking, traffic flow optimization, etc. Through a literature review approach, this study demonstrates how microelectronics technology can drive the development of intelligent transportation systems to improve the efficiency and sustainability of urban transportation. The research results show that microelectronics technology not only brings revolutionary changes to the field of intelligent transportation, but also provides accurate positioning and navigation functions in intelligent navigation systems, realizes more efficient parking process management in intelligent parking systems, and plays a key role in traffic flow optimization. Microelectronic technology has wide application prospects and a positive social influence in the field of intelligent transportation.
APA, Harvard, Vancouver, ISO, and other styles
9

Liu, Shiqian, Keith Sweatman, Stuart McDonald, and Kazuhiro Nogita. "Ga-Based Alloys in Microelectronic Interconnects: A Review." Materials 11, no. 8 (August 8, 2018): 1384. http://dx.doi.org/10.3390/ma11081384.

Full text
Abstract:
Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry.
APA, Harvard, Vancouver, ISO, and other styles
10

Гусев, К. Ю., Д. В. Жильцов, В. Л. Бурковский, and П. Ю. Гусев. "THE PROBLEMS OF MONITORING AND CONTROL OF MICROCLIMATE PARAMETERS IN THE MICROELECTRONICS INDUSTRY." МОДЕЛИРОВАНИЕ, ОПТИМИЗАЦИЯ И ИНФОРМАЦИОННЫЕ ТЕХНОЛОГИИ 7, no. 2(25) (May 28, 2019): 265–74. http://dx.doi.org/10.26102/2310-6018/2019.25.2.016.

Full text
Abstract:
В настоящее время всё большее внимание при стратегическом планировании развития промышленности в России уделяется предприятиям, работающим в сфере микроэлектроники. Подтверждением тому является большое число проводимых конференций, форумов и встреч на самом высоком государственном уровне по проблемам развития микроэлектроники в России. Основная часть предприятий, выпускающих микроэлектронную продукцию, начинали свою работу еще в советское время. То есть на сегодня имеются производственные цеха, которые по своим размерам и характеристикам не совпадают с современными производственными линиями выпуска микроэлектронной продукции. В статье приводится влияние параметров микроклимата на качество выпускаемой продукции. Рассматриваются как характеристики воздуха, поступающего и удаляемого из помещений, так и электростатические характеристики, несомненно оказывающие влияние на производство микроэлектроники и часто приводящие к браку, а также параметры воды, используемой в производстве. Результатом обзора существующего на сегодня в микроэлектронной промышленности уровня управления описанными выше параметрами является формулирование проблематики отсутствие системного подхода при постановке технического задания, разработки всех стадий проекта и реализации строительства или реконструкции предприятий микроэлектронной промышленности в ключе управления параметрами микроклимата цеха, электростатическими параметрами и характеристиками промышленной воды и газа. Currently, more and more attention in the strategic planning of industrial development in Russia is paid to enterprises working in the field of microelectronics. This is confirmed by a large number of conferences, forums and meetings at the highest state level on the development of microelectronics in Russia. The main part of the enterprises producing microelectronic products began their work in the Soviet period. That is, today there are production shops, which in their size and characteristics do not coincide with modern production lines of microelectronic products. The article presents the influence of microclimate parameters on the quality of products. Both the characteristics of the air entering and leaving the premises and the electrostatic characteristics undoubtedly affecting the production of microelectronics and often leading to marriage, as well as the parameters of the water used in the production are considered. The result of the review of the current level of control in the microelectronic industry described above parameters is the formulation of problems the lack of a systematic approach in the formulation of technical specifications, the development of all stages of the project and the construction or reconstruction of the microelectronic industry in the key management parameters of the microclimate shop, electrostatic parameters and characteristics of industrial water and gas.
APA, Harvard, Vancouver, ISO, and other styles
More sources

Dissertations / Theses on the topic "Microelectronics"

1

Karnaushenko, Daniil. "Shapeable microelectronics." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-205489.

Full text
Abstract:
This thesis addresses the development of materials, technologies and circuits applied for the fabrication of a new class of microelectronic devices that are relying on a three-dimensional shape variation namely shapeable microelectronics. Shapeable microelectronics has a far-reachable future in foreseeable applications that are dealing with arbitrarily shaped geometries, revolutionizing the field of neuronal implants and interfaces, mechanical prosthetics and regenerative medicine in general. Shapeable microelectronics can deterministically interface and stimulate delicate biological tissue mechanically or electrically. Applied in flexible and printable devices shapeable microelectronics can provide novel functionalities with unmatched mechanical and electrical performance. For the purpose of shapeable microelectronics, novel materials based on metallic multilayers, photopatternable organic and metal-organic polymers were synthesized. Achieved polymeric platform, being mechanically adaptable, provides possibility of a gentle automatic attachment and subsequent release of active micro-scale devices. Equipped with integrated electronic the platform provides an interface to the neural tissue, confining neural fibers and, if necessary, guiding the regeneration of the tissue with a minimal impact. The self-assembly capability of the platform enables the high yield manufacture of three-dimensionally shaped devices that are relying on geometry/stress dependent physical effects that are evolving in magnetic materials including magentostriction and shape anisotropy. Developed arrays of giant magnetoimpedance sensors and cuff implants provide a possibility to address physiological processes locally or distantly via magnetic and electric fields that are generated deep inside the organism, providing unique real time health monitoring capabilities. Fabricated on a large scale shapeable magnetosensory systems and nanostructured materials demonstrate outstanding mechanical and electrical performance. The novel, shapeable form of electronics can revolutionize the field of mechanical prosthetics, wearable devices, medical aids and commercial devices by adding novel sensory functionalities, increasing their capabilities, reducing size and power consumption.
APA, Harvard, Vancouver, ISO, and other styles
2

Banerji, Sounak. "Warpage characterization and lithographic limitations of FR-4 for SOP global interconnect needs." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/14853.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Saiyed, Mohammed Shafi. "System-in-package a system level investigation for package reliability /." Diss., Online access via UMI:, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Nazareth, Mathew B. "Design and simulation of a multichip module /." Online version of thesis, 1994. http://hdl.handle.net/1850/12181.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Zubair, Muhammed 1962. "Aluminoborophosphosilicate glasses for microelectronics packaging." Thesis, The University of Arizona, 1991. http://hdl.handle.net/10150/277898.

Full text
Abstract:
Glasses are used in microelectronic packaging for insulation and passivation purposes. To optimize the performance of these packages, it is necessary to investigate new glasses or improve on properties of the glasses in use. The insulating glass should have low dielectric constant, low dissipation factor, low glass transition temperature, high chemical resistivity, and a thermal expansion coefficient matching the substrate. In this study, various aluminoborophosphosilicate glasses containing Ca(Mg)O, Ca(Mg)F₂, and AlF₃ as flux were investigated. Processing temperatures for these glasses range from 1300°C to 1500°C. The coefficients of thermal expansion range from 4.52 μ/°C to 9.39 μ/°C. The dielectric constant as a function of frequency and composition is in the range of 4.1 to 5.2. The index of refraction for these glasses is in the range of 1.52 to 1.58. Glass transition and softening temperatures as low as 538°C and 622°C, respective, were found. Results of this investigation are discussed in terms of the possible use of aluminoborophosphosilicate glasses in microelectronic packaging.
APA, Harvard, Vancouver, ISO, and other styles
6

Eades, Herbert H. "Thermal modeling of hybrid microelectronics." Thesis, Virginia Tech, 1990. http://hdl.handle.net/10919/42141.

Full text
Abstract:

As the size of hybrid microelectronics is reduced, the power density increases and thermal interaction between heat-producing devices becomes significant. A nondimensional model is developed to investigate the effects of heat source interaction on a substrate. The results predict the maximum temperature created by a device for a wide range of device sizes, substrate thicknesses, device spacings, and external boundary conditions. They can be used to assess thermal interaction for preliminary design and layout of power devices on hybrid substrates.

Previous work in this area typically deals with semi-infinite regions or finite regions with isothermal bases. In the present work, the substrate and all heat dissipating mechanisms below the substrate are modeled as two separate thermal resistances in series. The thermal resistance at the base of the substrate includes the bond to the heat sink, the heat sink, and convection to a cooling medium. Results show that including this external resistance in the model can significantly alter the heat flow path through the substrate and the spreading resistance of the substrate. Results also show an optimal thickness exists to minimize temperature rise when the Biot number is small and the device spacing is large.

Tables are presented which list nondimensional values for maximum temperature and spreading resistance over a wide range of substrate geometries, device sizes, and boundary conditions. A design example is included to demonstrate an application of the results to a practical problem. The design example also shows the error that can result from assuming an isothermal boundary at the bottom of the substrate rather than a finite thermal resistance below the substrate.

Several other models are developed and compared with the axisymmetric model. A one-dimensional model and two two-dimensional models are simpler than the axisymmetric model but prove to be inaccurate. The axisymmetric model is then compared with a full three-dimensional model for accuracy. The model proves to be accurate when sources are symmetrically spaced and when sources are asymmetrical under certain conditions. However, when the sources are asymmetrical the axisymmetric model does not always predict accurate results.


Master of Science
APA, Harvard, Vancouver, ISO, and other styles
7

Nagarkar, Kaustubh Ravindra. "A systems approach to ultra-fine pitch flip chip interconnect packaging." Diss., Online access via UMI:, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

Hon, Chi Kwong. "3D packaging of multi-stacked flip chips with plugged through silicon vias for vertical interconnection /." View abstract or full-text, 2006. http://library.ust.hk/cgi/db/thesis.pl?MECH%202006%20HON.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Sinno, Bilal. "Mechanical and dielectric characterization of electronic grade polymers at subambient temperatures." Thesis, Georgia Institute of Technology, 1995. http://hdl.handle.net/1853/10149.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Wright-Williams, Lorna M. "New organic materials for microelectronics applications." Diss., Georgia Institute of Technology, 1998. http://hdl.handle.net/1853/26251.

Full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Books on the topic "Microelectronics"

1

Whitaker, Jerry C. Microelectronics. 2nd ed. Boca Raton, Fla: CRC/Taylor & Francis, 2006.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
2

Di Paolo Emilio, Maurizio. Microelectronics. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

W, Atwood Kenneth, ed. Microelectronics. Englewood Cliffs, N.J: Prentice-Hall, 1986.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
4

Canada. Industry, Science and Technology Canada. Microelectronics. Ottawa: Industry, Science and Technology Canada, 1993.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
5

Millman, Jacob. Microelectronics. 2nd ed. Maidenhead: McGraw-Hill, 1987.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
6

Millman, Jacob. Microelectronics. 2nd ed. Singapore: McGraw-Hill, 1987.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
7

Alley, Charles L. Microelectronics. Englewood Cliffs: Prentice-Hall International, 1986.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
8

C, Whitaker Jerry, ed. Microelectronics. 2nd ed. Boca Raton, FL: Taylor & Francis, 2005.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
9

Arvin, Grabel, ed. Microelectronics. 2nd ed. New York: McGraw-Hill, 1987.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
10

Giona, Sodini Charles, ed. Microelectronics. [Place of publication not identified]: [publisher not identified], 2008.

Find full text
APA, Harvard, Vancouver, ISO, and other styles
More sources

Book chapters on the topic "Microelectronics"

1

Weik, Martin H. "microelectronics." In Computer Science and Communications Dictionary, 1013. Boston, MA: Springer US, 2000. http://dx.doi.org/10.1007/1-4020-0613-6_11483.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Lewis, Barry, and Tim Strickland. "Microelectronics." In The Electronics Pathway, 271–300. London: Macmillan Education UK, 1996. http://dx.doi.org/10.1007/978-1-349-13300-0_10.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Di Paolo Emilio, Maurizio. "Review of Microelectronics." In Microelectronics, 1–18. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Di Paolo Emilio, Maurizio. "Bipolar Transistor." In Microelectronics, 19–34. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_2.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Di Paolo Emilio, Maurizio. "MOSFET." In Microelectronics, 35–43. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_3.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

Di Paolo Emilio, Maurizio. "Operational Amplifier." In Microelectronics, 45–54. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_4.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Di Paolo Emilio, Maurizio. "Design PCB." In Microelectronics, 55–65. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_5.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Di Paolo Emilio, Maurizio. "Applications." In Microelectronics, 67–98. Cham: Springer International Publishing, 2016. http://dx.doi.org/10.1007/978-3-319-22545-6_6.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

van Roosmalen, A. J. "Microelectronics Technology." In Solid mechanics and its applications, 1–34. Dordrecht: Springer Netherlands, 2006. http://dx.doi.org/10.1007/1-4020-4935-8_1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Hess, Dennis W., and Klavs F. Jensen. "Microelectronics Processing." In Advances in Chemistry, 1–33. Washington, DC: American Chemical Society, 1989. http://dx.doi.org/10.1021/ba-1989-0221.ch001.

Full text
APA, Harvard, Vancouver, ISO, and other styles

Conference papers on the topic "Microelectronics"

1

Kamarinos, Georges, Nadine Guillemot, and Bernard Courtois. "Microelectronics Education." In European Workshop on Microelectronics Education. WORLD SCIENTIFIC, 1996. http://dx.doi.org/10.1142/9789814531214.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

Tzanova, Slavka. "Microelectronics Skill Alliance – Need Analysis of Microelectronics Sector." In 2021 12th National Conference with International Participation (ELECTRONICA). IEEE, 2021. http://dx.doi.org/10.1109/electronica52725.2021.9513727.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Boostandoost, M., X. Ycaza, R. Leihkauf, U. Kerst, and C. Boit. "Challenges for Parametric Analysis of the Solar Cells Using Failure Analysis Technique Developed for the Microelectronics." In ISTFA 2012. ASM International, 2012. http://dx.doi.org/10.31399/asm.cp.istfa2012p0255.

Full text
Abstract:
Abstract In this study, the challenges to transfer the microelectronics failure analysis techniques to the photovoltaic industry have been discussed. The main focus of this study was the PHEMOS as a tool with strong technological research capacity developed for microelectronics failure analysis, and OBIC (Optical Beam Induced Current) as a non-destructive technique for detecting and localizing various defects in semiconductor devices. This failure analysis tool was a high resolution optical infrared photon emission microscope used mainly in microelectronics for qualitative analysis and localization of semiconductor defects. Such failure analysis equipment was designed to meet requirements for modern microelectronic devices. Characterization of current photovoltaic device often requires quantitative analysis and should provide information about the electrical and material properties of the solar cell. Therefore, in addition to the demand for further data processing of the obtained results we had to study the corresponding operating regime of solar cells to allow for a correct interpretation of measurement results. In this paper, some of the related problems we faced during this study, e.g. large amount of data processing, the spatial misalignment of the images obtained as EL (Electroluminescence) and IR-LBIC (Infrared Light Beam Induced Current), the implemented laser wavelength, its profile and power density for IR-LBIC measurement. These topics have been discussed in detailed to facilitate a reliable transfer of these techniques from microelectronics to the photovoltaic world.
APA, Harvard, Vancouver, ISO, and other styles
4

Canumalla, Sridhar. "Model for Acoustic Microscopy Inspection of Microelectronics Packages With Thin Layers." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33727.

Full text
Abstract:
A broadband model is proposed to describe the nature of ultrasonic pulses in multilayered systems with a sub-wavelength thickness layer. This model, which is targeted towards acoustic microscopy of microelectronic devices, can incorporate measured ultrasonic properties of electronic materials and predict the complete ultrasonic pulse-train for all the interfaces in an electronic device. The model is robust, and incorporates material and geometric variables commonly encountered in microelectronics applications. Results are presented to illustrate how delaminations and cracks with foreign material or moisture ingress can appear to be well-bonded and why acoustic images of interfaces with thin layers can sometimes give erroneous indications of the bond state.
APA, Harvard, Vancouver, ISO, and other styles
5

Gaensslen, Fritz H., and Richard C. Jaeger. "Low Temperature Microelectronics." In 1990 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 1990. http://dx.doi.org/10.7567/ssdm.1990.c-8-1.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

null. "Opportunities within microelectronics." In IEE Colloquium on Education and Training for the Electronics Manufacturing Industry. IEE, 1997. http://dx.doi.org/10.1049/ic:19970489.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Mastromatteo, Ubaldo. "MICROELECTRONICS & MICROSYSTEMS." In Proceedings of the 6th Italian Conference. WORLD SCIENTIFIC, 2001. http://dx.doi.org/10.1142/9789812810779_0037.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Buss, Dennis D. "Microelectronics in transition." In 2011 IEEE Technology Time Machine (TTM). IEEE, 2011. http://dx.doi.org/10.1109/ttm.2011.6005166.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

Hunt, D. J. "Low Budget Undergraduate Microelectronics Laboratory; University Government Industry Microelectronics Symposium." In 2006 16th Biennial University/Government/Industry Microelectronics Symposium. IEEE, 2006. http://dx.doi.org/10.1109/ugim.2006.4286358.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Furlong, Cosme, and Ryszard J. Pryputniewicz. "Advanced OEH Methodology for Evaluation of Microelectronics and Packaging." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39508.

Full text
Abstract:
With the microelectronics industry being one of the most dynamic, in terms of new technologies, electronic packages have to be designed and optimized for new and ever more demanding applications in relatively short periods of time. In addition, for certain applications, the nondestructive testing (NDT) of electronic packages may be needed, especially for applications requiring noninvasive, full-field-of-view, real-time testing the behavior of a specific package subjected to actual operating conditions. This type of NDT can be accomplished by application of optical techniques and, in particular, speckle phase correlation techniques in the form of optoelectronic holography (OEH). In this paper, advanced OEH techniques are described and representative applications of OEH for the effective characterization of microelectronic components and packages are presented.
APA, Harvard, Vancouver, ISO, and other styles

Reports on the topic "Microelectronics"

1

Balch, J. W. Diagnostics and Microelectronics. Office of Scientific and Technical Information (OSTI), March 1993. http://dx.doi.org/10.2172/10194490.

Full text
APA, Harvard, Vancouver, ISO, and other styles
2

RAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, April 1994. http://dx.doi.org/10.21236/ada278734.

Full text
APA, Harvard, Vancouver, ISO, and other styles
3

Palevsky, Alan. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, July 1994. http://dx.doi.org/10.21236/ada283123.

Full text
APA, Harvard, Vancouver, ISO, and other styles
4

Arch, D. K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, July 1992. http://dx.doi.org/10.21236/ada253488.

Full text
APA, Harvard, Vancouver, ISO, and other styles
5

Akinwande, A. I., P. Bauhahn, T. Ohnstein, J. Holmen, and B. Speldrich. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, July 1992. http://dx.doi.org/10.21236/ada253527.

Full text
APA, Harvard, Vancouver, ISO, and other styles
6

RAYTHEON CO LEXINGTON MA. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, July 1992. http://dx.doi.org/10.21236/ada253910.

Full text
APA, Harvard, Vancouver, ISO, and other styles
7

Arch, David K. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, February 1993. http://dx.doi.org/10.21236/ada260192.

Full text
APA, Harvard, Vancouver, ISO, and other styles
8

Akinwande, A. I., and D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, May 1993. http://dx.doi.org/10.21236/ada264528.

Full text
APA, Harvard, Vancouver, ISO, and other styles
9

RAYTHEON CO LEXINGTON MA RESEARCH DIV. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, July 1993. http://dx.doi.org/10.21236/ada266569.

Full text
APA, Harvard, Vancouver, ISO, and other styles
10

Akinwande, A. I., and D. K. Arch. RF Vacuum Microelectronics. Fort Belvoir, VA: Defense Technical Information Center, August 1993. http://dx.doi.org/10.21236/ada268317.

Full text
APA, Harvard, Vancouver, ISO, and other styles
You might also be interested in the extended bibliographies on the topic 'Microelectronics' for particular source types:
Journal articles Dissertations / Theses Books
We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!

To the bibliography