Books on the topic 'Microelectronic engineering'

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1

Sedra, Adel S. Microelectronic circuits. 3rd ed. New York: Oxford UniversityPress, 1995.

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2

Carless, Smith Kenneth, ed. Microelectronic circuits. 2nd ed. New York: Holt, Rinehart, and Winston, 1987.

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3

C, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. London: Saunders College Publishing, 1991.

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4

Carless, Smith Kenneth, ed. Microelectronic circuits. 4th ed. New York: Oxford University Press, 1998.

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5

Carless, Smith Kenneth, ed. Microelectronic circuits. 5th ed. New York: Oxford University Press, 2004.

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6

C, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. New York: Oxford University Press, 1991.

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7

Carless, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. Philadelphia: Saunders College Pub., 1991.

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8

C, Smith Kenneth, ed. Microelectronic circuits. 5th ed. New York: Oxford University Press, 2004.

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9

Carless, Smith Kenneth, ed. Microelectronic circuits. 3rd ed. New York: Oxford Univ. Press, 1991.

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10

The science and engineering of microelectronic fabrication. New York: Oxford University Press, 1996.

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11

Microelectronic systems 3 checkbook. London: Butterworths, 1985.

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12

Papananos, Yannis E. Radio-Frequency Microelectronic Circuits for Telecommunication Applications. Boston, MA: Springer US, 1999.

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13

Bhushan, Manjul. Microelectronic Test Structures for CMOS Technology. New York, NY: Springer Science+Business Media, LLC, 2011.

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14

Plasma electronics: Applications in microelectronic device fabrication. Boca Raton, FL: Taylor&Francis, 2005.

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15

Makabe, T. Plasma electronics: Applications in microelectronic device fabrication. New York: Taylor&Francis, 2006.

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16

Structural analysis in microelectronic and fiber-optic systems. New York: Van Nostrand Reinhold, 1991.

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17

Günter, Elst, Hanke Randolf, and SpringerLink (Online service), eds. Microelectronic Systems: Circuits, Systems and Applications. Berlin, Heidelberg: Springer-Verlag Berlin Heidelberg, 2011.

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18

M, Mayer, and Brand Oliver 1964-, eds. Force sensors for microelectronic packaging applications. Berlin: Springer, 2005.

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19

Kuang, Ken. RF and microwave microelectronics packaging. New York: Springer, 2010.

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20

Liu, S. Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Hoboken, N.J: Wiley, 2011.

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21

I, Baturone, ed. Microelectronic design of fuzzy logic-based systems. Boca Raton: CRC, 2000.

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22

1953-, Reichmanis Elsa, American Chemical Society. Division of Polymeric Materials: Science and Engineering., Kōbunshi Gakkai (Japan). Polymers for Microelectronics Division., and American Chemical Society Meeting, eds. Microelectronics technology: Polymers for advanced imaging and packaging : developed from a symposium sponsored by the ACS Division of Polymeric Materials: Science and Engineering, Inc., and the Polymers for Microelectronics Division of the Society of Polymer Science, Japan, at the 209th National Meeting of the American Chemical Society, Anaheim, California, April 2-6, 1995. Washington, DC: American Chemical Society, 1995.

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23

IEEE International Conference on Microelectronic Test Structures (1997 Monterey, Calif.). 1997 IEEE International Conference on Microelectronic Test Structures proceedings: March 17-20, 1997, Monterey, California. Piscataway, NJ: IEEE Service Center, 1997.

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24

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging. Materials for high-density electronic packaging and interconnection: Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. Washington, D.C: National Academy Press, 1990.

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25

3D IC stacking technology. New York: McGraw-Hill Professional, 2011.

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26

IEEE International Conference on Microelectronic Test Structures (1990 San Diego, Calif.). Proceedings of the 1990 International Conference on Microelectronic Test Structures, March 5-7, 1990, San Diego, California. [New York, N.Y.]: Institute of Electrical and Electronics Engineers, 1990.

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27

MEMS & Microsystems: Design, Manufacture, and Nanoscale Engineering. 2nd ed. Wiley, 2008.

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28

Hsu, Tai-Ran. MEMS and Microsystems: Design, Manufacture, and Nanoscale Engineering. Wiley & Sons, Incorporated, John, 2020.

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29

The Science and Engineering of Microelectronic Fabrication. Oxford University Press, USA, 2001.

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30

Vears, R. E. Microelectronic Systems 3 Checkbook. Elsevier Science & Technology Books, 2013.

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31

Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2011.

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32

Bhushan, Manjul, and Mark B. Ketchen. Microelectronic Test Structures for CMOS Technology. Springer, 2014.

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33

Neamen, Donald. Microelectronic Circuit Analysis and Design (Electrical & Computer Engineering). 3rd ed. McGraw-Hill Science/Engineering/Math, 2006.

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34

Neamen, Donald. Microelectronic Circuit Analysis and Design (Electrical & Computer Engineering). McGraw-Hill Science/Engineering/Math, 2006.

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35

Jowett, Charles E. The Engineering of Microelectronic Thin and Thick Films. Palgrave, 2014.

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36

Makabe, T., Toshiaki Makabe, and Z. Petrovic´. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2006.

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37

Makabe, T., and Z. Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2016.

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38

Makabe, Toshiaki, and Zoran Lj Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2014.

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39

Makabe, Toshiaki, and Zoran Lj Petrovic. Plasma Electronics: Applications in Microelectronic Device Fabrication. Taylor & Francis Group, 2014.

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40

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies. New York: Marcel Dekker, Inc., 2004.

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41

(Editor), Dennis W. Hess, and Klaus F. Jensen (Editor), eds. Microelectronic Processing: Chemical Engineering Aspects (Advances in Chemistry Series). An American Chemical Society Publication, 1998.

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42

Kuang, Ken, Franklin Kim, and Sean S. Cahill. RF and Microwave Microelectronics Packaging. Springer, 2010.

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43

Heuberger, Albert, Günter Elst, and Randolf Hanke. Microelectronic Systems: Circuits, Systems and Applications. Springer, 2012.

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44

Elwenspoek, M., and H. V. Jansen. Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering). Cambridge University Press, 1999.

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45

Smith, Kenneth C., and Adel S. Sedra. Microelectronic Circuits (Holt Rinehart and Winston Series in Electrical Engineering). Oxford University Press, USA, 1990.

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46

Elwenspoek, M., and H. V. Jansen. Silicon Micromachining (Cambridge Studies in Semiconductor Physics and Microelectronic Engineering). Cambridge University Press, 2004.

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47

Heuberger, Albert, Günter Elst, Randolf Hanke, Janina Heppner, and Karlheinz Kirsch. Microelectronic Systems: Circuits, Systems and Applications. Springer, 2014.

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48

Suhir, Ephraim. Structural Analysis in Microelectronic And Fiber Optic Systems. Wiley-Interscience, 2009.

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49

Plasma Electronics: Applications in Microelectronic Device Fabrication, Second Edition. Taylor & Francis Group, 2014.

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50

Puttlitz, Karl J., and Kathleen A. Stalter. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (Engineering Handbooks). McGraw-Hill Professional Publishing, 2002.

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