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Journal articles on the topic 'Microelectromechanical systems'

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Author: Grafiati

Published: 4 June 2021

Last updated: 31 July 2024

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1

Gabriel, K. J. "Microelectromechanical systems." Proceedings of the IEEE 86, no. 8 (1998): 1534–35. http://dx.doi.org/10.1109/5.704257.

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2

Mehregany, M. "Microelectromechanical systems." IEEE Circuits and Devices Magazine 9, no. 4 (July 1993): 14–22. http://dx.doi.org/10.1109/101.250229.

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3

MacDonald, Noel C. "SCREAM MicroElectroMechanical Systems." Microelectronic Engineering 32, no. 1-4 (September 1996): 49–73. http://dx.doi.org/10.1016/0167-9317(96)00007-x.

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4

Vasylenko, Mykola, and Maksym Mahas. "Microelectromechanical Gyrovertical." Electronics and Control Systems 1, no. 71 (June 27, 2022): 16–21. http://dx.doi.org/10.18372/1990-5548.71.16818.

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Gyroscopic verticals (gyroverticals) are designed to determine the direction of the true vertical on moving objects. Being one of the devices of the orientation system of a moving object, they are used as sensors for the roll and pitch angles of an aircraft (or sensors of similar angles for other moving objects) and serve to create a platform stabilized in the horizon plane on a moving object. The electrical signals taken from the measuring axes of the device are used in flight, navigation, radar systems, visual indicators, etc. Gyroscopic stabilization systems are widely used as the basis of integrated management systems on aircraft and miniature unmanned aerial vehicles for generating signals proportional to the angular deviations of the aircraft in space in terms of roll and pitch angles and for stabilizing and controlling the position in space of optical equipment. At present, sensors based on the technologies of microelectromechanical systems are widely used in small aircraft. Their important advantage is small weight and size characteristics, and the main disadvantage is low accuracy. Such sensors are used in navigation systems and automatic control systems of aircraft. In particular, algorithms for calculating the orientation angles of an unmanned aerial vehicle are known, using information from microelectromechanical angular velocity sensors. However, due to large drifts, an error accumulates in time and, as a result, the operating time is limited.

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5

Bhat, K. N. "Micromachining for Microelectromechanical Systems." Defence Science Journal 48, no. 1 (January 1, 1998): 5–19. http://dx.doi.org/10.14429/dsj.48.3863.

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6

Kal, Santiram. "Microelectromechanical Systems and Microsensors." Defence Science Journal 57, no. 3 (May 23, 2007): 209–24. http://dx.doi.org/10.14429/dsj.57.1762.

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7

Gupta, Amita. "Advances in Microelectromechanical Systems." Defence Science Journal 59, no. 6 (November 24, 2009): 555–56. http://dx.doi.org/10.14429/dsj.59.1579.

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8

Louizos, Louizos-Alexandros, Panagiotis G. Athanasopoulos, and Kevin Varty. "Microelectromechanical Systems and Nanotechnology." Vascular and Endovascular Surgery 46, no. 8 (October 8, 2012): 605–9. http://dx.doi.org/10.1177/1538574412462637.

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9

Kristo, Blaine, Joseph C. Liao, Hercules P. Neves, Bernard M. Churchill, Carlo D. Montemagno, and Peter G. Schulam. "Microelectromechanical systems in urology." Urology 61, no. 5 (May 2003): 883–87. http://dx.doi.org/10.1016/s0090-4295(03)00032-3.

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10

(Rich) Pryputniewicz, R. J. "Progress in Microelectromechanical Systems." Strain 43, no. 1 (February 2007): 13–25. http://dx.doi.org/10.1111/j.1475-1305.2007.00303.x.

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11

Packard, Corinne E., Apoorva Murarka, Eric W. Lam, Martin A. Schmidt, and Vladimir Bulović. "Contact-Printed Microelectromechanical Systems." Advanced Materials 22, no. 16 (April 22, 2010): 1840–44. http://dx.doi.org/10.1002/adma.200903034.

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12

Ansorge, Erik, Bertram Schmidt, Jan Sauerwald, and Holger Fritze. "Langasite for microelectromechanical systems." physica status solidi (a) 208, no. 2 (September 23, 2010): 377–89. http://dx.doi.org/10.1002/pssa.201026508.

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13

Sonetha, Vaibhavi, Poorvi Agarwal, Smeet Doshi, Ridhima Kumar, and Bhavya Mehta. "Microelectromechanical Systems in Medicine." Journal of Medical and Biological Engineering 37, no. 4 (June 19, 2017): 580–601. http://dx.doi.org/10.1007/s40846-017-0265-x.

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14

Fechan, Andriy, Yuriy Khoverko, Vladyslav Dalyavskii, and Taras Dyhdalovych. "Visualization of color label sensors in microelectromechanical systems." Computational Problems of Electrical Engineering 13, no. 2 (December 15, 2023): 9–14. http://dx.doi.org/10.23939/jcpee2023.02.009.

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The article presents the design and technological features of creating color labels-sensors of microelectromechanical systems intended for monitoring physicochemical parameters under the conditions of high- level electromagnetic interference. The software module of the hardware and software complex for the visualization of spectral intensity by converting it into an RGB colour model has been created. The algorithm for carrying out the procedure for calculating the color rendering index is shown and the main parameters of temperature colors in a wide range of visible radiation waves are determined

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15

Xu, L., C. Zhu, and L. Qin. "Microelectromechanical coupled dynamics." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 220, no. 10 (October 1, 2006): 1589–600. http://dx.doi.org/10.1243/09544062jmes134.

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In this paper, a continuous body, electromechanical coupled dynamic model of the micro ring, in an electrical field has been presented and its equations of motion have been given. From the analysis of the system's energy, the electromechanical coupled force has been obtained. The non-linear electromechanical coupled dynamic equations has been linearized and by means of the linear equations, the natural frequencies and vibration modes of the micro ring have been investigated. The dynamic responses of the electrical system and its changes, along with its system parameters have been investigated. These results are useful in the design and manufacture of microelectromechanical systems and can offer some reference for nanomachines.

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16

Adeosun, Oluwatosin. "Microelectromechanical Systems Lab Simulation Tool." Journal of Purdue Undergraduate Research 4, no. 1 (August 12, 2014): 74–75. http://dx.doi.org/10.5703/1288284315436.

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17

Liqin, Liu, Tang You Gang, and Wu Zhiqiang. "Nonlinear Dynamics of Microelectromechanical Systems." Journal of Vibration and Control 12, no. 1 (January 2006): 57–65. http://dx.doi.org/10.1177/1077546306061127.

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18

Bustillo, J. M., R. T. Howe, and R. S. Muller. "Surface micromachining for microelectromechanical systems." Proceedings of the IEEE 86, no. 8 (1998): 1552–74. http://dx.doi.org/10.1109/5.704260.

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19

Polla, D. L., and P. J. Schiller. "Integrated ferroelectric microelectromechanical systems (MEMS)." Integrated Ferroelectrics 7, no. 1-4 (February 1995): 359–70. http://dx.doi.org/10.1080/10584589508220246.

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20

Mehregany, M., C. A. Zorman, S. Roy, A. J. Fleischman, and N. Rajan. "Silicon carbide for microelectromechanical systems." International Materials Reviews 45, no. 3 (March 2000): 85–108. http://dx.doi.org/10.1179/095066000101528322.

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21

Zhou, Shu-Ang. "On forces in microelectromechanical systems." International Journal of Engineering Science 41, no. 3-5 (March 2003): 313–35. http://dx.doi.org/10.1016/s0020-7225(02)00207-0.

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22

Biasotti, M., L. Pellegrino, E. Bellingeri, C. Bernini, A. S. Siri, and D. Marrè. "All-Oxide Crystalline Microelectromechanical systems." Procedia Chemistry 1, no. 1 (September 2009): 839–42. http://dx.doi.org/10.1016/j.proche.2009.07.209.

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23

Soper, Steven A., Sean M. Ford, Shize Qi, Robin L. McCarley, Kevin Kelly, and Michael C. Murphy. "Peer Reviewed: Polymeric Microelectromechanical Systems." Analytical Chemistry 72, no. 19 (October 2000): 642 A—651 A. http://dx.doi.org/10.1021/ac0029511.

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24

Bao, Minhang, and Weiyuan Wang. "Future of microelectromechanical systems (MEMS)." Sensors and Actuators A: Physical 56, no. 1-2 (August 1996): 135–41. http://dx.doi.org/10.1016/0924-4247(96)01274-5.

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25

Latif, Rhonira, Enrico Mastropaolo, Andy Bunting, Rebecca Cheung, Thomas Koickal, Alister Hamilton, Michael Newton, and Leslie Smith. "Microelectromechanical systems for biomimetical applications." Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena 28, no. 6 (November 2010): C6N1—C6N6. http://dx.doi.org/10.1116/1.3504892.

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26

Seppa, H., J. Kyynarainen, and A. Oja. "Microelectromechanical systems in electrical metrology." IEEE Transactions on Instrumentation and Measurement 50, no. 2 (April 2001): 440–44. http://dx.doi.org/10.1109/19.918161.

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27

Chircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.

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The significant advancements within the electronics miniaturization field have shifted the scientific interest towards a new class of precision devices, namely microelectromechanical systems (MEMS). Specifically, MEMS refers to microscaled precision devices generally produced through micromachining techniques that combine mechanical and electrical components for fulfilling tasks normally carried out by macroscopic systems. Although their presence is found throughout all the aspects of daily life, recent years have witnessed countless research works involving the application of MEMS within the biomedical field, especially in drug synthesis and delivery, microsurgery, microtherapy, diagnostics and prevention, artificial organs, genome synthesis and sequencing, and cell manipulation and characterization. Their tremendous potential resides in the advantages offered by their reduced size, including ease of integration, lightweight, low power consumption, high resonance frequency, the possibility of integration with electrical or electronic circuits, reduced fabrication costs due to high mass production, and high accuracy, sensitivity, and throughput. In this context, this paper aims to provide an overview of MEMS technology by describing the main materials and fabrication techniques for manufacturing purposes and their most common biomedical applications, which have evolved in the past years.

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28

Hartzell, Allyson. "Optical microelectromechanical systems: designing for reliability." Journal of Micro/Nanolithography, MEMS, and MOEMS 6, no. 3 (July 1, 2007): 033010. http://dx.doi.org/10.1117/1.2775458.

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29

Yang, Yisong, Ruifeng Zhang, and Le Zhao. "Dynamics of electrostatic microelectromechanical systems actuators." Journal of Mathematical Physics 53, no. 2 (February 2012): 022703. http://dx.doi.org/10.1063/1.3684748.

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30

Lee, Y. C., B. A. Parviz, J. A. Chiou, and S. Chen. "Packaging for microelectromechanical and nanoelectromechanical systems." IEEE Transactions on Advanced Packaging 26, no. 3 (August 2003): 217–26. http://dx.doi.org/10.1109/tadvp.2003.817973.

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31

Elko, Gary W. "Small directional microelectromechanical systems microphone arrays." Journal of the Acoustical Society of America 133, no. 5 (May 2013): 3317. http://dx.doi.org/10.1121/1.4805527.

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32

Griggio, F., H. Kim, S. O. Ural, T. N. Jackson, K. Choi, R. L. Tutwiler, and S. Trolier-Mckinstry. "Medical Applications of Piezoelectric Microelectromechanical Systems." Integrated Ferroelectrics 141, no. 1 (January 2013): 169–86. http://dx.doi.org/10.1080/10584587.2012.694741.

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33

Bryzek, J., A. Flannery, and D. Skurnik. "Integrating microelectromechanical systems with integrated circuits." IEEE Instrumentation & Measurement Magazine 7, no. 2 (June 2004): 51–59. http://dx.doi.org/10.1109/mim.2004.1304566.

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34

Anscombe, N. "Good things, small packages [microelectromechanical systems]." Manufacturing Engineer 83, no. 3 (June 1, 2004): 10–13. http://dx.doi.org/10.1049/me:20040301.

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35

Riddle, A. "Nano- and microelectromechanical systems [Book Review]." IEEE Microwave Magazine 2, no. 4 (December 2001): 84–85. http://dx.doi.org/10.1109/mmw.2001.969938.

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36

Khuri‐Yakub, B. T. "Smart structures and microelectromechanical systems (MEMS)." Journal of the Acoustical Society of America 106, no. 4 (October 1999): 2233. http://dx.doi.org/10.1121/1.427599.

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37

Maluf, Nadim. "An Introduction to Microelectromechanical Systems Engineering." Measurement Science and Technology 13, no. 2 (January 16, 2002): 229. http://dx.doi.org/10.1088/0957-0233/13/2/701.

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38

Tadigadapa, Srinivas. "Piezoelectric microelectromechanical systems — challenges and opportunities." Procedia Engineering 5 (2010): 468–71. http://dx.doi.org/10.1016/j.proeng.2010.09.148.

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39

Freidhoff, C. B., R. M. Young, S. Sriram, T. T. Braggins, T. W. O'Keefe, J. D. Adam, H. C. Nathanson, et al. "Chemical sensing using nonoptical microelectromechanical systems." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 17, no. 4 (July 1999): 2300–2307. http://dx.doi.org/10.1116/1.581764.

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40

Gall, K., P. Kreiner, D. Turner, and M. Hulse. "Shape-Memory Polymers for Microelectromechanical Systems." Journal of Microelectromechanical Systems 13, no. 3 (June 2004): 472–83. http://dx.doi.org/10.1109/jmems.2004.828727.

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41

Ezawa, Motohiko. "Topological microelectromechanical systems." Physical Review B 103, no. 15 (April 26, 2021). http://dx.doi.org/10.1103/physrevb.103.155425.

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42

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 30, no. 2 (April 2021): C2. http://dx.doi.org/10.1109/jmems.2021.3063826.

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43

Chu, V., J. Gaspar, and J. P. Conde. "Thin Film Microelectromechanical Systems." MRS Proceedings 715 (2002). http://dx.doi.org/10.1557/proc-715-a12.3.

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AbstractThis paper presents the fabrication and characterization of MEMS structures on glass substrates using thin film silicon technology and surface micromachining. The technology developed to process bridge and cantilever structures as well as the electromechanical characterization of these structures is discussed. This technology can enable the expansion of MEMS to applications requiring large area and/or flexible substrates. The main results for the characterization of the movement of the structures are as follows: (1) in the quasi-DC regime and at low applied voltages, the response is linear with the applied dc voltage. Using an electromechanical model which takes into account the constituent materials and geometry of the bilayer, it is possible to extract the deflection of the structures. This estimate suggests that it is possible to control the actuation of these structures to deflections on the sub-nanometric scale; (2) resonance frequencies of up to 20 MHz have been measured on hydrogenated amorphous silicon (a-Si:H) bridge structures with quality factors (Q) of 70-100 in air. The frequency depends inversely on the square of the structure length, as predicted by the mechanical model; and (3) using an integrated permanent magnet/magnetic sensor system, it is possible to measure the structure movement on-chip and to obtain an absolute calibration of the deflection of the structures.

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44

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 30, no. 1 (February 2021): C2. http://dx.doi.org/10.1109/jmems.2020.3038296.

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45

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 31, no. 4 (August 2022): C2. http://dx.doi.org/10.1109/jmems.2022.3189490.

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46

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 31, no. 3 (June 2022): C2. http://dx.doi.org/10.1109/jmems.2022.3172163.

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47

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 30, no. 6 (December 2021): C2. http://dx.doi.org/10.1109/jmems.2021.3123770.

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48

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 30, no. 3 (June 2021): C2. http://dx.doi.org/10.1109/jmems.2021.3077790.

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49

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 30, no. 4 (August 2021): C2. http://dx.doi.org/10.1109/jmems.2021.3095642.

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50

"Journal of Microelectromechanical Systems." Journal of Microelectromechanical Systems 31, no. 2 (April 2022): C2. http://dx.doi.org/10.1109/jmems.2022.3158710.

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