Dissertations / Theses on the topic 'Microelectromechanical systems'
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Murarka, Apoorva. "Contact-printed microelectromechanical systems." Thesis, Massachusetts Institute of Technology, 2012. http://hdl.handle.net/1721.1/77080.
Full textCataloged from PDF version of thesis.
Includes bibliographical references (p. 105-107).
Microelectromechanical systems (MEMS) are ubiquitous. Scalable large-area arrays of MEMS on a variety of substrates, including flexible substrates, have many potential applications. Novel methods for additive fabrication of thin (125±15 nm thick) suspended gold membranes on a variety of rigid and flexible cavity-patterned substrates for MEMS applications are reported. The deflection of these membranes, suspended over cavities in a dielectric layer atop a conducting electrode, can be used to produce sounds or monitor pressure. The reported fabrication methods employ contact-printing, and avoid fabrication of MEMS diaphragms via wet or deep reactive-ion etching, which in turn removes the need for etch-stops and wafer bonding. Elevated temperature processing is also avoided to enable MEMS fabrication on flexible polymeric substrates. Thin films up to 12.5 mm2 in area are fabricated. The MEMS devices are electrically actuated and the resulting membrane deflection is characterized using optical interferometry. Preliminary sound production is demonstrated, and further applications of this technology are discussed.
by Apoorva Murarka.
M.Eng.
Latif, Rhonira. "Microelectromechanical systems for biomimetical application." Thesis, University of Edinburgh, 2013. http://hdl.handle.net/1842/7955.
Full textLemay, Scott A. "Microelectromechanical propulsion systems for spacecraft." Thesis, Monterey, California. Naval Postgraduate School, 2002. http://hdl.handle.net/10945/5883.
Full textRamaswamy, Deepak 1974. "Simulation tools for microelectromechanical systems." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8625.
Full textIncludes bibliographical references (p. 101-104).
In this thesis efficient techniques to solve complex 3-D electromechanical problems are developed. Finite element discretization of complex structures such as the micromirror lead to thousands of internal degrees of freedom. Their mostly rigid motion is exploited leading to a mixed rigid-elastic formulation. This formulation's advantage is apparent when it is incorporated in an efficient coupled domain simulation technique and examples are presented exploring geometry effects on device behavior. Then for system level simulation where full device simulation costs add up we need models with much reduced order with little degradation in accuracy. We describe a model reduction formulation for the electromechanical problem based on implicit techniques which accurately capture the original model behavior.
by Deepak Ramaswamy.
Ph.D.
Then, Alan M. (Alan Michael) 1965. "Commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8920.
Full textIncludes bibliographical references (leaves 69-72).
Microelectromechanical systems (MEMS), at their core are a set of technologies that employ the processes developed in the integrated circuit (IC) and semiconductor industries to construct electro- mechanical devices. In the case of Microopticelectromechanical systems (MOEMS), optical elements are also integrated into these devices. MEMS technology holds the promise of significantly miniaturizing, reducing the cost of, and enhancing the performance of many sensors and actuators, evidence its widespread use in the manufacture of accelerometers, ink jet printer heads and various chemical gas sensors. Despite its stellar success in these "killer-applications," MEMS technology has failed to realize the widespread success many had predicted for it. Nonetheless, this technology has recently been explored extensively for new electro-optics applications, specifically in telecommunications for dense wavelength division multiplexing (DWDM) and optical switching. This thesis examines various models of dynamic technology adoption and explores how they apply to MEMS technology. Furthermore, by way of historical comparison to the development of application specific integrated circuit (ASIC), it will identify various developmental similarities. Finally, a unique model outlining the critical driving forces behind the adoption of MEMS technology will be constructed.
by Alan M. Then.
S.M.M.O.T.
Cragun, Rebecca. "Thermal microactuators for microelectromechanical systems /." Diss., CLICK HERE for online access, 1999. http://contentdm.lib.byu.edu/ETD/image/etd170.pdf.
Full textWilson, Aubrey Marie Mueller. "Transgene Delivery via Microelectromechanical Systems." BYU ScholarsArchive, 2012. https://scholarsarchive.byu.edu/etd/3936.
Full textRuzziconi, Laura. "Nonlinear dynamics in microelectromechanical systems." Doctoral thesis, Università Politecnica delle Marche, 2011. http://hdl.handle.net/11566/242133.
Full textThis dissertation deals with the nonlinear dynamics in MEMS devices. The nonlinear dynamic topics currently addressed in the literature are essential to investigate their response. The accuracy of the nonlinear dynamic modeling is important to guarantee the reliability of the results and current nonlinear dynamic tools succeed in carefully interpreting the experimental data of the response of these devices. The dissertation considers two different case-studies. The first case-study is a MEMS device with axial load, very shallow arched initial shape and electrostatic and electrodynamic actuation. It is analyzed in the neighborhood of the bifurcation from a single potential well to a twin well. Both the nonlinear static configurations and the linear dynamic analysis cannot be solved in closed form and they are approximated by the Galerkin technique. They are used to derive an accurate single degree of freedom reduced order model of the nonlinear dynamics. In this model the fifth order term (connected to the Taylor expansion in the equation of motion) is removed to obtain a good approximation of the potential wells and of the global behavior. Other reduced order models are considered and compared. The nonlinear dynamic analysis is performed, with the combined use of frequency response curves, attractor-basins phase portraits and behavior charts. In a neighborhood of each natural frequency, the response of the device has the typical characteristics of a softening oscillator. The cases of the single and the double potential well are compared. The second case-study analyzes the experimental dynamic pull-in data at primary resonance for a MEMS device (a capacitive accelerometer). Starting from this particular case, the issue of the dynamical integrity in a mechanical system is addressed. Its qualitative evaluation is performed, choosing the most suitable tools according to the considered experimental conditions. The effectiveness of this analysis is highlighted, showing the accuracy of the curves of constant percentage of integrity factor in interpreting the existence of disturbances in experiments and practice. Also, their use in a design is proposed.
Lusk, Craig P. "Ortho-Planar Mechanisms for Microelectromechanical Systems." Diss., CLICK HERE for online access, 2005. http://contentdm.lib.byu.edu/ETD/image/etd902.pdf.
Full textZeng, Yang. "Finite Element Methods for Microelectromechanical Systems." Thesis, Uppsala University, Department of Information Technology, 2009. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-110896.
Full textThe stationary Joule heating problem is a crucial multiphysical problem for many microelectromechanical (MEMS) applications. In our paper, we derive a finite element method for this problem and introduce iterative solution-techniques to compute the numerical simulation. Further we construct an adaptive algorithm for mesh refinement based on a posteriori error estimation.Finally, we present two numerical tests: convergences analysis of different iterative methods for distinct materials which are classified by electrical conductivities, and a test of the new adaptive refinement algorithm. All the numerical implementations have been done in MATLAB.
Robinson, Gary Neil 1960. "The commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9534.
Full textIncludes bibliographical references (leaf 80).
Microelectromechanical systems (MEMS) comprise a set of technologies for the micromachining and electromechanical integration of sensors and actuators. MEMS allow for the radical miniaturization of such devices, as well as for significant improvements in performance and cost over conventionally fabricated mechanical and electrical components. In this thesis, I attempt to assess the value inherent in MEMS innovations and to understand how companies have tried to capture that value. In doing so, I assess the pathways and prospects for the commercialization of MEMS-based devices. I have chosen to focus on two classes of devices: (1) micromachined accelerometers for crash sensing and subsequent air bag deployment in automobiles, and (2) microfabricated chemical sensing and analysis devices for detecting and quantifying gas phase molecules, analyzing complex molecular mixtures, and carrying out high throughput screening of chemical compounds. Accelerometers are an example of a MEMS-based sensor that has almost completely displaced existing electromechanical substitute devices. Applications of MEMS to chemical sensing and analysis, however, are less mature and widespread adoption is less assured. In both cases, I evaluate the opportunities in the new technology from several different perspectives: (1) the factors that affect the transition from innovative technologies to marketable products; (2) the economic, market, and strategic forces that influence the adoption of these products; and (3) the business models of companies that have attempted to profit from MEMS innovations. I conclude the thesis with a chapter on potential strategic market barriers to successful commercialization of MEMS-based devices.
by Gary N. Robinson.
S.M.M.O.T.
Cragun, Rebecca. "Thermal Microactuators for Microelectromechanical Systems (MEMS)." BYU ScholarsArchive, 2003. https://scholarsarchive.byu.edu/etd/54.
Full textLienstromberg, Christina. "On Microelectromechanical Systems with General Permittivity." Thesis, Université Paris-Saclay (ComUE), 2016. http://www.theses.fr/2016SACLN007/document.
Full textIn the framework of this thesis physical/mathematical models for microelectromechanical systems with general permittivity have been developed and analysed with modern mathematical methods from the domain of partial differential equations. In particular these systems are moving boundary problems and thus difficult to handle. Numerical methods have been developed in order to validate the obtained analytical results
Kim, Seong Jin Dean Robert Neal. "An evaluation system for mechanical and electrical characterization of MEMS devices." Auburn, Ala, 2009. http://hdl.handle.net/10415/1592.
Full textCorkovic, Silvana. "Piezoelectric thick films for microelectromechanical systems application." Thesis, Cranfield University, 2007. http://dspace.lib.cranfield.ac.uk/handle/1826/1826.
Full textHill, Tyrone F. (Tyrone Frank) 1980. "Analysis of DRIE uniformity for microelectromechanical systems." Thesis, Massachusetts Institute of Technology, 2004. http://hdl.handle.net/1721.1/18060.
Full textIncludes bibliographical references (p. 81-82).
A quantitative model capturing pattern density effects in Deep Reactive Ion Etch (DRIE), which are important in MEMS, is presented. Our previous work has explored the causes of wafer-level variation and demonstrated die-to-die interactions resulting from pattern density and reactant species consumption. Several reports have focused on experimental evidence and modeling of feature level (aspect ratio) dependencies. This thesis contributes a computationally efficient and effective modeling approach which focuses on layout pattern density-induced nonuniformity in DRIE. This is a key component in an integrated model combining wafer-, die-, and feature-level DRIE dependencies to predict etch depth for an input layout and a characterized etch tool and process. The modeling approach proposed here is inspired by previous work in modeling of chemical mechanical polishing (CMP). Computationally, this involves the convolution of an etch "layout impulse response" function or filter with the layout information (or equivalently but more efficiently the multiplication of FFTs). The proposed model is validated by using a mask layer from the MIT Microengine project as a demonstration layout. The model can be tuned to predict the etch behavior to an accuracy of 0.1% RMS normalized error. Furthermore, a feature level model, which considers the effects of sidewall loading on the depletion of reactants is presented. Finally, methods of synthesizing dummy features to improve across-die uniformity in a layout are explored; a by tiling bare areas of the wafer into "fill zones," an improvement in intra-die uniformity is seen. In summary, a semi-empirical modeling approach has been developed for predicting the layout dependent pattern density nonuniformities present
(cont.) in DRIE. The approach can be tuned to specific tools and processes, and is computationally efficient. The model can serve as the basis for layout optimization to improve DRIE uniformity.
by Tyrone F. Hill.
S.M.
Steyn, J. Lodewyk (Jasper Lodewyk) 1976. "Hydraulic amplification for actuation in microelectromechanical systems." Thesis, Massachusetts Institute of Technology, 2002. http://hdl.handle.net/1721.1/16834.
Full textIncludes bibliographical references (p. [121]-123).
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
In this work the concept of hydraulic amplification as a means of stroke amplification is explored for applications in MicroElectroMechanical Systems (MEMS). Building on the batch fabrication technologies of the semiconductor industry, MEMS technology could enable the simultaneous fabrication of multiple microhydraulic systems of which hydraulic amplifiers would form part. Precision lithography would furthermore make dense arrays of microhydraulic systems possible, with the eventual goal being to create high power density microscale actuation and power generation systems. This document provides an overview of the design considerations required for a successful microfabricated hydraulic amplifier, and proceeds to discuss the techniques developed to successfully fabricate, assemble and test such a device. Deep Reactive Ion Etching (DRIE) techniques were developed for creating strong tethered membrane structures using Silicon On Insulator (SOI) technology. Bonding techniques included silicon-silicon fusion bonding of fragile wafers and silicon-glass anodic bonding and alignment on the wafer and die level to produce multi-layered structures. Liquid filling of micromachined dead volumes through micron-size channels was performed. Static sealing techniques for leak-free sealing of micromachined, filled dead volumes with minimal seal compression and dynamic sealing techniques when quasi-static actuation is not a prerequisite were successfully developed. Using these techniques, several hydraulic amplification devices have been produced. Testing of these devices revealed good correlation with theoretical predictions. Stroke amplification ratios as high as 48 : 1 have been observed. In addition, natural frequencies of up to 10kHz were measured. In conclusion, this work verifies the viability of hydraulic amplification for applications in microscale actuation systems.
by J. Lodewyk Steyn.
S.M.
Martyniuk, Mariusz. "Low-temperature micro-opto-electro-mechanical technologies for temperature sensitive substrates." University of Western Australia. School of Electrical, Electronic and Computer Engineering, 2006. http://theses.library.uwa.edu.au/adt-WU2007.0042.
Full textGiner, de Haro Joan Josep. "Development of microelectromechanical systems for RF signal processing." Doctoral thesis, Universitat Autònoma de Barcelona, 2012. http://hdl.handle.net/10803/96241.
Full textThe objective of this thesis is the study of CMOS MEMS monolithically integrated resonators, for RF transceivers applications. In particular, it has focuses on design and characterization of RF resonators and filters. Two types of filter concepts have been investigated: series filtering and parallel filtering. The series filters are composed of two different coupling methods: mechanical couplings that are divided into two types of couplers (the U-coupler and the V-coupler), and the electrostatic coupling. In mechanical coupled resonator filters, the bandwidth is fixed through the coupler design and the selection of its coupling point with the resonator whereas in the electrostatic filters the voltage applied between the constituent resonators fixes the bandwidth. The parallel filter allows increasing the out of band rejection due to the integration with circuitry. Finally, the parallel filtering and series filtering have been combined to achieve a dual filter. In the field of RF resonators, two types of resonator based on longitudinal acoustic resonance have been designed, fabricated, and measured: The enhanced LBAR, that includes to masses at the free ends in order to increase the coupling area, works at 250MHz and the hyperbolic LBAR that is capable to reach 380MHz resonant frequency. The electrostatic actuated mad capacitive read MEM devices characterization has been studied. In addition a new four-electrode based topology has been propose in order to cancel the feedthrough current that exists in this type of transduction.
Frank, Niklaus. "Adhesive Wafer Bonding for Microelectronic and Microelectromechanical Systems." Doctoral thesis, KTH, Signals, Sensors and Systems, 2002. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-3410.
Full textSemiconductor wafer bonding has been a subject of interestfor many years and a wide variety of wafer bonding techniqueshave been reported in literature. In adhesive wafer bondingorganic and inorganic adhesives are used as intermediatebonding material. The main advantages of adhesive wafer bondingare the relatively low bonding temperatures, the lack of needfor an electric voltage or current, the compatibility withstandard CMOS wafers and the ability to join practically anykind of wafer materials. Adhesive wafer bonding requires nospecial wafer surface treatmentssuch as planarisation.Structures and particles at the wafer surfaces can be toleratedand compensated for some extent by the adhesive material.Adhesive wafer bonding is a comparably simple, robust andlowcost bonding process. In this thesis, adhesive wafer bondingtechniques with different polymer adhesives have beendeveloped. The relevant bonding parameters needed to achievehigh quality and high yield wafer bonds have been investigated.A selective adhesive wafer bonding process has also beendeveloped that allows localised bonding on lithographicallydefined wafer areas.
Adhesive wafer bonding has been utilised in variousapplication areas. A novel CMOS compatible film, device andmembrane transfer bonding technique has been developed. Thistechnique allows the integration of standard CMOS circuits withthin film transducers that can consist of practically any typeof crystalline or noncrystalline high performance material(e.g. monocrystalline silicon, gallium arsenide,indium-phosphide, etc.). The transferred transducers or filmscan be thinner than 0.3 µm. The feature sizes of thetransferred transducers can be below 1.5 µm and theelectrical via contacts between the transducers and the newsubstrate wafer can be as small as 3x3 µm2. Teststructures for temperature coefficient of resistancemeasurements of semiconductor materials have been fabricatedusing device transfer bonding. Arrays of polycrystallinesilicon bolometers for use in uncooled infrared focal planearrays have been fabricated using membrane transfer bonding.The bolometers consist of free-hanging membrane structures thatare thermally isolated from the substrate wafer. Thepolycrystalline silicon bolometers are fabricated on asacrificial substrate wafer. Subsequently, they are transferredand integrated on a new substrate wafer using membrane transferbonding. With the same membrane transfer bonding technique,arrays of torsional monocrystalline silicon micromirrors havebeen fabricated. The mirrors have a size of 16x16 µm2 anda thickness of 0.34 µm. The advantages of micromirrorsmade of monocrystalline silicon are their flatness, uniformityand mechanical stability. Selective adhesive wafer bonding hasbeen used to fabricate very shallow cavities that can beutilised in packaging and component protection applications. Anew concept is proposed that allows hermetic sealing ofcavities fabricated using adhesive wafer bonding. Furthermore,microfluidic devices, channels and passive valves for use inmicro total analysis systems are presented.
Adhesive wafer bonding is a generic CMOS compatible bondingtechnique that can be used for fabrication and integration ofvarious microsystems such as infrared focal plane arrays,spatial light modulators, microoptical systems, laser systems,MEMS, RF-MEMS and stacking of active electronic films forthree-dimensional high-density integration of electroniccircuits. Adhesive wafer bonding can also be used forfabrication of microcavities in packaging applications, forwafer-level stacking of integrated circuit chips (e.g. memorychips) and for fabrication of microfluidic systems.
Lienstromberg, Christina [Verfasser]. "On microelectromechanical systems with general permittivity / Christina Lienstromberg." Hannover : Technische Informationsbibliothek (TIB), 2016. http://d-nb.info/1099105137/34.
Full textFarnsworth, Michael. "Multi-level and multidisciplinary optimisation of microelectromechanical systems." Thesis, Cranfield University, 2012. http://dspace.lib.cranfield.ac.uk/handle/1826/8048.
Full textChua, D. H. C. "Diamond-like carbon for microelectromechanical systems (MEMS) applications." Thesis, University of Cambridge, 2005. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.597675.
Full textRoberts, Robert Christopher. "Jet Printed Au Nanoparticle Films For Microelectromechanical Systems." Case Western Reserve University School of Graduate Studies / OhioLINK, 2012. http://rave.ohiolink.edu/etdc/view?acc_num=case1342809712.
Full textMangels, John Donald III, Syed Ammar Raza, Kevin Mueller, Namrah Habib, Josh Raymond, Daniel Brauer, Mohammed Azri Adb Rahim, et al. "Micro-Air Vehicle Control Using Microelectromechanical Systems Sensors." Thesis, The University of Arizona, 2017. http://hdl.handle.net/10150/625078.
Full textRaza, Syed Ammar, Kevin Mueller, Daniel Brauer, Namrah Habib, John Mangels, Azri Rahim, Joshua Raymond, et al. "Micro-Air Vehicle Control Using Microelectromechanical Systems Sensors." Thesis, The University of Arizona, 2017. http://hdl.handle.net/10150/625128.
Full textMoulton, Kellen S. "Straightness of Growth for Carbon Nanotube Microelectromechanical Systems." BYU ScholarsArchive, 2010. https://scholarsarchive.byu.edu/etd/2413.
Full textJoung, Yeun-Ho. "Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures." Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04052004-180025/unrestricted/joung%5Fyeun-ho%5F200312%5Fphd.pdf.
Full textLee, Wook. "Diffraction-based integrated optical readout for micromachined optomechanical sensors." Diss., Available online, Georgia Institute of Technology, 2006, 2006. http://etd.gatech.edu/theses/available/etd-09292006-115918/.
Full textF. Levent Degertekin, Committee Chair ; David S. Citrin, Committee Member ; Paul E. Hasler, Committee Member ; Peter J. Hesketh, Committee Member ; Zhiping Zhou, Committee Member.
Wittwer, Jonathan W. "Simulation-Based Design Under Uncertainty for Compliant Microelectromechanical Systems." Diss., CLICK HERE for online access, 2005. http://contentdm.lib.byu.edu/ETD/image/etd723.pdf.
Full textDelRio, Frank William. "Van der Waals and capillary adhesion in microelectromechanical systems." Diss., Connect to online resource, 2006. http://gateway.proquest.com/openurl?url_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:dissertation&res_dat=xri:pqdiss&rft_dat=xri:pqdiss:3239374.
Full textReynen, Gregory Peter. "Leveraging eigenvalue veering for improved sensing with microelectromechanical systems." Thesis, University of British Columbia, 2012. http://hdl.handle.net/2429/42808.
Full textMa, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.
Full textCookson, Jeremy L. "A method for testing the dynamic accuracy of Microelectro-Mechanical Systems (MEMS) Magnetic, Angular Rate, and Gravity (MARG) sensors for Inertial Navigation Systems (INS) and human motion tracking applications." Thesis, Monterey, California : Naval Postgraduate School, 2010. http://edocs.nps.edu/npspubs/scholarly/theses/2010/Jun/10Jun%5FCookson.pdf.
Full textThesis Advisor(s): Yun, Xiaoping ; Second Reader: Romano, Marcello. "June 2010." Description based on title screen as viewed on July 14, 2010. Author(s) subject terms: micro-electro-mechanical systems, MEMS, magnetic, angular rate, gravity sensor, MARG sensors, inertial navigation system, INS, inertial test, MicroStrain, 3DM-GX1, 3DMGX3, CompactRIO, MATLAB GUI, dynamic accuracy test. Includes bibliographical references (p. 187-189). Also available in print.
Cho, Jeong-Hyun. "Design, fabrication, and characterization of a MEMS thermal switch and integration with a dynamic micro heat engine." Online access for everyone, 2007. http://www.dissertations.wsu.edu/Dissertations/Fall2007/J_Cho_111607.pdf.
Full textMustafa, Haithem Ali Babiker. "Development of a noncontact current sensor based on MEMS technology." Thesis, Cape Peninsula University of Technology, 2007. http://hdl.handle.net/20.500.11838/1082.
Full textMost ofMEMS sensors are based on the micro-cantilever technology, which use wide range of different design materials and structures. The benefit ofMEMS technology is in developing devices having lower cost, lower power consumption, higher performance, and integration. A free-end cantileverbeam made of magnetic material (PerrnaIloy) and a movable mass attached to the free-end has been designed using MEMS software tools. The magnetic material was used to improve the sensitivity of the cantilever-beam to an external applied magnetic field. The deflection of the cantilever was detected using capacitive sensing method. The aim of this research was to develop a non-contact current sensor based on MEMS technology by analysing the simulation of the system design of the micro cantilever when subjected to a magnetic field produced by a current-carrying conductor. When the signal, a sinusoidal current with a constant frequency is applied, the cantilever-beam exhibits a vibration motion along the vertical axis when it is placed closer to the line current. This creates corresponding capacitance changes and generates a voltage output proportional to the capacitive change in the signal processing circuitry attached to the micro cantilever. Modelling of the magnetic moment of a magnetic cantilever-beam placed in a field, the deflection of { the beam, the natural frequency of the cantilever-beam, the maximum deflection, the change in differential capacitive sensing technique, linearity of the differential capacitive, and capacitive sensitivity the circuit designed for readout was derived.
Machiraju, Harita. "Thermal analysis and design of a MEMS-based safety and arming system." Diss., Online access via UMI:, 2007.
Find full textDawson, Jeremy M. "Through-wafer interrogation of MEMS device motion." Morgantown, W. Va. : [West Virginia University Libraries], 1999. http://etd.wvu.edu/templates/showETD.cfm?recnum=856.
Full textTitle from document title page. Document formatted into pages; contains xii, 122 p. : ill. (some col.) Includes abstract. Includes bibliographical references (p. 119-122).
Forester, Sean M. "Energy harvesting for self-powered, ultra-low power microsystems with a focus on vibration-based electromechanical conversion." Thesis, Monterey, California : Naval Postgraduate School, 2009. http://edocs.nps.edu/npspubs/scholarly/theses/2009/Sep/09Sep%5FForester.pdf.
Full textThesis Advisor(s): Singh, Gurminder ; Gibson, John. "September 2009." Description based on title screen as viewed on November 6, 2009. Author(s) subject terms: Microelectromechanical systems, photovoltaic, piezoelectric, thermocouple, power harvesting, energy scavenging, thermoelectric. Includes bibliographical references (p. 59-65). Also available in print.
Xiong, Xiaorong. "Controlled multi-batch self-assembly of micro devices /." Thesis, Connect to this title online; UW restricted, 2004. http://hdl.handle.net/1773/5917.
Full textWang, Limin. "Modeling and real-time feedback control of MEMS device." Morgantown, W. Va. : [West Virginia University Libraries], 2004. https://etd.wvu.edu/etd/controller.jsp?moduleName=documentdata&jsp%5FetdId=3711.
Full textTitle from document title page. Document formatted into pages; contains v, 132 p. : ill. (some col.). Includes abstract. Includes bibliographical references (p. 128-132).
Alastalo, Ari. "Microelectromechanical resonator-based components for wireless communications : filters and transmission lines /." Espoo VTT, 2006. http://www.vtt.fi/inf/pdf/publications/2006/P616.pdf.
Full textBolognini, Francesca. "An integrated simulation-based generative design method for microelectromechanical systems." Thesis, University of Cambridge, 2009. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.611409.
Full textKlaubert, Heather L. "Tiny design : a study of the design of microelectromechanical systems." Thesis, University of Cambridge, 1998. https://www.repository.cam.ac.uk/handle/1810/272160.
Full textYounis, Mohammad Ibrahim. "Modeling and Simulation of Microelectromechanical Systems in Multi-Physics Fields." Diss., Virginia Tech, 2004. http://hdl.handle.net/10919/11202.
Full textPh. D.
Xuqian, Zheng. "Lead Zirconate Titanate Piezoelectric Cantilevers for Multimode Vibrating Microelectromechanical Systems." Case Western Reserve University School of Graduate Studies / OhioLINK, 2015. http://rave.ohiolink.edu/etdc/view?acc_num=case1428592535.
Full textNabholz, Ulrike. "Physical Modelling and Identification of Nonlinear Effects in Microelectromechanical Systems." Universitätsverlag Chemnitz, 2020. https://monarch.qucosa.de/id/qucosa%3A73139.
Full textAnalytische und semi-analytische physikalische Modelle für MEMS werden aus der nichtlinearen Mechanik abgeleitet. Durch die Berücksichtigung systemspezifischer Merkmale und Annahmen, ermöglicht die Systemidentifikation das Ableiten eines mathematischen Modells, das auf den analysierten Effekt und das MEMS zugeschnitten ist. Ein solches Modell kann für die Erklärung der nichtlinearen Dynamik einzelner MEMS herangezogen werden und bildet erfolgreich nichtlineare Effekte nach, einschließlich des resonanten Aufschwingens von Parasitärmoden. Die durchgeführten Analysen bestätigen auch, dass geringe Abweichungen im Modenspektrum zwischen Bauteilen das Auftreten nichtlinearer Effekte beeinflussen.:1 Introduction 2 MEMS: Design, Devices & Modelling 3 Nonlinear Mechanics of Dynamical Systems 4 Modelling Approach 5 System Identification & Characterization 6 Conclusion
Rittenhouse, Scott A. "Diagnosis of operational changes in microelectromechanical systems via fault detection." Morgantown, W. Va. : [West Virginia University Libraries], 2004. https://etd.wvu.edu/etd/controller.jsp?moduleName=documentdata&jsp%5FetdId=3632.
Full textTitle from document title page. Document formatted into pages; contains v, 141 p. : ill. (some col.). Includes abstract. Includes bibliographical references (p. 137-141).
Lemay, Scott A. "Microelectromecanical propulsion systems for spacecraft." Monterey, California: Naval Postgraduate School, 2002. http://hdl.handle.net/10945/9767.
Full textThis is a survey of current research on micropropulsion options for very small satellites (less than ten kilogram). The concentration of research and performance evaluations utilize Micro Systems Technology (MST) and Micro Electromechanical Systems technology (MEMS) integrated with existing theories. State of the art methods used for the design and manufacturing of MEMS devices are included to provide a size perspective of microthruster technology. Nine viable microthruster options are presented, including a detailed performance analysis of the Pulsed Plasma Thruster. Exploration of the future role of micropropulsion in space is the influential factor benefiting research efforts on extremely small scale microthrusters. Significant background information on astrodynamics is included to assist the intended reader: a student of Engineering Science with interest in the Aerospace Propulsion Industry.
Kanikella, Phaninder Reddy. "Process development and applications of a dry film photoresist." Diss., Rolla, Mo. : University of Missouri-Rolla, 2007. http://scholarsmine.umr.edu/thesis/pdf/Kanikella_09007dcc803c3a3a.pdf.
Full textVita. The entire thesis text is included in file. Title from title screen of thesis/dissertation PDF file (viewed December 6, 2007) Includes bibliographical references.