Academic literature on the topic 'Microelectromechanical systems technology'

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Journal articles on the topic "Microelectromechanical systems technology"

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Liepmann, Dorian, Albert P. Pisano, and Burton Sage. "Microelectromechanical Systems Technology to Deliver Insulin." Diabetes Technology & Therapeutics 1, no. 4 (December 1999): 469–76. http://dx.doi.org/10.1089/152091599317026.

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Lucyszyn, S. "Review of radio frequency microelectromechanical systems technology." IEE Proceedings - Science, Measurement and Technology 151, no. 2 (March 1, 2004): 93–103. http://dx.doi.org/10.1049/ip-smt:20040405.

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Liu, A. Q., X. M. Zhang, H. Cai, D. Y. Tang, and C. Lu. "Miniaturized injection-locked laser using microelectromechanical systems technology." Applied Physics Letters 87, no. 10 (September 5, 2005): 101101. http://dx.doi.org/10.1063/1.2035321.

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Zhang, X. M., A. Q. Liu, D. Y. Tang, and C. Lu. "Discrete wavelength tunable laser using microelectromechanical systems technology." Applied Physics Letters 84, no. 3 (January 19, 2004): 329–31. http://dx.doi.org/10.1063/1.1639130.

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Yokoyama, Yoshisato, Takashi Fukushige, Seiichi Hata, Kazuya Masu, and Akira Shimokohbe. "On-Chip Variable Inductor Using Microelectromechanical Systems Technology." Japanese Journal of Applied Physics 42, Part 1, No. 4B (April 30, 2003): 2190–92. http://dx.doi.org/10.1143/jjap.42.2190.

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Bishop, David, Arthur Heuer, and David Williams. "Microelectro-mechanical Systems: Technology and Applications." MRS Bulletin 26, no. 4 (April 2001): 282–88. http://dx.doi.org/10.1557/mrs2001.60.

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Microelectromechanical systems, or MEMS, constitute a group of microdevices that are just beginning to affect many areas of science and technology. In diverse fields including the automotive industry, aeronautics, cellular communications, chemistry, acoustics, and display technologies and other photonic systems, these highly functional devices are making a big name for themselves, despite their diminutive size.
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Korikov, A. M., and Y. E. Meshcheryakov. "Orientation of mining technology machines based on microelectromechanical systems." Proceedings of Tomsk State University of Control Systems and Radioelectronics 21, no. 4 (2018): 92–97. http://dx.doi.org/10.21293/1818-0442-2018-21-4-92-97.

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Chircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.

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The significant advancements within the electronics miniaturization field have shifted the scientific interest towards a new class of precision devices, namely microelectromechanical systems (MEMS). Specifically, MEMS refers to microscaled precision devices generally produced through micromachining techniques that combine mechanical and electrical components for fulfilling tasks normally carried out by macroscopic systems. Although their presence is found throughout all the aspects of daily life, recent years have witnessed countless research works involving the application of MEMS within the biomedical field, especially in drug synthesis and delivery, microsurgery, microtherapy, diagnostics and prevention, artificial organs, genome synthesis and sequencing, and cell manipulation and characterization. Their tremendous potential resides in the advantages offered by their reduced size, including ease of integration, lightweight, low power consumption, high resonance frequency, the possibility of integration with electrical or electronic circuits, reduced fabrication costs due to high mass production, and high accuracy, sensitivity, and throughput. In this context, this paper aims to provide an overview of MEMS technology by describing the main materials and fabrication techniques for manufacturing purposes and their most common biomedical applications, which have evolved in the past years.
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Choe, Howard C., and Emel S. Bulat. "Systems and methods for sensing an acoustic signal using microelectromechanical systems technology." Journal of the Acoustical Society of America 118, no. 1 (2005): 25. http://dx.doi.org/10.1121/1.1999410.

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Kota, S., G. K. Ananthasuresh, S. B. Crary, and K. D. Wise. "Design and Fabrication of Microelectromechanical Systems." Journal of Mechanical Design 116, no. 4 (December 1, 1994): 1081–88. http://dx.doi.org/10.1115/1.2919490.

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An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. Alternate physical forms of the conventional joints are considered to improve the manufacturability of micromechanisms and the idea of using compliant mechanisms for micromechanical applications is put forth. The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
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Dissertations / Theses on the topic "Microelectromechanical systems technology"

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Then, Alan M. (Alan Michael) 1965. "Commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 2001. http://hdl.handle.net/1721.1/8920.

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Thesis (S.M.M.O.T.)--Massachusetts Institute of Technology, Sloan School of Management, Management of Technology Program, 2001.
Includes bibliographical references (leaves 69-72).
Microelectromechanical systems (MEMS), at their core are a set of technologies that employ the processes developed in the integrated circuit (IC) and semiconductor industries to construct electro- mechanical devices. In the case of Microopticelectromechanical systems (MOEMS), optical elements are also integrated into these devices. MEMS technology holds the promise of significantly miniaturizing, reducing the cost of, and enhancing the performance of many sensors and actuators, evidence its widespread use in the manufacture of accelerometers, ink jet printer heads and various chemical gas sensors. Despite its stellar success in these "killer-applications," MEMS technology has failed to realize the widespread success many had predicted for it. Nonetheless, this technology has recently been explored extensively for new electro-optics applications, specifically in telecommunications for dense wavelength division multiplexing (DWDM) and optical switching. This thesis examines various models of dynamic technology adoption and explores how they apply to MEMS technology. Furthermore, by way of historical comparison to the development of application specific integrated circuit (ASIC), it will identify various developmental similarities. Finally, a unique model outlining the critical driving forces behind the adoption of MEMS technology will be constructed.
by Alan M. Then.
S.M.M.O.T.
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Robinson, Gary Neil 1960. "The commercialization of microelectromechanical systems (MEMS)." Thesis, Massachusetts Institute of Technology, 1999. http://hdl.handle.net/1721.1/9534.

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Thesis (S.M.M.O.T.)--Massachusetts Institute of Technology, Sloan School of Management, Management of Technology Program, 1999.
Includes bibliographical references (leaf 80).
Microelectromechanical systems (MEMS) comprise a set of technologies for the micromachining and electromechanical integration of sensors and actuators. MEMS allow for the radical miniaturization of such devices, as well as for significant improvements in performance and cost over conventionally fabricated mechanical and electrical components. In this thesis, I attempt to assess the value inherent in MEMS innovations and to understand how companies have tried to capture that value. In doing so, I assess the pathways and prospects for the commercialization of MEMS-based devices. I have chosen to focus on two classes of devices: (1) micromachined accelerometers for crash sensing and subsequent air bag deployment in automobiles, and (2) microfabricated chemical sensing and analysis devices for detecting and quantifying gas phase molecules, analyzing complex molecular mixtures, and carrying out high throughput screening of chemical compounds. Accelerometers are an example of a MEMS-based sensor that has almost completely displaced existing electromechanical substitute devices. Applications of MEMS to chemical sensing and analysis, however, are less mature and widespread adoption is less assured. In both cases, I evaluate the opportunities in the new technology from several different perspectives: (1) the factors that affect the transition from innovative technologies to marketable products; (2) the economic, market, and strategic forces that influence the adoption of these products; and (3) the business models of companies that have attempted to profit from MEMS innovations. I conclude the thesis with a chapter on potential strategic market barriers to successful commercialization of MEMS-based devices.
by Gary N. Robinson.
S.M.M.O.T.
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Ma, Wei. "Low temperature metal-based micro fabrication and packaging technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20MA.

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Joung, Yeun-Ho. "Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures." Diss., Available online, Georgia Institute of Technology, 2004:, 2003. http://etd.gatech.edu/theses/available/etd-04052004-180025/unrestricted/joung%5Fyeun-ho%5F200312%5Fphd.pdf.

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Mustafa, Haithem Ali Babiker. "Development of a noncontact current sensor based on MEMS technology." Thesis, Cape Peninsula University of Technology, 2007. http://hdl.handle.net/20.500.11838/1082.

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Thesis (MTech (Technology))--Cape Peninsula University of Technology, 2007
Most ofMEMS sensors are based on the micro-cantilever technology, which use wide range of different design materials and structures. The benefit ofMEMS technology is in developing devices having lower cost, lower power consumption, higher performance, and integration. A free-end cantileverbeam made of magnetic material (PerrnaIloy) and a movable mass attached to the free-end has been designed using MEMS software tools. The magnetic material was used to improve the sensitivity of the cantilever-beam to an external applied magnetic field. The deflection of the cantilever was detected using capacitive sensing method. The aim of this research was to develop a non-contact current sensor based on MEMS technology by analysing the simulation of the system design of the micro cantilever when subjected to a magnetic field produced by a current-carrying conductor. When the signal, a sinusoidal current with a constant frequency is applied, the cantilever-beam exhibits a vibration motion along the vertical axis when it is placed closer to the line current. This creates corresponding capacitance changes and generates a voltage output proportional to the capacitive change in the signal processing circuitry attached to the micro cantilever. Modelling of the magnetic moment of a magnetic cantilever-beam placed in a field, the deflection of { the beam, the natural frequency of the cantilever-beam, the maximum deflection, the change in differential capacitive sensing technique, linearity of the differential capacitive, and capacitive sensitivity the circuit designed for readout was derived.
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Hau, Lap Wing. "Electrokinetically-driven liquid flows in microchannels using surface-chemistry technology /." View abstract or full-text, 2005. http://library.ust.hk/cgi/db/thesis.pl?MECH%202005%20HAU.

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Shen, Zhilei Liu. "Tensile Mechanical Properties of Isolated Collagen Fibrils Obtained by Microelectromechanical Systems Technology." Case Western Reserve University School of Graduate Studies / OhioLINK, 2010. http://rave.ohiolink.edu/etdc/view?acc_num=case1278977802.

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Coe, David James. "Fabrication technology approaches to micromachined synthetic jets." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15485.

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He, Huiqi. "Miniaturized electroporation system for gene transfer using bio-MEMS technology /." View abstract or full-text, 2007. http://library.ust.hk/cgi/db/thesis.pl?BIEN%202007%20HE.

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Yin, Guangyao. "Theoretical analysis and experiments of single cell electroporation using MEMS technology /." View abstract or full-text, 2010. http://library.ust.hk/cgi/db/thesis.pl?BIEN%202010%20YIN.

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Books on the topic "Microelectromechanical systems technology"

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Ekwall, Britt, and Mikkel Cronquist. Micro electro mechanical systems (MEMS): Technology, fabrication processes, and applications. Edited by Ekwall Britt and Cronquist Mikkel. Hauppauge, N.Y: Nova Science Publishers, 2009.

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Gross, Michael. Travels to the nanoworld: Miniature machinery in nature and technology. Cambridge, Mass: Perseus Pub., 2001.

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Michael, Gross. Travels to the nanoworld: Miniature machinery in nature and technology. Cambridge, Mass: Perseus Pub., 2001.

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Hensler, Ralph. MEMS technology: Where to? Norwalk, CT: Business Communications Co., 2002.

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Hierlemann, A. Integrated chemical microsensor systems in CMOS technology. Berlin: Springer, 2005.

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H, Baltes, ed. Enabling technology for MEMS and nanodevices. Weinheim, Germany: Wiley-VCH, 2004.

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Aiqun, Liu, ed. MEMS technology and devices: Suntec, Singapore, 1-6 July 2007. Singapore: Pan Stanford Pub., 2007.

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RF MEMS: Theory, design, and technology. Hoboken, N.J: Wiley-Interscience, 2003.

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Bourne, Marlene Avis. Microfluidics technology: Emerging markets for micronozzles, microvalves, and microsystems. Norwalk, CT: Business Communications Co., 1999.

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Micro and smart systems: Technology and modeling. Hoboken, NJ: John Wiley and Sons, 2012.

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Book chapters on the topic "Microelectromechanical systems technology"

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Gómez-Carmona, Carlos D., José Pino-Ortega, and Markel Rico-González. "Microelectromechanical Systems." In The Use of Applied Technology in Team Sport, 52–73. New York: Routledge, 2021. http://dx.doi.org/10.4324/9781003157007-6.

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Yunjia, Li. "Microelectromechanical Systems (MEMS)." In Material-Integrated Intelligent Systems - Technology and Applications, 81–106. Weinheim, Germany: Wiley-VCH Verlag GmbH & Co. KGaA, 2017. http://dx.doi.org/10.1002/9783527679249.ch4.

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Polla, D. L. "Integrated Ferroelectric Microelectromechanical Systems." In Science and Technology of Electroceramic Thin Films, 413–26. Dordrecht: Springer Netherlands, 1995. http://dx.doi.org/10.1007/978-94-017-2950-5_30.

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Hangarter, Carlos M., Thomas George, and Nosang V. Myung. "Electrochemically Fabricated Microelectromechanical Systems/Nanoelectromechanical Systems (MEMS/NEMS)." In Nanostructure Science and Technology, 187–226. New York, NY: Springer New York, 2009. http://dx.doi.org/10.1007/978-1-4419-1424-8_13.

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Marom, Dan M. "Enabling Devices Using MicroElectroMechanical System (MEMS) Technology for Optical Networking." In Advances in Science and Technology, 145–49. Stafa: Trans Tech Publications Ltd., 2008. http://dx.doi.org/10.4028/3-908158-12-5.145.

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"Microelectromechanical Systems." In New Materials, Processes, and Methods Technology, 497–526. CRC Press, 2005. http://dx.doi.org/10.1201/9781420039344-12.

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"Microelectromechanical Systems." In New Materials, Processes, and Methods Technology, 473–501. CRC Press, 2005. http://dx.doi.org/10.1201/9781420039344.ch9.

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"MICROELECTROMECHANICAL SYSTEMS (MEMS) TECHNOLOGY." In Wideband RF Technologies and Antennas in Microwave Frequencies, 281–97. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2016. http://dx.doi.org/10.1002/9781119048640.ch10.

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Galambos, P. "Microelectromechanical Systems, Principles of." In Encyclopedia of Materials: Science and Technology, 5598–609. Elsevier, 2001. http://dx.doi.org/10.1016/b0-08-043152-6/00979-7.

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Miki, Norihisa. "Liquid Encapsulation Technology for Microelectromechanical Systems." In Advances in Micro/Nano Electromechanical Systems and Fabrication Technologies. InTech, 2013. http://dx.doi.org/10.5772/55514.

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Conference papers on the topic "Microelectromechanical systems technology"

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Lee, Y. C. "Packaging and Microelectromechanical Systems (MEMS)." In 2007 8th International Conference on Electronic Packaging Technology. IEEE, 2007. http://dx.doi.org/10.1109/icept.2007.4441562.

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Agrawal, Richa, Majid Beidaghi, Wei Chen, and Chunlei Wang. "Carbon microelectromechanical systems (C-MEMS) based microsupercapacitors." In SPIE Sensing Technology + Applications, edited by Nibir K. Dhar and Achyut K. Dutta. SPIE, 2015. http://dx.doi.org/10.1117/12.2180122.

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Nakashima, Tetsu, Ted Heidrick, and Walied Moussa. "Multi-Stage Collaborative System for Microelectromechanical Systems Manufacturing." In PICMET '07 - 2007 Portland International Conference on Management of Engineering & Technology. IEEE, 2007. http://dx.doi.org/10.1109/picmet.2007.4349634.

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Komvopoulos, K. "Challenging Issues in Microelectromechanical Systems." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-1251.

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Abstract Microelectromechanical systems (MEMS) is a rapidly growing interdisciplinary field dealing with the design and manufacturing of miniaturized micromachines using mainly semiconductor technology. Recent demands have led to the integration of electrical, mechanical, optical, fluidic, thermal, and biological microdevices into versatile microsystems capable of performing complex sensing, control, and computing functions. While significant opportunities exist for MEMS, early indications suggest that a large number of challenging issues are presently preventing the evolution of MEMS from the laboratory to the application world. The objective of this article is to consider some of the important surface science issues in MEMS and the nature of microscopic processes occurring at micromachine interfaces during fabrication and operation.
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Yee, Steven C., Christopher R. Anderson, Harry K. Charles, Samara L. Firebaugh, and Deborah M. Mechtel. "Microstrip antenna tuning using variable reactive microelectromechanical systems." In 2011 IEEE 61st Electronic Components and Technology Conference (ECTC). IEEE, 2011. http://dx.doi.org/10.1109/ectc.2011.5898763.

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Ananthasuresh, G. K., Sridhar Kota, Selden B. Crary, and Kensall D. Wise. "Design and Fabrication of Microelectromechanical Systems." In ASME 1992 Design Technical Conferences. American Society of Mechanical Engineers, 1992. http://dx.doi.org/10.1115/detc1992-0222.

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Abstract An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. A set of key joints and mechanisms using which majority of the mechanical devices can be built, is identified. It is surmised that such an effort will be advantageous in designing micromechanisms as they form the basis for what we call fabrication building blocks (joints) and synthetic building blocks (mechanisms). The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made, and makes suggestions regarding the fabrication of a few generic mechanisms that can be made using these techniques. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
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Nicu, L., T. Alava, T. Leichle, D. Saya, J. Pourciel, F. Mathieu, C. Soyer, D. Remiens, C. Ayela, and K. Haupt. "Integrative technology-based approach of microelectromechanical systems (MEMS) for biosensing applications." In 2012 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC). IEEE, 2012. http://dx.doi.org/10.1109/embc.2012.6346960.

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Noell, Wilfried, Pierre-André Clerc, Benedikt Guldimann, Gregor Schürmann, Urs Staufer, Nico de Rooij, Hans Peter Herzig, Omar Manzardo, René Dändliker, and Cornel Marxer. "Optical microelectromechanical systems (OMEMS) based on silicon-on-insulator (SOI) technology." In Diffractive Optics and Micro-Optics. Washington, D.C.: OSA, 2002. http://dx.doi.org/10.1364/domo.2002.dtuc3.

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Segura, Jaume. "Integrated microelectromechanical systems in the More than Moore era." In 2017 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS). IEEE, 2017. http://dx.doi.org/10.1109/dtis.2017.7929870.

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Iontchev, Emil, Radostin Kenov, Rossen Miletiev, Ivaylo Simeonov, and Yavor Isaev. "Hardware implementation of quad microelectromechanical sensor structure for inertial systems." In 2014 37th ISSE International Spring Seminar in Electronics Technology (ISSE). IEEE, 2014. http://dx.doi.org/10.1109/isse.2014.6887636.

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Reports on the topic "Microelectromechanical systems technology"

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Boser, Bernhard, and John Yasaitis. Modular Monolithic Microelectromechanical (MEMS) System Technology (M3S). Fort Belvoir, VA: Defense Technical Information Center, September 2002. http://dx.doi.org/10.21236/ada409761.

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