Journal articles on the topic 'Microelectromechanical systems – Micromachining'
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Bhat, K. N. "Micromachining for Microelectromechanical Systems." Defence Science Journal 48, no. 1 (January 1, 1998): 5–19. http://dx.doi.org/10.14429/dsj.48.3863.
Full textBustillo, J. M., R. T. Howe, and R. S. Muller. "Surface micromachining for microelectromechanical systems." Proceedings of the IEEE 86, no. 8 (1998): 1552–74. http://dx.doi.org/10.1109/5.704260.
Full textEsashi, Masayoshi. "Micromachine. Microelectromechanical Systems by Silicon Micromachining." Journal of the Institute of Television Engineers of Japan 50, no. 8 (1996): 1046–53. http://dx.doi.org/10.3169/itej1978.50.1046.
Full textKota, S., G. K. Ananthasuresh, S. B. Crary, and K. D. Wise. "Design and Fabrication of Microelectromechanical Systems." Journal of Mechanical Design 116, no. 4 (December 1, 1994): 1081–88. http://dx.doi.org/10.1115/1.2919490.
Full textMehregany, Mehran, and Christian A. Zorman. "Surface Micromachining: A Brief Introduction." MRS Bulletin 26, no. 4 (April 2001): 289–90. http://dx.doi.org/10.1557/mrs2001.61.
Full textChircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.
Full textErmolov, Vladimir, Antti Lamminen, Jaakko Saarilahti, Ben Wälchli, Mikko Kantanen, and Pekka Pursula. "Micromachining integration platform for sub-terahertz and terahertz systems." International Journal of Microwave and Wireless Technologies 10, no. 5-6 (April 10, 2018): 651–59. http://dx.doi.org/10.1017/s175907871800048x.
Full textTao, Kai, Gui Fu Ding, Zhuo Qing Yang, Yan Wang, and Pei Hong Wang. "Fabrication and Characterization of Bonded NdFeB Microstructures for Microelectromechanical Systems Applications." Advanced Materials Research 211-212 (February 2011): 561–64. http://dx.doi.org/10.4028/www.scientific.net/amr.211-212.561.
Full textRamesham, Rajeshuni. "Fabrication of diamond microstructures for microelectromechanical systems (MEMS) by a surface micromachining process." Thin Solid Films 340, no. 1-2 (February 1999): 1–6. http://dx.doi.org/10.1016/s0040-6090(98)01370-4.
Full textBallarini, R., R. L. Mullen, Y. Yin, H. Kahn, S. Stemmer, and A. H. Heuer. "The Fracture Toughness of Polysilicon Microdevices: A First Report." Journal of Materials Research 12, no. 4 (April 1997): 915–22. http://dx.doi.org/10.1557/jmr.1997.0131.
Full textBeeby, S. P., A. Blackburn, and N. M. White. "Silicon micromachining processes combined with thick-film printed lead zirconate titanate actuators for microelectromechanical systems." Materials Letters 40, no. 4 (August 1999): 187–91. http://dx.doi.org/10.1016/s0167-577x(99)00073-7.
Full textLusk, Craig P., and Larry L. Howell. "Design Space of Single-Loop Planar Folded Micro Mechanisms With Out-of-Plane Motion." Journal of Mechanical Design 128, no. 5 (November 3, 2005): 1092–100. http://dx.doi.org/10.1115/1.2216734.
Full textChen, Tao, Li Guo Chen, Ming Qiang Pan, and Li Ning Sun. "Study on MEMS Microgripper Integrated Vacuum Tool." Applied Mechanics and Materials 43 (December 2010): 471–75. http://dx.doi.org/10.4028/www.scientific.net/amm.43.471.
Full textLi, Jing Feng, Song Zhe Jin, and Yong Li. "Fabrication of Si3N4 Micro-Components by a Combined Microfabrication Process." Key Engineering Materials 287 (June 2005): 28–32. http://dx.doi.org/10.4028/www.scientific.net/kem.287.28.
Full textKIM, JAE-HYUN, HAK-JOO LEE, SEUNG-WOO HAN, JUNG-YUP KIM, JUNG-SIL KIM, JAE-YOON KANG, SUNG-HOON CHOA, and CHANG-SEUNG LEE. "MECHANICAL BEHAVIOR OF FREESTANDING Mo THIN FILMS FOR RF–MEMS DEVICES." International Journal of Modern Physics B 20, no. 25n27 (October 30, 2006): 3757–62. http://dx.doi.org/10.1142/s0217979206040325.
Full textNanver, Lis K., Tihomir Knezevic, Xingyu Liu, Shivakumar D. Thammaiah, and Max Krakers. "On the Many Applications of Nanometer-Thin Pure Boron Layers in IC and Microelectromechanical Systems Technology." Journal of Nanoscience and Nanotechnology 21, no. 4 (April 1, 2021): 2472–82. http://dx.doi.org/10.1166/jnn.2021.19112.
Full textDroogendijk, H., M. J. de Boer, R. G. P. Sanders, and G. J. M. Krijnen. "A biomimetic accelerometer inspired by the cricket's clavate hair." Journal of The Royal Society Interface 11, no. 97 (August 6, 2014): 20140438. http://dx.doi.org/10.1098/rsif.2014.0438.
Full textSano, Chikako, Manabu Ataka, Gen Hashiguchi, and Hiroshi Toshiyoshi. "An Electret-Augmented Low-Voltage MEMS Electrostatic Out-of-Plane Actuator for Acoustic Transducer Applications." Micromachines 11, no. 3 (March 4, 2020): 267. http://dx.doi.org/10.3390/mi11030267.
Full textShetty, A., and G. Srinivasan. "MICROFABRICATED ORAL DRUG DELIVERY SYSTEMS." INDIAN DRUGS 52, no. 11 (November 28, 2015): 5–13. http://dx.doi.org/10.53879/id.52.11.10393.
Full textBen Messaoud, Jaweb, Jean-François Michaud, Dominique Certon, Massimo Camarda, Nicolò Piluso, Laurent Colin, Flavien Barcella, and Daniel Alquier. "Investigation of the Young’s Modulus and the Residual Stress of 4H-SiC Circular Membranes on 4H-SiC Substrates." Micromachines 10, no. 12 (November 21, 2019): 801. http://dx.doi.org/10.3390/mi10120801.
Full textChang, Yunxia, Qichang Zhang, Wei Wang, and Jianxin Han. "Mechanical Behaviors of Electrostatic Microbeams with Nonideal Supports." Shock and Vibration 2020 (August 17, 2020): 1–18. http://dx.doi.org/10.1155/2020/4507280.
Full textMaboudian, Roya. "Adhesion and Friction Issues Associated With Reliable Operation of MEMS." MRS Bulletin 23, no. 6 (June 1998): 47–51. http://dx.doi.org/10.1557/s0883769400030633.
Full textGe, Chang, and Edmond Cretu. "A Polymeric Piezoelectric Tactile Sensor Fabricated by 3D Printing and Laser Micromachining for Hardness Differentiation during Palpation." Micromachines 13, no. 12 (December 7, 2022): 2164. http://dx.doi.org/10.3390/mi13122164.
Full textBai, Yufang, Jie Zeng, Jiwei Huang, Shaolong Zhong, Zhuming Cheng, and Dakai Liang. "Measurement of Structural Loads Using a Novel MEMS Extrinsic Fabry–Perot Strain Sensor." Applied Sciences 10, no. 1 (December 18, 2019): 18. http://dx.doi.org/10.3390/app10010018.
Full textBajwa, Rayan, and Murat Kaya Yapici. "Integrated On-Chip Transformers: Recent Progress in the Design, Layout, Modeling and Fabrication." Sensors 19, no. 16 (August 13, 2019): 3535. http://dx.doi.org/10.3390/s19163535.
Full textKim, Jong Jin, Dong Il Son, and Dong Il Kwon. "Analysis of Time-Dependent Degradation of a Micro-Resonating Structure with a Notch." Key Engineering Materials 297-300 (November 2005): 594–602. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.594.
Full textKumar, A. Sravan, Sankha Deb, and S. Paul. "Burr removal from high-aspect-ratio micro-pillars using ultrasonic-assisted abrasive micro-deburring." Journal of Micromechanics and Microengineering 32, no. 5 (April 19, 2022): 055010. http://dx.doi.org/10.1088/1361-6439/ac6562.
Full textAcevedo-Mijangos, Jesús, Antonio Ramírez-Treviño, Daniel A. May-Arrioja, Patrick LiKamWa, Héctor Vázquez-Leal, and Agustín L. Herrera-May. "Design and fabrication of a microelectromechanical system resonator based on two orthogonal silicon beams with integrated mirror for monitoring in-plane magnetic field." Advances in Mechanical Engineering 11, no. 7 (July 2019): 168781401985368. http://dx.doi.org/10.1177/1687814019853683.
Full textLi, Jiachen, Jun Liu, Chunrong Peng, Xiangming Liu, Zhengwei Wu, and Fengjie Zheng. "Design and Testing of a Non-Contact MEMS Voltage Sensor Based on Single-Crystal Silicon Piezoresistive Effect." Micromachines 13, no. 4 (April 15, 2022): 619. http://dx.doi.org/10.3390/mi13040619.
Full textSchoeman, Johan, and Monuko du Plessis. "A two-port electrothermal model for suspended MEMS device structures with multiple inputs." Journal of Sensors and Sensor Systems 8, no. 2 (October 9, 2019): 293–304. http://dx.doi.org/10.5194/jsss-8-293-2019.
Full textKumar, Shashi, Pradeep Kumar Rathore, Brishbhan Singh Panwar, and Jamil Akhtar. "Development of a current mirror-integrated pressure sensor using CMOS-MEMS cofabrication techniques." Microelectronics International 35, no. 4 (October 1, 2018): 203–10. http://dx.doi.org/10.1108/mi-05-2017-0022.
Full textChu, V., J. Gaspar, and J. P. Conde. "Thin Film Microelectromechanical Systems." MRS Proceedings 715 (2002). http://dx.doi.org/10.1557/proc-715-a12.3.
Full textMehregany, Mehran, and Christian A. Zorman. "Micromachining Techniques for Advanced SiC MEMS." MRS Proceedings 640 (2000). http://dx.doi.org/10.1557/proc-640-h4.3.
Full textSathyanarayanan, S., and A. Vimala Juliet. "Simulation of Low Pressure MEMS Sensor for Biomedical Application." Journal of Nanotechnology in Engineering and Medicine 2, no. 3 (August 1, 2011). http://dx.doi.org/10.1115/1.4004025.
Full textUppal, Nitin, and Panos S. Shiakolas. "Micromachining Characteristics of NiTi Based Shape Memory Alloy Using Femtosecond Laser." Journal of Manufacturing Science and Engineering 130, no. 3 (June 1, 2008). http://dx.doi.org/10.1115/1.2936380.
Full textPal, Prem, and Kazuo Sato. "Advanced Wet Etch Bulk Micromachining in {100} Silicon Wafers." MRS Proceedings 1222 (2009). http://dx.doi.org/10.1557/proc-1222-dd05-04.
Full textNamura, Moriaki, and Toshiyuki Toriyama. "Experimental Study on Aerodynamics of Microelectromechanical Systems Based Single-Crystal-Silicon Microscale Supersonic Nozzle." Journal of Fluids Engineering 135, no. 8 (May 23, 2013). http://dx.doi.org/10.1115/1.4024080.
Full textPurohit, S., Veerla Swarnalatha, A. K. Pandey, RK Sharma, and Prem Pal. "Wet Bulk Micromachining Characteristics of Si{110} in NaOH-based solution." Journal of Micromechanics and Microengineering, October 19, 2022. http://dx.doi.org/10.1088/1361-6439/ac9b64.
Full textWood, R. J., S. Avadhanula, R. Sahai, E. Steltz, and R. S. Fearing. "Microrobot Design Using Fiber Reinforced Composites." Journal of Mechanical Design 130, no. 5 (March 26, 2008). http://dx.doi.org/10.1115/1.2885509.
Full textPurohit, S., V. Swarnalatha, A. K. Pandey, and P. Pal. "Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachining." Micro and Nano Systems Letters 10, no. 1 (December 1, 2022). http://dx.doi.org/10.1186/s40486-022-00162-7.
Full textCao, Zhiqiang, Tong-Yi Zhang, and Xin Zhang. "Microbridge Nanoindentation Testing of Plasma-Enhanced Chemical Vapor Deposited Silicon Oxide Films." MRS Proceedings 841 (2004). http://dx.doi.org/10.1557/proc-841-r12.4.
Full textNeves, Hercules P., Thomas D. Kudrle, Jia-Ming Chen, Scott G. Adams, Michel Maharbiz, Sergey Lopatin, and N. C. MacDonald. "Conformal Electroless Copper and Nickel Deposition on Mems Structures." MRS Proceedings 546 (1998). http://dx.doi.org/10.1557/proc-546-139.
Full textHopkins, Patrick E., and Leslie M. Phinney. "Thermal Conductivity Measurements on Polycrystalline Silicon Microbridges Using the 3ω Technique." Journal of Heat Transfer 131, no. 4 (February 11, 2009). http://dx.doi.org/10.1115/1.3072907.
Full textAbidin, Ummikalsom, Burhanuddin Yeop Majlis, and Jumril Yunas. "FABRICATION OF PYRAMIDAL CAVITY STRUCTURE WITH MICRON-SIZED TIP USING ANISOTROPIC KOH ETCHING OF SILICON (100)." Jurnal Teknologi 74, no. 10 (June 21, 2015). http://dx.doi.org/10.11113/jt.v74.4846.
Full textPal, Prem, Veerla Swarnalatha, Avvaru Venkata Narasimha Rao, Ashok Kumar Pandey, Hiroshi Tanaka, and Kazuo Sato. "High speed silicon wet anisotropic etching for applications in bulk micromachining: a review." Micro and Nano Systems Letters 9, no. 1 (February 22, 2021). http://dx.doi.org/10.1186/s40486-021-00129-0.
Full textSedky, Sherif. "Electrical Properties and Noise of Poly SiGe Deposited at Temperatures Compatible With MEMS Integration on Top of Standard CMOS." MRS Proceedings 729 (2002). http://dx.doi.org/10.1557/proc-729-u3.2.
Full textBorenstein, Jeffrey T., Kevin R. King, Hidetomi Terai, and Joseph P. Vacanti. "Capillary Formation In Microfabricated Polymer Scaffolds." MRS Proceedings 711 (2001). http://dx.doi.org/10.1557/proc-711-gg1.3.1.
Full textSwarnalatha, V., S. Purohit, P. Pal, and R. K. Sharma. "Enhanced etching characteristics of Si{100} in NaOH-based two-component solution." Micro and Nano Systems Letters 10, no. 1 (August 1, 2022). http://dx.doi.org/10.1186/s40486-022-00152-9.
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