Academic literature on the topic 'Microelectromechanical systems – Micromachining'
Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles
Consult the lists of relevant articles, books, theses, conference reports, and other scholarly sources on the topic 'Microelectromechanical systems – Micromachining.'
Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.
You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.
Journal articles on the topic "Microelectromechanical systems – Micromachining"
Bhat, K. N. "Micromachining for Microelectromechanical Systems." Defence Science Journal 48, no. 1 (January 1, 1998): 5–19. http://dx.doi.org/10.14429/dsj.48.3863.
Full textBustillo, J. M., R. T. Howe, and R. S. Muller. "Surface micromachining for microelectromechanical systems." Proceedings of the IEEE 86, no. 8 (1998): 1552–74. http://dx.doi.org/10.1109/5.704260.
Full textEsashi, Masayoshi. "Micromachine. Microelectromechanical Systems by Silicon Micromachining." Journal of the Institute of Television Engineers of Japan 50, no. 8 (1996): 1046–53. http://dx.doi.org/10.3169/itej1978.50.1046.
Full textKota, S., G. K. Ananthasuresh, S. B. Crary, and K. D. Wise. "Design and Fabrication of Microelectromechanical Systems." Journal of Mechanical Design 116, no. 4 (December 1, 1994): 1081–88. http://dx.doi.org/10.1115/1.2919490.
Full textMehregany, Mehran, and Christian A. Zorman. "Surface Micromachining: A Brief Introduction." MRS Bulletin 26, no. 4 (April 2001): 289–90. http://dx.doi.org/10.1557/mrs2001.61.
Full textChircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.
Full textErmolov, Vladimir, Antti Lamminen, Jaakko Saarilahti, Ben Wälchli, Mikko Kantanen, and Pekka Pursula. "Micromachining integration platform for sub-terahertz and terahertz systems." International Journal of Microwave and Wireless Technologies 10, no. 5-6 (April 10, 2018): 651–59. http://dx.doi.org/10.1017/s175907871800048x.
Full textTao, Kai, Gui Fu Ding, Zhuo Qing Yang, Yan Wang, and Pei Hong Wang. "Fabrication and Characterization of Bonded NdFeB Microstructures for Microelectromechanical Systems Applications." Advanced Materials Research 211-212 (February 2011): 561–64. http://dx.doi.org/10.4028/www.scientific.net/amr.211-212.561.
Full textRamesham, Rajeshuni. "Fabrication of diamond microstructures for microelectromechanical systems (MEMS) by a surface micromachining process." Thin Solid Films 340, no. 1-2 (February 1999): 1–6. http://dx.doi.org/10.1016/s0040-6090(98)01370-4.
Full textBallarini, R., R. L. Mullen, Y. Yin, H. Kahn, S. Stemmer, and A. H. Heuer. "The Fracture Toughness of Polysilicon Microdevices: A First Report." Journal of Materials Research 12, no. 4 (April 1997): 915–22. http://dx.doi.org/10.1557/jmr.1997.0131.
Full textDissertations / Theses on the topic "Microelectromechanical systems – Micromachining"
Kim, Yong-Jun. "Application of polymer/metal multi-layer processing techniques to microelectromechanical systems." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/14987.
Full textTondapu, Karthik. "Design and fabrication of one and two axis nickel electroplated micromirror array." Diss., Columbia, Mo. : University of Missouri-Columbia, 2007. http://hdl.handle.net/10355/6037.
Full textThe entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 15, 2008) Includes bibliographical references.
Coe, David James. "Fabrication technology approaches to micromachined synthetic jets." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15485.
Full textPan, Bo. "Development of micromachined millimeter-wave modules for next-generation wireless transceiver front-ends." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24654.
Full textCommittee Chair: John Papapolymerou; Committee Chair: Manos Tentzeris; Committee Member: Gordon Stuber; Committee Member: John Cressler; Committee Member: John Z. Zhang; Committee Member: Joy Laskar
Shah, Umer. "Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-143757.
Full textQC 20140328
Abhijit, Upadhye. "Electrostatically actuated and bi-stable MEMS structures." Diss., Columbia, Mo. : University of Missouri-Columbia, 2007. http://hdl.handle.net/10355/6041.
Full textThe entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 16, 2008) Includes bibliographical references.
Wittwer, Jonathan W. "Predicting the Effects of Dimensional and Material Property Variations in Micro Compliant Mechanisms." BYU ScholarsArchive, 2001. https://scholarsarchive.byu.edu/etd/73.
Full textAlper, Said Emre. "Mems Gyroscopes For Tactical-grade Inertial Measurement Applications." Phd thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606483/index.pdf.
Full textwhile the decoupled drive and sense modes minimizes mechanical cross-coupling for low-noise and stable operation. Three different and new symmetric and decoupled gyroscope structures with unique features are presented. These structures are fabricated in four different micromachining processes: nickel electroforming (NE), dissolved-wafer silicon micromachining (DWSM), silicon-on-insulator (SOI) micromachining, and silicon-on-glass (SOG) micromachining. The fabricated gyroscopes have capacitive gaps from 1.5µ
m to 5.5µ
m and structural layer thicknesses from 12µ
m to 100µ
m, yielding aspect ratios up to 20 depending on the fabrication process. The size of fabricated gyroscope chips varies from 1x1mm2 up to 4.2x4.6mm2. Fabricated gyroscopes are hybrid-connected to a designed capacitive interface circuit, fabricated in a standard 0.6µ
m CMOS process. They have resonance frequencies as small as 2kHz and as large as 40kHz
sense-mode resonance frequencies can be electrostatically tuned to the drive-mode frequency by DC voltages less than 16V. The quality factors reach to 500 at atmospheric pressure and exceed 10,000 for the silicon gyroscopes at vacuum. The parasitic capacitance of the gyroscopes on glass substrates is measured to be as small as 120fF. The gyroscope and interface assemblies are then combined with electronic control and feedback circuits constructed with off-the-shelf IC components to perform angular rate measurements. Measured angular rate sensitivities are in the range from 12µ
V/(deg/sec) to 180µ
V/(deg/sec), at atmospheric pressure. The SOI gyroscope demonstrates the best performance at atmospheric pressure, with noise equivalent rate (NER) of 0.025(deg/sec)/Hz1/2, whereas the remaining gyroscopes has an NER better than 0.1(deg/sec)/Hz1/2, limited by either the small sensor size or by small quality factors. Gyroscopes have scale-factor nonlinearities better than 1.1% with the best value of 0.06%, and their bias drifts are dominated by the phase errors in the demodulation electronics and are over 1deg/sec. The characterization of the SOI and SOG gyroscopes at below 50mTorr vacuum ambient yield angular rate sensitivities as high as 1.6mV/(deg/sec) and 0.9mV/(deg/sec), respectively. The NER values of these gyroscopes at vacuum are smaller than 50(deg/hr)/Hz1/2 and 36(deg/hr)/Hz1/2, respectively, being close to the tactical-grade application limits. Gyroscope structures are expected to provide a performance better than 10 deg/hr in a practical measurement bandwidth such as 50Hz, provided that capacitive gaps are minimized while preserving the aspect ratio, and the demodulation electronics are improved.
Gadiraju, Priya D. "Laminated chemical and physical micro-jet actuators based on conductive media." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26611.
Full textCommittee Chair: Allen, Mark; Committee Member: Allen, Sue; Committee Member: Glezer, Ari; Committee Member: Koros, Williams; Committee Member: Prausnitz, Mark. Part of the SMARTech Electronic Thesis and Dissertation Collection.
Azgin, Kivanc. "High Performance Mems Gyroscopes." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/12608194/index.pdf.
Full textm and structural layer thickness of 25 µ
m. Die sizes of the fabricated gyroscope chips are 4.1 mm x 4.1 mm for the single mass, 4.1 mm x 8.9 mm for the double mass, and 8.9 mm x 8.9 mm for the quadruple mass gyroscope. Fabricated gyroscopes are tested with dedicated differential readout electronics constructed with discrete components. Drive mode resonance frequencies of these gyroscopes are in a range of 3.4 kHz to 5.1 kHz. Depending on the drive mode mechanics, the drive mode quality (Q) factors of the fabricated gyroscopes are about 300 at atmospheric pressure and reaches to a value of 2500 at a vacuum ambient of 50 mTorr. Resolvable rates of the fabricated gyroscopes at atmospheric pressure are measured to be 0.109 deg/sec, 0.055 deg/sec, and 1.80 deg/sec for SMG, DMG, and QMG, respectively. At vacuum, the respective resolutions of these gyroscopes improve significantly, reaching to 106 deg/hr with the SMG and 780 deg/hr with the QMG, even though discrete readout electronics are used. Acceleration sensitivity measurements at atmosphere reveal that QMG has the lowest bias g-sensitivity and the scale factor g sensitivity of 1.02deg/sec/g and 1.59(mV/(deg/sec))/g, respectively. The performance levels of these multi-mass gyroscopes can be even further improved with high performance integrated capacitive readout electronics and precise sense mode phase matching.
Books on the topic "Microelectromechanical systems – Micromachining"
Kevin, Chau, Roop Ray M, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., and National Institute of Standards and Technology (U.S.), eds. Micromachined devices and components II: 14-15 October 1996, Austin, Texas. Bellingham, WA: SPIE, 1996.
Find full textMehta, Pratima. Micromachining technology: New developments, trends and markets. Norwalk, CT: Business Communications Co., 1995.
Find full textHensler, Ralph. MEMS technology: Where to? Norwalk, CT: Business Communications Co., 2002.
Find full textBourne, Marlene Avis. MEMS/micromachines/microsystems: Technologies and commercial realities. Norwalk, CT: Business Communications Co., 1998.
Find full textBourne, Marlene Avis. Microfluidics technology: Emerging markets for micronozzles, microvalves, and microsystems. Norwalk, CT: Business Communications Co., 1999.
Find full textLane, Maura Elizabeth. Microfluidics technologies. Norwalk, CT: Business Communications Co. Inc, 2004.
Find full textMicro-manufacturing: Design and manufacturing of micro-products. Hoboken, N.J: Wiley, 2011.
Find full textMicromachining using electrochemical discharge phenomenon: Fundamentals and application of spark assisted chemical engraving. Norwich, NY, USA: W. Andrew, 2009.
Find full textG, Johnson Eric, Nordin Gregory P, and Society of Photo-optical Instrumentation Engineers., eds. Micromachining technology for micro-optics and nano-optics II: 27-29 January 2004, San Jose, California, USA. Bellingham, Washington, USA: SPIE, 2004.
Find full textG, DeAnna Russell, Reshotko Eli, and United States. National Aeronautics and Space Administration., eds. Microelectromechanical systems for aerodynamics applications. [Washington, D.C: National Aeronautics and Space Administration, 1996.
Find full textBook chapters on the topic "Microelectromechanical systems – Micromachining"
Sugimoto, Shinya, Shuji Tanaka, Jing-Feng Li, Takashi Genda, Ryuzo Watanabe, and Masayoshi Esashi. "Three-Dimensional Micromachining of Silicon Nitride for Power Microelectromechanical Systems." In Transducers ’01 Eurosensors XV, 1112–15. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_263.
Full textBhattacharyya, Bijoy. "Microdevices Fabrication for Microelectromechanical Systems and Other Microengineering Applications." In Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology, 185–204. Elsevier, 2015. http://dx.doi.org/10.1016/b978-0-323-32737-4.00010-4.
Full textConference papers on the topic "Microelectromechanical systems – Micromachining"
Weigold, Jason W., and Stella W. Pang. "High-aspect-ratio single-crystal Si microelectromechanical systems." In Micromachining and Microfabrication, edited by James H. Smith. SPIE, 1998. http://dx.doi.org/10.1117/12.324307.
Full textWang, Lin, Flavio Aristone, Jost Goettert, Jong Ren Kong, Keith Bradshaw, Todd R. Christenson, Yohannes M. Desta, and Yoonyoung Jin. "High resolution x-ray masks for high aspect ratio microelectromechanical systems (HARMS)." In Micromachining and Microfabrication, edited by John A. Yasaitis, Mary Ann Perez-Maher, and Jean Michel Karam. SPIE, 2003. http://dx.doi.org/10.1117/12.478268.
Full textAnanthasuresh, G. K., Sridhar Kota, Selden B. Crary, and Kensall D. Wise. "Design and Fabrication of Microelectromechanical Systems." In ASME 1992 Design Technical Conferences. American Society of Mechanical Engineers, 1992. http://dx.doi.org/10.1115/detc1992-0222.
Full textBallarini, Roberto, Robert L. Mullen, Harold Kahn, and Arthur H. Heuer. "Fatigue and Fracture Testing of Microelectromechanical Systems." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-1152.
Full textKomvopoulos, K. "Surface Adhesion and Friction in Microelectromechanical Systems: Measurement and Modification Techniques." In World Tribology Congress III. ASMEDC, 2005. http://dx.doi.org/10.1115/wtc2005-64107.
Full textHolst, Gregory L., and Brian D. Jensen. "A Silicon Thermomechanical In-Plane Microactuation System for Large Displacements in Aqueous Environments." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-64268.
Full textMiller, Todd F., David J. Monk, Gary O’Brien, William P. Eaton, and James H. Smith. "Assembly and Testing of Surface Micromachined, Piezoresistive Polysilicon Pressure Sensors." In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0263.
Full textPryputniewicz, Ryszard J., and Dariusz R. Pryputniewicz. "Study of Heat Transfer in Microscale Systems." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33269.
Full textRao, Masaru P. "High-Aspect-Ratio Titanium Micromachining: Enabling Technology for In Vivo Therapeutic Microdevice Applications." In ASME 2010 5th Frontiers in Biomedical Devices Conference. American Society of Mechanical Engineers, 2010. http://dx.doi.org/10.1115/biomed2010-32024.
Full textShepherd, Ellen. "Prototyping With SUMMiT™ Technology, Sandia’s Ultra-Planar Multi-Level MEMS Technology." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39258.
Full text