Relevant bibliographies by topics / Microelectromechanical systems – Micromachining

Academic literature on the topic 'Microelectromechanical systems – Micromachining'

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Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Microelectromechanical systems – Micromachining"

1

Bhat, K. N. "Micromachining for Microelectromechanical Systems." Defence Science Journal 48, no. 1 (January 1, 1998): 5–19. http://dx.doi.org/10.14429/dsj.48.3863.

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2

Bustillo, J. M., R. T. Howe, and R. S. Muller. "Surface micromachining for microelectromechanical systems." Proceedings of the IEEE 86, no. 8 (1998): 1552–74. http://dx.doi.org/10.1109/5.704260.

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3

Esashi, Masayoshi. "Micromachine. Microelectromechanical Systems by Silicon Micromachining." Journal of the Institute of Television Engineers of Japan 50, no. 8 (1996): 1046–53. http://dx.doi.org/10.3169/itej1978.50.1046.

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4

Kota, S., G. K. Ananthasuresh, S. B. Crary, and K. D. Wise. "Design and Fabrication of Microelectromechanical Systems." Journal of Mechanical Design 116, no. 4 (December 1, 1994): 1081–88. http://dx.doi.org/10.1115/1.2919490.

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An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. Alternate physical forms of the conventional joints are considered to improve the manufacturability of micromechanisms and the idea of using compliant mechanisms for micromechanical applications is put forth. The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
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5

Mehregany, Mehran, and Christian A. Zorman. "Surface Micromachining: A Brief Introduction." MRS Bulletin 26, no. 4 (April 2001): 289–90. http://dx.doi.org/10.1557/mrs2001.61.

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The rapid expansion of microelectromechanical systems (MEMS) into new application areas is due in large part to the development of surface-micromachining techniques that allow the fabrication of a wide variety of MEMS devices with structural components that can execute motion in at least one direction.
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6

Chircov, Cristina, and Alexandru Mihai Grumezescu. "Microelectromechanical Systems (MEMS) for Biomedical Applications." Micromachines 13, no. 2 (January 22, 2022): 164. http://dx.doi.org/10.3390/mi13020164.

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The significant advancements within the electronics miniaturization field have shifted the scientific interest towards a new class of precision devices, namely microelectromechanical systems (MEMS). Specifically, MEMS refers to microscaled precision devices generally produced through micromachining techniques that combine mechanical and electrical components for fulfilling tasks normally carried out by macroscopic systems. Although their presence is found throughout all the aspects of daily life, recent years have witnessed countless research works involving the application of MEMS within the biomedical field, especially in drug synthesis and delivery, microsurgery, microtherapy, diagnostics and prevention, artificial organs, genome synthesis and sequencing, and cell manipulation and characterization. Their tremendous potential resides in the advantages offered by their reduced size, including ease of integration, lightweight, low power consumption, high resonance frequency, the possibility of integration with electrical or electronic circuits, reduced fabrication costs due to high mass production, and high accuracy, sensitivity, and throughput. In this context, this paper aims to provide an overview of MEMS technology by describing the main materials and fabrication techniques for manufacturing purposes and their most common biomedical applications, which have evolved in the past years.
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Ermolov, Vladimir, Antti Lamminen, Jaakko Saarilahti, Ben Wälchli, Mikko Kantanen, and Pekka Pursula. "Micromachining integration platform for sub-terahertz and terahertz systems." International Journal of Microwave and Wireless Technologies 10, no. 5-6 (April 10, 2018): 651–59. http://dx.doi.org/10.1017/s175907871800048x.

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AbstractWe demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.
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Tao, Kai, Gui Fu Ding, Zhuo Qing Yang, Yan Wang, and Pei Hong Wang. "Fabrication and Characterization of Bonded NdFeB Microstructures for Microelectromechanical Systems Applications." Advanced Materials Research 211-212 (February 2011): 561–64. http://dx.doi.org/10.4028/www.scientific.net/amr.211-212.561.

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A micromachining technique has been developed for the fabrication of microscale polymer-bonded magnet. Two types of lithographically defined molds, photoresist mold and electroplated metal mold, were introduced. Photoresist mold is convenient, while electroplated metal mold can be fabricated on the glass or steel substrate which can bear much more compression. NdFeB films of thickness between 50 and 500 µm were prepared by micro-patterning of composites containing 83-95wt% of commercial NdFeB powder after curing at the room temperature. Magnetic properties mainly depend on the types and percentage of volume loading of magnetic powder. Coercivity of 772.4kA/m (9.70kOe), remanence of 275.1mT (2.751kG), and energy product of 22.6kJ/m3 (2.8MGOe) have been achieved. This easily developed magnet could be a promising candidate for applications in magnetic microelectromechanical systems (MEMS).
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Ramesham, Rajeshuni. "Fabrication of diamond microstructures for microelectromechanical systems (MEMS) by a surface micromachining process." Thin Solid Films 340, no. 1-2 (February 1999): 1–6. http://dx.doi.org/10.1016/s0040-6090(98)01370-4.

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Ballarini, R., R. L. Mullen, Y. Yin, H. Kahn, S. Stemmer, and A. H. Heuer. "The Fracture Toughness of Polysilicon Microdevices: A First Report." Journal of Materials Research 12, no. 4 (April 1997): 915–22. http://dx.doi.org/10.1557/jmr.1997.0131.

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Polysilicon microfracture specimens were fabricated using surface micromachining techniques identical to those used to fabricate microelectromechanical systems (MEMS) devices. The nominal critical J-integral (the critical energy release rate) for crack initiation, Jc, was determined in specimens whose characteristic dimensions were of the same order of magnitude as the grain size of the polysilicon. Jc values ranged from 16 to 62 N/m, approximately a factor of four larger than Jc values reported for single crystal silicon.
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Dissertations / Theses on the topic "Microelectromechanical systems – Micromachining"

1

Kim, Yong-Jun. "Application of polymer/metal multi-layer processing techniques to microelectromechanical systems." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/14987.

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Tondapu, Karthik. "Design and fabrication of one and two axis nickel electroplated micromirror array." Diss., Columbia, Mo. : University of Missouri-Columbia, 2007. http://hdl.handle.net/10355/6037.

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Thesis (M.S.)--University of Missouri-Columbia, 2007.
The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 15, 2008) Includes bibliographical references.
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Coe, David James. "Fabrication technology approaches to micromachined synthetic jets." Diss., Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/15485.

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Pan, Bo. "Development of micromachined millimeter-wave modules for next-generation wireless transceiver front-ends." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/24654.

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Thesis (Ph.D.)--Electrical and Computer Engineering, Georgia Institute of Technology, 2008.
Committee Chair: John Papapolymerou; Committee Chair: Manos Tentzeris; Committee Member: Gordon Stuber; Committee Member: John Cressler; Committee Member: John Z. Zhang; Committee Member: Joy Laskar
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Shah, Umer. "Novel RF MEMS Devices Enabled by Three-Dimensional Micromachining." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2014. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-143757.

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This thesis presents novel radio frequency microelectromechanical (RF MEMS) circuits based on the three-dimensional (3-D) micromachined coplanar transmission lines whose geometry is re-configured by integrated microelectromechanical actuators. Two types of novel RF MEMS devices are proposed. The first is a concept of MEMS capacitors tuneable in multiple discrete and well-defined steps, implemented by in-plane moving of the ground side-walls of a 3-D micromachined coplanar waveguide transmission line. The MEMS actuators are completely embedded in the ground layer of the transmission line, and fabricated using a single-mask silicon-on-insulator (SOI) RF MEMS fabrication process. The resulting device achieves low insertion loss, a very high quality factor, high reliability, high linearity and high self actuation robustness. The second type introduces two novel concepts of area efficient, ultra-wideband, MEMS-reconfigurable coupled line directional couplers, whose coupling is tuned by mechanically changing the geometry of 3-D micromachined coupled transmission lines, utilizing integrated MEMS electrostatic actuators. The coupling is achieved by tuning both the ground and the signal line coupling, obtaining a large tuneable coupling ratio while maintaining an excellent impedance match, along with high isolation and a very high directivity over a very large bandwidth. This thesis also presents for the first time on RF nonlinearity analysis of complex multi-device RF MEMS circuits. Closed-form analytical formulas for the IIP3 of MEMS multi-device circuit concepts are derived. A nonlinearity analysis, based on these formulas and on  measured device parameters, is performed for different circuit concepts and compared to the simulation results of multi-device  conlinear electromechanical circuit models. The degradation of the overall circuit nonlinearity with increasing number of device stages is investigated. Design rules are presented so that the mechanical parameters and thus the IIP3 of the individual device stages can be optimized to achieve a highest overall IIP3 for the whole circuit.The thesis further investigates un-patterned ferromagnetic NiFe/AlN multilayer composites used as advanced magnetic core materials for on-chip inductances. The approach used is to increase the thickness of the ferromagnetic material without increasing its conductivity, by using multilayer NiFe and AlN sandwich structure. This suppresses the induced currents very effectively and at the same time increases the ferromagnetic resonance, which is by a factor of 7.1 higher than for homogeneous NiFe layers of same thickness. The so far highest permeability values above 1 GHz for on-chip integrated un-patterned NiFe layers were achieved.

QC 20140328

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6

Abhijit, Upadhye. "Electrostatically actuated and bi-stable MEMS structures." Diss., Columbia, Mo. : University of Missouri-Columbia, 2007. http://hdl.handle.net/10355/6041.

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Thesis (M.S.)--University of Missouri-Columbia, 2007.
The entire dissertation/thesis text is included in the research.pdf file; the official abstract appears in the short.pdf file (which also appears in the research.pdf); a non-technical general description, or public abstract, appears in the public.pdf file. Title from title screen of research.pdf file (viewed on April 16, 2008) Includes bibliographical references.
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7

Wittwer, Jonathan W. "Predicting the Effects of Dimensional and Material Property Variations in Micro Compliant Mechanisms." BYU ScholarsArchive, 2001. https://scholarsarchive.byu.edu/etd/73.

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Surface micromachining of micro-electro-mechanical systems (MEMS), like all other fabrication processes, has inherent variation that leads to uncertain material and dimensional parameters. To obtain accurate and reliable predictions of mechanism behavior, the effects of these variations need to be analyzed. This thesis expands already existing tolerance and uncertainty analysis methods to apply to micro compliant mechanisms. For simple compliant members, explicit equations can be used in uncertainty analysis. However, for a nonlinear implicit system of equations, the direct linearization method may be used to obtain sensitivities of output parameters to small changes in known variables. This is done by including static equilibrium equations and pseudo-rigid-body model relationships with the kinematic vector loop equations. Examples are used to show a comparison of this method to other deterministic and probabilistic methods and finite element analysis.
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8

Alper, Said Emre. "Mems Gyroscopes For Tactical-grade Inertial Measurement Applications." Phd thesis, METU, 2005. http://etd.lib.metu.edu.tr/upload/12606483/index.pdf.

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This thesis reports the development of high-performance symmetric and decoupled micromachined gyroscopes for tactical-grade inertial measurement applications. The symmetric structure allows easy matching of the resonance frequencies of the drive and sense modes of the gyroscopes for achieving high angular rate sensitivity
while the decoupled drive and sense modes minimizes mechanical cross-coupling for low-noise and stable operation. Three different and new symmetric and decoupled gyroscope structures with unique features are presented. These structures are fabricated in four different micromachining processes: nickel electroforming (NE), dissolved-wafer silicon micromachining (DWSM), silicon-on-insulator (SOI) micromachining, and silicon-on-glass (SOG) micromachining. The fabricated gyroscopes have capacitive gaps from 1.5µ
m to 5.5µ
m and structural layer thicknesses from 12µ
m to 100µ
m, yielding aspect ratios up to 20 depending on the fabrication process. The size of fabricated gyroscope chips varies from 1x1mm2 up to 4.2x4.6mm2. Fabricated gyroscopes are hybrid-connected to a designed capacitive interface circuit, fabricated in a standard 0.6µ
m CMOS process. They have resonance frequencies as small as 2kHz and as large as 40kHz
sense-mode resonance frequencies can be electrostatically tuned to the drive-mode frequency by DC voltages less than 16V. The quality factors reach to 500 at atmospheric pressure and exceed 10,000 for the silicon gyroscopes at vacuum. The parasitic capacitance of the gyroscopes on glass substrates is measured to be as small as 120fF. The gyroscope and interface assemblies are then combined with electronic control and feedback circuits constructed with off-the-shelf IC components to perform angular rate measurements. Measured angular rate sensitivities are in the range from 12µ
V/(deg/sec) to 180µ
V/(deg/sec), at atmospheric pressure. The SOI gyroscope demonstrates the best performance at atmospheric pressure, with noise equivalent rate (NER) of 0.025(deg/sec)/Hz1/2, whereas the remaining gyroscopes has an NER better than 0.1(deg/sec)/Hz1/2, limited by either the small sensor size or by small quality factors. Gyroscopes have scale-factor nonlinearities better than 1.1% with the best value of 0.06%, and their bias drifts are dominated by the phase errors in the demodulation electronics and are over 1deg/sec. The characterization of the SOI and SOG gyroscopes at below 50mTorr vacuum ambient yield angular rate sensitivities as high as 1.6mV/(deg/sec) and 0.9mV/(deg/sec), respectively. The NER values of these gyroscopes at vacuum are smaller than 50(deg/hr)/Hz1/2 and 36(deg/hr)/Hz1/2, respectively, being close to the tactical-grade application limits. Gyroscope structures are expected to provide a performance better than 10 deg/hr in a practical measurement bandwidth such as 50Hz, provided that capacitive gaps are minimized while preserving the aspect ratio, and the demodulation electronics are improved.
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Gadiraju, Priya D. "Laminated chemical and physical micro-jet actuators based on conductive media." Diss., Atlanta, Ga. : Georgia Institute of Technology, 2008. http://hdl.handle.net/1853/26611.

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Thesis (Ph.D)--Chemical Engineering, Georgia Institute of Technology, 2009.
Committee Chair: Allen, Mark; Committee Member: Allen, Sue; Committee Member: Glezer, Ari; Committee Member: Koros, Williams; Committee Member: Prausnitz, Mark. Part of the SMARTech Electronic Thesis and Dissertation Collection.
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10

Azgin, Kivanc. "High Performance Mems Gyroscopes." Master's thesis, METU, 2007. http://etd.lib.metu.edu.tr/upload/12608194/index.pdf.

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This thesis reports development of three different high performance, low g-sensitive micromachined gyroscopes having single, double, and quadruple masses. The single mass gyroscope (SMG) is developed for comparison of its performance with the double mass gyroscope (DMG) and quadruple mass gyroscope (QMG). DMG is a tuning fork gyroscope, diminishing the effects of unpredictable g-loadings during regular operation, while QMG is a twin tuning fork gyroscope, developed for a uniform and minimized g-sensitivity. DMG and QMG use novel ring spring connections for merging the masses in drive modes, providing uniform and anti-phase drive mode vibrations that minimize the cross-coupling and the effects of intrinsic and extrinsic accelerations on the scale factor and bias levels of the gyroscopes. The sense mode of each mass of the multi-mass gyroscopes is designed to have higher resonance frequencies than that of the drive mode for possible matching requirements, and these sense modes have dedicated frequency tuning electrodes for frequency matching or tuning. Detailed performance simulations are performed with a very sophisticated computer model using the ARCHITECT software. These gyroscopes are fabricated using a standard SOIMUMPs process of MEMSCAP Inc., which provides capacitive gaps of 2 µ
m and structural layer thickness of 25 µ
m. Die sizes of the fabricated gyroscope chips are 4.1 mm x 4.1 mm for the single mass, 4.1 mm x 8.9 mm for the double mass, and 8.9 mm x 8.9 mm for the quadruple mass gyroscope. Fabricated gyroscopes are tested with dedicated differential readout electronics constructed with discrete components. Drive mode resonance frequencies of these gyroscopes are in a range of 3.4 kHz to 5.1 kHz. Depending on the drive mode mechanics, the drive mode quality (Q) factors of the fabricated gyroscopes are about 300 at atmospheric pressure and reaches to a value of 2500 at a vacuum ambient of 50 mTorr. Resolvable rates of the fabricated gyroscopes at atmospheric pressure are measured to be 0.109 deg/sec, 0.055 deg/sec, and 1.80 deg/sec for SMG, DMG, and QMG, respectively. At vacuum, the respective resolutions of these gyroscopes improve significantly, reaching to 106 deg/hr with the SMG and 780 deg/hr with the QMG, even though discrete readout electronics are used. Acceleration sensitivity measurements at atmosphere reveal that QMG has the lowest bias g-sensitivity and the scale factor g sensitivity of 1.02deg/sec/g and 1.59(mV/(deg/sec))/g, respectively. The performance levels of these multi-mass gyroscopes can be even further improved with high performance integrated capacitive readout electronics and precise sense mode phase matching.
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Books on the topic "Microelectromechanical systems – Micromachining"

1

Kevin, Chau, Roop Ray M, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., and National Institute of Standards and Technology (U.S.), eds. Micromachined devices and components II: 14-15 October 1996, Austin, Texas. Bellingham, WA: SPIE, 1996.

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Mehta, Pratima. Micromachining technology: New developments, trends and markets. Norwalk, CT: Business Communications Co., 1995.

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Hensler, Ralph. MEMS technology: Where to? Norwalk, CT: Business Communications Co., 2002.

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Bourne, Marlene Avis. MEMS/micromachines/microsystems: Technologies and commercial realities. Norwalk, CT: Business Communications Co., 1998.

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Bourne, Marlene Avis. Microfluidics technology: Emerging markets for micronozzles, microvalves, and microsystems. Norwalk, CT: Business Communications Co., 1999.

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Lane, Maura Elizabeth. Microfluidics technologies. Norwalk, CT: Business Communications Co. Inc, 2004.

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Micro-manufacturing: Design and manufacturing of micro-products. Hoboken, N.J: Wiley, 2011.

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Micromachining using electrochemical discharge phenomenon: Fundamentals and application of spark assisted chemical engraving. Norwich, NY, USA: W. Andrew, 2009.

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9

G, Johnson Eric, Nordin Gregory P, and Society of Photo-optical Instrumentation Engineers., eds. Micromachining technology for micro-optics and nano-optics II: 27-29 January 2004, San Jose, California, USA. Bellingham, Washington, USA: SPIE, 2004.

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G, DeAnna Russell, Reshotko Eli, and United States. National Aeronautics and Space Administration., eds. Microelectromechanical systems for aerodynamics applications. [Washington, D.C: National Aeronautics and Space Administration, 1996.

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Book chapters on the topic "Microelectromechanical systems – Micromachining"

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Sugimoto, Shinya, Shuji Tanaka, Jing-Feng Li, Takashi Genda, Ryuzo Watanabe, and Masayoshi Esashi. "Three-Dimensional Micromachining of Silicon Nitride for Power Microelectromechanical Systems." In Transducers ’01 Eurosensors XV, 1112–15. Berlin, Heidelberg: Springer Berlin Heidelberg, 2001. http://dx.doi.org/10.1007/978-3-642-59497-7_263.

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Bhattacharyya, Bijoy. "Microdevices Fabrication for Microelectromechanical Systems and Other Microengineering Applications." In Electrochemical Micromachining for Nanofabrication, MEMS and Nanotechnology, 185–204. Elsevier, 2015. http://dx.doi.org/10.1016/b978-0-323-32737-4.00010-4.

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Conference papers on the topic "Microelectromechanical systems – Micromachining"

1

Weigold, Jason W., and Stella W. Pang. "High-aspect-ratio single-crystal Si microelectromechanical systems." In Micromachining and Microfabrication, edited by James H. Smith. SPIE, 1998. http://dx.doi.org/10.1117/12.324307.

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Wang, Lin, Flavio Aristone, Jost Goettert, Jong Ren Kong, Keith Bradshaw, Todd R. Christenson, Yohannes M. Desta, and Yoonyoung Jin. "High resolution x-ray masks for high aspect ratio microelectromechanical systems (HARMS)." In Micromachining and Microfabrication, edited by John A. Yasaitis, Mary Ann Perez-Maher, and Jean Michel Karam. SPIE, 2003. http://dx.doi.org/10.1117/12.478268.

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Ananthasuresh, G. K., Sridhar Kota, Selden B. Crary, and Kensall D. Wise. "Design and Fabrication of Microelectromechanical Systems." In ASME 1992 Design Technical Conferences. American Society of Mechanical Engineers, 1992. http://dx.doi.org/10.1115/detc1992-0222.

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Abstract An attempt has been made to summarize some of the important developments in the emerging technology of microelectromechanical systems (MEMS) from the mechanical engineering perspective. In the micro domain, design and fabrication issues are very much different from those of the macro world. The reason for this is twofold. First, the limitations of the micromachining techniques give way to new exigencies that are nonexistent in the macromachinery. One such difficulty is the virtual loss of the third dimension, since most of the microstructures are fabricated by integrated circuit based micromachining techniques that are predominantly planar. Second, the batch-produced micro structures that require no further assembly, offer significant economical advantage over their macro counterparts. Furthermore, electronic circuits and sensors can be integrated with micromechanical structures. In order to best utilize these features, it becomes necessary to establish new concepts for the design of MEMS. A set of key joints and mechanisms using which majority of the mechanical devices can be built, is identified. It is surmised that such an effort will be advantageous in designing micromechanisms as they form the basis for what we call fabrication building blocks (joints) and synthetic building blocks (mechanisms). The paper also reviews some of the fabrication techniques and the micromechanical devices that have already been made, and makes suggestions regarding the fabrication of a few generic mechanisms that can be made using these techniques. In particular, it discusses the fabrication of a motor-driven four-bar linkage using the “boron-doped bulk-silicon dissolved-wafer process” developed at The University of Michigan’s Center for Integrated Sensors and Circuits.
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Ballarini, Roberto, Robert L. Mullen, Harold Kahn, and Arthur H. Heuer. "Fatigue and Fracture Testing of Microelectromechanical Systems." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-1152.

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Abstract Polysilicon fracture mechanics specimens have been fabricated using standard MEMS (microelectromechanical systems) processing techniques, and as a result, have characteristic dimensions comparable to typical MEMS devices. These specimens are fully integrated with simultaneously fabricated electrostatic actuators which are capable of providing sufficient force to ensure catastrophic crack propagation from notches produced using micromachining. Thus, the entire fracture experiment takes place on-chip, without any possible influences from external sources. Fracture has been initiated using both monotonic and cyclic resonance loading. A typical device is shown in the figure below. This talk will review the (1) design of the experiment, (2) fabrication procedure, (3) measurements of bending strength, critical energy release rate, and fatigue life under cyclic loading, and (4) changes being incorporated in the structural design to make the testing procedure more robust.
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Komvopoulos, K. "Surface Adhesion and Friction in Microelectromechanical Systems: Measurement and Modification Techniques." In World Tribology Congress III. ASMEDC, 2005. http://dx.doi.org/10.1115/wtc2005-64107.

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Microscopic devices that can perform sensing, actuation, and control, known as microelectromechanical systems (MEMS), are projected to lead to new technologies with profound impacts in science and engineering. However, there are several limitations that must be overcome before MEMS could be fully utilized in various applications. In particular, because of the low stiffness and large surface-to-volume ratio of MEMS, high adhesion and friction forces between proximity and contacting surfaces limit the device efficiency and often lead to premature failure. Basic study of adhesion and friction under MEMS conditions requires special microdevices fabricated by surface micromachining. The basic features of such MEMS devices are presented herein together with suitable surface modification techniques for reducing surface adhesion and friction, such as surface texturing and deposition of low surface energy solid films and self-assembled monolayers.
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Holst, Gregory L., and Brian D. Jensen. "A Silicon Thermomechanical In-Plane Microactuation System for Large Displacements in Aqueous Environments." In ASME 2011 International Mechanical Engineering Congress and Exposition. ASMEDC, 2011. http://dx.doi.org/10.1115/imece2011-64268.

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This paper presents an underwater, silicon, thermal microactuation system capable of moving a 200 μN load to a displacement of 110 μm. Its function relies on a thermal actuator capable of 9 μm of displacement in an aqueous environment. This actuator is combined with a ratcheting device to achieve the 110 μm of displacement. The system is a microelectromechanical system (MEMS) fabricated with a two layer surface-micromachining process, PolyMUMPS. The actuation system is designed to provide motion to biological microelectromechanical systems (BioMEMS) in aqueous environments. This paper presents the design and experimental demonstration of the actuation system. The in-depth analysis of the thermal, mechanical, and fabrication aspects of the actuation system are outlined, and the experimental procedure and test parameters are discussed.
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Miller, Todd F., David J. Monk, Gary O’Brien, William P. Eaton, and James H. Smith. "Assembly and Testing of Surface Micromachined, Piezoresistive Polysilicon Pressure Sensors." In ASME 1999 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1999. http://dx.doi.org/10.1115/imece1999-0263.

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Abstract Surface micromachining is becoming increasingly popular for microelectromechanical systems (MEMS) and a new application for this process technology is pressure sensors. Uncompensated surface micromachined piezoresistive pressure sensors were fabricated by Sandia National Labs (SNL). Motorola packaged and tested the sensors over pressure, temperature and in a typical circuit application for noise characteristics. A brief overview of surface micromachining related to pressure sensors is described in the report along with the packaging and testing techniques used. The electrical data found is presented in a comparative manner between the surface micromachined SNL piezoresistive polysilicon pressure sensor and a bulk micromachined Motorola piezoresistive single crystal silicon pressure sensor.
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Pryputniewicz, Ryszard J., and Dariusz R. Pryputniewicz. "Study of Heat Transfer in Microscale Systems." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33269.

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Progress in micromachining technology enabled fabrication of micron-sized mechanical devices, which have had a major impact on many disciplines. These devices have not only led to development of miniature transducers for sensing and actuation, but also a chip-based chemical laboratory (μChemLab) and other microelectromechanical systems (MEMS). Applications of these microscale systems frequently demand heat removal and temperature control. This paper presents preliminary results of a study of heat transfer in microscale systems. Computational modeling is based on Thermal Analysis System (TAS), which facilitates multiscale modeling/simulation, and measurements are made using infrared (IR) microscopy. Representative applications describe multiscale modeling and measurement results obtained for a microhotplate of a μChemLab and a high-power GaAs FET amplifier. Comparison of the preliminary experimental/measurement and computational/modeling results shows good correlation.
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Rao, Masaru P. "High-Aspect-Ratio Titanium Micromachining: Enabling Technology for In Vivo Therapeutic Microdevice Applications." In ASME 2010 5th Frontiers in Biomedical Devices Conference. American Society of Mechanical Engineers, 2010. http://dx.doi.org/10.1115/biomed2010-32024.

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The continuing need for enhanced efficacy, safety, and/or functionality in in vivo therapeutics provides immense opportunity for microelectromechanical systems (MEMS). However, continuing reliance upon materials adopted from the semiconductor industry may ultimately limit the scope of what can be achieved. Many such materials suffer from poor mechanical reliability due to low fracture toughness, which results in extreme sensitivity to stress concentration and predisposition to catastrophic failure by fracture. Although mitigation via robust design and packaging is sometimes possible, this invariably increases complexity and cost. Moreover, in many emerging applications, these avenues are not available, due to design constraint and/or performance restriction, thus underscoring need for development of viable alternatives. Herein, we present an overview of high-aspect-ratio titanium micromachining techniques we have developed to address this need. We then follow with a brief summary of recent results from several applications currently under development. In each, Ti micromachining provides a means for leveraging a host of advantageous properties that yield potential for enhanced safety, reliability, and/or performance. As such, Ti micromachining shows considerable promise for extending the utility of MEMS for in vivo therapeutics.
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Shepherd, Ellen. "Prototyping With SUMMiT™ Technology, Sandia’s Ultra-Planar Multi-Level MEMS Technology." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-39258.

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Sandia National Laboratories, a world leader in the development and application of surface micromachining technology, offers its ultra-planar, multi-level SUMMiT™ technology for prototyping devices for microelectromechanical systems (MEMS). By incorporating advanced fabrication processes, such as chemical mechanical polishing and five levels of polysilicon (four mechanical and one ground), in a well-characterized, base-lined technology, the SUMMiT™ (Sandia’s Ultra-planar, Multi-level, MEMS Technology) process offers a virtually limitless range of microelectromechanical systems that can be fabricated for both commercial and military applications [1]. Sandia’s SUMMiT™ process, licensed to industry for volume production, is available from Sandia for agile prototyping through the SAMPLES™ Program. The SAMPLES™ (Sandia’s Agile MEMS Prototyping, Layout tools, Education, and Services) Program, offers participants the opportunity to access state-of-the-art MEMS technology to prototype an idea and produce hardware that can be used to sell a concept. The four components of the SAMPLES™ Program provide: • Education and training on Sandia’s SUMMiT™ designand visualization tools, fabrication process, and reliability issues; • Layout tools for design including visualization and checking of design rules; • Fabrication in the 5-level SUMMiT™ technology; • Post-fabrication services such as release, packaging, reliability characterization, and failure analysis. This paper discusses the SUMMiT™ technology, its capabilities, and the infrastructure for prototyping within the technology through the SAMPLES™ Program.
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