Books on the topic 'Microelectromechanical systems – Design and construction'
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Baglio, Salvatore. Scaling issues and design of microelectromechanical systems. Chichester, England: John Wiley & Sons, 2007.
Find full textNational Research Council (U.S.). Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems. Microelectromechanical systems: Advanced materials and fabrication methods. Washington, DC: National Academy Press, 1997.
Find full textBaglio, S. Scaling issues and design of MEMS. Chichester, West Sussex, England: John Wiley & Sons, 2007.
Find full textBaglio, S. Scaling issues and design of MEMS. Chichester, West Sussex, England: John Wiley & Sons, 2007.
Find full text(Firm), Knovel, ed. MEMS/NEMS: Handbook techniques and applications. New York: Springer, 2006.
Find full textT, Leondes Cornelius, ed. MEMS/NEMS: Handbook techniques and applications. New York: Springer, 2006.
Find full textBaldev, Raj, and Atul Tiwari. Materials and failures in MEMS and NEMS. Hoboken, New Jersey: John Wiley & Sons, 2015.
Find full textBahreyni, Behraad. Fabrication and design of resonant microdevices. Norwich, NY: W. Andrew Inc., 2008.
Find full textKiihamäki, Jyrki. Fabrication of SOI micromechanical devices. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2005.
Find full textHD, International Conference on High-Density Interconnect and Systems Packaging (2000 Denver Colo ). 2000 HD International Conference on High-Density Interconnect and Systems Packaging: 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA. Reston, VA: IMAPS, 2000.
Find full textInternational, Symposium on Semiconductor Wafer Bonding (9th 2006 Cancun Mexico). Simiconductor wafer bonding 9: Science, technology, and applications. Pennington, N.J: The Electrochemical Society, 2006.
Find full textInternational, Microprocesses and Nanotechnology Conference (14th 2001 Matsue-shi Japan). Microprocesses and nanotechnology 2001: 2001 International Microprocesses and Nanotechnology Conference, October 31-November 2, 2001, Shimane, Japan : digest of papers. Tokyo: Business Center for Academic Societies Japan, 2001.
Find full textInternational, Symposium on Semiconductor Wafer Bonding (4th 1997 Paris France). Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: Science, technology, and applications. Pennington, NJ: Electrochemical Society, 1998.
Find full textHenry, Helvajian, Janson Siegfried W, Lärmer Franz, Society of Photo-optical Instrumentation Engineers., United States. Defense Advanced Research Projects Agency., and Semiconductor Equipment and Materials International., eds. MEMS components and applications for industry, automobiles, aerospace, and communication: 22-23 October 2001, San Francisco, USA. Bellingham, Wash: SPIE, 2001.
Find full textIEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis (6th 2004 Shanghai, China). Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04): June 30-July 3, 2004, Bao Long Hotel, Shanghai, China. Piscataway, N.J: IEEE, 2004.
Find full textTutsch, Rainer. Optomechatronic sensors and instrumentation III: 8-10 October 2007, Lausanne, Switzerland. Edited by École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, Fondation suisse pour la recherche en microtechnique, and Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2007.
Find full textOlivier, Scot S., Joel A. Kubby, and Thomas G. Bifano. MEMS adaptive optics VI: 24 and 26 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), and Vuzix Corporation. Bellingham, Wash: SPIE, 2012.
Find full textname, No. MEMS components and applications for industry, automobiles, aerospace, and communication II: 28-29 January 2003, San Jose, California, USA. Bellingham, WA: SPIE, 2003.
Find full textInternational Symposium on Semiconductor Wafer Bonding (6th 2001 San Francisco, Calif.). Semiconductor wafer bonding: Science, technology, and applications VI : proceedings of the international symposium. Edited by Baumgart H and Electrochemical Society Electronics Division. Pennington, NJ: Electrochemical Society, 2002.
Find full textM, Graf, ed. CMOS hotplate chemical microsensors. Berlin: Springer, 2007.
Find full textW, Janson Siegfried, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MEMS components and applications for industry, automobiles, aerospace, and communication II: 28-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.
Find full textA, Rothbart Harold, ed. Cam design handbook. New York: McGraw-Hill, 2004.
Find full textBecker, H., and Wanjun Wang. Microfluidics, bioMEMS, and medical microsystems VIII: 25-27 January 2010, San Francisco, California, United States. Bellingham, Wash: SPIE, 2010.
Find full textBecker, H., and Bonnie Lynne Gray. Microfluidics, bioMEMS, and medical microsystems IX: 23-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), microfluidic ChipShop GmbH (Germany), and NanoInk Inc. Bellingham, Wash: SPIE, 2011.
Find full text1970-, Urey Hakan, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MOEMS display and imaging systems: 28-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.
Find full textLobontiu, Nicolae. Mechanical design of microresonators: Modeling and applications. New York: McGraw-Hill, 2006.
Find full textB, Courtois, Demidenko S. N, Lau Lee-Yee, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Design, modeling, and simulation in microelectronics: 28-30 November 2000, Singapore. Bellingham, Wash: SPIE, 2000.
Find full textFatikow, S. Optomechatronic systems control III: 8-10 October 2007, Lausanne, Switzerland. Edited by Society of Photo-optical Instrumentation Engineers, École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, and Fondation suisse pour la recherche en microtechnique. Bellingham, Wash: SPIE, 2007.
Find full textOlivier, Scot S. MEMS adaptive optics V: 25 and 27 January 2011, San Francisco, California, United States. Bellingham, Wash: SPIE, 2011.
Find full textKevin, Chau, Parameswaran Ash M, Tay Francis E. H, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Micromachining and microfabrication: 28-30 November 2000, Singapore. Bellingham, Wash., USA: SPIE, 2000.
Find full textJung-Chih, Chiao, Society of Photo-optical Instrumentation Engineers., University of Western Australia, and Defence Science and Technology Organisation (Australia), eds. Device and process technologies for MEMS, microelectronics, and photonics III: 10-12 December 2003, Perth, Australia. Bellingham, Wash: SPIE, 2004.
Find full textH, Becker, Woias Peter, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Microfluidics, bioMEMS, and medical microsystems: 27-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.
Find full textYasuhiro, Takaya, Kofman Jonathan 1957-, and SPIE (Society), eds. Optomechatronic sensors, instrumentation, and computer-vision systems: 3 October, 2006, Boston, Massachusetts, USA. Bellingham, Wash: SPIE, 2006.
Find full text1970-, Urey Hakan, Dickensheets David L, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MOEMS display and imaging systems III: 24-25 January 2005, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2005.
Find full text1970-, Urey Hakan, Dickensheets David L, and Society of Photo-optical Instrumentation Engineers., eds. MOEMS display and imaging systems II: 26-27 January 2004, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2004.
Find full text1939-, Breckinridge Jim B., Wang Yongtian, International Commission for Optics, United States. Air Force. Office of Scientific Research. Asia Office., and Society of Photo-optical Instrumentation Engineers., eds. ICO20: Optical design and fabrication : 21-26 August, 2005, Changchun, China. Bellingham, Wash: SPIE, 2006.
Find full textIan, Papautsky, Wang Wanjun 1958-, and Society of Photo-optical Instrumentation Engineers., eds. Microfluidics, bioMEMS, and medical microsystems V: 22-24 January 2007, San Jose, California, USA. Bellingham, Wash: SPIE, 2007.
Find full textC, Tien Norman, ed. Micromachining and microfabrication process technology and devices: 7-9 November 2001, Nanjing, China. Bellingham, Wash., USA: SPIE, 2001.
Find full textname, No. MEMS/MOEMS: Advances in photonic communications, sensing, metrology, packaging and assembly ; 28-29 October 2002, Brugge, Belgium. Bellingham, WA: SPIE, 2003.
Find full textDong, Lixin. Optomechatronic micro/nano devices and components III: 8-10 October 2007, Lausanne, Switzerland. Edited by École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, Fondation suisse pour la recherche en microtechnique, and Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2007.
Find full text(US), National Research Council. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academy Press, 1997.
Find full textMicrosystem design. Boston: Kluwer Academic Publishers, 2001.
Find full textMEMS/NEMS: Micro electro mechanical systems/nano electro mechanical systems. New York: Springer, 2005.
Find full textCommission on Engineering and Technical Systems, National Materials Advisory Board, Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems, National Research Council, and Division on Engineering and Physical Sciences. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academies Press, 1997.
Find full text(US), National Research Council. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academies Press, 2000.
Find full textSenturia, Stephen D. Microsystem Design. Springer, 2004.
Find full textAllen, James J. Micro Electro Mechanical System Design (Mechanical Engineering). CRC, 2005.
Find full textTerhaar, Tyson J. Comparison of two microvalve designs fabricated in mild steel using microprojection welding and capacitive dissociation. 1998.
Find full textLeondes, Cornelius T. Mems/Nems: Handbook Techniques and Applications Design Methods, Fabrication Techniques, Manufacturing Methods, Sensors and Actuators, Medical Applications and MOEMS. Springer, 2016.
Find full textLeondes, Cornelius T. Mems/Nems: (1) Handbook Techniques and Applications Design Methods, (2) Fabrication Techniques, (3) Manufacturing Methods, (4) Sensors and Actuators, (5) Medical Applications and MOEMS. Springer, 2006.
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