Books on the topic 'Microelectromechanical systems – Design and construction'

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1

Baglio, Salvatore. Scaling issues and design of microelectromechanical systems. Chichester, England: John Wiley & Sons, 2007.

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2

National Research Council (U.S.). Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems. Microelectromechanical systems: Advanced materials and fabrication methods. Washington, DC: National Academy Press, 1997.

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3

Baglio, S. Scaling issues and design of MEMS. Chichester, West Sussex, England: John Wiley & Sons, 2007.

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4

Baglio, S. Scaling issues and design of MEMS. Chichester, West Sussex, England: John Wiley & Sons, 2007.

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5

(Firm), Knovel, ed. MEMS/NEMS: Handbook techniques and applications. New York: Springer, 2006.

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6

T, Leondes Cornelius, ed. MEMS/NEMS: Handbook techniques and applications. New York: Springer, 2006.

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7

Baldev, Raj, and Atul Tiwari. Materials and failures in MEMS and NEMS. Hoboken, New Jersey: John Wiley & Sons, 2015.

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8

Bahreyni, Behraad. Fabrication and design of resonant microdevices. Norwich, NY: W. Andrew Inc., 2008.

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9

Kiihamäki, Jyrki. Fabrication of SOI micromechanical devices. [Espoo, Finland]: VTT Technical Research Centre of Finland, 2005.

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10

HD, International Conference on High-Density Interconnect and Systems Packaging (2000 Denver Colo ). 2000 HD International Conference on High-Density Interconnect and Systems Packaging: 25-28 April 2000, the Adam's Mark Hotel, Denver, Colorado, USA. Reston, VA: IMAPS, 2000.

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11

International, Symposium on Semiconductor Wafer Bonding (9th 2006 Cancun Mexico). Simiconductor wafer bonding 9: Science, technology, and applications. Pennington, N.J: The Electrochemical Society, 2006.

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12

International, Microprocesses and Nanotechnology Conference (14th 2001 Matsue-shi Japan). Microprocesses and nanotechnology 2001: 2001 International Microprocesses and Nanotechnology Conference, October 31-November 2, 2001, Shimane, Japan : digest of papers. Tokyo: Business Center for Academic Societies Japan, 2001.

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13

International, Symposium on Semiconductor Wafer Bonding (4th 1997 Paris France). Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding: Science, technology, and applications. Pennington, NJ: Electrochemical Society, 1998.

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14

Henry, Helvajian, Janson Siegfried W, Lärmer Franz, Society of Photo-optical Instrumentation Engineers., United States. Defense Advanced Research Projects Agency., and Semiconductor Equipment and Materials International., eds. MEMS components and applications for industry, automobiles, aerospace, and communication: 22-23 October 2001, San Francisco, USA. Bellingham, Wash: SPIE, 2001.

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15

IEEE CPMT Conference on High Density Microsystem Design and Packaging Component Failure Analysis (6th 2004 Shanghai, China). Proceeding of the sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP'04): June 30-July 3, 2004, Bao Long Hotel, Shanghai, China. Piscataway, N.J: IEEE, 2004.

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16

Tutsch, Rainer. Optomechatronic sensors and instrumentation III: 8-10 October 2007, Lausanne, Switzerland. Edited by École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, Fondation suisse pour la recherche en microtechnique, and Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2007.

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17

Olivier, Scot S., Joel A. Kubby, and Thomas G. Bifano. MEMS adaptive optics VI: 24 and 26 January 2012, San Francisco, California, United States. Edited by SPIE (Society), Dyoptyka (Firm), and Vuzix Corporation. Bellingham, Wash: SPIE, 2012.

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18

name, No. MEMS components and applications for industry, automobiles, aerospace, and communication II: 28-29 January 2003, San Jose, California, USA. Bellingham, WA: SPIE, 2003.

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19

International Symposium on Semiconductor Wafer Bonding (6th 2001 San Francisco, Calif.). Semiconductor wafer bonding: Science, technology, and applications VI : proceedings of the international symposium. Edited by Baumgart H and Electrochemical Society Electronics Division. Pennington, NJ: Electrochemical Society, 2002.

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20

M, Graf, ed. CMOS hotplate chemical microsensors. Berlin: Springer, 2007.

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21

W, Janson Siegfried, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MEMS components and applications for industry, automobiles, aerospace, and communication II: 28-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.

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22

A, Rothbart Harold, ed. Cam design handbook. New York: McGraw-Hill, 2004.

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23

Becker, H., and Wanjun Wang. Microfluidics, bioMEMS, and medical microsystems VIII: 25-27 January 2010, San Francisco, California, United States. Bellingham, Wash: SPIE, 2010.

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24

Becker, H., and Bonnie Lynne Gray. Microfluidics, bioMEMS, and medical microsystems IX: 23-25 January 2011, San Francisco, California, United States. Edited by SPIE (Society), microfluidic ChipShop GmbH (Germany), and NanoInk Inc. Bellingham, Wash: SPIE, 2011.

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25

1970-, Urey Hakan, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MOEMS display and imaging systems: 28-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.

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26

Lobontiu, Nicolae. Mechanical design of microresonators: Modeling and applications. New York: McGraw-Hill, 2006.

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27

B, Courtois, Demidenko S. N, Lau Lee-Yee, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Design, modeling, and simulation in microelectronics: 28-30 November 2000, Singapore. Bellingham, Wash: SPIE, 2000.

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28

Fatikow, S. Optomechatronic systems control III: 8-10 October 2007, Lausanne, Switzerland. Edited by Society of Photo-optical Instrumentation Engineers, École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, and Fondation suisse pour la recherche en microtechnique. Bellingham, Wash: SPIE, 2007.

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29

Olivier, Scot S. MEMS adaptive optics V: 25 and 27 January 2011, San Francisco, California, United States. Bellingham, Wash: SPIE, 2011.

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30

Kevin, Chau, Parameswaran Ash M, Tay Francis E. H, Society of Photo-optical Instrumentation Engineers., Nanyang Technological University, and Institute of Physics Singapore, eds. Micromachining and microfabrication: 28-30 November 2000, Singapore. Bellingham, Wash., USA: SPIE, 2000.

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31

Jung-Chih, Chiao, Society of Photo-optical Instrumentation Engineers., University of Western Australia, and Defence Science and Technology Organisation (Australia), eds. Device and process technologies for MEMS, microelectronics, and photonics III: 10-12 December 2003, Perth, Australia. Bellingham, Wash: SPIE, 2004.

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32

H, Becker, Woias Peter, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. Microfluidics, bioMEMS, and medical microsystems: 27-29 January 2003, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2003.

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33

Yasuhiro, Takaya, Kofman Jonathan 1957-, and SPIE (Society), eds. Optomechatronic sensors, instrumentation, and computer-vision systems: 3 October, 2006, Boston, Massachusetts, USA. Bellingham, Wash: SPIE, 2006.

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34

1970-, Urey Hakan, Dickensheets David L, Society of Photo-optical Instrumentation Engineers., Semiconductor Equipment and Materials International., Solid State Technology (Organization), and Sandia National Laboratories, eds. MOEMS display and imaging systems III: 24-25 January 2005, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2005.

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35

1970-, Urey Hakan, Dickensheets David L, and Society of Photo-optical Instrumentation Engineers., eds. MOEMS display and imaging systems II: 26-27 January 2004, San Jose, California, USA. Bellingham, Wash., USA: SPIE, 2004.

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36

1939-, Breckinridge Jim B., Wang Yongtian, International Commission for Optics, United States. Air Force. Office of Scientific Research. Asia Office., and Society of Photo-optical Instrumentation Engineers., eds. ICO20: Optical design and fabrication : 21-26 August, 2005, Changchun, China. Bellingham, Wash: SPIE, 2006.

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37

Ian, Papautsky, Wang Wanjun 1958-, and Society of Photo-optical Instrumentation Engineers., eds. Microfluidics, bioMEMS, and medical microsystems V: 22-24 January 2007, San Jose, California, USA. Bellingham, Wash: SPIE, 2007.

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38

C, Tien Norman, ed. Micromachining and microfabrication process technology and devices: 7-9 November 2001, Nanjing, China. Bellingham, Wash., USA: SPIE, 2001.

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39

name, No. MEMS/MOEMS: Advances in photonic communications, sensing, metrology, packaging and assembly ; 28-29 October 2002, Brugge, Belgium. Bellingham, WA: SPIE, 2003.

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40

Dong, Lixin. Optomechatronic micro/nano devices and components III: 8-10 October 2007, Lausanne, Switzerland. Edited by École polytechnique fédérale de Lausanne, France. Commissariat à l'énergie atomique. Laboratoire d'intégration des systèmes et des technologies, Fondation suisse pour la recherche en microtechnique, and Society of Photo-optical Instrumentation Engineers. Bellingham, Wash: SPIE, 2007.

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41

(US), National Research Council. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academy Press, 1997.

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42

Microsystem design. Boston: Kluwer Academic Publishers, 2001.

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43

MEMS/NEMS: Micro electro mechanical systems/nano electro mechanical systems. New York: Springer, 2005.

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44

Commission on Engineering and Technical Systems, National Materials Advisory Board, Committee on Advanced Materials and Fabrication Methods for Microelectromechanical Systems, National Research Council, and Division on Engineering and Physical Sciences. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academies Press, 1997.

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45

(US), National Research Council. Microelectromechanical Systems: Advanced Materials and Fabrication Methods. National Academies Press, 2000.

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46

Senturia, Stephen D. Microsystem Design. Springer, 2004.

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47

Allen, James J. Micro Electro Mechanical System Design (Mechanical Engineering). CRC, 2005.

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48

Terhaar, Tyson J. Comparison of two microvalve designs fabricated in mild steel using microprojection welding and capacitive dissociation. 1998.

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49

Leondes, Cornelius T. Mems/Nems: Handbook Techniques and Applications Design Methods, Fabrication Techniques, Manufacturing Methods, Sensors and Actuators, Medical Applications and MOEMS. Springer, 2016.

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50

Leondes, Cornelius T. Mems/Nems: (1) Handbook Techniques and Applications Design Methods, (2) Fabrication Techniques, (3) Manufacturing Methods, (4) Sensors and Actuators, (5) Medical Applications and MOEMS. Springer, 2006.

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