Relevant bibliographies by topics / Micro heat pipe

Academic literature on the topic 'Micro heat pipe'

Author: Grafiati
Published: 10 December 2022
Last updated: 28 January 2023

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Journal articles on the topic "Micro heat pipe"

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Chang, Fun Liang, and Yew Mun Hung. "Circulation Effectiveness of Working Fluid in Inclined Micro Heat Pipes." Applied Mechanics and Materials 789-790 (September 2015): 422–25. http://dx.doi.org/10.4028/www.scientific.net/amm.789-790.422.

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Micro heat pipe is a two-phase heat transfer device offering effective high heat-flux removal in electronics cooling. Essentially, micro heat pipe relies on the phase change processes, namely evaporation and condensation, and the circulation of working fluid to function as heat transfer equipment. The vast applications of micro heat pipe in portable appliances necessitate its functionality under different orientations with respect to gravity. Therefore, its thermal performance is strongly related to its orientation. By incorporating solid wall conduction, together with the continuity, momentum, and energy equations of the working fluid, a mathematical model is developed to investigate the heat and fluid flow characteristics of inclined micro heat pipes. We investigate both the favorable and adverse effects of gravity on the circulation rate which is intimately related to the thermal performance of micro heat pipes. The effects of gravity, through the angle of inclination, on the circulation strength and heat transport capacity are analysed. This study serves as a useful analytical tool in the micro heat pipe design and performance analysis, associated with different inclinations and operating conditions.
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ZHANG, JIN, STEPHEN J. WATSON, and HARRIS WONG. "Fluid flow and heat transfer in a dual-wet micro heat pipe." Journal of Fluid Mechanics 589 (October 8, 2007): 1–31. http://dx.doi.org/10.1017/s0022112007007823.

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Micro heat pipes have been used to cool micro electronic devices, but their heat transfer coefficients are low compared with those of conventional heat pipes. In this work, a dual-wet pipe is proposed as a model to study heat transfer in micro heat pipes. The dual-wet pipe has a long and narrow cavity of rectangular cross-section. The bottom-half of the horizontal pipe is made of a wetting material, and the top-half of a non-wetting material. A wetting liquid fills the bottom half of the cavity, while its vapour fills the rest. This configuration ensures that the liquid–vapour interface is pinned at the contact line. As one end of the pipe is heated, the liquid evaporates and increases the vapour pressure. The higher pressure drives the vapour to the cold end where the vapour condenses and releases the latent heat. The condensate moves along the bottom half of the pipe back to the hot end to complete the cycle. We solve the steady-flow problem assuming a small imposed temperature difference between the two ends of the pipe. This leads to skew-symmetric fluid flow and temperature distribution along the pipe so that we only need to focus on the evaporative half of the pipe. Since the pipe is slender, the axial flow gradients are much smaller than the cross-stream gradients. Thus, we can treat the evaporative flow in a cross-sectional plane as two-dimensional. This evaporative motion is governed by two dimensionless parameters: an evaporation number E defined as the ratio of the evaporative heat flux at the interface to the conductive heat flux in the liquid, and a Marangoni number M. The motion is solved in the limit E→∞ and M→∞. It is found that evaporation occurs mainly near the contact line in a small region of size E−1W, where W is the half-width of the pipe. The non-dimensional evaporation rate Q* ~ E−1 ln E as determined by matched asymptotic expansions. We use this result to derive analytical solutions for the temperature distribution Tp and vapour and liquid flows along the pipe. The solutions depend on three dimensionless parameters: the heat-pipe number H, which is the ratio of heat transfer by vapour flow to that by conduction in the pipe wall and liquid, the ratio R of viscous resistance of vapour flow to interfacial evaporation resistance, and the aspect ratio S. If HR≫1, a thermal boundary layer appears near the pipe end, the width of which scales as (HR)−1/2L, where L is the half-length of the pipe. A similar boundary layer exists at the cold end. Outside the boundary layers, Tp varies linearly with a gradual slope. Thus, these regions correspond to the evaporative, adiabatic and condensing regions commonly observed in conventional heat pipes. This is the first time that the distinct regions have been captured by a single solution, without prior assumptions of their existence. If HR ~ 1 or less, then Tp is linear almost everywhere. This is the case found in most micro-heat-pipe experiments. Our analysis of the dual-wet pipe provides an explanation for the comparatively low effective thermal conductivity in micro heat pipes, and points to ways of improving their heat transfer capabilities.
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Gou, Xiang, Qiyan Zhang, Yamei Li, Yingfan Liu, Shian Liu, and Saima Iram. "Experimental Research on the Thermal Performance and Semi-Visualization of Rectangular Flat Micro-Grooved Gravity Heat Pipes." Energies 11, no. 9 (September 18, 2018): 2480. http://dx.doi.org/10.3390/en11092480.

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To strengthen the heat dissipating capacity of a heat pipe used for integrated insulated gate bipolar transistors, as an extension of our earlier work, the effect of micro-groove dimension on the thermal performance of flat micro-grooved gravity heat pipe was studied. Nine pipes with different depths (0.4 mm, 0.8 mm, 1.2 mm) and widths (0.4 mm, 0.8 mm, 1.2 mm) were fabricated and tested under a heating load range from 80 W to 180 W. The start-up time, temperature difference, relative thermal resistance and equivalent thermal conductivity were presented as performance indicators by comparison of flat gravity heat pipes with and without micro-grooves. Results reveal that the highest equivalent thermal conductivity of the flat micro-grooved gravity heat pipes is 2.55 times as that of the flat gravity heat pipe without micro-grooves. The flat gravity heat pipes with deeper and narrower micro-grooves show better thermal performance and the optimal rectangular micro-groove dimension among the selected options is determined to be 1.2 mm (depth) × 0.4 mm (width). Furthermore, the liquid–vapor phase behaviors were observed to verify the heat transfer effects and analyze the heat transfer mechanism of the flat micro-grooved heat pipes.
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Swanson, L. W., and G. P. Peterson. "The Interfacial Thermodynamics of Micro Heat Pipes." Journal of Heat Transfer 117, no. 1 (February 1, 1995): 195–201. http://dx.doi.org/10.1115/1.2822303.

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Successful analysis and modeling of micro heat pipes requires a complete understanding of the vapor–liquid interface. A thermodynamic model of the vapor–liquid interface in micro heat pipes has been formulated that includes axial pressure and temperature differences, changes in local interfacial curvature, Marangoni effects, and the disjoining pressure. Relationships were developed for the interfacial mass flux in an extended meniscus, the heat transfer rate in the intrinsic meniscus, the “thermocapillary” heat-pipe limitation, as well as the nonevaporating superheated liquid film thickness that exists between adjacent menisci and occurs during liquid dry out in the evaporator. These relationships can be used to define quantitative restrictions and/or requirements necessary for proper operation of micro heat pipes. They also provide fundamental insight into the critical mechanisms required for proper heat pipe operation.
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Yang, Yan Xia, Xiao Dong Wang, Yi Luo, and Liang Liang Zou. "Heat Transfer Characteristic of Flat Trapezoid Grooved Micro Heat Pipes." Key Engineering Materials 609-610 (April 2014): 1526–31. http://dx.doi.org/10.4028/www.scientific.net/kem.609-610.1526.

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To study the heat transfer performance of micro heat pipe, theoretical analysis of flat plate micro heat pipe with trapezoid cross section are presented in this paper. A one-dimensional stationary mathematical model for micro heat pipe grooved capillary flow using finite volume method (FVM) was established. The micro heat pipe had vapor space connect with each other and the influences of shear stress between vapor and fluid in the working process were described in the model which made the model more precisely. The axial variation of working fluid distribution in the heat pipe, pressure difference between vapor and liquid, and velocity of vapor and liquid were analyzed. In addition, the maximum heat transport capacity of micro heat pipe was calculated. The simulation results showed good agreement with the experiment results, and it could predict the heat transfer performance accurately, which was useful to micro heat pipe structural design.
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Peterson, G. P., and H. B. Ma. "Temperature Response of Heat Transport in a Micro Heat Pipe." Journal of Heat Transfer 121, no. 2 (May 1, 1999): 438–45. http://dx.doi.org/10.1115/1.2825997.

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A detailed mathematical model for predicting the heat transport capability and temperature gradients that contribute to the overall axial temperature drop as a function of heat transfer in a micro heat pipe has been developed. The model utilizes a third-order ordinary differential equation, which governs the fluid flow and heat transfer in the evaporating thin film region; an analytical solution for the two-dimension heat conduction equation, which governs the macro evaporating film region in the triangular corners; the effects of the vapor flow on the liquid flow in the micro heat pipe; the flow and condensation of the thin film caused by the surface tension in the condenser; and the capillary flow along the axial direction of the micro heat pipe. With this model, the temperature distribution along the axial direction of the heat pipe and the effect on the heat transfer can be predicted. In order to verify the model presented here, an experimental investigation was also conducted and a comparison with experimental data made. This comparison indicated excellent correlation between the analytical model and experimental results, and as a result, the analysis provides a better understanding of the heat transfer capability and temperature variations occurring in micro heat pipes.
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Longtin, J. P., B. Badran, and F. M. Gerner. "A One-Dimensional Model of a Micro Heat Pipe During Steady-State Operation." Journal of Heat Transfer 116, no. 3 (August 1, 1994): 709–15. http://dx.doi.org/10.1115/1.2910926.

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Micro heat pipes are small structures that will be used to cool microscale devices. They function much like their conventional counterparts, with a few exceptions, most notably the absence of a wick. It is expected that water-filled micro heat pipes will be able to dissipate heat fluxes on the order of 10–15 W/cm2 (100,000–150,000 W/m2). This work addresses the modeling of a micro heat pipe operating under steady-state conditions. A one-dimensional model of the evaporator and adiabatic sections is developed and solved numerically to yield pressure, velocity, and film thickness information along the length of the pipe. Interfacial and vapor shear stress terms have been included in the model. Convection and body force terms have also been included in the momentum equation, although numerical experiments have shown them to be negligible. Pressure, velocity, and film thickness results are presented along with the maximum heat load dependence on pipe length and width. Both simple scaling and the model results show that the maximum heat transport capability of a micro heat pipe varies with the inverse of its length and the cube of its hydraulic diameter, implying the largest, shortest pipes possible should be used.
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Li, Xi Bing, Z. M. Shi, S. G. Wang, Q. M. Hu, L. Bao, and H. J. Zhang. "Analysis of Structural Parameters of Grooved-Wicksin Micro Heat Pipes Based on Capillary Limits." Key Engineering Materials 499 (January 2012): 21–26. http://dx.doi.org/10.4028/www.scientific.net/kem.499.21.

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For great progress in heat pipe technology, a micro heat pipe has become an ideal heat dissipating device in high heat-flux electronic products, and capillary limit is the main factor affecting its heat transfer performance. Based on analyses of capillary limit and currently commonly-used groove structures, this paper built capillary limit models for micro heat pipes with dovetail-groove, rectangular-groove, trapezoidal-groove and V-groove wick structures respectively for theoretical analyses. The analysis results show that better heat transfer performances can be obtained in micro heat pipes with small-angle dovetail (i.e. a sector structure), rectangular and small-angle trapezoidal grooved wick structures when groove depth is 0.2-0.3mm and top-width-to-depth ratio is 1.2-1.5.
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Peterson, G. P., A. B. Duncan, and M. H. Weichold. "Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers." Journal of Heat Transfer 115, no. 3 (August 1, 1993): 751–56. http://dx.doi.org/10.1115/1.2910747.

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An experimental investigation was conducted to determine the thermal behavior of arrays of micro heat pipes fabricated in silicon wafers. Two types of micro heat pipe arrays were evaluated, one that utilized machined rectangular channels 45 μm wide and 80 μm deep and the other that used an anisotropic etching process to produce triangular channels 120 μm wide and 80 μm deep. Once fabricated, a clear pyrex cover plate was bonded to the top surface of each wafer using an ultraviolet bonding technique to form the micro heat pipe array. These micro heat pipe arrays were then evacuated and charged with a predetermined amount of methanol. Using an infrared thermal imaging unit, the temperature gradients and maximum localized temperatures were measured and an effective thermal conductivity was computed. The experimental results were compared with those obtained for a plain silicon wafer and indicated that incorporating an array of micro heat pipes as an integral part of semiconductor devices could significantly increase the effective thermal conductivity; decrease the temperature gradients occurring across the wafer; decrease the maximum wafer temperatures; and reduce the number and intensity of localized hot spots. At an input power of 4 W, reductions in the maximum chip temperature of 14.1°C and 24.9°C and increases in the effective thermal conductivity of 31 and 81 percent were measured for the machined rectangular and etched triangular heat pipe arrays, respectively. In addition to reducing the maximum wafer temperature and increasing the effective thermal conductivity, the incorporation of the micro heat pipe arrays was found to improve the transient thermal response of the silicon test wafers significantly.
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Kang, Shung-Wen, Sheng-Hong Tsai, and Ming-Han Ko. "Metallic micro heat pipe heat spreader fabrication." Applied Thermal Engineering 24, no. 2-3 (February 2004): 299–309. http://dx.doi.org/10.1016/j.applthermaleng.2003.08.008.

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Dissertations / Theses on the topic "Micro heat pipe"

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Alexseev, Alexandre Viktorovich. "Micro loop heat pipe evaporator coherent pore structures." Texas A&M University, 2003. http://hdl.handle.net/1969.1/1303.

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Loop heat pipes seem a promising approach for application in modern technologies where such thermal devices as cooling fans and radiators cannot satisfy overall requirements. Even though a loop heat pipe has a big potential to remove the thermal energy from a high heat flux source, the heat removal performance of heat pipes cannot be predicted well since a first principles of evaporation has not been established. An evaporation model based on statistical rate theory has been recently suggested by Ward and developed for a single pore by Oinuma. A loop heat pipe with coherent pore wick structure has been proposed as a design model. To limit product development risk and to enhance performance assurance, design model features and performance parameters have been carefully reviewed during the concept development phase and have been deliberately selected so as to be well-founded on the limited existing loop heat pipe knowledge base. A first principles evaporation model has been applied for evaporator geometry optimization. A number of iteration calculations have been performed to satisfy design and operating limitations. A set of recommendations for design optimization has been formulated. An optimal model has been found and proposed for manufacture and experimental investigation.
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Lee, Man. "Design, fabrication and characterization of an integrated micro heat pipe system /." View Abstract or Full-Text, 2002. http://library.ust.hk/cgi/db/thesis.pl?MECH%202002%20LEE.

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Thesis (M. Phil.)--Hong Kong University of Science and Technology, 2002.
Includes bibliographical references (leaves 74-77). Also available in electronic version. Access restricted to campus users.
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Simionescu, Florentina. "Considerations on optimum design of micro heat pipe sinks using water as working fluid." Auburn, Ala., 2006. http://repo.lib.auburn.edu/Send%2012-15-07/SIMIONESCU_FLORENTINA_33.pdf.

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Coughlin, Scott Joseph. "Optimization of the configuration and working fluid for a micro heat pipe thermal control device." Texas A&M University, 2005. http://hdl.handle.net/1969.1/3193.

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Continued development of highly compact and powerful electronic components has led to the need for a simple and effective method for controlling the thermal characteristics of these devices. One proposed method for thermal control involves the use of a micro heat pipe system containing a working fluid with physical properties having been speciffcally selected such that the heat pipes, as a whole, vary in effective thermal conductance, thereby providing a level of temperature regulation. To further explore this possibility, a design scenario with appropriate constraints was established and a model developed to solve for the effective thermal conductance of individual heat pipes as a function of evaporator-end temperature. From the results of this analysis, several working fluids were identified and selected from a list over thirteen hundred that were initially analyzed. Next, a thermal circuit model was developed that translated the individual heat pipe operating characteristics into the system as a whole to determine the system level effects. It was found that none of the prospective fluids could completely satisfy the established design requirements to regulate the device temperature over the entire range of operating conditions. This failure to fully satisfy design requirements was due, in large part, to the highly constrained nature of problem definition. Several fluids, however, did provide for an improved level of thermal control when compared to the unmodified design. Suggestions for improvements that may lead to enhanced levels of thermal control are offered as well as areas that are in need of further research.
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SHARMA, MONIKA. "THIN FILM EVAPORATION IN THE PORES OF MICRO LOOP HEAT PIPE WITH NON-UNIFORM HEAT FLUX." University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1132344889.

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Shuja, Ahmed A. "Material and Processing Development Contributions Toward the Development of a MEMS Based Micro Loop Heat Pipe." University of Cincinnati / OhioLINK, 2007. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1179501051.

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PONUGOTI, PRIYANKA. "STUDY OF TRANSIENT BEHAVIOR OF THE EVAPORATOR OF THE MICRO LOOP HEAT PIPE AND MODIFICATIONS TO THE EXISTING GLOBAL MODEL." University of Cincinnati / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1152120818.

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SHUJA, AHMED. "DEVELOPMENT OF A MICRO LOOP HEAT PIPE, A NOVEL MEMS SYSTEM BASED ON THE CPS TECHNOLOGY." University of Cincinnati / OhioLINK, 2003. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1054220863.

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ARRAGATTU, PRAVEEN KUMAR. "OPTIMAL SOLUTIONS FOR PRESSURE LOSS AND TEMPERATURE DROP THROUGH THE TOP CAP OF THE EVAPORATOR OF THE MICRO LOOP HEAT PIPE." University of Cincinnati / OhioLINK, 2006. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1152120112.

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Medis, Praveen S. "Development of Microfluidic Packaging Strategies, with Emphasis on the Development of a MEMS Based Micro Loop Heat Pipe." University of Cincinnati / OhioLINK, 2005. http://rave.ohiolink.edu/etdc/view?acc_num=ucin1131996727.

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Books on the topic "Micro heat pipe"

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Investigation of micro-gravity effects on heat pipe thermal performance and working fluid behavior. Torrance, CA: Hughes Aircraft Co., Electron DYnamics Division, 1990.

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United States. National Aeronautics and Space Administration., ed. Investigation of micro-gravity effects on heat pipe thermal performance and working fluid behavior. Torrance, CA: Hughes Aircraft Co., Electron DYnamics Division, 1990.

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National Aeronautics and Space Administration (NASA) Staff. Liquid Metal Micro Heat Pipes for Space Radiator Applications. Independently Published, 2018.

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T, Henderson H., and United States. National Aeronautics and Space Administration., eds. Liquid metal micro heat pipes for space radiator applications: Final report. Cincinnati, Ohio: University of Cincinnati, 1995.

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Book chapters on the topic "Micro heat pipe"

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Wang, Pei, Yaping Zhang, Yongxin Guo, and Yao Chen. "Thermal Performance Simulation Analysis of the Novel Micro Heat Pipe." In Environmental Science and Engineering, 331–38. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-13-9520-8_36.

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Bakhirathan, Asokan, and Lachireddi Gangadhara Kiran Kumar. "Computational Analysis on Thermo-Hydrodynamic Characteristics of Y-Shaped Multi-branched Micro Heat Pipe." In Lecture Notes in Mechanical Engineering, 119–27. Singapore: Springer Singapore, 2021. http://dx.doi.org/10.1007/978-981-16-0698-4_13.

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Liu, Yunhan, Zhenhua Quan, Yaohua Zhao, Ruixue Dong, and Xianlai Fan. "Experimental Study on Indoor Thermal Environment of Radiant Floor Heating System Based on Micro-Heat Pipe Array." In Environmental Science and Engineering, 1007–16. Singapore: Springer Singapore, 2020. http://dx.doi.org/10.1007/978-981-13-9520-8_104.

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Ma, Hongbin. "Micro Heat Pipes." In Encyclopedia of Microfluidics and Nanofluidics, 1813–25. New York, NY: Springer New York, 2015. http://dx.doi.org/10.1007/978-1-4614-5491-5_973.

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Zohar, Yitshak. "Micro Heat Pipes." In Heat Convection in Micro Ducts, 157–77. Boston, MA: Springer US, 2003. http://dx.doi.org/10.1007/978-1-4757-3607-6_9.

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Ma, Hongbin. "Micro Heat Pipes." In Encyclopedia of Microfluidics and Nanofluidics, 1–16. Boston, MA: Springer US, 2013. http://dx.doi.org/10.1007/978-3-642-27758-0_973-4.

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Vasiliev, L., and L. Vasiliev. "Heat Pipes in Fuel Cell Technology." In Mini-Micro Fuel Cells, 117–24. Dordrecht: Springer Netherlands, 2008. http://dx.doi.org/10.1007/978-1-4020-8295-5_8.

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Sotani, J., K. Nanba, Y. Kasagi, and K. Yoshioka. "PERFORMANCE OF FLAT MICRO HEAT PIPE." In Experimental Heat Transfer, Fluid Mechanics and Thermodynamics 1993, 414–21. Elsevier, 1993. http://dx.doi.org/10.1016/b978-0-444-81619-1.50044-7.

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Fei, Qiang, Biao Jin, Tong Zhang, and Heli Zhang. "Optimization of Thermal Management System of Power Lithium Battery with Cooling / Heat Pipe Coupling of Composite Phase Change Materials." In Advances in Transdisciplinary Engineering. IOS Press, 2022. http://dx.doi.org/10.3233/atde220525.

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In view of the current thermal safety and thermal balance of power lithium batteries, it takes the heat generation, heat transfer and heat dissipation of batteries as the main line, and uses the method of combining CFD simulation with experimental research to explore the application of expanded graphite based composite micro heat pipe coupling heat dissipation technology to BTMS. The reliability of the battery heat generation model is verified by experiments. The structure of the heat pipe is designed based on the phase change heat transfer and heat generation of the pipe. The CPCM heat transfer and micro heat pipe heat transfer models are coupled to form a hybrid BTMS numerical heat transfer model, and the optimal design of the system is carried out, so that the system mass is reduced by 15∼50%, the volume is reduced by 10∼50%, so as to prevent the battery temperature from being too high.Finally, a set of perfect BTMS thermal design, simulation analysis methods and processes are summarized, which provides a set of theoretical basis for the development and design of complex BTMS.
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"A flat micro heat pipe with fiber wick and mathematical model." In Electronic Engineering and Information Science, 375–78. CRC Press, 2015. http://dx.doi.org/10.1201/b18471-89.

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Conference papers on the topic "Micro heat pipe"

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Sakurai, Hisashi, Yasuo Koizumi, and Hiroyasu Ohtake. "Orientation-Free Micro Heat Pipe." In ASME 3rd International Conference on Microchannels and Minichannels. ASMEDC, 2005. http://dx.doi.org/10.1115/icmm2005-75066.

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A simple design micro-heat pipe was proposed. It was composed of a 20.0 × 20.0 mm square flow circuit which had two adjacent narrow-sides (1.0 × 1.0 mm2 or 0.5 × 1.0 mm2) and two adjacent wide-sides (5.0 × 1.0 mm2 or 2.5 × 1.0 mm2). A heating spot was at the narrow side and a cooling spot was at the wide side. Working fluid was ethanol. The flow circuit was placed horizontally. Bubbles generated at the heating spot migrated toward the wide side, the bubbles coalesced there to form a large bubble, and then the large bubble moved to the cooling spot. Finally, the large bubble was condensed at the cooling spot. This cycle repeated continuously. As a result of it, heat transport from the heating spot to the cooling spot was produced in the micro heat pipe even if it was arranged horizontally. It was confirmed that this simple device works as the heat pipe. An analysis of a flow mechanism was performed by solving a simple flow equation based on the flow resistance. It was proved that one-way circulation flow could be formed in the flow circuit. Predicted flow velocities were close to measured velocities. The heat transport performance of the proposed micro heat pipe was much better than the heat conduction of a stainless steel plate.
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Sugumar, D., and Kek Kiong Tio. "Heat Transport Limitation of a Triangular Micro Heat Pipe." In ASME 2003 1st International Conference on Microchannels and Minichannels. ASMEDC, 2003. http://dx.doi.org/10.1115/icmm2003-1096.

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A micro heat pipe will operate effectively by achieving its maximum possible heat transport capacity only if it is to operate at a specific temperature, i.e., design temperature. In reality, micro heat pipe’s may be required to operate at temperatures different from the design temperature. In this study, the heat transport capacity of an equilateral triangle micro heat pipe is investigated. The micro heat pipe is filled optimally with working fluid for a specific design temperature and operated at different operating temperatures. For this purpose, water, pentane and acetone was selected as the working fluids. From the numerical results obtained, it shows that the optimal charge level of the micro heat pipe is dependent on the operating temperature. Furthermore, the results also shows that if the micro heat pipe is to be operated at temperatures other than its design temperature, its heat transport capacity is limited by the occurrence of flooding at the condenser section or dryout at the evaporator section, depending on the operating temperature and type of working fluid. It is observed that when the micro heat pipe is operated at a higher temperature than its design temperature, the heat transport capacity increases but limited by the onset of dryout at the evaporator section. However, the heat transport capacity decreases if it is to be operated at lower temperatures than its design temperature due to the occurrence of flooding at condenser end. From the results obtained, we can conclude that the performance of a micro heat pipe is decreased if it is to be operated at temperatures other than its design temperature.
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Hallinan, Kevin P., Wilber Bhagat, Balamurali Kashaboina, and A. Reza Kashani. "Electro-Hydrodynamic Augmentation of Heat Transport in Micro Heat Pipe Arrays." In ASME 1998 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 1998. http://dx.doi.org/10.1115/imece1998-0649.

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Abstract Research is reported on a novel use of electrostatic fields to both enhance the effectiveness of heat transport and the maximum heat transfer throughput of micro heat pipe devices. This research has sought to make practical the electro-hydrodynamic heat pipe concept proposed by T. Jones in the early 1970s, but which never was successfully developed at macroscales. Experiments are reported which conclusively demonstrate the viability of using electrostatic fields to augment heat transfer in micro heat pipe devices. An n-pentane filled glass heat pipe array comprised of 1mm width grooves having 1mm of ‘land’ between each groove was fabricated from quartz. The heat pipe array was 25.4 mm long. Gold-palladium electrodes, approximately 100 microns in thickness, were vapor deposited on both sides of the heat pipe to allow for the application of an electrostatic field across the grooves of up to 10 kV/mm. The electrodes were semi-transparent, thereby permitting visual observation of the liquid orientation within the micro heat pipe. For a majority of experiments, however, the micro heat pipes were contained in an insulated enclosure. The experiments indicated little difference in the micro heat pipe temperature at low heat inputs (less than 0.3 W/groove). At heat inputs sufficient to cause the onset of dry-out of the evaporator without application of the electric field, the presence of the electric field was noticeable in producing a more uniform micro heat pipe temperature and a relatively lower evaporator temperature. At increasing heat inputs, the presence of the electric field was shown to prevent evaporator dry-out for the heat inputs considered. Further, at heat inputs sufficient to cause dry-out of the evaporator without an applied electric field, the electric field contributed to an increasing heat transfer effectiveness in the evaporator as the heat input was increased.
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Quan, Li, and Li Jia. "Experimental Study on Heat Transfer Characteristic of Plate Pulsating Heat Pipe." In ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASMEDC, 2009. http://dx.doi.org/10.1115/mnhmt2009-18080.

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An experimental system of flat plate pulsating heat pipe was established and experimental research was carried out in this system to understand the mechanism of heat transfer and operating characteristics. The effects of start-up time, operating characteristics, and structures of passage, incline angle, fill ratio and working fluid on plate pulsating heat pipe were discussed. The results indicate that temperature of heating section decreases and the temperature of cooling section increases, then the thermal resistant of PHP is decreased once the plate pulsating heat pipe starts to work. Different start-up powers are needed for different fill ratios and incline angles. The inter pressure of PHP has some impacts on the start-up and operation of PHP. The pulsating heat pipes with different structures have different heat transfer performance. Increasing cross-sectional area and the number of turnings of the heat pipe can improve the heat transfer characteristics of heat pipes. Cross-section shape was also an important influencing factor. With the same cross-sectional area, heat pipe with triangular cross-section of the inner tubes gives better performance than that with rectangular cross-section.
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Li, Yan, Li Jia, and Tiantian Zhang. "Research on Heat Transfer Characteristic of Pulsating Heat Pipe." In 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems. ASMEDC, 2008. http://dx.doi.org/10.1115/micronano2008-70034.

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In order to understand the mechanism and characteristics of the running and heat transfer of pulsating heat pipe, visualizing experimental system was established. Bottom heat mode and top heat mode have been done. In the case of bottom heat mode different diameters have been investigated. The results indicate that the total thermal resistance of PHP was decreased with heat transfer rate and increased with filling ratio for two heat mode. Thermal resistance of PHP for bottom heat mode is higher than top heat mode. The startup time is shorter for bottom heat mode than top heat mode. Thermal resistance of uneven inner diameter PHP is higher than even inner diameter pipe.
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Rao, Sai Sashankh, and Harris Wong. "Fluid Flow in Polygonal Micro Heat Pipes." In ASME 2010 International Mechanical Engineering Congress and Exposition. ASMEDC, 2010. http://dx.doi.org/10.1115/imece2010-37073.

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Micro heat pipes have been used to cool microelectronic devices, but their heat transfer coefficients are low compared with those of conventional heat pipes. A typical micro heat pipe has a long and narrow cavity of polygonal cross section. A long vapor bubble occupies the center of the cavity, while the liquid fills the rest. As one end of the pipe is heated, the liquid evaporates and increases the vapor pressure. The higher pressure drives the vapor to the cold end where the vapor condenses and releases the latent heat. The condensate moves along the liquid-filled corners of the pipe back to the hot end to complete the cycle. Since the pipe is long, the vapor and liquid flow almost uni-directionally along most part of the pipe. We have developed a finite-difference method to solve for the coupled flows. To validate the numerical code, we modify the flow geometry so that analytic solutions can be obtained for the axial velocity and compared with the numerical results. The analytic solutions and the finite-difference method are described and their results compared. We find good agreement for the volume flow rate and the velocity profile, thus validating the numerical method.
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Youn, Young Jik, and Sung Jin Kim. "Development of a Compact Micro Pulsating Heat Pipe." In ASME/JSME 2011 8th Thermal Engineering Joint Conference. ASMEDC, 2011. http://dx.doi.org/10.1115/ajtec2011-44654.

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A compact micro pulsating heat pipe was developed and tested to investigate thermal performance. Micro Flat Plate Pulsating Heat Pipe (FP-PHP) was fabricated using DRIE MEMS technique. A total of 10 parallel interconnected rectangular channels forming a meandering closed loop are engraved on the silicon wafer with a thickness of 1 mm. The top of the silicon wafer was covered by a transparent glass plate (#7740PyrexTM) with a thickness of 0.5 mm to allow visualization of the internal thermo-hydrodynamic behavior in the PHP. The overall FP-PHP has length of 50 mm, width of 15.5 mm, and thickness of 1.5 mm, respectively. The width and height of the engraved rectangular channel is 1 mm and 0.6 mm and the hydraulic diameter is 0.75 mm. The ethanol is used for working fluid. The results show that the FP-PHP without working fluid has thermal resistance of 17 °C/W and the FP-PHP with working fluid of filling ratio of 50% has thermal resistance of 4 °C/W. In other words, the FP-PHP has effective thermal conductivity of 650 W/mK which is about 1.6 times as much as of that of the Copper (keff = 400 W/mK). Therefore the developed FP-PHP can be used as compact high performance electronic cooling system.
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Kohno, Masamichi, Takashi Nishizono, Yasunori Onaka, Sumitomo Hidaka, Koji Takahashi, and Yasuyuki Takata. "Micro Oscillation Heat Pipe Fabricated on Silicon Wafer." In ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels. ASMEDC, 2008. http://dx.doi.org/10.1115/icnmm2008-62082.

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Heat transport characteristics of micro oscillation heat pipe have been investigated. A single winding flow path consists of 28 turns microchannels fabricated on a silicon wafer the size of which was 31mm×27mm. We used heat pipe with non-uniformed cross section. Equivalent diameters of channels were 0.19 and 0.10mm. Test fluid was R141b and liquid fractions were 0, 75, 85%. It was found that steady pulsating flow occurred by increasing the number of turns and the frequency of vibration has an effect on heat transfer performance.
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Wang, Bang-Ji, C. R. Chen, J. R. Tsai, W. F. Lee, C. H. Chen, and C. Y. Chen. "Flow Study in Magnetic Micro-Channel Heat Pipe." In 6th International Energy Conversion Engineering Conference (IECEC). Reston, Virigina: American Institute of Aeronautics and Astronautics, 2008. http://dx.doi.org/10.2514/6.2008-5674.

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Shioga, Takeshi, and Yoshihiro Mizuno. "Micro loop heat pipe for mobile electronics applications." In 2015 31st Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). IEEE, 2015. http://dx.doi.org/10.1109/semi-therm.2015.7100139.

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Reports on the topic "Micro heat pipe"

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Hu, G., R. Hu, J. M. Kelly, and J. Ortensi. Multi-Physics Simulations of Heat Pipe Micro Reactor. Office of Scientific and Technical Information (OSTI), September 2019. http://dx.doi.org/10.2172/1569948.

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Benson, David A., Steven N. Burchett, Stanley H. Kravitz, Charles V. Robino, Carrie Schmidt, and Chris P. Tigges. Kovar Micro Heat Pipe Substrates for Microelectronic Cooling. Office of Scientific and Technical Information (OSTI), April 1999. http://dx.doi.org/10.2172/7792.

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Lee, Changho, and Yeon Sang Jung. Development of the PROTEUS and ANSYS Coupled System for Simulating Heat Pipe Cooled Micro Reactors. Office of Scientific and Technical Information (OSTI), February 2020. http://dx.doi.org/10.2172/1601796.

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Benson, D. A., R. T. Mitchell, and M. R. Tuck. Micro-machined heat pipes in silicon MCM substrates. Office of Scientific and Technical Information (OSTI), January 1997. http://dx.doi.org/10.2172/437666.

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Cao, Yiding. An Innovative Turbine Blade Cooling Technology and Micro/Miniature Heat Pipes for Turbine Blades. Fort Belvoir, VA: Defense Technical Information Center, July 2000. http://dx.doi.org/10.21236/ada381455.

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Jones, K., Y. Cao, and M. Gao. Development of Micro Heat Pipes Embedded in Laminate Substrates for Enhanced Thermal Management (TM) for Printed Wiring Boards (PWBs). Fort Belvoir, VA: Defense Technical Information Center, June 2002. http://dx.doi.org/10.21236/ada412953.

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