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Journal articles on the topic 'Micro-Electronics industry'
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1
Hayward, Keith. "Micro-electronics: an industry in transition." International Affairs 65, no. 2 (1989): 338. http://dx.doi.org/10.2307/2622111.
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Velinova, R. "Statistical modelling of wastewater quality: The case of micro-electronics industry." Water Research 29, no. 11 (November 1995): 2541–47. http://dx.doi.org/10.1016/0043-1354(95)00080-5.
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Xu, Shu Bo, and Wen Cai Xu. "Printed Electronics Based on Precision Coating." Applied Mechanics and Materials 312 (February 2013): 550–53. http://dx.doi.org/10.4028/www.scientific.net/amm.312.550.
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The situation and development of the current main coating technology is analyzed at the view of the application of printed electronics at home and abroad. Spin coating, micro-gravure coating and slot die coating are the main coating technologies in the field of printed electronics.Along with the application of digital controlling technology and the progress of coating technology, precision coating technology will be more widely applied in printed electronics field and it also can promote the development of the printed electronics industry.
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Oxley, C. H., R. H. Hopper, G. Hill, and G. A. Evans. "Improved infrared (IR) microscope measurements and theory for the micro-electronics industry." Solid-State Electronics 54, no. 1 (January 2010): 63–66. http://dx.doi.org/10.1016/j.sse.2009.09.022.
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Lin, Y. P., L. L. Yen, L. Y. Pan, P. J. Chang, and T. J. Cheng. "Emerging epidemic in a growing industry: cigarette smoking among female micro-electronics workers in Taiwan." Public Health 119, no. 3 (March 2005): 184–88. http://dx.doi.org/10.1016/j.puhe.2004.03.005.
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Acero Cacho, Raquel, Jorge Santolaria Mazo, and Marcos Pueo Arteta. "Double Flank Roll Testing as Verification Technique for Micro Gears." Key Engineering Materials 615 (June 2014): 45–50. http://dx.doi.org/10.4028/www.scientific.net/kem.615.45.
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In recent years there has been a considerable interest in microsystems, named as MEMS (Micro Electromechanical Systems). Its continuing expansion is expected, derived from the trend towards miniaturization of components and the increasing applications for these micro devices. To overcome this, the technology to produce these products known as microsystem technology (MST), has been improving in order to allow the manufacturing of this type of parts becoming of growing importance over the past years. Micro gears are commonly used in electronics industry where the miniaturization process follows a constant evolution with multiple use advantages despite their small size. In this work the study and analysis of the existing verification techniques for micro gears together with the definition of a double flank rolling test focused on these gears is presented.
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Akhtar, Mohd Majid, Mohammad Zubair Khan, Mohd Abdul Ahad, Abdulfattah Noorwali, Danish Raza Rizvi, and Chinmay Chakraborty. "Distributed ledger technology based robust access control and real-time synchronization for consumer electronics." PeerJ Computer Science 7 (June 1, 2021): e566. http://dx.doi.org/10.7717/peerj-cs.566.
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Background Consumer electronics or daily use home appliances are the basic necessity of every household. With the adoption of IoT in consumer electronics, this industry is set to rise exponentially. In recent times, the demand for consumer electronics rises amidst the pandemic due to a paradigm shift from in-office culture to work from home. Despite intelligent IoT devices, smart home configuration, and appliances at our disposal, the rudimentary client-server architecture fails to provide facilities like full access control of data and devices, transparency, secured communication, and synchronization between multiple devices, etc. to the users. Methods To overcome these limitations, Blockchain technology has been adopted in recent years, however, it has its own set of limitations in its widespread implementation. Hence, we propose a methodology using the IOTA platform, a distributed ledger technology (DLT) for secured communication between consumer electronics devices and appliances. Results The implementation provides access control, interoperability, data storage, and management with an exploratory insight towards a decentralized micro-payment use-case between Electric cars and charging stations.
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Burling, Steven, Gary Nicholls, Stewart Hemsley, Sadayuki Nagatomo, and Kazuhiko Shiokawa. "Current Developments in Precious Metal Plating for the Semi - Conductor/Micro - Electronics Markets." International Symposium on Microelectronics 2015, no. 1 (October 1, 2015): 000112–20. http://dx.doi.org/10.4071/isom-2015-tp44.
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How the metal finishing (plating) industry is meeting the technical demands of the Microelectronic market as the demand of smaller, lighter, faster, cheaper moves on relentlessly. This paper will focus in particular on Pure Gold Plating, Silver Plating and Palladium Plating for this market. Electrolytic, electroless and immersion processes will be covered outlining the operating parameters and defining applications in particular to the rapidly changing electronic packaging market within microelectronics. In this market the effects of contamination on the deposit compositions, e.g. comparing a Modern Pure Gold Plating bath with traditional Pure Gold Plating processes, can be significant and will be discussed in detail. Details on silver plating for LED applications will also be covered in this paper. How these products are moving towards more Environmentally Friendly low and non-cyanide systems will also be shown.
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Nodin, Muhamad Nor, and Mohd Sallehuddin Yusof. "A Preliminary Study of PDMS Stamp towards Flexography Printing Technique: An Overview." Advanced Materials Research 844 (November 2013): 201–4. http://dx.doi.org/10.4028/www.scientific.net/amr.844.201.
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Polydimethylsiloxane (PDMS) commonly used for microcontact printing is essential towards the successful introduction of high speed printing of reel-to-reel or reel-to-plate manufacturing processes. Here, it is proposed that extending flexography printing method into the multiple micro-scale printing solid line onto subtract by using PDMS stamp as a plate. Flexography is a high-speed technique commonly used for printing onto substrates in a lot of paper printing industry. It was introduces a decade ago where it is very useful for large production. In this area of printing, the expanding demand on printing electronics leads to a lot of study needed for high speed and large production of electronic industries. This work elaborates the feasibility of PDMS stamp (12in x 4in) use in flexography printing for multiple micro solid lines. It will undergo by using simple and inexpensive fabrication PDMS mold process. This paper illustrates the use of PDMS in microcontact printing fusing with flexography printing to produce multiple micro-solid line printing capability by using conductive ink as application of printing electronic industry applications.
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Bočková, Nina, and Tomáš Meluzín. "R&D investments as Possible Factors of Company’s Competitiveness." Acta Universitatis Agriculturae et Silviculturae Mendelianae Brunensis 64, no. 6 (2016): 1857–67. http://dx.doi.org/10.11118/actaun201664061857.
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This article describes the impact of R&D investment to on the economic stability in the Czech electronics industry in the period 2007–2014. Increasing the competitiveness of companies is conditional on the systematic investments, development and stability of companies. Searching for competitive advantage through innovation may be one of the ways of how to obtaining a stab. market position in the industry. The aim of this article was is to determine whether there are relations between changes of economic indicators and the reporting process of research activities for innovative companies in the electronics industry. The research was conducted among 103 companies based in the Czech Republic, which invested in R&D in 2007 – 2013. The comparison was made between companies which invested in the 2007 – 2013 in the annual or occasional R&D. Two subgroups were established and companies in each subgroup were monitored companies according to their size. Spearman’s rank correlation was used to assess if relationships among R&D Expenditure and Operating Revenue were preserved across periods. Two hypotheses were formulated and verified on the basis of statistical data processing of innovative companies. The results showed that innovative companies had the ability to better capitalize on their asset base, and they are better able to cover their needs from their own resources better than other companies of in the electronics industry. Their ability to provide a return on equity varies by according to company size. Innovative companies showed an ability to reach a positive outcome from operating activities. The coefficient of self-financing for SMEs is for SMEs constantly above the industry mean and increases with the length of period of time. This trend was not confirmed for micro-companies and large companies this trend was not confirmed.
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Raj-Reichert, Gale. "The powers of a social auditor in a global production network: the case of Verité and the exposure of forced labour in the electronics industry." Journal of Economic Geography 20, no. 3 (November 8, 2019): 653–78. http://dx.doi.org/10.1093/jeg/lbz030.
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Abstract Research on labour governance actors in global production networks (GPNs) has been limited to civil society organisations, firms and governments. Understanding the influence of actors in GPNs has been dealt with singular and overt modes of relational power. This paper contributes to both debates by examining an intermediary actor—the social auditing organisation Verité—and its exercise of multiple modes of overt and covert powers to illustrate the complex terrain of change in GPNs. Verité, whose exposure of forced labour in Malaysian electronics subsequently changed labour governance practices in the electronics industry, mobilised power resources of credible information to exercise powers of expert authority and acts of dissimulation across various networked relationships in the GPN. This paper puts forth a multi-power framework of analysis to understand the micro-politics of GPNs.
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Salhab, Abbas Ramez, Julien Carlier, Pierre Campistron, Marc Neyens, Malika Toubal, Bertrand Nongaillard, and Vincent Thomy. "Polydimethylsiloxane Micro-Channels Application for the Study of Dynamic Wetting of Nano-Etched Silicon Surfaces Based on Acoustic Characterization Method." Solid State Phenomena 314 (February 2021): 143–49. http://dx.doi.org/10.4028/www.scientific.net/ssp.314.143.
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Efficient cleaning of contaminations in the semiconductor industry is a determining factor in ensuring the good quality of the electronics products. We present here the dynamic wetting characterization of a fluid on top of DTI structures using ultra-high frequency acoustic method. The dynamics of the fluid will be established using a PDMS micro-channel placed on top of the structures, in order to obtain conditions as close as possible to those used in the industrial process. Wetting state of the DTI structures is determined based on the measured acoustic reflection coefficient.
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Keller, William W., and Louis W. Pauly. "Innovation in the Indian Semiconductor Industry: The Challenge of Sectoral Deepening." Business and Politics 11, no. 2 (August 2009): 1–21. http://dx.doi.org/10.2202/1469-3569.1270.
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Seeking to build on related successes in other information technology sectors, the government of India has signaled its intent to transform the country's performance in microelectronics. Facing a young and expanding population, India needs to create manufacturing jobs in promising industries, and it needs to build out from its limited high-technology base. Semiconductors are foundational in this regard. Today, there is much discussion within India about the link between semiconductors and innovation in bio-electronics, alternative energy production and storage, and various micro- and nano-devices. The government's contemporary attempt to promote the building of infrastructure for manufacturing and applied research in semiconductors highlights reasons for hope. So too does the remarkable talent now available in the Indian diaspora. But significant impediments, especially in postsecondary and graduate-level education, must still be overcome if the necessary human capital is to be developed, equipped, and deployed effectively.
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Claypole, James, Alex Holder, Caitlin McCall, Amy Winters, William Ray, and Tim Claypole. "Inorganic Printed LEDs for Wearable Technology." Proceedings 32, no. 1 (March 27, 2020): 24. http://dx.doi.org/10.3390/proceedings2019032024.
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: A new form of inorganic printed electronics has been developed that allows for high speed production of solid-state lighting on flexible substrates. Light emitting diodes (LED) become more efficient as their size is decreased. However, the difficulties in making the electrical connection to micro LEDs has previously prevented these benefits being exploited outside the laboratory. Standard InGaN film, grown on a defined substrate (heteroepitaxy), was fabricated into micro LEDs (approx. 27 µm) and dispersed in a carrier fluid to form an ink, which can then be printed using established printing technologies. During printing and curing, the geometry of the individual micro LEDs causes them to orientate into a single preferential direction. Connections can then be made via further printed layers of conductive and dielectric ink to create flexible lamps consisting of areas of discrete LEDs. These lamps have low power consumption and high light output making them ideal for incorporating into garments and for packaging. The “Thunderstorm” dress (a Rainbow Winters project) was developed for the “Wired to Wear” exhibition in the Museum of Science and Industry, Chicago (MSI) to demonstrate the potential of this technology. The concept was to turn the wearer into a living representation of a thunderstorm. The concept had previously been realised in 2010 using electroluminescent elements (EL) to create a lightning flash in the panels of the dress. However, this required the wearer to carry high voltage devices, bulky electronics and heavy batteries. Instead, using inorganic printed LEDs afforded the potential to create a truly wearable piece of haute couture, using low voltages, miniature electronics and small batteries. The work reported here describes the fabrication technique used to create the micro LED lamps and the issues related to their integration into a piece of wearable technology. The lamps could be driven in such a way as to create a more realistic flash compared to the EL version. Other potential applications such as smart packaging, are also discussed.
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von Bargen, Roland, Julien Kovac, Axel von Hehl, Andreas Mehner, and Hans Werner Zoch. "Influence of PVD Target Power on the Age Hardening Behaviour of Al-4Zr Micro Sheets." Materials Science Forum 794-796 (June 2014): 864–69. http://dx.doi.org/10.4028/www.scientific.net/msf.794-796.864.
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High strength aluminium alloys with improved stability at elevated temperatures for micro components, which are needed e.g. in the automotive or the micro electronics industry, require new alloys and advanced production processes regarding primary shaping, heat treatment and cold forming. Their development is part of the Collaborative Research Centre 747 Micro Cold Forming of the German Research Foundation. Especially heat treatment is a necessary step in the manufacturing process chain to adjust the mechanical properties of semi-finished micro components to cold forming and finally the usage properties of aluminium micro components by precipitation hardening to increase the strength above the strain hardened level. Conventional casting techniques limit the dissolvable zirconium content in alloys to 0.28 mass-% due to Al3Zr precipitation of higher contents during slow cooling. With physical vapour deposition (PVD) by magnetron sputtering at temperatures below 50 °C it is possible to achieve alloys with a highly oversaturated solid solution and up to 3.6 mass-% of zirconium. The target power of the plasma during the magnetron sputtering process has considerable impact on the mechanical properties of the deposited Al-Zr alloys. Therefore the age hardening response of different micro sheets is evaluated by ultra micro hardness measurements (UMH), transmission electron microscopy (TEM) and differential power scanning calorimetry (DPSC).
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Kogdenko, V. G. "Accounting and Analytical Support of Public Procurement in the Electronics Industry in the Digitalization." Accounting. Analysis. Auditing 8, no. 2 (April 4, 2021): 48–61. http://dx.doi.org/10.26794/2408-9303-2021-8-2-48-61.
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The article deals with the problems of accounting and analytical support of public procurement in the electronics industry; one of the objectives of the study is to substantiate the criteria for assessing suppliers' reputation; evaluations of persons filing procurement complaints; procurement monitoring indicators. In the process of research, the author used such general scientific principles and methods as abstraction, generalization, as well as statistical methods of data processing. As a result, there has been developed a methodology for assessing the suppliers' reputation including three stages. At the first one — participating companies are assessed according to the criteria of size, industry, ownership, organizational and legal form, data transparency for subsequent calculations. At the second stage — the economic viability of the subjects is assessed in terms of the availability of financial, material and human resources, as well as the effectiveness of companies and the dynamics of their growth. At the third stage — the conscientiousness of the participants is assessed according to the criteria of the authorized capital, credit limit, tax burden, the Spark-Risk lists inclusion. The technique has been tested on data from the register of unscrupulous suppliers supplying products for the electronics industry; the data for analysis has been generated on the basis of 1360 companies. Calculations have shown that the overwhelming majority of unscrupulous suppliers are micro-enterprises that do not belong to the production related industries, repair, and in electronics trade; the significant part of them are registered in Moscow and its region. There is found out some companies which are unscrupulous suppliers of electronic products. They do not have sufficient financial, material and human resources and are characterized by low reputation characteristics. The proposed changes in the legislation in the introduction of prequalification terms require an adequate accounting and analytical support that would help to control the admittance of only participants with high reputational characteristics that can and should be allowed in the public procurement system.
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Hamidnia, Mohammad, Yi Luo, Xiaodong Wang, and Congming Li. "Experimental investigation on the thermal performance of Si micro-heat pipe with different cross-sections." Modern Physics Letters B 31, no. 30 (October 26, 2017): 1750279. http://dx.doi.org/10.1142/s0217984917502797.
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Increasing component densities of the integrated circuit (IC) and packaging levels has led to thermal management problems. Si substrates with embedded micro-heat pipes (MHPs) couple good thermal characteristics and cost savings associated with IC batch processing. The thermal performance of MHP is intimately related to the cross-sectional geometry. Different cross-sections are designed in order to enhance the backflow of working fluid. In this experimental study, three different Si MHPs with same hydraulic diameter and various cross-sections are fabricated by micro-fabrication methods and tested under different conditions of fluid charge ratios. The results show that the trapezoidal MHP associated with rectangular artery which is charged with 40% of vapor chamber’s volume has the best thermal performance. This silicon-based MHP is a passive approach for thermal management, which could widen applications in the commercial electronics industry and LED lightings.
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Weidman, Stephanie M., Daniel J. McFarland, Gulser Meric, and Ilhan Meric. "Determinants of return-on-equity in USA, German and Japanese manufacturing firms." Managerial Finance 45, no. 3 (March 11, 2019): 445–51. http://dx.doi.org/10.1108/mf-07-2018-0305.
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Purpose DuPont financial analysis is generally used in micro-economic studies to compare an individual firm’s financial performance with industry averages. The purpose of this paper is to undertake a macro-economic cross-sectional analysis of the determinants of return-on-equity (ROE) in USA, German and Japanese manufacturing firms. Design/methodology/approach The authors use cross-sectional log-linear multivariate regression analysis to determine the elasticity of ROE to changes in net profit margin (NPM), total assets turnover (TAT) and equity multiplier (EQM) in USA, German and Japanese manufacturing firms. The authors obtain the data for the analysis from the COMPUSTAT Research Insight/Global Vintage database. Findings With data for all manufacturing firms, the authors find that the most important determinant of ROE is NPM in all three countries. The least important determinant of ROE is TAT in the USA and Germany, and EQM in Japan. Electronics is the most important manufacturing industry in all three countries, the authors also apply the analysis to data for the electronics manufacturing firms in the three countries. The authors find that an increase of 10 percent in NPM increases ROE by about 9.8 percent in Germany, by about 8.3 percent in the USA, and by about 6.9 percent in Japan. An increase of 10 percent in TAT increases ROE by about 2.2 percent in Germany and by about 1.5 percent in Japan. An increase of 10 percent in EQM increases ROE by about 1.9 percent in Germany and by about 1.5 percent in the USA. Practical implications The empirical findings of this study can provide useful insights for financial managers regarding the determinants of ROE they should focus on to achieve the greatest impact on ROE. Originality/value DuPont analysis is generally used as a micro-economic tool at the firm level. This study is a macro-economic application of the tool to study the cross-sectional determinants of ROE at the industry level.
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Griffiths, A. D., J. Herrnsdorf, J. J. D. McKendry, M. J. Strain, and M. D. Dawson. "Gallium nitride micro-light-emitting diode structured light sources for multi-modal optical wireless communications systems." Philosophical Transactions of the Royal Society A: Mathematical, Physical and Engineering Sciences 378, no. 2169 (March 2, 2020): 20190185. http://dx.doi.org/10.1098/rsta.2019.0185.
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Gallium nitride-based light-emitting diodes (LEDs) have revolutionized the lighting industry with their efficient generation of blue and green light. While broad-area (square millimetre) devices have become the dominant LED lighting technology, fabricating LEDs into micro-scale pixels (micro-LEDs) yields further advantages for optical wireless communications (OWC), and for the development of smart-lighting applications such as tracking and imaging. The smaller active areas of micro-LEDs result in high current density operation, providing high modulation bandwidths and increased optical power density. Fabricating micro-LEDs in array formats allows device layouts to be tailored for target applications and provides additional degrees of freedom for OWC systems. Temporal and spatial control is crucial to use the full potential of these micro-scale sources, and is achieved by bonding arrays to pitch-matched complementary metal-oxide-semiconductor control electronics. These compact, integrated chips operate as digital-to-light converters, providing optical signals from digital inputs. Applying the devices as projection systems allows structured light patterns to be used for tracking and self-location, while simultaneously providing space-division multiple access communication links. The high-speed nature of micro-LED array devices, combined with spatial and temporal control, allows many modes of operation for OWC providing complex functionality with chip-scale devices. This article is part of the theme issue ‘Optical wireless communication’.
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Kosoy, Boris. "Micro channels in macro thermal management solutions." Thermal Science 10, no. 1 (2006): 81–98. http://dx.doi.org/10.2298/tsci0601081k.
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Modern progress in electronics is associated with increase in computing ability and processing speed, as well as decrease in size. Future applications of electronic devices in aviation, aero space and high performance consumer products? industry demand on very stringent specifications concerning miniaturization, component density, power density and reliability. Excess heat produces stresses on internal components inside the electronic device, thus creating reliability problems. Thus, a problem of heat generation and its efficient removal arises and it has led to the development of advanced thermal control systems. Present research analyses a thermodynamic feasibility of micro capillary heat pumped net works in thermal management of electronic systems, considers basic technological constrains and de sign availability, and identifies perspective directions for the further studies. Computer Fluid Dynamics studies have been per formed on the laminar convective heat transfer and pressure drop of working fluid in silicon micro channels. Surface roughness is simulated via regular constructal, and stochastic models. Three-dimensional numerical solution shows significant effects of surface roughness in terms of the rough element geometry such as height, size, spacing and the channel height on the velocity and pressure fields.
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Monaco-Malbet, Stéphanie, Emilie Poudevigne, Michael Sztucki, Elodie Boller, Tamzin Lafford, and Edward Mitchell. "ESRF X-rays at the service of industry." Acta Crystallographica Section A Foundations and Advances 70, a1 (August 5, 2014): C591. http://dx.doi.org/10.1107/s205327331409408x.
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The creation and tailoring of new materials are at the heart of current industry challenges. New materials must meet ever more stringent requirements of performance, whilst fitting into the modern cradle-to-grave cycle of material production, use, and recycling. The properties and function expected of materials depend heavily upon their composition and their micro- or even nano-structure. Their "ultimate" characterisation is possible down to the atomic scale using the tools and techniques of large-scale facilities such as synchrotron X-rays. The European Synchrotron Radiation Facility (ESRF) provides the ability to visualise the atomic, nano-, and macro-structure of a huge range of complex materials, often under processing or end-use conditions and in real time. This capability lends itself to an equally wide range of industrial R&D problems which, in particular, have been adopted by the healthcare industry. Beyond drug discovery and development, the ESRF is also very active in providing analysis for micro- and nano-electronics, energy and smart materials, transport, chemistry and catalysis, engineering materials, and home and body care amongst others. In Europe and worldwide, funding agencies are requesting and demanding a stronger economic return from the significant public investments made in central facilities and this is resulting a gradual but firm pressure for stronger interactions with industry. In this context, new business models are springing to life, with more partnerships, more services, and nimble small start-ups bridging the gap between the oft "ivory tower" nature of research infrastructure and the commercially driven industry world. This presentation will present and discuss the increasingly critical role of such large-scale facilities in delivering ultimate materials characterization for innovative industrial and applied R&D, looking to both the current developments and future possibilities as well as review several examples of partnerships between research and industry and the impact these partnerships have on academic research.
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Low, Yee L., Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, and Khanh C. Nguyen. "Packaging of Optical MEMS Devices." Journal of Electronic Packaging 125, no. 3 (September 1, 2003): 325–28. http://dx.doi.org/10.1115/1.1535933.
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Recently, optical MEMS devices have gained considerable attention in the telecommunications industry—particularly in the optical networking and switching arenas. Since optical MEMS are micro-systems which rely on high precision optics, electronics and mechanics working in close concert, these emerging devices pose some unique packaging challenges yet to be addressed by the general packaging industry. Optical MEMS packages often are required to provide both optical and electrical access, hermeticity, mechanical strength, dimensional stability, and long-term reliability. Hermetic optical access necessitates the use of metallized and anti-reflection coated windows, and ever-increasing electrical I/O count has prompted the use of higher density substrate/package technologies. Taking these requirements into consideration, we explore three ceramic packaging technologies, namely high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate designs, package materials, ease of integration and assembly.
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Kiswanto, Gandjar, Maulana Azmi, Adrian Mandala, Dede Lia Zariatin, and Tae Jo Ko. "Machining Parameters Mapping’s of Inconel 718 and Aluminum Alloy 1100 in Micro-Milling Process." Key Engineering Materials 846 (June 2020): 99–104. http://dx.doi.org/10.4028/www.scientific.net/kem.846.99.
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The development of micro-products in industry, like aviation, medical equipment, electronics, etc, has been increasing lately. The need for scaling down of product has been increasing to make the product simpler and complex. Micro-milling has capabilities in producing complex parts. In this study, mapping and comparing the result of the machining process of Inconel 718 and Aluminum Alloy 1100 was employed. In this experiment, Inconel 718 was used as workpiece material and the result of Aluminum Alloy taken from recent studies. Then, A cutting tool with a diameter 1 mm carbide coating TiAlN was used in this experiment. The machining process was performed with three varieties of spindle speed and feed rate with a constant depth of cut. After the machining is done, the mapping of the result surface roughness of Inconel 718 and AA1100 performed. It was found that Inconel 718 has poor machinability compared with AA 1100. Inconel 718 also has a high manufacturing cost compared to AA 1100 because the cutting tool was easy to wear.
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Schönecker, Andreas, and Sylvia Gebhardt. "Microsystems Technologies for Use in Structures and Integrated Systems." Advances in Science and Technology 56 (September 2008): 76–83. http://dx.doi.org/10.4028/www.scientific.net/ast.56.76.
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Piezoceramics are considered as key functional material in micro systems and smart structure technology. Showing superior mechanical, dielectric, pyroelectric, ferroelectric and piezoelectric properties they introduce improved functionality, e.g. sensing, actuation, energy harvesting, health monitoring or shape control. Various applications such as micro integrated valves, drives, voltage converter, piezoelectric, pyroelectric and ultrasound sensors are expected. Another field of application concerns active structures in space, automotive or machine building industry. Progress was achieved by combining flexible board and piezo technology which opens up a new class of reliable ready to use actuator and sensor modules. Tailored design and packaging are seen as key factors for progress in custom applications. Load carrying structures with embedded actuators, sensors and electronics, which are usually pre-integrated in modules, offer the opportunity for noise reduction, vibration and shape control and health monitoring. The present paper summarizes the potential of advanced, microsystems compatible piezotechnology for active structures and systems. The focus will be given to PZT film and fibre processing and the integration in silicon wafer, ceramic multilayer and polymer matrix architectures. Finally, forward-looking applications are highlighted.
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Arutyunov, Valerii V., and Nataliya V. Grishina. "BASIC REGIONAL SCIENTIFIC CLUSTERS OF RUSSIA." RSUH/RGGU Bulletin. Series Information Science. Information Security. Mathematics, no. 2 (2021): 8–18. http://dx.doi.org/10.28995/2686-679x-2021-2-8-18.
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The paper analyzes the scientific activity of Russian organizations in the three regional scientific clusters of Russia (Moscow, St. Petersburg and the cluster of the Moscow region), the results of which in a number of branches of science are characterized by high values of the demand, citation and Hirsch indices obtained on the basis of scientometric indicators (publication activity, citation, Hirsch index) from the database of the Russian Science Citation Index (RSCI). At the same time, 11 such natural science branches were identified in the Moscow cluster (chemical technologies and industry, geodesy and cartography, biology, physics, communications, chemistry, biotechnology, astronomy, electrical engineering, electronics and radio engineering, geography) and corresponding organizations in each of these branches of science, in St. Petersburg-six (electrical engineering, physics, geology, electronics and radio engineering, geodesy and cartography, mechanics), in the Moscow region cluster – five (physics, instrumentation, chemistry, chemical technologies and industry, nuclear engineering). The three leaders in the index of demand for research results in the Moscow cluster include the L.Y. Karpov Research Institute of Physics and Chemistry (branch of science – chemical technologies and industry), the Research and Design Institute of Information, Automation and Communication in Railway Transport (geodesy and cartography) and the Institute of Micro-Production (biology). The Moscow Region cluster is dominated by the Institute of Microelectronics Technology and High-Purity Materials of the Russian Academy of Sciences (physics), the Joint Institute for Nuclear Research (instrumentation) and the Institute of Engineering Immunology (chemistry). Among the leaders in the St. Petersburg cluster are the M.A. Bonch-Bruevich St. Petersburg State University of Telecommunications (electrical engineering), Peter the Great St. Petersburg Polytechnic University (physics) and I.S. Gramberg Research Institute of Geology and Mineral Resources of the World Ocean (geology).
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Chen, Chang Cheng, and Bo Heng Wu. "Numerical Investigation on Mini Internal Gear Forging Process." Key Engineering Materials 725 (December 2016): 560–65. http://dx.doi.org/10.4028/www.scientific.net/kem.725.560.
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Gear transmission system is closely related to the consumer electronics products, factory automation industry, science and technology toys, medical equipment, electric hand tools, home appliances and the low-speed high torque applications of automotive industry. In the past, the almost manufacturers produced the metal gear of transmission system mostly by machining method. The gear machining tools of relative processing are mired in difficulties when the gear was miniaturized. In terms of the way of micro forging to produce the gear transmission components, not only a high accuracy and production rate being much times of gear machining, which achieves a significant competitive advantage. This study aims to conduct a research for a mini internal gear forging formability. For this purpose, the finite element method was used to analyze the mini internal gear forging process based on a die set of involute gear profile model. From the simulation results, the characteristic of flowing field of material filled into the gear mold and the induced strain and stress distribution were observed. All findings can be significantly provided to develop the manufacturing process of mini gear forging.
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Patel, Jayesh D., Rohit H. Trivedi, and Jignasa Savalia. "MGA Entertainment, Consumer Entertainment Products Company: Marketing Strategies for ‘Bratz’." South Asian Journal of Business and Management Cases 4, no. 2 (December 2015): 226–39. http://dx.doi.org/10.1177/2277977915596257.
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Toy industry in the US is product driven and full of challenges. This case presents an overview of the California-based Micro Games of America (MGA) Entertainment, which is a consumer entertainment products company, engaged in innovative lines of proprietary and licensed products including toys and games, dolls, consumer electronics, home decor, stationery and sporting goods. It had more than 200 licences. In 2001, MGA launched a fashion doll called ‘Bratz’, and it sold 150 million Bratz dolls all over the world. Bratz line surpassed the legendary brand ‘Barbie’—Mattel, Inc.’s flagship brand—in a short span of time through many innovative marketing strategies and different product placement, roll-outs, tie-ins and other promotional tactics, despite facing many challenges, such as, fast-changing demographics, shorter product life cycle (PLC) and negative perceptions about brand. This case can be used to address two issues: first, structural change drivers and trends that shaped the toy industry in developed economies and, second, how to develop effective marketing strategies for product with shorter PLC in highly product-driven market?
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Javed, Yaser, Mohtashim Mansoor, and Irtiza Ali Shah. "A review of principles of MEMS pressure sensing with its aerospace applications." Sensor Review 39, no. 5 (September 16, 2019): 652–64. http://dx.doi.org/10.1108/sr-06-2018-0135.
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Purpose Pressure, being one of the key variables investigated in scientific and engineering research, requires critical and accurate measurement techniques. With the advancements in materials and machining technologies, there is a large leap in the measurement techniques including the development of micro electromechanical systems (MEMS) sensors. These sensors are one to two orders smaller in magnitude than traditional sensors and combine electrical and mechanical components that are fabricated using integrated circuit batch-processing technologies. MEMS are finding enormous applications in many industrial fields ranging from medical to automotive, communication to electronics, chemical to aviation and many more with a potential market of billions of dollars. MEMS pressure sensors are now widely used devices owing to their intrinsic properties of small size, light weight, low cost, ease of batch fabrication and integration with an electronic circuit. This paper aims to identify and analyze the common pressure sensing techniques and discuss their uses and advantages. As per our understanding, usage of MEMS pressure sensors in the aerospace industry is quite limited due to cost constraints and indirect measurement approaches owing to the inability to locate sensors in harsh environments. The purpose of this study is to summarize the published literature for application of MEMS pressure sensors in the said field. Five broad application areas have been investigated including: propulsion/turbomachinery applications, turbulent flow diagnosis, experimentalaerodynamics, micro-flow control and unmanned aerial vehicle (UAV)/micro aerial vehicle (MAV) applications. Design/methodology/approach The first part of the paper deals with an introduction to MEMS pressure sensors and mathematical relations for its fabrication. The second part covers pressure sensing principles followed by the application of MEMS pressure sensors in five major fields of aerospace industry. Findings In this paper, various pressure sensing principles in MEMS and applications of MEMS technology in the aerospace industry have been reviewed. Five application fields have been investigated including: Propulsion/Turbomachinery applications, turbulent flow diagnosis, experimental aerodynamics, micro-flow control and UAV/MAV applications. Applications of MEMS sensors in the aerospace industry are quite limited due to requirements of very high accuracy, high reliability and harsh environment survivability. However, the potential for growth of this technology is foreseen due to inherent features of MEMS sensors’ being light weight, low cost, ease of batch fabrication and capability of integration with electric circuits. All these advantages are very relevant to the aerospace industry. This work is an endeavor to present a comprehensive review of such MEMS pressure sensors, which are used in the aerospace industry and have been reported in recent literature. Originality/value As per the author’s understanding, usage of MEMS pressure sensors in the aerospace industry is quite limited due to cost constraints and indirect measurement approaches owing to the inability to locate sensors in harsh environments. Present work is a prime effort in summarizing the published literature for application of MEMS pressure sensors in the said field. Five broad application areas have been investigated including: propulsion/turbomachinery applications, turbulent flow diagnosis, experimental aerodynamics, micro-flow control and UAV/MAV applications.
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Moon, Seungyeon, and Heesang Lee. "Shaping a Circular Economy in the Digital TV Industry: Focusing on Ecopreneurship through the Lens of Dynamic Capability." Sustainability 13, no. 9 (April 26, 2021): 4865. http://dx.doi.org/10.3390/su13094865.
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In this study, we investigate how companies can contribute to achieving a circular economy (CE) in the electronics industry viewed through the lens of dynamic capability. In particular, we examine how companies can contribute through idiosyncratic ecopreneurship according to dynamic capabilities with three points: the dynamic capabilities of established companies, the formation of ecopreneurship according to idiosyncratic dynamic capabilities, and the shaping of a CE through the interplay of ecopreneurship and dynamic capabilities of established companies. We conducted a case study of five leading TV manufacturers (Samsung, LG, Sony, Hisense, and TCL) to verify our conceptual framework, which we derived from a literature review. The case study shows that a company’s contribution to the CE and ecopreneurship type largely depend on a combination of dynamic capabilities and business strategies. Based on the case study results, we derived managerial implications with three points: the approach of leading companies to CE with consideration of business strategies, leveraging ecopreneurship to gain competitiveness in the market, and the influence of micro- and meso-level dynamic capabilities on a company’s contribution to CE.
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Çakır, Orhan. "Review of Etchants for Copper and its Alloys in Wet Etching Processes." Key Engineering Materials 364-366 (December 2007): 460–65. http://dx.doi.org/10.4028/www.scientific.net/kem.364-366.460.
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Wet etching processes have been widely used for producing micro-components for various applications. These processes are simple and easy to implement. The selection of suitable chemical solution which is called etchant is the most important factor in the wet etching processes. It affects etch rate and surface finish quality. Copper and its alloys are important commercial materials in various industries, especially in electronics industry. Their wide applications are due to their excellent electrical and thermal conductivity, ease of fabrication, good strength and fatigue properties. The present study examines the possible etchants for copper and its alloys and reviews studies in detail to find out optimum etchant and its application parameters. The study is also aimed to provide information about safety, health and environmental issues caused by using various etchants in wet etching processes of copper and copper alloys.
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Ferro, Paolo, and Franco Bonollo. "Design for Recycling in a Critical Raw Materials Perspective." Recycling 4, no. 4 (November 19, 2019): 44. http://dx.doi.org/10.3390/recycling4040044.
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The European Union (EU) identified a number of raw materials that are strategic for its economy but suffer at the same time from a high supply risk. Such critical raw materials (CRMs) are used in a wide range of commercial and governmental applications: green technology, telecommunications, space exploration, aerial imaging, aviation, medical devices, micro-electronics, transportation, defense, and other high-technology products and services. As a result, the industry, the environment, and our quality and modern way of life are reliant on the access and use of them. In this scenario, recycling may be a strategic mitigating action aimed at reducing the critical raw materials supply risks. In this work, a design strategy is proposed for alloys selection that minimizes the number of CRMs with the lowest end-of-life recycling input rate. The method is illustrated with an example.
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He, Baofeng, D. Patrick Webb, and Jon Petzing. "Areal Surface Texture Parameters for Copper/Glass Plating Adhesion Characteristics." Measurement Science Review 21, no. 1 (February 1, 2021): 11–18. http://dx.doi.org/10.2478/msr-2021-0002.
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Abstract Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide the conductive layer, but there is limited understanding of how the surface topography of the glass substrate affects the copper/glass bonding strength exhibited in the current literature. A laser ablation technique was used to prepare glass surfaces with micro-scale structured features in this study, and these features were characterized quantitatively using areal surface texture parameters. The copper/glass bonding adhesion strength was quantified using a scratch testing technique, and the relationships between the critical loads measured and the areal surface parameters, as well as discussion of the underlying mechanisms, are presented in this report. Statistical analysis was employed to identify the most relevant areal parameters that may be used for prediction of the copper/glass bonding strength and for design of adhesion promoting surface textures. The experimental results suggest that the most significant areal surface texture parameters to consider are Sq, Sdq, Sdr, Sxp, Vv, Vmc, and Vvc, and the recommended value range for each parameter for optimal plating adhesion performance is given.
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Mazurov, Anatoly I., and Nikolay N. Potrakhov. "ABOUT TECHNOLOGIES OF X-RAY SYSTEMS FOR CONTROL OF ELECTRONIC COMPONENTS." Journal of the Russian Universities. Radioelectronics 22, no. 3 (July 2, 2019): 113–21. http://dx.doi.org/10.32603/1993-8985-2019-22-3-113-121.
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Introduction. X-ray methods are currently widely used in manufacturing of various products and components of the electronics industry, including micro- and nano-electronics. One of the most informative and illustrative methods is projection X-ray microscopy. Specialized X-ray systems for process control are developed and used in industry. The key element in the design of an X-ray inspection system is an X-ray tube. In the overwhelming majority of cases, X-ray inspection systems are based on collapsible microfocus x-ray tubes with constant pumping. This greatly complicates the design of the installation, increases its dimensions, weight and cost. Objective. Analysis of possible technical and technological solutions that improve the availability of the X-ray system for monitoring of electronic components while maintaining the information content of the control. Materials and methods. The article presents the results of analytical studies of assessment of the degree of influence of the main parameters of the X-ray tube – the size of the focal spot and the focal length – on the resolution of the resulting X-ray images. The advantages and disadvantages of two variants of the construction of the X-ray inspection systems are described: based on collapsible and based on sealed X-ray tubes. The dependence of the size of the focal spot on the voltage on the X-ray tube and on the power supplied by the electron beam to the target of the X-ray tube is analyzed. It is shown that sealed (from a vacuum pumping system) micro focus X-ray tubes can be successfully used as a radiation source in installations for X-ray inspection. It is concluded that in most cases, sealed tubes are more practical. Results. In solving of most problems of non-destructive testing of electronic components in the composition of the Xray system, X-ray sources based on sealed X-ray tubes can be successfully used. Due to this, dimensions, weight, and the cost of an X-ray system for monitoring of electronic components are substantially reduced. Conclusion. Sealed X-ray tubes are an effective alternative in the development of an X-ray system for monitoring of electronic components, which enables to fundamentally increase the availability of such a system.
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Smeets, René P. P., Arman Derviškadić, Adriaan B. Hofstee, Roy M. Nijman, Nadew A. Belda, and Benjamin Baum. "Innovative T&D Switching Equipment and Development of its Testing Technology." B&H Electrical Engineering 15, no. 1 (October 1, 2021): 5–18. http://dx.doi.org/10.2478/bhee-2021-0001.
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Abstract A short overview of the developments in the overall transmission and distribution industry in South East Europe is presented in this contribution. Furthermore, as the present journal focuses on breaking and switching in HV and MV switchgears, several technology innovations in T&D switchgear have been identified, at global level. In almost all cases, the ongoing energy transition is the main driver of these innovations. In this contribution, based on test-experience and overview of the industry, innovations are grouped by drivers, with each of them having its impact on testing technology. These drivers are the following: 1. Increase of ratings: the ongoing trend of co-existence of micro-, local- and super-grids. The consequences for testing of switchgear for UHV and very large current are highlighted: 2. Offshore transmission: compactness and reliability are requirements stretched to the limit for this application. Very long cables for AC and HVDC power transmission, even in a multi-terminal topology will have impact on switchgear. 3. Health safety and environment: here, the major switchgear related discussion is on SF6 replacement and reduction of electrical losses. Various issues related to SF6 replacement will be highlighted. In addition, a recent project intended to quantify the hazard of aluminium bus bars in power stations affected by long duration fault arcs is described. 4. HVDC and power electronics: circuit breakers are going to be installed in multi-terminal HVDC grids. Testing of HVDC breakers, regarding the complete interruption current process is described. 5. Digitalization: switchgear is going to be communicating with the IEC 61850 communication protocol. This will impact testing for which laboratories need to prepare. The introduction of smaller micro-electronics (sensors, IED) closer to primary HV components and its high-frequency transients need careful consideration regarding operation, endurance, and lifetime. 6. Resilience and fault mitigation: Resilience against severe weather conditions, vandalism and cyber-attacks calls for resistant equipment and robust mobile equ ipment/substations that can 6be deployed very rapidly still having an extreme degree of readiness and availability. 7. Quality assurance of products in the face of a pandemic and a lockdown requires adequate methods of a remote digital access to test, and factory sites for type testing and inspection.
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KUZANYAN, A. A., V. A. PETROSYAN, and A. S. KUZANYAN. "METHODS FOR PULSED LASER DEPOSITION OF LARGE-AREA FILMS USING MORE THAN ONE TARGET." International Journal of Modern Physics: Conference Series 15 (January 2012): 170–78. http://dx.doi.org/10.1142/s2010194512007118.
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Several new methods of pulsed laser deposition for fabricating large-area thin films of uniform thickness and composition on a rotating substrate and onto a moving ribbon are proposed. The peculiarities of the methods are the laser deposition of a compound upon a substrate through a diaphragm or the mask placed in immediate proximity of the substrate together with a use of more than one target. The proposed method makes it possible to obtain thin films of uniform thickness on substrates with sizes limited only by the deposition chamber size. Some of the methods are experimentally verified by depositing CuO thin films and the deviation of the film thickness from the average value does not exceed ±3%. Given the advantage of laser deposition, the offered methods should find practical use, in particular, in micro-electronics, optical industry, development of superconducting coated conductors, deposition of thin films of functional materials and other modern technologies.
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Berretti, Enrico, Nicola Calisi, Andrea Capaccioli, Claudia Borri, Laura Capozzoli, Abdel Magid Hamouda, Andrea Giaccherini, et al. "Electrodeposited White Bronzes: A Comparison between Zn-Bearing and Zn-Free Coatings." Materials Proceedings 2, no. 1 (May 13, 2020): 26. http://dx.doi.org/10.3390/ciwc2020-06824.
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White bronzes are ternary alloys composed of Cu, Zn and Sn, named after their bright whitish color. This class of alloys shares excellent hardness, corrosion and tarnishing resistance, and is commonly adopted in galvanic industrial processes as technological grade coatings to obtain layers with particular aesthetical and/or anticorrosive properties. Despite the widespread employment of white bronzes in fashion and the electronics industry, the recent literature lacks a characterization of these electrodeposited alloys with respect to more common binary (Cu-Sn) white bronzes. In this presentation, a thorough characterization of a commercial ternary Cu-Zn-Sn white bronze, produced by electrodeposition, is reported. Structural, chemical and physical characteristics of the deposited coating were investigated by various techniques (e.g., FIB/SEM, XPS, XRD, EDX, micro-hardness, color and corrosion tests). Results were compared with a similar set of measures obtained from a binary electrodeposited Cu-Sn white bronze (with a high tin content), in order to shed some light on the influence of Zn in the coating properties.
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Duan, J. Z., and R. M. Fisher. "Influence of columnar and defect microstructures in chromium films on the kinetics of internal stress generation." Proceedings, annual meeting, Electron Microscopy Society of America 50, no. 2 (August 1992): 1368–69. http://dx.doi.org/10.1017/s0424820100131474.
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Vapor-deposited Cr and other thin metal films are widely used in the micro-electronics industry as active circuit elements or intermediate layers to enhance the adhesion of other thin film materials to ceramic substrates or inhibit inter-diffusion. A key factor in the long term reliability of semiconductor devices is adequate adherence of films to various substrates to maintain the electrical integrity of the device. Internal stresses, that exceed the fracture strength of the interface, can cause interfacial fracture and film delamination so that the microstructures and internal stresses that are produced during film formation have been subjects of much research in this laboratory and elsewhere. Conventional and high resolution TEM and SEM studies of Cr films deposited on glass and Si substrates at room and elevated temperatures and at normal and oblique incident angles have shown that Cr forms as well defined columns surrounded by a highly disordered intergranular regions.
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Carminati, Marco. "Advances in High-Resolution Microscale Impedance Sensors." Journal of Sensors 2017 (2017): 1–15. http://dx.doi.org/10.1155/2017/7638389.
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Sensors based on impedance transduction have been well consolidated in the industry for decades. Today, the downscaling of the size of sensing elements to micrometric and submicrometric dimensions is enabled by the diffusion of lithographic processes and fostered by the convergence of complementary disciplines such as microelectronics, photonics, biology, electrochemistry, and material science, all focusing on energy and information manipulation at the micro- and nanoscale. Although such a miniaturization trend is pivotal in supporting the pervasiveness of sensors (in the context of mass deployment paradigms such as smart city, home and body monitoring networks, and Internet of Things), it also presents new challenges for the detection electronics, reaching the zeptoFarad domain. In this tutorial review, a selection of examples is illustrated with the purpose of distilling key indications and guidelines for the design of high-resolution impedance readout circuits and sensors. The applications span from biological cells to inertial and ultrasonic MEMS sensors, environmental monitoring, and integrated photonics.
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Ogawa, Keiji, Takumi Imada, Haruki Kino, Heisaburo Nakagawa, and Hitomi Kojima. "Micro-End-Milling with Small Diameter Left Hand Helical Tool for High Quality Vertical Wall Machining." International Journal of Automation Technology 13, no. 5 (September 5, 2019): 639–47. http://dx.doi.org/10.20965/ijat.2019.p0639.
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The demand for micro-end-milling for products in fields such as the medical, optical, and electronics industry is increasing. However, when machining with a small diameter end-mill (micro-end-mill) with diameters such as 0.5 mm, the rigidity of the tool itself is low; hence, the cutting conditions must be set to low values to achieve stable machining. Therefore, we examined various cutting phenomena that occur during actual machining processes to achieve high machining accuracy, high finished-surface quality, and long tool life. Some studies on micromachining achieved high accuracy, high-grade machining by considering the cutting phenomena. In previous papers, we dealt with the side-cutting phenomena in micro-end-milling of hardened die steels using a high-speed air-turbine spindle with rolling bearing. Cutting experiments were carried out by measuring the cutting force and flank wear of a cutting tool to investigate the difference in cutting phenomena caused by cutting direction in high-speed micro-end-milling. Observation of the machined surface and measurement of the profile of the cutting edge and machined surface were demonstrated. It was revealed that machining quality in high-speed up-cut milling was better than that in down-cut milling. Shoulder cutting, in which both peripheral and bottom cutting edges act simultaneously on the workpiece, was also investigated. A novel small diameter end-mill with left-hand helical tool with right-hand cut was developed to avoid damaging the cutting edge in the initial cutting stage. In the present study, high-quality shoulder cutting of a vertical wall using the new tool was proposed and demonstrated.
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Egitto, Frank D., Rabindra N. Das, Francesco Marconi, Bill Wilson, and Voya R. Markovich. "Development of Electronic Substrates for Medical Device Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2012, DPC (January 1, 2012): 001527–46. http://dx.doi.org/10.4071/2012dpc-wa23.
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There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present study, we are developing flexible packages for a variety of medical applications. Here we discuss several classes of flexible materials that can be used to form high-performance flexible packaging. In addition, copper thinner than 5 μm is routinely used, with copper layers as thin as 0.2 μm used as a seed layer for semi-additive approaches. The use of semi-additive circuitization facilitates manufacture of fine-line circuit features, and traces narrower than 12μm have been produced routinely. A smooth copper-polymer interface is ideal for high speed applications and for fine line etching. Selection of an appropriate material provides good copper adhesion to the base film. Flexible materials with 1 or 2 metal layers provide the smallest possible roll diameter for systems such as catheters. Compatibility with well developed, high performance electronic materials represents a key advantage of flexible electronics systems that are enabled by high density fine line structures rather than unusual materials. Electrical interconnection between the chip and package can be made by a number of means. Solder-coated Cu-micro pillars for a variety of finer pitch applications are being developed. Cu micro pillars are grown through the dielectric or silicon and subsequently coated with solder to produce finer pitch 3D-interconnects. The paper also describes a novel approach for the fabrication of flexible electronics on PDMS substrates. The paper discusses the fabrication of PDMS substrates using different circuit patterns and geometries. Rozalia/Ron ok move from 2.5/3D to FC/WLP 12-21-11.
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Olmos, Dania, and Javier González-Benito. "Polymeric Materials with Antibacterial Activity: A Review." Polymers 13, no. 4 (February 18, 2021): 613. http://dx.doi.org/10.3390/polym13040613.
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Infections caused by bacteria are one of the main causes of mortality in hospitals all over the world. Bacteria can grow on many different surfaces and when this occurs, and bacteria colonize a surface, biofilms are formed. In this context, one of the main concerns is biofilm formation on medical devices such as urinary catheters, cardiac valves, pacemakers or prothesis. The development of bacteria also occurs on materials used for food packaging, wearable electronics or the textile industry. In all these applications polymeric materials are usually present. Research and development of polymer-based antibacterial materials is crucial to avoid the proliferation of bacteria. In this paper, we present a review about polymeric materials with antibacterial materials. The main strategies to produce materials with antibacterial properties are presented, for instance, the incorporation of inorganic particles, micro or nanostructuration of the surfaces and antifouling strategies are considered. The antibacterial mechanism exerted in each case is discussed. Methods of materials preparation are examined, presenting the main advantages or disadvantages of each one based on their potential uses. Finally, a review of the main characterization techniques and methods used to study polymer based antibacterial materials is carried out, including the use of single force cell spectroscopy, contact angle measurements and surface roughness to evaluate the role of the physicochemical properties and the micro or nanostructure in antibacterial behavior of the materials.
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Imada, Takumi, Keiji Ogawa, Haruki Kino, Heisaburo Nakagawa, and Hitomi Kojima. "Experimental Investigations on Cutting Phenomena in Shoulder Cutting of Hardened Die Steel with Small Diameter End Mill: Effects of Left Hand Helical Tool." International Journal of Automation Technology 14, no. 1 (January 5, 2020): 26–37. http://dx.doi.org/10.20965/ijat.2020.p0026.
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This study deals with shoulder cutting phenomena in micro-end-milling of hardened die steel. Demand for micro-end-milling for products in the medical, optical, and electronics industry is increasing. However, in machining with a small diameter end mill that has diameter of e.g., 0.5 mm, the rigidity of the tool itself is low; therefore, cutting conditions must be set to low values to achieve stable machining. We revealed that cutting phenomena became unstable because the end cutting edge was damaged early in shoulder cutting. Therefore, we experimentally prepared a left hand helical tool with a right hand cut to perform complete processing by improving the strength of the end cutting edge. Cutting experiments were carried out while measuring cutting force and observing cutting phenomena, end cutting edge, and machined surface via scanning electron microscopy (SEM). We determined the effects of such tools on fundamental phenomena in shoulder cutting with a small diameter end mill. The rake angle of the tool was improved based on experimental analysis of the damage mechanism of the cutting edge in the shoulder cutting. A result of the examination to investigate the influence of the difference in rake angle on chip evacuation showed that the chip discharge direction was affected by the rake angle; when the angle is blunt, the chips were discharged upward, and the chip discharge performance improved.
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Cole, Edward I., and Richard E. Anderson. "New Rapid Failure Analysis Techniques for Multilevel Metallization." MRS Bulletin 20, no. 11 (November 1995): 74–77. http://dx.doi.org/10.1557/s0883769400045632.
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Open interconnections on integrated circuits (ICs) are a serious and ubiquitous problem throughout the micro-electronics industry. The efforts to understand the mechanisms responsible for producing open interconnections and to develop analytical methods to localize them demonstrate the concern manufacturers have for this problem. Multiple layers of metallization not only increase the probability that an open conductor or via will occur because of the increased number of interconnections and vias but also increase the difficulty in localizing the site of the failure because upper layers may mask the failure site.Rapid failure analysis of open-conductor defects is critical in new product development and reliability assessment of ICs where manufacturing and product development delays can cost millions of dollars a day. In this article, we briefly review some standard failure analysis approaches and then concentrate on new techniques to rapidly locate open-conductor defects that would have been difficult or impossible to identify using earlier methods. Each method is described in terms of the physics of signal generation, application, and advantages and disadvantages when compared to existing methods.
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Liang, Peijie, Zhiliang Pan, Liang Tang, Guoqi Zhang, Daoguo Yang, Siliang He, and Haidong Yan. "Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer." Materials 15, no. 6 (March 17, 2022): 2232. http://dx.doi.org/10.3390/ma15062232.
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Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.
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Zhang, He-Na, Chunhua Yang, Yun-Qin Li, Shi-Yu Zhu, Xin-Yu Wang, Qi-Wen He, Dai-Song Tang, and Xiao-Chun Wang. "Large out-of-plane piezoelectricity of VIA group functionalized MXenes thin films for MEMS." Applied Physics Letters 121, no. 14 (October 3, 2022): 143504. http://dx.doi.org/10.1063/5.0106898.
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The integration of piezoelectric and micro-electro-mechanical system (MEMS) technologies is promoting the rapid development of the MEMS industry. However, due to the lack of excellent in-plane and out-of-plane piezoelectric coefficients, good ambient temperature stability, and high mechanical durability, the reported two-dimensional piezoelectric thin films are facing severe challenges in the development of MEMS. Therefore, based on density functional theory calculations, we simulated the VIA group (the sixth main family in the periodic table of elements) functional MXenes, namely, Sc2CXY (Sc2COS, Sc2COSe, Sc2CSO, and Sc2CSeO). The results show that this kind of material has good dynamic, thermal, and mechanical stability. Importantly, the structure exhibits good in-plane and out-of-plane piezoelectric effects due to the inversion asymmetry, bandgap adjustability, flexibility, and different electronegativity. Among them, the piezoelectric strain value of d33 is one to three orders of magnitude higher than that of d22 or d31, which makes these materials can become a strong candidate for advanced equipment such as nano-wearable electronics, robot bionic skin, and piezoelectric products for MEMS.
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Epstein, Alan H. "Millimeter-Scale, Micro-Electro-Mechanical Systems Gas Turbine Engines." Journal of Engineering for Gas Turbines and Power 126, no. 2 (April 1, 2004): 205–26. http://dx.doi.org/10.1115/1.1739245.
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The confluence of market demand for greatly improved compact power sources for portable electronics with the rapidly expanding capability of micromachining technology has made feasible the development of gas turbines in the millimeter-size range. With airfoil spans measured in 100’s of microns rather than meters, these “microengines” have about 1 millionth the air flow of large gas turbines and thus should produce about one millionth the power, 10–100 W. Based on semiconductor industry-derived processing of materials such as silicon and silicon carbide to submicron accuracy, such devices are known as micro-electro-mechanical systems (MEMS). Current millimeter-scale designs use centrifugal turbomachinery with pressure ratios in the range of 2:1 to 4:1 and turbine inlet temperatures of 1200–1600 K. The projected performance of these engines are on a par with gas turbines of the 1940s. The thermodynamics of MEMS gas turbines are the same as those for large engines but the mechanics differ due to scaling considerations and manufacturing constraints. The principal challenge is to arrive at a design which meets the thermodynamic and component functional requirements while staying within the realm of realizable micromachining technology. This paper reviews the state of the art of millimeter-size gas turbine engines, including system design and integration, manufacturing, materials, component design, accessories, applications, and economics. It discusses the underlying technical issues, reviews current design approaches, and discusses future development and applications.
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Mierczyk, Z. "Lasers in the dual use technologies." Bulletin of the Polish Academy of Sciences: Technical Sciences 60, no. 4 (December 1, 2012): 691–96. http://dx.doi.org/10.2478/v10175-012-0080-z.
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Abstract In the more developed countries the use of modern technologies in the national economy is a general process allowing joint funding of a security research and development by both sources, state and private. The last one is especially involved in applications of modern technologies. One of the examples of important modern technologies being under development in many countries are dual-use technologies, which include IT technologies, sensors, effective energy sources, material science, nanotechnology, micro- and nano-electronics, photonics, biotechnology and quantum medicine. In this paper chosen technologies fulfilling the needs of the military technique and security monitoring systems, which have found their applications in the different branches of industry like power engineering, transportation, construction industry, metrology, protection of environment and the medicine, are discussed. The examples include the devices and lasers systems for different threats monitoring, which have been developed at the Military University of Technology. The research studies carried out on the analysis of various materials based on their spectroscopic characteristics: absorption, emission, dispersion, polarization and fluorescence in different mediums have led to the development of laser telemetry devices, environment monitoring devices and spatial imagery, as well as devices for medical diagnostics and therapy. Mentioned systems are composed of functional modules, which were developed to meet the real needs. These systems can be expanded further by addition of extra detectors of chemical materials and physical properties, and improving measuring functions and data transmission and processing.
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Mouapi, Alex, Nadir Hakem, and Nahi Kandil. "Cantilevered Piezoelectric Micro Generator Design Issues and Application to the Mining Locomotive." Energies 13, no. 1 (December 20, 2019): 63. http://dx.doi.org/10.3390/en13010063.
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This paper will present a complete discussion in recent design strategies for harvesting vibration energy using piezoelectric cantilever transducers. The interest in this primary energy source is due to its presence in non-negligible quantities in most of the engines used in the industrial process. Previous work has shown that it is possible to harvest significant amounts of energy capable of supplying a wireless sensor (WS) node. However, in most research, only one step of the energy conversion and utilization chain is studied. Starting from the definition of the different design issues for a piezoelectric micro generator (PMG), the leading optimization solutions will be reviewed in this paper. Based on the findings, the quantification of the data transmission range of wireless sensor nodes powered by a PMG is proposed to support the objectives envisioned by Industry 4.0. The vibration characteristics taken from mining locomotives that have not yet been treated previously are used to illustrate the improvement of the various optimization solutions. Through our objectives, this work offers a comprehensive discussion on the use of vibrational energy by wireless sensors, bringing together the fields of mechanics, electrical, electronics, and wireless communications. The theoretical basis for each design stage is provided through the design equations. Based on actual measurements of ambient vibration, it is demonstrated, considering an optimal design of the PMG, that a WS could transmit data beyond 1 km for physical phenomena to be controlled every 7 min.
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Kwak, Jae B., and Soonwan Chung. "Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components." Microelectronics International 38, no. 1 (January 29, 2021): 14–22. http://dx.doi.org/10.1108/mi-08-2020-0052.
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Purpose This paper aims to present an adaptation of digital image correlation (DIC) to the electronics industry for reliability assessment of electronic packages. Two case studies are presented: one for warpage measurement of a micro-electro-mechanical system (MEMS) package under different temperature conditions and the other for the measurement of transient displacements on the surface of a printed circuit board (PCB) assembly under free-fall drop conditions, which is for explaining the typical camera setup requirement and comparing among different boundary conditions by fastening methods of PCB. Design/methodology/approach DIC warpage measurements on a small device, such as a MEMS package, require a special speckle pattern. A new method for the creation of speckle patterns was developed using carbon coating and aluminum evaporative deposition. To measure the transient response on the surface of a PCB during a free-fall impact event, three-dimensional (3D) DIC was integrated with synchronized stereo-high speed cameras. This approach enables the measurement of full-field displacement on the PCB surface during a free-fall impact event, contrary to the localized information that is obtained by the conventional strain gage and accelerometer method. Findings The authors suggest the proposed patterning method to the small-sized microelectronics packages for DIC measurements. More generally, the idea is to have a thin layer of the dark or bright color of the background and then apply the white or black colored pattern, respectively, so that the surface has high contrast. Also, to achieve a proper size of speckles, this paper does not want to expose the measuring objects to high temperatures or pressures during the sample preparation stage. Of course, it seems a complicated process to use aluminum evaporator, carbon coater and electroformed mesh. However, the authors intend to share one of the solutions to achieve a proper pattern on such small-sized electronic packages. Originality/value 3D DIC technique can be successfully implemented for the measurement of micro-scale deformations in small packages (such as MEMS) and for the analysis of dynamic deformation of complex PCB.
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Liang, Weijie, Xin Ge, Jianfang Ge, Tiehu Li, Tingkai Zhao, Xunjun Chen, Yaozhen Song, et al. "Reduced Graphene Oxide Embedded with MQ Silicone Resin Nano-Aggregates for Silicone Rubber Composites with Enhanced Thermal Conductivity and Mechanical Performance." Polymers 10, no. 11 (November 12, 2018): 1254. http://dx.doi.org/10.3390/polym10111254.
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With developments of the electronics industry, more components are being included in electronic devices, which has led to challenges in thermal management. Using reduced graphene oxide embedded with MQ silicone resin (RGO/MQ) nano-aggregates as the composite filler and silicone rubber (SR) as the matrix, a simple approach is designed to prepare RGO/MQ/SR composites. Reduced graphene oxide (RGO) was first used as a substrate for the growth of MQ silicone resin by hybridization, forming sandwich-like micro structured RGO/MQ nano-aggregates successfully. Then, RGO/MQ was integrated into α,ω-dihydroxylpolydimethylsiloxane based on the in situ solvent-free blending method, followed by condensation and vulcanization, fabricating the final RGO/MQ/SR composites. The effective strategy could enhance the adaptability between graphene and silicone matrix under external stimuli at room temperature by embedding nanoscale MQ into the interface of graphene/silicone as the buffer layer. Obvious improvements were found in both thermal conductivity and mechanical properties due to excellent dispersion and interfacial compatibility of RGO/MQ in the host materials. These attractive results suggest that this RGO/MQ/SR composite has potential as a thermal interface material for heat dissipation applications.