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Dissertations / Theses on the topic 'MICRO-BONDING'
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Kay, Robert William. "Novel micro-engineered stencils for flip-chip bonding and wafer level packaging." Thesis, Heriot-Watt University, 2008. http://hdl.handle.net/10399/2193.
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Andersson, Martin. "Ag-In transient liquid phase bonding for high temperature stainless steel micro actuators." Thesis, Uppsala universitet, Mikrosystemteknik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-207559.
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A stainless steel, high temperature, phase change micro actuator has been demonstrated using the solid-liquid phase transition of mannitol at 168°C and In-Ag transient liquid phase diffusion bonding. Joints created with this bonding technique can sustain temperatures up to 695°C, while being bonded at only 180°C, and have thicknesses between 1.4 to 6.0 μm. Physical vapour deposition, inkjet printing and electroplating have been evaluated as deposition methods for bond layers. For actuation, cavities were filled with mannitol and when heated, the expansion was used to deflect a 10 μm thick stainless steel membrane. Bond strengths of the joints are found to be in the region of 0.51 to 2.53 MPa and pressurised cavities sustained pressures of up to 30 bar. Bond strength is limited by the bond contact area and the surface roughness of the bonding layers.
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Ahmad, Zakiah. "Nano-and micro-particle filled epoxy-based adhesives for in-situ timber bonding." Thesis, University of Bath, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.478940.
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Lu, Chunmeng. "Development of novel micro-embossing methods and microfluidic designs for biomedical applications." Columbus, Ohio : Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1156820643.
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Leal, Ayala Angel Andres. "Effect of intermolecular hydrogen bonding on the micro-mechanical properties of high performance organic fibers." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 307 p, 2008. http://proquest.umi.com/pqdweb?did=1597616621&sid=11&Fmt=2&clientId=8331&RQT=309&VName=PQD.
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Struble, John D. "Micro-scale planar and two-dimensional modeling of two phase composites with imperfect bonding between matrix and inclusion." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17345.
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Yang, Keqin. "Inter-tube bonding and defects in carbon nanotubes and the impact on the transport properties and micro-morphology." Connect to this title online, 2009. http://etd.lib.clemson.edu/documents/1263408693/.
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Dutto, Mathieu. "Procédé micro-ondes pour l’élaboration de composites B4C-SiC par infiltration et réaction de silicium, en vue d’applications balistiques." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEM021/document.
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De nombreuses études ont montré la faisabilité de la fabrication de pièces composites en carbure de bore et de silicium par l’infiltration de silicium fondu dans une préforme poreuse en carbure de bore (Reaction bonding). Cette méthode permet l’obtention d'un composite fortement chargé en carbure de bore (phase qui nous intéresse pour les applications balistiques), sans pour autant avoir besoin de monter à des températures de frittage de plus de 2200°C (température habituellement utilisée pour fritter le B4C). Dans notre cas la température maximale est comprise entre 1400-1600°C. Cette thèse s’intéresse plus particulièrement à l’adaptation du procédé de « reaction bonding » au chauffage sous champ micro-ondes. Les micro-ondes sont particulièrement intéressantes en ce qui concerne la rapidité du cycle thermique et le chauffage préférentiel de certaines phases (dans le cas des multi-matériaux). Pour ce faire, plusieurs verrous technologiques ont dû être levés (travail sous atmosphère et sous champs électromagnétiques, température élevée, …). Les composites obtenus sont comparés à leurs équivalents en chauffage conventionnel. Des différences microstructurales ont été observées au niveau du SiC formé lors de la réaction. Cette thèse nous a donc permis de :-trouver des conditions de fabrication de pièces en carbure de bore par chauffage micro-ondes (Argon/Hydrogéné10%, légère surpression : 1.4 bars)-montrer que les propriétés mécaniques (dureté, module d’Young,…) obtenues en four micro-ondes sont équivalentes à celles obtenus en four conventionnel (dureté : 14-20GPa) -montrer d’importante différences microstructurales du carbure de silicium formé, entre les échantillons obtenus sous vide (four conventionnel) et ceux obtenus sous atmosphère contrôlée (micro-ondes et four conventionnel).-montrer que le passage à des plus grandes tailles est possible, il est même plus simple d’infiltrer de grandes pièces que de petites à cause de l’effet de la masse sur la réponse du matériau aux champs électromagnétiques des micro-ondes.Ces résultats sont très prometteurs pour des applications balistiques : fabrication de gilets pare-balles et blindages légers<br>Many studies have shown the feasibility of processing silicon-boron carbide composite by infiltration of molten silicon through a porous preform made of boron carbide (Reaction Bonding Process). Using this method, the obtained composite contains a large amount of boron carbide, which is the hardest and the most interesting phase for ballistic application. In our developed process, the maximum processing temperature is 1600°C, which is far below the usual high temperature stage/pressure conditions commonly used to sinter B4C by conventional method (respectively 2200°C and40MPa). The main goal of this thesis is to develop a novel reaction bonded process based on microwave heating. Microwaves heating has many interesting features, including fast heating process, selective heating mechanism (in case of heating multi-materials) and volumetric heating distribution. . To fulfill our goal, many technological issues need to be addressed (working in controlled atmosphere and under microwave field, high temperature ...). This thesis reports the development of this novel process, and materials made from it, exhibit similar properties compared to those made conventionally. However, some microstructural differences were observed in SiC resulting phases. This thesis has allowed to-find out the boron carbide composite piece fabrication conditions in microwave cavity (Argon/Hydrogen10%, slight overpressure: 14bars)-show that mechanical properties (hardness, Young’s modulus…) obtained are comparable to those measured on conventionally reaction bonded produced materials. -show that formed SiC has some microstructural peculiarities, between vacuum samples (for conventional) and ones obtained in hydrogenous argon (using microwave).-show that it is possible to produce larger size piece (66mm of diameter). These results are shown to be promising for ballistic applications, including the fabrication of bulletproof jacket and light armor
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Allenet, Timothée. "Réalisation d'un micro-capteur optofluidique pour la mesure déportée de radionucléides." Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT041/document.
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L’exploitation de l’énergie nucléaire pour la production d’électricité présente un défi de gestion des e˜uents radiotoxiques pour les générations présentes et futures. Face à ce constat, la communauté des chimistes recherche continument à améliorer les solutions de traitement et de recyclage du combustible usé. Dans le contrôle de ces procédés, les opérations d’analyse jouent un rôle primordial. La miniaturisation des procédés est un des enjeux principaux de la recherche en sûreté nucléaire, dans un e˙ort de réduction des risques, des délais et des coûts des activités de laboratoire. Dans ce contexte, les travaux présentés ici sont issus d’une collaboration entre le CEA de Marcoule et l’IMEP-LAHC et traitent de la mise au point d’un microsystème optofluidique sur verre, adapté à la mesure de concentration de plutonium (VI) en acide nitrique. Une source de lumière sonde est confinée dans un guide d’onde obtenu par échange d’ions et interagit par onde évanescente avec un canal microfluidique. La raie d’absorption à 832 nm du Pu(VI) dans la solution à analyser devient donc observable dans le spectre de la lumière après une certaine longueur d’interaction. Un des enjeux principaux est de fabriquer un capteur très robuste, fonctionnel en boîte à gants. L’assemblage du dispositif est e˙ectué par collage moléculaire avec un procédé permettant d’atteindre une énergie de surface > 2, 5 J·m2 suÿsante à garantir la tenue du dispositifs à des pressions testées jusqu’à 2 bars dans les canaux. Les fonctions optiques et fluidiques du dispositif sont complètement interfacées avec des fibres optiques et des capillaires fluidiques. Des mesures spectrales d’une solution de plutonium (VI) en acide nitrique ont permis de vérifier la compatibilité de la solution technologique abordée pour la manipulation d’acides forts et la résistance à l’irradiation. Le système présente une limite de détection de 1,6·10−2 mol·L−1 Pu(VI) pour un volume sondé inférieur à 1 nano-litre, au sein d’un microcanal de 21 micro-litres. Une structure permettant d’optimiser la sensibilité du capteur ainsi que le volume du canal est étudiée en perspective du travail de thèse, afin d’atteindre les performances équivalentes à des outils commerciaux pour des volumes sondés de l’ordre de quelques nano-litres<br>.The use of nuclear energy for electricity production presents an important concern with radiotoxic waste management for present and future generations. In view of this fact, the chemists’ community has been searching for solutions to treat and recycle nu-clear fuel. The miniaturization of chemical processes is extensively sought out nowerdays, in an attempt to reduce laboratory acivity risks, delays and costs. The researched ana-lytical innovation requires subsequent development of appropriate analysis tools. In this respect, the work presented here addresses the development of co-integrated optofluidic micro-systems on borosilicate glass, compatible with nuclear e˜uent analysis constraints. A spectrometric sensor is designed, fabricated, interfaced and characterized in a nuclear environement. An optical waveguide and a microfluidic channel are designed adjacent to one another in order to obtain wide-spectrum absorption spectroscopy measurements by light/fluid evanescent interaction. Both ion-exchange technology and wet-etching tech-nologies were used to create the optical and fluidic planar functions. The device is assem-bled by direct molecular bonding with an optimized protocole which withstands surface energies > 2, 5 J·m2. Sensor optical and fluidic functions are interfaced with fiber optics and fluid capillaries in order for the chip to be used within a plug-and-play detection chain. Spectral measurements of a plutonium(VI) in nitric acid solution have allowed to verify the technological solution’s compatibility with harsh acid manipulation and irra-diation resistance. The system put together for the detection of plutonium(VI) displays a detection limit of 1.6×10−2 mol·L−1 for a probed volume below 1 nano-liter, inside a 21 micro-liter channel. A new sensor design is studied in the thesis work perspectives in order to optimize sensor detection limit and channel volume and reach industrial tools analytical performances with nano-liter sample volumes
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Samel, Björn. "Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite." Doctoral thesis, KTH, Mikrosystemteknik, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4470.
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The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. Precise microfluidic control for such systems has long been considered one of the most difficult technical barriers due to integration of on-chip fluidic handling components and complicated off-chip liquid control as well as fluidic interconnections. Actuation principles and materials with the advantages of low cost, easy fabrication, easy integration, high reliability, and compact size are required to promote the development of such systems. Within this thesis, liquid displacement in microfluidic applications, by means of expandable microspheres, is presented as an innovative approach addressing some of the previously mentioned issues. Furthermore, these expandable microspheres are embedded into a PDMS matrix, which composes a novel thermally responsive silicone elastomer composite actuator for liquid handling. Due to the merits of PDMS and expandable microspheres, the composite actuator's main characteristic to expand irreversibly upon generated heat makes it possible to locally alter its surface topography. The composite actuator concept, along with a novel adhesive PDMS bonding technique, is used to design and fabricate liquid handling components such as pumps and valves, which operate at work-ranges from nanoliters to microliters. The integration of several such microfluidic components promotes the development of disposable lab-on-a-chip platforms for precise sample volume control addressing, e.g. active dosing, transportation, merging and mixing of nanoliter liquid volumes. Moreover, microfluidic pumps based on the composite actuator have been incorporated with sharp and hollow microneedles to realize a microneedle-based transdermal patch which exhibits on-board liquid storage and active dispensing functionality. Such a system represents a first step toward painless, minimally invasive and transdermal administration of macromolecular drugs such as insulin or vaccines. The presented on-chip liquid handling concept does not require external actuators for pumping and valving, uses low-cost materials and wafer-level processes only, is highly integrable and potentially enables controlled and cost-effective transdermal microfluidic applications, as well as large-scale integrated fluidic networks for point-of care diagnostics, disposable biochips or lab-on-a-chip applications. This thesis discusses several design concepts for a large variety of microfluidic components, which are promoted by the use of the novel composite actuator. Results on the successful fabrication and evaluation of prototype devices are reported herein along with comprehensive process parameters on a novel full-wafer adhesive bonding technique for the fabrication of PDMS based microfluidic devices.<br>QC 20100817
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Musaramthota, Vishal. "Prediction of Fracture Toughness and Durability of Adhesively Bonded Composite Joints with Undesirable Bonding Conditions." FIU Digital Commons, 2015. http://digitalcommons.fiu.edu/etd/2513.
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Advanced composite materials have enabled the conventional aircraft structures to reduce weight, improve fuel efficiency and offer superior mechanical properties. In the past, materials such as aluminum, steel or titanium have been used to manufacture aircraft structures for support of heavy loads. Within the last decade or so, demand for advanced composite materials have been emerging that offer significant advantages over the traditional metallic materials. Of particular interest in the recent years, there has been an upsurge in scientific significance in the usage of adhesively bonded composite joints (ABCJ’s). ABCJ’s negate the introduction of stress risers that are associated with riveting or other classical techniques. In today’s aircraft transportation market, there is a push to increase structural efficiency by promoting adhesive bonding to primary joining of aircraft structures. This research is focused on the issues associated with the durability and related failures in bonded composite joints that continue to be a critical hindrance to the universal acceptance of ABCJ’s. Of particular interest are the short term strength, contamination and long term durability of ABCJ’s.
One of the factors that influence bond performance is contamination and in this study the influence of contamination on composite-adhesive bond quality was investigated through the development of a repeatable and scalable surface contamination procedure. Results showed an increase in the contaminant coverage area decreases the overall bond strength significantly. A direct correlation between the contaminant coverage area and the fracture toughness of the bonded joint was established. Another factor that influences bond performance during an aircraft’s service life is its long term strength upon exposure to harsh environmental conditions or when subjected to severe mechanical loading. A test procedure was successfully developed in order to evaluate durability of ABCJ’s comprising severe environmental conditioning, fatiguing in ambient air and a combination of both. The bonds produced were durable enough to sustain the tests cases mentioned above when conditioned for 8 weeks and did not experience any loss in strength. Specimens that were aged for 80 weeks showed a degradation of 10% in their fracture toughness when compared to their baseline datasets. The effect of various exposure times needs to be further evaluated to establish the relationship of durability that is associated with the fracture toughness of ABCJ’s.
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Artvin, Zafer. "Fabrication Of Nanostructured Samples For The Investigation Of Near Field Radiation Transfer." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614826/index.pdf.
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Radiative heat transfer in nanostructures with sub-wavelength dimensions can exceed that predicted by Planck'<br>s blackbody distribution. This increased effect is due to the tunneling of infrared radiation between nanogaps, and can allow the eventual development of nano-thermo-photo-voltaic (Nano-TPV) cells for energy generation from low temperature heat sources. Although near field radiation effects have been discussed for many years, experimental verification of these effects is very limited so far. In this study, silica coated silicon wafer sample chips have been manufactured by using MEMS fabrication methods for testing the near field radiation effects. A variety of samples with 1×<br>1, 2×<br>2 and 5×<br>5 mm2 area, and with 25 nm, 50 nm, 100 nm and 200 nm (nano-gap) separations have been prepared. 3D structures with vacuum gaps have been obtained by bonding of the silica coated wafers. The samples have been tested in an experimental setup by a collaborative group at Ö<br>zyegin University, Istanbul. An increase in the net radiation heat transfer with decreasing nano-gap size has been reported by the Ö<br>zyegin group who used these samples in a parallel study. The thesis outlines the micro-fabrication techniques used for the sample preparation. Also, the manufacturing problems we have faced during this research program are discussed.
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Bellaredj, Mohamed Lamine Fayçal. "Méthodes et outils pour la fabrication de transducteurs ultrasonores en silicium." Phd thesis, Université de Franche-Comté, 2013. http://tel.archives-ouvertes.fr/tel-00937560.
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L'utilisation des ultrasons pour l'imagerie présente plusieurs avantages : elle est extrêmement sure car ellen'utilise pas de radiations ionisantes et ne présente pas d'effets néfastes sur la santé. D'autre part, elle donne desrésultats d'excellente qualité avec un coût relativement faible. Historiquement, les matériaux piézoélectriques et leurscomposites ont été très tôt utilisés pour la génération d'ultrasons. Les transducteurs fabriqués à partir de ces matériauxdominent actuellement le marché des sondes ultrasonores. Cependant, pour certaines applications, ils ne peuvent pasêtre utilisés pour des raisons de dimensionnement et de limitations dues aux propriétés des matériaux. Une solutionpeut être apportée par l'utilisation des transducteurs ultrasonores capacitifs micro-usinés dits CMUTs. Ces dernierssuscitent un intérêt croissant dans le milieu de l'imagerie ultrasonore et sont considérés comme une alternativepotentielle et viable aux transducteurs piézoélectriques. Cette nouvelle technologie CMUTs est caractérisée par uneplus large bande passante, une sensibilité élevée, une facilité de fabrication et une réduction des coûts de production.Cette thèse est consacrée à la mise en place d'un certain nombre d'outils théoriques et expérimentaux permettant lamodélisation/conception, la fabrication et la caractérisation de transducteurs CMUTs à membrane circulaire pourl'émission des ultrasons. Nous commençons par développer des outils de simulation à base de calculs par élémentsfinis, permettant la compréhension et la modélisation du comportement électromécanique des CMUTs pour laconception et le dimensionnement des cellules élémentaires et des réseaux. Nous proposons par la suite un nouveauprocédé de fabrication de transducteurs CMUTs basé sur le collage anodique d'une couche de silicium monocristallind'épaisseur fixe d'une plaquette de SOI sur un substrat de verre. L'évolution du procédé de fabrication est détailléepour chaque étape technologique en soulignant à chaque fois les améliorations/modifications apportées pour unefiabilité et une répétitivité accrue associées à une connaissance des limites de faisabilité. Dans la dernière partie de cetravail, on s'intéresse à la mise en œuvre de plusieurs plateformes expérimentales permettant différentescaractérisations électromécaniques statiques et dynamiques des dispositifs CMUTs fabriqués
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Cummins, Gerard Pio. "Fabrication of microchannels for use in micro-boiling experiments." Thesis, University of Edinburgh, 2011. http://hdl.handle.net/1842/5035.
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Increased power densities in VLSI chips have led to a need to develop cooling methods that can cope with the increased heat produced by such chips. Currently one of the more attractive methods to meet this goal is through the use of two phase flow of a fluid as changing phase of the material allows high heat transfer rates for a low temperature change. To bring this technology to commercialisation a greater understanding of the underlying physics involved at the microscale is required as there is much debate within literature as to what occurs during two phase flow heat transfer at these scales. The work conducted as part of this thesis is a step towards improving the understanding of the mechanisms involved with this process. This thesis describes the fabrication of a novel microchannel structure, which can be used to experimentally characterise two phase heat transfer as it occurs. The final process reported for these microchannels structures provides the basis of a technology for the fabrication of microchannels with increased sensor densities. Two types of microchannel devices have been fabricated for this project. The first device of these was an array of parallel microchannels formed by the reactive ion etching (RIE) of silicon, which was then bonded with Pyrex glass. These microchannels were simple in that sensors were not integrated for local measurement. However the production of these devices incorporated fabrication techniques such as anodic bonding and inductively coupled plasma RIE that were essential to the fabrication of more complex devices. The second device built was a single microchannel that contained an integrated heater and several temperature sensors. The use of wafer bonding enabled the device to take full advantage of both bulk and surface micromachining technology as the placement of the temperature sensors on the channel floor would not be possible with conventional bulk micromachining. The initial microchannel structures demonstrated that wafer bonding could be used to fabricate novel devices, but they highlighted the difficulty of achieving strong anodic bonds due to the presence of dielectric films throughout the fusion bonded wafer stack used in the channel fabrication. To improve the performance of the device the process was optimised through the use of insitu, non-destructive test structures. These structures enabled the uniformity and strength of the bonds to be optimised through visualisation over the whole wafer surface. The integrated sensors enabled temperature measurements to be taken along the channel with a sensitivity 3.60 ΩK-1 while the integrated heater has delivered a controllable and uniform heat flux of 264 kWm-2.
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Joesbury, Adam Michael. "New approaches to composite metal joining." Thesis, Cranfield University, 2015. http://dspace.lib.cranfield.ac.uk/handle/1826/10009.
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This thesis explores new methods for achieving load-carrying joints between the dissimilar materials of continuous fibre reinforced polymer matrix composites and structural metals. The new composite-to-metal joining methods investigated in this work exploit the metal-to-metal joining techniques of arc micro-welding, resistance spot welding, and metal filler brazing, to form novel micro-architectured metal adherends that can be used for enhanced composite-to-metal joining. Through a combination of equipment instrumentation and metallographic inspection of fabricated prototype joints, understanding is gained of how materials respond when processed by manufacturing techniques that have not previously been exploited for dissimilar material joining. Mechanical testing of prototype joints; both to ultimate loading strength and partial failure states, with subsequent inspection of specimens and comparative performances evaluation enabled joining performance characterisation of the new joining methods. Key results include: the identification of micropin reinforced adhesive joints to exhibit pseudo-ductile failure characteristics, resistance spot weld reinforcement of adhesive joints to boost bonding performance, and the use of a polymer infused metal foam to overcome difficulties of thermoplastic to metal adhesion. Through this work knowledge of how novel micro-architectures reacted under mechanical loading enabled insights to be gained into how perceived manufacturing defects can benefit joining performance. Such examples include, localised material weakness that lead to global pseudo-ductile failure behaviour, and low-strength secondary joining mechanisms boosting primary load transfer systems. By comparison of the diverse joining methods investigated in this work, trends were identified that suggest joining performance between the two dissimilar materials is improved by increasing the direct interaction between the composite reinforcement fibres and the metal structure. It is demonstrated that joining improvements are gained by forming mechanical connections between metals and composite precursory material before the final manufacturing process of the composite.
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Thammajaruk, Putsadeeporn. "Influence of Ceramic Coating Pre-treatment Techniques on Bonding of Zirconia to Composite Cements." Thesis, The University of Sydney, 2018. http://hdl.handle.net/2123/19628.
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Zirconia is a ceramic widely used in dentistry as an indirect restorative material. In contrary to glass-ceramics, zirconia does not contain amorphous silica glass in its composition thus conventional bonding based on hydrofluoric acid etching followed by silane application is ineffective. The inability to etch and chemically treat the fitting surface of zirconia restoration is seen as a limiting factor for bonding composite cements to zirconia, particularly, in those clinical situations where achieving resistance and retention form of the abutments teeth is challenging. Objectives: The aims of this thesis were: (i) to update the current knowledge and to systematically review and evaluate which pre-treatments and type of cement provide the greatest bond strength between zirconia and composite cements and (ii) to evaluate and compare micro-tensile bond strength between composite cements and zirconia pre-treated with three ceramic coating techniques (DCMhotbond ceramic coating, nano-structured alumina coating, and lithium disilicate ceramic coating) versus conventional methods based on air abrasion, and (iii) to chemically characterise the nature of the bond. Results: The meta-analysis and systematic review appeared to indicate that ceramic coating techniques combined with methacryloyloxydecyl dihydrogenphosphate (MDP)-containing primers achieved the greatest long-term bond strength in aged condition. Testing of the micro-tensile bond strength showed that nano-structured alumina coating groups yielded comparable bond strength to air abrasion techniques, whereas DCMhotbond ceramic coating and lithium disilicate ceramic coating groups yielded lower bond strength than alumina air-abrasion techniques. Chemical bonds between primers and ceramic-coated or air-abraded zirconia were detected in all the protocols investigated. However, the nature of the bonds was different according to the material and protocol. Conclusions: Ceramic-coating techniques based on nano-structured alumina coating has the potential to be an alternative method to improve the bond strength between zirconia and composite cement. Other ceramic coating techniques were more sensitive to strength degradation following thermocycling and did not seem to be valid alternatives to air-abrasion protocols.
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Liang, Hai-chiung, and 梁海瓊. "Micro-push-out bond strength and the modes of failure for a fibre-reinforced resin-post system cemented using three adhesive lutingcements after cyclic loading." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2010. http://hub.hku.hk/bib/B45591106.
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Pekárek, Jan. "Katodové nanostruktury v MEMS aplikacích." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217244.
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The main goal of this work is to introduce new carbon structures - carbon nanotubes. The main objective of this work is to take advantage of the unique characteristic of carbon nanotubes to emit electrons at very low supply voltage.
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Mahindre, Prajakta Prakash. "Micro-push-out bond strength and the modes of failure for a fiber-reinforced resin-post system cemented using four adhesive luting cements." Click to view the E-thesis via HKUTO, 2009. http://sunzi.lib.hku.hk/hkuto/record/B43224052.
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Singh, John-Luke Benjamin. "Design and Fabrication of Micro-Channels and Numerical Analysis of Droplet Motion Near Microfluidic Return Bends." Thesis, North Dakota State University, 2019. https://hdl.handle.net/10365/31706.
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Three-dimensional spheroid arrays represent in vivo activity better than conventional 2D cell culturing. A high-throughput microfluidic chip may be capable of depositing cells into spheroid arrays, but it is difficult to regulate the path of individual cells for deposition. Droplets that encapsulate cells may aid in facilitating cell delivery and deposition in the return bend of a microfluidic chip. In this study, a low-cost method for fabricating polymer-cast microfluidic chips has been developed for rapid device prototyping. Computational fluid dynamic (CFD) simulations were conducted to quantify how a change in geometry or fluid properties affects the dynamics of a droplet. These simulations have shown that the deformation, velocity, and trajectory of a droplet are altered when varying the geometry and fluid properties of a multiphase microfluidic system. This quantitative data will be beneficial for the future design of a microfluidic chip for cell deposition into 3D spheroid arrays.
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Fischer, Andreas C. "Integration and Fabrication Techniques for 3D Micro- and Nanodevices." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-107125.
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The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new ground with a multitude of novel approaches for the integration of non-standard materials that enable the fabrication of 3D micro and nanoelectromechanical systems. The objective of this thesis is to highlight methods that make use of non-standard materials with superior characteristics or methods that use standard materials and fabrication techniques in a novel context. The overall goal is to propose suitable and cost-efficient fabrication and integration methods, which can easily be made available to the industry. The first part of the thesis deals with the integration of bulk wire materials. A novel approach for the integration of at least partly ferromagnetic bulk wire materials has been implemented for the fabrication of high aspect ratio through silicon vias. Standard wire bonding technology, a very mature back-end technology, has been adapted for yet another through silicon via fabrication method and applications including liquid and vacuum packaging as well as microactuators based on shape memory alloy wires. As this thesis reveals, wire bonding, as a versatile and highly efficient technology, can be utilized for applications far beyond traditional interconnections in electronics packaging. The second part presents two approaches for the 3D heterogeneous integration based on layer transfer. Highly efficient monocrystalline silicon/ germanium is integrated on wafer-level for the fabrication of uncooled thermal image sensors and monolayer-graphene is integrated on chip-level for the use in diaphragm-based pressure sensors. The last part introduces a novel additive fabrication method for layer-bylayer printing of 3D silicon micro- and nano-structures. This method combines existing technologies, including focused ion beam implantation and chemical vapor deposition of silicon, in order to establish a high-resolution fabrication process that is related to popular 3D printing techniques.<br><p>QC 20121207</p>
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Baum, Mario. "Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-161996.
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Die vorliegende Arbeit beschreibt die Übertragung der aus der Siliziumtechnologie bekannten Präzision der Strukturierung und die Zuverlässigkeit der Verbindungstechnologie auf andere Materialien wie Kupfer und PMMA. Diese Untersuchung ist auf die Entwicklung der Teiltechnologien Strukturierung und Integration fokussiert und konzentriert sich insbesondere auf die Kombination von Mikrostrukturierung und dreidimensionalen Aufbautechniken einschließlich vertikaler fluidischer Durchkontaktierungen bei den Materialien Silizium, Kupfer und Kunststoff (PMMA). Eine begleitende Charakterisierung und messtechnische Bewertung gestattet die Weiterentwicklung während der Experimentedurchführung und erweitert den Stand der Wissenschaft hinsichtlich der genannten Kombinationen<br>The work describes the transfer of well known high precisive and reliable micro technologies for patterning and packaging of Silicon to new materials like Copper and PMMA. This investigation is focused on special patterning technologies and system integration aspects. Furthermore the development of material-dependent micro patterning technologies and multi layer packaging techniques including vertical fluidic interconnects using materials like Silicon, Copper, and PMMA (polymer) is shown. An accompanying characterization and measurement-based evaluation enables the ongoing development while performing experimental analysis. At least a higher state of the art for these complex combinations is reached
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Mahindre, Prajakta Prakash. "Micro-push-out bond strength and the modes of failure for a fiber-reinforced resin-post system cemented using four adhesive lutingcements." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2009. http://hub.hku.hk/bib/B43224052.
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Agarwal, Rahul. "A novel normal-to-plane space efficient micro corner cube retroreflector with improved fill factor." [Tampa, Fla.] : University of South Florida, 2003. http://purl.fcla.edu/fcla/etd/SFE0000629.
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Bleiker, Simon J. "Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207185.
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Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D integration of NEMS and ICs also contributes to more compact device footprints, improves device performance, and lowers the power consumption. Therefore, 3D integration of NEMS and ICs has been proposed as a promising solution to the end of Moore’s law, i.e. the slowing advancement of complementary metal-oxide-semiconductor (CMOS) technology.In this Ph.D. thesis, I propose a comprehensive fabrication methodology for heterogeneous 3D integration of NEM devices directly on top of CMOS circuits. In heterogeneous integration, the NEMS and CMOS components are fully or partially fabricated on separate substrates and subsequently merged into one. This enables process flexibility for the NEMS components while maintaining full compatibility with standard CMOS fabrication. The first part of this thesis presents an adhesive wafer bonding method using ultra-thin intermediate bonding layers which is utilized for merging the NEMS components with the CMOS substrate. In the second part, a novel NEM switch concept is introduced and the performance of CMOS-integrated NEM switch circuits for logic and computation applications is discussed. The third part examines two different packaging approaches for integrated MEMS and NEMS devices with either hermetic vacuum cavities or low-cost glass lids for optical applications. Finally, a novel fabrication approach for through silicon vias (TSVs) by magnetic assembly is presented, which is used to establish an electrical connection from the packaged devices to the outside world.<br>Tredimensionell (3D) integration av mikro- och nano-elektromekaniska system (MEMS/NEMS) med integrerade kretsar (ICs) är en ny teknik som erbjuder stora fördelar jämfört med konventionell mikroelektronik. MEMS och NEMS används oftast som sensorer och aktuatorer då de möjliggör många funktioner som inte kan uppnås med vanliga ICs.3D-integration av NEMS och ICs bidrar även till mindre dimensioner, ökade prestanda och mindre energiförbrukning av elektriska komponenter. Den nuvarande tekniken för complementary metal-oxide-semicondictor (CMOS) närmar sig de fundamentala gränserna vilket drastiskt begränsar utvecklingsmöjligheten för mikroelektronik och medför slutet på Moores lag. Därför har 3D-integration identifierats som en lovande teknik för att kunna driva vidare utvecklingen för framtidens elektriska komponenter.I denna avhandling framläggs en omfattande fabrikationsmetodik för heterogen 3D-integration av NEMS ovanpå CMOS-kretsar. Heterogen integration betyder att både NEMS- och CMOS-komponenter byggs på separata substrat för att sedan förenas på ett enda substrat. Denna teknik tillåter full processfrihet för tillverkning av NEMS-komponenter och garanterar kompatibilitet med standardiserade CMOS-fabrikationsprocesser.I den första delen av avhandlingen beskrivs en metod för att sammanfoga två halvledarskivor med en extremt tunn adhesiv polymer. Denna metod demonstreras för 3D-integration av NEMS- och CMOS-komponenter. Den andra delen introducerar ett nytt koncept för NEM-switchar och dess användning i NEM-switch-baserade mikrodatorchip. Den tredje delen presenterar två olika inkapslingsmetoder för MEMS och NEMS. Den ena metoden fokuserar på hermetisk vakuuminkapsling medan den andra metoden beskriver en lågkostnadsstrategi för inkapsling av optiska komponenter. Slutligen i den fjärde delen presenteras en ny fabrikationsteknik för så kallade ”through silicon vias” (TSVs) baserad på magnetisk självmontering av nickeltråd på mikrometerskala.<br><p>20170519</p>
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Schelcher, Guillaume. "Le transfert de films : vers une intégration hétérogène des micro et nanosystèmes." Phd thesis, Université Paris Sud - Paris XI, 2012. http://tel.archives-ouvertes.fr/tel-00755977.
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Une technologie d'élaboration de micro et nanosystèmes idéale devrait permettre l'intégration de différents matériaux (magnétiques, piézoélectriques, polymères, etc.) ou structures (composants optiques, mécaniques, optoélectroniques, etc.) de nature fortement hétérogène dans le but d'obtenir des systèmes multifonctionnels complexes éventuellement encapsulés. Un moyen de contourner les différents problèmes d'incompatibilité, liés aux mélanges des technologies de fabrication, est de transférer les différents films de matériaux ou composants d'un substrat donneur, sur lequel ils ont été préalablement élaborés, vers le substrat comportant le système visé Dans cette optique, un procédé de transfert de film à basse température a été développé. Ce procédé repose sur le contrôle de l'adhésion d'un film mince de nickel préformé, à partir d'un substrat dit " donneur ", sur une couche à adhésion contrôlée de nature carbonée ou fluorocarbonée. La libération mécanique du film, sur un substrat dit " cible ", est assurée par une soudure adhésive via des cordons de scellement en BCB. Grâce à sa facilité de mise en œuvre et aux faibles températures requises pour le scellement des substrats, ce procédé a permis de transférer des microstructures en nickel sur des substrats de silicium, de verre ainsi que sur des substrats Kapton souples. L'emploi d'une soudure BCB assure l'isolation thermique et électrique des microstructures sur le substrat cible. La versatilité du procédé a été prouvée par l'empilement de microstructures suspendues et par le transfert de divers matériaux. Ce procédé est très prometteur pour de nombreuses applications et apporte de nouvelles perspectives quant à l'intégration hétérogène 3D de micro et nanosystèmes.
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Hofmann, Lutz. "3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias." Doctoral thesis, Universitätsbibliothek Chemnitz, 2017. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-231412.
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For mobile electronics such as Smartphones, Smartcards or wearable devices there is a trend towards an increasing functionality as well as miniaturisation. In this development Micro Electro- Mechanical Systems (MEMS) are an important key element for the realisation of functions such as motion detection. The specifications given by such devices together with the limited available space demand advanced packaging technologies. The 3D-Wafer Level Packaging (3D-WLP) enables one solution for a miniaturised MEMS package by using techniques such as Wafer Level Bonding (WLB) and Through Silicon Vias (TSV). This technology increases the effective area of the MEMS device by elimination dead space, which is typically required for other approaches based on wire bond assembly. Within this thesis, different TSV technology concepts with respect to a 3D-WLP for MEMS have been developed. Thereby, the focus was on a copper based technology as well as on two major TSV implementation methods. This comprises a Via Middle approach based on the separated TSV fabrication in the cap wafer as well as a Via Last approach with a TSV implementation in either the MEMS or cap wafer, respectively. For each option with its particular challenges, corresponding process modules have been developed. In the Via Middle approach, the wafer-related etch rate homogeneity determines the TSV reveal from the wafer backside Here, a reduction of the TSV depth down to 80 μm is favourable as long as the desired Cu-thermo-compression bonding (Cu-TCB) is performed before the thinning. For the TSV metallisation, a Cu electrochemical deposition method was developed, which allows the deposition of one redistribution layer as well as the bonding patterns for Cu-TCB at the same time. In the Via Last approach, the TSV isolation represents one challenge. Chemical Vapour Deposition processes have been investigated, for which a combination of PE-TEOS and SA-TEOS as well as a Parylene deposition yield the most promising results. Moreover, a method for the realisation of a suitable bonding surface for the Silicon Direct Bonding method has been developed, which does not require any wet pre treatment of the fabricated MEMS patterns. A functional MEMS acceleration sensor as well as Dummy devices serve as demonstrators for the overall integration technology as well as for the characterisation of electrical parameters<br>Im Bereich mobiler Elektronik, wie z.B. bei Smartphones, Smartcards oder in Kleidung integrierten Geräten ist ein Trend zu erkennen hinsichtlich steigender Funktionalität und Miniaturisierung. Bei dieser Entwicklung spielen Mikroelektromechanische Systeme (MEMS) eine entscheidende Rolle zur Realisierung neuer Funktionen, wie z.B. der Bewegungsdetektion. Die Anforderungen derartiger Bauteile zusammen mit dem begrenzten zur Verfügung stehenden Platz erfordern neuartige Technologien für die Aufbau- und Verbindungstechnick (engl. Packaging) der Bauteile. Das 3D-Wafer Level Packaging (3D-WLP) ermöglicht eine Lösung für eine miniaturisierte MEMS-Bauform unter Nutzung von Techniken wie dem Waferlevelbonden (WLB) und den Siliziumdurchkontaktierungen (TSV von engl. Through Silicon Via). Diese Technologie erhöht die effektive aktive Fläche des MEMS Bauteils durch die Reduzierung von Toträumen, welche für andere Ansätze wie der Drahtbond-Montage üblich sind. In der vorliegenden Arbeit wurden verschiedene Technologiekonzepte für den Aufbau von 3D-WLP für MEMS erarbeitet. Dabei lag der Fokus auf einer Kupfer-basierten Technologie sowie auf zwei prinzipiellen Varianten für die TSV-Implementierung. Dies umfasst den Via Middle Ansatz, welcher auf der TSV Herstellung auf einem separaten Kappenwafer beruht, sowie den Via Last Ansatz mit einer TSV Herstellung entweder im MEMS-Wafer oder im Kappenwafer. Für beide Varianten mit individuellen Herausforderungen wurden entsprechende Prozessmodule entwickelt. Beim Via Middle Ansatz ist die Wafer-bezogene Ätzratenhomogenität des Siliziumtiefenätzen entscheidend für das spätere Freilegen der TSVs von der Rückseite. Hier hat sich eine Reduzierung der TSV-Tiefe auf bis zu 80 μm vorteilhaft erwiesen insofern, das Kupfer-Thermokompressionsbonden (Cu-TKB) vor dem Abdünnen erfolgt. Zur Metallisierung der TSVs wurde ein Cu Galvanikprozess erarbeitet, welcher es ermöglicht gleichzeitig eine Umverdrahtungsebene sowie die Bondstrukturen für das Cu-TKB zu erzeugen. Beim Via Last Ansatz ist die TSV Isolation eine Herausforderung. Es wurden CVD (Chemische Dampfphasenabscheidung) Prozesse untersucht, wobei eine Kombination aus PE-TEOS und SA-TEOS sowie eine Parylene Beschichtung erfolgversprechende Ergebnisse liefern. Des Weiteren wurde eine Methode zur Erzeugung bondfähiger Oberflächen für das Siliziumdirektbonden erarbeitet, welche eine Nass-Vorbehandlung des MEMS umgeht. Ein realer MEMS-Beschleunigungssensor sowie Testaufbauten dienen zur Demonstration der Gesamtintegrationstechnologie sowie zur Charakterisierung elektrischer Parameter
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Baum, Mario. "Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2014. https://monarch.qucosa.de/id/qucosa%3A20212.
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Die vorliegende Arbeit beschreibt die Übertragung der aus der Siliziumtechnologie bekannten Präzision der Strukturierung und die Zuverlässigkeit der Verbindungstechnologie auf andere Materialien wie Kupfer und PMMA. Diese Untersuchung ist auf die Entwicklung der Teiltechnologien Strukturierung und Integration fokussiert und konzentriert sich insbesondere auf die Kombination von Mikrostrukturierung und dreidimensionalen Aufbautechniken einschließlich vertikaler fluidischer Durchkontaktierungen bei den Materialien Silizium, Kupfer und Kunststoff (PMMA). Eine begleitende Charakterisierung und messtechnische Bewertung gestattet die Weiterentwicklung während der Experimentedurchführung und erweitert den Stand der Wissenschaft hinsichtlich der genannten Kombinationen.<br>The work describes the transfer of well known high precisive and reliable micro technologies for patterning and packaging of Silicon to new materials like Copper and PMMA. This investigation is focused on special patterning technologies and system integration aspects. Furthermore the development of material-dependent micro patterning technologies and multi layer packaging techniques including vertical fluidic interconnects using materials like Silicon, Copper, and PMMA (polymer) is shown. An accompanying characterization and measurement-based evaluation enables the ongoing development while performing experimental analysis. At least a higher state of the art for these complex combinations is reached.
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Senate, University of Arizona Faculty. "Faculty Senate Minutes January 22, 2018." University of Arizona Faculty Senate (Tucson, AZ), 2018. http://hdl.handle.net/10150/626508.
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Alexander, Dale. "Laser driven micro-explosive bonding." 1986. http://catalog.hathitrust.org/api/volumes/oclc/68787458.html.
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Liu, Hsung-Pen, and 劉祥本. "Brazing Diffusion Bonding of Micro Fiber Spinnerets." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/51746706231117767875.
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碩士<br>淡江大學<br>機械工程學系<br>86<br>Because of the need of the micro fiber spinnerets in domestic market, this research conducted an experiment of the brazing diffusion bonding of nickel cylinder and the JIS SUS 316 stainless steel hole. Using filler metal BNi-3 with the same bonding clearance 0.05 mm and under two bonding temperature 1000℃ and 1050℃, we study the varieties of microstructure, the diffusion situation of the component and the strength test to the bonding interface.
By the experiment result, we can always bond nickel cylinder with stainless steel hole successfully under the two temperature. But the nickel base filler metal BNi-3 has better wettability at 1050℃ than that at 1000℃, And the bonding interface can be divided into three zones, which are solid-diffusion zone, the zone near nickel base metal and near 316 stainless steel, On each zone, there are product of intermediate phase, precipitation in grains or in the grain boundaries, and the products will be increased or decreased by the length of the bonding time. We can obviously understand each element effect on the microstructure and the situation of diffusion. Besides, no matter there are filler metal or base metal, with the increasing of the time, each component of metal will deffuse out. But the diffused distance of Ni and Si elements in filler metal toward 316 stainless steel is shorter, and will not increase until reach a constant length.
The strength of the bonding interface will be stronger by the time under the two different bonding temperature. Even under shorter bonding time, the sample at 1050℃ has the higher strength than the one at 1000℃.
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Tsai, Chi-Yang, and 蔡奇洋. "Micro Vibrating Ring Gyroscope Fabricated with Fusion Bonding." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/96882589889542767171.
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Tsai, Gweo-cherng, and 蔡虢城. "Fabrication of micro deformable focusing mirror by bonding method." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/95456418406644345409.
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碩士<br>逢甲大學<br>機械工程學所<br>95<br>Micro-optical-electromechanical system, aiming at optical applications in MEMS, uses deformable mirrors to conduct adaptive optics devices and to change the focal length of the mirror. This thesis designed and fabricated micro deformable focusing mirror by bonding method. The novel micro deformable focusing mirror was actuated with electrostatics to adjust the focal length.
In analysis, plate and shell theories are used to obtain the relations among deformation and electrostatic force.
In fabrication, use the bulk-micromachining to produce upper and lower electrode structures. Finally, upper electrode structure bonded lower electrode structure by wafer bonding technology. To avoid the damage of high temperature and high voltage from anodic bonding method, this thesis rendered an idea which is using photo resist as medium.
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Wu, Yi-Ting, and 吳奕霆. "Fabrication and Analysis of Electrostatically Driven Micro Deformable Mirror by Bonding Method." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/12871453419588256175.
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碩士<br>逢甲大學<br>機械工程學所<br>98<br>An electro-statically actuated Micro-optical-electromechanical systems (MOEMS) device is designed in this thesis by bulk micromachining. This MEMOS device with deformable mirror can change mirror’s profile to focus light by applying voltage. To investigate the performance of the deformable mirror, numerical analysis is using as analytic method. And the device is made by MEMS fabrication process.
In the simulation, a multiphysical coupling software COMSOL by finite element method is used. Several mirror shapes are analyzed to obtained the relationship between mirror deformation, driving voltage and focal length.
In fabrication process, the top mirror structure and the lower mirror structure are both made by bulk micromachining. By the good adhesion ability of photoresist AZ4620, these two Wafers are bonded to become an electrostatically driven micro deformable mirror.
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Chang, Shyh-Ming, and 張世明. "Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding." Thesis, 1993. http://ndltd.ncl.edu.tw/handle/85629765706142355637.
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Yeh, Ren-Yu, and 葉人瑜. "Influence of Micro-mechanical Interlocking on Bonding Strength of Plastic/Metal Direct Adhesion." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/44437022855560275719.
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博士<br>國立交通大學<br>機械工程系所<br>104<br>Every material has its unique material properties, which can bring benefits or shortcomings. As advances of technologies, use of only one particular material very often cannot meet the demand of products. Thus, joining of dissimilar materials, especially between metal and plastic, has become a key issue in many industries.
Industrial joining of dissimilar materials is generally performed by using adhesive bonds. Nevertheless the usage of adhesives is not environmentally friendly and takes long curing time. Several direct adhesion technologies have been developed, such as insert injection molding, hot pressing, laser welding, ultrasonic welding, and friction lap welding. These technologies were achieved by several different joining mechanisms, however, micro mechanical interlocking is considered as one of the major factor of the direct adhesion.
The direct adhesion technologies based on micro mechanical interlocking were studied and developed in this thesis. In the first part, ABS and PBT+30%GF parts were formed and joined on micro-structured A5052 parts by injection molding method. An in-mold heating device was used to heat the metal insert independently. The PBT+30%GF could be joined onto the anodized, PEO, laser treated metal insert when the metal insert heated over 130°C. However, the ABS part could only joined onto laser specimen. In the second part, a low energy demand ultrasonic direct adhesion technology was carried out by the laser micro structure on the metal surface. The ABS parts were joined onto A5052 laser specimens by weld energy lower than 100J in 1sec. A method to predict the shear bond strength of micro-mechanical interlocking was established, and the shear bond strength of ABS/A5052 laser structured specimens were near the theoretical strength. The highest shear bond strength of injection molding was 14MPa, which was 36% of the plastic tensile strength. The highest shear bond strength of ultrasonic direct adhesion was 11MPa, which was 28% of the plastic tensile strength.
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Shih, Yen-Lin, and 施延霖. "Flip-Chip Bonding for 960 X 540 GaN-Based Micro Light Emitting Diode Array." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/00060283680124626493.
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碩士<br>國立清華大學<br>電子工程研究所<br>104<br>Recently, Flip-chip bonding plays an important role in bonding industries. Rather than traditional wire bonding, flip-chip bonding have many merits including high I/O, smaller size, shorter electrical path and better heat dissipation. Thus, many optoelectronics devices are asked for combination with this technique. The purpose of this research is to develop micro light emitting diode array applying flip-chip technique and aim for finding out the best parameter for flip-chip bonding. Besides, it is hoped to let all pixels lightened, increase yield and achieve well uniformity as process enhanced. At last, the 960 540 mLEDA by flip chip bonding is fabricated with yield rate 46.42%.
Because of insulating and hardness of sapphire, micro LED array has many potential in many fields. In response to larger size array and capacity requirements in the future, we use indium as interconnection material which is 6 um high by e-beam evaporation in this thesis. Daisy chain used for evaluating the inter-chip connectivity is also brought to our experiment. After finding out optimal bonding parameter and method for injection of underfill, the smallest single bump resistance in 10um diameter of daisy chain is 0.0597 Ω. Finally, apply the bonding parameter in 960 540 mLEDA.
We hope that this research would be dedicated to development of wearable devices and mask-free photolithography in the future and expanding potential applications of LED.
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Su, Yu-Heng, and 蘇裕恒. "Flip-Chip Bonding Testing and Applying for 960*540 Micro Light Emitting Diode Array." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/sqtfv8.
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Chung, Cheng Shan, and 鍾承珊. "Flip-Chip bonding for 64 × 64 Matrix-Addressable GaN-Based Micro-Light-Emitting Diodes Array." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/c9pg85.
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碩士<br>國立清華大學<br>電子工程研究所<br>103<br>Recently, the micro-light-emitting diode has become a potential commercial device, which is integrated with functional module for widely applications, such as micro-display, micro-projector, mask-free photolithography, and optogenetics. In this research, a monolithic 450 nm GaN-based 64 × 64 micro-light-emitting diode arrays (μLEDA) with flip-chip bonding is demonstrated. To realize a high-quality μLEDA, this research has to deal with issues raised by area shrinkage and arrayed emitters. Area shrinkage results in increased series resistance and enhanced perimeter effect, while arrayed emitters result in optical crosstalk. Furthermore, the flip-chip boning technology is introduced for enhancing the extraction efficiency and improving heat dissipation. Underfilling is also added to the process to improve the stability of the devices. We delve into these problems and find appropriate countermeasures to raise the yield and uniformity of the μLEDA. The operation voltage at 100 μA (25 A/cm2) and leakage current at -5 V are 2.89 V and 41.62 pA, respectively. And the output power at 100 μA (25 A/cm2) and 20 mA (5 kA/cm2) could be achieved to 9.5 μW and 0.42 mW, respectively.
In order to develop applications of active-matrix of μLEDA in the future, the flip-chip bonding technology must be investigated. In this thesis, we evaporated 6 μm-thick indium bumps and induced the relationship between the bump area and height. The bonding process is optimized by varying bonding force, temperature and time. The 120 × 120 indium bumps array is fabricated, which includes the daisy chains design for examining each of contact resistance is about 0.3 Ω and the yield is up to 100%.
In summary, 450 nm GaN-based 64 × 64 μLEDA with flip chip bonding is demonstrated in this thesis. We believed that these technologies play an important role to make μLEDA be a potential candidate for portable micro-projector with lowest power consumption.
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Sood, Varun. "An experimental study on thermal bonding effects of PMMA based micro-devices using hot embossing." 2007. http://hdl.handle.net/10106/899.
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Liu, Yu-Ting, and 劉育廷. "Fabrication and Characterization of CMOS Micro-Fluxgate with Wire-Bonding and Flip-Chip Post Process." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/dkvq9v.
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碩士<br>國立臺北科技大學<br>機電整合研究所<br>99<br>This paper presents a dual-core (Vacquier-type) micro-fluxgate magnetic sensor fabricated on a silicon chip based on standard CMOS technology. The 3D design with both excitation and sensing coils winding the cores can achieve a higher responsivity and a lower noise level, but the cost in mass production would be much higher in comparison with planar design. The silicon chip is 2.5 mm 2.5 mm in dimension, and the micro-fluxgate sensor occupies the area of 2.5 mm 1.8 mm. The sensor consists of magnetic cores, planar pick-up coils, bottom excitation coils (CMOS Al interconnections) and upper excitation coils (wire-bonding Al wires). The micro-solenoid excitation coils consisting of aluminum bonding wires and CMOS metallic layers can generate out-of-phase excitation magnetic fields strong enough to saturate the two magnetic cores. It was found that the sensor’s sensitivity can be optimized and the field noise spectral density can be minimized by adjusting the excitation current as well as the excitation frequency. The responsivity at the second harmonic of 25-kHz excitation frequency is maximized to 4.32 V/T when the excitation current is 174.9 mA. The largest responsivity of 9.43 V/T occurs at the second harmonic when the excitation frequency is 210 kHz and the excitation current is 174.9 mA. The minimum field noise of our device was found to be 1.7 nT/√Hz at 1 Hz under a 20-kHz excitation. In comparison with other miniature planar fluxgates with similar dimensions reported to date, our device has a relatively low field noise spectral density. In addition, the fabrication process of a new micro-fluxgate design with flip-chip technology was also investigated and the feasibility of this scheme was evaluated.
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Kwan, Charles. "Cyclic Deformation Behaviour and the Related Micro-mechanisms of F.C.C. Metals Processed by Accumulative Roll-bonding." Thesis, 2011. http://hdl.handle.net/1807/31810.
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The improvement in mechanical strength offered by ultra fine- (UF) and nanocrystalline (NC) sized grains is very attractive for potential applications of structural metals. Accumulative Roll-Bonding (ARB) is one of the promising new techniques for producing bulk UF grained metals. There are numerous reports on the monotonic mechanical behavior of various ARBed metals, however there are few, if any, on the cyclic deformation behavior of such metals. The primary objective of this study is to investigate the cyclic deformation behaviour and the related micro-mechanisms of ARBed metals from a fundamental perspective. To achieve this, the microstructure and the deformation behavior of commercial purity aluminum, OFHC copper, and DLP copper after ARB processing have been systematically characterized.
The as-ARBed microstructure is found to be composite natured, with constituents of different grain sizes. The three constituents are: (i)UF grained matrix, (ii)NC primary discontinuities, and (iii)conventional sized pre-existing coarse grains. Due to this composite nature, three different cyclic strain accommodation mechanisms were found in the ARBed OFHC copper: (i)conventional dislocation patterns in the large grains, (ii)reactivation of pre-existing shear bands, and (iii)stress/strain driven grain coarsening at sites of strain localization. The order of activation of the mechanisms can be described with a composite approach based on activation energy. The occurrence of grain coarsening is the major contributor to the cyclic softening response observed in OFHC copper. Conversely, the lesser extent of cyclic softening in the other two metals is likely due to the higher microstructure stability of the initial as-ARBed materials. The microstructure stability is believed to be the primary influencing factor for the extent of grain coarsening and cyclic softening. The applied cyclic plastic strain is a secondary influencing factor, although this is generally overshadowed by the limitation of grain coarsening due to the short cyclic lifespan of these metals. The occurrences of shear banding and grain coarsening reported in the present ARBed metals are similarly reported for UF grained metals from other processes, e.g. ECAPed metals. Thus, its relationship to the cyclic deformation response and governing factors are believed to be applicable for UF grained metals in general.
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Lin, Chih-Chen, and 林治溱. "Study on the Bonding Strength between Micro Arc Oxidation Treated 5052 Aluminum Alloy and PBT Polymer." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/99303982159093453550.
Full textAbstract:
碩士<br>國立交通大學<br>機械工程系所<br>101<br>Recently‚ electronic products featuring design elements of metal combined with plastic becoming more and more popular. Insert molding techniques for bonding between metal and plastic in early days were made by groove design or adhesive. In order to reduce costs and facilitate manufacturing processes‚ new adhesion technologies have been developed.
Past studies show that using surface treatment for modification of the metal surface would let metal surface become rough and porous‚which benefits to making resins interlocking on metal surface. Therefore‚ this kind of bonding technique has become a focus of current research.
This research uses two electrical surface-treated techniques, namely Micro Arc Oxidation（MAO）and Anodic Aluminum Oxidation（AAO） to treat Aluminum 5052. Influence of different forms of metal oxide thin film patterns on bonding strength between metal and PBT polymer are discussed.
The results showed that the highest porosity created by Micro Arc Oxidation is 20％‚ while Anodic Aluminum Oxidation porosity is 33％. In hot pressing experiments‚ MAO treated test pieces have shear bonding strength up to 4MPa‚ AAO test pieces are about 7Mpa. The Plastic/Metal bonding strength and surface porosity are positively related.
The experiment results in insert molding experiments showed that MAO pieces surface have larger pore size‚ thus higher bonding strength. MAO treated test pieces have bonding strength up to 8MPa‚ while AAO test pieces are about 13Mpa.
From the experiment results‚ the main factor which influences Plastic/Metal bonding strength is surface porosity. Improving the MAO specimen surface porosity can further enhance the bonding strength.
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Chen, Ching-yang, and 陳青揚. "A Micro-Mechanics Based Computational Model for Hygro-Thermo-Mechanical Analysis of Heterogeneous Adhesive Bonding Layer in Packaging Structures." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/56630876910358520423.
Full textAbstract:
博士<br>國立中正大學<br>機械工程所<br>94<br>The direct application of the conventional finite element method (FEM) to modeling of the particulate-reinforced and fiber-reinforced composites has limitations. The infinite element method (IEM) has been used in predicting the mechanical behaviors of heterogeneous materials, but so far is still not in maturity. In this thesis, a micro-mechanics based computational model for hygro-thermo-mechanical analysis of heterogeneous materials reinforced with arbitrarily distributed multiple particles is proposed. First, the infinite element method not only is enhanced by taking the temperature and moisture effects into account but also is extended to deal with three-dimensional elastostatic problems in which the constituent material properties are heterogeneous. Next, an innovative IEM application for studying material interface problems and a novel numerical technique, hybrid moisture element method (HMEM), for modeling and analyzing the moisture diffusion in heterogeneous epoxy resin filled with multiple randomly distributed particles are also both well presented. Finally, the IE-FE and HME-FE coupling scheme are addressed and their implementation are accomplished by employing the commercial software ABAQUS to greatly enhance the convenience and capability of our proposed methods. With the proposed approach, the execution time in the modeling stage, the number of DOFs, and PC memory storage were significantly reduced. A series of problems relating to the two-dimensional packaging structure containing heterogeneous adhesive bonding layer and three-dimensional particulate-reinforced composites are investigated. The proposed approach provides another simple and efficient numerical analysis tool for related problems of heterogeneous material, as demonstrated in the analysis result presented in this dissertation.
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"Bonding from Afar: The Effects of a Writing Micro-intervention on Perceived Child-Parent Connectedness and Personal Well-being." Master's thesis, 2018. http://hdl.handle.net/2286/R.I.49409.
Full textAbstract:
abstract: Previous studies about well-being have examined either gratitude’s or social connectedness’ relationship to subjective well-being. The aim of this randomized control trial was to examine the efficacy of a gratitude-based writing micro-intervention in enhancing felt social connectedness and well-being between young adults and their parents. The trial tested the impact of engaging in gratitude-based writing about family members or enhanced caretakers on measures of social connectedness and well-being between grown children and their parents. Data from a pool of social work students in the Southwest (N=148) were used. Results revealed within-subject effects and between subject effects for psychological well-being from pretest to one month follow-up, with the intervention group reporting significantly higher psychological well-being than the control group. Results also revealed slight mean differences from pretest to posttest for perceptions of family relationships, with the intervention group reporting approaching significant better perceptions of family relationships than the control group at posttest. Findings from the study indicate that engaging in gratitude-based writing about family can improve perceptions of psychological well-being and may improve social connectedness to family.<br>Dissertation/Thesis<br>Masters Thesis Social Work 2018
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SANGA, BHARAT. "SOME STUDIES ON ULTRASONIC JOINING OF THIN COPPER, ALUMINIUM AND PHOSPHOR BRONZE SHEETS." Thesis, 2022. http://dspace.dtu.ac.in:8080/jspui/handle/repository/19725.
Full textAbstract:
The quest to produce cost-effective, efficient, and ergonomically designed products demands
the use of assemblies fabricated with assorted materials. Because of the differences in their
physical, chemical, and metallurgical properties, joining dissimilar metals has been a difficult
task for the researchers. Ultrasonic metal welding has overcome some of these limitations due
to its unique characteristics. A number of diversified applications, ranging from small
components used in the electronics industry to aerospace and solar, are being fabricated by
Ultrasonic Spot Metal Welding (USMW). USMW uses vibrational energy to produce heat at
the interface of the faying surfaces. The sheets are subjected to combined normal and shear
loading with the help of sonotrode assembly. These combined loads disperse the oxides and
contaminants as well as remove the surface asperities so as to form pure metallic bonds in
cold conditions without filler metal, flux, or shielding gas. It’s an efficient, green process that
takes very little processing time. Since USMW is designed to join dissimilar metals/materials,
this study used both similar and dissimilar combinations of phosphor bronze (UNS C51100),
copper (UNS C10300), and aluminum (Al 3003).
It was observed through the available literature that there is a need for the optimization of the
process parameters along with the characterization of the weld joint in the case of USMW.
With these goals in mind, experiments were carried out in both 'Time Control Mode' and
'Energy Control Mode' using different experimental designs. The Analysis of Variance
(ANOVA) is utilized on the response parameters-tensile shear load and the weld area. Weld
pressure is observed as the most significant parameter, followed by weld time, and vibration
amplitude, in affecting the weld strength. A reasonably good correlation is observed between
the tensile shear load and the weld area between all the combinations of the weld metals. The
process parameters are optimized by coupling the regression model as a fitness function with
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the simulated annealing optimization algorithm. Finally, the confirmatory experimental
results substantiated the predicted results and validated the proposed methodology.
The modeling and simulation of the USMW process is carried out using FEM. The model is
utilized for the study and prediction of the thermal profiles at the weld interface. The heat
fluxes generated due to deformation and friction are calculated and assigned as boundary
conditions during thermal simulation. The forecast of temperature is done under various
welding conditions. The maximum temperature obtained by transient simulation at the weld
interface is 368.8℃, 369.4℃ and 296.1℃ for PB-PB, PB-Cu, and PB-Al, respectively. The
continuous reduction in the temperature is observed towards the extremes of the weld metal.
The sonotrode and the anvil achieve a lower temperature in comparison to the weld interface.
The effect of clamping force and bonding ratio on the interface temperature is observed to be
positive. The weld interface is distinguished as the weld zone, TMAZ and HAZ. The model is
validated with the maximum absolute errors within 5% for PB-PB joints, 6.26% for PB-Cu
joints, and 5.68% for PB-Al joints between the observed and predicted temperature results. A
correlation coefficient of 0.96, 0.87, and 0.86 is established between the simulated
temperature result and the weld strength for PB-PB, PB-Cu, and PB-Al, respectively. Thus, it
is clear that the interface temperature has a strong linear relationship with joint strength and is
a major deciding factor for achieving strong joints.
The effect of the weld energy on interface temperature and weld strength is also explored. It
is observed that the values of peak interface temperature and tensile-shear strength increase
with the welding energy. The failure mode changes from interfacial to nugget pull-out at a
considerably high energy level during the tensile-shear load test. There is a significant rise in
the tensile-shear load initially, but a negligible change is observed in the last stage. The
scanning electron microscopy (SEM) revealed that the joining line appears almost straight at
a low energy level but fades away at a higher energy level. The bonding region ultimately
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acquires the shape of a wavy, convoluted interface. Micro-bonding accompanied by
interlocking is observed as the primary joining mechanism at high energy level. Hence, it can
be concluded that joint strength in USMW was the combined result of the formation of
micro-bonds and mechanical interlocking due to the swirling of metal at the interface.
The observations and the results of the current study reflect that different combinations of
PB, Cu, and Al give very good responses to the ultrasonic spot metal welding in the given
ranges of the parameters. Hence, this joining technique can be effectively used for the
fabrication of thin components made of these metals. This study can provide useful inputs for
the industries involved in the manufacturing of battery electrical vehicles, solar panels, small
electrical and electronic products like relays, contacts, and heat sinks etc.
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Wang, Chang Ming, and 王章銘. "Investigation of Thermosonic Wire Bonding of Electronic Packaging for Chips with Copper Interconnect from the view point of Micro-Interfacial Phenomena." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/43950073494345805669.
Full textAbstract:
碩士<br>國立中正大學<br>機械系<br>90<br>The requirements for improved performance and reduced size have driven Copper to replace Aluminum interconnection for deep submicron integrated circuit. Copper has been identified as the best candidate to replace Aluminum due to its low resistivity, high electromigration resistance and likely lower processing cost. Thermosonic bonding of gold wire is the most popular joining technique in microelectronic packaging became of its advantages of high yield rate, fine pitch and easy for automatic operation. However, due to the material properties of Copper, thermosonic bonding on Cu Chip presents a major challenge for the electronic packaging industry.
This study used a microcontact approach to develop the thermosonic bonding technique for Cu Chips. Incorporating with the bonding parameter testing, the interfacial microcontact model had been developed, based on the interfacial energy model to identify the weldable range and elucidate the wire bonding phenomena. In order to improve the bonding quality for Cu Chip, this work presented three methods to overcome the bonding difficulty. These were inertia gas method, copper oxides growth method and titanium barrier layer method respectively. The bonding quality is based on the bonding strength and the circuit electric resistance. This study combines the analysis of microcontact theory and experiment results to determine optimal bonding parameter range by using the energy saturation theory. It also provides physical interpretation of thermosonic bonding of Cu pad from the viewpoint of interfacial micro contact phenomenon. This study constitutes a breakthrough in the wire bonding process for Cu Chip.
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Karingula, Varun Kumar. "MANUFACTURING PROCESS OF NANOFLUIDICS USING AFM PROBE." Thesis, 2015. http://hdl.handle.net/1805/7917.
Full textAbstract:
Indiana University-Purdue University Indianapolis (IUPUI)<br>A new process for fabricating a nano
fluidic device that can be used in medical
application is developed and demonstrated. Nano channels are fabricated using a
nano tip in indentation mode on AFM (Atomic Force Microscopy). The nano channels
are integrated between the micro channels and act as a filter to separate biomolecules.
Nano channels of 4 to7 m in length, 80nm in width, and at varying depths from 100nm
to 850 nm allow the resulting device to separate selected groups of lysosomes and
other viruses. Sharply developed vertical micro channels are produced from a deep
reaction ion etching followed by deposition of different materials, such as gold and
polymers, on the top surface, allowing the study of alternative ways of manufacturing
a nano fluidic device. PDMS (Polydimethylsiloxane) bonding is performed to close
the top surface of the device. An experimental setup is used to test and validate the
device by pouring fluid through the channels. A detailed cost evaluation is conducted
to compare the economical merits of the proposed process. It is shown that there is
a 47:7% manufacturing time savings and a 60:6% manufacturing cost savings.
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Li, Jun-jie, and 李俊潔. "Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/09694242990833044733.
Full textAbstract:
碩士<br>國立中山大學<br>機械與機電工程學系研究所<br>101<br>Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous stringent environmental conditions have been established for low-temperature processes. This has increased costs and created additional processing steps. Recently, researchers have proposed a couples-polishing activation-bonding (CAB) process. This process involves using ultrasonic vibration technology to induce interfacial friction, thereby increasing temperatures at the interface. Subsequently, atomic diffusion leaving copper contacts generate engagement. This process can be performed at room temperature.
In this study, the finite-element method was used to establish a micro-copper block ultrasonic-vibration-bonding 3D simulation model. In addition, the effects of various ultrasonic-vibration frequencies on the stress, strain, and temperature fields of the interface were explored, and the effects of the coefficients of friction and amplitude on interface strain were analyzed.
The simulation results showed that at 50 kHz, the bonding process was successful after 1500 μs. The equivalent stress could be divided into stress upward, stress downward, and stress stabilization phases. Based on the results, it may be suggested that ultrasound-vibration frequencies affect energy transfer rates. The results obtained at 50 kHz showed that the outermost strain was less than 23% of the center strain.
By increasing the frequency, a critical frequency was determined regarding the period necessary to obtain a steady stress rate.
Finally, when the friction coefficient and amplitude were changed, at a fixed frequency, the coefficient of friction rose from 0.1 to 0.15, which was a larger increase in strain than 0.15 to 0.2. Regarding amplitude changes, when the frequency was low, the amplitude exhibited an increased effect on the maximum equivalent strain.
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Tu, Wei, and 杜威. "Evolution of Intermetallic Compounds, Phase Transformation and the Interfacial Reaction Modified by the Bonding Order of the Under Bump Metallization in Cu/Sn-Ag/Ni Micro-bump." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/rvr289.
Full textAbstract:
碩士<br>國立清華大學<br>材料科學工程學系<br>105<br>With the highly demand for the miniaturization of large-scale-integration of circuits on Si chips, the electronic packaging technology has been evolved from conventional flip-chip bumps to small micro-bumps. Dramatically reduction of soldering volume results in a great concern of packaging reliability. Furthermore, in micro-bumps, not only the characteristics of interfacial reaction will be a main concern but also more limitation in fabrication process. As a result, architecture control through process modification to alter the microstructure of micro-bumps was demonstrated to affect the interfacial reaction in micro-bumps. Meanwhile, the understanding of interfacial reaction in micro-bumps is a potential way to solve the critical issues in this small solder volume system. In this study, two steps of boing process were investigated. One with ENIG substrate bonded ahead of the Cu substrate, the other with OSP-Cu substrate bonded ahead of the Ni substrate.
By bonding the ENIG substrate ahead of the Cu substrate, the microstructure evolution of ENIG/Sn-3.5Ag/Cu micro-bumps after reflow was studied. Due to the short diffusion path between two opposite substrates, the effects of substrate dissolution by two-steps reflowing process in ENIG/Sn-3.5Ag/Cu micro-bumps revealed a complex 5 layered structure. After 30 sec of reflow, only ENIG side has a dual phase structure composed of H-(Cu,Ni)6Sn5 and (Ni,Cu)3Sn4. After longer reflow time, it is interesting to note that dual phase structure appeared at both Cu and ENIG sides. H-(Cu,Ni)6Sn5 and L-(Cu,Ni)6Sn5 showed up at the Cu side, meanwhile, H-(Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 were at the ENIG side after reflow for 5 min. The dual phase structures are believed to be vulnerable to cracks and lead to degradation of micro-bumps’ reliabilities.
In contrast, by bonding the OSP-Cu substrate ahead of the Ni substrate, the microstructure evolution of OSP-Cu/Sn-3.5Ag/Ni micro-bumps after reflow was also studied. It is noted that the microstructure of IMCs on both interface of the substrates showed a significant difference as only one phase was found, which was L-(Cu,Ni)6Sn5. Also, the deteriorative dual phase structures found in ENIG/Sn-3.5Ag/Cu micro-bumps were no longer shown in OSP Cu/Sn-3.5Ag/Ni micro-bumps. With the aid of the field emission electron probe micro-analyzer (FE-EPMA), the mechanisms of the microstructural evolution are probed in detail by the phase diagram and the diffusion related migration of the constituents. It is expected that the results derived in this study can provide useful information for the industry of microelectronic packaging.