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Dissertations / Theses on the topic 'MICRO-BONDING'

Author: Grafiati

Published: 11 September 2023

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1

Kay, Robert William. "Novel micro-engineered stencils for flip-chip bonding and wafer level packaging." Thesis, Heriot-Watt University, 2008. http://hdl.handle.net/10399/2193.

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2

Andersson, Martin. "Ag-In transient liquid phase bonding for high temperature stainless steel micro actuators." Thesis, Uppsala universitet, Mikrosystemteknik, 2013. http://urn.kb.se/resolve?urn=urn:nbn:se:uu:diva-207559.

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A stainless steel, high temperature, phase change micro actuator has been demonstrated using the solid-liquid phase transition of mannitol at 168°C and In-Ag transient liquid phase diffusion bonding. Joints created with this bonding technique can sustain temperatures up to 695°C, while being bonded at only 180°C, and have thicknesses between 1.4 to 6.0 μm. Physical vapour deposition, inkjet printing and electroplating have been evaluated as deposition methods for bond layers. For actuation, cavities were filled with mannitol and when heated, the expansion was used to deflect a 10 μm thick stai

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3

Ahmad, Zakiah. "Nano-and micro-particle filled epoxy-based adhesives for in-situ timber bonding." Thesis, University of Bath, 2008. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.478940.

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4

Lu, Chunmeng. "Development of novel micro-embossing methods and microfluidic designs for biomedical applications." Columbus, Ohio : Ohio State University, 2006. http://rave.ohiolink.edu/etdc/view?acc%5Fnum=osu1156820643.

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5

Leal, Ayala Angel Andres. "Effect of intermolecular hydrogen bonding on the micro-mechanical properties of high performance organic fibers." Access to citation, abstract and download form provided by ProQuest Information and Learning Company; downloadable PDF file, 307 p, 2008. http://proquest.umi.com/pqdweb?did=1597616621&sid=11&Fmt=2&clientId=8331&RQT=309&VName=PQD.

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6

Struble, John D. "Micro-scale planar and two-dimensional modeling of two phase composites with imperfect bonding between matrix and inclusion." Thesis, Georgia Institute of Technology, 2002. http://hdl.handle.net/1853/17345.

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7

Yang, Keqin. "Inter-tube bonding and defects in carbon nanotubes and the impact on the transport properties and micro-morphology." Connect to this title online, 2009. http://etd.lib.clemson.edu/documents/1263408693/.

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8

Dutto, Mathieu. "Procédé micro-ondes pour l’élaboration de composites B4C-SiC par infiltration et réaction de silicium, en vue d’applications balistiques." Thesis, Lyon, 2017. http://www.theses.fr/2017LYSEM021/document.

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De nombreuses études ont montré la faisabilité de la fabrication de pièces composites en carbure de bore et de silicium par l’infiltration de silicium fondu dans une préforme poreuse en carbure de bore (Reaction bonding). Cette méthode permet l’obtention d'un composite fortement chargé en carbure de bore (phase qui nous intéresse pour les applications balistiques), sans pour autant avoir besoin de monter à des températures de frittage de plus de 2200°C (température habituellement utilisée pour fritter le B4C). Dans notre cas la température maximale est comprise entre 1400-1600°C. Cette thèse s

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Allenet, Timothée. "Réalisation d'un micro-capteur optofluidique pour la mesure déportée de radionucléides." Thesis, Université Grenoble Alpes (ComUE), 2018. http://www.theses.fr/2018GREAT041/document.

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L’exploitation de l’énergie nucléaire pour la production d’électricité présente un défi de gestion des e˜uents radiotoxiques pour les générations présentes et futures. Face à ce constat, la communauté des chimistes recherche continument à améliorer les solutions de traitement et de recyclage du combustible usé. Dans le contrôle de ces procédés, les opérations d’analyse jouent un rôle primordial. La miniaturisation des procédés est un des enjeux principaux de la recherche en sûreté nucléaire, dans un e˙ort de réduction des risques, des délais et des coûts des activités de laboratoire. Dans ce c

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10

Samel, Björn. "Novel Microfluidic Devices Based on a Thermally Responsive PDMS Composite." Doctoral thesis, KTH, Mikrosystemteknik, 2007. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-4470.

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The field of micro total analysis systems (μTAS) aims at developments toward miniaturized and fully integrated lab-on-a-chip systems for applications, such as drug screening, drug delivery, cellular assays, protein analysis, genomic analysis and handheld point-of-care diagnostics. Such systems offer to dramatically reduce liquid sample and reagent quantities, increase sensitivity as well as speed of analysis and facilitate portable systems via the integration of components such as pumps, valves, mixers, separation units, reactors and detectors. Precise microfluidic control for such systems has

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11

Musaramthota, Vishal. "Prediction of Fracture Toughness and Durability of Adhesively Bonded Composite Joints with Undesirable Bonding Conditions." FIU Digital Commons, 2015. http://digitalcommons.fiu.edu/etd/2513.

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Advanced composite materials have enabled the conventional aircraft structures to reduce weight, improve fuel efficiency and offer superior mechanical properties. In the past, materials such as aluminum, steel or titanium have been used to manufacture aircraft structures for support of heavy loads. Within the last decade or so, demand for advanced composite materials have been emerging that offer significant advantages over the traditional metallic materials. Of particular interest in the recent years, there has been an upsurge in scientific significance in the usage of adhesively bonded compo

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12

Artvin, Zafer. "Fabrication Of Nanostructured Samples For The Investigation Of Near Field Radiation Transfer." Master's thesis, METU, 2012. http://etd.lib.metu.edu.tr/upload/12614826/index.pdf.

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Radiative heat transfer in nanostructures with sub-wavelength dimensions can exceed that predicted by Planck&#039<br>s blackbody distribution. This increased effect is due to the tunneling of infrared radiation between nanogaps, and can allow the eventual development of nano-thermo-photo-voltaic (Nano-TPV) cells for energy generation from low temperature heat sources. Although near field radiation effects have been discussed for many years, experimental verification of these effects is very limited so far. In this study, silica coated silicon wafer sample chips have been manufactured by using

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13

Bellaredj, Mohamed Lamine Fayçal. "Méthodes et outils pour la fabrication de transducteurs ultrasonores en silicium." Phd thesis, Université de Franche-Comté, 2013. http://tel.archives-ouvertes.fr/tel-00937560.

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L'utilisation des ultrasons pour l'imagerie présente plusieurs avantages : elle est extrêmement sure car ellen'utilise pas de radiations ionisantes et ne présente pas d'effets néfastes sur la santé. D'autre part, elle donne desrésultats d'excellente qualité avec un coût relativement faible. Historiquement, les matériaux piézoélectriques et leurscomposites ont été très tôt utilisés pour la génération d'ultrasons. Les transducteurs fabriqués à partir de ces matériauxdominent actuellement le marché des sondes ultrasonores. Cependant, pour certaines applications, ils ne peuvent pasêtre utilisés po

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14

Cummins, Gerard Pio. "Fabrication of microchannels for use in micro-boiling experiments." Thesis, University of Edinburgh, 2011. http://hdl.handle.net/1842/5035.

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Increased power densities in VLSI chips have led to a need to develop cooling methods that can cope with the increased heat produced by such chips. Currently one of the more attractive methods to meet this goal is through the use of two phase flow of a fluid as changing phase of the material allows high heat transfer rates for a low temperature change. To bring this technology to commercialisation a greater understanding of the underlying physics involved at the microscale is required as there is much debate within literature as to what occurs during two phase flow heat transfer at these scale

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15

Joesbury, Adam Michael. "New approaches to composite metal joining." Thesis, Cranfield University, 2015. http://dspace.lib.cranfield.ac.uk/handle/1826/10009.

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This thesis explores new methods for achieving load-carrying joints between the dissimilar materials of continuous fibre reinforced polymer matrix composites and structural metals. The new composite-to-metal joining methods investigated in this work exploit the metal-to-metal joining techniques of arc micro-welding, resistance spot welding, and metal filler brazing, to form novel micro-architectured metal adherends that can be used for enhanced composite-to-metal joining. Through a combination of equipment instrumentation and metallographic inspection of fabricated prototype joints, understand

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Thammajaruk, Putsadeeporn. "Influence of Ceramic Coating Pre-treatment Techniques on Bonding of Zirconia to Composite Cements." Thesis, The University of Sydney, 2018. http://hdl.handle.net/2123/19628.

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Zirconia is a ceramic widely used in dentistry as an indirect restorative material. In contrary to glass-ceramics, zirconia does not contain amorphous silica glass in its composition thus conventional bonding based on hydrofluoric acid etching followed by silane application is ineffective. The inability to etch and chemically treat the fitting surface of zirconia restoration is seen as a limiting factor for bonding composite cements to zirconia, particularly, in those clinical situations where achieving resistance and retention form of the abutments teeth is challenging. Objectives: The aims o

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17

Liang, Hai-chiung, and 梁海瓊. "Micro-push-out bond strength and the modes of failure for a fibre-reinforced resin-post system cemented using three adhesive lutingcements after cyclic loading." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2010. http://hub.hku.hk/bib/B45591106.

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18

Pekárek, Jan. "Katodové nanostruktury v MEMS aplikacích." Master's thesis, Vysoké učení technické v Brně. Fakulta elektrotechniky a komunikačních technologií, 2008. http://www.nusl.cz/ntk/nusl-217244.

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The main goal of this work is to introduce new carbon structures - carbon nanotubes. The main objective of this work is to take advantage of the unique characteristic of carbon nanotubes to emit electrons at very low supply voltage.

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19

Mahindre, Prajakta Prakash. "Micro-push-out bond strength and the modes of failure for a fiber-reinforced resin-post system cemented using four adhesive luting cements." Click to view the E-thesis via HKUTO, 2009. http://sunzi.lib.hku.hk/hkuto/record/B43224052.

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20

Singh, John-Luke Benjamin. "Design and Fabrication of Micro-Channels and Numerical Analysis of Droplet Motion Near Microfluidic Return Bends." Thesis, North Dakota State University, 2019. https://hdl.handle.net/10365/31706.

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Three-dimensional spheroid arrays represent in vivo activity better than conventional 2D cell culturing. A high-throughput microfluidic chip may be capable of depositing cells into spheroid arrays, but it is difficult to regulate the path of individual cells for deposition. Droplets that encapsulate cells may aid in facilitating cell delivery and deposition in the return bend of a microfluidic chip. In this study, a low-cost method for fabricating polymer-cast microfluidic chips has been developed for rapid device prototyping. Computational fluid dynamic (CFD) simulations were conducted to qua

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21

Fischer, Andreas C. "Integration and Fabrication Techniques for 3D Micro- and Nanodevices." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2012. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-107125.

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The development of micro and nano-electromechanical systems (MEMS and NEMS) with entirely new or improved functionalities is typically based on novel or improved designs, materials and fabrication methods. However, today’s micro- and nano-fabrication is restrained by manufacturing paradigms that have been established by the integrated circuit (IC) industry over the past few decades. The exclusive use of IC manufacturing technologies leads to limited material choices, limited design flexibility and consequently to sub-optimal MEMS and NEMS devices. The work presented in this thesis breaks new g

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22

Baum, Mario. "Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen." Doctoral thesis, Universitätsbibliothek Chemnitz, 2016. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-161996.

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Die vorliegende Arbeit beschreibt die Übertragung der aus der Siliziumtechnologie bekannten Präzision der Strukturierung und die Zuverlässigkeit der Verbindungstechnologie auf andere Materialien wie Kupfer und PMMA. Diese Untersuchung ist auf die Entwicklung der Teiltechnologien Strukturierung und Integration fokussiert und konzentriert sich insbesondere auf die Kombination von Mikrostrukturierung und dreidimensionalen Aufbautechniken einschließlich vertikaler fluidischer Durchkontaktierungen bei den Materialien Silizium, Kupfer und Kunststoff (PMMA). Eine begleitende Charakterisierung und mes

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23

Mahindre, Prajakta Prakash. "Micro-push-out bond strength and the modes of failure for a fiber-reinforced resin-post system cemented using four adhesive lutingcements." Thesis, The University of Hong Kong (Pokfulam, Hong Kong), 2009. http://hub.hku.hk/bib/B43224052.

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24

Agarwal, Rahul. "A novel normal-to-plane space efficient micro corner cube retroreflector with improved fill factor." [Tampa, Fla.] : University of South Florida, 2003. http://purl.fcla.edu/fcla/etd/SFE0000629.

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25

Bleiker, Simon J. "Heterogeneous 3D Integration and Packaging Technologies for Nano-Electromechanical Systems." Doctoral thesis, KTH, Mikro- och nanosystemteknik, 2017. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-207185.

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Three-dimensional (3D) integration of micro- and nano-electromechanical systems (MEMS/NEMS) with integrated circuits (ICs) is an emerging technology that offers great advantages over conventional state-of-the-art microelectronics. MEMS and NEMS are most commonly employed as sensor and actuator components that enable a vast array of functionalities typically not attainable by conventional ICs. 3D integration of NEMS and ICs also contributes to more compact device footprints, improves device performance, and lowers the power consumption. Therefore, 3D integration of NEMS and ICs has been propose

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26

Schelcher, Guillaume. "Le transfert de films : vers une intégration hétérogène des micro et nanosystèmes." Phd thesis, Université Paris Sud - Paris XI, 2012. http://tel.archives-ouvertes.fr/tel-00755977.

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Une technologie d'élaboration de micro et nanosystèmes idéale devrait permettre l'intégration de différents matériaux (magnétiques, piézoélectriques, polymères, etc.) ou structures (composants optiques, mécaniques, optoélectroniques, etc.) de nature fortement hétérogène dans le but d'obtenir des systèmes multifonctionnels complexes éventuellement encapsulés. Un moyen de contourner les différents problèmes d'incompatibilité, liés aux mélanges des technologies de fabrication, est de transférer les différents films de matériaux ou composants d'un substrat donneur, sur lequel ils ont été préalable

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27

Hofmann, Lutz. "3D-Wafer Level Packaging approaches for MEMS by using Cu-based High Aspect Ratio Through Silicon Vias." Doctoral thesis, Universitätsbibliothek Chemnitz, 2017. http://nbn-resolving.de/urn:nbn:de:bsz:ch1-qucosa-231412.

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For mobile electronics such as Smartphones, Smartcards or wearable devices there is a trend towards an increasing functionality as well as miniaturisation. In this development Micro Electro- Mechanical Systems (MEMS) are an important key element for the realisation of functions such as motion detection. The specifications given by such devices together with the limited available space demand advanced packaging technologies. The 3D-Wafer Level Packaging (3D-WLP) enables one solution for a miniaturised MEMS package by using techniques such as Wafer Level Bonding (WLB) and Through Silicon Vias (T

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Baum, Mario. "Strukturierungs- und Aufbautechnologien von 3-dimensional integrierten fluidischen Mikrosystemen." Doctoral thesis, Universitätsverlag der Technischen Universität Chemnitz, 2014. https://monarch.qucosa.de/id/qucosa%3A20212.

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Die vorliegende Arbeit beschreibt die Übertragung der aus der Siliziumtechnologie bekannten Präzision der Strukturierung und die Zuverlässigkeit der Verbindungstechnologie auf andere Materialien wie Kupfer und PMMA. Diese Untersuchung ist auf die Entwicklung der Teiltechnologien Strukturierung und Integration fokussiert und konzentriert sich insbesondere auf die Kombination von Mikrostrukturierung und dreidimensionalen Aufbautechniken einschließlich vertikaler fluidischer Durchkontaktierungen bei den Materialien Silizium, Kupfer und Kunststoff (PMMA). Eine begleitende Charakterisierung und mes

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29

Senate, University of Arizona Faculty. "Faculty Senate Minutes January 22, 2018." University of Arizona Faculty Senate (Tucson, AZ), 2018. http://hdl.handle.net/10150/626508.

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30

Alexander, Dale. "Laser driven micro-explosive bonding." 1986. http://catalog.hathitrust.org/api/volumes/oclc/68787458.html.

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31

Liu, Hsung-Pen, and 劉祥本. "Brazing Diffusion Bonding of Micro Fiber Spinnerets." Thesis, 1998. http://ndltd.ncl.edu.tw/handle/51746706231117767875.

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碩士<br>淡江大學<br>機械工程學系<br>86<br>Because of the need of the micro fiber spinnerets in domestic market, this research conducted an experiment of the brazing diffusion bonding of nickel cylinder and the JIS SUS 316 stainless steel hole. Using filler metal BNi-3 with the same bonding clearance 0.05 mm and under two bonding temperature 1000℃ and 1050℃, we study the varieties of microstructure, the diffusion situation of the component and the strength test to the bonding interface. 　　By the experiment result, we can always bond nickel cylinder with stainless steel hole successfully under the two temp

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32

Tsai, Chi-Yang, and 蔡奇洋. "Micro Vibrating Ring Gyroscope Fabricated with Fusion Bonding." Thesis, 2003. http://ndltd.ncl.edu.tw/handle/96882589889542767171.

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Tsai, Gweo-cherng, and 蔡虢城. "Fabrication of micro deformable focusing mirror by bonding method." Thesis, 2007. http://ndltd.ncl.edu.tw/handle/95456418406644345409.

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碩士<br>逢甲大學<br>機械工程學所<br>95<br>Micro-optical-electromechanical system, aiming at optical applications in MEMS, uses deformable mirrors to conduct adaptive optics devices and to change the focal length of the mirror. This thesis designed and fabricated micro deformable focusing mirror by bonding method. The novel micro deformable focusing mirror was actuated with electrostatics to adjust the focal length. In analysis, plate and shell theories are used to obtain the relations among deformation and electrostatic force. In fabrication, use the bulk-micromachining to produce upper and lower electrod

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Wu, Yi-Ting, and 吳奕霆. "Fabrication and Analysis of Electrostatically Driven Micro Deformable Mirror by Bonding Method." Thesis, 2010. http://ndltd.ncl.edu.tw/handle/12871453419588256175.

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碩士<br>逢甲大學<br>機械工程學所<br>98<br>An electro-statically actuated Micro-optical-electromechanical systems (MOEMS) device is designed in this thesis by bulk micromachining. This MEMOS device with deformable mirror can change mirror’s profile to focus light by applying voltage. To investigate the performance of the deformable mirror, numerical analysis is using as analytic method. And the device is made by MEMS fabrication process. In the simulation, a multiphysical coupling software COMSOL by finite element method is used. Several mirror shapes are analyzed to obtained the relationship between mirro

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Chang, Shyh-Ming, and 張世明. "Study of Processing Parameters Effect on the Reli- ability of Micro-bump Bonding." Thesis, 1993. http://ndltd.ncl.edu.tw/handle/85629765706142355637.

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36

Yeh, Ren-Yu, and 葉人瑜. "Influence of Micro-mechanical Interlocking on Bonding Strength of Plastic/Metal Direct Adhesion." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/44437022855560275719.

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博士<br>國立交通大學<br>機械工程系所<br>104<br>Every material has its unique material properties, which can bring benefits or shortcomings. As advances of technologies, use of only one particular material very often cannot meet the demand of products. Thus, joining of dissimilar materials, especially between metal and plastic, has become a key issue in many industries. Industrial joining of dissimilar materials is generally performed by using adhesive bonds. Nevertheless the usage of adhesives is not environmentally friendly and takes long curing time. Several direct adhesion technologies have been develope

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37

Shih, Yen-Lin, and 施延霖. "Flip-Chip Bonding for 960 X 540 GaN-Based Micro Light Emitting Diode Array." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/00060283680124626493.

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碩士<br>國立清華大學<br>電子工程研究所<br>104<br>Recently, Flip-chip bonding plays an important role in bonding industries. Rather than traditional wire bonding, flip-chip bonding have many merits including high I/O, smaller size, shorter electrical path and better heat dissipation. Thus, many optoelectronics devices are asked for combination with this technique. The purpose of this research is to develop micro light emitting diode array applying flip-chip technique and aim for finding out the best parameter for flip-chip bonding. Besides, it is hoped to let all pixels lightened, increase yield and achieve w

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Su, Yu-Heng, and 蘇裕恒. "Flip-Chip Bonding Testing and Applying for 960*540 Micro Light Emitting Diode Array." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/sqtfv8.

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Chung, Cheng Shan, and 鍾承珊. "Flip-Chip bonding for 64 × 64 Matrix-Addressable GaN-Based Micro-Light-Emitting Diodes Array." Thesis, 2015. http://ndltd.ncl.edu.tw/handle/c9pg85.

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碩士<br>國立清華大學<br>電子工程研究所<br>103<br>Recently, the micro-light-emitting diode has become a potential commercial device, which is integrated with functional module for widely applications, such as micro-display, micro-projector, mask-free photolithography, and optogenetics. In this research, a monolithic 450 nm GaN-based 64 × 64 micro-light-emitting diode arrays (μLEDA) with flip-chip bonding is demonstrated. To realize a high-quality μLEDA, this research has to deal with issues raised by area shrinkage and arrayed emitters. Area shrinkage results in increased series resistance and enhanced perime

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Sood, Varun. "An experimental study on thermal bonding effects of PMMA based micro-devices using hot embossing." 2007. http://hdl.handle.net/10106/899.

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Liu, Yu-Ting, and 劉育廷. "Fabrication and Characterization of CMOS Micro-Fluxgate with Wire-Bonding and Flip-Chip Post Process." Thesis, 2011. http://ndltd.ncl.edu.tw/handle/dkvq9v.

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碩士<br>國立臺北科技大學<br>機電整合研究所<br>99<br>This paper presents a dual-core (Vacquier-type) micro-fluxgate magnetic sensor fabricated on a silicon chip based on standard CMOS technology. The 3D design with both excitation and sensing coils winding the cores can achieve a higher responsivity and a lower noise level, but the cost in mass production would be much higher in comparison with planar design. The silicon chip is 2.5 mm 2.5 mm in dimension, and the micro-fluxgate sensor occupies the area of 2.5 mm 1.8 mm. The sensor consists of magnetic cores, planar pick-up coils, bottom excitation coils (CMOS

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Kwan, Charles. "Cyclic Deformation Behaviour and the Related Micro-mechanisms of F.C.C. Metals Processed by Accumulative Roll-bonding." Thesis, 2011. http://hdl.handle.net/1807/31810.

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The improvement in mechanical strength offered by ultra fine- (UF) and nanocrystalline (NC) sized grains is very attractive for potential applications of structural metals. Accumulative Roll-Bonding (ARB) is one of the promising new techniques for producing bulk UF grained metals. There are numerous reports on the monotonic mechanical behavior of various ARBed metals, however there are few, if any, on the cyclic deformation behavior of such metals. The primary objective of this study is to investigate the cyclic deformation behaviour and the related micro-mechanisms of ARBed metals from a fund

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Lin, Chih-Chen, and 林治溱. "Study on the Bonding Strength between Micro Arc Oxidation Treated 5052 Aluminum Alloy and PBT Polymer." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/99303982159093453550.

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碩士<br>國立交通大學<br>機械工程系所<br>101<br>Recently‚ electronic products featuring design elements of metal combined with plastic becoming more and more popular. Insert molding techniques for bonding between metal and plastic in early days were made by groove design or adhesive. In order to reduce costs and facilitate manufacturing processes‚ new adhesion technologies have been developed. Past studies show that using surface treatment for modification of the metal surface would let metal surface become rough and porous‚which benefits to making resins interlocking on metal surface. Therefore‚ this kind

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Chen, Ching-yang, and 陳青揚. "A Micro-Mechanics Based Computational Model for Hygro-Thermo-Mechanical Analysis of Heterogeneous Adhesive Bonding Layer in Packaging Structures." Thesis, 2006. http://ndltd.ncl.edu.tw/handle/56630876910358520423.

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博士<br>國立中正大學<br>機械工程所<br>94<br>The direct application of the conventional finite element method (FEM) to modeling of the particulate-reinforced and fiber-reinforced composites has limitations. The infinite element method (IEM) has been used in predicting the mechanical behaviors of heterogeneous materials, but so far is still not in maturity. In this thesis, a micro-mechanics based computational model for hygro-thermo-mechanical analysis of heterogeneous materials reinforced with arbitrarily distributed multiple particles is proposed. First, the infinite element method not only is enhanced by

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"Bonding from Afar: The Effects of a Writing Micro-intervention on Perceived Child-Parent Connectedness and Personal Well-being." Master's thesis, 2018. http://hdl.handle.net/2286/R.I.49409.

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abstract: Previous studies about well-being have examined either gratitude’s or social connectedness’ relationship to subjective well-being. The aim of this randomized control trial was to examine the efficacy of a gratitude-based writing micro-intervention in enhancing felt social connectedness and well-being between young adults and their parents. The trial tested the impact of engaging in gratitude-based writing about family members or enhanced caretakers on measures of social connectedness and well-being between grown children and their parents. Data from a pool of social work students in

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SANGA, BHARAT. "SOME STUDIES ON ULTRASONIC JOINING OF THIN COPPER, ALUMINIUM AND PHOSPHOR BRONZE SHEETS." Thesis, 2022. http://dspace.dtu.ac.in:8080/jspui/handle/repository/19725.

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The quest to produce cost-effective, efficient, and ergonomically designed products demands the use of assemblies fabricated with assorted materials. Because of the differences in their physical, chemical, and metallurgical properties, joining dissimilar metals has been a difficult task for the researchers. Ultrasonic metal welding has overcome some of these limitations due to its unique characteristics. A number of diversified applications, ranging from small components used in the electronics industry to aerospace and solar, are being fabricated by Ultrasonic Spot Metal Welding (

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Wang, Chang Ming, and 王章銘. "Investigation of Thermosonic Wire Bonding of Electronic Packaging for Chips with Copper Interconnect from the view point of Micro-Interfacial Phenomena." Thesis, 2002. http://ndltd.ncl.edu.tw/handle/43950073494345805669.

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碩士<br>國立中正大學<br>機械系<br>90<br>The requirements for improved performance and reduced size have driven Copper to replace Aluminum interconnection for deep submicron integrated circuit. Copper has been identified as the best candidate to replace Aluminum due to its low resistivity, high electromigration resistance and likely lower processing cost. Thermosonic bonding of gold wire is the most popular joining technique in microelectronic packaging became of its advantages of high yield rate, fine pitch and easy for automatic operation. However, due to the material properties of Copper, thermosonic b

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Karingula, Varun Kumar. "MANUFACTURING PROCESS OF NANOFLUIDICS USING AFM PROBE." Thesis, 2015. http://hdl.handle.net/1805/7917.

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Indiana University-Purdue University Indianapolis (IUPUI)<br>A new process for fabricating a nano fluidic device that can be used in medical application is developed and demonstrated. Nano channels are fabricated using a nano tip in indentation mode on AFM (Atomic Force Microscopy). The nano channels are integrated between the micro channels and act as a filter to separate biomolecules. Nano channels of 4 to7 m in length, 80nm in width, and at varying depths from 100nm to 850 nm allow the resulting device to separate selected groups of lysosomes and other viruses. Sharply developed vert

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Li, Jun-jie, and 李俊潔. "Effects of Ultrasonic Frequency Variation on the Micro Copper Bumps Friction Phenomena in the Couples-polishing Activation Bonding Process of 3D IC Package." Thesis, 2013. http://ndltd.ncl.edu.tw/handle/09694242990833044733.

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碩士<br>國立中山大學<br>機械與機電工程學系研究所<br>101<br>Since the development of high-density integrated circuits (ICs), numerous studies have used 3D IC bonding technology to reduce processing temperatures and increase reliability. However, numerous stringent environmental conditions have been established for low-temperature processes. This has increased costs and created additional processing steps. Recently, researchers have proposed a couples-polishing activation-bonding (CAB) process. This process involves using ultrasonic vibration technology to induce interfacial friction, thereby increasing temperature

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Tu, Wei, and 杜威. "Evolution of Intermetallic Compounds, Phase Transformation and the Interfacial Reaction Modified by the Bonding Order of the Under Bump Metallization in Cu/Sn-Ag/Ni Micro-bump." Thesis, 2016. http://ndltd.ncl.edu.tw/handle/rvr289.

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碩士<br>國立清華大學<br>材料科學工程學系<br>105<br>With the highly demand for the miniaturization of large-scale-integration of circuits on Si chips, the electronic packaging technology has been evolved from conventional flip-chip bumps to small micro-bumps. Dramatically reduction of soldering volume results in a great concern of packaging reliability. Furthermore, in micro-bumps, not only the characteristics of interfacial reaction will be a main concern but also more limitation in fabrication process. As a result, architecture control through process modification to alter the microstructure of micro-bumps w

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