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Journal articles on the topic 'Metal grain boundary diffusion'

Author: Grafiati

Published: 4 June 2021

Last updated: 9 February 2022

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1

Niu, Li Sha, and Ting Ting Dai. "Finite Element Study of the Creep Size-Effect in Thin Metal Films." Key Engineering Materials 353-358 (September 2007): 1858–62. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.1858.

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A 2-D Finite element simulation method was developed based on the kinetic law and the energy evolution during the whole process of deformation, which is used to investigate the creep size effects in polycrystalline thin metal film on substrates. Three diffusion paths (e.g. surface, grain boundary and lattice diffusion) are considered in the present model. The diffusion rate for these three processes was compared under different loading conditions with corresponding microstructure. It’s found that grain boundary diffusion is coupled with another diffusion channel. Creep size effects result from mass transferring in thin film. The model gave the quantitative results of the influences of the film thickness, grain size, and the constraints of the substrate on polycrystalline metal film diffusion. The simulated results present the evolution of the point defects in grain interior, the strain and stress field. The distribution of the crack-like stress in the grain boundary could explain the stress concentration mechanisms clearly and this also agrees with the literature results.

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2

Poletaev, G. M., I. V. Zorya, R. Yu Rakitin, and M. D. Starostenkov. "Effect of light elements impurity atoms on grain boundary diffusion in FCC metals: a molecular dynamics simulation." Izvestiya. Ferrous Metallurgy 62, no. 12 (January 15, 2020): 930–35. http://dx.doi.org/10.17073/0368-0797-2019-12-930-935.

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Effect of carbon and oxygen impurity atoms on diffusion along the tilt grain boundaries with <100> and <111> misorientation axis in metals with FCC lattice was studied by mean of molecular dynamics method. Ni, Ag, and Al were considered as metals. Interactions of metal atoms with each other were described by many-particle Clery-Rosato potentials constructed within the framework of tight binding model. To describe interactions of atoms of light elements impurities with metal atoms and atoms of impurities with each other, Morse pair potentials were used. According to obtained results, impurities in most cases lead to an increase in self-diffusion coefficient along the grain boundaries, which is caused by deformation of crystal lattice near the impurity atoms. Therefore, additional distortions and free volume are formed along the boundaries. It is more expressed for carbon impurities. Moreover, with an increase in concentration of carbon in the metal, an increase in coefficient of grain-boundary self-diffusion was observed first, and then a decrease followed. This behavior is explained by formation of aggregates of carbon atoms at grain boundary, which leads to partial blocking of the boundary. Oxygen atoms had smaller effect on diffusion along the grain boundaries, which is apparently explained by absence of a tendency to form aggregates and lesser deformation of crystal lattice around impurity. The greatest effect of impurities on self-diffusion along the grain boundaries among the examined metals was observed for nickel. Nickel has the smallest lattice parameter, impurity atoms deform its lattice around itself more than aluminum and silver, and therefore they create relatively more lattice distortions in it and additional free volume along the grain boundaries, which lead to an increase in diffusion permeability. Diffusion coefficients along the high-angle boundaries with misorientation angle of 30° turned out to be approximately two times higher than along low-angle boundaries with a misorientation angle of 7°. Diffusion along the <100> grain boundaries flowed more intensively than along the <111> boundaries.

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3

Farzin, Mahmoud, Reza Jafari Nedoushan, and Mohammad Mashayekhi. "Simulation of Hot Sheet Metal Forming Processes Based on a Micro-Structural Constitutive Model." Key Engineering Materials 473 (March 2011): 556–63. http://dx.doi.org/10.4028/www.scientific.net/kem.473.556.

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A constitutive model is proposed for simulations of hot forming processes. Dominant mechanisms in hot forming including inter-granular deformation, grain boundary sliding and grain boundary diffusion are considered in the constitutive model. A Taylor type polycrystalline model is used to predict inter-granular deformation. Previous works on grain boundary sliding and grain boundary diffusion are extended to drive three dimensional macro stress-strain rate relationships for each mechanism. In these relationships, the effect of grain size is also taken into account. It is shown that for grain boundary diffusion, stress-strain rate relationship obeys the Prandtl-Reuss flow rule. The proposed model is used to simulate step strain rate tests and the results are compared with experimental data. It is concluded that the model can be used to predict flow stress for various grain sizes and strain rates. The proposed model can be directly used in simulation of hot forming processes and as an example the bulge forming process is simulated and the results are compared with experimental data.

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4

Kim, B. N., K. Hiraga, and K. Morita. "Viscous grain-boundary sliding and grain rotation accommodated by grain-boundary diffusion." Acta Materialia 53, no. 6 (April 2005): 1791–98. http://dx.doi.org/10.1016/j.actamat.2004.12.028.

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5

King, A. H. "Diffusion induced grain boundary migration." International Materials Reviews 32, no. 1 (January 1987): 173–89. http://dx.doi.org/10.1179/095066087790150304.

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6

Gao, H., L. Zhang, W. D. Nix, C. V. Thompson, and E. Arzt. "Crack-like grain-boundary diffusion wedges in thin metal films." Acta Materialia 47, no. 10 (August 1999): 2865–78. http://dx.doi.org/10.1016/s1359-6454(99)00178-0.

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7

Yang, Y., Tomonrori Kitashima, T. Hara, Y. Hara, Yoko Yamabe-Mitarai, M. Hagiwara, and L. J. Liu. "Effect of Grain Size on Oxidation Resistance of Unalloyed Titanium." Materials Science Forum 879 (November 2016): 2187–91. http://dx.doi.org/10.4028/www.scientific.net/msf.879.2187.

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The effect of the grain size on the high-temperature oxidation resistance of unalloyed titanium was experimentally investigated using titanium samples with two different grain sizes of 219 μm and 118 μm. The weight gain during oxidation and the penetration depth of oxygen from a metal surface were larger in the small-grain-size sample compared with the large-grain-size sample. In addition, oxygen diffusion was faster in the substrate of the small-grain-size sample. These results were attributed to the grain-boundary diffusion of oxygen. A steep change in the oxygen concentration was observed at a grain boundary. Our simulation results suggested that slower oxygen diffusion into the inner grain from the surface through the grain boundary with high diffusivity can cause the observed steep change in the oxygen concentration.

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8

Dolgopolov, Nikolai, A. Petelin, and S. Rakov. "Role of Diffusion as a Control Stage of a Grain Boundary Liquid Grooving." Defect and Diffusion Forum 249 (January 2006): 227–30. http://dx.doi.org/10.4028/www.scientific.net/ddf.249.227.

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The interaction of liquid metals with solid polycrystalline metal leads to the appearance of liquid grooves at grain boundaries. The shapes of these grooves may be of a very wide variety. In this paper the typical features of different liquid grooves are presented, classified and analyzed on the base of our experimental data. The developed models confirm the dominant role of diffusion mechanisms.

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9

Panigrahi, B. B., K. Das, and M. M. Godkhindi. "Dilatometry of ball milled nickel nano powder during non-isothermal sintering." Science of Sintering 39, no. 1 (2007): 25–29. http://dx.doi.org/10.2298/sos0701025p.

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This work attempts to evaluate the sintering mechanisms of ball milled nanocrystalline nickel during nonisothermal heating. Samples showed a sintered density of 91.2% (theoretical) and grain growth up to 414 nm at 1273K. The activation energies of 12.4, 32.0 and 51.6 kJ/mol were found for viscous flow, lattice diffusion and grain boundary diffusion mechanisms respectively. Sintering was found to be controlled by interface reactions involving surface and grain boundary diffusions.

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10

Apyhtina, Irina, Kseniia Kovaleva, Alexander Novikov, Darya Orelkina, Alexander Petelin, and Egor Yakushko. "Diffusion Controlled Grain Boundary and Triple Junction Wetting in Polycrystalline Solid Metal." Defect and Diffusion Forum 363 (May 2015): 127–29. http://dx.doi.org/10.4028/www.scientific.net/ddf.363.127.

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Grain boundary liquid grooving process takes place during the contact of solid phase with the melt. The liquid bismuth network formation along grain boundaries (GBs) and triple junctions (TJs) was investigated in copper polycrystalline samples. The in situ experimental observation technique of Bi penetration through the Cu plate was used. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.

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11

Bokstein, Boris S., S. A. Gulevsky, A. L. Petelin, and A. O. Rodin. "Diffusion Controlled Grain Triple Junctions Wetting in Metals." Defect and Diffusion Forum 309-310 (March 2011): 231–38. http://dx.doi.org/10.4028/www.scientific.net/ddf.309-310.231.

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The interaction between liquid and solid metals where the liquid-solid interface contains three grain boundary lines which meet in triple junction point is considered. The assumption that the liquid grooves may be formed not only along grain boundaries but along triple junctions is presented. The variation of Gibbs energy during the formation of triangle pyramidal groove along triple junction is determined. The dependence of Gibbs energy variation from groove dimensions shows that the wetting of triple junctions occurs by lower temperatures than the wetting of grain boundaries. This result allows to take into account the existence of grain size effect on the liquid phase penetration depth into the polycrystalline sample. The proposed mechanism of wetting in polycrystalline metal contains two stages: the outstrip melt penetration along triple junctions and the liquid grooving on grain boundaries forming the triple junctions. One of the processes – triple junction diffusion or liquid diffusion – may control the wetting in the polycrystalline sample.

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12

He, Jiayi, Jiali Cao, Zhigao Yu, Wenyue Song, Hongya Yu, Mozaffar Hussain, and Zhongwu Liu. "Grain Boundary Diffusion Sources and Their Coating Methods for Nd-Fe-B Permanent Magnets." Metals 11, no. 9 (September 10, 2021): 1434. http://dx.doi.org/10.3390/met11091434.

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Nd-Fe-B magnets containing no heavy rare earth (HRE) elements exhibit insufficient coercivity to withstand the demagnetization field at elevated temperatures. The grain boundary diffusion (GBD) process provides the best route to fabricate high-coercive Nd-Fe-B magnets with low consumption of expensive HRE resources. Here we give a special review on the grain boundary diffusion sources and their coating methods. Up to now, various types of grain boundary sources have been developed, starting from the earliest Tb or Dy metal. The HRE-M eutectic alloys were firstly proposed for reducing the cost of the diffusion source. After that, the diffusion sources based on light rare earth and even non rare earth elements have also been proposed, leading to new understanding of GBD. Now, the diffusion sources including inorganic compounds, metals, and alloys have been employed in the industry. At the same time, to coat the diffusion source on the magnets before diffusion treatment, various methods have been developed. Different from the previous review articles for GBD, this review gives an introduction of typical types of diffusion sources and their fabrication approaches. The effects of diffusion source on the microstructure and magnetic properties are summarized briefly. In particular, the principles and applicability of different coating approaches were discussed in detail. It is believed that this review can provide a technical guidance for the industry for designing the diffusion process and products meeting specific requirements.

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13

Popov, Vladimir V. "Emission Mössbauer Spectroscopy of Grain Boundaries in Poly- and Nanocrystalline Metals." Defect and Diffusion Forum 289-292 (April 2009): 633–40. http://dx.doi.org/10.4028/www.scientific.net/ddf.289-292.633.

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Capabilities of the emission nuclear gamma resonance (NGR) spectroscopy in studying grain boundaries in metals are considered. It is demonstrated that this method enables to evaluate grain-boundary segregation factors, to determine grain-boundary diffusion mechanisms, to estimate an effective diffusion coefficient in near-boundary areas, etc. Besides, this method permits to evaluate quantitatively differences in the properties of grain boundaries of polycrystalline and nanostructured materials.

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14

Tellier, C. R. "Thin Metal Film Sensors." Active and Passive Electronic Components 12, no. 1 (1985): 9–32. http://dx.doi.org/10.1155/1985/17659.

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During the last decade some progress have been made in the field of sensors using thin film techniques. In particular thin metal film strain gauges and thin film temperature sensors based on the temperature dependent resistivity of metal are now commonly used. But changes in other transport parameters with various measurands are also useful for the design of metal film sensors. Difficulty arises in thin film techniques when structural defects are frozen in films.Intensive theoretical investigations are carried out to explain the effect of grain-boundary and external surface scatterings on transport parameters. Accordingly the main results are presented to specify the influence of film structure on the sensor performance. The grain-boundary effects are discussed according to applications of metal film sensors. Theoretical predictions are analyzed in terms of sensitivity, thermal stability and long term behavior. But other problems induced by the presence of grain boundaries or point defects are also discussed, in particular problems associated with bulk diffusion, electromigration induced failures or intrinsic stresses.

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15

Popov, V. V., E. V. Osinnikov, S. A. Murzinova, A. V. Stolbovsky, and R. M. Falahutdinov. "Grain Boundary Diffusion of 57Co in Nickel." Journal of Phase Equilibria and Diffusion 41, no. 2 (April 2020): 132–37. http://dx.doi.org/10.1007/s11669-020-00794-5.

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16

Wang, W. L., Y. T. Chou, and Sanboh Lee. "Chemical stresses induced by grain-boundary diffusion." Metallurgical and Materials Transactions A 29, no. 8 (August 1998): 2121–25. http://dx.doi.org/10.1007/s11661-998-0037-x.

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17

Onaka, Susumu, Masaharu Kato, and T. Mori. "Reexamination of grain-boundary sliding by diffusion." Metallurgical Transactions A 17, no. 11 (November 1986): 1949–53. http://dx.doi.org/10.1007/bf02644992.

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18

Beke, Dezső L., A. Lakatos, G. Erdélyi, A. Makovecz, G. A. Langer, Lajos Daróczi, K. Vad, and A. Csik. "Investigation of Grain Boundary Diffusion in Thin Films by SNMS Technique." Defect and Diffusion Forum 312-315 (April 2011): 1208–15. http://dx.doi.org/10.4028/www.scientific.net/ddf.312-315.1208.

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It was shown more recently in our Laboratory [1,2,3] that having a substrate/diffusant/thin-film/cap-layer structure (the thin film was typically several 10 nm thick, with the same order of magnitude of grain size; the refractory metal cap layer was used just to avoid the oxidation), first the diffusant atoms migrated very fast across the thin film and segregated at the film/cap-layer interface. The accumulated atoms at the film/cap layer interface form a secondary diffusion reservoir and atoms diffuse back to the layer. Later on, the thin film was gradually filled up with the diffusing atoms and composition depth profiles, determined by Secondary Neutral Mass Spectroscopy (SNMS), showed a maximum at the cap layer-thin film interface. The accumulated atoms at this interface formed a secondary diffusion reservoir and atoms diffused back to the layer. These observations can be interpreted supposing a bimodal grain boundary structure with different (fast and low) diffusivities. The observed grain boundary diffusion phenomena can be classified as C-type diffusion. The appearance of the peak observed at the cap layer interface can be used as a tool to determine the grain boundary diffusivity along the fast boundaries. Because the fast boundaries were saturated in the first stage of the process, this back-diffusion took place along the low-diffusivity boundaries only. Thus the SNMS depth-profiling is a good method to determine grain boundary diffusivities in a bimodal structure. In addition, from the overall impurity content inside the film the segregation can also be estimated, if the bulk solubility is low and the GB density is known. Numerical simulations of C-type GB diffusion in thin films with a bimodal structure confirmed that the interpretation of the result depicted above is reasonable [4]. In order to estimate roughly the GB diffusion data we determined the fast diffusivity using the first appearance method. The lower diffusivity was determined from the time evolution of the broadening of the diffusant/thin film interface. In addition both (slow and fast) diffusivities were also estimated from fitting numerical solutions obtained in [4] too.

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19

Rajeshwari K., Sai, S. Sankaran, K. C. Hari Kumar, Harald Rösner, Martin Peterlechner, Vladimir A. Esin, Sergiy Divinski, and Gerhard Wilde. "Grain boundary diffusion and grain boundary structures of a Ni-Cr-Fe- alloy: Evidences for grain boundary phase transitions." Acta Materialia 195 (August 2020): 501–18. http://dx.doi.org/10.1016/j.actamat.2020.05.051.

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20

Lei, Xianjun, Xiaopeng Wang, Fantao Kong, Haitao Zhou, and Yuyong Chen. "Self-Induced Internal Corrosion Stress Transgranular Cracking in Gradient-Structural Ploycrystalline Materials at High Temperature." Metals 11, no. 9 (September 16, 2021): 1465. http://dx.doi.org/10.3390/met11091465.

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Self-induced internal corrosion stress transgranular cracking is investigated theoretically and experimentally linking grain boundary wetting (GBW) and grain boundary diffusion (GBD) to improve the ability to reveal the micro mechanism of crack in compositional gradient-structural intermetallic materials. Theoretical analysis shows that the grain boundary wetting and diffusion induce the diffusion-coupled dynamic internal stresses, and their interaction leads to crack nucleation. The experimental results show a stress concentration zone have been established at the grain boundary interface where the cracks preferentially nucleate and then extend through the inside of the grain to both sides, forming a typical transgranular fracture.

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21

Koju, R. K., and Y. Mishin. "Atomistic study of grain-boundary segregation and grain-boundary diffusion in Al-Mg alloys." Acta Materialia 201 (December 2020): 596–603. http://dx.doi.org/10.1016/j.actamat.2020.10.029.

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22

Akano, U. G., D. A. Thompson, W. W. Smeltzer, and J. A. Davies. "Ion-beam mixing of Ni/Pd layers: II. Thermally assisted regime (>500K)." Journal of Materials Research 3, no. 6 (December 1988): 1063–71. http://dx.doi.org/10.1557/jmr.1988.1063.

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Atomic mixing in Ni/Pd bilayer films due to 120 keV Ar+ irradiation in the thermally assisted regime (523−673 K) has been measured, in situ, using Rutherford backscattering with 2.0 MeV 4He+ ions. The mean diameter of grains in these polycrystallinc films increased from 10 to 60 nm, following Ar+ bombardment at 573 K. Initial mixing was rapid due to grain boundary diffusion and incorporation of the metal solute into the solvent metal matrix by grain growth; this mixing stage was essentially complete within 10 min for annealed films or after an Ar+ dose of 4 × 1015 cm−2 in irradiated films (10 min irradiation). No further measurable mixing occurred in the annealed, unirradiated films. For the irradiated samples the initial rapid mixing (6−35 atoms/ion) was followed by a slower mixing stage of 0.7–1.8 atoms/ion for irradiation doses of up to 2.5 × 1016 Ar+ cm−2. The Ar+ bombardment gave rise to much smaller mixing levels when the Pd films were deposited on large-grain or single-crystal Ni. A diffusion analysis demonstrates that the effective diffusivity, Deff, for ion-irradiation-enhanced mixing in the thermally assisted regime satisfied the relation Dl < Deff < DB, where the ratio of the grain boundary to lattice diffusivity was DB/Dl > 106.

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23

Zhang, Jiarui, Fan Yang, Yaping Liu, Zheng Zhong, and Jinfeng Zhao. "On the deformation-induced grain rotations in gradient nano-grained copper based on molecular dynamics simulations." Nanotechnology Reviews 10, no. 1 (January 1, 2021): 87–98. http://dx.doi.org/10.1515/ntrev-2021-0010.

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Abstract In this paper, the mechanical behavior of gradient nano-grained copper under uniaxial deformation was investigated using molecular dynamics simulations. The stress response was found to be different in the regions with different grain sizes, which was attributed to the different dislocation activities due to the dislocation-grain boundary synergies. The phenomenon of grain rotation was observed and a program was developed to accurately evaluate the grain rotation and explore its dependence on the grain size and the initial crystal orientation. It is found that all grains tend to rotate to the 30° orientation, consistent with the activation theory of the slip systems under the uniaxial deformation. The rotation magnitude is larger for larger grains, but the rotation rate is more diversely distributed for smaller grains, indicating more disturbance from grain boundary mechanisms such as the grain boundary sliding and the grain boundary diffusion for smaller grains. The effect of temperature on the grain rotation is also investigated, showing an increase of the dispersion of grain rotation distribution with the increase of temperature. This paper aims at providing insights into the synergistic deformation mechanisms from dislocations and grain boundaries accounting for the exceptional ductility of the gradient nano-grained metals.

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24

Dekhtyaruk, Leonid. "Influence of interdiffusion on the electrical conductivity of multilayered metal films." Open Physics 4, no. 1 (March 1, 2006): 73–86. http://dx.doi.org/10.1007/s11534-005-0007-5.

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AbstractThe annealing-time dependence of the electrical conductivity of multilayered single-crystal and polycrystalline metal films has been analyzed theoretically within the frame of the semi-classical approach. It is demonstrated that changes in the electrical conductivity which are caused by the diffusion annealing allow for investigating the processes of the bulk and grain-boundary diffusion, and for estimating the coefficients of the diffusion. The electrical conductivity was calculated and the numerical analysis of the diffusion-annealing time dependence was performed at various parameters.

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25

Aleshin, A. N. "Role of grain-boundary diffusion in the grain growth in nanocrystalline nickel." Russian Metallurgy (Metally) 2008, no. 4 (August 2008): 286–93. http://dx.doi.org/10.1134/s0036029508040034.

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26

Randjelovic, B., K. Shinagawa, and Z. S. Nikolic. "A mathematical approach to Ostwald ripening due to diffusion and deformation in liquid bridge." Science of Sintering 45, no. 3 (2013): 261–71. http://dx.doi.org/10.2298/sos1303261r.

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From many experiments with mixtures of small and large grains, it can be concluded that during liquid phase sintering, smaller grains partially dissolve and a solid phase precipitates on the larger grains and grain coarsening occurs. The growth rate can be controlled either by the solid-liquid phase boundary reaction or by diffusion through the liquid phase. The microstructure may change either by larger grains growing during the Ostwald ripening process or by shape accommodation. In this study, two-dimensional mathematical approach for simulation of grain coarsening by grain boundary migration based on a physical and corresponding numerical modeling of liquid phase sintering will be considered. A combined mathematical method of analyzing viscous deformation and solute diffusion in liquid bridge between two grains with different sizes will be proposed. The viscous FE method will be used for calculating meniscus of the liquid bridge, with the interfacial tensions taken into consideration. The FE method for diffusion will be also implemented by using the same mesh as the deformation analysis.

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27

Novikov, A. A., A. L. Petelin, Boris S. Bokstein, S. N. Zhevnenko, and D. I. Orelkina. "The Formation of Liquid Metal Channels Network under Grain Boundary Wetting in the Cu-Bi System." Defect and Diffusion Forum 323-325 (April 2012): 177–81. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.177.

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Grain boundary liquid grooving process takes place during the contact of solid metal phase with the metal melt. The liquid bismuth network formation along grain boundaries (GB) and triple junctions (TJ) was investigated in copper polycrystalline samples. The experimental observation in situ technique of Bi penetration through the Cu plate was used. Microscopic images of the liquid channels network were obtained. The temperature dependencies of GB and TJ effective penetration depths were determined. The effect of the GB and TJ diffusion on the liquid channels growth mechanism was discussed.

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Klinger, Leonid, and Eugen Rabkin. "Kirkendall Effect during Grain Boundary Interdiffusion in Polycrystalline Thin Films." Defect and Diffusion Forum 323-325 (April 2012): 49–54. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.49.

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We consider the kinetics of chemical interdiffusion along the grain boundaries in stressed thin metal film attached to inert substrate. We show that the kinetics of stress relaxation in the film can be either accelerated or slowed down if compared with the same kinetics in a single-component film, depending on the difference of intrinsic GB diffusion coefficients of the two components. In the case of faster matrix atoms the tensile stress in the film significantly increases beyond its initial value at the beginning of interdiffusion process, while in the case of faster diffuser atoms the compressive stresses develop in the film at the intermediate stages of stress evolution.

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Qian, X. R., and Y. T. Chou. "Grain boundary diffusion of chromium in niobium bicrystals." Philosophical Magazine A 52, no. 2 (August 1985): L13—L18. http://dx.doi.org/10.1080/01418618508237612.

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Jahn, R. J., and A. H. King. "Vacancy deposition during diffusion-induced grain boundary migration." Philosophical Magazine A 54, no. 1 (July 1986): L3—L7. http://dx.doi.org/10.1080/01418618608242872.

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31

Mishin, Yuri. "Calculation of diffusion coefficients and correlation factors in grain-boundary diffusion." Philosophical Magazine A 72, no. 6 (December 1995): 1589–607. http://dx.doi.org/10.1080/01418619508243932.

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Rodin, Alexey, Nikolai Dolgopolov, and Sergei Kryukov. "Grain Boundary Diffusion. Effect of Segregation or Concentration Dependence of Diffusivity." Defect and Diffusion Forum 323-325 (April 2012): 165–70. http://dx.doi.org/10.4028/www.scientific.net/ddf.323-325.165.

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Effect of microalloying of Al by Ce on Cu grain boundary diffusion (GBD) in Al and other results of GBD study in metals with different purity were analyzed. It is shown that in dependence on the chemical composition of the matrix the triple product of GB diffusion can be higher or less than that for pure metals. The main concept used for description of the results is local ordering of the atoms (including atomic complex formation and appearance of «poisonous» places around atoms of the alloying element). The increasing of atom mobility at GB is discussed also in terms of solidus temperature changes.

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Hashimoto, R. Y., E. S. K. Menon, and A. G. Fox. "Segregation of Silicon in Metal-Alumina Composites." Microscopy and Microanalysis 5, S2 (August 1999): 624–25. http://dx.doi.org/10.1017/s1431927600016445.

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A common impurity in polycrystalline commercial alumina is Si since silica is often added as a sintering aid. There have been several studies on impurities in alumina, and substantial degree of grain boundary segregation has been found to occur. Alumina-metal composites have found several applications especially in the electronic industry and consequently systems such as alumina-copper have been studied exhaustively. However, the role of impurities in metal-alumina composites has not been fully explored. Studies of Pt-alumina composites has shown that silicon is present at the interface of vacuum, diffusion bonded samples. Our earlier studies have shown that Si indeed segregates to the triple junctions and grain boundaries in alumina and in alumina-copper composites, often Si segregates to the metal-ceramic interfaces as well. This investigation concentrates on the distribution of silicon in copper-alumina in comparison to aluminum-alumina composites.The metal-ceramic composites were prepared by diffusion bonding 99.99% pure metal foils sandwiched in between commercially available sintered alumina (∼99.5% pure) substrates for several hours in vacuum.

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34

Zhang, Yuanheng, Kai Ding, Guanzhi Wu, Bingge Zhao, Yuanfang Wang, Tao Wei, and Yulai Gao. "Aging-induced formation of the nano-sized clustered carbides in the weld metal of Co-based alloy/AISI 410 stainless steel dissimilar welded joint." Metallurgical Research & Technology 117, no. 4 (2020): 402. http://dx.doi.org/10.1051/metal/2020033.

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The microstructure evolution in Co-based alloy/AISI 410 stainless steel dissimilar welded joints by aging at 566 °C for 200, 400, 600, and 800 h was systematically investigated. In particular, the specimen aging treated for 800 h was emphasized in the present study for its nano-sized clustered characteristic microstructure. The results showed that the microstructure of the weld metal (WM) was mainly γ-Co matrix with dendritic morphology. Before aging treatment, the elements Cr and W segregated slightly in the interdendritic regions. Nevertheless, a large amount of nano-sized clustered carbides rich in elements Cr and W precipitated along grain boundaries after aging treatment. The element segregation during solidification and element diffusion under high-temperature condition could trigger the carbide formation. Though the precipitated carbides revealed a negligible influence on the microhardness of weld (∼ 275 HV), yet a stable performance under high-temperature condition was anticipated for this weldment considering the grain boundary strengthening effect of the nano-sized carbides.

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Dohie, Jonathan S., J. R. Cahoon, and W. F. Caley. "The Grain-Boundary Diffusion of Zn in α-Fe." Journal of Phase Equilibria and Diffusion 28, no. 4 (June 6, 2007): 322–27. http://dx.doi.org/10.1007/s11669-007-9093-y.

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36

Lee, M. W., K. H. Bae, S. R. Lee, H. J. Kim, and T. S. Jang. "Microstructure and Magnetic Properties of NdFeB Sintered Magnets Diffusion-Treated with Cu/Al Mixed Dyco Alloy-Powder." Archives of Metallurgy and Materials 62, no. 2 (June 1, 2017): 1263–66. http://dx.doi.org/10.1515/amm-2017-0189.

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AbstractWe investigated the microstructural and magnetic property changes of DyCo, Cu + DyCo, and Al + DyCo diffusion-treated NdFeB sintered magnets. The coercivity of all diffusion treated magnet was increased at 880ºC of 1stpost annealing(PA), by 6.1 kOe in Cu and 7.0 kOe in Al mixed DyCo coated magnets, whereas this increment was found to be relatively low (3.9 kOe) in the magnet coated with DyCo only. The diffusivity and diffusion depth of Dy were increased in those magnets which were treated with Cu or Al mixed DyCo, mainly due to comparatively easy diffusion path provided by Cu and Al because of their solubility with Ndrich grain boundary phase. The formation of Cu/Al-rich grain boundary phase might have enhanced the diffusivity of Dy-atoms. Moreover, relatively a large number of Dy atoms reached into the magnet and mostly segregated at the interface of Nd2Fe14B and grain boundary phases covering Nd2Fe14B grains so that the core-shell type structures were developed. The formation of highly anisotropic (Nd, Dy)2Fe14B phase layer, which acted as the shell in the core-shell type structure so as to prevent the reverse domain movement, was the cause of enhancing the coercivity of diffusion treated NdFeB magnets. Segregation of cobalt in Nd-rich TJP followed by the formation of Co-rich phase was beneficial for the coercivity enhancement, resulting in the stabilization of the metastable c-Nd2O3phase.

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37

Poletaev, G. M., I. V. Zorya, and M. D. Starostenkov. "Role of point defects in self-diffusion along low-angle twist boundaries in fcc metals: A molecular dynamics study." Journal of Micromechanics and Molecular Physics 03, no. 01n02 (March 2018): 1850001. http://dx.doi.org/10.1142/s2424913018500017.

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The interaction of point defects with low-angle (100), (110) and (111) twist boundaries in fcc metals Ni, Cu, Al and role of the point defects in self-diffusion along considered boundaries were studied by the molecular dynamics method. The binding energies of point defects with low-angle twist boundaries were calculated. It was found that the point defects are mainly fixed in the nodes of grain-boundary screw dislocations network. It was shown that the introduced vacancies play an important role in diffusion along twist grain boundaries. The contribution of introduced interstitial atoms to grain-boundary diffusion under thermodynamic equilibrium condition is less by several orders of magnitude in comparison with the contribution of vacancies.

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38

Geise, Jürgen, and Christian Herzig. "Lattice and Grain Boundary Diffusion of Niobium in Iron." International Journal of Materials Research 76, no. 9 (September 1, 1985): 622–26. http://dx.doi.org/10.1515/ijmr-1985-760907.

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39

Zeng, H. X., Z. W. Liu, J. S. Zhang, X. F. Liao, and H. Y. Yu. "Towards the diffusion source cost reduction for NdFeB grain boundary diffusion process." Journal of Materials Science & Technology 36 (January 2020): 50–54. http://dx.doi.org/10.1016/j.jmst.2019.08.009.

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40

Divinski, Sergiy, Jens Ribbe, Guido Schmitz, and Christian Herzig. "Grain boundary diffusion and segregation of Ni in Cu." Acta Materialia 55, no. 10 (June 2007): 3337–46. http://dx.doi.org/10.1016/j.actamat.2007.01.032.

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41

Ribbe, Jens, Vladimir A. Esin, and Sergiy V. Divinski. "Grain boundary diffusion of 59Fe in high-purity copper." Acta Materialia 165 (February 2019): 431–43. http://dx.doi.org/10.1016/j.actamat.2018.11.060.

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42

Du, Ningning, Yue Qi, Paul E. Krajewski, and Allan F. Bower. "Aluminum Σ3 grain boundary sliding enhanced by vacancy diffusion." Acta Materialia 58, no. 12 (July 2010): 4245–52. http://dx.doi.org/10.1016/j.actamat.2010.04.016.

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43

Gao, Y., J. Jia, R. E. Loehman, and K. G. Ewsuk. "Transmission electron microscopy study of Al/Al2O3 composites fabricated by reactive metal infiltration." Journal of Materials Research 10, no. 5 (May 1995): 1216–25. http://dx.doi.org/10.1557/jmr.1995.1216.

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The microstructure of Al/α-Al2O3 composites made by infiltrating molten Al into dense mullite preforms has been characterized using transmission electron microscopy. The growth of the Al/Al2O3 composites was found to proceed through three stages. Initially, Al infiltrates into a dense mullite preform through grain boundary diffusion, and reacts with mullite at grain boundaries to form a partial reaction zone. Then, a complete reaction takes place in the reaction region between the partial reaction zone and the full reaction zone to convert the dense mullite preform to a composite of α-Al2O3 (matrix) and an Al-Si phase (thin channels). Finally, the reduced Si from the reaction diffuses out of the Al/Al2O3 composite through the metal channels, whereas Al from the molten Al pool is continuously drawn to the reaction region until the mullite preform is consumed or the sample is removed from the molten Al pool. Based on the observed microstructure, infiltration mechanisms have been discussed, and a growth model of the composites is proposed in which the process involves repeated nucleation of Al2O3 grains and grain growth.

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44

Alpe´rine, S., and L. Lelait. "Microstructural Investigations of Plasma-Sprayed Yttria Partially Stabilized Zirconia TBC (In Relation to Thermomechanical Resistance and High-Temperature Oxidation Mechanisms)." Journal of Engineering for Gas Turbines and Power 116, no. 1 (January 1, 1994): 258–65. http://dx.doi.org/10.1115/1.2906802.

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This study deals with microstructural investigations of plasma-sprayed yttria partially stabilized zirconia thermal barrier coatings, performed by classical and analytical transmission electron microscopy. The aim of the study was to determine eventual relationships between coating microstructure and toughness. The ceramic/metal interface, which plays an important role during TBC thermomechanical solicitation, has also been studied. In the 6–8 wt. percent Y2O3 range, the metastable tetragonal t′ phase is observed, showing special faulted microstructural features, such as grain twinning and antiphase boundary planes. Moreover, after high-temperature annealing in air, a very fine and stable precipitation of the equilibrium cubic phase appears. It is believed that these microstructural elements could act as crack deviation sites and enhance the coatings’ intrinsic toughness. Microstructural investigations of the alumina scales grown during high-temperature annealing reveal yttrium segregation at oxide grain boundaries as well as significant quantities of zirconium inside the alumina grains. The oxide growth seems to be dominated by a classical grain boundary oxygen diffusion mechanism. The presence of zirconium inside the alumina grains suggests that Al2O3 also partially forms by chemical reduction of ZrO2 by Al.

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45

Erdélyi, Z., Christophe Girardeaux, Jean Bernardini, Dezső L. Beke, and Andree Rolland. "Experimental and Theoretical Study of Type-C Grain Boundary and Volume Diffusion by AES in Metal/Metal Structures." Defect and Diffusion Forum 194-199 (April 2001): 1161–66. http://dx.doi.org/10.4028/www.scientific.net/ddf.194-199.1161.

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46

Sabioni, A. C. S., A. M. Huntz, F. Millot, and C. Monty. "Self-diffusion in cr2o3III. Chromium and oxygen grain-boundary diffusion in polycrystals." Philosophical Magazine A 66, no. 3 (September 1992): 361–74. http://dx.doi.org/10.1080/01418619208201562.

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47

Istomina, A. Yu, and E. V. Osinnikov. "ANALYSIS USING ELECTROLYTIC LAYER STRIPPING TO DETERMINE THE PARAMETERS OF GRAIN-BOUNDARY DIFFUSION OF COBALT IN POLYCRYSTALLINE NICKEL." Bulletin of the South Ural State University series "Mathematics. Mechanics. Physics" 12, no. 4 (2020): 62–69. http://dx.doi.org/10.14529/mmph200407.

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A technique for layer-by-layer radiometric analysis using electrolytic layer stripping to determine the parameters of grain-boundary diffusion of cobalt in polycrystalline nickel has been developed. The aim of the work is to develop a complete technological cycle of layer-by-layer radiometric analysis, to select the optimal electrolyte composition for nickel and the conditions for conducting an experiment to remove metal layers with their thickness of 20–200 nm. The studies have been carried out on nickel of nominal purity of 99,98 %. The stabilizing heat treatment of the samples is carried out at a pressure of 10–5 Pa for 2 hours at a temperature of 1273 K. Diffusion annealing is carried out at a pressure of 10–9 Pa in the temperature range of 623–1173 K for 5–30 hours. Concentration profiles have been measured by parallel stripping of layers, which are obtained by electrolytic polishing in a solution based on nickel sulfamate, followed by weighing the sample on a high-precision analytical balance. The difference in weight before and after removal of the layers is used to further calculate the thickness of the removed layers and, as a consequence, the penetration depth of the diffusing. The residual activity of the sample is measured using a digital gamma spectrometer with a NaI (Tl) detector. Before carrying out the experiments, a reference source with a previously known activity has been made to take into account the correction factor due to the radioactive decay of 57Co. The specific layer activity is calculated from the integral remainder of the 122,14 keV line using the Gruzin method. Based on the proposed technique, it is possible to determine the parameters of grain boundary diffusion, such as the diffusion coefficient of grain boundary, triple product and segregation coefficient.

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48

Shveykin, Alexey, Peter Trusov, and Elvira Sharifullina. "Statistical Crystal Plasticity Model Advanced for Grain Boundary Sliding Description." Crystals 10, no. 9 (September 16, 2020): 822. http://dx.doi.org/10.3390/cryst10090822.

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Grain boundary sliding is an important deformation mechanism, and therefore its description is essential for modeling different technological processes of thermomechanical treatment, in particular the superplasticity forming of metallic materials. For this purpose, we have developed a three-level statistical crystal plasticity constitutive model of polycrystalline metals and alloys, which takes into account intragranular dislocation sliding, crystallite lattice rotation and grain boundary sliding. A key advantage of our model over the classical Taylor-type models is that it also includes a consideration of grain boundaries and possible changes in their mutual arrangement. The constitutive relations are defined in rate form and in current configuration, which makes it possible to use additive contributions of intragranular sliding and grain boundary sliding to the strain rate at the macrolevel. In describing grain boundary sliding, displacements along the grain boundaries are considered explicitly, and changes in the neighboring grains are taken into account. In addition, the transition from displacements to deformation (shear) characteristics is done for the macrolevel representative volume via averaging, and the grain boundary sliding submodel is attributed to a separate structural level. We have also analyzed the interaction between grain boundary sliding and intragranular inelastic deformation. The influx of intragranular dislocations into the boundary increases the number of defects in it and the boundary energy, and promotes grain boundary sliding. The constitutive equation for grain boundary sliding describes boundary smoothing caused by diffusion effects. The results of the numerical experiments are in good agreement with the known experimental data. The numerical simulation demonstrates that analysis of grain boundary sliding has a significant impact on the results, and the multilevel constitutive model proposed in this study can be used to describe different inelastic deformation regimes, including superplasticity and transitions between conventional plasticity and superplasticity.

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49

Haslam, A. J., V. Yamakov, D. Moldovan, D. Wolf, S. R. Phillpot, and H. Gleiter. "Effects of grain growth on grain-boundary diffusion creep by molecular-dynamics simulation." Acta Materialia 52, no. 7 (April 2004): 1971–87. http://dx.doi.org/10.1016/j.actamat.2003.12.048.

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50

Gignac, L. M., and K. P. Rodbell. "Metal Microstructures in Advanced CMOS Devices." Proceedings, annual meeting, Electron Microscopy Society of America 54 (August 11, 1996): 358–59. http://dx.doi.org/10.1017/s0424820100164258.

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As advanced semiconductor device features shrink, grain boundaries and interfaces become increasingly more important to the properties of thin metal films. With film thicknesses decreasing to the range of 10 nm and the corresponding features also decreasing to sub-micrometer sizes, interface and grain boundary properties become dominant. In this regime the details of the surfaces and grain boundaries dictate the interactions between film layers and the subsequent electrical properties. Therefore it is necessary to accurately characterize these materials on the proper length scale in order to first understand and then to improve the device effectiveness. In this talk we will examine the importance of microstructural characterization of thin metal films used in semiconductor devices and show how microstructure can influence the electrical performance. Specifically, we will review Co and Ti silicides for silicon contact and gate conductor applications, Ti/TiN liner films used for adhesion and diffusion barriers in chemical vapor deposited (CVD) tungsten vertical wiring (vias) and Ti/AlCu/Ti-TiN films used as planar interconnect metal lines.

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