Academic literature on the topic 'Mesures sur tranche'
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Journal articles on the topic "Mesures sur tranche"
Bloch, Laurence, Pierre-Yves Hénin, Olivier Marchand, F. Meunier, and Claude Thélot. "Analyse macro-économique des taux d’activité et flexion conjoncturelle." Économie appliquée 39, no. 4 (1986): 665–703. http://dx.doi.org/10.3406/ecoap.1986.4098.
Full textMacPherson, M., M. de Groh, L. Loukine, D. Prud'homme, and L. Dubois. "Prévalence du syndrome métabolique et de ses facteurs de risque chez les enfants et les adolescents canadiens : Enquête canadienne sur les mesures de la santé, cycle 1 (2007-2009) et cycle 2 (2009-2011)." Promotion de la santé et prévention des maladies chroniques au Canada 36, no. 2 (February 2016): 37–45. http://dx.doi.org/10.24095/hpcdp.36.2.03f.
Full textKONATÉ, Z., M. DJODJO, K. M. E. V. EBOUAT, Z. M. COULIBALY, K. S. N’GUETTIA-ATTOUNGBRÉ, K. BOTTI, and H. YAPO ETTÉ. "ÉTUDE SOCIODÉMOGRAPHIQUE ET MÉDICO-LÉGALE DES HOMICIDES SURVENUS À DOMICILE À ABIDJAN (CÔTE D’IVOIRE)." MEDECINE LEGALE DROIT MEDICAL 65, no. 4 (July 11, 2023): 30. http://dx.doi.org/10.54695/crim.051.0030.
Full textKioko, Ben. "The right of intervention under the African Union's Constitutive Act: From non-interference to non-intervention." International Review of the Red Cross 85, no. 852 (December 2003): 807–26. http://dx.doi.org/10.1017/s0035336100179948.
Full textBouhdjila, Abderrachid. "Martial deficiency in children under five years of age in Batna." Batna Journal of Medical Sciences (BJMS) 7, no. 2 (November 9, 2020): 129–33. http://dx.doi.org/10.48087/bjmsoa.2020.7214.
Full textKamangu, Joël BK. "Profil épidémiologique d’Escherichia Coli isolé des urines aux Cliniques Universitaires de Lubumbashi par le diagnostic de la Bêta-Lactamase à large spectre." Revue de l’Infirmier Congolais 8, no. 1 (July 20, 2024): 36. http://dx.doi.org/10.62126/zqrx.2024819.
Full textSkinner, R., S. McFaull, J. Draca, M. Frechette, J. Kaur, C. Pearson, and W. Thompson. "Le suicide et les hospitalisations associées à des blessures auto-infligées au Canada (1979 à 2014-2015)." Promotion de la santé et prévention des maladies chroniques au Canada 36, no. 11 (November 2016): 272–81. http://dx.doi.org/10.24095/hpcdp.36.11.02f.
Full textAbdoulaye, Z., and Et Al. "Surveillance épidémiologique du rotavirus chez les enfants de 0 à 59 mois de 2010 à 2022 à l’Hôpital National de Niamey, Niger." Revue Malienne d'Infectiologie et de Microbiologie 18, no. 2 (January 8, 2024): 82–88. http://dx.doi.org/10.53597/remim.v18i2.2738.
Full textWijesundera, Jessica, Padma Kaul, Anamaria Savu, Sunjidatul Islam, Douglas C. Dover, Linn E. Moore, Andrea M. Haqq, and Geoff D. C. Ball. "Associations entre les déterminants sociaux de la santé et le statut pondéral des enfants d’âge préscolaire : une étude de population." Promotion de la santé et prévention des maladies chroniques au Canada 43, no. 6 (June 2023): 312–21. http://dx.doi.org/10.24095/hpcdp.43.6.02f.
Full textDiouf, Joseph Samba, Max Crocquet, Papa Ibrahima Ngom, Michel Danguy, Falou Diagne, Khady Diop-Ba, and Alpha Badiane. "Intérêt d’une approche téléradiographique basée sur les entités trigéminales dans l’étude de la morphologie sagittale de sujets sénégalais." L'Orthodontie Française 81, no. 2 (June 2010): 147–55. http://dx.doi.org/10.1051/orthodfr/20101014.
Full textDissertations / Theses on the topic "Mesures sur tranche"
Alawar, Maya. "Micromachining and Packaging of Smart Probes for mmW on-Wafer Measurements." Electronic Thesis or Diss., Université de Lille (2022-....), 2024. http://www.theses.fr/2024ULILN036.
Full textAdvanced silicon technologies, such as BiCMOS B55X from STMicroelectronics, which target fT/fmax cutoff frequencies above 400 GHz, are enabling the development of silicon circuits in the 140-220 GHz range (G-band). To validate these technologies, microwave characterization methods for on-wafer measurements are essential to extract the figures of merit of transistors, passive circuitry and associated parasitics. However, broadband circuits like noise sources (NS), noise receivers and impedance tuners at these frequencies are very incompletely covered by the market offer. Previous research demonstrated that embedding measurement functions directly onto silicon in BiCMOS B55 technology is possible, but this in-situ approach or built-in self-test (BIST) has certain limitations, particularly in terms of the silicon surface allocated to the test circuits alone and also because embedded BIST instrumentation cannot be used for another technology.This thesis broadens the applicability of measurement instrumentation beyond the B55X process and aims to reduce testing costs by transitioning from BIST to smart probes. This new approach focuses on integrating measurement functions into compact systems placed as close as possible to the measurement probes for ex-situ measurements.Building on earlier research achievement as part of a previous thesis, the first-ever packaged NS based on SiGe BiCMOS 55-nm technology was developed and characterized in two distinct configurations. In a first flavor, on-wafer noise measurements yielded an extracted excess noise ratio (ENRav) level of 37 dB in the 140-170 GHz. In an alternative approach, the NS was packaged in a split-block with a WR5.1 flange termination for connection to commercial passive probes, achieving an ENRav level of up to 25 dB in 140-220 GHz corresponding to a 12 dB ENR reduction when compared to the on-wafer measurements.To improve on this work, a key achievement of the present thesis is the development of Ground-Signal-Ground (GSG) probes for on-wafer measurements fabricated using femtosecond laser micromachining with a resolution between 5-10 µm. These probes made from 100 µm thick Schott AF32 glass substrate bonded to a 10 µm thick nickel sheet, demonstrate improved mechanical durability and electrical performance. Nickel was chosen for the tip contacts due to its mechanical hardness and superior electrical properties, which minimize contact resistance and extend probe lifespan. Mechanical testing revealed that while glass-only probes failed at a contact force of 196 mN, the nickel-glass probes withstood forces up to 667 mN. Additionally, these probes achieved low-resistance electrical contacts (0.05 Ω above 6 mN), as verified through four-wire measurements on a single contact point.Furthermore, this research introduces a novel substrate technology that integrates an amplified NS B55X chip onto a glass interposer to reduce dielectric and transition losses. Using femtosecond laser micromachining, the interconnects are precisely structured, allowing the integration of the NS chip on the same substrate used to manufacture the coplanar probing tips, with the advantage of simplifying the signal propagation path. This system achieved a tunable ENRav level of up to 29 dB in the 140-170 GHz range, with constant output impedance matching better than -12 dB across the entire frequency band. This innovation allows for the integration of the GSG probes with the NS to perform on-wafer noise measurements.This research opens new possibilities for cost-effective, scalable millimeter-wave active probes for on-wafer measurements. Their adaptable design makes them suitable for diverse applications, advancing circuit characterization and high-frequency semiconductor testing
Carbonero, Jean-Louis. "Développement des méthodes de mesures en hyperfréquences sur tranches de silicium et application à la caractérisation des technologies CMOS et BICMOS sub-microniques." Grenoble INPG, 1996. http://www.theses.fr/1996INPG0051.
Full textPeltier, Fabienne. "Influence du transport de matière sur la compétition entre la corrosion d'une surface d'un alliage d'aluminium mis à nu et le relâchement de peintures fonctionnalisées par des pigments inhibiteurs : validation d'un concept de capteur de corrosion." Thesis, Dijon, 2014. http://www.theses.fr/2014DIJOS042/document.
Full textThe conventional aircraft paint scheme for corrosion protection of aluminum structures is partly based on application of a primer containing inhibitors. In such coatings, release of the inhibiting species enables fast healing of a bare metal surface after a mechanical damage of the protective layers. Nevertheless, considering possible depletion of inhibitors by uncontrolled leaching, it appears important to estimate the corrosion risk integrating “corrosion” sensors in the structure. The objective of this work was to understand the operating mode of a sensor simulating a damaged paint coating whose concept is based on the competition between the triggering of localized corrosion and the passivation of a bare 2024 alloy. The behavior of this massive alloy and Al-Cu solid solutions (the active metallic slots of the sensor) was studied in chloride solution in presence or not of inhibitor ions at different concentrations.Varying the size of a cut-edge electrode coated on both sides, the effectiveness of these inhibitors was demonstrated detecting the microstructural corrosion triggering or its inhibition, by mapping surface pH. Combining these chemical probing with in situ observations it was possible to confirm the nature of the limiting steps controlling the competition between corrosion and passivation. These analyzes highlighted that to quantify this competition, the triggering of the microstructural corrosion represents a key factor which is not possible to mimic by the response of the solid solutions.The existence of a threshold value for the distance between the inhibitor source and the area to be passivated has been confirmed by simulating the mass transport of inhibiting species which appear to be dependent of the release rate of inhibitors
Le, Neal Jean-François. "Impact du packaging sur le comportement d'un capteur de pression piézorésistif pour application aéronautique." Thesis, Toulouse, INSA, 2011. http://www.theses.fr/2011ISAT0035.
Full textProtection of most of the pressure sensors working in harsh environment consist in oil filled metallic unit including the sensor die. In that case, pressure is applied on a metallic membrane moving the silicon membrane of the die across an incompressible fluid. The main drawbacks of the standard encapsulation are a complex fabrication process and most of all a sensor limitation in high temperatures. The topic of this PhD thesis is about wafer-level packaging (WLP) of the pressure sensor. The main idea is to integrate the die protection in the fabrication process at wafer level. Advantage is to obtain a collective protection fabrication reducing production costs. Moreover, a wafer-level encapsulation allows a possible reduction of sensor dimensions keeping it reliable. Removing intermediary elements allows also high temperature applications. Once encapsulation realised on the wafer, it is necessary to build the first-level packaging. First-level packaging makes the die usable in terms of electrical connection and dimensions. Wafer and first-levels are both packaging levels with important impact on the die behaviour.At wafer-level packaging, three wafer bonding technologies have been investigated: anodic bonding, Au-Si eutectic bonding and direct bonding. Anodic bonding is the most known technology to assemble a glass wafer with a silicon wafer. Eutectic bonding represents a promising technique to bond two silicon wafers allowing less CTE mismatch between wafers material and an easier micromachining of silicon instead of glass material. Direct bonding is also interesting to bond two silicon wafers, without using intermediary metallic layer but needing really clean surfaces to assemble. Anodic bonding process gave us the opportunity to deliver WLP sensors showing interest for high temperature applications. Silicon-Silicon technologies have been evaluated but did not give representative WLP sensors.At first-level packaging, the Flip-chip technology have been used for die attach. This technique consists in flipping the die and making the die attach by thermocompression with stud bumps on the die connection pads.Temperature cycling (-55°C to +125°C or more) have been realised on anodic WLP sensors. Accuracy total error of these WLP sensors is in the same order than standard Auxitrol sensors with digital compensation. the main advantage of the WLP sensors is a offset non-linearity in temperature divided by two. This characteristic is important in the case of analogical compensation that can resist to higher temperatures than digital compensation elements. In definitive, WLP sensors offer a good opportunity to have application over 200°C, prohibited at present with the presence of oil for standard Auxitrol sensor
Book chapters on the topic "Mesures sur tranche"
Monnet J., Fabre D., and Zielinski M. "Les “Terres Noires” du Dauphiné, un cas de roche très sensible aux variations climatiques." In Proceedings of the 15th European Conference on Soil Mechanics and Geotechnical Engineering. IOS Press, 2011. https://doi.org/10.3233/978-1-60750-801-4-369.
Full textDrozdowicz, Zbigniew. "L’Égoisme raisonnable des temps moderns." In The Paideia Archive: Twentieth World Congress of Philosophy, 33–38. Philosophy Documentation Center, 1998. http://dx.doi.org/10.5840/wcp20-paideia199811238.
Full textFarhat H. "Approche technique et contractuelle pour l'optimisation des injections d'un parking souterrain." In Proceedings of the 17th International Conference on Soil Mechanics and Geotechnical Engineering. IOS Press, 2009. https://doi.org/10.3233/978-1-60750-031-5-2645.
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