Academic literature on the topic 'Mechanical grinding'

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Journal articles on the topic "Mechanical grinding":

1

Rasuljon, Tojiev, Azizbek Isomiddinov, Bobojon Ortiqaliyev, and Boyqo‘Zi Khursanov. "INFLUENCE OF PREVIOUS MECHANICAL TREATMENTS ON MATERIAL GRINDING." International Journal of Advance Scientific Research 02, no. 11 (November 1, 2022): 35–43. http://dx.doi.org/10.37547/ijasr-02-11-06.

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Shiga, Shinya, Takayuki Norimatsu, Tsuyoshi Itsukaichi, Minoru Umemoto, and Isao Okane. "Mechanical Alloying and Mechanical Grinding of Al75Ni25." Journal of the Japan Society of Powder and Powder Metallurgy 38, no. 7 (1991): 976–80. http://dx.doi.org/10.2497/jjspm.38.976.

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HARA, Shigeo, and Toshio SAITOU. "Influence of Grinding Fluids on Grinding Cracks. Study on Grinding Cracks in Creep Feed Grinding." Journal of the Japan Society for Precision Engineering 59, no. 2 (1993): 252–56. http://dx.doi.org/10.2493/jjspe.59.252.

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Zhou, Fu Fang, Bao Gai Zhai, Zhuo Ran She, Yuan Ming Huang, and Chun Xu Pan. "Mechanical Grinding: An Effective Method to Control the Conductivity of p-Toluene Sulfonic Acid Doped Polypyrrole." Key Engineering Materials 407-408 (February 2009): 573–76. http://dx.doi.org/10.4028/www.scientific.net/kem.407-408.573.

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With four-probe and laser light scattering techniques, we have studied the dependencies of the conductivity and the particle sizes of p-toluene sulfonic acid doped polypyrrole on the mechanical grinding time. As the chemically synthesized polypyrrole was mechanically grounded in a mortar from 0 to 8 hours, its conductivity decreased from 607 to 10 S/m while and its particle size decreased from 27 to 4 m. If the mechanical grinding continued, the conductivity of the polymer was found to be up to 1680 S/m. Our results have demonstrated that mechanical grinding is an effective method to control the conductivity of the p-toluene sulfonic acid doped polypyrrole.
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INASAKI, Ichiro. "Grinding." Journal of the Japan Society for Precision Engineering 75, no. 1 (2009): 72–73. http://dx.doi.org/10.2493/jjspe.75.72.

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Kabanov, Vadim. "The Cement Mechanical Activation Effective Application Field Determination." Materials Science Forum 1011 (September 2020): 31–36. http://dx.doi.org/10.4028/www.scientific.net/msf.1011.31.

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Of all the known methods for increasing the cement activity, mechanical grinding is distinguished in the work. For mechanical grinding, technological characteristics of grinding in an electromagnetic field are established (mill - linear induction rotator, LIV). The value of the increment of activity is determined depending on its initial (initial) value. To determine the estimated value of the cement consumption, the methods provided by the state standard of the Russian Federation were used. The experiments, as well as the measurement of the compressive strength (R), were carried out in accordance with the GOST requirements. The cement mechanical grinding effective application field in electromagnetic field is determined by comparing the costs and savings. The costs are calculated as the cost of electricity needed for grinding. The savings are the cost of the established difference between the cement consumption for the initial activity of cement and the actual value, which is able to provide the concrete with a given design strength. The results describing the field of the cement mechanical grinding effective application are presented in tabular form and graphically. When determining the area of ​​ the mechanical grinding effective use, the conclusion that it is necessary to adjust the technological grinding regimes depending on the initial activity of the cement, as well as on the chemical composition of the clinker (manufacturer) was confirmed. The prospects for the research on mechanical grinding technology are associated with obtaining grinding regimes depending on the initial size and composition of the clinker. The area of ​​effective application of mechanical activation should be determined each time depending on the physical and mechanical cement properties.
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Rodríguez Torres, C. E., Francisco H. Sánchez, L. Mendoza-Zélis, and M. B. Fernández Van Raap. "Mechanical Grinding of Iron Borides." Materials Science Forum 179-181 (February 1995): 103–8. http://dx.doi.org/10.4028/www.scientific.net/msf.179-181.103.

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ZHOU, Li bo, Shinji KAWAI, Jun SHIMIZU, Hiroshi EDA, and Shunichiro KIMURA. "Research on Chemo-Mechanical Grinding." Proceedings of The Manufacturing & Machine Tool Conference 2002.4 (2002): 97–98. http://dx.doi.org/10.1299/jsmemmt.2002.4.97.

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Rodríguez Torres, C. E., F. H. Sánchez, and L. A. Mendoza Zélis. "Decomposition ofFe2B by mechanical grinding." Physical Review B 51, no. 18 (May 1, 1995): 12142–48. http://dx.doi.org/10.1103/physrevb.51.12142.

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Sun, Hao, and Yi Hua Feng. "The Research of Minimum Quantity Lubrication Mechanism in Grinding with Mechanical Mechanics." Applied Mechanics and Materials 252 (December 2012): 129–33. http://dx.doi.org/10.4028/www.scientific.net/amm.252.129.

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Effective cooling and lubricating is got by use a small amount of cutting fluid in MQL grinding. Compare grinding performance under various cooling lubrication, reasonable grinding temperature, lower grinding force, improved surface quality and extended wheel life is got in MQL grinding. The grinding performance of MQL grinding is also influenced by many factors, such as the nozzle shape, position, distance, and MQL flow rate.

Dissertations / Theses on the topic "Mechanical grinding":

1

Brown, Austin (Austin R. ). "Axially force limited grinding spindle for robotic grinding." Thesis, Massachusetts Institute of Technology, 2018. http://hdl.handle.net/1721.1/119966.

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Thesis: S.B., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2018.
Cataloged from PDF version of thesis.
Includes bibliographical references (page 35).
Grinding and Polishing of small parts is often easily performed by human hands, yet is challenging to automate. The grinding and polishing process is best done using a force-control scheme, which human hands perform naturally. Heavy robotic arms, which favor a position-control scheme, are difficult to control precisely, and trajectory errors can cause excessive grinding force which leads to burning of the part or destruction of the grinding wheel. Prior art of direct force control on a large robot arm requires the end-effector to have a 6-axis dynamometer, which is unwieldy, costly, and greatly limits the speed/precision of the process. We will discuss a new type of grinding spindle which is axially compliant, allowing the position-control robot arm to be used in a force-control nature. The spindle has a disjoint force-displacement curve, effectively operating in two modes: position-control mode at first, until a critical force is exceeded, when the spindle transitions into force-mode, keeping constant grinding force on the part though a certain range of travel. This limits the amount of force which can be imparted during grinding to a safe amount. The spindle is very simple and mechanically robust. We have built this hybrid position-force control spindle and tested it. The spindle was shown to perform correctly and successfully completed the test grind.
by Austin Brown.
S.B.
2

Curtis, David Thomas. "Point grinding and electrolytic point grinding of Udimet 720." Thesis, University of Birmingham, 2011. http://etheses.bham.ac.uk//id/eprint/2850/.

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The work within this Thesis is concerned with the manufacturing processes associated with the production of blade root mounting slots in aeroengine compressor and turbine discs. Typically slots are of dovetail or fir-tree geometry dependent on specific design requirements. The state of the art process across the industry is broaching however, despite achieving required geometrical tolerances and surface integrity for decades the process is not without its disadvantages. Primarily these include the inflexibility of the process, machine tool cost; size and cutting forces, complexity of tooling and set up and further the limited level of control of the process beyond tooling design. This has led to research into alternative processes across a range of conventional and non-conventional manufacturing techniques. Work presented here focuses on two key technology areas, namely point grinding and electrolytic point grinding. The former applies small diameter single layer grinding wheels on a high speed machining centre with spindle capability in the region of 60,000rpm. Target geometry was a complex fir-tree root form requiring dimensional control to within +/- 5um and a surface integrity in line with critical aerospace components. The later process investigated the unification of point grinding and electrochemical machining on a vertical machining centre to assess process performance across a range of variables.
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Levert, Joseph Albert. "Interface mechanics of chemical mechanical polishing for integrated circuit planarization." Diss., Georgia Institute of Technology, 1997. http://hdl.handle.net/1853/15914.

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Svensson, Dennis, and Svärd Tobias Falk. "Mechanical dry grinding process of saw chain." Thesis, Högskolan i Halmstad, Akademin för ekonomi, teknik och naturvetenskap, 2019. http://urn.kb.se/resolve?urn=urn:nbn:se:hh:diva-39927.

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The cutting links on chainsaws needs to be sharpened regularly to retain its sharpness. The most effective way is to use a machine wheel grinder. However, due to high friction there is a high risk of tempering the steel and damaging the sustainability to wear, resulting in a dull cutting edge. In order to develop a grinding method that produces a good result every time, a series of parameters were tested in order to determine which combination of these generated the best grinding results. With all parameters established the results shows that the attributes of each grinding wheel are the main parameter controlling the grinding result. This project investigates the attributes of different grinding wheels and their impact on grinding results. By comparing the energy each grinding wheel uses to perform the same amount of work, each grinding wheels suitability is rated based on its performance.   The calculations and the results from the analyses and tests show which of the grinding wheels performed the work with the lowest amount of increased energy.
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Baniszewski, Beth (Beth Ellen). "An environmental impact analysis of grinding." Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/32880.

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Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.
Includes bibliographical references (leaves 39-40).
This thesis was intended to investigate the environmental impact of grinding in the United States manufacturing industry. Grinding is an ideal method for producing parts with a fine surface finish and high dimensional accuracy and for shaping hard or brittle workpieces. There are a wide variety of different types of grinding machines, each with different applications and slightly different energy requirements. Workpieces are generally flooded with a stream of coolant while being ground or placed in a spray of coolant mist. Coolant recycling systems are used to filter ground off chips out of coolant and to remove foreign oils and bacteria which pose health hazards. Oil mist collectors both clean mist coolant and prevent the toxic coolant from being inhaled by machinists. In total, 63 *10¹⁵ joules of energy are consumed per year by grinding in manufacturing, 57% of which is directly used in material removal. A total of 1.5*10¹⁰ pounds of scrap chips, spent grinding wheels, and used filters are produced each year as a result of grinding, over 99% of that being scrap chips. About 2.3 million gallons of fluids per year of grinding fluids are incinerated. Grinding creates a significant environmental footprint, creating a need for methods to reduce energy use in grinding and for ways to recycle solid waste that would otherwise be sent to landfills or incinerated.
by Beth Baniszewski.
S.B.
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Zhang, Xiaohong. "Chemical mechanical polishing and grinding of silicon wafers." Diss., Manhattan, Kan. : Kansas State University, 2007. http://hdl.handle.net/2097/475.

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Brown, Matthew Lasché. "Intelligent robot grinding : planning, optimization, and control." Thesis, Massachusetts Institute of Technology, 1988. http://hdl.handle.net/1721.1/14552.

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Ebbrell, Stephen. "Process requirements for precision grinding." Thesis, Liverpool John Moores University, 2003. http://researchonline.ljmu.ac.uk/5633/.

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Scagnetti, Paul Albert. "Design of an industrial precision ceramic grinding machine." Thesis, Massachusetts Institute of Technology, 1996. http://hdl.handle.net/1721.1/10918.

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Shan, Lei. "Mechanical interactions at the interface of chemical mechanical polishing." Diss., Georgia Institute of Technology, 2000. http://hdl.handle.net/1853/17774.

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Books on the topic "Mechanical grinding":

1

Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials. New York: J. Wiley, 1997.

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Milton C. Shaw Grinding Symposium (1985 Miami Beach, Fla.). Milton C. Shaw Grinding Symposium: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Miami Beach, Florida, November 17-22, 1985. New York, N.Y: American Society of Mechanical Engineers, 1985.

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Dr, Juhász Z. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Budapest: Akadémiai Kiadó, 1990.

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Z, Juhász. Mechanical activation of minerals by grinding: Pulverizing and morphology of particles. Chichester: Ellis Horwood, 1990.

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Samuels, Leonard Ernest. Metallographic polishing by mechanical methods. 4th ed. Materials Park, OH: ASM International, 2003.

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American Society of Mechanical Engineers. Winter Meeting. Mechanics of deburring and surface finishing processes: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: American Society of Mechanical Engineers, 1989.

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1941-, Malkin S., Kovach Joseph A, American Society of Mechanical Engineers. Winter Meeting, and American Society of Mechanical Engineers. Production Engineering Division., eds. Grinding fundamentals and applications: Presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, San Francisco, California, December 10-15, 1989. New York, N.Y: The Society, 1989.

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Oliver, Michael R. Chemical-Mechanical Planarization of Semiconductor Materials. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004.

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Chemical-Mechanical, Polishing 2000 (2000 San Francisco Calif ). Chemical-Mechanical Polishing 2000: Fundamentals and materials issues : symposium held April 26-27, 2000, San Francisco, California, U.S.A. Warrendale, Pa: Materials Research Society, 2001.

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International, Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia Pa ). Chemical mechanical planarization V: Proceedings of the International Symposium. Pennington, NJ: Electrochemical Society, Inc., 2002.

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Book chapters on the topic "Mechanical grinding":

1

Larshin, Vasily, Natalia Lishchenko, Oleksandr Lysyi, and Sergey Uminsky. "Gear Grinding Stock Alignment in Advance of Grinding." In Lecture Notes in Mechanical Engineering, 170–79. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-91327-4_17.

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Zmich, Robert, and Carsten Heinzel. "3D-Printed MWF Nozzles for Improved Energy Efficiency and Performance During Grinding." In Lecture Notes in Mechanical Engineering, 3–11. Cham: Springer International Publishing, 2023. http://dx.doi.org/10.1007/978-3-031-28839-5_1.

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AbstractParticularly during grinding of metal workpieces, a high energy consumption is required during the main process times, so that the resulting energy costs represent a significant amount of the total operating costs of the machine tool. In this context, the supply of metal working fluids (MWF) during the grinding process is often associated with a high energy consumption, but the MWF supply strategy (MWF flow rate, MWF nozzle, control and dimensioning of the MWF supply pumps) can significantly influence the energy efficiency of such processes. In the scope of this work, additive manufacturing was used to produce fluid supply nozzles adapted to the respective grinding process. In this work, it was shown that by using a flow-optimized nozzle the required power of the MWF supply pump can be significantly reduced, allowing to make the grinding process more efficient in terms of the energy required.
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Larshin, Vasily, and Natalia Lishchenko. "Grinding Temperature Penetration Depth Study." In Lecture Notes in Mechanical Engineering, 168–76. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-40724-7_17.

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Lishchenko, Natalia, and Vasily Larshin. "Temperature Field Analysis in Grinding." In Lecture Notes in Mechanical Engineering, 199–208. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-22365-6_20.

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Larshin, Vasily, Olga Babiychuk, Oleksandr Lysyi, and Sergey Uminsky. "Discontinuous Generating Gear Grinding Optimization." In Lecture Notes in Mechanical Engineering, 263–72. Cham: Springer International Publishing, 2022. http://dx.doi.org/10.1007/978-3-031-06025-0_26.

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Bezpalova, Ala, Vladimir Lebedev, Tatiana Chumachenko, Olga Frolenkova, and Nataliya Klymenko. "Methods for Measuring Grinding Temperatures." In Lecture Notes in Mechanical Engineering, 141–50. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-91327-4_14.

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Lishchenko, N. V., V. P. Larshin, and I. V. Marchuk. "Forced Cooling Modeling in Grinding." In Lecture Notes in Mechanical Engineering, 1140–49. Cham: Springer International Publishing, 2021. http://dx.doi.org/10.1007/978-3-030-54817-9_133.

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Ben Moussa, Naoufel, Nasreddine Touati, and Nabil Ben Fredj. "Analysis of Surfaces Characteristics Stability in Grinding Process." In Advances in Mechanical Engineering and Mechanics, 221–27. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-19781-0_27.

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Riabchenko, Sergey, Anatoliy Krivosheja, Vitaliy Burykin, Artem Najdenko, and Mikhail Bandurenko. "Gear Grinding by Superhard Materials Wheels." In Lecture Notes in Mechanical Engineering, 273–80. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-40724-7_28.

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Lishchenko, N. V., and V. P. Larshin. "Gear-Grinding Temperature Modeling and Simulation." In Lecture Notes in Mechanical Engineering, 289–97. Cham: Springer International Publishing, 2019. http://dx.doi.org/10.1007/978-3-030-22063-1_32.

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Conference papers on the topic "Mechanical grinding":

1

Tawakoli, Taghi, and Alireza Vesali. "Dynamic Behavior of Different Grinding Wheel Hub Material in High Efficiency Deep Grinding (HEDG)." In ASME 2012 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2012. http://dx.doi.org/10.1115/imece2012-86207.

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Machining accuracy and productivity of the grinding process can be mainly affected by the dynamic behavior of the different components participating in grinding process, e.g. grinding wheel, grinding machine and workpiece. Amongst others, design and material of the grinding wheels play a significant role in grinding performance. Therefore, controlling the dynamic behavior of the grinding wheel through an in-process monitoring and a post-process measurement seems an appropriate approach to optimize the grinding process, especially in high efficiency deep grinding (HEDG). This paper presents the results of the grinding tests, which were conducted using two different vitrified bonded CBN wheels — one with Carbon fiber-reinforced polymer (CFRP) hub body and other one with steel hub body. The experiments have been carried out using a new in-process measurement system which allows the detection of the wheel vibration amplitudes and frequencies in different location of the wheel body during grinding. It was proved that the dynamic behavior of grinding wheels can affect the chip removal mechanism. The experimental investigation showed that grinding parameters and coolant supply conditions in HEDG process can affect the dynamic behavior of the grindings wheels. Furthermore, using CFRP as the hub material leads to a reduction in the wheel vibration and generated amplitudes.
2

Pei, Z. J., and Alan Strasbaugh. "Fine Grinding of Silicon Wafers: Grinding Marks." In ASME 2002 International Mechanical Engineering Congress and Exposition. ASMEDC, 2002. http://dx.doi.org/10.1115/imece2002-33458.

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In order to ensure high quality chips with high yield, the base material, semiconductor wafers (over 90% are silicon), must have superior quality. It is critically important to develop new manufacturing processes that allow silicon wafer manufacturers to produce high quality wafers at a reasonably low cost. A newly patented technology—fine grinding of etched silicon wafers—has great potential to manufacture very flat silicon wafers more cost-effectively. This paper presents an investigation of grinding marks in fine grinding. The investigation covers (1) nature of grinding marks, (2) factors that have effects on grinding marks, and (3) approaches to reduce grinding marks. Varying chuck speed during grinding operation is shown to be a very effective approach to reduce grinding marks. Conclusions from this study have direct impacts to the silicon wafer industry.
3

Xiaolin, Yu. "Finite element analysis of influence of grinding parameters on grinding force." In Mechanical Engineering and Information Technology (EMEIT). IEEE, 2011. http://dx.doi.org/10.1109/emeit.2011.6024070.

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Jingen, Huang, and Ying Fuqiang. "Grinding Force and Feed in Grinding the Spring End." In 1st International Conference on Mechanical Engineering and Material Science). Paris, France: Atlantis Press, 2012. http://dx.doi.org/10.2991/mems.2012.147.

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Xu, Li, and Shubo Liu. "Grinding engineering ceramics research." In Mechanical Engineering and Information Technology (EMEIT). IEEE, 2011. http://dx.doi.org/10.1109/emeit.2011.6023365.

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Marcel Yuzo Kondo, MANOEL CLEBER DE SAMPAIO ALVES, Eduardo Carlos Bianchi, Cleverson Pinheiro, HAMILTON JOSÉ DE MELLO, José Vitor Candido de Souza, and Paulo Roberto de Aguiar. "AISI 4340 STEEL GRINDING WITH GEOMETRY INTERRUPTED BY CONVENTIONAL GRINDING WHEEL." In 23rd ABCM International Congress of Mechanical Engineering. Rio de Janeiro, Brazil: ABCM Brazilian Society of Mechanical Sciences and Engineering, 2015. http://dx.doi.org/10.20906/cps/cob-2015-0133.

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Tawakoli, Taghi, Abdolreza Rasifard, and Alireza Vesali. "Effect of the Grinding Oil Type on CBN Grinding Wheels Performance." In ASME 2009 International Mechanical Engineering Congress and Exposition. ASMEDC, 2009. http://dx.doi.org/10.1115/imece2009-12234.

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The efficiency of the grinding process highly depends on the coolant lubricant used. In grinding with CBN grinding wheels grinding oils are used increasingly. In the last decade new grinding oils based on different oil types are brought into the market, whose effect on the CBN grinding wheels performance until now not sufficiently been investigated. The Institute of Grinding and Precision Technology (KSF) investigated the influence of four different grinding oils on the performance of vitrified CBN grinding while grinding of 100Cr6 (M.-No. 1.3505), which is a heat-treatable steel with a very good grindability, and Nimonic A80, which is a difficult to grind heat-resistance superalloy. The obtained results show that the performance of the vitrified CBN grinding wheels—while using grinding oil as coolant lubricant—regarding the quality of the work piece surface, the grinding forces as well as the wear of the grinding wheel, highly depend on the viscosity of the grinding oil. Moreover, the results show that the surface quality and the grinding forces while using different grinding oils depend significantly on the work piece material.
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SLÍVA, Aleš, and Robert BRÁZDA. "DESIGN OF NEW Grinding device for Homogenization of Mechanical Grinding METALLURGY Process." In METAL 2020. TANGER Ltd., 2020. http://dx.doi.org/10.37904/metal.2020.3615.

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Li, Jun-chen, Wen-hu Wang, Rui-song Jiang, Xiao-fen Liu, Huang Bo, and Cheng-cheng Jin. "Investigation of Grinding Force and Surface Integrity of IC10 in Creep Feed Grinding." In ASME 2020 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2020. http://dx.doi.org/10.1115/imece2020-23529.

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Abstract The IC10 superalloy material is one of the most important materials for aero-engine turbine blade due to its excellent performances. However, it is difficult to be machined because of its special properties such as terrible tool wear and low machined efficiency. The creep feed grinding is widely used in machining IC10 superalloy due to the advance in reducing tool wear, improving material removal rate and surface quality. The creep feed grinding is a promising machining process with the advantages of high material removal rate due to large cutting depth, long cutting arc and very slow workpiece, and its predominant features might have significant influence on the grinding force and surface quality for the workpiece. Hence, it is of great importance to study the grinding force and surface integrity in creep feed grinding IC10 superalloy. In this paper, a series of orthogonal experiments have been carried out and the effects of grinding parameters on the grinding force and the surface roughness are analyzed. The topographies and defects of the machined surface were observed and analyzed using SEM. The results of the experiments show that the tangential force is decreased with the workpiece speed increasing. However, there is no significant change in tangential force with the increasing of grinding depth and wheel speed. The normal force is decreased with the workpiece speed increasing when the workpiece speed is less than 150 mm/min, but when the workpiece speed is more than 150 mm/min the normal force is increased tardily. Moreover, the normal force is increased sharply with the increase of grinding depth and is increased slowly with the increase of wheel speed. In general, the surface roughness is increased with workpiece speed and grinding depth increasing, while the trend of increase corresponding that of workpiece speed is more evident. The value of the surface roughness is decreased with wheel speed increasing. And it is found out that the main defect is burning of the IC10 superalloy material in creep feed grinding by energy spectrum analysis of some typical topography in this study.
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de Martini Fernandes, Lucas, José Claudio Lopes, Roberta Silveira Volpato, Paulo Aguiar, Anselmo Diniz, Hamilton José de Mello, and Eduardo Carlos Bianchi. "Comparative analysis of two CBN grinding wheels performance in nodular cast iron plunge grinding." In 24th ABCM International Congress of Mechanical Engineering. ABCM, 2017. http://dx.doi.org/10.26678/abcm.cobem2017.cob17-2789.

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Reports on the topic "Mechanical grinding":

1

Suratwala, T., P. Miller, J. Menapace, L. Wong, R. Steele, M. Feit, P. Davis, and C. Walmer. FY07 LDRD Final Report A Fracture Mechanics and Tribology Approach to Understanding Subsurface Damage on Fused Silica during Grinding and Polishing. Office of Scientific and Technical Information (OSTI), February 2008. http://dx.doi.org/10.2172/926036.

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