Relevant bibliographies by topics / Low temperature processing

Academic literature on the topic 'Low temperature processing'

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Published: 6 September 2023

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Journal articles on the topic "Low temperature processing"

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Admane, Darshana C., and Sneha V. Karadbhajne. "Advances in Low Temperature Processing." International Journal of Engineering Trends and Technology 67, no. 10 (October 25, 2019): 100–112. http://dx.doi.org/10.14445/22315381/ijett-v67i10p219.

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TAKAI, Rikuo. "Foods Processing in Low Temperature." Journal of the Society of Mechanical Engineers 99, no. 927 (1996): 103–6. http://dx.doi.org/10.1299/jsmemag.99.927_103.

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Lill, Thorsten, Andreas Fischer, Ivan Berry, and Meihua Shen. "Low Temperature Semiconductor Device Processing." ECS Meeting Abstracts MA2022-02, no. 18 (October 9, 2022): 866. http://dx.doi.org/10.1149/ma2022-0218866mtgabs.

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In the manufacturing of integrated circuits, etching and deposition processes with and without plasma are widely used. Except for physical processes such as Physical Vapor Deposition and Ion Beam Etching, these processes leverage the adsorption of reactive neutrals to enable chemical reactions at the wafer surface. In this paper, we will investigate the fundamentals and applicability of low temperatures to stimulate physisorption of neutrals. Among the points of interest for this approach are the use of less reactive gases, higher fluxes to the surface, new transport mechanisms into high aspect ratio features, and 3D effects thanks to condensation in small features. We will discuss temperature and pressure ranges for relevant material and pre-cursor gas combinations and means to initiate the deposition and etching reactions. An overview of experimental results from our research and the literature will be presented.
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Mandrov, G. A., V. I. Klishin, and V. A. Fedorin. "Low-temperature processing of Volga fuel shale." Coke and Chemistry 57, no. 1 (January 2014): 30–32. http://dx.doi.org/10.3103/s1068364x14010062.

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Xiao, S. Q., S. Xu, and K. Ostrikov. "Low-temperature plasma processing for Si photovoltaics." Materials Science and Engineering: R: Reports 78 (April 2014): 1–29. http://dx.doi.org/10.1016/j.mser.2014.01.002.

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Lim, Kwang-Young, Young-Wook Kim, and In-Hyuck Song. "Low-temperature processing of porous SiC ceramics." Journal of Materials Science 48, no. 5 (October 26, 2012): 1973–79. http://dx.doi.org/10.1007/s10853-012-6963-4.

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Nayak, Yougojoti, Raghunath Rana, Swadesh Pratihar, and Santanu Bhattacharyya. "Low-Temperature Processing of Dense HydroxyapatiteZirconia Composites." International Journal of Applied Ceramic Technology 5, no. 1 (January 2008): 29–36. http://dx.doi.org/10.1111/j.1744-7402.2008.02180.x.

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Alzanki, T., R. Gwilliam, N. G. Emerson, and B. J. Sealy. "Low-temperature processing of antimony-implanted silicon." Journal of Electronic Materials 33, no. 7 (July 2004): 767–69. http://dx.doi.org/10.1007/s11664-004-0238-z.

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Mathur, P., A. Thakur, and M. Singh. "Low temperature processing of Mn–Zn nanoferrites." Journal of Materials Science 42, no. 19 (October 2007): 8189–92. http://dx.doi.org/10.1007/s10853-007-1690-y.

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Ewais, Emad M. M., Yasser M. Z. Ahmed, Ahmed A. M. El-Amir, and Hamdy El-Didamony. "Cement kiln dust/rice husk ash as a low temperature route for wollastonite processing." Epitoanyag - Journal of Silicate Based and Composite Materials 66, no. 3 (2014): 69–80. http://dx.doi.org/10.14382/epitoanyag-jsbcm.2014.14.

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Dissertations / Theses on the topic "Low temperature processing"

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Mahanama, G. D. K. "Low temperature processing of crystalline silicon solar cells." Thesis, London South Bank University, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.435235.

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Briseno, Murguia Silvia. "Processing of NiTi Shape Memory Alloys through Low Pressure and Low Temperature Hydrogen Charging." Thesis, University of North Texas, 2018. https://digital.library.unt.edu/ark:/67531/metadc1157656/.

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Many industries including the medical, aerospace, and automobile industries have increasingly adopted the use of shape memory alloys (SMAs) for a plethora of applications due to their unique thermomechanical properties. From the commercially available SMAs in the market, binary NiTi SMAs have shown the most desirable properties. However, SMA properties can be significantly affected by the fabrication process. One of the most familiar applications of NiTi SMAs is in the design of actuating devices where the shape memory effect properties are highly advantageous. Spring NiTi SMA actuators are among the most commonly used and are generally made by torsion loading a straight wire. Consequently, stress concentrations are formed causing a reduction in recovery force. Other methods for producing springs and other NiTi SMA components is the fast emerging manufacturing method of additive manufacturing (AM). AM often uses metal powders to produce the near-net shape components. A major challenge for SMAs, in particular, is their well-known composition sensitivity. Therefore, it is critical to control composition in NiTi SMAs. In this thesis, a novel method for processing NiTi SMAs for pre-alloyed NiTi SMA powders and springs is presented. A low pressure and low temperature hydriding-pulverization-dehydriding method is used for preparing the pre-alloyed NiTi SMA powders with well-controlled compositions, size, and size distributions from wires. By hydrogen charging as-drawn martensitic NiTi SMA wires in a heated H3PO4 solution, pulverizing, and dehydriding, pre-alloyed NiTi powders of various well-controlled sizes are produced. In addition, a low pressure and low temperature hydriding-dehydriding method is used for producing NiTi SMA helixes from wires. The helix pattern in the pre-alloyed NiTi SMA wires was obtained by hydrogen charging NiTi SMA 500 μm diameter wires at different time intervals, followed by dehydriding to remove the hydrogen. The wires, powders, and resulting helixes were characterized using scanning electron microscopy (SEM), differential scanning calorimetry (DSC), and x-ray diffraction (XRD). The relationship between the wire diameter, powder particle size, and helix geometry as a function of hydrogen charging time is investigated. Lastly, the recovery behavior due to the shape memory effect is also investigated after dehydriding.
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Juodawlkis, Paul W. "Low-temperature-grown InGaAs quantum wells for optical device applications." Diss., Georgia Institute of Technology, 1999. http://hdl.handle.net/1853/13752.

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González-León, Juan A. (Juan Antonio). "Low temperature processing of baroplastic core-shell nanoparticles and block copolymers." Thesis, Massachusetts Institute of Technology, 2005. http://hdl.handle.net/1721.1/36202.

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Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, February 2006.
Includes bibliographical references (p. 131-144).
Baroplastics are nanophase polymeric materials comprised of two components that can miscibilize under pressure thereby facilitating flow. The possibility of processing these materials at low temperatures was the main focus of this work. Block copolymer baroplastics comprised of a low Tg and a high Tg component that microphase separate, such as polystyrene-block-poly(butyl acrylate) (PS-b-PBA) and polystyrene-b-poly(2-ethyl hexylacrylate) (PS-b-PEHA), were synthesized by ATRP and processed at reduced temperatures by compression molding. The resulting processed specimens were clear and well-defined solid objects. Structural characterization studies on the processed baroplastics showed that the mixing between components during processing is incomplete and distinct hard and soft domains are present even after multiple processing cycles. This suggests that the processing is of a semi-solid nature, where the rigid PS domains are mobilized by the low Tg component. Processing of a control sample exhibiting pressure-induced demixing, polystyrene-block-poly(lauryl methacrylate) (PS-b-PLMA), yielded incompletely processed objects under the same processing conditions and inferior mechanical properties to its acrylate counterparts.
(cont.) Low temperature processing of baroplastics and the proposed semi-solid processing mechanism were further demonstrated with the study of core-shell nanoparticles, where the soft homopolymer (PBA or PEHA) formed the core surrounded by a rigid PS shell. These materials could also be processed at reduced temperatures, displaying a wide range of mechanical properties as a function of their composition, going from tough and rigid materials to soft and rubbery ones comparable to commercial thermoplastic elastomers. Low temperature processing of baroplastics opens a new route to polymer processing, where energy for heating and cooling could be saved, processing times could be reduced and materials with high sensitivity to temperature could be processed.
by Juan A González-León.
Ph.D.
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Young, Avery W. "A Study on NiTiSn Low-Temperature Shape Memory Alloys and the Processing of NiTiHf High-Temperature Shape Memory Alloys." Thesis, University of North Texas, 2018. https://digital.library.unt.edu/ark:/67531/metadc1157642/.

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Shape memory alloys (SMAs) operating as solid-state actuators pose economic and environmental benefits to the aerospace industry due to their lightweight, compact design, which provides potential for reducing fuel emissions and overall operating cost in aeronautical equipment. Despite wide applicability, the implementation of SMA technology into aerospace-related actuator applications is hindered by harsh environmental conditions, which necessitate extremely high or low transformation temperatures. The versatility of the NiTi-based SMA system shows potential for meeting these demanding material constraints, since transformation temperatures in NiTi can be significantly raised or lowered with ternary alloying elements and/or Ni:Ti ratio adjustments. In this thesis, the expansive transformation capabilities of the NiTi-based SMA system are demonstrated with a low and high-temperature NiTi-based SMA; each encompassing different stages of the SMA development process. First, exploratory work on the NiTiSn SMA system is presented. The viability of NiTiSn alloys as low-temperature SMAs (LTSMAs) was investigated over the course of five alloy heats. The site preference of Sn in near-equiatomic NiTi was examined along with the effects of solution annealing, Ni:Ti ratio adjustments, and precipitation strengthening on the thermomechanical properties of NiTiSn LTSMAs. Second, the thermomechanical processability of NiTiHf high-temperature SMA (HTSMA) wires is presented. The evolution of various microstructural features (grain size reduction, oxide growth, and nano-precipitation) were observed at incremental stages of the hot rolling process and linked to the thermal and mechanical responses of respective HTSMA rods/wires. This work was carried out in an effort to optimize the rolling/drawing process for NiTiHf HTSMAs.
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Garlapati, Suresh [Verfasser], Horst [Akademischer Betreuer] Hahn, and Heinz von [Akademischer Betreuer] Seggern. "Low Temperature Processing of Printed Oxide Transistors / Suresh Garlapati ; Horst Hahn, Heinz von Seggern." Darmstadt : Universitäts- und Landesbibliothek Darmstadt, 2017. http://d-nb.info/1126115932/34.

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Terry, Mason L. Photovoltaic &amp Renewable Energy Engineering UNSW. "Post???deposition processing of polycrystalline silicon thin???film solar cells on low???temperature glass superstrates." Awarded by:University of New South Wales. Photovoltaic and Renewable Energy Engineering, 2007. http://handle.unsw.edu.au/1959.4/30498.

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In polycrystalline silicon (pc-Si) thin-film solar cells, defect passivation is critical to device performance. Isoelectronic or covalently bonded impurities, hydrogenic, extended defects and defects with localized levels in the bandgap (deep level defects) are typically introduced during the fabrication of, and/or are inherent to, pc-Si thin-film solar cells. These defects dramatically affect minority carrier lifetimes. Removing and/or passivating these defects is required to maximize minority carrier lifetimes and is typically done through thermal annealing and passivation techniques. For pc-Si thin-film solar cells on low temperature glass superstrates, rapid thermal annealing (RTA) and hydrogen plasma passivation (hydrogenation) are powerful techniques to achieve effective removal and passivation of these defects. In this thesis, three silicon thin-film solar cells structures on low-temperature glass are subjected to variations in RTA high-temperature plateaus, RTA plateau times, and hydrogen plasma passivation parameters. These solar cells are referred to as ALICIA, EVA and PLASMA. By varying the RTA plateau temperature and time at plateau, the trade-off between extensive dopant diffusion and maximum defect removal is optimized. To reduce the density of point defects and to electrically activate the majority of dopants, an RTA process is shown to be essential. For all three of the thin-film solar cell structures investigated in this thesis, a shorter, higher-temperature RTA process provides the best open-circuit voltage (Voc). Extensive RTA plateau times cause excessive dopant smearing, increasing n = 2 recombination and shunt resistance losses. Hydrogenation is shown to be an essential step to achieve maximum device performance by `healing' the defects inherent to pc-Si thin-film solar cells. If the hydrogen concentration is about 1-2 times the density of oxygen in the cells as measured by secondary ion mass spectroscopy (SIMS), the cells seem to respond best to hydrogenation, with good resultant Voc and short-circuit for all cells investigated in this thesis. The effect of hydrogen passivation on the Voc is spectacular, typically increasing it by a factor of 2 to 3.5. Hydrogen de-bonding from repeated thermal treatments at increasing temperature provides a deeper understanding of what defects exist and the nature of the defects that limit the cell voltage. The variation in RTA and hydrogenation process parameters produces significant empirical insight into the effectiveness of RTA processes for point defect removal, dopant activation, point defect and grain boundary passivation, and impurity passivation. SIMS measurements are used to determine the impurities present in the cells' bulk and the amount of hydrogen available to passivate defects. From the results presented it appears that pc-Si thin-film solar cells on low-temperature glass are a promising, and potentially lower-cost, alternative to Si wafer based cells.
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Mandal, L. "High performance photo-detectors and field effect transistors based on low temperature solution processing routes." Thesis(Ph.D.), CSIR-National Chemical Laboratory, Pune, 2013. http://dspace.ncl.res.in:8080/xmlui/handle/20.500.12252/2200.

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Zhang, Xinge. "Influence of architecture, materials, and processing on low temperature solid oxide fuel cell (LT-SOFC) performance." Thesis, University of British Columbia, 2009. http://hdl.handle.net/2429/11262.

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The goal of this dissertation is to develop low temperature solid oxide fuel cells (SOFCs) through the understanding of cell material and component fabrication technology. A typical anode supported thin electrolyte cell structure has been adopted, fabricated by wet ceramic processing and co-firing. Sm₀.₂Ce₀.₈O₁.₉ (SDC) electrolyte cells supported by Ni-Y₀.₁₀Zr₀.₈₄O₁₉₂ (YSZ) cermet substrates, with Sm₀.₅Sr₀.₅CoO₃ cathode and Ni-SDC anode, demonstrate a high performance of 0.89 W cm⁻² at 600°C. A designed experiment quantitatively reveals the internal shorting problem due to the mixed ionic and electronic conductivity of the SDC electrolyte. The internal shorting current density of the thin SDC cell reaches 0.85 A cm⁻² at 600°C under open circuit voltage (OCV) conditions, which limits the fuel utilization to less than 65% and electrical efficiency to below 25%. In order to eliminate the internal shorting problem, a unique bi-layered electrolyte structure has been developed by adding a thin zirconia based electrolyte layer as an electronic blocking layer. A YSZ/SDC bi-layered electrolyte cell prepared by wet ceramic processing and co-firing generated 0.34 W cm⁻² peak power density at 650°C, with an open circuit voltage (OCV) of over 1.0V. Further improvement of the cell performance was achieved by using a Sc₀.₂Ce₀.₀₁Zr₀.₇₉O₁.₉ (SSZ)/SDC bi-layered electrolyte. The cell reached 0.50W cm⁻² at 650°C. Electrochemical impedance analysis reveals that the ionic resistance of the bi-layered electrolyte prepared by co-firing is one order of magnitude higher than the theoretical value, indicating that interaction between the two electrolytes during the co-firing is a main limit. In order to eliminate the bi-layered electrolyte interaction, pulsed laser deposition (PLD) technology is applied for the bi-layered electrolyte cell fabrication. The cell fabricated by PLD reaches power densities of 0.95 W cm⁻² at 600°C, and 1.37 W cm⁻² at 650°C with open circuit voltage (OCV) values larger than 1.02 V, the highest performance ever reported in the literature. Nonetheless, the bi-layered electrolyte cells exhibit relatively high degradation rates. A study on the degradation of bi-layered electrolyte cells indicates that the cathode degradation is the main contributor. Therefore, an optimization of cathode compositions and fabrication conditions is important to improve the cell stability.
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Zheng, Hanguang. "Processing and Properties of Die-attachment on Copper Surface by Low-temperature Sintering of Nanosilver Paste." Thesis, Virginia Tech, 2012. http://hdl.handle.net/10919/42658.

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As the first level interconnection in electronic packages, chip attachment plays a key role in the total packaging process. Sintered nanosilver paste may be used as a lead-free alternative to solder for die-attachment at sintering temperature below 300 °C without applying any pressure. Typically, the substrate, such as direct bond copper (DBC) substrates, has surface metallization such as silver or gold to protect the copper surface from oxidation during the sintering process. This study focused on developing techniques for die-attachment on pure copper surface by low-temperature sintering of nanosilver paste. One of the difficulties lies in the need for oxygen to burn off the organics in the paste during sintering. However, the copper surface would oxidize, preventing the formation of a strong bond between sintered silver and copper substrate. Two approaches were investigated to develop a feasible technique for attachment. The first approach was to reduce air pressure as a means of varying the oxygen partial pressure and the second approach was to introduce inert gas to control the sintering atmosphere. For the first method, die-shear tests showed that increasing the oxygen partial pressure (PO2) from 0.04 atm to 0.14 atm caused the bonding strength to increase but eventually decline at higher partial pressure. Scanning electron microscopy (SEM) imaging and energy dispersive spectroscopy (EDS) analysis showed that there was insufficient oxygen for complete organics burnout at low PO2 condition, while the copper surface was heavily oxidized at high PO2 levels, thus preventing strong bonding. A maximum bonding strength of about average 8 MPa was attained at about PO2 = 0.08 atm. With the second method, the die-shear strength showed a significant increase to about 24 MPa by adjusting the oxygen exposure temperature and time during sintering. The processing conditions necessary for bonding large-area chips (6 mm à 6 mm) directly on pure copper surface by sintering nanosilver paste was also investigated. A double-print process with an applied sintering pressure of less than 5 MPa was developed. Die-shear test of the attached chips showed an average bonding strength of over 40 MPa at applied pressure of 3 MPa and over 77 MPa under 12 MPa sintering pressure. SEM imaging of the failure surface showed a much denser microstructure of sintered silver layer when pressure was applied. X-ray imaging showed a bond layer almost free of voids. Because the samples were sintered in air, the DBC surface showed some oxidation. Wirebondability test of the oxidized surface was performed with 250 μm-diameter aluminum wires wedge-bonded at different locations on the oxidized surface. Pull test results of the bonded wires showed a minimum pull-strength of 400 gram-force, exceeding the minimum of 100-gf required by the IPC-TM-650 test standard.
Master of Science
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Books on the topic "Low temperature processing"

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Symposium on Reduced Temperature Processing for VLSI (1985 Las Vegas, Nev.). Proceedings of the Symposium on Reduced Temperature Processing for VLSI. Edited by Reif Rafael, Srinivasan G. R, Electrochemical Society Electronics Division, and Electrochemical Society. Dielectrics and Insulation Division. Pennington, NJ (10 S. Main St., Pennington 085334-2896): Electrochemical Society, 1986.

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Dharma, Rao P., and Alaska Science and Technology Foundation., eds. Characterization of coal products from high temperature processing of Usibelli low-rank coal: Report to Alaska Science and Technology Foundation. [Fairbanks: Mineral Industry Research Laboratory, University of Alaska Fairbanks, 1991.

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Jafari, Seid Mahdi. Low-Temperature Processing of Food Products. Elsevier Science & Technology, 2021.

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Friction Stir Processing for Enhanced Low Temperature Formability. Elsevier, 2014. http://dx.doi.org/10.1016/c2013-0-09874-x.

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Friction Stir Processing For Enhanced Low Temperature Formability. Elsevier Science & Technology, 2014.

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Braton, Norman R. Cryogenic Recycling and Processing. Taylor & Francis Group, 2018.

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Braton, Norman R. Cryogenic Recycling and Processing. Taylor & Francis Group, 2018.

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Braton, Norman R. Cryogenic Recycling and Processing. Taylor & Francis Group, 2018.

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Braton, Norman R. Cryogenic Recycling and Processing. Taylor & Francis Group, 2018.

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Jafari, Seid Mahdi. Low-Temperature Processing of Food Products : Volume 7: Unit Operations and Processing Equipment in the Food Industry. Woodhead Publishing, 2023.

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Book chapters on the topic "Low temperature processing"

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Glinšek, Sebastjan, Barbara Malič, and Marija Kosec. "Low-Temperature Processing." In Chemical Solution Deposition of Functional Oxide Thin Films, 431–44. Vienna: Springer Vienna, 2013. http://dx.doi.org/10.1007/978-3-211-99311-8_18.

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Yasuda, Hirotsugu K. "Interface Engineering by Low Temperature Plasma Processes." In Plasma Processing of Polymers, 289–303. Dordrecht: Springer Netherlands, 1997. http://dx.doi.org/10.1007/978-94-015-8961-1_14.

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Matkarimov, Sokhibjon Turdalievich, Bakhriddin Tilovkabulovich Berdiyarov, Zaynobiddin Turdalievich Matkarimov, Raimkul Rakhmonkulov, and Sevara Dusmuratovna Jumaeva. "Low-Temperature Reduction Processing of Copper Slag." In Springer Proceedings in Materials, 189–200. Singapore: Springer Nature Singapore, 2022. http://dx.doi.org/10.1007/978-981-19-5395-8_15.

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Borland, John Ogawa. "Low Temperature Silicon Epitaxy for Novel Device Structures." In Reduced Thermal Processing for ULSI, 393–429. Boston, MA: Springer US, 1989. http://dx.doi.org/10.1007/978-1-4613-0541-5_11.

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Nayak, Yougojoti, Raghunath Rana, Swadesh Pratihar, and Santanu Bhattacharyya. "Low-Temperature Processing of Dense Hydroxyapatite-Zirconia Composites." In Progress in Nanotechnology, 359–66. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2014. http://dx.doi.org/10.1002/9780470588246.ch49.

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Liu, Shuai, Fuming Wang, Zhanbing Yang, Yongliang Li, Xi Chen, and Lijuan Sun. "Ripening Behavior of Carbides in Low-Carbon Low Alloy Steel FAS3420H During Spheroidizing Annealing Process." In 11th International Symposium on High-Temperature Metallurgical Processing, 329–39. Cham: Springer International Publishing, 2020. http://dx.doi.org/10.1007/978-3-030-36540-0_30.

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Gundu, Pavan M., Preeti Birwal, Chaitradeepa G. Mestri, and Abila Krishna. "Low Temperature Based Ultrasonic Drying of Foods." In Handbook of Research on Food Processing and Preservation Technologies, 3–32. Boca Raton: Apple Academic Press, 2021. http://dx.doi.org/10.1201/9781003184720-4.

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Xiao, Yongzhong, Zhen He, Tiejun Chun, Deqing Zhu, and Jian Pan. "Reduction Kinetics of Low Grade Hematite Ore." In 3rd International Symposium on High-Temperature Metallurgical Processing, 129–35. Hoboken, NJ, USA: John Wiley & Sons, Inc., 2012. http://dx.doi.org/10.1002/9781118364987.ch16.

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Lu, T. C., T. T. Nguyen, Y. Bienvenu, J. H. Davidson, and O. Dugue. "The Influence of Powder Processing Variables on the Structure and Properties of Hiped Low Carbon Astroloy." In High Temperature Alloys, 297–305. Dordrecht: Springer Netherlands, 1987. http://dx.doi.org/10.1007/978-94-009-1347-9_28.

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Cheftel, J. C., M. Thiebaud, and E. Dumay. "High Pressure — Low Temperature Processing of Foods: A Review." In Advances in High Pressure Bioscience and Biotechnology II, 327–40. Berlin, Heidelberg: Springer Berlin Heidelberg, 2003. http://dx.doi.org/10.1007/978-3-662-05613-4_58.

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Conference papers on the topic "Low temperature processing"

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Boyce, K. R., E. Figueroa-Feliciano, F. M. Finkbeiner, K. C. Gendreau, R. L. Kelley, M. A. Lindeman, F. S. Porter, C. K. Stahle, and A. E. Szymkowiak. "Data processing for large fast microcalorimeter arrays." In LOW TEMPERATURE DETECTORS: Ninth International Workshop on Low Temperature Detectors. American Institute of Physics, 2002. http://dx.doi.org/10.1063/1.1457660.

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Tan, Hui, Dimitry Breus, Wolfgang Hennig, Konstantin Sabourov, Jeffrey W. Collins, William K. Warburton, W. Bertrand Doriese, et al. "High Rate Pulse Processing Algorithms for Microcalorimeters." In THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS—LTD13. AIP, 2009. http://dx.doi.org/10.1063/1.3292337.

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Adams, J. S., S. R. Bandler, L. E. Brown, K. R. Boyce, M. P. Chiao, W. B. Doriese, M. E. Eckart, et al. "Real-Time Data Processing for X-Ray Spectroscopy." In THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS—LTD13. AIP, 2009. http://dx.doi.org/10.1063/1.3292331.

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Lok, B. K., Kyung W. Paik, L. L. Wai, W. Fan, Albert C. W. Lu, and K. P. Pramoda. "Low temperature processing for integrated magnetics." In 2007 International Conference on Electronic Materials and Packaging (EMAP 2007). IEEE, 2007. http://dx.doi.org/10.1109/emap.2007.4510280.

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Hoteling, N., M. K. Bacrania, A. S. Hoover, M. W. Rabin, M. Croce, P. J. Karpius, J. N. Ullom, et al. "Issues in energy calibration, nonlinearity, and signal processing for gamma-ray microcalorimeter detectors." In THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS—LTD13. AIP, 2009. http://dx.doi.org/10.1063/1.3292440.

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Wright, D. R., Wayne D. Clark, Dennis C. Hartman, U. C. Sridharan, Martin Kent, and Ralph C. Kerns. "Closed-loop temperature control system for a low-temperature etch chuck." In Microelectronic Processing '92, edited by James A. Bondur, Gary Castleman, Lloyd R. Harriott, and Terry R. Turner. SPIE, 1993. http://dx.doi.org/10.1117/12.142927.

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Lu, Daoqiang Daniel, Chuan Hu, and Annie Tzu-yu Huang. "Forming High Temperature Solder Interfaces by Low Temperature Fluxless Processing." In High Density Design Packaging and Microsystem Integration, 2007 International Symposium on. IEEE, 2007. http://dx.doi.org/10.1109/hdp.2007.4283575.

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Lu, Daoqiang Daniel, Chuan Hu, and Annie Tzu-Yu Huang. "Forming High Temperature Solder Interfaces by Low Temperature Fluxless Processing." In ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference. ASMEDC, 2007. http://dx.doi.org/10.1115/ipack2007-33197.

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Abstract:
This paper provides a fundamental study of large area, fluxless bonding with three different solder systems Cu-Sn, Ag-In, and Ag-SnBi, which were pre-deposited in layered structures. The thickness of each individual layer was carefully designed such that, after bonding and annealing at lower temperatures, the final solder interface only had high melting point components and showed higher re-melting points. A systematic bonding study was conducted, and re-melting points and microstructure of the formed solder interface were studied using differential scanning calorimetry (DSC), and scanning electron microsopy (SEM), respectively.
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Fukano, T., T. Ito, and H. Ishikawa. "Microwave annealing for low temperature VLSI processing." In 1985 International Electron Devices Meeting. IRE, 1985. http://dx.doi.org/10.1109/iedm.1985.190936.

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Seta, Hiromi, Makoto S. Tashiro, Yukikatsu Terada, Yuya Shimoda, Kaori Onda, Yoshitaka Ishisaki, Masahiro Tsujimoto, et al. "Development of a Digital Signal Processing System for the X-ray Microcalorimeter onboard ASTRO-H." In THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS—LTD13. AIP, 2009. http://dx.doi.org/10.1063/1.3292332.

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Reports on the topic "Low temperature processing"

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Paul, Ryan Michael, and Amit Naskar. Low-Cost Bio-Based Carbon Fibers for High Temperature Processing. Office of Scientific and Technical Information (OSTI), August 2017. http://dx.doi.org/10.2172/1373688.

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Naskar, Amit K., Kokouvi M. Akato, Chau D. Tran, Ryan M. Paul, and Xuliang Dai. Low–Cost Bio-Based Carbon Fiber for High-Temperature Processing. Office of Scientific and Technical Information (OSTI), February 2017. http://dx.doi.org/10.2172/1345795.

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Elliott, D. C., and T. R. Hart. Low-temperature catalytic gasification of food processing wastes. 1995 topical report. Office of Scientific and Technical Information (OSTI), August 1996. http://dx.doi.org/10.2172/379027.

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Sigmon, Thomas W., and A. M. Goodman. Low Temperature Materials Growth and Processing Development for Flat Panel Display Technology Applications. Fort Belvoir, VA: Defense Technical Information Center, November 1993. http://dx.doi.org/10.21236/ada278013.

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Berglund, C. N. Low Temperature Materials Growth and Processing Development for Flat Panel Display Technology Applications. Fort Belvoir, VA: Defense Technical Information Center, February 1995. http://dx.doi.org/10.21236/ada292177.

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Berglund, C. N. Low Temperature Materials Growth and Processing Development for Flat Panel Display Technology Applications. Fort Belvoir, VA: Defense Technical Information Center, August 1995. http://dx.doi.org/10.21236/ada327342.

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Berglund, C. N. Low Temperature Materials Growth and Processing Development for Flat Panel Display Technology Applications. Fort Belvoir, VA: Defense Technical Information Center, May 1995. http://dx.doi.org/10.21236/ada327508.

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OREGON GRADUATE INST BEAVERTON. Low Temperature Materials Growth and Processing Development for Flat Panel Display Technology Applications. Fort Belvoir, VA: Defense Technical Information Center, February 1996. http://dx.doi.org/10.21236/ada328925.

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Kubes, G. J. Development of an alternative kraft black liquor recovery process based on low-temperature processing in fluidized beds. Final technical report on Annex 9, Task 1. Office of Scientific and Technical Information (OSTI), March 1994. http://dx.doi.org/10.2172/10117463.

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Chen, I.-Wei. Final technical report to Department of Energy, Basic Energy Sciences. ''Oxide ceramic alloys and microlaminates'' (1996-1999) and ''Low temperature processing and kinetics of ceramics and ceramic matrix composites with large interfacial areas'' (1999-2000). Office of Scientific and Technical Information (OSTI), March 2001. http://dx.doi.org/10.2172/808312.

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