Journal articles: 'Long-term electrical reliability'

1

Xie, Jingsong, Ming Sun, Michael Pecht, and David F. Barbe. "Why Gold Flash Can Be Detrimental to Long-Term Reliability." Journal of Electronic Packaging 126, no. 1 (March 1, 2004): 37–40. http://dx.doi.org/10.1115/1.1646425.

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Most connectors are made from copper or copper alloys, with beryllium copper and phosphor bronze being the most common base materials due to their high electrical conductivity, low stress relaxation, and competitive cost. The most significant drawback is copper’s low resistance to corrosion, which can lead to electrical failure of connectors. For this reason, a layer of gold is often plated on the surfaces of connectors to seal off the base metal from being directly exposed to the environment. As an economical practice, gold flashing has been used to protect electrical contacts from corrosion. However, there is increasing evidence indicating that gold flashing can be detrimental in applications calling for long-term reliability. This paper provides insight into reliability issues of gold flash.

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Lenner, Miklos, Andreas Frank, Lin Yang, Tomas Mikael Roininen, and Klaus Bohnert. "Long-Term Reliability of Fiber-Optic Current Sensors." IEEE Sensors Journal 20, no. 2 (January 15, 2020): 823–32. http://dx.doi.org/10.1109/jsen.2019.2944346.

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Peterson, D. K., M. L. Nochomovitz, T. A. Stellato, and J. T. Mortimer. "Long-term intramuscular electrical activation of the phrenic nerve: safety and reliability." IEEE Transactions on Biomedical Engineering 41, no. 12 (1994): 1115–26. http://dx.doi.org/10.1109/10.335860.

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Miyake, Takuma, Yoshihiro Arata, Tatsuya Sakoda, Masahisa Otsubo, Yasufumi Sonoda, and Hiroshi Yamaguchi. "Assessing Long-term Reliability of Polymeric Housing Materials." IEEJ Transactions on Power and Energy 131, no. 6 (2011): 530–31. http://dx.doi.org/10.1541/ieejpes.131.530.

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Plumbridge, W. J. "Long term mechanical reliability with lead‐free solders." Soldering & Surface Mount Technology 16, no. 2 (August 2004): 13–20. http://dx.doi.org/10.1108/09540910410537291.

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Kim, Bal-Ho H. "A Study on Reliability Differentiated Pricing of Long-Term Transactions." Journal of Electrical Engineering and Technology 6, no. 1 (January 1, 2011): 8–13. http://dx.doi.org/10.5370/jeet.2011.6.1.008.

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Golovanov, Igor', Pavel Maslihov, Uulu Turatbek, and Natal'ya Bel'dyagina. "STUDY OF THE RELIABILITY OF ELECTRICAL EQUIPMENT OF THE ELECTRICAL POWER SUPPLY SYSTEM, HAVING A LARGE PERIOD OF WORKING." Bulletin of the Angarsk State Technical University 1, no. 12 (December 18, 2018): 29–31. http://dx.doi.org/10.36629/2686-777x-2018-1-12-29-31.

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Pecht, Judy, Michael Pecht, and Anthony J. Rafanelli. "Long-Term Non-Operating Reliability of Electronic Products." Journal of Electronic Packaging 119, no. 2 (June 1, 1997): 145–46. http://dx.doi.org/10.1115/1.2792222.

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Matsumoto, Michito, Tadashi Haibara, Yutaka Katsuyama, Masamitsu Tokuda, Tadatoshi Tanifuji, Regular Members, and Mitsuru Miyauchi, Regular Member. "Long-term reliability assurance for arc-fusion spliced fiber." Electronics and Communications in Japan (Part I: Communications) 68, no. 2 (February 1985): 73–81. http://dx.doi.org/10.1002/ecja.4410680210.

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Kaga, T., and T. Hagiwara. "Short- and long-term reliability of nitrided oxide MISFETs." IEEE Transactions on Electron Devices 35, no. 7 (July 1988): 929–34. http://dx.doi.org/10.1109/16.3347.

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11

HSU, YEN-TSENG, and CHEN-FA HSU. "Evaluation of reliability and safety of long-term unmaintained computer systems." International Journal of Electronics 70, no. 2 (February 1991): 389–405. http://dx.doi.org/10.1080/00207219108921287.

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12

Bamba, Satoshi, Kuniaki Yabe, Tomomichi Seki, and Tetsuji Shibaya. "An Investment Level Decision Method to Secure Long-term Reliability." IEEJ Transactions on Power and Energy 128, no. 1 (2008): 329–34. http://dx.doi.org/10.1541/ieejpes.128.329.

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13

Engelmaier, W. "Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction." Soldering & Surface Mount Technology 1, no. 1 (January 1989): 14–22. http://dx.doi.org/10.1108/eb037660.

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14

Seltzer, C. P., R. Studd, M. J. Harlow, P. C. Spurdens, and S. D. Perrin. "Long-term reliability of strain-compensated InGaAs(P)/InP MQW BH lasers." Electronics Letters 30, no. 3 (February 3, 1994): 227–29. http://dx.doi.org/10.1049/el:19940150.

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15

Koyano, Yasushi, Motoki Kakui, Tomonori Kashiwada, Masashi Onishi, Masayuki Shigematsu, Hiroo Kanamori, and Masayuki Nishimura. "Long-term reliability of Er-doped fibers in hydrogen environments." Electronics and Communications in Japan (Part II: Electronics) 79, no. 1 (1996): 33–42. http://dx.doi.org/10.1002/ecjb.4420790104.

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16

Wasif, Rukhshinda, Mohammad Osman Tokhi, John Rudlin, Gholamhossein Shirkoohi, and Fang Duan. "Reliability Improvement of Magnetic Corrosion Monitor for Long-Term Applications." Sensors 23, no. 4 (February 16, 2023): 2212. http://dx.doi.org/10.3390/s23042212.

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Electromagnetic techniques are widely employed for corrosion detection, and their performance for inspection of corrosion is well established. However, limited work is carried out on the development and reliability of smart corrosion monitoring devices for tracking internal or buried thickness loss due to corrosion remotely. A novel smart magnetic corrosion transducer is developed for long-term monitoring of thickness loss due to corrosion at critical locations. The reliability of the transducer is enhanced by using a dissimilar active redundancy approach. The improved corrosion monitor has been tested in the ambient environment for seven months to evaluate the stability against environmental factors and degradation. The monitor is found to show great sensitivity to detect defects due to corrosion. Detection of anomalous patterns in the time series data received from the monitors is accomplished by using Pearson’s correlation coefficient. The critical component of the monitor is identified at the end of the test. Research findings reveal that, compared to the existing corrosion monitoring techniques in the industry, the detection and isolation of faulty sensor features introduced in this study can contribute to reliable monitoring of thickness loss due to corrosion in ferromagnetic structures over an extended period of time.

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17

Dong, Xian Ping, Bo Zhang, and Jian Sheng Wu. "Optical-Electrical Properties and Corrosion Behavior of Tantalum-Doped Indium Tin Oxide Films Deposited by Magnetron Sputtering." Materials Science Forum 638-642 (January 2010): 2897–902. http://dx.doi.org/10.4028/www.scientific.net/msf.638-642.2897.

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Tantalum-doped indium tin oxide films were deposited on glass substrate by co-sputtering with two-targets. Tantalum-doping strengthened the orientation of the (400) plane and resulted in better crystalline structure, larger grain size and lower surface roughness. Due to the better crystallizability of the tantalum-doping films, carrier concentration and the mobility were increased. Tantalum-doping revealed better optical–electrical properties. The environmental effects on electrical properties stability and long-term reliability of tantalum-doped films in NaCl, Na2SO4 and HCl solutions at 25°C were also investigated, which simulated corrosion behavior in marine, industrial and acidic environments. The relative resistance change (△R/R) for tantalum-doped films revealed that the films had the best electrical properties stability and long-term reliability in these aggressive environments. The pre-formation of a protective oxide layer on the surface of the films had an enhancing effect on the corrosion properties.

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18

Ahn, Jeong, and Kim. "Emerging Encapsulation Technologies for Long-Term Reliability of Microfabricated Implantable Devices." Micromachines 10, no. 8 (July 31, 2019): 508. http://dx.doi.org/10.3390/mi10080508.

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The development of reliable long-term encapsulation technologies for implantable biomedical devices is of paramount importance for the safe and stable operation of implants in the body over a period of several decades. Conventional technologies based on titanium or ceramic packaging, however, are not suitable for encapsulating microfabricated devices due to their limited scalability, incompatibility with microfabrication processes, and difficulties with miniaturization. A variety of emerging materials have been proposed for encapsulation of microfabricated implants, including thin-film inorganic coatings of Al2O3, HfO2, SiO2, SiC, and diamond, as well as organic polymers of polyimide, parylene, liquid crystal polymer, silicone elastomer, SU-8, and cyclic olefin copolymer. While none of these materials have yet been proven to be as hermetic as conventional metal packages nor widely used in regulatory approved devices for chronic implantation, a number of studies have demonstrated promising outcomes on their long-term encapsulation performance through a multitude of fabrication and testing methodologies. The present review article aims to provide a comprehensive, up-to-date overview of the long-term encapsulation performance of these emerging materials with a specific focus on publications that have quantitatively estimated the lifetime of encapsulation technologies in aqueous environments.

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Oleinikova, I., Z. Krishans, and A. Mutule. "Basic Principles of Electrical Network Reliability Optimization in Liberalised Electricity Market." Latvian Journal of Physics and Technical Sciences 45, no. 4 (January 1, 2008): 3–13. http://dx.doi.org/10.2478/v10047-008-0015-5.

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Basic Principles of Electrical Network Reliability Optimization in Liberalised Electricity MarketThe authors propose to select long-term solutions to the reliability problems of electrical networks in the stage of development planning. The guide lines or basic principles of such optimization are: 1) its dynamical nature; 2) development sustainability; 3) integrated solution of the problems of network development and electricity supply reliability; 4) consideration of information uncertainty; 5) concurrent consideration of the network and generation development problems; 6) application of specialized information technologies; 7) definition of requirements for independent electricity producers. In the article, the major aspects of liberalized electricity market, its functions and tasks are reviewed, with emphasis placed on the optimization of electrical network development as a significant component of sustainable management of power systems.

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20

Flicker, Jack, Govindasamy Tamizhmani, Mathan Kumar Moorthy, Ramanathan Thiagarajan, and Raja Ayyanar. "Accelerated Testing of Module-Level Power Electronics for Long-Term Reliability." IEEE Journal of Photovoltaics 7, no. 1 (January 2017): 259–67. http://dx.doi.org/10.1109/jphotov.2016.2621339.

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21

Fischer, Th, A. Olbrich, G. Georgakos, B. Lemaitre, and D. Schmitt-Landsiedel. "Impact of process variations and long term degradation on 6T-SRAM cells." Advances in Radio Science 5 (June 13, 2007): 321–25. http://dx.doi.org/10.5194/ars-5-321-2007.

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Abstract. In modern deep-submicron CMOS technologies voltage scaling can not keep up with the scaling of the dimensions of transistors. Therefore the electrical fields inside the transistors are not constant anymore, while scaling down the device area. The rising electrical fields bring up reliability problems, such as hot carrier injection. Also other long term degradation mechanisms like Negative Bias Temperature Instability (NBTI) come into the focus of circuit design. Along with process device parameter variations (threshold voltage, mobility), variations due to the degradation of devices form a big challenge for designers to build circuits that both yield high under the influence of process variations and remain functional with respect to long term device drift. In this work we present the influence of long term degradation and process variations on the performance of SRAM core-cells and parametric yield of SRAM arrays. For different use cases we show the performance degradation depending on temperature and supply voltage.

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Patil, Nishad, Diganta Das, Estelle Scanff, and Michael Pecht. "Long term storage reliability of antifuse field programmable gate arrays." Microelectronics Reliability 53, no. 12 (December 2013): 2052–56. http://dx.doi.org/10.1016/j.microrel.2013.06.016.

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23

Wu, Chenyang, Junqiang Wang, Xiaofei Liu, Mengwei Li, Zehua Zhu, and Yue Qi. "Au Wire Ball Welding and Its Reliability Test for High-Temperature Environment." Micromachines 13, no. 10 (September 27, 2022): 1603. http://dx.doi.org/10.3390/mi13101603.

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The long-term application of sensors in a high-temperature environment needs to address several challenges, such as stability at high temperatures for a long time, better wiring interconnection of sensors, and reliable and steady connection of the sensor and its external equipment. In order to systematically investigate the reliability of thin coatings at high temperatures for a long time, Au and Cr layers were deposited on silicon substrates by magnetron sputtering. Additionally, samples with different electrode thicknesses were annealed at different temperatures for a varied duration to study the effect of electrode thickness, temperature, and duration on the reliability of samples. The results of tensile and probe tests before and after heat treatment revealed that the mechanical strength and electrical properties have changed after annealing. In addition, the bonding interface was analyzed by a cross-sectional electron microscope. The analysis showed that long-term continuous high-temperature exposure would result in thinning of the electrode, formation of pores, recrystallization, and grain growth, all of which can affect the mechanical strength and electrical properties. In addition, it was observed that increasing the thickness of the gold layer will improve reliability, and the test results show that although the thin metal layer sample is in poor condition, it is still usable. The present study provides theoretical support for the application of thin coatings in high temperatures and harsh environments.

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Araki, Noritoshi, Motoki Eto, Takumi Ohkabe, Teruo Haibara, Takashi Yamada, Tetsuya Oyamada, and Tomohiro Uno. "High bond reliability of newly developed silver alloy bonding wire." International Symposium on Microelectronics 2019, no. 1 (October 1, 2019): 000524–29. http://dx.doi.org/10.4071/2380-4505-2019.1.000524.

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Abstract In this paper, a new type of silver (Ag) alloy bonding wire is introduced, and its bonding property and long term reliability are demonstrated. The new Ag wire, called GX2s, is developed as a cost-effective alternative to gold (Au) wire targeting at automotive electronics. The wire material is doped with added element, and its electrical resistivity is much lower than the conventional palladium (Pd) doped Ag wire. Highly accelerated stress test (HAST) and high temperature storage life (HTSL) test were carried out along with other bonding evaluations. The results show that GX2s has good bonding property and excellent long term bond reliability. Microstructural analyses of bond interface after the reliability tests were also conducted to investigate its improving mechanism. GX2s is a suitable alternative to Au wire for many applications including high temperature automotive devices.

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Kumar, Rakesh. "A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2011, HITEN (January 1, 2011): 000207–14. http://dx.doi.org/10.4071/hiten-paper3-rkumar.

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A recent development in the area of high temperature and UV stable polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and component, including PCB's, MEMS, optoelectronic devices, fuel cell components and nano-electronic parts are, becoming more challenging due to their long-term performance requirements. This high temperature polymer, named Parylene HT, offers solutions to many existing protective, packaging and reliability issues in the electronics and medical industries, in part because of its excellent electrical and mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure (up to 350°C long-term and short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity, mechanical processing, etc. of a dynamic electronics industry. In addition, Parylene HT polymer coating truly conforms to parts due to its molecular level deposition characteristics. Its suitability and biocompatibility encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries.

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Yotto, Habib Conrad Sotiman, Patrice Chetangny, Victor Zogbochi, Jacques Aredjodoun, Sossou Houndedako, Gerald Barbier, Antoine Vianou, and Didier Chamagne. "Long-Term Electricity Load Forecasting Using Artificial Neural Network: The Case Study of Benin." Advanced Engineering Forum 48 (January 10, 2023): 117–36. http://dx.doi.org/10.4028/p-zq4id8.

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Africans in general and specially Beninese’s low rate access to electricity requires efforts to set up new electricity production units. To satistfy the needs, it is therefore very important to have a prior knowledge of the electrical load. In this context, knowing the right need for the electrical energy to be extracted from the Beninese network in the long term and in order to better plan its stability and reliability, a forecast of this electrical load is then necessary. The study has used the annual power grid peak demand data from 2001 to 2020 to develop, train and validate the models. The electrical load peaks until 2030 are estimated as the output value. This article evaluates three algorithms of a method used in artificial neural networks (ANN) to predict electricity consumption, which is the Multilayer Perceptron (MLP) with backpropagation. To ensure stable and accurate predictions, an evaluation approach using mean square error (MSE) and correlation coefficient (R) has been used. The results have proved that the data predicted by the Bayesian regulation variant of the Multilayer Perceptron (MLP), is very close to the real data during the training and the learning of these algorithms. The validated model has developed high generalization capabilities with insignificant prediction deviations.

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Abumohsen, Mobarak, Amani Yousef Owda, and Majdi Owda. "Electrical Load Forecasting Using LSTM, GRU, and RNN Algorithms." Energies 16, no. 5 (February 27, 2023): 2283. http://dx.doi.org/10.3390/en16052283.

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Forecasting the electrical load is essential in power system design and growth. It is critical from both a technical and a financial standpoint as it improves the power system performance, reliability, safety, and stability as well as lowers operating costs. The main aim of this paper is to make forecasting models to accurately estimate the electrical load based on the measurements of current electrical loads of the electricity company. The importance of having forecasting models is in predicting the future electrical loads, which will lead to reducing costs and resources, as well as better electric load distribution for electric companies. In this paper, deep learning algorithms are used to forecast the electrical loads; namely: (1) Long Short-Term Memory (LSTM), (2) Gated Recurrent Units (GRU), and (3) Recurrent Neural Networks (RNN). The models were tested, and the GRU model achieved the best performance in terms of accuracy and the lowest error. Results show that the GRU model achieved an R-squared of 90.228%, Mean Square Error (MSE) of 0.00215, and Mean Absolute Error (MAE) of 0.03266.

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Chen, B. L., X. Q. Shi, G. Y. Li, K. H. Ang, and Jason P. Pickering. "Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly." Journal of Electronic Packaging 127, no. 4 (February 24, 2005): 466–73. http://dx.doi.org/10.1115/1.2056574.

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In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

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JÓŹWIAK, IRENEUSZ, MAKSYMILIAN KOWALCZYK, and ANDRZEJ PIOTROWICZ. "REFACTORIZATION'S IMPACT ON SOFTWARE RELIABILITY." International Journal of Reliability, Quality and Safety Engineering 13, no. 01 (February 2006): 47–60. http://dx.doi.org/10.1142/s0218539306002136.

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Software refactorization is a process of changing program's source code structure without changing its functionality. The purpose of the refactorization is to make program's source code easier to understand and maintain, which in turn influence the fact that in a long term such code should have fewer errors (be more reliable). In recent years many works described refactorization, but till now there are no researches, which would assess long term influence of refactoring on reliability. In this work we try to depict our fundamental study on software systems reliability improvement in context of refactoring. We tried to find the answer to the question: What are benefits of using refactorization as far as reliability is concerned?

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30

Madrakhimov, Daniyar Bakhtiyarovich, Vera Pavlovna Ivanova, and Victoria Vyacheslavovna Tsypkina. "Improving the reliability of cable lines operation in hot climates." E3S Web of Conferences 216 (2020): 01151. http://dx.doi.org/10.1051/e3sconf/202021601151.

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Reliability of cable lines in hot climate is determined by the climatic characteristics of cables and wires, which include: long-term and short-term heat resistance, cold resistance, moisture resistance, resistance to cyclic exposure to temperatures and solar radiation, ozone resistance, etc. This article considers the main impacts of environmental factors: high temperatures, solar radiation, which, as practice shows, lead to irreversible deterioration of the electrical and mechanical properties of cable products. The result of climatic impacts in the Central Asian region, in hot climate conditions, is the aging of both insulation and protective coverings, which leads to irreversible change in the mechanical and electrical properties of the used polymers due to the loss of elasticity of the extruded material and its subsequent cracking, turning into cracks. The assessment of the possibility of long-term operation of the used polymer was carried out according to the polyethylene oxidation period, which determines the time of natural preservation of various types of cables during the period of their operation. The research was carried out on samples of cables stored under a canopy in wooden boxes, protected from sunlight and precipitation, by measuring criterion parameters with strict compliance with the established norms. Thus, the proposed solution for increasing the reliability of cable lines consists of debugging the technological process of applying insulation and sheathing, in which the extrusion of the polymer mass is carried out by technique that minimizes the ingress of contamination. Review of the results showed that extrusion line improvement would provide possibility of increasing reliability in the operation of cable products under the impact of climatic factors of the Central Asian region due to the reduced aging of insulation.

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31

Shenai, Krishna, Philip G. Neudeck, M. Dudley, and Robert F. Davis. "Material Defects and Rugged Electrical Power Switching in Semiconductors." Materials Science Forum 717-720 (May 2012): 1077–80. http://dx.doi.org/10.4028/www.scientific.net/msf.717-720.1077.

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A paradigm shift in the development and utilization of power semiconductor switch technology is proposed. This new "top down" approach begins with the field-reliability of a power semiconductor switch in a power converter circuit is subjected to long-term repetitive-switching under stressful field-operating conditions. This approach is derived from extensive field-reliability data collected on state-of-the-art silicon power MOSFETs in compact computer/telecom power supplies that clearly suggests that power MOSFET field-failures were primarily caused by bulk material defects. A careful survey of power switch technologies reported to-date in Silicon Carbide (SiC) and Gallium Nitride (GaN) further suggests that excessive bulk material defects have predominantly hindered the development and commercialization of cost-effective, high-performance, and reliable high-power devices. A reliability-driven approach is likely to "unlock" the vast potential of SiC (and GaN for moderate power levels) power device technology for high-voltage and high-power switching electronics in order to impact transformative changes.

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32

Kumar, Rakesh. "Parylene HT®: A High Temperature Vapor Phase Polymer for Electronics Applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2010, HITEC (January 1, 2010): 000108–13. http://dx.doi.org/10.4071/hitec-rkumar-tp13.

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A development in the area of high temperature polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and components that include PCB's, MEM's, optoelectronic devices, fuel cell components and nano-electronic parts are becoming more challenging due to their long-term performance requirements. Parylene HT offers solutions to many existing packaging and reliability issues of electronics industry in part because of its excellent electrical & mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure to over 350°C (short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity and mechanical processing etc. of dynamic electronic industry. In addition, Parylene HT polymer coating truly conforms to the parts due to its molecular level deposition characteristics. Its suitability and biocompatibilty encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries, which include enhancing high temperature application/technologies.

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33

Crosson, A., L. Escotte, M. Bafleur, D. Talbourdet, L. Crétinon, P. Perdu, and G. Perez. "Long-term reliability of silicon bipolar transistors subjected to low constraints." Microelectronics Reliability 47, no. 9-11 (September 2007): 1590–94. http://dx.doi.org/10.1016/j.microrel.2007.07.057.

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34

Tanaka, Yo, Shinnosuke Soda, Takahito Fushimi, Tomoki Matsuda, Tomokazu Sano, and Akio Hirose. "Study on Improvement of the Initial and Long-Term Reliability in Ultrasonically Bonded Copper Joints." Journal of The Japan Institute of Electronics Packaging 23, no. 2 (March 1, 2020): 166–72. http://dx.doi.org/10.5104/jiep.23.166.

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35

Muneer, Amgad, Rao Faizan Ali, Ahmed Almaghthawi, Shakirah Mohd Taib, Amal Alghamdi, and Ebrahim Abdulwasea Abdullah Ghaleb. "Short term residential load forecasting using long short-term memory recurrent neural network." International Journal of Electrical and Computer Engineering (IJECE) 12, no. 5 (October 1, 2022): 5589. http://dx.doi.org/10.11591/ijece.v12i5.pp5589-5599.

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<span>Load forecasting plays an essential role in power system planning. The efficiency and reliability of the whole power system can be increased with proper planning and organization. Residential load forecasting is indispensable due to its increasing role in the smart grid environment. Nowadays, smart meters can be deployed at the residential level for collecting historical data consumption of residents. Although the employment of smart meters ensures large data availability, the inconsistency of load data makes it challenging and taxing to forecast accurately. Therefore, the traditional forecasting techniques may not suffice the purpose. However, a deep learning forecasting network-based long short-term memory (LSTM) is proposed in this paper. The powerful nonlinear mapping capabilities of RNN in time series make it effective along with the higher learning capabilities of long sequences of LSTM. The proposed method is tested and validated through available real-world data sets. A comparison of LSTM is then made with two traditionally available techniques, exponential smoothing and auto-regressive integrated moving average model (ARIMA). Real data from 12 houses over three months is used to evaluate and validate the performance of load forecasts performed using the three mentioned techniques. LSTM model has achieved the best results due to its higher capability of memorizing large data in time series-based predictions.</span>

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Gordina, Anastasiya, Aleksandr Gumenyuk, Irina Polyanskikh, Grigorij Yakovlev, and Vít Černý. "Effect of Electrochemical Corrosion on the Properties of Modified Concrete." Construction Materials 3, no. 2 (April 25, 2023): 202–16. http://dx.doi.org/10.3390/constrmater3020013.

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Analysis of the use of reinforced concrete structures confirmed the destruction of reinforced products based on Portland cement due to stray currents, which makes it impossible to achieve the required durability and reliability of structures. The present work shows the results of a study on the diffusion permeability of samples with different degrees of electrical conductivity. The relative value of the electrode potential was measured by the open circuit potential method. The novelty of this work is its analysis of the quantitative and qualitative characteristics of the structure of the mineral matrix with specified electrical properties after long-term exposure to electrochemical corrosion. In this work, an assessment was carried out, for the first time, on the effects of electrochemical corrosion on modified composites with predominantly electrically conductive and electrically insulating properties. An increase in the electrical conductivity of the composite was found to reduce the potential difference. The use of such composites helped protect the reinforcement from electrochemical corrosion.

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Schumm, Andreas, Madalina Rabung, Gregory Marque, and Jary Hamalainen. "Reactor performance, system reliability, instrumentation and control." EPJ Nuclear Sciences & Technologies 6 (2020): 43. http://dx.doi.org/10.1051/epjn/2019017.

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We present a cross-cutting review of three on-going Horizon 2020 projects (ADVISE, NOMAD, TEAM CABLES) and one already finished FP7 project (HARMONICS), which address the reliability of safety-relevant components and systems in nuclear power plants, with a scope ranging from the pressure vessel and primary loop to safety-critical software systems and electrical cables. The paper discusses scientific challenges faced in the beginning and achievements made throughout the projects, including the industrial impact and lessons learned. Two particular aspects highlighted concern the way the projects sought contact with end users, and the balance between industrial and academic partners. The paper concludes with an outlook on follow-up issues related to the long term operation of nuclear power plants.

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Borovikov, S. M., E. N. Shneiderov, A. I. Berasnevich, and V. O. Kaziuchyts. "Individual forecasting of reliability of bipolar transistors by using electrical voltage as a simulation factor." Doklady BGUIR 18, no. 5 (September 2, 2020): 80–88. http://dx.doi.org/10.35596/1729-7648-2020-18-5-80-88.

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Individual forecasting of the reliability of semiconductor devices, taking into account gradual failures, is an urgent task, as it allows you to choose highly reliable instances for critical electronic devices of long-term functioning. In relation to bipolar transistors, an approach is proposed that allows us to solve this problem by using the voltage applied to the collector-emitter junction as a simulated effect. Using the example of highpower bipolar transistors of the KT872A type, it is shown how the problem is solved. For the sample of transistors of this type using the results of a training experiment, two equations were obtained to describe the electrical parameter under consideration (a static base current transfer coefficient in a circuit with a common emitter), the value of which judges the absence or presence of a gradual failure for a specific instance. The first equation shows how the electrical parameter changes on average depending on the voltage applied to the collector – emitter junction. The second equation describes the average degradation of the electrical parameter during long-term operating time of transistors. Based on these two equations, a simulation model of the reliability of bipolar transistors of the type in question is obtained in the form of a communication function that shows what level of simulation voltage corresponds to a given operating time. As applied to the transistors of the type under consideration, the obtained simulation model allows us to individually predict reliability by the gradual failures of the same type of samples that did not participate in the training experiment. To do this, first determine the value of the simulation voltage corresponding to a given operating time. This is achieved by substituting a given operating time into the model. The individual forecasting of the reliability of a new onetype instance consists in measuring the electrical parameter of this instance at a voltage on the transistor collector corresponding to the calculated simulation value, and comparing the measurement result with the norm set on the electrical parameter.

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NASIROV, Shamsi. "Analysis of Innovative Methods for Ensuring Operational Reliability and Safety Used in the Energy Systems of Azerbaijan." Eurasia Proceedings of Science Technology Engineering and Mathematics 20 (December 21, 2022): 155–60. http://dx.doi.org/10.55549/epstem.1222691.

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The high rates of restoration work carried out in the territories of Azerbaijan recently liberated from the occupation and the technological requirements for the projected power plants and electric grids of modern design and high power require the use of reliable and effective methods of control and protection of these facilities from failures and damage, as well as possible cyberattacks. In this regard, the article analyses the actual questions of the use of modern technologies and developments for the protection of power systems, provides the best options for the management and protection of electrical networks, which are most suitable for long-term plans for the development of the region on the principle of smart cities.

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Neumaier, Lukas, Gabriele C. Eder, Yuliya Voronko, Karl A. Berger, Gusztáv Újvári, and Karl Knöbl. "Advanced UV-fluorescence image analysis for early detection of PV-power degradation." EPJ Photovoltaics 14 (2023): 9. http://dx.doi.org/10.1051/epjpv/2023001.

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Reliability and durability of photovoltaic modules are a key factor for the development of emerging PV markets worldwide. Reliability is directly dependent on the chemical and physical stability of the polymeric encapsulation materials. One method capable of detecting ageing effects of the polymeric encapsulant directly on-site is UltraViolet Fluorescence (UVF) imaging. This work deals with advanced imaging analysis of UVF images and the subsequent correlation to electrical parameters of PV modules, which were exposed to climate-specific, long-term, accelerated aging procedures. For establishing a correlation, a so called UVF area ratio was established, resulting from the typical fluorescence patterns of the encapsulant material, which arise due to stress impact (e.g., water vapor ingress, elevated temperature, irradiation) and aging/degradation processes. Results of the data analysis show a clear correlation of the UVF area ratios and the electrical parameters with increasing aging time. In particular, the relationship between power and series resistance could be confirmed by extensive long-term test series with different climate-specific aging processes. Assuming the same type of polymeric encapsulation and backsheet and a comparable climate, determining the UVF area ratio can be used to estimate the service life and electrical power dissipation of each module installed in a PV array.

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Qiao, Li, Hui Huang Yang, and Jian Feng Sheng. "Comparison Study on Friction-Welded Cu-Al Material and Pure Cu/Al." Materials Science Forum 817 (April 2015): 374–78. http://dx.doi.org/10.4028/www.scientific.net/msf.817.374.

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Friction-weld Cu-Al has many potential applications to replace the traditional Cu or Al conductor as it has the superior performance and low cost. For ensuring the reliability of Al/Cu metal joints, the mechanical, electrical and long-term properties were investigated by comparing the properties of Cu and Al. The results show that the mechanical properties (tension, impact and hardness) of friction-welded Cu-Al are between the values of Cu and Al, and the welding seam is not the weakest part in mechanical. The electrical resistance of Cu-Al is also between the values of Cu and Al, and does not increase after long-term vibration test and high-low temperature cycle test. The welding seaming is a weak part for salt spray test, it is better to be protected for use.

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Kumar, Rakesh. "A high temperature nano/micro vapor phase conformal coating for electronics applications." Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT) 2015, HiTEN (January 1, 2015): 000083–90. http://dx.doi.org/10.4071/hiten-session3a-paper3a_1.

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Through characterization of dielectric and other properties at high temperatures, this work describes the development of a high temperature and UV stable nano/micro vapor phase deposited polymer coating for providing electrical insulation and protection of various electronics from chemical corrosion and other harsh environmental effects. Packaging, protection and reliability of various electronic devices and components, including PCBs, MEMS, optoelectronic devices, fuel cell components and nanoelectronic parts, are becoming more challenging due to the long-term performance requirements on devices. A recently commercialized high temperature polymer, Parylene HT®, offers solutions to many existing protective, packaging and reliability issues of electronic and medical applications, in part because of its excellent electrical and mechanical properties, chemical inertness and long-term thermal stability (high temperature exposure to over 350°C, short-term at 450 °C). Experimental results and commercial applications demonstrate the ability of Parylene HT coating to meet the growing requirements for higher dielectric capabilities, higher temperature integrity and mechanical processing, etc. of dynamic electronics applications. In addition, Parylene HT polymer coating truly conforms to parts due to its molecular level deposition characteristics. Its suitability and biocompatibility encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries.

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Andersson, Johan, Ulf H. Nilsson, Susanne Nilsson, Hedvig Pollak, and Nilena Nilsson. "Influence of Field Grading in Setup for Electric Breakdown Testing of Polyethylene Films." Proceedings of the Nordic Insulation Symposium, no. 26 (August 8, 2019): 47–51. http://dx.doi.org/10.5324/nordis.v0i26.3277.

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High dielectric strength of solid electrical insulation materials for high voltage applications is essential for high reliability and long-term performance.The IEC 60243 and ASTM D149 both describe very similar test methods to determine the short-term electric strength of solid insulation materials. A test sample, usually thin plaque, is placed in an electrode system with surrounding insulating oil. The voltage is then steadily increased until an electric breakdown occurs. Despite the relatively simple test setup, testing materials with high electric strength can be difficult. The breakdown channel is often located outside the active testing area of the electrodes and found at the electrode edge at the triple point between the electrode, test object, and surrounding oil.In this study, we have investigated different possibilities to control the electrical field enhancement in the vicinity of the electrode edges using silicone rubber, field grading silicone rubber, and a high permittivity oil. The testing was performed with semi-spherical electrodes and electrodes as recommended in IEC 60243 on polyethylene films. Electrodes covered with the field grading rubber increased the short-term breakdown strength compared to standard testing without modification. The high permittivity oil and silicone rubber seemed to have limited effect on the breakdown strength.

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Deng, Yang, Aiqun Li, and Dongming Feng. "Fatigue Reliability Assessment for Orthotropic Steel Decks Based on Long-Term Strain Monitoring." Sensors 18, no. 2 (January 10, 2018): 181. http://dx.doi.org/10.3390/s18010181.

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Choi, B. K., D. M. Fleetwood, R. D. Schrimpf, L. W. Massengill, K. F. Galloway, M. R. Shaneyfelt, T. L. Meisenheimer, et al. "Long-term reliability degradation of ultrathin dielectric films due to heavy-ion irradiation." IEEE Transactions on Nuclear Science 49, no. 6 (December 2002): 3045–50. http://dx.doi.org/10.1109/tns.2002.805389.

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Si, Wujun, Yunfei Shao, and Wei Wei. "Accelerated Degradation Testing With Long-Term Memory Effects." IEEE Transactions on Reliability 69, no. 4 (December 2020): 1254–66. http://dx.doi.org/10.1109/tr.2020.2997404.

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Fukuda, Kenji, Akimasa Kinoshita, Takasumi Ohyanagi, Ryouji Kosugi, T. Sakata, Y. Sakuma, Junji Senzaki, et al. "Influence of Processing and of Material Defects on the Electrical Characteristics of SiC-SBDs and SiC-MOSFETs." Materials Science Forum 645-648 (April 2010): 655–60. http://dx.doi.org/10.4028/www.scientific.net/msf.645-648.655.

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The influences of processing and material defects on the electrical characteristics of large-capacity (approximately 100A) SiC-SBDs and SiC-MOSFETs have been investigated. In the case of processing defects, controlled activation annealing is the most important factor. On the other hand for material defects, the number of epitaxial defects must be decreased to zero for both SBDs and MOSFETs. The dislocation defects in SiC wafers are dangerous for the breakdown voltage of MOSFETs. However, they are not killer defects. If the epitaxial defect density is sufficiently low and the dislocation density is in the order of 10000cm-2, the long- term reliability of the gate oxide at the electric field of 3MV/cm can be guaranteed.

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Ali, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh." International Journal of Infrared and Millimeter Waves 7, no. 3 (March 1986): 339–56. http://dx.doi.org/10.1007/bf01010852.

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Ali, Adel Ahmed. "Reliability analysis of millimeter wave propagation based on long term rain data in Riyadh." International Journal of Infrared and Millimeter Waves 7, no. 4 (April 1986): 599–621. http://dx.doi.org/10.1007/bf01013280.

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Song, Shihao, Jui Hanamshet, Adarsha Balaji, Anup Das, Jeffrey L. Krichmar, Nikil D. Dutt, Nagarajan Kandasamy, and Francky Catthoor. "Dynamic Reliability Management in Neuromorphic Computing." ACM Journal on Emerging Technologies in Computing Systems 17, no. 4 (July 19, 2021): 1–27. http://dx.doi.org/10.1145/3462330.

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Neuromorphic computing systems execute machine learning tasks designed with spiking neural networks. These systems are embracing non-volatile memory to implement high-density and low-energy synaptic storage. Elevated voltages and currents needed to operate non-volatile memories cause aging of CMOS-based transistors in each neuron and synapse circuit in the hardware, drifting the transistor’s parameters from their nominal values. If these circuits are used continuously for too long, the parameter drifts cannot be reversed, resulting in permanent degradation of circuit performance over time, eventually leading to hardware faults. Aggressive device scaling increases power density and temperature, which further accelerates the aging, challenging the reliable operation of neuromorphic systems. Existing reliability-oriented techniques periodically de-stress all neuron and synapse circuits in the hardware at fixed intervals, assuming worst-case operating conditions, without actually tracking their aging at run-time. To de-stress these circuits, normal operation must be interrupted, which introduces latency in spike generation and propagation, impacting the inter-spike interval and hence, performance (e.g., accuracy). We observe that in contrast to long-term aging, which permanently damages the hardware, short-term aging in scaled CMOS transistors is mostly due to bias temperature instability. The latter is heavily workload-dependent and, more importantly, partially reversible. We propose a new architectural technique to mitigate the aging-related reliability problems in neuromorphic systems by designing an intelligent run-time manager (NCRTM), which dynamically de-stresses neuron and synapse circuits in response to the short-term aging in their CMOS transistors during the execution of machine learning workloads, with the objective of meeting a reliability target. NCRTM de-stresses these circuits only when it is absolutely necessary to do so, otherwise reducing the performance impact by scheduling de-stress operations off the critical path. We evaluate NCRTM with state-of-the-art machine learning workloads on a neuromorphic hardware. Our results demonstrate that NCRTM significantly improves the reliability of neuromorphic hardware, with marginal impact on performance.

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Journal articles on the topic 'Long-term electrical reliability'

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