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Journal articles on the topic 'Laser processing'

Author: Grafiati

Published: 4 June 2021

Last updated: 12 October 2024

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1

KOBAYASHI, Naoto, Takashi UEDA, Tatsuaki FURUMOTO, Akira HOSOKAWA, and Ryutaro TANAKA. "E23 Laser Sintering Characteristics of Metallic Powder with Yb Fiber Laser : Optimization of Processing Conditions about Laser irradiation(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 593–96. http://dx.doi.org/10.1299/jsmelem.2009.5.593.

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2

IKEDA, Masayuki. "Precision Processing by Laser. Laser Material Processing." Journal of the Japan Society for Precision Engineering 65, no. 11 (1999): 1539–42. http://dx.doi.org/10.2493/jjspe.65.1539.

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3

OGITA, Taira, Toru MURAI, and Masaru KANAOKA. "High-quality Laser Welding of Stainless Steels(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 279–84. http://dx.doi.org/10.1299/jsmelem.2005.1.279.

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4

TOYODA, KOICHI. "Laser processing." Review of Laser Engineering 21, no. 1 (1993): 185–87. http://dx.doi.org/10.2184/lsj.21.185.

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5

Zhan, Xuepeng, Huailiang Xu, and Hongbo Sun. "Femtosecond laser processing of microcavity lasers." Frontiers of Optoelectronics 9, no. 3 (September 2016): 420–27. http://dx.doi.org/10.1007/s12200-016-0581-8.

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6

Chen, Ying-Tung, Yunn-shiuan Liao, and Ta-Tung Chen. "Fabrication of arrayed microneedles by laser LIGA process(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 285–90. http://dx.doi.org/10.1299/jsmelem.2005.1.285.

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7

TOYODA, Koichi. "Laser Materials Processing." Review of Laser Engineering 24, Supplement (1996): P1—P4. http://dx.doi.org/10.2184/lsj.24.supplement_p1.

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8

YONEDA, Masafumi, and Munehide KATSUMURA. "Laser hybrid processing." Journal of the Japan Welding Society 58, no. 6 (1989): 427–34. http://dx.doi.org/10.2207/qjjws1943.58.427.

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9

TOYODA, Koichi. "Laser Photochemical Processing." Review of Laser Engineering 38, no. 1 (2010): 39–42. http://dx.doi.org/10.2184/lsj.38.39.

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10

Roessler, David M. "Laser Materials Processing." Optical Engineering 36, no. 12 (December 1, 1997): 3481. http://dx.doi.org/10.1117/1.601561.

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11

Dutta Majumdar, J., and I. Manna. "Laser material processing." International Materials Reviews 56, no. 5-6 (November 2011): 341–88. http://dx.doi.org/10.1179/1743280411y.0000000003.

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12

Spalding, I. J. "Laser materials processing." Optics & Laser Technology 17, no. 5 (October 1985): 275. http://dx.doi.org/10.1016/0030-3992(85)90048-9.

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13

Tam, S. C. "Laser material processing." Journal of Materials Processing Technology 39, no. 1-2 (October 1993): 229. http://dx.doi.org/10.1016/0924-0136(93)90021-w.

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14

Ireland, Clive. "Laser materials processing." Optics & Laser Technology 24, no. 4 (August 1992): 239–40. http://dx.doi.org/10.1016/0030-3992(92)90031-v.

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15

MIYAMOTO, Isamu. "Laser materials processing." Journal of the Japan Society for Precision Engineering 75, no. 1 (2009): 66–67. http://dx.doi.org/10.2493/jjspe.75.66.

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16

Nakazawa, Hiromu. "LASER RHEOLOGY PROCESSING." Advanced Manufacturing Processes 1, no. 2 (January 1986): 323–39. http://dx.doi.org/10.1080/10426918608953167.

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17

Goswami, G. L., and Dilip Kumar. "Laser materials processing." Bulletin of Materials Science 11, no. 2-3 (November 1988): 213–24. http://dx.doi.org/10.1007/bf02744555.

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18

Gillner, Arnold. "Laser Micro Processing." Laser Technik Journal 5, no. 1 (January 2008): 27–30. http://dx.doi.org/10.1002/latj.200790202.

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19

OKAMOTO, Y., N. KATAOKA, Y. UNO, I. TANINO, and S. NAKASHIBA. "Machining Characteristics of Aluminum Nitride by Harmonics of Nd:YAG Laser(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 269–72. http://dx.doi.org/10.1299/jsmelem.2005.1.269.

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20

WATANABE, Takehiro. "Precision Processing by Laser. Foreign Research Trend in Laser Material Processing." Journal of the Japan Society for Precision Engineering 65, no. 11 (1999): 1574–78. http://dx.doi.org/10.2493/jjspe.65.1574.

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21

Li, Shuang Mei. "Research of Laser Shock Processing." Applied Mechanics and Materials 182-183 (June 2012): 343–47. http://dx.doi.org/10.4028/www.scientific.net/amm.182-183.343.

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This paper analyzes the actual requirements for the laser in laser shock processing. A laser used in laser shock processing for special experiment is designed and main performance of the laser has been tested.

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22

Novikov, Dmitri. "Advances in Laser Processing." AM&P Technical Articles 181, no. 6 (September 1, 2023): 25–28. http://dx.doi.org/10.31399/asm.amp.2023-06.p025.

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Abstract This guide outlines recent advances in the various methods of laser technology and appropriate manufacturing applications. Each process has unique requirements and matching the laser source to the project is essential for developing a robust solution.

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23

WASHIO, Kunihiko. "Precision Processing by Laser. Precision Micro-Processing by All-Solid-State Lasers." Journal of the Japan Society for Precision Engineering 65, no. 11 (1999): 1566–69. http://dx.doi.org/10.2493/jjspe.65.1566.

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24

Arnold, Craig B., and Alberto Piqué. "Laser Direct-Write Processing." MRS Bulletin 32, no. 1 (January 2007): 9–15. http://dx.doi.org/10.1557/mrs2007.9.

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AbstractDirect-write techniques enable computer-controlled two- and three-dimensional pattern formation in a serial fashion. Among these techniques, the versatility offered by laser-based direct-write methods is unique, given their ability to add, remove, and modify different types of materials without physical contact between a tool or nozzle and the material of interest. Laser pulses used to generate the patterns can be manipulated to control the composition, structure, and even properties of individual three-dimensional volumes of materials across length scales spanning six orders of magnitude, from nanometers to millimeters. Such resolution, combined with the ability to process complex or delicate material systems, enables laser direct-write tools to fabricate structures that are not possible to generate using other serial or parallel fabrication techniques. The goal of the articles in this issue of MRS Bulletin is to illustrate the range of materials processing capabilities, fundamental research opportunities, and commercially viable applications that can be achieved using recently developed laser direct-write techniques. We hope that the articles provide the reader with a fresh perspective on the challenges and opportunities that these powerful techniques offer for the fabrication of novel devices and structures.

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25

Hou, Zhi-Shan, Qiu-Lan Huang, Xue-Peng Zhan, Ai-Wu Li, and Huai-Liang Xu. "Real 3D microsphere lasers by femtosecond laser processing." RSC Advances 7, no. 27 (2017): 16531–34. http://dx.doi.org/10.1039/c6ra28840e.

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26

Shizhou Xiao, Shizhou Xiao, and Andreas Ostendorf Andreas Ostendorf*. "Laser Processing in Solar Cell Production(Invited Paper)." Chinese Journal of Lasers 36, no. 12 (2009): 3116–24. http://dx.doi.org/10.3788/cjl20093612.3116.

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27

LAL, BAJRANG, and PANKAJ JAIN. "LASER IN CERAMICS PROCESSING." International Journal of Modern Physics: Conference Series 22 (January 2013): 701–7. http://dx.doi.org/10.1142/s201019451301088x.

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LASER, an acronym for Light Amplification by Stimulated Emission of Radiation have unique properties, Which make it differ from ordinary light such as it is highly coherent, monochromatic, negligible divergence and scattering loss and a intense beam of electromagnetic radiation or light. It also occur in a wide range of wavelength/frequency (from Ultraviolet to Infrared), energy/power and beam-mode/configurations ; Due to these unique properties, it have use in wide application of ceramic processing for industrial manufacturing, fabrication of electronic circuit such as marking, serializing, engraving, cutting, micro-structuring because laser only produces localized heating, without any contact and thermal stress on the any part during processing. So there is no risk of fracturing that occurs during mechanical sawing and also reduce Cost of processing. The discussion in this paper highlight the application of laser in ceramics processing.

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28

FUJIWARA, Junji. "Laser Processing System Using Direct Diode Laser." JOURNAL OF THE JAPAN WELDING SOCIETY 89, no. 1 (2020): 63–69. http://dx.doi.org/10.2207/jjws.89.63.

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29

Klug, Ulrich, and Frank Siegel. "Laser Micro Processing using short Laser Pulses." Laser Technik Journal 4, no. 1 (January 2007): 32–35. http://dx.doi.org/10.1002/latj.200790140.

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30

KAWASUMI, Hiromichi. "Laser processing of materials." Jitsumu Hyomen Gijutsu 32, no. 4 (1985): 149–59. http://dx.doi.org/10.4139/sfj1970.32.149.

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31

KATAYAMA, Seiji. "Progress in Laser Processing." Journal of Smart Processing 1, no. 1 (2012): 8–19. http://dx.doi.org/10.7791/jspmee.1.8.

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32

MIZOBE, Hirofumi, and Tsuyoshi NAKAMURA. "Intelligence in Laser Processing." Journal of Smart Processing 6, no. 2 (2017): 52–56. http://dx.doi.org/10.7791/jspmee.6.52.

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33

KITAGAWA, Akikazu. "Laser processing of ceramics." Journal of the Surface Finishing Society of Japan 40, no. 8 (1989): 885–88. http://dx.doi.org/10.4139/sfj.40.885.

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34

NAGAI, Haruhiko. "Laser processing 30 years." Review of Laser Engineering 19, no. 1 (1991): 38–39. http://dx.doi.org/10.2184/lsj.19.38.

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35

DAIDO, Hiroyuki. "Laser Processing Technology (1)." Journal of the Institute of Electrical Engineers of Japan 136, no. 7 (2016): 422–25. http://dx.doi.org/10.1541/ieejjournal.136.422.

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36

MIKAME, Kazuhisa, and Hiroyuki NIINO. "Laser Processing Technology (2)." Journal of the Institute of Electrical Engineers of Japan 136, no. 7 (2016): 426–29. http://dx.doi.org/10.1541/ieejjournal.136.426.

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37

Steen, W. M. "Laser processing in manufacturing." Optics & Laser Technology 26, no. 2 (April 1994): 140–41. http://dx.doi.org/10.1016/0030-3992(94)90100-7.

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38

Steen, W. M. "Laser processing in manufacturing." Materials & Design 14, no. 5 (January 1993): 313. http://dx.doi.org/10.1016/0261-3069(93)90148-o.

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39

Ilyuschenko, A. Ph, V. A. Okovity, N. K. Tolochko, and S. Steinhauser. "Laser processing of ZrO2coatings." Materials and Manufacturing Processes 17, no. 2 (January 5, 2002): 157–67. http://dx.doi.org/10.1081/amp-120003526.

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40

Rooks, Brian. "Laser processing of plastics." Industrial Robot: An International Journal 31, no. 4 (August 2004): 338–42. http://dx.doi.org/10.1108/01439910410541837.

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41

Zimmer, K. "Laser Processing and Chemistry." Zeitschrift für Physikalische Chemie 208, Part_1_2 (January 1999): 291–92. http://dx.doi.org/10.1524/zpch.1999.208.part_1_2.291a.

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42

Dutta Majumdar, J., and I. Manna. "Laser processing of materials." Sadhana 28, no. 3-4 (June 2003): 495–562. http://dx.doi.org/10.1007/bf02706446.

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43

Davies, W. S. "Laser processing in manufacturing." Optics and Lasers in Engineering 18, no. 5 (January 1993): 380. http://dx.doi.org/10.1016/0143-8166(93)90048-p.

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44

Rath, Wolfram, and Corinna Brettschneider. "Industrial Laser Materials Processing." Laser Technik Journal 11, no. 4 (September 2014): 23–27. http://dx.doi.org/10.1002/latj.201400037.

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45

Afanasieva, Оlga, Nataliia Lalazarova, Anatolіy Chygryn, and Olena Popova. "Modeling laser processing of materials." Bulletin of Kharkov National Automobile and Highway University 1, no. 103 (December 29, 2023): 151. http://dx.doi.org/10.30977/bul.2219-5548.2023.103.1.151.

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For a long time, the complexity of the phenomena occurring during the laser exposure to the material made possible the mainly experimental selection of processing modes. The analysis of the thermal processes taking place at the same time and the programs being used require in-depth knowledge of physical phenomena, as well as broad capabilities of computing equipment, so they have become inaccessible to many researchers. Goal. The purpose of the study is to model the interaction of laser radiation with substance on the example of acrylic glass using the COMSOL Multiphysics 5.5 software package. Methodology. The scrap material for research was acrylic extrusion glass according to GOST 17622-72 and GOST 10667-99. Successful laser treatment requires maximum absorption of radiation, so a CO2 laser with a wavelength of 10.6 microns was chosen for the research. Other laser processing parameters (power 10 W, focus point diameter 1 mm, pro-menu movement speed 40 mm/s) are typical for the StoLaser Standard 4030 Mini installation. Results. The main task was modelling of the interaction of laser radiation with substance on the example of acrylic glass using the COMSOL Multiphysics 5.5 software package. The paper investigates the peculiarities and nature of the interaction of laser radiation with acrylic glass using the finite element method, as well as with the help of the COMSOL software complex, which works according to this method. A program for modelling the interaction of a laser beam with a material, in this case non-metallic, was created experimentally. A graphical distribution of heat on the surface and an isotherm of the depth of heat distribution inside the material were obtained. Scientific novelty. In this paper, a model of the passage of laser radiation through a block of dielectric material was created using the COMSOL Multiphysics package. The possibility of modeling laser processing of materials by the finite element method was proven. Practicality. The developed model can be used when choosing the modes of laser processing of various materials.

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46

Kwok, C. T., K. I. Leong, F. T. Cheng, and H. C. Man. "Enhancement in Properties of High-speed Steel by Laser Surface Treatment(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 257–62. http://dx.doi.org/10.1299/jsmelem.2005.1.257.

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47

TAKAHASHI, Kenji, Takehiro WATANABE, Souta MATSUSAKA, and Tsutomu WADA. "Direct Micro-joining of Copper Materials with YAG Laser Beams(Laser processing (continued))." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.2 (2005): 799–804. http://dx.doi.org/10.1299/jsmelem.2005.2.799.

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48

SUZUKI, Ryo, Jiang ZHU, Tomohisa TANAKA, and Yoshio SAITO. "E20 Excimer Laser 3D Machining Based on Irradiation Pulse Number Control(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 581–84. http://dx.doi.org/10.1299/jsmelem.2009.5.581.

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49

OGAWA, Keiji, Heisaburo NAKAGAWA, and Satoshi WATANABE. "E25 Run-out Correction Technology Using Laser On-the-Machine Tool(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 603–8. http://dx.doi.org/10.1299/jsmelem.2009.5.603.

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50

LIU, Zhongjie, and Muneharu KUTSUNA. "Parametric Study on Laser-Arc Hybrid Welding of High Strength Steels Using CO_2 Laser(Laser processing (continued))." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.2 (2005): 793–98. http://dx.doi.org/10.1299/jsmelem.2005.2.793.

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