Relevant bibliographies by topics / Laser processing

Contents

  1. Journal articles
  2. Dissertations / Theses
  3. Books
  4. Book chapters
  5. Conference papers
  6. Reports

Academic literature on the topic 'Laser processing'

Author: Grafiati
Published: 4 June 2021
Last updated: 12 October 2024

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Journal articles on the topic "Laser processing"

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KOBAYASHI, Naoto, Takashi UEDA, Tatsuaki FURUMOTO, Akira HOSOKAWA, and Ryutaro TANAKA. "E23 Laser Sintering Characteristics of Metallic Powder with Yb Fiber Laser : Optimization of Processing Conditions about Laser irradiation(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2009.5 (2009): 593–96. http://dx.doi.org/10.1299/jsmelem.2009.5.593.

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IKEDA, Masayuki. "Precision Processing by Laser. Laser Material Processing." Journal of the Japan Society for Precision Engineering 65, no. 11 (1999): 1539–42. http://dx.doi.org/10.2493/jjspe.65.1539.

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OGITA, Taira, Toru MURAI, and Masaru KANAOKA. "High-quality Laser Welding of Stainless Steels(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 279–84. http://dx.doi.org/10.1299/jsmelem.2005.1.279.

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TOYODA, KOICHI. "Laser processing." Review of Laser Engineering 21, no. 1 (1993): 185–87. http://dx.doi.org/10.2184/lsj.21.185.

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Zhan, Xuepeng, Huailiang Xu, and Hongbo Sun. "Femtosecond laser processing of microcavity lasers." Frontiers of Optoelectronics 9, no. 3 (September 2016): 420–27. http://dx.doi.org/10.1007/s12200-016-0581-8.

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Chen, Ying-Tung, Yunn-shiuan Liao, and Ta-Tung Chen. "Fabrication of arrayed microneedles by laser LIGA process(Laser processing)." Proceedings of International Conference on Leading Edge Manufacturing in 21st century : LEM21 2005.1 (2005): 285–90. http://dx.doi.org/10.1299/jsmelem.2005.1.285.

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TOYODA, Koichi. "Laser Materials Processing." Review of Laser Engineering 24, Supplement (1996): P1—P4. http://dx.doi.org/10.2184/lsj.24.supplement_p1.

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YONEDA, Masafumi, and Munehide KATSUMURA. "Laser hybrid processing." Journal of the Japan Welding Society 58, no. 6 (1989): 427–34. http://dx.doi.org/10.2207/qjjws1943.58.427.

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TOYODA, Koichi. "Laser Photochemical Processing." Review of Laser Engineering 38, no. 1 (2010): 39–42. http://dx.doi.org/10.2184/lsj.38.39.

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Roessler, David M. "Laser Materials Processing." Optical Engineering 36, no. 12 (December 1, 1997): 3481. http://dx.doi.org/10.1117/1.601561.

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Dissertations / Theses on the topic "Laser processing"

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O'Neill, William. "Mixed wavelength laser processing." Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46479.

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Patz, Timothy Matthew. "Laser Processing of Biological Materials." Thesis, Georgia Institute of Technology, 2005. http://hdl.handle.net/1853/7451.

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I have explored the use of the matrix assisted pulsed laser evaporation (MAPLE) and MAPLE direct write (MDW) to create thin films of biological materials. MAPLE is a novel physical vapor deposition technique used to deposit thin films of organic materials. The MAPLE process involves the laser desorption of a frozen dilute solution (1-5%) containing the material to be deposited. A focused laser pulse (~200 mJ/cm2) impacts the frozen target, which causes the solvent to preferentially absorb the laser energy and evaporate. The collective action of the evaporated solvent desorbs the polymeric solute material towards the receiving substrate placed parallel and opposite to the target. The bioresorbable polymer PDLLA and the anti-inflammatory pharmaceutical dexamethasone were processed using MAPLE, and characterized using Fourier transform infrared spectroscopy, atomic force microscopy and x-ray photoelectron spectroscopy. MDW is a CAD/CAM controlled direct writing process. The material to be transferred is immersed in a laser-absorbing matrix or solution and coated onto a target or support positioned microns to millimeters away from a receiving substrate. Using a UV microscope objective, a focused laser pulse is directed at the backside of the ribbon, so that the laser energy first interacts with the matrix at the ribbon/matrix interface. This energy is used to gently desorb the depositing material and matrix onto the receiving substrate. I have deposited neuroblasts within a three-dimensional extracellular matrix. These two laser processing techniques have enormous potential for functional medical device and tissue engineering applications.
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Beck, Rainer Johannes. "Adaptive optics for laser processing." Thesis, Heriot-Watt University, 2011. http://hdl.handle.net/10399/2462.

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The overall aim of the work presented in this thesis is to develop an adaptive optics (AO) technique for application to laser-based manufacturing processes. The Gaussian beam shape typically coming from a laser is not always ideal for laser machining. Wavefront modulators, such as deformable mirrors (DM) and liquid crystal spatial light modulators (SLM), enable the generation of a variety of beam shapes and furthermore offer the ability to alter the beam shape during the actual process. The benefits of modifying the Gaussian beam shape by means of a deformable mirror towards a square flat top profile for nanosecond laser marking and towards a ring shape intensity distribution for millisecond laser drilling are presented. Limitations of the beam shaping capabilities of DM are discussed. The application of a spatial light modulator to nanosecond laser micromachining is demonstrated for the first time. Heat sinking is introduced to increase the power handling capabilities. Controllable complex beam shapes can be generated with sufficient intensity for direct laser marking. Conventional SLM devices suffer from flickering and hence a process synchronisation is introduced to compensate for its impact on the laser machining result. For alternative SLM devices this novel technique can be beneficial when fast changes of the beam shape during the laser machining are required. The dynamic nature of SLMs is utilised to improve the marking quality by reducing the inherent speckle distribution of the generated beam shape. In addition, adaptive feedback on the intensity distribution can further improve the quality of the laser machining. In general, beam shaping by means of AO devices enables an increased flexibility and an improved process control, and thus has a significant potential to be used in laser materials processing.
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Lutey, Adrian Hugh Alexander <1986&gt. "High-Speed Laser Processing of Thin Single and Multi-Layer Films." Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2013. http://amsdottorato.unibo.it/5741/1/Lutey_Adrian_tesi.pdf.

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Theoretical models are developed for the continuous-wave and pulsed laser incision and cut of thin single and multi-layer films. A one-dimensional steady-state model establishes the theoretical foundations of the problem by combining a power-balance integral with heat flow in the direction of laser motion. In this approach, classical modelling methods for laser processing are extended by introducing multi-layer optical absorption and thermal properties. The calculation domain is consequently divided in correspondence with the progressive removal of individual layers. A second, time-domain numerical model for the short-pulse laser ablation of metals accounts for changes in optical and thermal properties during a single laser pulse. With sufficient fluence, the target surface is heated towards its critical temperature and homogeneous boiling or "phase explosion" takes place. Improvements are seen over previous works with the more accurate calculation of optical absorption and shielding of the incident beam by the ablation products. A third, general time-domain numerical laser processing model combines ablation depth and energy absorption data from the short-pulse model with two-dimensional heat flow in an arbitrary multi-layer structure. Layer removal is the result of both progressive short-pulse ablation and classical vaporisation due to long-term heating of the sample. At low velocity, pulsed laser exposure of multi-layer films comprising aluminium-plastic and aluminium-paper are found to be characterised by short-pulse ablation of the metallic layer and vaporisation or degradation of the others due to thermal conduction from the former. At high velocity, all layers of the two films are ultimately removed by vaporisation or degradation as the average beam power is increased to achieve a complete cut. The transition velocity between the two characteristic removal types is shown to be a function of the pulse repetition rate. An experimental investigation validates the simulation results and provides new laser processing data for some typical packaging materials.
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Lutey, Adrian Hugh Alexander <1986&gt. "High-Speed Laser Processing of Thin Single and Multi-Layer Films." Doctoral thesis, Alma Mater Studiorum - Università di Bologna, 2013. http://amsdottorato.unibo.it/5741/.

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Theoretical models are developed for the continuous-wave and pulsed laser incision and cut of thin single and multi-layer films. A one-dimensional steady-state model establishes the theoretical foundations of the problem by combining a power-balance integral with heat flow in the direction of laser motion. In this approach, classical modelling methods for laser processing are extended by introducing multi-layer optical absorption and thermal properties. The calculation domain is consequently divided in correspondence with the progressive removal of individual layers. A second, time-domain numerical model for the short-pulse laser ablation of metals accounts for changes in optical and thermal properties during a single laser pulse. With sufficient fluence, the target surface is heated towards its critical temperature and homogeneous boiling or "phase explosion" takes place. Improvements are seen over previous works with the more accurate calculation of optical absorption and shielding of the incident beam by the ablation products. A third, general time-domain numerical laser processing model combines ablation depth and energy absorption data from the short-pulse model with two-dimensional heat flow in an arbitrary multi-layer structure. Layer removal is the result of both progressive short-pulse ablation and classical vaporisation due to long-term heating of the sample. At low velocity, pulsed laser exposure of multi-layer films comprising aluminium-plastic and aluminium-paper are found to be characterised by short-pulse ablation of the metallic layer and vaporisation or degradation of the others due to thermal conduction from the former. At high velocity, all layers of the two films are ultimately removed by vaporisation or degradation as the average beam power is increased to achieve a complete cut. The transition velocity between the two characteristic removal types is shown to be a function of the pulse repetition rate. An experimental investigation validates the simulation results and provides new laser processing data for some typical packaging materials.
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Gulia, Kiran. "Pulsed laser processing of dielectric materials." Thesis, Heriot-Watt University, 2007. http://hdl.handle.net/10399/2035.

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The thesis investigates the wavelength dependent laser ablp..~ion in dielectric materials used for the fabrication ofhigh density Printed Circuit Boards (PCBs) in the electronics industry. Here the market for consumer and industrial products of ever-rising complexity has led to a demand for increased miniaturisation and low costs of multilevel printed circuit boards (PCBs) interconnected by microvias, which electrically connect the various circuit layers. Laser machining offers a potential solution to this need. The main objective of the research is to investigate the wavelength-dependence of the laser machining/drilling efficiency of two important sets of PCB materials, categorised as Organics and Ceramics using a carbon dioxide laser which can be tuned across its emission spectrum in the 9flm - 11 flm spectral region.. The organics include commercially available electronic materials with trade names such as Kapton, ArIon, FR4 and RCC and the ceramics materials studied are alumina and low temperature cofired ceramic (LTCC). The aim is to determine the optimum laser wavelength for maximum processing efficiency Le. to find the wavelength where the laser parameters are best matched to the optical, thermal and mechanical properties of each of the materials. A CO2 laser machining system was constructed which incorporated a novel laser source developed in the research programmes. The laser source was a MOPA system with a line-tuneable cw oscillator and a five pass power planar waveguide rf discharge-excited power operating in the so-called enhanced power regime to produce maximum peak power. An Acousto-optic modulator between the master oscillator and the amplifier allowed convenient control of pulse amplitude and duration. The system enabled the wavelength dependent studies on the wavelength and pulse energy dependence of the laser ablation properties (e.g. ablation threshold fluence and ablation rates) - to derive the so-called 'ablation spectrum' of the selected materials A comparison is made of the wavelength dependence of ablation with the room temperature absorption spectrum measured for each material using ellipsometry. It was observed that the 'ablation spectrum' information does not always appear to match the simple expectations derived from the room temperature 'absorption spectrum' of the material. This disparity in results is likely due to the change of absorption properties of • material because of rise in temperature, chemical decomposition or melting of material during ablation. However, the room temperature absorption spectrum (while not adequate alone), did provide a useful guide to the selection of a sub-set of the 40+ lines that would otherwise have to be studied. The results may be of direct application in the electronics industry to increase the efficiency oflaser machining.
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Holmberg, Patrik. "Laser processing of Silica based glass." Doctoral thesis, KTH, Laserfysik, 2015. http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-173929.

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The main topic of this thesis work is photosensitivity and photo-structuring of optical fibers and bulk glass. Although research in the field of photosensitivity in glass and optical fibers has been ongoing for more than three decades, the underlying mechanisms are still not well understood. The objective was to gain a better understanding of the photo-response by studying photosensitivity from a thermodynamic perspective, as opposed to established research focusing on point defects and structural changes, and strain and stress in optical fibers. Optical fibers was mainly used for experimental studies for two reasons; first, photosensitivity in fibers is more pronounced and more elusive compared to its bulk counterpart, and secondly, fibers provide a simplified structure to study as they experimentally can be seen as one-dimensional.Initially, ablation experiments on bulk glass were performed using picosecond infrared pulses. With a design cross section of 40x40 μm, straight channels were fabricated on the top (facing incident light) and bottom side of the sample and the resulting geometries were analyzed. The results show a higher sensitivity to experimental parameters for bottom side ablation which was ascribed to material incubation effects. Moreover, on the top side, the resulting geometry has a V-shape, independent of experimental parameters, related to the numerical aperture of the focusing lens, which was ascribed to shadowing effects.After this work, the focus shifted towards optical fibers, UV-induced fiber Bragg gratings (FBGs) and thermal processing with conventional oven and with a CO2 laser as a source of radiant heat.First, a system for CO2 laser heating of optical fibers was constructed. For measuring the temperature of the processed fibers, a special type of FBG with high temperature stability, referred to as "Chemical Composition Grating" (CCG) was used. A thorough characterization and temperature calibration was performed and the results show the temperature dynamics with a temporal resolution of less than one millisecond. The temperature profile of the fiber and the laser beam intensity profile could be measured with a spatial resolution limited by the grating length and diameter of the fiber. Temperatures as high as ~ 1750 °C could be measured with corresponding heating and cooling rates of 10.500 K/s and 6.500 K/s.Subsequently, a thorough investigation of annealing and thermal regeneration of FBGs in standard telecommunication fibers was performed. The results show that thermal grating regeneration involves several mechanisms. For strong regeneration, an optimum annealing temperature near 900 C was found. Two different activation energies could be extracted from an Arrhenius of index modulation and Braggv iwavelength, having a crossing point also around 900 °C, indication a balance of two opposing mechanisms.Finally, the thermal dynamics and spectral evolution during formation of long period fiber gratings (LPGs) were investigated. The gratings were fabricated using the CO2 laser system by periodically grooving the fibers by thermal ablation. Transmission losses were reduced by carefully selecting the proper processing conditions. These parameters were identified by mapping groove depth and transmission loss to laser intensity and exposure time.
Huvudtemana i denna avhandling är fotokänslighet och fotostrukturering av optiska fibrer och bulk glas. Trots att forskning inom fotokänslighet i glas och optiska fibrer har pågått under mer än tre decennier är de bakomliggande mekanismerna ännu inte klarlagda. Syftet var att få en bättre förståelse för fotoresponsen genom att studera fotokäsligheten ur ett termodynamiskt perspektiv, i motsats till etablerad forskning med fokus på punktdefekter och strukturförändringar, samt mekaniska spännings effekter i optiska fibrer. Optiska fibrer användes för flertalet av de experimentella studierna av två skäl; för det första är fotokänsligheten i fibrer större och dessutom vet man mindre om bakomliggande mekanismer jämfört med motsvarande bulk glas, och för det andra kan fibrer vara enklare att studera eftersom de experimentellt kan ses som en endimensionell struktur.Inledningsvis utfördes ablaherings experiment på bulk glas med en infraröd laser med pikosekund pulser. Raka kanaler med ett designtvärsnitt på 40x40 μm tillverkades på ovansidan (mot infallande ljus) och bottensidan av provet och de resulterande geometrierna analyserades. Resultaten visar en högre känslighet för variationer i experimentella parametrar vid ablahering på undersidan vilket kan förklaras av inkubations effekter i materialet. Dessutom är den resulterande geometrin på ovansidan V-formad, oavsett experimentella parametrar, vilket kunde relateras till den numeriska aperturen hos den fokuserande linsen, vilket förklaras av skuggningseffekter.Efter detta arbete flyttades fokus mot optiska fibrer, UV inducerade fiber Bragg gitter (FBG), och termisk bearbetning med konventionell ugn samt även med en CO2-laser som källa för strålningsvärme.Först konstruerades ett system för CO2-laservärmning av fibrer. För mätning av temperaturen hos bearbetade fibrer användes en speciell sorts FBG med hög temperaturstabilitet, kallade ”Chemical Composition Gratings” (CCG). En grundlig karaktärisering och temperaturkalibrering utfördes och temperaturdynamiken mättes med en tidsupplösning på under en millisekund. Temperaturprofilen i fibern, och laserns strålprofil, kunde mätas med en spatiell upplösning begränsad av gitterlängden och fiberns diameter. Temperaturer upp till ~1750 °C, vilket är högre än mjukpunktstemperaturen, kunde mätas med korresponderande uppvärmnings- och avsvalningshastighet på 10.500 K/s och 6.500 K/s.Därefter gjordes en omfattande undersökning av värmebearbetning och termisk regenerering av FBG:er i telekomfiber. Resultaten visar att termisk gitter-regenerering aktiveras av flera olika mekanismer. Värmebearbetning vid en temperatur omkring 900 °C resulterade i starka gitter efter en regenerering vid en temperatur på 1100 °C. Två olika aktiveringsenergier kunde extraheras från en Arrhenius plot avseende brytningsindexmodulation och Braggvåglängd, med en skärningspunkt tillika runt 900 °C, vilket indikerar en avvägning mellan två motverkande mekanismer vid denna temperatur.Slutligen undersöktes temperaturdynamiken och de spektrala egenskaperna under tillverkning av långperiodiga fibergitter (LPG). Gittren tillverkades med CO2-vi iilasersystemet genom att skapa en periodisk urgröpning medelst termisk ablahering. Transmissionsförluster kunde reduceras med noggrant valda processparametrar. Dessa parametrar identifierades genom mätningar av ablaherat djup och transmissionsförlust som funktion av laserintensitet och exponeringstid.

QC 20150924

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Zhang, Jingyu. "Polarization sensitive ultrafast laser material processing." Thesis, University of Southampton, 2016. https://eprints.soton.ac.uk/419400/.

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In this thesis, I will concentrate on ultrafast laser interactions with various materials such as fused silica, crystalline silicon, amorphous silicon and nonlinear crystal. The first polarization sensitive ultrafast laser material interaction to be illustrated was second harmonic generation in lithium niobate by tightly focused cylindrical vector beams. The generated second harmonic patterns were experimentally demonstrated and theoretically explained. Existence of the longitudinal component of the fundamental light field was proven. The same beams were used for modifying fused silica glass. Distribution of the electric field in the focal region was visualized by the presence of self-assembled nanogratings. Also in this experiment, crystalline and amorphous silicon were modified by the focused cylindrical vector beams. The generated modifications matched well with the theoretical simulations. Polarization dependent structure was not observed under single pulse irradiation above the silicon surface. The generated isotropic crater structures with their smooth surface can be implemented as a wavefront sensor. Unexpectedly, an entirely different modification was observed after the double pulse laser irradiation. The size and orientation of the structure can be independently manipulated by the energy of the first pulse and polarization of the second pulse. Theoretical analysis was conducted and the formation mechanism of the polarization dependent structures was explained. This structure on silicon surface can be used for the polarization-multiplexed optical memory. One type of polarization sensitive ultrafast laser modification in fused silica is nanogratings. This modification exhibits form birefringence and therefore can be implemented for multi-dimensional optical data storage. Optimized data recording parameters were determined by sets of experiments. Stress-induced birefringence was observed and explained by material expansion at different conditions. Finally, the multilevel encoding of polarization and intensity states of light with self-assembled nanostructures was illustrated. A new writing setup was designed and involved a spatial light modulator, a half-wave plate matrix and a 4F optical system. The data recording rate was increased by 2 orders of magnitude compared to conventional laser direct writing setup using polarization optics. The recording and readout of digital information was experimental demonstrated. We successfully recorded across three layers a digital copy of a 310KB file. The benefits of 5D optical data storage, such as long lifetime and high capacity were illustrated. In addition, the theoretical limitations of the current writing system and readout system were discussed and several upgraded systems were proposed.
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Collins, Gustina B. "Laser Processing of Polyimide on Copper." Thesis, Virginia Tech, 2001. http://hdl.handle.net/10919/32559.

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While work using a laser for processing a polymer dielectric is currently being studied, the purpose of this thesis is to present an effective and economical approach using laboratory equipment that is most commonly used and available for the processing of materials including polymers and metals. The use of a laser allows for a more cost effective and flexible method for processing polyimide over other wet and dry processes. This thesis represents the results of research on the laser processing of polyimide on copper. The research examines the effect of the laser processing parameters using a CO2 laser. The parameters examined include the pulse width, repetition rate, and number of pulses. The processed samples include freestanding Kapton with no adhesive layer, freestanding Kapton with an adhesive layer, and Kapton with adhesive layered on copper. The laser processing used a single laser shot with the parameters being varied over a series of shots fired. The effect of the parameters was observed over large and small ranges. The characteristics of processed freestanding samples were graphically presented along with captured images. The results demonstrate that the laser processing of polyimide is strongly dependent on the laser pulse width and that the optimum value from these experiments suggest the use of a pulse width of 60ms for using a CO2 laser. From these results, further considerations for the laser processing of polyimide on copper were given.
Master of Science
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Franzel, Louis. "Modification of Nanostructures via Laser Processing." VCU Scholars Compass, 2013. http://scholarscompass.vcu.edu/etd/3024.

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Modification of nanostructures via laser processing is of great interest for a wide range of applications such as aerospace and the storage of nuclear waste. The primary goal of this dissertation is to improve the understanding of nanostructures through two primary routes: the modification of aerogels and pulsed laser ablation in ethanol. A new class of materials, patterned aerogels, was fabricated by photopolymerizing selected regions of homogeneous aerogel monoliths using visible light. The characterization and fabrication of functionally graded, cellular and compositionally anisotropic aerogels and ceramics is discussed. Visible light was utilized due to it’s minimal absorption and scattering by organic molecules and oxide nanoparticles within wet gels. This allowed for the fabrication of deeply penetrating, well resolved patterns. Similarly, nanoporous monoliths with a typical aerogel core and a mechanically robust exterior ceramic layer were synthesized from silica aerogels cross-linked with polyacrylonitrile. Simple variations of the exposure geometry allowed fabrication of a wide variety of anisotropic materials without requiring layering or bonding. Nanoparticle solutions were prepared by laser ablation of metal foils (Fe and Mo) in ethanol. Ablation of Fe generated Fe3O4 and Fe3C nanoparticles which were superparamagnetic with a saturation magnetization Ms = 124 emu/g. Zero field cooled (ZFC) measurements collected at an applied field of 50 Oe displayed a maximum magnetic susceptibility at 120 K with a broad distribution. Field cooled (FC) measurements showed a thermal hysteresis indicative of temperature dependent magnetic viscosity. Pulsed laser ablation of a Mo foil in ethanol generated inhomogeneous nanoparticles where Mo and MoC coexisted within the same aggregate. Formation of these unique nanoparticles is likely due to phase separation that occurs when a high temperature carbide phase cools after the laser pulse terminates. Similarly, magnetic nanoparticle suspensions were generated by pulsed laser ablation of Fe and Mo in ethanol. The formation of several carbide phases with no discernable alloy formation was seen. A decrease in magnetization with a decrease in Fe concentration was seen which was reconciled with the decreased Fe content in the system. However, at Fe concentrations below ~ 40%, an increase in Ms and Hc was observed which was reconciled with the disappearance of the ε–Fe3C. TEM analysis showed the formation of core-shell nanoparticles and Energy Filtered TEM showed the distribution of Fe-based nanoparticles in the suspensions.
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Books on the topic "Laser processing"

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R, Migliore Leonard, ed. Laser materials processing. New York: M. Dekker, 1996.

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Steen, William M. Laser Material Processing. London: Springer London, 1998. http://dx.doi.org/10.1007/978-1-4471-3609-5.

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Steen, William M. Laser Material Processing. London: Springer London, 2003. http://dx.doi.org/10.1007/978-1-4471-3752-8.

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Steen, William M. Laser Material Processing. London: Springer London, 1991. http://dx.doi.org/10.1007/978-1-4471-3820-4.

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Steen, William M., and Jyotirmoy Mazumder. Laser Material Processing. London: Springer London, 2010. http://dx.doi.org/10.1007/978-1-84996-062-5.

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Steen, W. M. Laser Material Processing. 4th ed. London: Springer-Verlag London, 2010.

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Steen, W. M. Laser material processing. New York: Springer-Verlag, 1991.

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Houldcraft, P. T. Lasers in materials processing. Oxford: Pergamon Press, 1991.

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International Congress on Applications of Lasers and Electro-optics (1991 San Jose, Calif.). ICALEO '91: Laser materials processing. Orlando, Fla: LIA--Laser Institute of America, 1992.

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Bäuerle, Dieter. Laser Processing and Chemistry. Berlin, Heidelberg: Springer-Verlag Berlin Heidelberg, 2011.

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Book chapters on the topic "Laser processing"

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Spalding, I. J. "Material-Processing." In Laser/Optoelektronik in der Technik / Laser/Optoelectronics in Engineering, 698–700. Berlin, Heidelberg: Springer Berlin Heidelberg, 1987. http://dx.doi.org/10.1007/978-3-642-83174-4_135.

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Steen, William M. "Laser Safety." In Laser Material Processing, 321–29. London: Springer London, 1998. http://dx.doi.org/10.1007/978-1-4471-3609-5_10.

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Steen, William M. "Laser Cutting." In Laser Material Processing, 103–46. London: Springer London, 1998. http://dx.doi.org/10.1007/978-1-4471-3609-5_4.

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Steen, William M. "Laser Welding." In Laser Material Processing, 147–89. London: Springer London, 1998. http://dx.doi.org/10.1007/978-1-4471-3609-5_5.

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Watkins, K. G. "Laser Cleaning." In Laser Material Processing, 327–50. London: Springer London, 2003. http://dx.doi.org/10.1007/978-1-4471-3752-8_10.

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Steen, William M. "Laser Safety." In Laser Material Processing, 387–95. London: Springer London, 2003. http://dx.doi.org/10.1007/978-1-4471-3752-8_12.

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Steen, William M. "Laser Cutting." In Laser Material Processing, 107–56. London: Springer London, 2003. http://dx.doi.org/10.1007/978-1-4471-3752-8_4.

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Steen, William M. "Laser Welding." In Laser Material Processing, 157–99. London: Springer London, 2003. http://dx.doi.org/10.1007/978-1-4471-3752-8_5.

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Steen, William M. "Laser Cutting." In Laser Material Processing, 69–107. London: Springer London, 1991. http://dx.doi.org/10.1007/978-1-4471-3820-4_4.

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Steen, William M. "Laser Welding." In Laser Material Processing, 108–44. London: Springer London, 1991. http://dx.doi.org/10.1007/978-1-4471-3820-4_5.

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Conference papers on the topic "Laser processing"

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Liu, Y. S. "Laser processing for interconnect technology." In OSA Annual Meeting. Washington, D.C.: Optica Publishing Group, 1990. http://dx.doi.org/10.1364/oam.1990.tuhh1.

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The development of high-power UV excimer laser sources has opened up many new opportunities in applications of lasers to material processing. The recent development of many new nonlinear optical materials has further extended the spectral coverage of high-repetition-rate solid-state lasers to deep UV (6 eV). These advances have made lasers powerful processing tools for microfabrication with either the direct-writing or projection technique. In the meantime, the rapid advance in high-speed microelectronics has significantly increased the demand for in situ and adaptive processing techniques for material and device fabrication and for related microelectronic packaging. The high-density chip-to-chip interconnect is becoming the key technology that determines the ultimate device and circuit performances. This paper reviews recent development in applying laser processing to high-density interconnect technology and discusses opportunities for in situ laser processing of materials for microelectronic packaging applications.
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Hossein-Zadeh, Mani, and Kerry J. Vahala. "Optomechanical RF Signal Processing." In Laser Science. Washington, D.C.: OSA, 2009. http://dx.doi.org/10.1364/ls.2009.lstub3.

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Liao, Xian-Ning, and Leo H. J. F. Beckmann. "Computer-assisted Laser Material Processing (CALMP): a PC database and simulation software for laser material processing." In Europto High Power Lasers and Laser Applications V, edited by Eckhard Beyer, Maichi Cantello, Aldo V. La Rocca, Lucien D. Laude, Flemming O. Olsen, and Gerd Sepold. SPIE, 1994. http://dx.doi.org/10.1117/12.184713.

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Berendt, Martin, Hugo Barbosa, Job Tomé, and Miguel Melo. "Laser diode pulse modulation in sensing and materials processing." In Semiconductor Lasers and Laser Dynamics IX, edited by Krassimir Panajotov, Marc Sciamanna, Rainer Michalzik, and Sven Höfling. SPIE, 2020. http://dx.doi.org/10.1117/12.2555821.

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Ilyuschenko, A. Ph, V. A. Okovity, N. K. Tolochko, and A. F. Shevtsov. "Laser Processing of ZrO2 Coatings." In ITSC2002, edited by C. C. Berndt and E. Lugscheider. Verlag für Schweißen und verwandte Verfahren DVS-Verlag GmbH, 2002. http://dx.doi.org/10.31399/asm.cp.itsc2002p0788.

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Abstract This work investigates the processes involved in the formation of fragmented layers produced on the surface of ceramic coatings by means of laser melting. For the experiments, plasma sprayed zirconia was applied to steel substrates and treated with CO2 and Nd:YAG lasers. The modified layers were found to consist of macro-fragments 500-2000 µm in size, which in turn consist of micro-fragments 20-70 µm in size. Crack gaps were observed at both levels with widths of 10-15 µm and 1-5 µm, respectively. Heat resistance, hardness, density, and roughness were determined before and after laser melting, and the changes measured are shown to depend on emitted laser power. Paper includes a German-language abstract.
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Chang, Dale U. "Laser Material Processing." In SAE International Congress and Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1985. http://dx.doi.org/10.4271/850406.

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Joeckle, Rene C., Andre Sontag, and Martin Schellhorn. "Laser processing with high-power gas lasers." In Gas Flow and Chemical Lasers: Tenth International Symposium, edited by Willy L. Bohn and Helmut Huegel. SPIE, 1995. http://dx.doi.org/10.1117/12.204976.

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Bauerle, Dieter. "Chemically assisted laser processing." In 2006 Conference on Lasers and Electro-Optics and 2006 Quantum Electronics and Laser Science Conference. IEEE, 2006. http://dx.doi.org/10.1109/cleo.2006.4627847.

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Zhang, Wenwu, Junke Jiao, Liang Ruan, and Tianrun Zhang. "Experimental Study on Laser High-Speed Micro-Processing." In ASME 2014 International Manufacturing Science and Engineering Conference collocated with the JSME 2014 International Conference on Materials and Processing and the 42nd North American Manufacturing Research Conference. American Society of Mechanical Engineers, 2014. http://dx.doi.org/10.1115/msec2014-4065.

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To study the characteristics of material removal with high power ultra-short pulsed lasers, a 300 W picosecond laser was used to make microgrooves in cooper and steel. The effects of laser power, laser frequency, scanning layers, and scanning velocity on the width and depth of the grooves were analyzed. The material removal rate of picosecond laser was compared with that of a 10 W nanosecond laser. The results showed that high power high frequency ultra-short pulsed lasers have good potential in high speed micromachining. Evidence showed that ps laser machining could be more efficient than nanosecond machining. There are issues to be solved to make high power ultra-short pulsed lasers the dominating process for high speed micromachining.
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Delmdahl, Ralph. "Advanced-UV excimer laser processing." In SPIE LASE: Lasers and Applications in Science and Engineering, edited by Steven J. Davis, Michael C. Heaven, and J. Thomas Schriempf. SPIE, 2009. http://dx.doi.org/10.1117/12.807981.

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Reports on the topic "Laser processing"

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Ehrlich, Daniel. Laser Microchemical Processing Instrument. Fort Belvoir, VA: Defense Technical Information Center, September 1995. http://dx.doi.org/10.21236/ada304319.

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Banks, P. S., M. D. Feit, A. Komashko, M. D. Perry, A. M. Rubenchik, M. Shirk, and B. C. Stuart. Short-pulse laser materials processing. Office of Scientific and Technical Information (OSTI), April 1999. http://dx.doi.org/10.2172/9636.

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Stuart, B. C., M. D. Perry, B. R. Myers, P. S. Banks, and E. C. Honea. Short-pulse laser materials processing. Office of Scientific and Technical Information (OSTI), June 1997. http://dx.doi.org/10.2172/586810.

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Singaravelu, Senthilraja. Laser Processing of Metals and Polymers. Office of Scientific and Technical Information (OSTI), May 2012. http://dx.doi.org/10.2172/1057575.

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Stuart, B. C., and A. Wynne. Femtosecond laser processing of fuel injectors - a materials processing evaluation. Office of Scientific and Technical Information (OSTI), December 2000. http://dx.doi.org/10.2172/15006882.

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Marcus, Harris L. Solid Freeform Fabrication from Gas Precursors Using Laser Processing. Fort Belvoir, VA: Defense Technical Information Center, January 2002. http://dx.doi.org/10.21236/ada403015.

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Tober, Richard L., Carlos Monroy, Kimberly Olver, and John D. Bruno. Processing Interband Cascade Laser for High Temperature CW Operation. Fort Belvoir, VA: Defense Technical Information Center, November 2004. http://dx.doi.org/10.21236/ada428728.

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Hargrove, R. S., E. P. Dragon, R. P. Hackel, D. D. Kautz, and B. E. Warner. Laser materials processing applications at Lawrence Livermore National Laboratory. Office of Scientific and Technical Information (OSTI), February 1993. http://dx.doi.org/10.2172/10175715.

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Chen, H.-L., and L. A. Hackel. Laser Peening - A Processing Tool to Strengthen Metals or Alloys. Office of Scientific and Technical Information (OSTI), September 2003. http://dx.doi.org/10.2172/15005261.

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Crane, J., and C. J. Lehane. Laser Materials Processing Final Report CRADA No. TC-1526-98. Office of Scientific and Technical Information (OSTI), September 2017. http://dx.doi.org/10.2172/1396222.

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