Log in

Relevant bibliographies by topics / Jounce bumper / Journal articles

Journal articles on the topic 'Jounce bumper'

To see the other types of publications on this topic, follow the link: Jounce bumper.

Author: Grafiati

Published: 28 April 2023

Create a spot-on reference in APA, MLA, Chicago, Harvard, and other styles

Select a source type:

Consult the top 22 journal articles for your research on the topic 'Jounce bumper.'

Next to every source in the list of references, there is an 'Add to bibliography' button. Press on it, and we will generate automatically the bibliographic reference to the chosen work in the citation style you need: APA, MLA, Harvard, Chicago, Vancouver, etc.

You can also download the full text of the academic publication as pdf and read online its abstract whenever available in the metadata.

Browse journal articles on a wide variety of disciplines and organise your bibliography correctly.

1

Wang, Yuanlong, Liangmo Wang, Zheng-dong Ma, and Tao Wang. "Finite element analysis of a jounce bumper with negative Poisson’s ratio structure." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 231, no. 23 (January 6, 2017): 4374–87. http://dx.doi.org/10.1177/0954406216665415.

Full text

Abstract:

Jounce bumpers in automotive suspension are key components that can improve the noise, vibration, and harshness performance of entire vehicle. Traditional jounce bumper made of polyurethane usually cannot satisfy the mechanical performances required by noise, vibration, and harshness optimization. In addition, the application of hyperelastic material influenced the efficiency and reliability of numerical calculations of polyurethane jounce bumper. In this paper, an engineering negative Poisson’s ratio structure was introduced and applied on the jounce bumper. The negative Poisson’s ratio jounce bumper can be mainly defined by few structure parameters. The finite element analysis of the negative Poisson’s ratio jounce bumper was conducted applied explicit method. The influences of loading velocity and material densities on computational time and numerical results were researched. The results indicated that enlargements of material densities and loading velocity can improve the computational efficiency and have limited influence on reliability. Furthermore, a negative Poisson’s ratio jounce bumper prototype was manufactured and tested to verify the numerical results. It was proved that the finite element analysis of the negative Poisson’s ratio jounce bumper was reliable both in load–displacement curve and deformation shapes. Compared to the traditional jounce bumper, the negative Poisson’s ratio jounce bumper can achieve similar mechanical behavior but with a smoother load–displacement curve, which is beneficial to the vehicle’s noise, vibration, and harshness performance.

APA, Harvard, Vancouver, ISO, and other styles

2

Samad, M. S. A., Aidy Ali, and R. S. Sidhu. "Durability of automotive jounce bumper." Materials & Design 32, no. 2 (February 2011): 1001–5. http://dx.doi.org/10.1016/j.matdes.2010.08.017.

Full text

APA, Harvard, Vancouver, ISO, and other styles

3

Sidhu, R. S., and Aidy Ali. "Fatigue life of automotive rubber jounce bumper." IOP Conference Series: Materials Science and Engineering 11 (May 1, 2010): 012008. http://dx.doi.org/10.1088/1757-899x/11/1/012008.

Full text

APA, Harvard, Vancouver, ISO, and other styles

4

Wang, Yuanlong, Liangmo Wang, Zheng-dong Ma, and Tao Wang. "A negative Poisson's ratio suspension jounce bumper." Materials & Design 103 (August 2016): 90–99. http://dx.doi.org/10.1016/j.matdes.2016.04.041.

Full text

APA, Harvard, Vancouver, ISO, and other styles

5

Sidhu, R. S., Aidy Ali, and M. R. Hassan. "Experimental Determination of Fatigue Life of Automotive Jounce Bumper." Key Engineering Materials 462-463 (January 2011): 634–38. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.634.

Full text

Abstract:

It is evident that most rubber components in the automotive industry are subjected to repetitive loading. Vigorous research is needed towards improving the safety and reliability of the components. The study is conducted on an automotive rubber jounce bumper with a rubber hardness of 60 IRHD. The test is conducted in displacement controlled environment under compressive load. The existing models by Kim, Harbour, Woo and Li are adopted to predict the fatigue life. The experimental results show strong similarities with the predicted models.

APA, Harvard, Vancouver, ISO, and other styles

6

Lee, ChulHyung, MyeongJae Han, TaeWon Park, SukJin Lee, and JeongSik Park. "Development and Optimization of Support Bumper for Increasing the Energy Absorption of the Jounce Bumper." Transaction of the Korean Society of Automotive Engineers 27, no. 4 (April 1, 2019): 319–24. http://dx.doi.org/10.7467/ksae.2019.27.4.319.

Full text

APA, Harvard, Vancouver, ISO, and other styles

7

Wang, Yuanlong, Zheng-dong Ma, and Liangmo Wang. "A finite element stratification method for a polyurethane jounce bumper." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 230, no. 7 (August 31, 2015): 983–92. http://dx.doi.org/10.1177/0954407015602578.

Full text

APA, Harvard, Vancouver, ISO, and other styles

8

Çalışkan, Kemal, Erhan Ilhan Konukseven (1), and Y. Samim Ünlüsoy. "Product Based Material Testing for Hyperelastic Suspension Jounce Bumper Design with FEA." Key Engineering Materials 450 (November 2010): 119–23. http://dx.doi.org/10.4028/www.scientific.net/kem.450.119.

Full text

Abstract:

The basic problem in the finite element analysis of parts made of hyperelastic materials is the identification of mathematical material model coefficients. Furthermore, selection of a suitable mathematical hyperelastic material model may not be straightforward. In this study, a systematic design methodology is presented for hyperelastic suspension jounce bumpers. The presented methodology involves a critical examination of material testing procedures, material model selection, and coefficient identification. The identified material model coefficients are verified through comparison of the finite element analysis results with actual tests.

APA, Harvard, Vancouver, ISO, and other styles

9

Caliskan, Kemal, IIhan Konukseven, and Y. Samim Unlusoy. "Product-oriented material testing and FEA for hyperelastic suspension jounce bumper design." International Journal of Design Engineering 3, no. 4 (2010): 374. http://dx.doi.org/10.1504/ijde.2010.040523.

Full text

APA, Harvard, Vancouver, ISO, and other styles

10

Lee, ChulHyung, MyeongJae Han, TaeWon Park, SukJin Lee, and JeongSik Park. "Development of Tuning Jounce Bumper and Verification of Ride Comfort Performance Using the Vehicle Dynamics Model." Transactions of the Korean Society of Automotive Engineers 27, no. 10 (October 1, 2019): 803–9. http://dx.doi.org/10.7467/ksae.2019.27.10.803.

Full text

APA, Harvard, Vancouver, ISO, and other styles

11

Wang, Yuanlong, Wanzhong Zhao, Guan Zhou, Qiang Gao, and Chunyan Wang. "Optimization of an auxetic jounce bumper based on Gaussian process metamodel and series hybrid GA-SQP algorithm." Structural and Multidisciplinary Optimization 57, no. 6 (December 1, 2017): 2515–25. http://dx.doi.org/10.1007/s00158-017-1869-z.

Full text

APA, Harvard, Vancouver, ISO, and other styles

12

Wang, Yuanlong, Wanzhong Zhao, Guan Zhou, Qiang Gao, and Chunyan Wang. "Suspension mechanical performance and vehicle ride comfort applying a novel jounce bumper based on negative Poisson's ratio structure." Advances in Engineering Software 122 (August 2018): 1–12. http://dx.doi.org/10.1016/j.advengsoft.2018.04.001.

Full text

APA, Harvard, Vancouver, ISO, and other styles

13

Wang, YuanLong, WanZhong Zhao, Guan Zhou, ChunYan Wang, and Qiang Gao. "Parametric design strategy of a novel cylindrical negative Poisson’s ratio jounce bumper for ideal uniaxial compression load-displacement curve." Science China Technological Sciences 61, no. 10 (March 23, 2018): 1611–20. http://dx.doi.org/10.1007/s11431-017-9194-2.

Full text

APA, Harvard, Vancouver, ISO, and other styles

14

Pahlawan, Ilham Arifin, Alviani Hesthi Permata Ningtyas, and Burhanudin Rahmat Darmawan. "Dynamic Response of Metallic Foams Bumper with Morphology Design Variation in ABAQUS Software Simulation." Kontribusia : Research Dissemination for Community Development 6, no. 1 (January 2, 2023): 162. http://dx.doi.org/10.30587/kontribusia.v6i1.4877.

Full text

Abstract:

Variation design of open-cell foams located in the bumper car were investigated in this paper. A brief experimental result on the dynamic response of crash was focused on energy absorption and deformation behavior. The bumper design was based on typical design of bumper compared with gradual density of hexagonal foam type. The method used was imitate crashing real behavior dynamic explicit using ABAQUS simulation software with some extra constraint, such as: crashing object and crash direction. Results showed the design strongly affect the value of energy absorption and deformation. Energy absorption was higher using hexagon foams compare to the normal bumper structure with 4.8740 E6 Joule and 4.8572 E6 respectively. Furthermore, highest energy absorption was by simulated redesign hexagon foam into varying thickness (gradual density) – similar to cortical bone structure – with 4.950 E6 Joule. Meanwhile the deformation shows highest value on typical design of bumper with 4 cm translation after crashed. Expected design has to be safe for passengers with have high ability to absorb energy and minimize the deformation movement.

APA, Harvard, Vancouver, ISO, and other styles

15

Liu, Pei Sheng, Long Long Yang, Jin Xin Hang, and Ying Lu. "The Simulation and Analysis of Current Crowding and Joule Heat in Flip Chip Solder Bumps." Key Engineering Materials 645-646 (May 2015): 319–24. http://dx.doi.org/10.4028/www.scientific.net/kem.645-646.319.

Full text

Abstract:

Electro-migration has become a critical reliability issue for high density solder joints in flip chip technology, especially for current crowding and joule heat. Electro-migration force and mean time to failure of flip chip are introduced in this paper. This study employs two-dimensional simulation to investigate the distribution of current density and Joule heating in the flip chip joint. It is found that current crowding and Joule heat effect are very serious in the solder bump. The Joule heat may play important role in the void formation and thermo-migration in solder bump. And the factors that impact the distribution of current density and Joule heat are studied. The results show that the thickness of Al and UBM has great influence on the distribution of current density and Joule heat.

APA, Harvard, Vancouver, ISO, and other styles

16

Shie, Kai-Cheng, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, and Chih Chen. "Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps." Materials 14, no. 21 (October 25, 2021): 6394. http://dx.doi.org/10.3390/ma14216394.

Full text

Abstract:

In microelectronic packaging technology for three-dimensional integrated circuits (3D ICs), Cu-to-Cu direct bonding appears to be the solution to solve the problems of Joule heating and electromigration (EM) in solder microbumps under 10 μm in diameter. However, EM will occur in Cu–Cu bumps when the current density is over 106 A/cm2. The surface, grain boundary, and the interface between the Cu and TiW adhesion layer are the three major diffusion paths in EM tests, and which one may lead to early failure is of interest. This study showed that bonding strength affects the outcome. First, if the bonding strength is not strong enough to sustain the thermal mismatch of materials during EM tests, the bonding interface will fracture and lead to an open circuit of early failure. Second, if the bonding strength can sustain the bonding structure, voids will form at the passivation contact area between the Cu–Cu bump and redistribution layer (RDL) due to current crowding. When the void grows along the passivation interface and separates the Cu–Cu bump and RDL, an open circuit can occur, especially when the current density and temperature are severe. Third, under excellent bonding, when the voids at the contact area between the Cu–Cu bump and RDL do not merge together, the EM lifetime can be more than 5000 h.

APA, Harvard, Vancouver, ISO, and other styles

17

Dalil, M., Elgi Oki Andeska, and Dodi Sofyan Arief. "The Effect of Short and Long Fiber on Impact Strength in High Density Polyethylene-Fiberglass Composite." Journal of Ocean, Mechanical and Aerospace -science and engineering- (JOMAse) 66, no. 3 (November 30, 2022): 94–98. http://dx.doi.org/10.36842/jomase.v66i3.315.

Full text

Abstract:

This study aims to investigate the HDPE (High Density Polyethylene) reinforced with fiberglass to increase strength and toughness into a composite that has the potential to replace ABS (Acronitrile Butadiene Styrene). The composites were made with variations in composition based on volume fraction. The HDPE as matrix and fiberglass as reinforcement through the mixing method, molded in a heating machine (T=140°C), pressed with a pressing time of ±45 minutes. Then, the specimens were cut according to ASTM D6110 standard, and the Charpy impact test was performed. The impact of long fiber for the HDPE composition of 70%vol and fiberglass 30%vol, the average impact strength was 176.838 Joule/mm². The long fiber for the HDPE composition of 80%vol and fiberglass of 20%vol, the average impact strength was 208.08 Joule/mm². The impact of short fiber for HDPE composition of 70%vol and fiberglass of 30%vol, the average impact strength was 72.858 Joule/mm². The short fiber for HDPE composition 80%vol and fiberglass of 20%vol, the average impact strength was 33.394 Joule/mm². Based on research of ABS mixture at 40%/60%vol mixture variation, the average impact strength was 24.8 Joule/mm2 and the 20%/80%vol mixture variation, the impact strength was 18 Joule/mm². In conclusion, the impact strength of the ABS was lower than the HDPE-Fiberglass composite. Therefore, the HDPE-Fiberglass composite can be used as a substitute for ABS for car bumpers.

APA, Harvard, Vancouver, ISO, and other styles

18

Supriyanto, Supriyanto. "Karakterisik Kekuatan Komposit Serat Daun Nanas Dengan Variasi Panjang Serat." Jurnal Mesin Nusantara 4, no. 1 (July 20, 2021): 30–39. http://dx.doi.org/10.29407/jmn.v4i1.16039.

Full text

Abstract:

Penggunaan material logam memiliki peranan yang sangat besar dalam perkembangan teknologi saat ini, terutama di dunia industri maupun otomotif, salah satu yang hal yang menjadi perhatian adalah pemilihan jenis dan kualitas bahan baku material untuk pembuatan komposit kendaraan. Beradasarkan data Badan Pusat Statik (BPS), rata-rata produksi nanas di Indonesia adalah 1,5 juta ton/hari. Melihat banyaknya produksi tanaman nanas pertahun, tentunya daun nanas berpontesi besar untuk menjadi limbah. Untuk itulah penelitian ini berinisiatif untuk memanfaatkan serat daun nanas Peneliatian ini bertujuan untuk mendapatkan nilai kekuatan uji Tarik dan uji Impack komposit serat daun nanas sebagai bahan pembuatan bumper mobil. Komposisi komposit serat daun nanas yaitu 40% serat daun nanas dan 60% resin. Resin yang digunakan adalah resin polyester, masing-masing spesiemen dibuat 3 benda untuk pengujian dari setiap varisi panjang serat 50 mm,100 mm, 150 mm sehingga terdapat 12 spesimen pengujian untuk uji tarik dan uji impack. Berdasarkan pengujian sifat mekanik komposit serat daun nanas didapatkan nilai tegangan dan regangan tarik tertinggi adalah komposit dengan panjang serat 150 mm dengan nilai tegangan tarik sebesar 15,66 Mpa dan regangan 0,53% sedangkan sifat mekanik komposit serat daun nanas didapakan nilai tertinggi dengan panjang serat 100 mm dengan energi impack 11,23 joule dan kekuatan impack 0,145 j/mm2. Dari nilai yang didapatkan dari pengujiant tarik masing-masing panjang serat masih bekum bisa menyentuh nilai murni kekuatan matriks dengan tegangan tarik sebesar 31,63 Mpa. Dari hasil nilai yang didapat komposit serat daun nanas, memiliki nilai di atas standar JIS A5905-2003 bumper mobil.

APA, Harvard, Vancouver, ISO, and other styles

19

Liang, S. W., T. L. Shao, Chih Chen, Everett C. C. Yeh, and K. N. Tu. "Relieving the current crowding effect in flip-chip solder joints during current stressing." Journal of Materials Research 21, no. 1 (January 1, 2006): 137–46. http://dx.doi.org/10.1557/jmr.2006.0004.

Full text

Abstract:

Three-dimensional simulations for relieving the current crowding effect in solder joints under current stressing were carried out using the finite element method. Three possible approaches were examined in this study, including varying the size of the passivation opening, increasing the thickness of Cu underbump metallization (UBM), and adopting or inserting a thin highly resistive UBM layer. It was found that the current crowding effect in the solder bump could be successfully relieved with the thick Cu UBM or with the highly resistive UBM. Compared to the solder joint with Al/Ni(V)/Cu UBM, for instance, the maximum current density in a solder bump decreased dramatically by a factor of fifteen, say from 1.11 × 105 A/cm2 to 7.54 × 103 A/cm2 when a 20-μm-thick Cu UBM was used. It could be lowered by a factor of seven, say to 1.55 × 104 A/cm2, when a 0.7-μm UBM of 14770 μΩ cm was adopted. It is worth noting that although a resistive UBM layer was used, the penalty on overall resistance increase was negligible because the total resistance was dominated by the Al trace instead of the solder bump. Thermal simulation showed that the average temperature increase due to Joule heating effect was only 2.8 °C when the solder joints with UBM of 14770 μΩ cm were applied by 0.2 A.

APA, Harvard, Vancouver, ISO, and other styles

20

Fu, Xing, Yunfei En, Bin Zhou, Si Chen, Yun Huang, Xiaoqi He, Hongtao Chen, and Ruohe Yao. "Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature." Materials 12, no. 10 (May 15, 2019): 1593. http://dx.doi.org/10.3390/ma12101593.

Full text

Abstract:

Electromigration was characterized at the cathode Cu/solder interface—without the effect of Joule heating—by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cux,Ni1−x)6Sn5 intermetallic compound (IMC) growth was observed at the anomalous region at the cathode end due to the effect of current crowding. The abnormal isotropic diffusion and parallel distribution of Pb were characterized in an ultra-low temperature environment in a monocrystalline structure stressed at −196 °C. The interesting results were attributed to crystallographic transformation due to the simultaneous effect of cryogenic and electrical stressing. The diffusion behavior of Pb atoms in face-centered cubic lattices performed isomorphism. As a result, Pb atoms of the bump gathered at the high-energy grain boundaries by diffusing through the face-centered cubic lattices around the long grain boundary, eventually forming a long-range distribution and accumulation of Pb elements. Our study may provide understanding of cryogenic electromigration evolution of the Cu/solder interface and provide visual data for abnormal lattice transformation at the current stressing.

APA, Harvard, Vancouver, ISO, and other styles

21

Huri, Dávid, and Tamás Mankovits. "Automotive Rubber Product Design Using Response Surface Method." Periodica Polytechnica Transportation Engineering, September 14, 2021. http://dx.doi.org/10.3311/pptr.16280.

Full text

Abstract:

In rubber bumper design one of the most important technical properties of the product is the force-displacement curve under a compression load, which is a highly nonlinear behavior because of the large deformation, the rubber material and the contacts. Finite element analysis is a good way to evaluate the working characteristics of the rubber part. Fulfillment of customer needs requires a general iterative design method where the objective can be reached with the modification of the product shape. The determination of the optimum requires numerous iterations of finite element analysis which is computationally expensive. With the integration of the Response Surface Method (RSM) into the design process of a two-variable shape optimization task, the optimal design can be achieved more efficiently. Four different Design of Experiments (DOE) methods were used to intelligently chose design points. As a metamodeling technique, Genetic Aggregation was selected to predict the relation between the sampled geometric variables and the nonlinear objective function value. The Nonlinear Programming by Quadratic Lagrangian (NLPQL) and the Mixed-Integer Sequential Quadratic Programming (MISQP) algorithms with different settings were tested to find the optimum of the response surface. As a result, the most accurate and efficient DOE method and optimization algorithm were determined. The introduced Response Surface Method-based optimization is proved to be suitable to determine the shape of the rubber jounce bumper, which meets the technical requirements.

APA, Harvard, Vancouver, ISO, and other styles

22

Hsiao, Hsiang Yao, Chih Chen, and D. J. Yao. "Investigation of Joule Heating Effect in Various Stages of Electromigration in Flip-chip Solder Joints by Infrared Microscopy." MRS Proceedings 1249 (2010). http://dx.doi.org/10.1557/proc-1249-f08-01.

Full text

Abstract:

AbstractThe Joule heating effect at various stages under electromigration of flip-chip Sn3.5Ag solder joints was investigated under a current of 0.5 A at 100°C. During various stages of electromigration, voids may form and propagate and Joule heating effect may vary at different void sizes. To verify the void nucleation and propagation on Joule heating effect during electromigration process, the solder bump was stressed for different lengths of time and then examined by Kelvin bump probes and infrared microscopy. We found that voids started to form at approximately 1.2 times of the initial bump resistance. Then the voids propagated when the bump resistance increased. In addition, the temperature of the solder joints increased with the bump resistance and the increase of current stressing time. It increased very slowly in initial stages. In the last stage, the temperature of the solder bump increased rapidly due to the increase of the bump resistance and the local Joule heating effect.

APA, Harvard, Vancouver, ISO, and other styles

We offer discounts on all premium plans for authors whose works are included in thematic literature selections. Contact us to get a unique promo code!