Relevant bibliographies by topics / Jounce bumper

Academic literature on the topic 'Jounce bumper'

Author: Grafiati
Published: 28 April 2023

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Journal articles on the topic "Jounce bumper"

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Wang, Yuanlong, Liangmo Wang, Zheng-dong Ma, and Tao Wang. "Finite element analysis of a jounce bumper with negative Poisson’s ratio structure." Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science 231, no. 23 (January 6, 2017): 4374–87. http://dx.doi.org/10.1177/0954406216665415.

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Jounce bumpers in automotive suspension are key components that can improve the noise, vibration, and harshness performance of entire vehicle. Traditional jounce bumper made of polyurethane usually cannot satisfy the mechanical performances required by noise, vibration, and harshness optimization. In addition, the application of hyperelastic material influenced the efficiency and reliability of numerical calculations of polyurethane jounce bumper. In this paper, an engineering negative Poisson’s ratio structure was introduced and applied on the jounce bumper. The negative Poisson’s ratio jounce bumper can be mainly defined by few structure parameters. The finite element analysis of the negative Poisson’s ratio jounce bumper was conducted applied explicit method. The influences of loading velocity and material densities on computational time and numerical results were researched. The results indicated that enlargements of material densities and loading velocity can improve the computational efficiency and have limited influence on reliability. Furthermore, a negative Poisson’s ratio jounce bumper prototype was manufactured and tested to verify the numerical results. It was proved that the finite element analysis of the negative Poisson’s ratio jounce bumper was reliable both in load–displacement curve and deformation shapes. Compared to the traditional jounce bumper, the negative Poisson’s ratio jounce bumper can achieve similar mechanical behavior but with a smoother load–displacement curve, which is beneficial to the vehicle’s noise, vibration, and harshness performance.
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Samad, M. S. A., Aidy Ali, and R. S. Sidhu. "Durability of automotive jounce bumper." Materials & Design 32, no. 2 (February 2011): 1001–5. http://dx.doi.org/10.1016/j.matdes.2010.08.017.

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Sidhu, R. S., and Aidy Ali. "Fatigue life of automotive rubber jounce bumper." IOP Conference Series: Materials Science and Engineering 11 (May 1, 2010): 012008. http://dx.doi.org/10.1088/1757-899x/11/1/012008.

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Wang, Yuanlong, Liangmo Wang, Zheng-dong Ma, and Tao Wang. "A negative Poisson's ratio suspension jounce bumper." Materials & Design 103 (August 2016): 90–99. http://dx.doi.org/10.1016/j.matdes.2016.04.041.

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Sidhu, R. S., Aidy Ali, and M. R. Hassan. "Experimental Determination of Fatigue Life of Automotive Jounce Bumper." Key Engineering Materials 462-463 (January 2011): 634–38. http://dx.doi.org/10.4028/www.scientific.net/kem.462-463.634.

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It is evident that most rubber components in the automotive industry are subjected to repetitive loading. Vigorous research is needed towards improving the safety and reliability of the components. The study is conducted on an automotive rubber jounce bumper with a rubber hardness of 60 IRHD. The test is conducted in displacement controlled environment under compressive load. The existing models by Kim, Harbour, Woo and Li are adopted to predict the fatigue life. The experimental results show strong similarities with the predicted models.
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Lee, ChulHyung, MyeongJae Han, TaeWon Park, SukJin Lee, and JeongSik Park. "Development and Optimization of Support Bumper for Increasing the Energy Absorption of the Jounce Bumper." Transaction of the Korean Society of Automotive Engineers 27, no. 4 (April 1, 2019): 319–24. http://dx.doi.org/10.7467/ksae.2019.27.4.319.

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Wang, Yuanlong, Zheng-dong Ma, and Liangmo Wang. "A finite element stratification method for a polyurethane jounce bumper." Proceedings of the Institution of Mechanical Engineers, Part D: Journal of Automobile Engineering 230, no. 7 (August 31, 2015): 983–92. http://dx.doi.org/10.1177/0954407015602578.

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Çalışkan, Kemal, Erhan Ilhan Konukseven (1), and Y. Samim Ünlüsoy. "Product Based Material Testing for Hyperelastic Suspension Jounce Bumper Design with FEA." Key Engineering Materials 450 (November 2010): 119–23. http://dx.doi.org/10.4028/www.scientific.net/kem.450.119.

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The basic problem in the finite element analysis of parts made of hyperelastic materials is the identification of mathematical material model coefficients. Furthermore, selection of a suitable mathematical hyperelastic material model may not be straightforward. In this study, a systematic design methodology is presented for hyperelastic suspension jounce bumpers. The presented methodology involves a critical examination of material testing procedures, material model selection, and coefficient identification. The identified material model coefficients are verified through comparison of the finite element analysis results with actual tests.
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Caliskan, Kemal, IIhan Konukseven, and Y. Samim Unlusoy. "Product-oriented material testing and FEA for hyperelastic suspension jounce bumper design." International Journal of Design Engineering 3, no. 4 (2010): 374. http://dx.doi.org/10.1504/ijde.2010.040523.

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Lee, ChulHyung, MyeongJae Han, TaeWon Park, SukJin Lee, and JeongSik Park. "Development of Tuning Jounce Bumper and Verification of Ride Comfort Performance Using the Vehicle Dynamics Model." Transactions of the Korean Society of Automotive Engineers 27, no. 10 (October 1, 2019): 803–9. http://dx.doi.org/10.7467/ksae.2019.27.10.803.

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Dissertations / Theses on the topic "Jounce bumper"

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Le, Bail Jean-Baptiste. "Modélisation du comportement mécanique sous chargement d’une butée d’amortisseur en mousse de polyuréthane : vers une démarche de dimensionnement en fatigue." Electronic Thesis or Diss., Brest, École nationale supérieure de techniques avancées Bretagne, 2022. http://www.theses.fr/2022ENTA0003.

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Les butées d’amortisseur en mousse de polyuréthane sont largement utilisées dans le milieu automobile. Leur principale fonction est d’amortir les chocs verticaux aux roues et de contribuer à l’intégrité de la suspension du véhicule. La réponse mécanique de ce type de pièces implique de prendre en considération différents mécanismes, allant du flambement des parois de la pièce à l’auto-contact en passant par les non-linéarités géométriques. La caractérisation actuelle de ces butées d’amortisseur en mousse de polyuréthane en fatigue est aujourd’hui limitée au cahier des charges du client et aux tests prédéfinis par celui-ci. L’objectif de cette thèse est de mener une caractérisation expérimentale complète du comportement mécanique afin d’aboutir à l’identification d’une loi de comportement type Hyperfoam. Cette caractérisation est effectuée en s’appuyant également sur des techniques d’imagerie, MEB et tomographique, afin de caractériser le lien entre la microstructure et le comportement mécanique de la butée d’amortisseur. Cette étude doit permettre au final, de définir une démarche globale pour le dimensionnement en fatigue des butées d’amortisseur en mousse de polyuréthane
Polyurethane foam jounce bumpers are widely used in the automotive industry. Their main function is to absorb vertical shocks to the wheels and contribute to the integrity of the vehicle suspension. The mechanical response of this type of parts implies to take into account different mechanisms, from the buckling of the walls of the part to the self-contact through the geometrical non-linearities. The current characterization of these polyurethane foam jounce bumpers in fatigue is currently limited to the customer’s specifications and to the tests predefined by him. The objective of this thesis is to carry out a complete experimental characterization of the mechanical behavior in order to identify an Hyperfoam type behavior law. This characterization is also based on imaging techniques, SEM and tomographic, in order to characterize the link between the microstructure and the mechanical behavior of the jounce bumper. This study should allow to define a global approach for the fatigue design of polyurethane foam jounce bumper
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Ganzarolli, Francisco. "Influência das frequências de ride no conforto e dirigibilidade veiculares na faixa linear de uso do veículo." Universidade de São Paulo, 2012. http://www.teses.usp.br/teses/disponiveis/18/18149/tde-05092012-073800/.

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O tema do conforto na automobilística é bastante extenso e possuidor de muitas interpretações. A ideia central deste trabalho é definir e direcionar alguns métricos para que, durante as fases de conceituação e desenvolvimento de um veículo, seja possível ter um direcional de definição de componentes e atributos veiculares de modo a facilitar o direcionamento dos atributos no programa veicular, e assim atingir suas necessidades. Como exemplo empregado, é empregado um veículo de plataforma tipo B em desenvolvimento por uma montadora, o qual teve as molas de suspensão definidas e rigidezes laterais de eixos com base em material técnico interno equivalente aos estudos apresentados neste trabalho. É adotada uma abordagem inicialmente empírica conforme os primeiros estudos de suspensões independentes realizados neste continente, depois o trabalho é complementado com exigências de normas especificas para vibrações (ISO2361, ISO5008, BS6055) de modo a caracterizar energia vibracional e a interpretação pelo ser humano. Porém como hoje em dia as suspensões automotivas são muito mais complexas, existem componentes específicos para as várias condições de solicitação, deste modo a análise é limitada a situações de ride (conforto) primário e handling (dirigibilidade) em situações de sublimite na faixa linear (cerca de 0,5 g). Como conclusão dos estudos, é possível ter em um veículo atributos de estabilidade sem necessariamente prejudicar o conforto, pois sendo definidos corretamente os componentes elásticos da dinâmica vertical para situações estacionárias e de ride primário, é definido seu equilíbrio estacionário e assim não é necessário comprometimento dos atributos de outros componentes para compensar alguma deficiência existente.
The range of assumptions for ride comfort is considered very wide in the automotive world and they can assume lots of possible interpretations. The central idea in this work is define and manage some metrics that, during the concept and development phases of a vehicular program, be possible to follow a better direction for the attributes development and so reach the program targets. As the example in this work, a B platform typical vehicle is used and it is under development in a carmaker, its suspension springs and axle roll stiffness were setup with technical information similar to the ones presented in this work. The initial approach is empiric as occurred with the first independent suspension system studies in this continent and in the sequence, the work is complemented with standards for vibrational issues (ISO2361, ISO5008, BS6055), after this, finally how the vibrational energy is defined and perceived by human beings. The automotive suspensions of current days are very complex and there are lots of specific components to do a specific work, so the analysis are limited to primary ride and sub limit handling (up to 0,5 g). As conclusion, its possible setup a car that is comfortable and stable in the same time, since the elastic components for the vertical dynamics and steady state conditions are correctly set, so its correct balance is reached and no other components attributes are compromised to compensate any deficiency.
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Book chapters on the topic "Jounce bumper"

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Babu, T., R. Sudharshan, Mohammed Suhail, K. Pradeep, and S. Sanjay Arun. "Framework Execution and Schematic of Jounce Bumper in Two-Wheeler Fork." In Lecture Notes in Mechanical Engineering, 503–9. Singapore: Springer Singapore, 2019. http://dx.doi.org/10.1007/978-981-13-6374-0_56.

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Ali, Aidy, R. S. Sidhu, and M. S. A. Sam. "Fatigue Characteristics of Automotive Jounce Bumper." In New Trends and Developments in Automotive System Engineering. InTech, 2011. http://dx.doi.org/10.5772/12985.

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Conference papers on the topic "Jounce bumper"

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Schudt, Joseph A., Maolin Tsai, Ravindra Patil, and Robert Geisler. "Dual Rate Jounce Bumper Design." In SAE 2011 World Congress & Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2011. http://dx.doi.org/10.4271/2011-01-0791.

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Dickson, Daniel G. "A Primer on Jounce Bumper Design Using Microcellular Polyurethane." In SAE 2004 World Congress & Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2004. http://dx.doi.org/10.4271/2004-01-1541.

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Dickson, Daniel G., Stefan Schranz, and Mario Wolff. "Microcellular Polyurethane Jounce Bumper Design and the Effects on Durability." In SAE 2005 World Congress & Exhibition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2005. http://dx.doi.org/10.4271/2005-01-1714.

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Krishna, Murali M. R. "Finite Element Topography and Shape Optimization of a Jounce Bumper Bracket." In International Off-Highway & Powerplant Congress. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 2002. http://dx.doi.org/10.4271/2002-01-1468.

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Plasse, Bruce P., and Robert L. Norton. "Dynamic Characterization of Microcellular Urethane Jounce Bumpers Under Impact Conditions." In International Congress & Exposition. 400 Commonwealth Drive, Warrendale, PA, United States: SAE International, 1999. http://dx.doi.org/10.4271/1999-01-0035.

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Nagaraj, Vishal, Saket Karajgikar, Dereje Agonafer, and Senol Pekin. "Bump Electromigration and Back End Design Rules." In ASME 2007 International Mechanical Engineering Congress and Exposition. ASMEDC, 2007. http://dx.doi.org/10.1115/imece2007-43766.

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As there is continuous demand for miniaturization of electronic devices, flip chip technology is predominantly used for high density packaging. The technology offers several advantages like excellent electrical performance and better heat dissipation ability. Original invention of flip chip packaging utilized ceramic substrates and high lead bumps. Low cost commercialization of this packaging technology, however, required organic laminate substrates coupled with SnPb eutectic bumped interconnects on the die side. While organic laminate flip chip packaging may be a good option for many low power applications, current carrying capability of the eutectic bumped interconnect causes a catastrophic failure mechanism called electromigration. Previously, researchers have identified and addressed few issues regarding electromigration. Electomigration leads to the formation of metal voids in the conductors which eventually increases the resistance drop across the conductor causing electrical opens. Electromigration is very significant at high current densities. Temperature is the other parameter of concern for electromigration. High current density causes temperature to rise due to Joule heating, there by reducing the life of package. In order to determine the factors responsible for high current densities, we formed a full factorial design of experiments (DOE) that contained parameters such as passivation opening, UBM size, UBM thickness and trace width. Finite Element Analysis (FEA) was performed in order to study the effect of above parameters on current crowding and temperature in the bumped interconnects. Based on the results, hierarchy of the most important parameters to be considered while selecting the appropriate flip chip technology is proposed.
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Li, Bin, Xiaobo Yang, and James Yang. "Validation of a Newly Proposed 3D Flexible Ring Tire Model Through Adams FTire Full-Vehicle Simulations." In ASME 2018 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. American Society of Mechanical Engineers, 2018. http://dx.doi.org/10.1115/detc2018-85597.

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Flexible ring tire models are widely used for vehicle durability and ride comfort analysis. In our previous research, a novel 3D flexible ring tire model was proposed, and the model’s parameter identification and predictability were illustrated based on various tire cleat tests. To further demonstrate its capability, this paper applies the tire model in a full-vehicle model for various full vehicle bump tests with different driving speeds and cleat orientations in Matlab programing. The tire model and the full-vehicle model are connected through a suspension system, with the suspension spring and damper along the vertical direction, and rigid attachment along the longitudinal and lateral directions. The predicted results are compared against ADAMS® full-vehicle FTire virtual tests with the same simulation conditions. The comparison variables include tire forces, vertical displacements, and suspension jounce movements. The results provide useful guidance for the design of vehicle suspension.
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Zhou, Peng, Baojie Zhao, Yubao Zhen, Shuo Liu, Yuehua Hu, and Jiayu Li. "Finite-element calculations of elastic fields within flip-chip solder bumps and Cu-pillar bumps under the influences of thermal stresses and joule heating." In 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017. http://dx.doi.org/10.1109/icept.2017.8046519.

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Lee, Jang-Hee, Yong-Duk Lee, Young-Bae Park, Seung-Taek Yang, Min-Suk Suh, Qwan-Ho Chung, and Kwang-Yoo Byun. "Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder Bump." In 2007 Proceedings 57th Electronic Components and Technology Conference. IEEE, 2007. http://dx.doi.org/10.1109/ectc.2007.373984.

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Gotoh, Masaru, Ken Suzuki, and Hideo Miura. "Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity." In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/ipack2015-48197.

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Electroplated copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (trough silicon via) structures, fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grains and grain boundaries in the films. Porous or sparse grain boundaries cause the increase in electrical resistivity and the embrittlement of the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on Wiedemann-Franz law. Since copper interconnections are used for not only electrical conductor but also thermal heat conductor, it is important to clarify the relationship between the crystallinity and thermal properties of the films. In this study, the local distributions of the crystallinity and physical properties were investigated experimentally. As the result of the temperature distribution due to local Joule heating along an interconnection, it was suggested that the variation in the quality of the grain boundaries in the electroplated copper thin-films caused the non-uniformity of the resistivity and thus, Joule heating in the thin films. In this study, the effect of the seed layer material on the thermal properties of the electroplated copper thin film was investigated. When a Ru seed layer was deposited as a buffer layer between the electroplated copper thin film and the Ta diffusion barrier layer, both the crystallinity and uniformity of grain boundaries in the electroplated copper films were improved since lattice mismatch between copper and the seed layer metal was decreased. The improvement of the crystallinity increased the long-term reliability of the interconnections under the loads of electromigration and stress-induced migration.
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