Dissertations / Theses on the topic 'Ion Beam Lithography'

To investigate the ultimate resolution in ion beam lithography (IBL) the resist material poly(methyl methacrylate) PMMA has been modified by single ion impacts. The latent damage tracks have been etched prior to imaging and characterisation. The interest in IBL comes from a unique advantage over more traditional electron beam or optical lithography. An ion with energy of the order of 1 MeV per nucleon evenly deposits its energy over a long range in a straight latent damage path. This gives IBL the ability to create high aspect ratio structures with a resolution in the order of 10 nm. Precise ion counting into a spin coated PMMA film on top of an active substrate enabled control over the exact fluence delivered to the PMMA from homogenously irradiated areas down to separated single ion tracks. Using the homogenous areas it was possible to macroscopically measure the sensitivity of the PMMA as a function of the developing parameters. Separated single ion tracks wer e created in the PMMA using 8 MeV F, 71 MeV Cu and 88 MeV I ions. These ion tracks were etched to create voids in the PMMA film. For characterisation the tracks were imaged primarily with atomic force microscopy (AFM) and also with scanning electron microscopy (SEM). The series of studies presented here show that the sensitivity of the resist-developer combination can be tailored to allow the etching of specific single ion tracks. With the ability to etch only the damage track, and not the bulk material, one may experimentally characterise the damage track of any chosen ion. This offers the scientific community a useful tool in the study and fabrication of etched ion tracks. Finally work has been conducted to allow the precise locating of an ion beam using a nanoscale mask and piezoelectrically driven scanning stage. This method of beam locating has been trailed in conjunction with single ion detection in an effort to test the practical limits of ion beam lithography in the single ion realm.

Traditionally electron beam lithography (EBL) has been used to fabricate micron and sub-micron sized devices, such as Γ and Τ gates for metal-semiconductor devices for study within the semiconductor industry. EBL is also used for the fabrication of ferromagnetic elements for use as components in magnetic random access memory (MRAM) and read/write heads in hard disk drives (HDD). MRAM is being investigated as a direct replacement to standard semiconductor RAM as it has lower power consumption and is a non-volatile memory solution, although the areal density, at present, is not as great. Smaller read/write heads are necessary for HDD as recent advances now allow for perpendicular magnetisation (as opposed to parallel magnetisation) of films and increase the areal density to 100 Gb/inch2, four times the current value. In this thesis, the physical and magnetic properties of such micron-sized devices that have been fabricated by focussed ion beam (FIB) lithography for comparison to those fabricated by the EBL method are discussed. In addition to this work, the physical and magnetic properties of micron-sized element that have been irradiated using the 30 keV gallium ion source are also discussed. Also in this thesis, the results of 10×10 μm2 arrays of 50 nm thick polycrystalline cobalt elements (270×270 nm2 with a 400 nm period) that are fabricated by EBL to determine if there is any magnetic superdomain structure present are discussed. Bright field imaging in a transmission electron microscope (TEM) is used to investigate the physical structure of the ferromagnets, such as the grain size, element roughness and dimensions. Additional information about the topography is measured by atomic force microscopy (AFM). The magnetic properties, such as the magnitude of the applied field at which irreversible events happen and the domain structure, are investigated by the Fresnel imaging and the differential phase contrast modes of Lorentz microscopy. A programme known as object orientated micromagnetic framework (OOMMF) is used to model the magnetic properties of such structures.

Thesis (Ph. D.)--University of California, San Diego, 2005.
Title from first page of PDF file (viewed March 8, 2006). Available via ProQuest Digital Dissertations. Vita. Includes bibliographical references (p. 108-111).

Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2017.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 51-57).
The forefront of polariton research in two-dimensional (2D) materials focuses on pushing the limits of patterning 2D materials into nanoresonators and other nanophotonic structures that manipulate highly confined polaritons for technologically relevant near-IR and mid-IR applications. Furthermore, tuning the properties of hexagonal boron nitride, graphene, and other 2D materials in-plane and stacking them into heterostructures has the potential to create hybrid optical, electronic, thermal, and mechanical properties with a wealth of new functions. To fully tailor these novel properties, controlled nanoscale patterning of these and other van der Waals materials is essential. Moreover, it becomes imperative to understand how patterning and geometries modify the properties within each layer or introduce defects that affect the interfaces of layered 2D heterostructures. Herein, we demonstrate high-resolution patterning of h-BN via both helium and neon ion beams and pattern a h-BN grating with a 35 nm pitch and 20 nm feature size. We study varying degrees of nanostructuring and defects via Raman spectroscopy, photo-thermal microscopy, and scattering-type scanning near-field optical microscopy and observe complimentary information about the phonon modes and the absorption and scattering of light from such nanostructures. Specifically, we observe geometry and layer dependent photo-thermal expansion of h-BN nanostructures that are mediated by phonons. This work demonstrates a thorough understanding of directly patterned 2D materials with ion beams and demonstrates that far-field and near-field measurements are essential in understanding how the nanostructuring of 2D materials can tune their properties.
by Josué Jacob López.
S.M.

Heavy Ion Elastic Recoil Detection Analysis (HIERDA) is a versatile Ion Beam Analysis technique well suited to multi-elemental depth profiling of thin layered structures and near-surface regions of materials. An existing limitation is the inability to accurately account for the pronounced broadening and tailing effects of multiple scattering typically seen in HIERDA spectra. This thesis investigates the role of multiple large angle scattering in heavy ion applications such as HIERDA, and seeks to quantify its contribution to experimental output. This is achieved primarily by the development of a computer simulation capable of predicting these contributions and using it to classify and quantify the interactions that cause them. Monte Carlo ion transport simulation is used to generate simulated HIERDA spectra and the results are compared to experimental data acquired using the Time of Flight HIERDA facility at the Australian Nuclear Science and Technology Organisat ion. A Monte Carlo simulation code was adapted to the simulation of HIERDA spectra with considerable attention on improving the modelling efficiency to reduce processing time. Efficiency enhancements have achieved simulation time reductions of two to three orders of magnitude. The simulation is shown to satisfactorily reproduce the complex shape of HIERDA spectra. Some limitations are identified in the ability to accurately predict peak widths and the absolute magnitude of low energy tailing in some cases. The code is used to identify the plural scattering contribution to the spectral features under investigation, and the complexity of plurally scattered ion and recoil paths is demonstrated. The program is also shown to be useful in the interpretation of overlapped energy spectra of elements of similar mass whose signals cannot be reliably separated experimentally. The effect of large angle scattering on the transmission of heavy ions through a nano-scale aperture mask, used to collimate an ion beam to a very small beam spot, is modelled using a version of the program adapted to handle the more complex geometry of the aperture mask. The effectiveness of nano-aperture collimation was studied for a variety of ion-energy combinations. Intensity, energy, and angular distributions of transmitted ions were calculated to quantify the degree to which scattering within the mask limits the spatial resolution achievable. The simulation successfully predicted the effect of misaligning the aperture and the beam, and the result has subsequently been observed experimentally. Transmitted ion distributions showed that the higher energy heavier ions studied are more effectively collimated than are lower energy lighter ions. However, there is still a significant probability of transmission of heavy ions with substantial residual energy beyond the perimeter of the aperture. For the intended application, ion beam lithography, these ions are likely to be problematic. The results indicate that medium energy He ions are the more attractive option, as the residual energy of scattered transmitted ions can be more readily managed by customising the etching process. Continuing research by experimentalists working in this area is proceeding in this direction as a result of the conclusions from this work.

This thesis reports the characterization and development of nanolithography using Electron Beam Lithography system and nanoscale plasma etching. The standard Bosch process and a modified three-pulse Bosch process were developed in STS ICP and Plasma ICP system separately. The limit of the Bosch process at the nanoscale regime was investigated and documented. Furthermore, the effect of different control parameters on the process were studied and summarized in this report. 28nm-wide trench with aspect-ratio of 25 (smallest trench), and 50nm-wide trench with aspect ratio of 37 (highest aspect-ratio) have been demonstrated using the modified three-pulse process. Capacitive resonators, SiBAR and IBAR devices have been fabricated using the process developed in this work. IBARs (15MHz) with ultra-high Q (210,000) have been reported.

The use of micro- and nanotechnologies is necessary in the development of advanced sensor systems. In this thesis few selected technologies were studied and tested on fabrication of creating two different systems for bioelectrical and electrochemical applications. For biolelectrical applications a chip with a pair of gold nanoelectrodes was designed and implemented. For electrochemical analysis a novel two electrode system was designed and realized, which should contribute by greater sensitivity and accuracy in amperometric detection compared with three-electrode systems in voltammetric analysis. The fabricated systems were tested and the results were discussed.

The development of new materials with novel properties plays an important role in improving our lives and welfare. Research in Nanotechnology can provide e.g. cheaper and smarter materials in applications such as energy storage and sensors. In order for this development to proceed, we need to be able to characterize the material properties at the nano-, and even the atomic scale. The ultimate goal is to be able to tailor them according to our needs. One of the great challenges concerning the characterization of nano-sized objects is how to achieve the physical contact to them. This thesis is focused on the contacting of nanoobjects with the aim of electrically characterizing them and subsequently understanding their electrical properties. The analyzed nanoobjects are carbon nanosheets, nanotetrapods, nanoparticles and molecular systems. Two contacting strategies were employed in this thesis. The first strategy involved the development of a focused ion beam (FIB) based nanocontact platform. The platform consists of gold nanoelectrodes, having nanogaps of 10-30 nm, on top of an insulating substrate. Gold nanoparticles, double-stranded DNA and cadmium telluride nanotetrapods have been trapped in the gaps by using dielectrophoresis. In certain studies, the gold electrodes have also been coated with conducting or non-conducting molecules, prior to the trapping of gold nanoparticles, in order to form molecular junctions. These junctions were subsequently electrically characterized to evaluate the conduction properties of these molecular systems. For the purpose of better controlling the attachment of molecules to the nanoelectrodes, a novel route to synthesize alkanedithiol coated gold nanoparticles was developed. The second contacting strategy was based on the versatility of the FIB instrument as a platform for in-situ manipulation and electrical characterization of non-functionalized and functionalized carbon nanosheets, where it was found that the functionalized samples had an increased conductivity by more than one order of magnitude. Both contacting strategies proved to be valuable for building knowledge around contacting and electrical characterization of nanoobjects

The aim of this work is fabrication of nanostructures and measurement of their electrotransport properties. There are two different methods used for fabrication - electron beam lithography with sputtering of thin films and focused ion beam with deposition from gas phase. I-V characteristic was measured for characterisation of as prepared nanostructures - wires. Material of wires prepared by using of electron beam lithography was permalloy - an alloy of iron and nickel. Second types of wires prepared by using of chemical vapor deposition induced by focused ion beam was platinum based.

Le regain d'attention des industriels pour les mémoires non volatiles intégrant des nanocristaux, illustré par l'introduction sur le marché de la Flexmemory de Freescale en technologie 90 nm, incite à poursuivre des études sur ce type de systèmes. Pour cela, nous avons mis au point des cellules mémoires élémentaires, à savoir des transistors MOS dont l'oxyde de grille contient une grille granulaire formée par un plan de nanocristaux de silicium (Si-ncx) stockant la charge électrique.Ce travail présente les principaux résultats issus de ces travaux, ceux-ci allant du procédé de fabrication à la caractérisation fine des dispositifs mémoires. Le parfait contrôle de l'élaboration de la grille granulaire de Si-ncx par implantation ionique à très basse énergie (ULE-IBS) est accompagné de caractéristiques « mémoires » répondant aux normes industrielles d'endurance et d'une discrimination des pièges responsables du chargement. Le stockage majoritaire par les Si-ncx est démontré, ce qui est essentiel pour la rétention de la charge. Nous avons développé une technique électrique permettant d'extraire à la fois la quantité de charge stockée par les Si-ncx mais également leurs principales caractéristiques structurales (taille, densité, position dans l'oxyde). Cette extension de la technique électrique de « pompage de charges », non destructive et in-situ permet de suivre l'état du composant en fonctionnement et de caractériser des pièges (e.g. les Si-ncx) pour la première fois au-delà de 3 nm de profondeur dans l'oxyde. Ces résultats ont été validés par des observations TEM. La résolution du pompage de charge étant le piège unique, nous avons alors couplé l'ULE-IBS avec la lithographie « Stencil » pour réduire latéralement le nombre de Si-ncx synthétisés. Cette technique nous permet pour le moment de contrôler la synthèse locale à la position désirée dans l'oxyde de « poches » de Si-ncx de 400 nm. La synthèse de « quelques » Si-ncx est envisagée à très court terme. Nous serons alors en mesure de fabriquer des mémoires à nombre choisi de nanocristaux (par SM-ULE-IBS), dont les propriétés structurales (taille, densité, position) et électriques (quantité de charge stockée) seront vérifiées par pompage de charge, offrant ainsi des outils puissants pour la fabrication et la caractérisation de mémoires à nombre réduit de nanocristaux, notamment pour des longueurs de grilles inférieures à 90 nm
The aim of this thesis has been to fabricate and electrically characterize elementary memory cells containing silicon nanocrystals (Si-ncs), in other words MOSFET which insulating layer (SiO2) contains a Si-ncs array storing the electrical charge. We have shown that we perfectly control the synthesis of a 2D array of 3-4 nm Si-ncs embedded into the MOSFET oxide by low-energy ion implantation (1-3 keV) Reaching this goal implied two key steps: on the one hand develop a reliable MOSFET fabrication process incorporating the Si-ncs synthesis steps and on the other hand develop tools and methods for both memory window and Si-ncs array itself characterizations. We have developed an in-situ characterization technique based on the well-known charge pumping technique, allowing for the first time the extraction of traps depth (e.g. the Si-ncs array) further than 3 nm into the oxide layer leading to the characterization of both position of these Si-ncs into the SiO2 matrix and their structural properties (diameter, density). These results have been confirmed by EF-TEM measurements. Finally, we have worked on the improvement of controlled local synthesis of Si-ncs pockets by combining low-energy ion implantation and stencil lithography. We reduced the size of these pockets down to about 400 nm using this parallel, low cost and reliable technique and identified the limiting effect for the pockets size reduction. These results pave the way for memory cells containing a few Si-ncs with a well-defined position into the oxide and a well-controlled number of ncs

This project investigated directed energy techniques for modifying organic films. These techniques show great promise for creating materials with unique, tailored properties. In this work, ion and electron beams were used to fabricate spatially-defined polymer features in nanometre-scale film of small molecules. An alternative pathway to the direct on-surface fabrication of polymer surface coatings was also investigated and showed that a room temperature, atmospheric pressure plasma can facilitate coupling of small molecules at a catalytic surface. In all cases, it was possible to control the optical properties, chemistry, solubility and hardness of the polymer films by varying the processing parameters.

Biofilm formation is the major causes of infection in implants. This research presented nanopillars architecture to eliminate the bacteria attachment based on mechanical interaction. Advanced microscopy techniques (e.g. HIM and SEM and AFM) were employed to characterize the cicada wings' nanopillars and find the optimum geometry with the highest bactericidal effect. Electron beam lithography was used to mimic and fabricate versatile geometry of titanium nanopillars for orthopaedic application. It is proposed that the biomimicked titanium nanopillars have an excellent bactericidal effect in the same manner as cicada wings. The titanium nanopillars were biocompatible with human cells.

Photonic crystals (PhCs) are structures periodic in thedielectric constant. They exhibit a photonic bandgap, i.e., arange of wavelengths for which light propagation is forbidden.Engineering of defects in the PhC lattice offers new ways toconfine and guide light. PhCs have been manufactured usingsemiconductors and other material technologies. This thesisfocuses on two-dimensional PhCs etched in InP-based materials.Only recently, such structures were identified as promisingcandidates for the realization of novel and advanced functionsfor optical communication applications.

The primary focus was on fabrication and characterization ofPhC structures in the InP/GaInAsP/InP material system. Thedemands on fabrication are very high: holes as small as100-300nm in diameter have to be etched at least as deep as 2µm. Thus, different etch processes had to be explored andspecifically developed for InP. We have implemented an etchingprocess based on Ar/Cl₂chemically assisted ion beam etching (CAIBE), thatrepresents the state of the art PhC etching in InP.

Different building blocks were manufactured using thisprocess. A transmission loss of 10dB/mm for a PhC waveguide, areflection of 96.5% for a 4-row mirror and a record qualityfactor of 310 for a 1D cavity were achieved for this materialsystem. With an etch depth of 4.5 µm, optical loss wasfound to be close to the intrinsic limit. PhC-based opticalfilters were demonstrated using (a) a Fabry-Pérot cavityinserted in a PhC waveguide and (b) a contra-directionalcoupler. Lag effect in CAIBE was utilized positively to realizehigh quality PhC taper sections. Using a PhC taper, a couplingefficiency of 70% was demonstrated from a standard ridgewaveguide to a single line defect PhC waveguide.

During the course of this work, InP membrane technology wasdeveloped and a Fabry-Pérot cavity with a quality factorof 3200 was demonstrated.

Keywords:photonic crystals, photonic bandgap materials,indium phosphide, dry etching, chemically assisted ion beametching, reactive ion etching, electron beam lithography,photonic integrated circuits, optical waveguides, resonantcavities, optical filtering, finite difference time domain,plane wave expansion.

The diploma thesis deals with the experimental study of surface plasmon polaritons (SPPs) on nano-structures with the Au/Co/Au multilayer. Plasmonic structures were prepared by the electron beam lithography and by the focused ion beam. A Scanning optical near-field microscope was used for detection of surface plasmon polaritons. SPPs were confirmed by the experiment with different polarizations of the illuminating light. Furthermore, differences in plasmon interference wavelengths was measured for different surface dielectric functions. Finally, the decantation of the SPPs interference image was measured in dependence on the external magnetic field.

Diffractive zone-plate lenses are widely used as optics in high-resolution x-ray microscopes. The achievable resolution in such microscopes is presently not limited by the x-ray wavelength but by limitations in zone-plate nanofabrication. Thus, for the advance of high-resolution x-ray microscopy, progress in zone-plate nanofabrication methods are needed.   This Thesis describes the development of new nanofabrication processes for improved x-ray zone-plate optics. Cold development of the electron-beam resist ZEP7000 is applied to improve the resolution of soft x-ray Ni zone plates. The influence of developer temperature on resist contrast, resolution, and pattern quality is investigated. With an optimized process, Ni zone plates with outermost zone widths down to 13 nm are demonstrated. To enhance the diffraction efficiency of Ni zone plates, the concept of Ni-Ge zone plates is introduced. The applicability of Ni-Ge zone plates is first demonstrated in a proof-of-principle experiment, and then extended to cold-developed Ni zone plates with outermost zone widths down to 13 nm. For 15-nm Ni-Ge zone plates a diffraction efficiency of 4.3% at a wavelength of 2.88 nm is achieved, which is about twice the efficiency of state-of-the-art 15-nm Ni zone plates. To further increase both resolution and diffraction efficiency of soft x-ray zone plates, a novel fabrication process for W zone plates is developed. High resolution is provided by salty development of the inorganic electron-beam resist HSQ, and cryogenic RIE in a SF6 plasma is investigated for high-aspect-ratio W structuring. We demonstrate W zone plates with 12-nm outermost zone width and a W height of 90 nm, resulting in a 30% increase in theoretical diffraction efficiency compared to 13-nm efficiency-enhanced Ni-Ge zone plates. In addition to soft x-ray zone plates, some lenses for hard x-ray free-electron-laser applications were also fabricated during this Thesis work. Fabrication processes for the materials W, diamond, and Pt were developed. We demonstrate Pt and W-diamond zone plates with 100-nm outermost zone width and respective diffraction efficiencies of 8.2% and 14.5% at a photon energy of 8 keV.
QC 20111114

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 203-212).
Scanning-electron-beam lithography (SEBL) is the workhorse of nanoscale lithography in part because of the high brightness of the Schottky source of electrons, but also benefiting from decades of incremental innovation and engineering of apparatus around the Schottky source. Light ions are an attractive intermediary between electrons and heavy ions in terms of exposure efficiency and resolution by attaining a minimal interaction volume within the resist layer, if only we had bright sources of these light ions and could thus achieve small spot sizes. In this thesis, I present sub-10-nm lithography at high exposure efficiency using the gas field ionization source (GFIS) with helium and neon ions. I also present preliminary results using the magnetooptical trap ion source (MOTIS) with lithium ions. This work has also challenged the understanding of exposure efficiency as directly proportional to the so-called stopping power of incident beam particles - i.e. the average energy loss per unit path length, particularly for thin (less than 20 nm thick) resist. Values of stopping power are readily obtained via the popular Stopping and Range of Ions in Matter (SRIM) software for a variety of beam species and target materials at various landing energies, making this metric particularly convenient for predicting exposure efficiency. However, the exposure efficiency of neon ions for thin hydrogen silsesquioxane (HSQ) resist on bulk silicon is similar to that of gallium ions at 20-30 keV landing energy despite SRIM indicating a much larger stopping power for the gallium ions. Separating stopping power into nuclear and electronic components reveals that both the neon and gallium ions have similar electronic stopping powers. This correspondence points to electronic stopping power as a better indication of exposure efficiency in ion beam lithography. Unfortunately, the use of electronic stopping power alone to predict exposure efficiency has too been challenged by the data. Whereas the exposure efficiencies of neon and gallium ions were much higher than that of helium ions for the landing energies studied, the electronic stopping powers were all similar. One interpretation of this anomaly is that slower ions, i.e. neon and gallium ions in this case, for the same total energy dissipated via ionization per unit path length, produce a redshifted secondary-electron (SE) spectrum (with a correspondingly larger number of SEs), and that these lower-energy SEs are more efficient at exposure of resist. Such a phenomenon would be hidden by reliance on a single number, the electronic stopping power, to predict exposure efficiency. In addition to demonstrating sub-10-nm lithography at high exposure efficiency with light-ion beams, this thesis provides data toward predicting exposure efficiency in charged-particle-beam lithography in a way that is as simple as possible, but not simpler, using point exposures in a thin-film, high-contrast resist process. In contrast with SEBL, the lithographic techniques presented in this thesis are at their infancy. With further development, light-ion-beam lithography may serve as a useful complement to SEBL for nanofabrication in a wide variety of contexts.
by Donald Winston.
Ph.D.

Diese Arbeit befasst sich mit der Nanostrukturierung von magnetischen Schichtsystemen mit Tunnelmagnetowiderstandseffekt (TMR-Effekt), welche in der Form von Nanosäulen in magnetoresistiven Speichern (MRAM) eingesetzt werden. Solche Nanosäulen können zukünftig ebenfalls als Nanoemitter von Mikrowellensignalen eine Rolle spielen. Dabei wird von der Auswahl eines geeigneten TMR-Schichtsystems mit einer MgO-Tunnelbarriere über die Präparation der Nanosäulen mit Seitenisolierung bis hin zum Aufbringen der elektrischen Zuleitungen eine komplette Prozesskette entwickelt und optimiert. Die Strukturen werden mittels optischer Lithographie und Elektronenstrahllithographie definiert, die anschließende Strukturübertragung erfolgt durch Ionenstrahlätzen (teilweise reaktiv) sowie durch Lift-off. Rückmeldung über Erfolg oder Probleme bei der Strukturierung geben Transmissionselektronenmikroskopie (teilweise mit Zielpräparation per Ionenfeinstrahl, FIB), Rasterelektronenmikroskopie sowie die Lichtmikroskopie. Es können so TMR-Nanosäulen mit minimalen Abmessungen von bis zu 69 nm x 71 nm hergestellt werden, von denen Nanosäulen mit Abmessungen von 65 nm x 87 nm grundlegend magneto-elektrisch charakterisiert worden sind. Dies umfasst die Bestimmung des TMR-Effektes und des Widerstandes der Tunnelbarriere (RA-Produkt). Weiterhin wurde das Verhalten der magnetischen Schichten bei größeren Magnetfeldern bis +-200mT sowie das Umschaltverhalten der magnetisch freien Schicht bei verändertem Winkel zwischen magnetischer Vorzugsachse des TMR-Elementes und dem äußeren Magnetfeld untersucht. Der Nachweis des Spin-Transfer-Torque Effektes an den präparierten TMR-Nanosäulen ist im Rahmen dieser Arbeit nicht gelungen, was mit dem zu hohen elektrischen Widerstand der verwendeten Tunnelbarriere erklärt werden kann. Mit dünneren Barrieren konnte der Widerstand gesenkt werden, allerdings führt ein Stromfluss durch diese Barrieren schnell zur Degradation der Barrieren. Weiterführende Arbeiten sollten das Ziel haben, niederohmige und gleichzeitig elektrisch belastbare Tunnelbarrieren in einem entsprechenden TMR-Schichtsystem abzuscheiden. Eine erste Auswahl an Ansatzpunkten dafür aus der Literatur wird im Ausblick gegeben
This thesis deals with the fabrication of nanopillars with tunnel magnetoresistance effect (TMR-effect), which are used in magnetoresistive memory (MRAM) and may be used as nanooscillators for future near field communication devices. Starting with the selection of a suitable TMR-layer stack with MgO-tunnel barrier, the whole process chain covering the fabrication of the nanopillars, sidewall isolation and preparation of the supply lines on top is developed and optimised. The structures are defined by optical and electron beam lithography, the subsequent patterning is done by ion beam etching (partially reactive) and lift-off. Techniques providing feedback on the nanofabrication are transmission electron microscopy (partially with target preparation by focused ion beam, FIB), scanning electron microscopy and optical microscopy. In this way nanopillars with minimal dimensions reaching 69 nm x 71 nm could be fabricated, of which nanopillars with a size of 65 nm x 87 nm were characterized fundamentally with respect to their magnetic and electric properties. This covers the determination of the TMR-effect and the resistance of the tunnel barrier (RA-product). In addition, the behaviour of the magnetic layers under higher magnetic fields (up to +-200mT) and the switching behaviour of the free layer at different angles between the easy axis of the TMR-element and the external magnetic field were investigated. The spin transfer torque effect could not be detected in the fabricated nanopillars due to the high electrical resistance of the tunnel barriers which were used. The resistance could be lowered by using thinner barriers, but this led to a quick degradation of the barrier when a current was applied. Continuative work should focus on the preparation of tunnel barriers in an appropriate TMR-stack being low resistive and electrically robust at the same time. A first selection of concepts and ideas from the literature for this task is given in the outlook

Diese Arbeit befasst sich mit der Nanostrukturierung von magnetischen Schichtsystemen mit Tunnelmagnetowiderstandseffekt (TMR-Effekt), welche in der Form von Nanosäulen in magnetoresistiven Speichern (MRAM) eingesetzt werden. Solche Nanosäulen können zukünftig ebenfalls als Nanoemitter von Mikrowellensignalen eine Rolle spielen. Dabei wird von der Auswahl eines geeigneten TMR-Schichtsystems mit einer MgO-Tunnelbarriere über die Präparation der Nanosäulen mit Seitenisolierung bis hin zum Aufbringen der elektrischen Zuleitungen eine komplette Prozesskette entwickelt und optimiert. Die Strukturen werden mittels optischer Lithographie und Elektronenstrahllithographie definiert, die anschließende Strukturübertragung erfolgt durch Ionenstrahlätzen (teilweise reaktiv) sowie durch Lift-off. Rückmeldung über Erfolg oder Probleme bei der Strukturierung geben Transmissionselektronenmikroskopie (teilweise mit Zielpräparation per Ionenfeinstrahl, FIB), Rasterelektronenmikroskopie sowie die Lichtmikroskopie. Es können so TMR-Nanosäulen mit minimalen Abmessungen von bis zu 69 nm x 71 nm hergestellt werden, von denen Nanosäulen mit Abmessungen von 65 nm x 87 nm grundlegend magneto-elektrisch charakterisiert worden sind. Dies umfasst die Bestimmung des TMR-Effektes und des Widerstandes der Tunnelbarriere (RA-Produkt). Weiterhin wurde das Verhalten der magnetischen Schichten bei größeren Magnetfeldern bis +-200mT sowie das Umschaltverhalten der magnetisch freien Schicht bei verändertem Winkel zwischen magnetischer Vorzugsachse des TMR-Elementes und dem äußeren Magnetfeld untersucht. Der Nachweis des Spin-Transfer-Torque Effektes an den präparierten TMR-Nanosäulen ist im Rahmen dieser Arbeit nicht gelungen, was mit dem zu hohen elektrischen Widerstand der verwendeten Tunnelbarriere erklärt werden kann. Mit dünneren Barrieren konnte der Widerstand gesenkt werden, allerdings führt ein Stromfluss durch diese Barrieren schnell zur Degradation der Barrieren. Weiterführende Arbeiten sollten das Ziel haben, niederohmige und gleichzeitig elektrisch belastbare Tunnelbarrieren in einem entsprechenden TMR-Schichtsystem abzuscheiden. Eine erste Auswahl an Ansatzpunkten dafür aus der Literatur wird im Ausblick gegeben.:Einleitung I Grundlagen 1 Spinelektronik und Magnetowiderstand 1.1 Der Elektronenspin – Grundlage des Magnetismus 1.2 Magnetoresistive Effekte 1.2.1 AnisotroperMagnetowiderstand 1.2.2 Riesenmagnetowiderstand 1.2.3 Tunnelmagnetowiderstand 1.3 Spin-Transfer-Torque 1.4 Anwendungen 1.4.1 Festplattenleseköpfe 1.4.2 Magnetoresistive Random AccessMemory (MRAM) 1.4.3 Nanooszillatoren für drahtlose Kommunikation 2 Grundlagen der Mikro- und Nanostrukturierung 2.1 Belacken 2.2 Belichten 2.2.1 Optische Lithographie 2.2.2 Elektronenstrahllithographie 2.3 Entwickeln 2.4 Strukturübertragung 2.4.1 Die Lift-off Technik 2.4.2 Ätzen 2.5 Entfernen der Lackmaske 2.6 Reinigung 2.6.1 Quellen von Verunreinigungen 2.6.2 Auswirkungen von Verunreinigungen 2.6.3 Entfernung von Verunreinigungen 2.6.4 Spülen und Trocknen der Probenoberfläche 3 Ionenstrahlätzen 3.1 Physikalisches Ätzen – Sputterätzen 3.2 Reaktives Ionenstrahlätzen – RIBE 3.3 Anlagentechnik 3.3.1 Parameter 3.3.2 Homogenität 3.3.3 Endpunktdetektion II Ergebnisse und Diskussion 4 TMR-Schichtsysteme 4.1 Prinzipielle Schichtfolge 4.2 Verwendete TMR-Schichtsysteme 4.3 Rekristallisation von Kupfer 4.4 Formierung der TMR-Schichtsysteme 4.4.1 Antiferromagnetische Kopplung an PtMn 4.4.2 Rekristallisation an der MgO-Barriere 4.5 Anpassung der MgO-Schicht – TMR-Effekt und RA-Produkt 4.6 Magnetische Charakterisierung 5 Probendesign 5.1 Beschreibung der vier lithographischen Ebenen 5.2 Layout für statische und dynamischeMessungen 5.2.1 Geometrie 5.2.2 Anforderungen für die Hochfrequenzmessung 5.3 Layout für Zuverlässigkeitsmessungen 5.3.1 Geometrie 5.3.2 Voraussetzungen für die Funktion 5.4 Chiplayout 5.4.1 Zusatzstrukturen 5.4.2 Anordnung der Elemente 6 Fertigung eines Maskensatzes für die optische Lithographie 6.1 Vorbereitung desMaskenrohlings 6.2 Strukturierung mittels Elektronenstrahllithographie 6.3 Ätzen der Chromschicht 7 Ergebnisse und Diskussion der Probenpräparation 7.1 Definition der Grundelektrode 7.1.1 Freistellen der Grundelektrode 7.1.2 Gratfreiheit der Grundelektrode 7.1.3 Oberflächenqualität nach der Strukturierung 7.2 Präparation der magnetischen Nanosäulen 7.2.1 Aufbringen einer Ätzmaske 7.2.2 Ionenstrahlätzen der TMR-Nanosäule 7.2.3 Abmessungen der präparierten Nanosäulen 7.3 Vertikale Kontaktierung 7.3.1 Seitenwandisolation 7.3.2 Freilegen der Kontakte 7.3.3 Aufbringen der elektrischen Zuleitungen 7.4 Die komplette Prozesskette und Ausbeute 8 Magneto-elektrische Charakterisierung 8.1 Messung des Tunnelmagnetowiderstandes 8.2 Stabilität der magnetischen Konfiguration 8.3 Spin-Transfer-Torque an TMR-Nanosäulen 9 Zusammenfassung und Ausblick Literaturverzeichnis
This thesis deals with the fabrication of nanopillars with tunnel magnetoresistance effect (TMR-effect), which are used in magnetoresistive memory (MRAM) and may be used as nanooscillators for future near field communication devices. Starting with the selection of a suitable TMR-layer stack with MgO-tunnel barrier, the whole process chain covering the fabrication of the nanopillars, sidewall isolation and preparation of the supply lines on top is developed and optimised. The structures are defined by optical and electron beam lithography, the subsequent patterning is done by ion beam etching (partially reactive) and lift-off. Techniques providing feedback on the nanofabrication are transmission electron microscopy (partially with target preparation by focused ion beam, FIB), scanning electron microscopy and optical microscopy. In this way nanopillars with minimal dimensions reaching 69 nm x 71 nm could be fabricated, of which nanopillars with a size of 65 nm x 87 nm were characterized fundamentally with respect to their magnetic and electric properties. This covers the determination of the TMR-effect and the resistance of the tunnel barrier (RA-product). In addition, the behaviour of the magnetic layers under higher magnetic fields (up to +-200mT) and the switching behaviour of the free layer at different angles between the easy axis of the TMR-element and the external magnetic field were investigated. The spin transfer torque effect could not be detected in the fabricated nanopillars due to the high electrical resistance of the tunnel barriers which were used. The resistance could be lowered by using thinner barriers, but this led to a quick degradation of the barrier when a current was applied. Continuative work should focus on the preparation of tunnel barriers in an appropriate TMR-stack being low resistive and electrically robust at the same time. A first selection of concepts and ideas from the literature for this task is given in the outlook.:Einleitung I Grundlagen 1 Spinelektronik und Magnetowiderstand 1.1 Der Elektronenspin – Grundlage des Magnetismus 1.2 Magnetoresistive Effekte 1.2.1 AnisotroperMagnetowiderstand 1.2.2 Riesenmagnetowiderstand 1.2.3 Tunnelmagnetowiderstand 1.3 Spin-Transfer-Torque 1.4 Anwendungen 1.4.1 Festplattenleseköpfe 1.4.2 Magnetoresistive Random AccessMemory (MRAM) 1.4.3 Nanooszillatoren für drahtlose Kommunikation 2 Grundlagen der Mikro- und Nanostrukturierung 2.1 Belacken 2.2 Belichten 2.2.1 Optische Lithographie 2.2.2 Elektronenstrahllithographie 2.3 Entwickeln 2.4 Strukturübertragung 2.4.1 Die Lift-off Technik 2.4.2 Ätzen 2.5 Entfernen der Lackmaske 2.6 Reinigung 2.6.1 Quellen von Verunreinigungen 2.6.2 Auswirkungen von Verunreinigungen 2.6.3 Entfernung von Verunreinigungen 2.6.4 Spülen und Trocknen der Probenoberfläche 3 Ionenstrahlätzen 3.1 Physikalisches Ätzen – Sputterätzen 3.2 Reaktives Ionenstrahlätzen – RIBE 3.3 Anlagentechnik 3.3.1 Parameter 3.3.2 Homogenität 3.3.3 Endpunktdetektion II Ergebnisse und Diskussion 4 TMR-Schichtsysteme 4.1 Prinzipielle Schichtfolge 4.2 Verwendete TMR-Schichtsysteme 4.3 Rekristallisation von Kupfer 4.4 Formierung der TMR-Schichtsysteme 4.4.1 Antiferromagnetische Kopplung an PtMn 4.4.2 Rekristallisation an der MgO-Barriere 4.5 Anpassung der MgO-Schicht – TMR-Effekt und RA-Produkt 4.6 Magnetische Charakterisierung 5 Probendesign 5.1 Beschreibung der vier lithographischen Ebenen 5.2 Layout für statische und dynamischeMessungen 5.2.1 Geometrie 5.2.2 Anforderungen für die Hochfrequenzmessung 5.3 Layout für Zuverlässigkeitsmessungen 5.3.1 Geometrie 5.3.2 Voraussetzungen für die Funktion 5.4 Chiplayout 5.4.1 Zusatzstrukturen 5.4.2 Anordnung der Elemente 6 Fertigung eines Maskensatzes für die optische Lithographie 6.1 Vorbereitung desMaskenrohlings 6.2 Strukturierung mittels Elektronenstrahllithographie 6.3 Ätzen der Chromschicht 7 Ergebnisse und Diskussion der Probenpräparation 7.1 Definition der Grundelektrode 7.1.1 Freistellen der Grundelektrode 7.1.2 Gratfreiheit der Grundelektrode 7.1.3 Oberflächenqualität nach der Strukturierung 7.2 Präparation der magnetischen Nanosäulen 7.2.1 Aufbringen einer Ätzmaske 7.2.2 Ionenstrahlätzen der TMR-Nanosäule 7.2.3 Abmessungen der präparierten Nanosäulen 7.3 Vertikale Kontaktierung 7.3.1 Seitenwandisolation 7.3.2 Freilegen der Kontakte 7.3.3 Aufbringen der elektrischen Zuleitungen 7.4 Die komplette Prozesskette und Ausbeute 8 Magneto-elektrische Charakterisierung 8.1 Messung des Tunnelmagnetowiderstandes 8.2 Stabilität der magnetischen Konfiguration 8.3 Spin-Transfer-Torque an TMR-Nanosäulen 9 Zusammenfassung und Ausblick Literaturverzeichnis

Magnetoelectricity (ME) is a physical property that results from an exchange between polar (electric dipole) and spin (magnetic dipole) subsystem: i.e., a change in polarization (P) with application of magnetic field (H), or a change in magnetization (M) with applied electric field (E). Magnetoelectricity can be found both in single phase and composite materials. Compared with single phase multiferroic materials, composite multiferroics have higher ME effects. Through a strictive interaction between the piezoelectricity of the ferroelectric phase and the magnetostriction of the ferromagnetic phase, said multiferroic composites are capable of producing relatively large ME coefficients. This Dissertation focused on the deposition and characterization of two-phase composite magnetoelectric thin films. First, single phase ferroelectric thin films were studied to improve the multiferroic properties of the composite thin films. Then structural, ferroelectric, ferromagnetic, and magnetoelectric properties of composite thin films were researched. Finally, regular nano-array composite films were deposited and characterized. First, for single phase ferroelectric thin films, the phase stability was controlled by epitaxial engineering. Because ferroelectric properties are strongly related to their crystal structure, it is necessary to study the crystal structures in single phase ferroelectric thin films. Through constraint of the substrates, the phase stability of the ferroelectric thin films were able to be altered. Epitaxial thin-layers of Pb(Fe1/2Nb1/2)O3 (or PFN) grown on (001), (110), and (111) SrTiO3 substrates are tetragonal, orthorhombic, and rhombohedral respectively. The larger constraint stress induces higher piezoelectric constants in tetragonal PFN thin film. Epitaxial thin-layers of Pb(Zr0.52Ti0.48)O3 (or PZT) grown on (001), (110), and (111) SrTiO3 substrates are tetragonal, monoclinic C, and rhombohedral respectively. Enhanced ferroelectric properties were found in the low symmetry monoclinic phase. A triclinic phase in BFO was observed when it was deposited on tilted (001) STO substrates by selecting low symmetry (or interim) orientations of single crystal substrates. Then, in two phase composite magnetoelectric thin films, the morphology stability was controlled by epitaxial engineering. Because multiferroic properties are strongly related to the nano-structures of the composite thin films, it is necessary to research the nano-structures in composite thin films. Nano-belt structures were observed in both BaTiO3-CoFe2O4 and BiFeO3-CoFe2O4 systems: by changing the orientation of substrates or annealing condition, the nano-pillar structure could be changed into nano-belts structure. By doing so, the anisotropy of ferromagnetic properties changes accordingly. The multi-ferroic properties and magnetoelectric properties or (001), (110) and (111) self-assembled BiFeO3-CoFe2O4 nano-composite thin film were also measured. Finally, the regular CoFe2O4-BiFeO3 nano-array composite was deposited by pulsed laser deposition patterned using a focused ion beam. Top and cross-section views of the composite thin film showed an ordered CoFe2O4 nano-array embedded in a BiFeO3 matrix. Multiferroic and magnetoelectric properties were measured by piezoresponse force microscopy and magnetic force microscopy. Results show (i) switching of the magnetization in ferromagnetic CoFe2O4 and of the polarization in ferroelectric BiFeO3 phases under external magnetic and electric field respectively, and (ii) changes of the magnetization of CoFe2O4 by applying an electric field to the BiFeO3 phase.
Ph. D.

Eletrônica utilizando polímero em substituição ao silício é uma área de pesquisa recente com perspectivas econômicas promissoras. Compósitos de polímeros com partículas metálicas apresentam interessantes propriedades elétricas, magnéticas e ópticas e têm sido produzidos por uma grande variedade de técnicas. Implantação iônica de metais utilizando plasma é um dos métodos utilizados para obtenção desses compósitos condutores. Neste trabalho é realizada implantação de íons de ouro de baixa energia em PMMA utilizando plasma. O PMMA tem grande importância tecnológica sendo largamente utilizado como resiste em litografias por feixe de elétrons, raios-X, íons e deep-UV. Como resultado da implantação iônica de baixa energia em PMMA há formação de uma camada nanométrica de material condutor. Esse novo material, denominado compósito isolante-condutor, permite criar micro e nanodispositivos através de técnicas largamente utilizadas em microeletrônica. Medidas elétricas são realizadas in situ em função da dose de íons metálicos implantada, o que permite um estudo das propriedades de transporte desses novos materiais, que podem ser modeladas pela teoria da percolação. Simulações utilizando o programa TRIDYN permitem obter a profundidade e o perfil da implantação dos íons. São mostradas caracterizações importantes tais como Microscopia Eletrônica de Transmissão, Microscopia de Varredura por Tunelamento, Espalhamento de Raios-X a Baixos Ângulos, Difração de Raios-X e Espectroscopia UV-vis. Essas técnicas permitem visualizar e investigar o caráter nanoestruturado do compósito metal-polímero. Ainda como parte deste projeto, as camadas condutoras formadas no polímero são caracterizadas quanto à manutenção das suas características de elétron resiste.
Electronics using polymers instead of silicon is a recent research area with promising economic perspectives. Polymer with metallic particles composites presents interesting electrical, magnetic and optical properties and they have been produced by a broad variety of techniques. Metal ion implantation using plasma is one of the used methods to obtain conductor composites. In this work it is performed low energy gold ion implantation in PMMA by using plasma. PMMA has great technological importance once it is broadly used as resist in electron-beam, X-ray, ion and deep UV lithography. As a result of low energy ion implantation in PMMA, a nanometric conducting layer is formed. This new material, named insulator-conductor composite, can allow the creation of micro and nanodevices through well known microelectronics techniques. Electrical measurements are performed in situ as a function of metal ions implanted dose, which allows the investigation of electrical transport of these new materials, which can be modeled by the percolation theory. Simulations using TRIDYN computer code provide the prediction of depth profile of implanted ions. Important characterizations are showed such as Transmission Electron Microscopy, Scanning Tunneling Microscopy, Small Angle X-Ray Scattering, X-Ray Diffraction and UV-vis Spectroscopy. These techniques allow to visualize and to investigate the nanostructured character of the metal-polymer composite. Still as a part of this project, the conducting layers formed are characterized in relation to the maintenance of their characteristics as electron-beam resist.

La technologie necessaire a la realisation de memoires a bulles magnetiques implantees de haute densite (au moins 16 mb/cm**(2)) est etudiee sous differents aspects: le report de motifs submicroniques (0. 3-0. 8 mu m) necessite d'optimiser les moyens classiques de lithographie optique par contact ou projection. A cette fin, une modelisation est utilisee et des experiences comparatives realisees; la realisation des circuits comporte des implantations ioniques: differents materiaux de masque sont proposes (or, silice, polymere). Dans chacun des cas, des realisations concretes de masques graves sont effectuees et analysees; enfin des implantations hydrogene sont realisees. Le fonctionnement des dispositifs est correle aux parametres de l'implantation et au dessin des motifs. Des conclusions pratiques sont tirees sur l'implantation et la technologie compatibles avec un bon fonctionnement des dispositifs

碩士
國立中正大學
物理所
94
In electron beam lithography, the matter wave length of electron, which be added 20 keV voltage, is pproximately 10-11m. The wave length is smaller than 193 nm or 157 nm that the Optical lithography excimer laser wave length has. In general, the electron beam lithography has the very good ability of high resolution, and the resolution can reach several nm degree(ignoring exposure depth).The electron beam lithography can be used in photo masks fabrication, direct e-bean writing, and nanometer structures fabrication. In our article, we try to fabricate high aspect ratio 2-D cylinder array structure. The desire of diameter is smaller than 150 nm, height is higher than 2 mm, and the lattice const is 300 nm. We want to use e-bean lithography and reactive ion etching (RIE) to fabricate the desired size. We must make up the etching mask, then try the RIE parameter. We try the positive and negative photo resist at the same time in order to choosing the best method. The changes of RIE parameters will make the change in the etching structures and height. We try to change the etching time, power, pressure and ratio of the gas, and compare the RIE result. In this way, we want to get the best RIE parameters for helping us to fabricate the desired structures.

Device fabrication on multi walled carbon nanotubes (MWCNTs) using electrical beam lithography (EBL), electron beam induced deposition (EBID), ion beam induced deposition (IBID) methods was carried out, followed by device electrical characterization using a conventional probe station. A four-probe configuration was utilized to measure accurately the electrical resistivity of MWCNTs with similar results obtained from devices fabricated by different methods. In order to reduce the contact resistance of the beam deposited platinum electrodes, single step vacuum thermal annealing was performed. Microscopy and spectroscopy were carried out on the beam deposited electrodes to follow the structural and chemical changes occurring during the vacuum thermal annealing. For the first time, a core-shell type structure was identified on EBID Pt and IBID Pt annealed electrodes and analogous free standing nanorods previously exposed to high temperature. We believe this observation has important implications for transport properties studies of carbon materials. Apart from that, contamination of carbon nanostructure, originating from the device fabrication methods, was also studied. Finally, based on the observations of faster processing time together with higher yield and flexibility for device preparation, we investigated EBID to fabricate devices for other discrete carbon nanostructures.

M.Sc.
Layered Manufacturing (LM), also known as "Rapid Prototyping", is that process in terms of which a computer-designed model is created layer by layer with the aid of specific LM hardware. Telemanufacturing constitutes an extension of this technology that allows remote submission of manufacturing jobs or assignments across a communication medium, typically the Internet, to be built at the manufacturing bureau concerned. The de facto standard of LM is the STL file. Simply put, this file consists of a number of triangles that are used to describe an object in its entirety. This file format has several advantages over other known formats and allows easy 2D rendering. Unfortunately, however, the limitations of the latter format outweigh its advantages. Since the entire model is described in terms of a collection of triangles, the original geometry of the model is lost. As a result, a certain level of degradation will occur, especially around curvatures in the model. Although an increase in the number of triangles around such areas will enhance precision, it will also result in a much larger STL file. Triangles that get lost somewhere inside the file could also give rise to holes, orphaned surfaces and zero-width walls in the projected object. It is vital, therefore, that the manufacturing bureau verify the correctness of the entire file before it is built in order to prevent machine time and materials from being wasted. Instead of transmitting the entire file again, the bureau could attempt automatically to correct and repair less critical errors, thereby saving valuable resources and time.

The continuing scaling of integrated circuits beyond 22nm technology node poses increasing challenges to Electromigration (EM) reliability for Cu on-chip interconnects. First, the width of Cu lines in advanced technology nodes is less than the electron mean free path which is 39nm in Cu at room temperature. This is a new size regime where any new scaling effect on EM is of basic interest. And second, the reduced line width necessitates the development of new methods to analyze the EM characteristics. Such studies will require the development of well controlled processes to fabricate suitable test structures for EM study and model verification. This dissertation is to address these critical issues for EM in Cu interconnects. The dissertation first studies the initial void growth under EM, which is critical for measurement of the EM lifetime and statistics. A method based on analyzing the resistance traces obtained from EM tests of multi-link structures has been developed. The results indicated that there are three stages in the resistance traces where the rate of the initial void growth in Stage I is lower than that in Stage III after interconnect failure and they are linearly correlated. An analysis extending the Korhonen model has been formulated to account for the initial void formation. In this analysis, the stress evolution in the line during void growth under EM was analyzed in two regions and an analytic solution was deduced for the void growth rate. A Monte Carlo grain growth simulation based on the Potts model was performed to obtain grain structures for void growth analysis. The results from this analysis agreed reasonably well with the EM experiments. The next part of the dissertation is to study the size effect on the electron wind force for a thin film and for a line with a rectangular cross section. The electron wind force was modeled by considering the momentum transfer during collision between electrons and an atom. The scaling effect on the electron wind force was found to be represented by a size factor depending on the film/line dimensions. In general, the electron wind force is enhanced with increasing dimensional confinement. Finally, a process for fabrication of Si nanotrenches was developed for deposition of Cu nanolines with well-defined profiles. A self-aligned sub-lithographic mask technique was developed using polymer residues formed on Si surfaces during reactive ion etching of Si dioxide in a fluorocarbon plasma. This method was capable to fabricate ultra-narrow Si nanotrenches down to 20nm range with rectangular profiles and smooth sidewalls, which are ideal for studying EM damage mechanisms and model verification for future technology nodes.
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Eine grundlegende Schwierigkeit in der Röntgenoptik liegt in der Bereitstellung geeigneter Optiken. So ist aufgrund der schwachen Wechselwirkung der Röntgenstrahlung mit Materie der Einsatz brechender Optiken nicht sinnvoll, und es wird auf alternative Konzepte wie Röntgenwellenleiter zurückgegriffen. Röntgenwellenleiter sind nicht-dispersive strahlführende Optiken, welche die Kohärenz der Röntgenstrahlung filtern und als quasi-Punktquellen fungieren. Hierbei wird der Röntgenstrahl in einer oder zwei Dimensionen räumlich beschränkt, wobei der Wellenlängenbereich der Röntgenstrahlung eine Abmessung im sub-100 nm-Bereich erfordert. In der vorliegenden Arbeit wurde ein Verfahren etabliert, mit welchem die Herstellung von Wellenleiterkanälen im sub-50 nm-Bereich in Silizium gelingt. Die Prozessierung basiert hierbei auf einem Schema aus elektronenstrahllithographischer Belichtung, Reaktivem Ionenätzen und Wafer bonding. Das Verfahren ist variabel in Bezug auf verschiedene Wellenleitergeometrien, beispielsweise gekreuzte Wellenleiter und Kanalwellenleiter, ist auf alternative Materialien übertragbar, und erlaubt die Strahlführung auf in einer Dimension gekrümmten Pfaden. Die im Rahmen der vorliegenden Arbeit hergestellten Wellenleiter wurden erfolgreich an verschiedenen Synchrotron-Messplätzen eingesetzt und ihre Fernfelder charakterisiert, und der kohärente Wellenleiterstrahl wurde in der Röntgenmikroskopie und der holographischen Bildgebung eingesetzt. Es finden sich sowohl für die Quellgröße der Wellenleiter als auch für die Auflösung in der Bildgebung Werte im sub-50 nm-Bereich.