Academic literature on the topic 'Interphase de liaison'
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Journal articles on the topic "Interphase de liaison":
Paudel, MN. "Outreach Research: A liaison between research and extension." Agronomy Journal of Nepal 3 (October 24, 2013): 97–108. http://dx.doi.org/10.3126/ajn.v3i0.9011.
Róka, Rastislav. "Experimental measurements for evaluation of the network throughput of the RC4 channel in the in-home PLC network." Journal of Electrical Engineering 70, no. 1 (February 1, 2019): 25–31. http://dx.doi.org/10.2478/jee-2019-0003.
Dissertations / Theses on the topic "Interphase de liaison":
Chanson, Charlotte. "Optimisation de la liaison interfaciale dans les composites à matrice céramique renforcés par des fibres Hi-Nicalon S." Thesis, Bordeaux, 2015. http://www.theses.fr/2015BORD0222.
Mechanical properties of ceramic composites can be improved by controlling interfacial bonding and choosing materials. To enhance interfacial bonding, treatment on the last SiC fiber, Hi-Nicalon S surface are proposed in this work. The aim is to allow chemical and/or mechanical bonds mainly with BN interphase. For this, composites models, minicomposites are elaborated by CVI (Chemical Vapor Infiltration). Quantification of the strength of interfacial bonding is based by evaluating interfacial bonding energy Gci with tensile tests, and by calculating interfacial shear stress τ with push-out tests. Firstly, Hi-Nicalon S fibers whose surfaces have been slightly modified have been tested with classic interphase PyC. Interfacial bonding on minicomposites is weak. Different treatments have been performed on surface fibers to enhance interfacial bonding with BN, which have a better resistance oxidation than PyC. Before, elaboration parameters of BN interphase have been studied
He, Qian. "Étude sur le mécanisme d'activation du bois/bambou/adhésif et amélioration du collage induit par le champ électrique à haute tension." Electronic Thesis or Diss., Université de Lorraine, 2021. http://www.theses.fr/2021LORR0147.
In this study, the advanced equipments were selected in order to investigate the effects of HVEF on the physicochemical properties of wood and bamboo, the effects of HVEF on the chemical structure and rheological properties of adhesives under a series of HVEF parameters. The aggregation effect of adhesive at bonding interface induced by HVEF has also been revealed and the micro-mechanical prediction model is established.The main conclusions of this study are as follows:1.After HVEF treatment, the surface activity of wood and bamboo increased significantly. Moreover, with the increase of voltage/time, the surface free radicals, O/C ratio and the number of oxygen groups increased significantly while the contact angle decreased. Under the condition of 60kV, the surface activity highly increased. The increment of free radicals was 26%, the decrease of initial contact angle was 22%, the decrease of equilibrium contact angle was 23%, the increment of free energy component was 43% ~ 75%, the increment of O/C ratio was 34%, the increment of oxygen-containing groups were 39% (C‒OH), 149% (C‒O or C=O) and 97% (O‒C=O), respectively. Therefore, under HVEF treatment, the physical and chemical properties of wood and bamboo can be significantly improved, which is conducive to improving the interphase properties of composite materials.2.With the increase of voltage/time, significantly improved inter-molecular reactions of urea formaldehyde resin and phenol formaldehyde resin were obtained. After 60kV/8 min treatment, significant increment of the characteristic peaks of C‒O groups were obtained. Under HVEF treatment, the temperature/frequency dependence of the rheological behaviors of the two resins changed significantly. Therefore, the degree of inter-molecular polymerization of phenol formaldehyde and urea formaldehyde resin can be significantly improved and the viscoelasticity of the resin can be improved under HVEF treatment.3.After HVEF treatment, the distribution of adhesive at the bonding interphase was continuous and uniform. The penetration depth was significantly reduced. The density and bonding strength at the bonding interphase were significantly increased, and the delamination rate was reduced. After treatment, the maximal density at interphase is 1081 kg/m3, which was 32% higher than the control. The bonding strength increased from 0.66MPa to 1.25MPa and the wood breaking rate increased to 85%, and the delamination rate decreased to 5.97%. For bamboo material, the bonding strength was significantly improved after HVEF treatment. The bonding strength of bamboo skin and bamboo skin was 9.51MPa, and the bamboo failure ratio was 60%. In the combination of bamboo pith and bamboo pith, the maximum bamboo failure ratio was 85%, which was increased by 70%. Therefore, under HVEF treatment, the continuous and uniform distribution of bonding interphase adhesives can be obtained, which can significantly improve the bonding performance of wood bamboo composite, and is conducive to the efficient utilization of wood bamboo composite.4. According to the vertical density profile at the bonding interface, the laminated stiffness and stress distribution model of the bonding interface has been established. The results showed that the relative error was less than ±15%. Based on the distribution model, the macroscopic mechanical properties of composite are predicted with the combination of composite mechanics and laminated plate theory, including elastic modulus, bending strength, shear modulus and shear strength. The results showed that the prediction error of mechanical properties is less than 30%. With the stiffness and strength distribution model, the effect of HVEF treatment can be quantitatively characterized and the mechanical properties of HVEF treated composites can be predicted. As a result, strengthening mechanism of bonding interphase can be revealed with the the stiffness and strength distribution model
Smet-Nocca, Caroline. "Etude des interactions entre la peptidyl-prolyl cis/trans isomérase Pin1 et la protéine microtubulaire Tau. Recherche d'inhibiteurs ciblant la liaison de Pin1 à ses substrats phosphorylés." Phd thesis, Université du Droit et de la Santé - Lille II, 2004. http://tel.archives-ouvertes.fr/tel-00354986.
Nous avons ciblé les interactions entre Pin1 et la protéine Tau comme modèle de substrats pour une étude détaillée des mécanismes intervenant à l'échelle moléculaire, sur base de substrats peptidiques, qui permettraient d'expliquer le rôle fonctionnel de Pin1. L'interaction avec les substrats au travers des motifs Ser/Thr-Pro phosphorylés est double : un domaine de liaison WW permet la liaison du substrat et un domaine catalytique PPIase (peptidyl-prolyl isomérase) catalyse l'isomérisation cis/trans des prolines. Un criblage par RMN des différents motifs phospho-Ser/Thr-Pro au sein de la protéine Tau a permis de déterminer un nouveau site d'interaction centré autour du motif Thr212-Pro213, phosphorylé uniquement dans la forme pathologique de Tau.
Nous avons étendu l'investigation des interactions avec Pin1 à l'échelle de la protéine Tau entière. Comme pour la plupart des régions protéiques impliquées dans les interactions avec Pin1, la protéine Tau se caractérise par une absence de structure globale qui limite considérablement les études par RMN. Un fragment peptidique de 40 acides aminés comprenant les sites Thr231 et Thr212 phosphorylés a permis de montrer un rôle régulateur du domaine WW dans l'activité enzymatique. Une première étude avec une protéine mutante mimant l'état phosphorylé de Tau a montré une interaction avec le domaine catalytique de Pin1 et a nécessité la mise au point préalable d'une technique d'attribution de la protéine Tau par RMN que nous avons appelé « mapping peptidique ».
La phosphorylation du domaine WW de Pin1 est associée à l'inhibition de la liaison des substrats et joue un rôle dans la régulation de l'activité de Pin1 in vivo. La forme non phosphorylée active de Pin1 est retrouvée majoritairement dans les cellules cancéreuses et la forme phosphorylée inactive dans les cellules saines. Nous avons envisagé de cibler les interactions entre Pin1 et les phospho-peptides avec la synthèse de molécules organiques mimant le dipeptide phosphoThr-Pro et la mise en œuvre d'un test de criblage par RMN pour l'obtention d'inhibiteurs ciblant le domaine WW de Pin1 qui pourraient mimer la forme inactive de la protéine.
Frada, Jean-Michel. "Contribution à l'étude des multimatériaux acier-polymère-acier : caractérisation chimique et structurale des interphases dans des systèmes métal-oxyde-polymère." Nancy 1, 1992. http://docnum.univ-lorraine.fr/public/SCD_T_1992_0408_FRADA.pdf.
Book chapters on the topic "Interphase de liaison":
Sato, Yosuke. "Spelling Out Prosodic Domains: A Multiple Spell-Out Account∗." In InterPhases, 234–60. Oxford University PressOxford, 2009. http://dx.doi.org/10.1093/oso/9780199541126.003.0009.