Relevant bibliographies by topics / Interlayer thickness

Academic literature on the topic 'Interlayer thickness'

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Published: 30 May 2022
Last updated: 31 May 2022

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Journal articles on the topic "Interlayer thickness"

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HE, YUANPING, YU-XIAO CUI, and FANG-HONG SUN. "ENHANCEMENT OF ADHESION STRENGTH AND TRIBOLOGICAL PERFORMANCE OF CVD DIAMOND FILMS ON TUNGSTEN CARBIDE SUBSTRATES WITH HIGH COBALT CONTENT VIA AMORPHOUS SiC INTERLAYERS." Surface Review and Letters 26, no. 09 (October 17, 2019): 1950051. http://dx.doi.org/10.1142/s0218625x19500513.

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In this study, the diamond films are deposited on tungsten carbide substrates with 10[Formula: see text]wt.% Co via hot filament chemical vapor deposition (HFCVD). Amorphous SiC (a-SiC) interlayers with various thicknesses are fabricated between the diamond films and tungsten carbide substrates via precursor pyrolysis to promote the adhesion and friction performance of diamond films. Indentation tests are performed to evaluate the adhesion of the as-fabricated diamond films, which show that the a-SiC interlayers can greatly improve the adhesive strength between diamond films and tungsten carbide substrates with 10[Formula: see text]wt.% Co. Moreover, the thickness of a-SiC interlayer is of great importance for the effectiveness on the film–substrate adhesion enhancement. The optimum thickness of a-SiC interlayer is 1[Formula: see text][Formula: see text]m. Afterwards, ball-on-disc experiments are chosen to check the tribological properties of the as-fabricated a-SiC interlayered diamond film specimen with the optimum interlayer thickness, which exhibits lower friction coefficient than the conventional diamond film with no interlayer.
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Su, Jie, Zhenghua Zhou, You Zhou, Xiaojun Li, Qing Dong, Yafei Wang, Yuping Li, and Liu Chen. "The Characteristics of Seismic Response on Hard Interlayer Sites." Advances in Civil Engineering 2020 (June 25, 2020): 1–11. http://dx.doi.org/10.1155/2020/1425969.

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Based on the engineering geological data of a nuclear power plant site, nine engineering geological profiles were created with hard interlayers of different thicknesses. The equivalent linearization method of seismic motion segment-input used for one-dimensional nonlinear seismic response analysis was applied to study the effect of the interlayer thickness on the peak acceleration and the acceleration response spectra of the site seismic response. The results showed that there was an obvious influence of hard interlayer thickness on site seismic responses. With the increase of hard interlayer thickness, the site nonlinear effect on seismic responses decreased. Under the same thickness of the hard interlayer, the nonlinear effect of the site was strengthened with the higher input peak acceleration. In addition, the short-period acceleration response spectrum was found to be significantly influenced by the hard interlayer and showed that the longer the period, the less influence of the hard interlayer on the acceleration response spectrum coordinates. Moreover, the influenced frequency band was wider with the increase in the thickness of hard interlayer.
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Xia, Xiong, Yi Bo Wang, Sai Ying Xi, Jun Sun, Han Dong Xu, and Yi Huang. "Study on Effects of Earthquake Response of Soft Interlayer." Advanced Materials Research 1049-1050 (October 2014): 205–8. http://dx.doi.org/10.4028/www.scientific.net/amr.1049-1050.205.

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This paper carried on the numerical analysis about the impact on soft soil ground seismic effect according to the buried depth and thickness of the soft interlayer, which took Jiangsu typical stratigraphic distribution and some engineering field as the prototype. In order to analyze the impact of buried depth and thickness of soft soil interlayers on the surface of the ground motion parameter, this paper combined with the formation parameters and calculated 3 sections which the thickness of soft soil interlayers were respectively 3m, 5m and 9m, in condition of the buried depth of the soft soil interlayer was constant. Choose ElCENTRO process curve for site seismic response analysis. The results showed that the influence of soft soil interlayer thickness on ground surface acceleration peak value was related with the location of weak interlayer. The influence of soft interlayer thickness on earthquake peak acceleration Amax and the eigenperiod Tg was more obvious; When the thickness of the soft interlayer increased, the earthquake peak acceleration decreased, the maximum speed decreased, and the maximum displacement increase; When the thickness of the soft interlayer increased, The maximum response spectrum decreased, the cycle of response spectrum peak increased, and the eigenperiod increased.
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Bauer, Sondes, Adriana Rodrigues, Lukáš Horák, Xiaowei Jin, Reinhard Schneider, Tilo Baumbach, and Václav Holý. "Structure Quality of LuFeO3 Epitaxial Layers Grown by Pulsed-Laser Deposition on Sapphire/Pt." Materials 13, no. 1 (December 21, 2019): 61. http://dx.doi.org/10.3390/ma13010061.

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Structural quality of LuFeO 3 epitaxial layers grown by pulsed-laser deposition on sapphire substrates with and without platinum Pt interlayers has been investigated by in situ high-resolution X-ray diffraction (reciprocal-space mapping). The parameters of the structure such as size and misorientation of mosaic blocks have been determined as functions of the thickness of LuFeO 3 during growth and for different thicknesses of platinum interlayers up to 40 nm. By means of fitting of the time-resolved X-ray reflectivity curves and by in situ X-ray diffraction measurement, we demonstrate that the LuFeO 3 growth rate as well as the out-of-plane lattice parameter are almost independent from Pt interlayer thickness, while the in-plane LuFeO 3 lattice parameter decreases. We reveal that, despite the different morphologies of the Pt interlayers with different thickness, LuFeO 3 was growing as a continuous mosaic layer and the misorientation of the mosaic blocks decreases with increasing Pt thickness. The X-ray diffraction results combined with ex situ scanning electron microscopy and high-resolution transmission electron microscopy demonstrate that the Pt interlayer significantly improves the structure of LuFeO 3 by reducing the misfit of the LuFeO 3 lattice with respect to the material underneath.
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Bouška, Petr, Miroslav Špaček, Drahomír Crhan, Tomáš Bittner, and Miroslav Vokáč. "Experimental Verification of the Effective Thickness of Laminated Glass." Key Engineering Materials 662 (September 2015): 245–48. http://dx.doi.org/10.4028/www.scientific.net/kem.662.245.

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Properties of laminated glass comprising two or more sheets of glass are greatly affected by the composite action of these panes which is influenced by material properties of used interlayer. Generally plastic foil or cast resin is used as the interlayer in lamination process. Laminated glass has been experimentally investigated in the laboratory condition in a four-point bending test on several kinds of interlayers in combination with variable thickness of the annealed glass. This paper establishes the so-called effective bending thickness according to standard method and presents comparisons with experimentally determined values.
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Lee, J. J., W. S. Yang, and Jung Ho Je. "Enhanced nucleation density of chemical vapor deposition diamonds by using interlayer." Journal of Materials Research 12, no. 3 (March 1997): 657–64. http://dx.doi.org/10.1557/jmr.1997.0100.

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Effects of interlayers on diamond nucleation were investigated for the Si substrates. Interlayers were deposited on the diamond-abraded Si substrates by rf sputtering prior to diamond growth using microwave plasma chemical vapor deposition (CVD). Compared with 1 × 108/cm2 for the just abraded substrate, the nucleation density was greatly enhanced to 1 ∼ 2 × 109/cm2 by 50 nm thick interlayer, irrespective of the kind of interlayer material used in this study (Si, Mo, Ti, Pt, Ag, TiN, or SiO2). As the thickness of the Si interlayer increased from 20 to 500 nm, the nucleation density reached a maximum value, 3 × 109/cm2 at 100 nm. However, the growth rate was monotonically reduced from ∼300 nm/h to ∼100 nm/h. For the 700 nm thick Si interlayer, no diamond growth was observed. These results indicate that there is an optimum interlayer thickness around 100 nm for the higher nucleation density. The role of the interlayer in enhancing the nucleation density is believed to protect the nucleation sites generated by the diamond abrasion, otherwise they could be considerably etched away by atomic hydrogen during the initial diamond deposition.
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Lu, Sheng Bo, and Zheng Kui Xu. "Effect of Interlayer Thickness on Stress and Dielectric Properties of MgTiO3 Modified (Ba,Sr)TiO3 Multilayer Thin Films." Materials Science Forum 654-656 (June 2010): 1796–99. http://dx.doi.org/10.4028/www.scientific.net/msf.654-656.1796.

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Ba0.6Sr0.4TiO3 (BST)/MgTiO3 (MT)/ Ba0.6Sr0.4TiO3 multilayer thin films were deposited on LaNiO3 (100)/Pt/Ti/SiO2/Si (100) substrates by pulsed laser deposition. It was found that the film orientation and dielectric properties of BST/MT/BST multilayer thin films are strongly dependent on MT interlayer thickness. Pure BST thin film exhibits a (100) preferred orientation, while BST thin films with a MT interlayer exhibit a random orientation. Residual stress is relaxed dramatically due to a closer match of thermal expansion coefficients between the BST and MT interlayers. The largest figure of merit of 18.7 is achieved in the multilayer thin film with a 50-nm-thick MT interlayer, which exhibits a tunability of 30% and a lost tangent of 0.016. Dielectric constant and loss tangent decrease with increasing MT interlayer thickness due to a series dielectric dilution effect.
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Gan, Kuan, Min Li, and Meng Meng Wu. "The Influences of Interdigitated Electrode Asymmetry on the Actuation Performance of Piezoelectric Materials." Applied Mechanics and Materials 664 (October 2014): 18–22. http://dx.doi.org/10.4028/www.scientific.net/amm.664.18.

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The electrostatic field distribution of interdigitated electrode piezoceramics (IDEPZT) and piezoelectric fiber composite (IDEPFC) are analyzed by finite element method separately. The impact of the interdigitated electrode asymmetry on the actuation performance of piezoelectric actuators with a certain interlayer thickness is studied. The influence of the interdigitated electrode asymmetry on the actuation performance, stress concentration and electrostatic field concentration with different interlayer thicknesses are also discussed and compared. For piezoceramics, the results show that the actuation performance can be influenced little by increasing the degree of the excursion with a relatively thin interlayer thickness. As the interlayer thickness increases, the actuation performance can be influenced much by increasing the degree of the asymmetry. And it results in the decrease of the longitudinal free strain overall. The electric field becomes increasingly uneven as the degree of the asymmetry increases. The actuated stress can be improved evidently by increasing the degree of the asymmetry with a relatively thin interlayer thickness while the stress concentration is not increased apparently.
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Shmorgun, Victor Georgievich, Artem I. Bogdanov, and Alexander O. Taube. "Analysis of Thermal Stresses in Layered Composite AD1 + Cr20Ni80 + M1 after Heat Treatment." Materials Science Forum 946 (February 2019): 8–13. http://dx.doi.org/10.4028/www.scientific.net/msf.946.8.

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The results of modeling of the influence of layers thickness of the Ni-Cr-Al composite on value of thermal stresses on its interlayer boundaries after diffusion annealing are presented. It is shown that the cooling of the AD1-Cr20Ni80 composite after annealing, which provides formation of a DZ at its interlayer boundary, consisting of three interlayers (CrAl7, NiAl3 + CrAl7 and Ni2Al3 + CrAl7), leads to spontaneous separation of the aluminum layer,due to the action of tensile stresses, exceeding the zone strength of the interlayer boundaries (CrAl7) - (NiAl3 + CrAl7), and at k> 0.3 - (NiAl3 + CrAl7) - (Ni2Al3 + CrAl7) with the ratio of layers thickness of aluminum and the alloy Cr20Ni80 - k <0.3, which leads to the formation of layered Cr20Ni80 / ( Ni2Al3 + CrAl7) / (NiAl3 + CrAl7) or Cr20Ni80 / (Ni2Al3 + CrAl7) coatings.
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Yang, Min, Zeng Da Zou, Si Li Song, and Xin Hong Wang. "Effect of Interlayer Thickness on Strength and Fracture of Si3N4 and Inconel600 Joint." Key Engineering Materials 297-300 (November 2005): 2435–40. http://dx.doi.org/10.4028/www.scientific.net/kem.297-300.2435.

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In this study, Si3N4 was bonded to Inconel600 with Nb/Cu/Ni interlayer by partial liquid phase diffusion bonding method under vacuum condition. The bonding temperature, bonding time, bonding pressure and cooling velocity was 1403K, 50min, 7.5MPa and 5K/min, respectively. The effects of interlayer thickness on the strength and fracture behaviors of joint were investigated through evaluating the strength of joints based on shear test and observing the fracture morphology by means of SEM. The results showed that the shear strength of joint changed with variation of the interlayer thickness. When the shear strength of joint increased, the location of fracture was changed from the ceramic/interlay interface to the reaction layer.
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Dissertations / Theses on the topic "Interlayer thickness"

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Shipkova, I. G., V. S. Chumak, M. V. Reshetnyak, A. Y. Devizenko, and Y. P. Pershyn. "Estimation of interlayer composition in WC/Si multilayer X-ray mirrors (MXMs) at nanometer scale." Thesis, НТУ "ХПІ", 2016. http://repository.kpi.kharkov.ua/handle/KhPI-Press/28180.

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Sugar, Joshua D. "Mechanisms of microstructure development at metallic-interlayer/ceramic interfaces during liquid-film-assisted bonding." Berkeley, Calif. : Oak Ridge, Tenn. : Lawrence Berkeley National Laboratory ; distributed by the Office of Scientific and Technical Information, U.S. Dept. of Energy, 2003. http://www.osti.gov/servlets/purl/825347-j6A0Su/native/.

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Thesis (M.S.); Submitted to the University of California, Berkeley, CA (US); 1 Dec 2003.
Published through the Information Bridge: DOE Scientific and Technical Information. "LBNL--54185" Sugar, Joshua D. USDOE Director. Office of Science. Basic Energy Sciences (US) 12/01/2003. Report is also available in paper and microfiche from NTIS.
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Wang, Yu-Ting, and 王俞婷. "Thickness Effect of Nickel Interlayer on the Properties after Aluminum and Alumina Interfacial Reactions." Thesis, 2018. http://ndltd.ncl.edu.tw/handle/heshg2.

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碩士
國立交通大學
材料科學與工程學系所
106
Direct bonded copper (DBC) substrates have been widely used in power electronics and insulated gate bipolar transistors (IGBT) modules. However, poor thermal cycling reliability of DBC substrates restrict its applications. Direct bonded aluminum (DBA) substrates have been developed to replace DBC substrates due to its superior reliability. Previous studies used the silicon, germanium, silver, and copper as the interlayer to prepare DBA substrates. In this study, the Ni was selected and various thickness of nickel (100 nm、300 nm、500 nm) has been deposited on the Al2O3 substrate as the interlayer to join Al substrate by electron-beam evaporation. The specimens were then annealed at Al-Ni eutectic temperature (640℃) in argon atmosphere, the eutectic liquid phase formed at Al/Al2O3 interface to obtain better wettability. The purpose of present study is to analyze the microstructure of Al/Al2O3 contact by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). Furthermore, scanning acoustic tomography (SAT) is used to reveal the voids distribution of Al/Al2O3 bonding layer for the purpose of evaluating the quality of DBA substrate. After joining of Al to Al2O3 with various thickness of nickel interlayers, Al3Ni phase were observed in the aluminum layer. The interfacial strength of Al/Al2O3 interfaces was measured by the shear strength test. The thermal conductivity of the sandwich (Al2O3/Al/Al2O3) specimens were measured by laser flash method. The resistivity of the aluminum layer with Al3Ni which was measured by four point probe. The results indicated that the interfacial strength of Al/Al2O3 interfaces and thermal conductivity of DBA substrates increased with the thickness of nickel interlayer increasing. The best thermal conductivity and shear strength of DBA specimens with 500 nm nickel interlayer was about 37 Wm-1K-1 and 31.5 MPa, respectively. In addition, comparing with the initial aluminum foil, the resistivity of aluminum layer with Al3Ni which was formed after Al/Al2O3 joint decreased insufficiently.
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Yang, Fan-Yi Ou, and 歐陽汎怡. "Effect of film thickness and Ti interlayer thickness on the structure and properties of nanocrystalline TiN thin film deposited by unbalanced magnetron (UBM) sputtering." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/36607902561557804174.

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碩士
國立清華大學
工程與系統科學系
92
Nanocrystalline TiN thin films were successfully deposited on Si (100) and D2 steel substrates using unbalanced magnetron sputtering (UBMS) system. The objective of this study was to investigate the effect of film thickness and Ti interlayer thickness on the composition, structures, mechanical properties, and corrosion resistance of TiN film. The results showed that (111) was the dominant preferred orientation in the TiN films. The effects of the film thickness were only slightly varied on the N/Ti ratio, roughness, and grain size. The packing factor was almost constant with film thickness and the thinnest specimen reached a quite high packing factor of 0.8. Nanoindentation data, ranging from 22~29 GPa, indicated that hardness of the films was not related to the film texture and film thickness. The residual stresses of all TiN films were compressive, and mostly decreased with increasing film thickness in TiN/D2 specimens. Interfacial shear stress induced from the residual stress was increased with film thickness, whereas the residual stress was not necessarily increased with film thickness. In the bi-layer TiN/Ti coating, there was a critical Ti interlayer thickness (120~150nm) to effectively reduce the thermal stress and residual stress in the TiN coating. The results of potentiodynamic polarization scan in both 5% NaCl and 0.5M H2SO4 + 0.05M KSCN solutions indicated that packing factor was more effective than film thickness to the corrosion resistance for the coating. Furthermore, increasing film thickness or adding a Ti interlayer could effectively protect the substrate from the corrosive medium, if the packing factor was sufficiently high.
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Chih, Po-Chun, and 植柏鈞. "Effect of Ti interlayer thickness on mechanical properties and wear resistance of TiZrN coatings on AISI D2 steel." Thesis, 2017. http://ndltd.ncl.edu.tw/handle/9h9q96.

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Yan, Pay-Yu, and 嚴佩瑜. "The effect of different thickness of Ge interlayers on the Ni / Ge / Si system." Thesis, 2004. http://ndltd.ncl.edu.tw/handle/83851340011615135622.

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碩士
國立清華大學
材料科學工程學系
92
In this thesis, we will investigate the influence of thickness of Ge interlayer on the reaction process of Ni/Ge/Si system. 　　We use effusion cell to deposit 12, 20, and 30nm Ge interlayer, and then deposit 30nm Ni by electron beam evaporate. During the annealing process at different temperature(500, 600, and 700℃) with different time(1~18 hr), we measure the curvature of the samples in situ. After annealing, the samples were investigated by four-point probe, X-ray diffraction(XRD), Auger Electron Spectroscopy(AES), and transmission electron microscopy(TEM) with energy dispersion spectrometer(EDX). The result shows that if the Ge interlayer is below 20 nm, the samples formed Ge (NiSi1-zGez、NiSi1-yGey)/ NiSi1-zGez（Si1-xGex、Ge）/Si (y、x>z) structure after annealing at 500℃. As the annealing time increases, the ratio of Ge in the upper layer increases. When the annealing temperature raises to 700℃, the samples’ structures change into transverse NiSi1-zGez /Si1-xGex /NiSi1-zGez sandwich structure. We speculate that this is because the Si1-xGex grain grows upwardly. The percentage of Ge in the Si1-xGex grain increases, but does not change in the NiSi1-zGez grain as the annealing time increases at 700℃. The samples’ structures are Ge、NiSi1-yGey、NiSi1-zGez/ NiSi1-zGez、Si1-xGex、Ge/NiSi2/Si after annealing at 500℃ as the Ge interlayer is 30nm. The structures transfer into transverse NiSi1-zGez or NiSi2/Si1-xGex/ NiSi1-zGez or NiSi2 sandwich structures, and a thin Si1-xGex layer forms at surface after annealing at 700℃. We speculate that it is also because the Si1-xGex grain grows upwardly. The NiSi2 grain grows but the NiSi1-zGez grain decreases when the annealing time increases. NiSi2 appears early for the samples of 30nm Ge interlayer, and doesn’t be found even the annealing condition is 700℃ for 18hrs if the samples have Ge interlayer below 20nm. This is because when the thicker Ge interlayer anneals, the diffusion of Ni will be obstructed, and Ni will form NiSi2 in the Si surface. This is very different from normal nickel silicide forming sequence. We will bring up reasonable explanations to the experiment results by using the effective heat of formation.
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Book chapters on the topic "Interlayer thickness"

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Yang, Min, Zeng Da Zou, Si Li Song, and Xin Hong Wang. "Effect of Interlayer Thickness on Strength and Fracture of Si3N4 and Inconel600 Joint." In Key Engineering Materials, 2435–40. Stafa: Trans Tech Publications Ltd., 2005. http://dx.doi.org/10.4028/0-87849-978-4.2435.

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Gérard, J. F., N. Amdouni, H. Sautereau, and J. P. Pascault. "Introduction of a Rubbery Interphase in Glass/Epoxy Composite Materials: Influence of the Interlayer Thickness on the Viscoelastic and Mechanical Properties of Particulate and Unidirectional Composites." In Controlled Interphases in Composite Materials, 441–48. Dordrecht: Springer Netherlands, 1990. http://dx.doi.org/10.1007/978-94-011-7816-7_43.

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Conference papers on the topic "Interlayer thickness"

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Shen, W., A. Das, M. Racine, R. Cheng, J. H. Judy, and J. Wang. "Reduction of Ru Interlayer Thickness for CoCrPt-SiO2 Perpendicular Recording Media." In INTERMAG 2006 - IEEE International Magnetics Conference. IEEE, 2006. http://dx.doi.org/10.1109/intmag.2006.376354.

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Zhao, Fuxiao, Tianqing Yu, and Jianhua Cheng. "The optimum thickness confirmation of asphalt mixture stress-absorbing material interlayer." In 2010 International Conference on Mechanic Automation and Control Engineering (MACE). IEEE, 2010. http://dx.doi.org/10.1109/mace.2010.5536612.

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Balasubramanian, Manickam, and Ramalingam Kumar. "Prediction of Reliability in Friction Welded Dissimilar Joints by Weibull Distribution." In ASME 2015 International Mechanical Engineering Congress and Exposition. American Society of Mechanical Engineers, 2015. http://dx.doi.org/10.1115/imece2015-50621.

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The reliability of experimental data obtained in friction welded titanium alloy and stainless steel with copper interlayer by using various interlayer thicknesses and upset time are investigated using the maximum likelihood method for the estimation of the Weibull parameters of the results. The results indicate that among the various process parameters, interlayer thickness was significant. Further the reliability of the tensile strength was estimated using weibull distribution. Using this technique in conjunction with the experimental data, we can predict the output, in this case tensile strength more accurately and minimize their impact. Titanium alloy when directly bonded to stainless steel, improper bonding happens. Hence an interlayer in the form of copper is added to have successful joints.
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Marcinichen, Jackson B., and John R. Thome. "3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73263.

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For the next generation of high performance computers, the new challenges are to shorten the distance for transporting data (to accelerate the transfer of information) between multi-microprocessors and memories, and to cool these electronic components despite the increased heat flux that results from increased transistor density. Recent technological advances show a tendency for the development of 3D integrated circuit stacked architectures with interlayer cooling (multi-microchannels in the silicon layers). However, huge challenges exist in such design/concept, i.e. flow distribution to hundreds microchannels distributed in the different interlayers, thermo-hydrodynamic and geometrical limitations, manufacturing etc. 3D-ICs with interlayer cooling are still about a decade away, so a viable shorter term goal is 3D stacks with backside cooling, taking advantage of Si layers now able to be thineer down to only 50 μm thickness. Thus, the present work presents thermo-hydrodynamic simulations for 3D stacks considering only a backside cooler, which simplifies considerably the assembly and guarantees a high level of reliability. In summary, the results showed that this concept is thermally feasible and potentially that interlayer microchannels (between stacks) will not be necessary.
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Abou-Hanna, Jeries, John Carlson, and Jose´ Lozano. "Nano Investigation of Cracks in Tungsten-Doped Diamond-Like Carbon (DLC) Coatings." In ASME 2005 International Mechanical Engineering Congress and Exposition. ASMEDC, 2005. http://dx.doi.org/10.1115/imece2005-79135.

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Tungsten-doped diamond-like carbon (DLC) coatings have been magnetron sputtered onto 52100 steel blocks with chromium and chromium / tungsten carbide compound interlayers. The surface finish (Ra) of the substrate before deposition was 0.102 to 0.203 μm. The effect on the growth of the film of this substrate finish as well as surface contaminants is investigated using SEM and TEM. In areas of greatest substrate roughness, the coatings exhibited cracks from near the columnar structured chromium interlayer through the coating thickness. STEM EDS analysis shows chemistry variations at the interlayers to be minimal. In the areas with surface contaminants, cracks are observed in the film at an approximately 45° angle to the substrate.
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Moharana, P. L., Shahid Anwar, Aminul Islam, S. Bajpai, and Sharmistha Anwar. "Study of nickel interlayer thickness effect on WN/Ni multilayer thin film." In DAE SOLID STATE PHYSICS SYMPOSIUM 2016. Author(s), 2017. http://dx.doi.org/10.1063/1.4980483.

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Mohammed, Omar B., Leonard F. Register, and Sanjay K. Banerjee. "Tunnel Barrier Thickness, Interlayer Rotational Alignment, and Top Gating Effects on ReS2/hBN/ReS2 Resonant Interlayer Tunnel Field Effect Transistors." In 2019 Device Research Conference (DRC). IEEE, 2019. http://dx.doi.org/10.1109/drc46940.2019.9046452.

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Arai, Masahiro, Koh-Ichi Sugimoto, and Morinobu Endo. "Mode II Interlaminar Fracture Toughness of CNF-CFRP Hybrid Composite." In ASME 2006 Multifunctional Nanocomposites International Conference. ASMEDC, 2006. http://dx.doi.org/10.1115/mn2006-17033.

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Interlaminar fracture toughness for mode II deformation were investigated for carbon fiber (CF)/epoxy laminates toughened by carbon-nano-fiber/epoxy interlayer. Vapor grown carbon fiber (VGCF) and vapor grown carbon ‘nano’ fiber (VGNF) were chosen as the stiffeners for the interlayer. In order to illustrate the effect of the interlayer on the model II fracture toughness of the laminates, several types of CFRP/CNF hybrid laminates were fabricated, which are composed of unidirectional prepregs and carbon nano fiber varying the thickness of the interlayer. Mode II interlaminar fracture toughnesses of the hybrid composites were evaluated by end notched flexure (ENF) test using short-type beam specimens. The fracture toughnesses were calculated by traditional beam theory using the energy release rate of the crack. From the experimental results, it is confirmed that the mode II interlaminar fracture toughnesses for hybrid laminates are from 2.0 to 3.0 times higher than that of original CFRP laminates, and the optimal thickness (area density) of the CNF interlayer exists. The difference in the effect of the interlayer fracture properties under mode II deformation was discussed on the bases of fractographic observations derived from scanning electric microscope.
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Le, Minh-Quy, Jin-Woo Yi, and Seock-Sam Kim. "Finite Element Analysis of Ceramic Coating Systems Under Spherical Indentation With Metallic Interlayer: Part I — Uncracked Coatings." In World Tribology Congress III. ASMEDC, 2005. http://dx.doi.org/10.1115/wtc2005-64209.

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Spherical indentation problems of ceramic coatings/metallic inter-layer/ductile substrate were investigated numerically by axisymmetric finite element analysis (FEA) for two typical ceramic coatings with relatively high and low elastic modulus deposited on aluminum alloy and carbon steel. Various indenter radius-coating thickness ratios and interlayer thickness-coating thickness ratios were used in the modeling. Radial stress distribution and plastic damage zones evolution were discussed in connection with model parameters. The results showed that the suitable metallic interlayer could improve resistance of ceramic coating systems through reducing the peak tensile radial stress on the surface and interface of ceramic coatings and plastic damage zone size in the substrate under spherical indentation.
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Zhang, M., Y. Nozaki, and K. Matsuyama. "Thickness dependence of interlayer fringe field coupling in sub micron NiFe/Cu multilayered pillars." In INTERMAG Asia 2005: Digest of the IEEE International Magnetics Conference. IEEE, 2005. http://dx.doi.org/10.1109/intmag.2005.1464305.

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You might also be interested in the extended bibliographies on the topic 'Interlayer thickness' for particular source types:
Journal articles
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