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Journal articles on the topic 'Interfacial thermal conductance'

Author: Grafiati

Published: 2 November 2024

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1

Green, Andrew J., and Hugh H. Richardson. "Solute Effects on Interfacial Thermal Conductance." MRS Proceedings 1543 (2013): 151–57. http://dx.doi.org/10.1557/opl.2013.677.

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ABSTRACTThe thermal conductance of a gold/water interface has been found to change as a function of the surrounding’s adhesion energy. We measure the thermal conductance of a lithographically prepared gold nanowire with a thin film nanoscale thermal sensor composed of AlGaN:Er3+. The temperature of the nanowire is measured as a function of incident laser intensity. The slope of this plot is inversely proportional to the thermal conductance of the nanoparticle/surrounding’s interface. We show that the conductance of the nanoparticle/water interface increases with the molality of the solution. This was tested with multiple solutes including NaCl, and D-Glucose. The interfacial conductance of pure water is reported to be 44 MW/m2K and the conductance saturates to 100 MW/m2K at a molality of 0.21 m.

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2

Rajabpour, Ali, Saeed Bazrafshan, and Sebastian Volz. "Carbon-nitride 2D nanostructures: thermal conductivity and interfacial thermal conductance with the silica substrate." Physical Chemistry Chemical Physics 21, no. 5 (2019): 2507–12. http://dx.doi.org/10.1039/c8cp06992a.

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The rate of heat dissipation from a carbon-nitride 2D nanostructure depends on the interfacial thermal conductance with its substrate. It was found that a structure with higher thermal conductivity, has a lower value of interfacial thermal conductance with the silica substrate.

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3

Yang, Wu Lin, Kun Peng, Jia Jun Zhu, De Yi Li, and Ling Ping Zhou. "Numerical Modeling of Thermal Conductivity of Diamond Particle Reinforced Aluminum Composite." Advanced Materials Research 873 (December 2013): 344–49. http://dx.doi.org/10.4028/www.scientific.net/amr.873.344.

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In the present work, the finite element method is employed to predict the effective thermal conductivity of diamond particle reinforced aluminum composite. The common finite element commercial software ANSYS is used to for this numerical analysis. A body-centered cubic particle arrangement model are constructed to simulate the microstructure of the composite with 60 vol.% diamond. The effect of particle size and inhomogeneous interfacial conductance on the thermal conductivity of diamond particles reinforced aluminum composite is investigated. Cubo-octahedral particles are assumed and interfacial thermal conductance between different diamond faces and aluminum matrix is implemented by real constants of contact element. The results show that the numerical results using present model agree reasonably well with the experimentation. Taking into consideration the interfacial thermal conductance, the influence of particle size on total thermal conductivity of composite is obvious, the larger size particles tend to meet requirement of the high thermal conductivity of composite. Fitting the experimental result with the inhomogeneous interfacial thermal conductance model, the evolution of the composite thermal property is profound studied.

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4

Fan, Hang, Kun Zhang, Guansong He, Zhijian Yang, and Fude Nie. "Ab initio determination of interfacial thermal conductance for polymer-bonded explosive interfaces." AIP Advances 12, no. 6 (June 1, 2022): 065005. http://dx.doi.org/10.1063/5.0094018.

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Understanding the thermal transport in polymer-bonded explosives (PBXs) is critical for enhancing the safety and reliability during PBX design, especially in the absence of effective experimental measurements. In this work, we rigorously investigated the phonon properties of 1,3,5-triamino-2,4,6-trinitrobenzene (TATB) and polyvinylidene fluoride (PVDF) and calculated the interfacial thermal conductance using an ab initio approach. The diffuse mismatch model and anharmonic inelastic model were adopted to examine the interfacial thermal conductance as a function of temperature for the TATB–PVDF interface. Our calculation results indicate that low-frequency phonon modes and the two-phonon process play dominant roles in the thermal transport at interfaces. In contrast, high-order phonon processes involving three to eight phonons accounted for around 8% of the interfacial thermal conductance at the TATB–PVDF interface. Phonon properties, such as the velocity and degree of phonon density overlap, are discussed for the TATB–PVDF and 1,3,5,7-tetranitro-1,3,5,7-tetraazacyclooctane (HMX)–PVDF interfaces to estimate the interfacial thermal conductance of PBXs. This study provides a theoretical explanation for the establishment of a research method for PBX thermal transport.

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5

Bai, Guang Zhao, Wan Jiang, G. Wang, Li Dong Chen, and X. Shi. "Effective Thermal Conductivity of MoSi₂/SiC Composites." Materials Science Forum 492-493 (August 2005): 551–54. http://dx.doi.org/10.4028/www.scientific.net/msf.492-493.551.

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Thermal conductivity of as-prepared MoSi2/SiC composites has been determined by Laser Flash method. Interfacial thermal conductance for composites with 100nm SiC and with 0.5µm has been determined by using effective medium theory. The results of interfacial thermal conductance exhibit that both the inclusion size and the clustering of the inclusions play an important role in determining composite thermal conductivity.

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6

Wu, Shuang, Jifen Wang, Huaqing Xie, and Zhixiong Guo. "Interfacial Thermal Conductance across Graphene/MoS2 van der Waals Heterostructures." Energies 13, no. 21 (November 9, 2020): 5851. http://dx.doi.org/10.3390/en13215851.

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The thermal conductivity and interface thermal conductance of graphene stacked MoS2 (graphene/MoS2) van der Waals heterostructure were studied by the first principles and molecular dynamics (MD) simulations. Firstly, two different heterostructures were established and optimized by VASP. Subsequently, we obtained the thermal conductivity (K) and interfacial thermal conductance (G) via MD simulations. The predicted Κ of monolayer graphene and monolayer MoS2 reached 1458.7 W/m K and 55.27 W/m K, respectively. The thermal conductance across the graphene/MoS2 interface was calculated to be 8.95 MW/m2 K at 300 K. The G increases with temperature and the interface coupling strength. Finally, the phonon spectra and phonon density of state were obtained to analyze the changing mechanism of thermal conductivity and thermal conductance.

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7

Liu, Yang, Wenhao Wu, Shixian Yang, and Ping Yang. "Interfacial thermal conductance of graphene/MoS2 heterointerface." Surfaces and Interfaces 28 (February 2022): 101640. http://dx.doi.org/10.1016/j.surfin.2021.101640.

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8

Yang, Wei, Kun Wang, Yongsheng Fu, Kun Zheng, Yun Chen, and Yongmei Ma. "Interfacial Thermal Conductance between Alumina and Epoxy." Journal of Physics: Conference Series 2109, no. 1 (November 1, 2021): 012018. http://dx.doi.org/10.1088/1742-6596/2109/1/012018.

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Abstract Interfacial thermal conductance (ITC) of inorganic/epoxy interface is regarded as one of the most significant factors in determining thermal transport performance of epoxy composite. Here, ITC between alumina and epoxy was experimentally investigated by time-domain thermoreflectance (TDTR) method. The results show that the ITC is effectively increased from 9.0 MW m-2 K-1 for non-treated alumina/epoxy interfaces to 26.3 MW m-2 K-1 for plasma treated interfaces. This work sheds some light on design and application for thermally conductive composites.

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9

Xu, Ke, Jicheng Zhang, Xiaoli Hao, Ning Wei, Xuezheng Cao, Yang Kang, and Kun Cai. "Interfacial thermal conductance of buckling carbon nanotubes." AIP Advances 8, no. 6 (June 2018): 065116. http://dx.doi.org/10.1063/1.5039499.

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10

Zhang, Lifa, Juzar Thingna, Dahai He, Jian-Sheng Wang, and Baowen Li. "Nonlinearity enhanced interfacial thermal conductance and rectification." EPL (Europhysics Letters) 103, no. 6 (September 1, 2013): 64002. http://dx.doi.org/10.1209/0295-5075/103/64002.

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11

Liu, Chenhan, Zhiyong Wei, Jian Wang, Kedong Bi, Juekuan Yang, and Yunfei Chen. "The contact area dependent interfacial thermal conductance." AIP Advances 5, no. 12 (December 2015): 127111. http://dx.doi.org/10.1063/1.4937775.

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12

Ding, Zhiwei, Qing-Xiang Pei, Jin-Wu Jiang, Wenxuan Huang, and Yong-Wei Zhang. "Interfacial thermal conductance in graphene/MoS2 heterostructures." Carbon 96 (January 2016): 888–96. http://dx.doi.org/10.1016/j.carbon.2015.10.046.

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13

Peterson, G. P., and L. S. Fletcher. "Measurement of the Thermal Contact Conductance and Thermal Conductivity of Anodized Aluminum Coatings." Journal of Heat Transfer 112, no. 3 (August 1, 1990): 579–85. http://dx.doi.org/10.1115/1.2910426.

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An experimental investigation was conducted to determine the thermal contact conductance and effective thermal conductivity of anodized coatings. One chemically polished Aluminum 6061-T6 test specimen and seven specimens with anodized coatings varying in thickness from 60.9 μm to 163.8 μm were tested while in contact with a single unanodized aluminum surface. Measurements of the overall joint conductance, composed of the thermal contact conductance between the anodized coating and the bare aluminum surface and the bulk conductance of the coating material, indicated that the overall joint conductance decreased with increasing thickness of the anodized coating and increased with increasing interfacial load. Using the experimental data, a dimensionless expression was developed that related the overall joint conductance to the coating thickness, the surface roughness, the interfacial pressure, and the properties of the aluminum substrate. By subtracting the thermal contact conductance from the measured overall joint conductance, estimations of the effective thermal conductivity of the anodized coating as a function of pressure were obtained for each of the seven anodized specimens. At an extrapolated pressure of zero, the effective thermal conductivity was found to be approximately 0.02 W/m-K. In addition to this extrapolated value, a single expression for predicting the effective thermal conductivity as a function of both the interface pressure and the anodized coating thickness was developed and shown to be within ±5 percent of the experimental data over a pressure range of 0 to 14 MPa.

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14

Ren, Kai, Yan Chen, Huasong Qin, Wenlin Feng, and Gang Zhang. "Graphene/biphenylene heterostructure: Interfacial thermal conduction and thermal rectification." Applied Physics Letters 121, no. 8 (August 22, 2022): 082203. http://dx.doi.org/10.1063/5.0100391.

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The allotrope of carbon, biphenylene, was prepared experimentally recently [Fan et al., Science 372, 852–856 (2021)]. In this Letter, we perform first-principles simulation to understand the bonding nature and structure stability of the possible in-plane heterostructure built by graphene and biphenylene. We found that the graphene–biphenylene in-plane heterostructure only exhibits along the armchair direction, which is connected together by strong covalent bonds and energetically stable. Then, the non-equilibrium molecular dynamics calculations are used to explore the interfacial thermal properties of the graphene/biphenylene heterostructure. It is found that the graphene/biphenylene in-plane heterostructure possesses an excellent interfacial thermal conductance of 2.84 × 109 W·K−1·m−2 at room temperature. Importantly, the interfacial thermal conductance presents different temperature dependence under opposite heat flux direction. This anomalous temperature dependence results in increased thermal rectification ratio with temperature about 40% at 350 K. This work provides comprehensive insight into the graphene–biphenylene heterostructure and suggests a route for designing a thermal rectifier with high efficiency.

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15

Wang, Qilang, Xing Liang, Bohai Liu, Yihui Song, Guohua Gao, and Xiangfan Xu. "Thermal conductivity of V2O5 nanowires and their contact thermal conductance." Nanoscale 12, no. 2 (2020): 1138–43. http://dx.doi.org/10.1039/c9nr08803b.

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16

Guo, Jianhua, Niping Ma, Jiale Chen, and Ning Wei. "Efficient Non-Destructive Detection of Interface Adhesion State by Interfacial Thermal Conductance: A Molecular Dynamics Study." Processes 11, no. 4 (March 29, 2023): 1032. http://dx.doi.org/10.3390/pr11041032.

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The state of interface adhesion, as measured by the void ratio, is a critical factor affecting the adhesion strength and heat dissipation efficiency of a system. However, non-destructive and rapid detection of the adhesion process remains a challenge. In this study, we used all-atom molecular dynamics simulations to investigate the interfacial thermal conductance of silicon and polymer at various adhesion void ratios, with the aim of achieving non-destructive and rapid detection of the adhesion process. Our results demonstrate a linear relationship between the interfacial thermal conductance and effective contact area at different temperatures, enabling the numerical value of interfacial thermal conductance to serve as an indicator of interfacial adhesion state. Furthermore, we also output the surface temperature of the adhesive interface. The non-uniformity of the surface temperature evolution can be used to identify the location of bubbles on the adhesive surface, which further reflects the bonding state of the interface. This project presents a novel approach and research framework for the non-destructive and rapid testing of the adhesion processes.

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17

Stocker, Kelsey M., Suzanne M. Neidhart, and J. Daniel Gezelter. "Interfacial thermal conductance of thiolate-protected gold nanospheres." Journal of Applied Physics 119, no. 2 (January 14, 2016): 025106. http://dx.doi.org/10.1063/1.4939956.

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18

Wang, W., and H. H. Qiu. "Interfacial thermal conductance in rapid contact solidification process." International Journal of Heat and Mass Transfer 45, no. 10 (May 2002): 2043–53. http://dx.doi.org/10.1016/s0017-9310(01)00307-6.

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19

Zhang, Chunwei, Weiwei Zhao, Yong Zeng, Hai Zhou, Kedong Bi, and Yunfei Chen. "Manipulation of interfacial thermal conductance via Rhodamine 6G." Science Bulletin 60, no. 6 (March 2015): 654–56. http://dx.doi.org/10.1007/s11434-015-0754-7.

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20

Zhang, Ying-Yan, Qing-Xiang Pei, Yiu-Wing Mai, and Siu-Kai Lai. "Interfacial thermal conductance in multilayer graphene/phosphorene heterostructure." Journal of Physics D: Applied Physics 49, no. 46 (October 20, 2016): 465301. http://dx.doi.org/10.1088/0022-3727/49/46/465301.

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21

Oh, Dong-Wook, Seok Kim, John A. Rogers, David G. Cahill, and Sanjiv Sinha. "Interfacial Thermal Conductance of Transfer-Printed Metal Films." Advanced Materials 23, no. 43 (October 4, 2011): 5028–33. http://dx.doi.org/10.1002/adma.201102994.

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22

Hopkins, Patrick E. "Thermal Transport across Solid Interfaces with Nanoscale Imperfections: Effects of Roughness, Disorder, Dislocations, and Bonding on Thermal Boundary Conductance." ISRN Mechanical Engineering 2013 (January 30, 2013): 1–19. http://dx.doi.org/10.1155/2013/682586.

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The efficiency in modern technologies and green energy solutions has boiled down to a thermal engineering problem on the nanoscale. Due to the magnitudes of the thermal mean free paths approaching or overpassing typical length scales in nanomaterials (i.e., materials with length scales less than one micrometer), the thermal transport across interfaces can dictate the overall thermal resistance in nanosystems. However, the fundamental mechanisms driving these electron and phonon interactions at nanoscale interfaces are difficult to predict and control since the thermal boundary conductance across interfaces is intimately related to the characteristics of the interface (structure, bonding, geometry, etc.) in addition to the fundamental atomistic properties of the materials comprising the interface itself. In this paper, I review the recent experimental progress in understanding the interplay between interfacial properties on the atomic scale and thermal transport across solid interfaces. I focus this discussion specifically on the role of interfacial nanoscale “imperfections,” such as surface roughness, compositional disorder, atomic dislocations, or interfacial bonding. Each type of interfacial imperfection leads to different scattering mechanisms that can be used to control the thermal boundary conductance. This offers a unique avenue for controlling scattering and thermal transport in nanotechnology.

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23

Hong, Yang, Jingchao Zhang, and Xiao Cheng Zeng. "Thermal contact resistance across a linear heterojunction within a hybrid graphene/hexagonal boron nitride sheet." Physical Chemistry Chemical Physics 18, no. 35 (2016): 24164–70. http://dx.doi.org/10.1039/c6cp03933b.

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24

Yang, Wei, Yun Chen, Yipeng Zhang, Yongsheng Fu, Kun Zheng, Kun Wang, and Yongmei Ma. "Thermal Conductance of Epoxy/Alumina Interfaces." Journal of Physics: Conference Series 2133, no. 1 (November 1, 2021): 012002. http://dx.doi.org/10.1088/1742-6596/2133/1/012002.

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Abstract The interfacial thermal conductance (ITC) between filler and polymer matrix is considered as one of the important factors that limits the thermal conductivity of thermally conductive polymer composites. The effect of two different surface treatments (piranha solution and plasma) on ITC of epoxy/alumina was investigated using Time-domain thermoreflectance method (TDTR). The TDTR results show that compared with non-treated samples, the ITC of samples treated by piranha solution and plasma increased 2.9 times and 3.4 times, respectively. This study provides guidance for improving the thermal conductivity of thermally conductive polymer composites.

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25

Mittelbach, M., C. Vogd, L. S. Fletcher, and G. P. Peterson. "The Interfacial Pressure Distribution and Thermal Conductance of Bolted Joints." Journal of Heat Transfer 116, no. 4 (November 1, 1994): 823–28. http://dx.doi.org/10.1115/1.2911454.

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Experimental interface pressure distributions and thermal conductance data are presented for a bolted joint. The variables considered included the bolt torque and associated axial load, the upper and lower plate thicknesses, and the mean interface temperature within the bolt radius. For 7.62-cm-dia Aluminum 6061-T6 plates, axial loads of 6.69 to 13.425 kN (1500 to 3000 lb), three heat fluxes, and mean junction temperatures of up to 310 K were considered. Pressure distribution data obtained with a pressure-sensitive film compared favorably with both theoretical predictions and published experimental data. Thermal conductance data obtained at three radial locations for the bare interface compared favorably with published data. These data also were compared with a previously published correlation for heat transfer in bolted joints. Thermal conductance data for high-conductivity elastomeric gasket materials were obtained to ascertain their suitability for thermal enhancement. The results of this investigation will be useful in the thermal analysis of bolted and riveted joints.

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26

Liang, Xuebing, Chengchang Jia, Ke Chu, and Hui Chen. "Predicted interfacial thermal conductance and thermal conductivity of diamond/Al composites with various interfacial coatings." Rare Metals 30, no. 5 (October 2011): 544–49. http://dx.doi.org/10.1007/s12598-011-0427-x.

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27

Li, Shanchen, Yang Chen, Junhua Zhao, Chunlei Wang, and Ning Wei. "Atomic structure causing an obvious difference in thermal conductance at the Pd–H2O interface: a molecular dynamics simulation." Nanoscale 12, no. 34 (2020): 17870–79. http://dx.doi.org/10.1039/d0nr04594b.

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28

Tao, Yi, Chao Wu, Han Qi, Chenhan Liu, Xiongyu Wu, Mengyi Hao, Zhiyong Wei, Juekuan Yang, and Yunfei Chen. "The enhancement of heat conduction across the metal/graphite interface treated with a focused ion beam." Nanoscale 12, no. 27 (2020): 14838–46. http://dx.doi.org/10.1039/c9nr09937a.

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29

Zhang, Lin, and Ling Liu. "Hierarchically hydrogen-bonded graphene/polymer interfaces with drastically enhanced interfacial thermal conductance." Nanoscale 11, no. 8 (2019): 3656–64. http://dx.doi.org/10.1039/c8nr08760a.

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30

Zhou, Xiao-wang, Reese E. Jones, Patrick E. Hopkins, and Thomas E. Beechem. "Thermal boundary conductance between Al films and GaN nanowires investigated with molecular dynamics." Phys. Chem. Chem. Phys. 16, no. 20 (2014): 9403–10. http://dx.doi.org/10.1039/c4cp00261j.

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Using molecular dynamics simulations, we studied the thermal boundary conductance between GaN nanowires and Al films and showed how it may be possible to enhance interfacial thermal transport in this important system.

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31

Dong, Yun, Yusong Ding, Zhiyuan Rui, Fangming Lian, Weibin Hui, Jie Wu, Zhiguo Wu, and Pengxun Yan. "Tuning the interfacial friction force and thermal conductance by altering phonon properties at contact interface." Nanotechnology 33, no. 23 (March 15, 2022): 235401. http://dx.doi.org/10.1088/1361-6528/ac56ba.

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Abstract Controlling friction force and thermal conductance at solid/solid interface is of great importance but remains a significant challenge. In this work, we propose a method to control the matching degree of phonon spectra at the interface through modifying the atomic mass of contact materials, thereby regulating the interfacial friction force and thermal conductance. Results of Debye theory and molecular dynamics simulations show that the cutoff frequency of phonon spectrum decreases with increasing atomic mass. Thus, two contact surfaces with equal atomic mass have same vibrational characteristics, so that more phonons could pass through the interface. In these regards, the coupling strength of phonon modes on contact surfaces makes it possible to gain insight into the nonmonotonic variation of interfacial friction force and thermal conductance. Our investigations suggest that the overlap of phonon modes increases energy scattering channels and therefore phonon transmission at the interface, and finally, an enhanced energy dissipation in friction and heat transfer ability at interface.

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32

Pan, Shuaihang, Jie Yuan, Tianqi Zheng, Zhenyu She, and Xiaochun Li. "Interfacial thermal conductance of in situ aluminum-matrix nanocomposites." Journal of Materials Science 56, no. 24 (May 24, 2021): 13646–58. http://dx.doi.org/10.1007/s10853-021-06176-7.

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33

Wu, Dan, Hua Ding, Zhi-Qiang Fan, Pin-Zhen Jia, Hai-Qing Xie, and Xue-Kun Chen. "High interfacial thermal conductance across heterogeneous GaN/graphene interface." Applied Surface Science 581 (April 2022): 152344. http://dx.doi.org/10.1016/j.apsusc.2021.152344.

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34

Seshadri, Indira, Theo Borca-Tasciuc, Pawel Keblinski, and Ganpati Ramanath. "Interfacial thermal conductance-rheology nexus in metal-contacted nanocomposites." Applied Physics Letters 103, no. 17 (October 21, 2013): 173113. http://dx.doi.org/10.1063/1.4824702.

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35

Gaitonde, Aalok, Amulya Nimmagadda, and Amy Marconnet. "Measurement of interfacial thermal conductance in Lithium ion batteries." Journal of Power Sources 343 (March 2017): 431–36. http://dx.doi.org/10.1016/j.jpowsour.2017.01.019.

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36

Khosravian, N., M. K. Samani, G. C. Loh, G. C. K. Chen, D. Baillargeat, and B. K. Tay. "Molecular dynamic simulation of diamond/silicon interfacial thermal conductance." Journal of Applied Physics 113, no. 2 (January 14, 2013): 024907. http://dx.doi.org/10.1063/1.4775399.

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37

Chen, Yang, Yingyan Zhang, Kun Cai, Jinwu Jiang, Jin-Cheng Zheng, Junhua Zhao, and Ning Wei. "Interfacial thermal conductance in graphene/black phosphorus heterogeneous structures." Carbon 117 (June 2017): 399–410. http://dx.doi.org/10.1016/j.carbon.2017.03.011.

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38

Zhang, W., T. S. Fisher, and N. Mingo. "Simulation of Interfacial Phonon Transport in Si–Ge Heterostructures Using an Atomistic Green’s Function Method." Journal of Heat Transfer 129, no. 4 (May 30, 2006): 483–91. http://dx.doi.org/10.1115/1.2709656.

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An atomistic Green’s function method is developed to simulate phonon transport across a strained germanium (or silicon) thin film between two semi-infinite silicon (or germanium) contacts. A plane-wave formulation is employed to handle the translational symmetry in directions parallel to the interfaces. The phonon transmission function and thermal conductance across the thin film are evaluated for various atomic configurations. The contributions from lattice straining and material heterogeneity are evaluated separately, and their relative magnitudes are characterized. The dependence of thermal conductance on film thickness is also calculated, verifying that the thermal conductance reaches an asymptotic value for very thick films. The thermal boundary resistance of a single Si∕Ge interface is computed and agrees well with analytical model predictions. Multiple-interface effects on thermal resistance are investigated, and the results indicate that the first few interfaces have the most significant effect on the overall thermal resistance.

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39

Wang, Quanjie, Xujun Wang, Xiangjun Liu, and Jie Zhang. "Interfacial engineering for the enhancement of interfacial thermal conductance in GaN/AlN heterostructure." Journal of Applied Physics 129, no. 23 (June 21, 2021): 235102. http://dx.doi.org/10.1063/5.0052742.

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40

Zobeiri, Hamidreza, Nicholas Hunter, Ridong Wang, Xinman Liu, Hong Tan, Shen Xu, and Xinwei Wang. "Thermal conductance between water and nm-thick WS2: extremely localized probing using nanosecond energy transport state-resolved Raman." Nanoscale Advances 2, no. 12 (2020): 5821–32. http://dx.doi.org/10.1039/d0na00844c.

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Interfacial thermal conductance between a nm-thick suspended WS₂ film and water is measured using a novel nET-Raman technique. By significantly reducing the effect of water thermal resistance, the interface resistance effect become more preeminent.

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41

Verma, Akarsh, Rajesh Kumar, and Avinash Parashar. "Enhanced thermal transport across a bi-crystalline graphene–polymer interface: an atomistic approach." Physical Chemistry Chemical Physics 21, no. 11 (2019): 6229–37. http://dx.doi.org/10.1039/c9cp00362b.

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42

Liu, Xiangjun, Junfeng Gao, Gang Zhang, and Yong-Wei Zhang. "Design of phosphorene/graphene heterojunctions for high and tunable interfacial thermal conductance." Nanoscale 10, no. 42 (2018): 19854–62. http://dx.doi.org/10.1039/c8nr06110f.

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Using density functional theory calculations and molecular dynamics simulations, we systematically explore various possible atomic structures of phosphorene/graphene in-plane heterojunctions and their effects on interfacial thermal conductance (ITC).

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43

Jagannadham, K. "Effect of interfacial interactions on the thermal conductivity and interfacial thermal conductance in tungsten–graphene layered structure." Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 32, no. 5 (September 2014): 051101. http://dx.doi.org/10.1116/1.4890576.

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44

Rastgarkafshgarkolaei, Rouzbeh, Jingjie Zhang, Carlos A. Polanco, Nam Q. Le, Avik W. Ghosh, and Pamela M. Norris. "Maximization of thermal conductance at interfaces via exponentially mass-graded interlayers." Nanoscale 11, no. 13 (2019): 6254–62. http://dx.doi.org/10.1039/c8nr09188a.

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45

Angeles, Frank, Xinping Shi, and Richard B. Wilson. "In situ and ex situ processes for synthesizing metal multilayers with electronically conductive interfaces." Journal of Applied Physics 131, no. 22 (June 14, 2022): 225302. http://dx.doi.org/10.1063/5.0084573.

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A number of technological applications and scientific experiments require processes for preparing metal multilayers with electronically and thermally conductive interfaces. We investigate how in situ vs ex situ synthesis processes affect the thermal conductance of metal/metal interfaces. We use time-domain thermoreflectance experiments to study thermal transport in Au/Fe, Al/Cu, and Cu/Pt bilayer samples. We quantify the effect of exposing the bottom metal layer to an ambient environment prior to deposition of the top metal layer. We observe that for Au/Fe, exposure of the Fe layer to air before depositing the top Au layer significantly impedes interfacial electronic currents. Exposing Cu to air prior to depositing an Al layer effectively eliminates interfacial electronic heat currents between the two metal layers. Exposure to air appears to have no effect on interfacial transport in the Cu/Pt system. Finally, we show that a short RF sputter etch of the bottom layer surface is sufficient to ensure a thermally and electronically conductive metal/metal interface in all materials we study. We analyze our results with a two-temperature model and bound the electronic interface conductance for the nine samples we study. Our findings have applications for thin-film synthesis and advance fundamental understanding of electronic thermal conductance at different types of interfaces between metals.

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Dinpajooh, Mohammadhasan, and Abraham Nitzan. "Heat conduction in polymer chains: Effect of substrate on the thermal conductance." Journal of Chemical Physics 156, no. 14 (April 14, 2022): 144901. http://dx.doi.org/10.1063/5.0087163.

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In standard molecular junctions, a molecular structure is placed between and connected to metal leads. Understanding how mechanical tuning in such molecular junctions can change heat conductance has interesting applications in nanoscale energy transport. In this work, we use nonequilibrium molecular dynamics simulations to address the effect of stretching on the phononic contribution to the heat conduction of molecular junctions consisting of single long-chain alkanes and various metal leads, such as Ag, Au, Cu, Ni, and Pt. The thermal conductance of such junctions is found to be much smaller than the intrinsic thermal conductance of the polymer and significantly depends on the nature of metal leads as expressed by the metal–molecule coupling and metal vibrational density of states. This behavior is expected and reflects the mismatch of phonon spectra at the metal molecule interfaces. As a function of stretching, we find a behavior similar to what was observed earlier [M. Dinpajooh and A. Nitzan, J. Chem. Phys. 153, 164903 (2020)] for pure polymeric structures. At relatively short electrode distances, where the polyethylene chains are compressed, it is found that the thermal conductances of the molecular junctions remain almost constant as one stretches the polymer chains. At critical electrode distances, the thermal conductances start to increase, reaching the values of the fully extended molecular junctions. Similar behaviors are observed for junctions in which several long-chain alkanes are sandwiched between various metal leads. These findings indicate that this behavior under stretching is an intrinsic property of the polymer chain and not significantly associated with the interfacial structures.

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Xu, Bin, Shiqian Hu, Shih-Wei Hung, Cheng Shao, Harsh Chandra, Fu-Rong Chen, Takashi Kodama, and Junichiro Shiomi. "Weaker bonding can give larger thermal conductance at highly mismatched interfaces." Science Advances 7, no. 17 (April 2021): eabf8197. http://dx.doi.org/10.1126/sciadv.abf8197.

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Thermal boundary conductance is typically positively correlated with interfacial adhesion at the interface. Here, we demonstrate a counterintuitive experimental result in which a weak van der Waals interface can give a higher thermal boundary conductance than a strong covalently bonded interface. This occurs in a system with highly mismatched vibrational frequencies (copper/diamond) modified by a self-assembled monolayer. Using finely controlled fabrication and detailed characterization, complemented by molecular simulation, the effects of bridging the vibrational spectrum mismatch and bonding at the interface are systematically varied and understood from a molecular dynamics viewpoint. The results reveal that the bridging and binding effects have a trade-off relationship and, consequently, that the bridging can overwhelm the binding effect at a highly mismatched interface. This study provides a comprehensive understanding of phonon transport at interfaces, unifying physical and chemical understandings, and allowing interfacial tailoring of the thermal transport in various material systems.

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Diao, Jiankuai, Deepak Srivastava, and Madhu Menon. "Molecular dynamics simulations of carbon nanotube/silicon interfacial thermal conductance." Journal of Chemical Physics 128, no. 16 (April 28, 2008): 164708. http://dx.doi.org/10.1063/1.2905211.

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Tao, Yi, Chenhan Liu, Weiyu Chen, Shuang Cai, Chen Chen, Zhiyong Wei, Kedong Bi, Juekuan Yang, and Yunfei Chen. "Mean free path dependent phonon contributions to interfacial thermal conductance." Physics Letters A 381, no. 22 (June 2017): 1899–904. http://dx.doi.org/10.1016/j.physleta.2017.03.020.

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Hu, Ming, Pawel Keblinski, Jian-Sheng Wang, and Nachiket Raravikar. "Interfacial thermal conductance between silicon and a vertical carbon nanotube." Journal of Applied Physics 104, no. 8 (October 15, 2008): 083503. http://dx.doi.org/10.1063/1.3000441.

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