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Relevant bibliographies by topics / Interfacial reaction

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Academic literature on the topic 'Interfacial reaction'

Author: Grafiati

Published: 4 June 2021

Last updated: 9 February 2022

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Journal articles on the topic "Interfacial reaction"

1

Astumian, R. D., and P. B. Chock. "Interfacial reaction dynamics." Journal of Physical Chemistry 89, no. 16 (August 1985): 3477–82. http://dx.doi.org/10.1021/j100262a012.

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O'Shaughnessy, B., and D. Vavylonis. "Interfacial reaction kinetics." European Physical Journal E 1, no. 2-3 (February 2000): 159–77. http://dx.doi.org/10.1007/pl00014596.

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Shubber, Fatima L. "Study the Interfacial Reaction between Copper/304 Stainless Steel Joining." Journal of Advanced Research in Dynamical and Control Systems 12, SP4 (March 31, 2020): 365–70. http://dx.doi.org/10.5373/jardcs/v12sp4/20201500.

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Wertheim, G. K., and D. N. E. Buchanan. "Interfacial reaction ofC60with silver." Physical Review B 50, no. 15 (October 15, 1994): 11070–73. http://dx.doi.org/10.1103/physrevb.50.11070.

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Wang, Chao-Hong, Chen-Nan Chiu, and Sinn-Wen Chen. "Investigations on interfacial reactions at reentrant corners." Journal of Materials Research 25, no. 5 (May 2010): 999–1003. http://dx.doi.org/10.1557/jmr.2010.0121.

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Interfacial reactions in Bi/Ni, Sn/Co, and Sn/Te systems that exhibit unique cruciform pattern formation are investigated. Different from the couples examined in the past, the solid substrates, Ni, Co, and Te, are placed outside the couples while constituents of low melting temperature, Bi and Sn, are placed in the center. With interfacial reactions proceeding in these couples, the reaction products grow inwardly at reentrant corners, and shrinking of the reaction layer at the corner is observed. As a result of the volumetric changes caused by interfacial reactions, stresses are built up in the couples, and stress-intensified locations are found at reentrant corners. The built-up stresses alter the diffusion rates and thus retard the reaction at the corners. Instead of forming cruciform patterns, the inner reactant is of flat shuriken shape after reactions.

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Lii, Ding-Fwu, Jow-Lay Huang, Jin-Jay Huang, and Horng-Hwa Lu. "The interfacial reaction in Cr3C2/Al2O3 composites." Journal of Materials Research 14, no. 3 (March 1999): 817–23. http://dx.doi.org/10.1557/jmr.1999.0108.

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This study investigates the effects of sintering atmosphere and temperature on the interfacial properties of Cr3C2/Al2O3 composites. Thermodynamic considerations and calculations with computer-assisted methods for the equilibrium compositions in the Al–O–Cr–C system were used to simulate the interfacial reaction in Cr3C2/Al2O3 composite during sintering. The results were in good agreement with the experimental analysis. Cr3C2 is more stable during sintering in a system with carbon due to the lower equilibrium oxygen partial pressure. Controlling CO and O2 gas concentration, Cr3C2 first oxidized, decarbonized, and then transformed to Cr7C3 before reacting with Al2O3. An interfacial reaction between Cr3C2 and Al2O3 was not observed.

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Chu, Jing, Ming Gu, Ruiheng Liu, Shengqiang Bai, Xun Shi, and Lidong Chen. "Interfacial behaviors of p-type CeyFexCo4–xSb12/Nb thermoelectric joints." Functional Materials Letters 13, no. 05 (May 28, 2020): 2051020. http://dx.doi.org/10.1142/s1793604720510200.

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Interfacial diffusions and/or chemical reactions are one of the key issues for the reliability of CoSb3-based skutterudite thermoelectric (TE) joint, especially for the [Formula: see text]-type joint, which limits the applications of TE devices. We investigate the interfacial evolution for [Formula: see text]-type CeyFexCo[Formula: see text]Sb[Formula: see text]/Nb joints ([Formula: see text]–1, [Formula: see text], 3, 4) and combine the previous study on [Formula: see text]-type Yb[Formula: see text]Co4Sb[Formula: see text]/Nb joint to demonstrate the effect of TE materials on the interfacial microstructure and interfacial resistivity. The reaction–diffusion kinetic analysis shows that the TE materials has little effect on chemical reactions but strongly influence the Sb diffusions. The low energy barrier of Sb diffusion leads to the absent phase decomposition of skutterudites in CeyFexCo[Formula: see text]Sb[Formula: see text]/Nb joints. The interfacial resistivity of CeyFexCo[Formula: see text]Sb[Formula: see text]/Nb joints is related with Fe content and the interfacial reaction layer (IRL) growth. In addition, since the interfacial reaction layer growth rate and interfacial resistivity of CeyFexCo[Formula: see text]Sb[Formula: see text]/Nb joints are both low, Nb is an adequate barrier layer candidate material.

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Chou, T. C., A. Joshi, and J. Wadsworth. "Solid state reactions of SiC with Co, Ni, and Pt." Journal of Materials Research 6, no. 4 (April 1991): 796–809. http://dx.doi.org/10.1557/jmr.1991.0796.

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Solid state reactions between SiC ceramics and Co, Ni, and Pt metals have been studied at temperatures between 800 and 1200 °C for various times under He or vacuum conditions. Reactions between the metals and SiC were extensive above 900 °C. Various metal silicides and carbon precipitates were formed in layered reaction zones. Interfacial melting was also observed at certain temperatures; teardrop-shaped reaction zones, porosity, and dendritic microstructure resulting from melting/solidification were evident. The metal/ceramic interfaces exhibited either planar or nonplanar morphologies, depending upon the nature of the metal/ceramic reactions. Concave interfacial contours were observed when interfacial melting occurred. By contrast, planar interfaces were observed in the absence of interfacial melting. In all cases, the decomposition of SiC was sluggish and may serve as a rate limiting step for metal/ceramic reactions. Free unreacted carbon precipitates were formed in all the reaction zones and the precipitation behavior was dependent upon the metal system as well as the location with respect to the SiC reaction interface. Modulated carbon bands, randomly scattered carbon precipitates, and/or carbon-denuded bands were formed in many of the reaction zones, and the carbon existed in a mixed state containing both amorphous and graphitic forms.

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Zhang, Qiang, Jie Cai Han, Ye Zhu, and Gao Hui Wu. "Microstructure and Hardness Performance of a SiCp/Al Composite by Pressureless Infiltration Technique." Key Engineering Materials 353-358 (September 2007): 1318–21. http://dx.doi.org/10.4028/www.scientific.net/kem.353-358.1318.

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In the present work, a SiCp/Al composite was fabricated by pressureless infiltration of aluminum alloy into loose-packed SiC particles preform, and its microstructure and hardness performance were investigated. The results showed that the composite was fully infiltrated and the particles were distributed uniformly in the composite. Interfacial reactions were found in the as-cast composite and the reaction product was identified as MgAl2O4 by TEM observation and XRD analysis. The interfacial reactions enhanced the wettability and promote the spontaneous infiltration process. The thermal exposure process increased the Brinell hardness of the composite. After the thermal exposure process, the block-like interfacial reaction products were distributed discretely, but the amount of the reaction products was increased.

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Chou, T. C. "Interfacial reaction of BN/Ni3Al." Applied Physics Letters 53, no. 16 (October 17, 1988): 1500–1502. http://dx.doi.org/10.1063/1.100467.

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Dissertations / Theses on the topic "Interfacial reaction"

1

Matthews, Sinéad Marie. "A microfluidic investigation of interfacial reaction kinetics." Thesis, University of Cambridge, 2007. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.613334.

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Unwin, Patrick Robert. "Hydrodynamic electrodes and the study of interfacial reaction mechanisms." Thesis, University of Oxford, 1989. http://ethos.bl.uk/OrderDetails.do?uin=uk.bl.ethos.236340.

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Ling, Juliette Roseanne. "Enhancement of the interfacial transfer of iodine by chemical reaction." Thesis, National Library of Canada = Bibliothèque nationale du Canada, 1997. http://www.collectionscanada.ca/obj/s4/f2/dsk2/ftp01/MQ29382.pdf.

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Xu, Lei. "Controlling interfacial reaction in aluminium to steel dissimilar metal welding." Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/controlling-interfacial-reaction-in-aluminium-to-steel-dissimilar-metal-welding(721d3009-de49-434c-bd81-b01ff5973706).html.

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Two different aluminium alloys, AA6111 (Al-Mg-Si) and AA7055 (Al-Mg-Zn), were chosen as the aluminium alloys to be welded with DC04, and two welding methods (USW and FSSW) were selected to prepare the welds. Selected pre-welded joints were then annealed at T=400 - 570oC for different times. Kinetics growth data was collected from the microstructure results, and the growth behaviour of the IMC layer was found to fit the parabolic growth law. A grain growth model was built to predict the grain size as a function of annealing time. A double-IMC phase diffusion model was applied, together with grain growth model, to predict the thickness of each phase as a function of annealing time in the diffusion process during heat treatment. In both material combinations and with both welding processes a similar sequence of IMC phase formation was observed during the solid state welding. η-Fe2Al5 was found to be the first IMC phase to nucleate. The IMC islands then spread to form a continuous layer in both material combinations. With longer welding times a second IMC phase, θ-FeAl3, was seen to develop on the aluminium side of the joints. Higher fracture energy was received in the DC04-AA6111 joints than in the DC04-AA7055 joints. Two reasons were claimed according to the microstructure in the two joints. The thicker IMC layers were observed in the DC04-AA7055 joints either before or after heat treatment, due to the faster growth rate of the θ phase. In addition, pores were left in the aluminium side near the interface as a result of the low melting point of AA7055.The modelling results for both the diffusion model and grain growth model fitted very well with the data from the static heat treatment. Grain growth occurred in both phases in the heat treatment significantly, and was found to affect the calculated activation energy by the grain boundary diffusion. At lower temperatures in the phases with a smaller grain size, the grain boundary diffusion had a more significant influence on the growth rate of the IMC phases. The activation energies for the grain boundary diffusion and lattice diffusion were calculated as 240 kJ/mol and 120 kJ/mol for the η phase, and 220 kJ/mol and 110 kJ/mol for the θ phase, respectively. The model was invalid for the growth of the discontinuous IMC layers in USW process. The diffusion model only worked for 1-Dimensional growth of a continuous layer, which was the growth behaviour of the IMC layer during heat treatment. However, due to the highly transient conditions in USW process, the IMC phases were not continuous and uniform even after a welding time of 2 seconds. Therefore, the growth of the island shaped IMC particles in USW was difficult to be predicted, unless the nucleation stage was taken into consideration.

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Rhamdhani, Muhammad Akbar Brooks Geoffrey. "Reaction kinetics and dynamic interfacial phenomena in liquid metal-slag systems." *McMaster only, 2005.

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6

Yu, Kyle Kai-Hung. "Interfacial Electrochemistry of Copper and Spectro-Electrochemical Characterization of Oxygen Reduction Reaction." Thesis, University of North Texas, 2011. https://digital.library.unt.edu/ark:/67531/metadc103416/.

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The first part of this dissertation highlights the contents of the electrochemical characterization of Cu and its electroplating on Ru-based substrates. The growth of Ru native oxide does diminish the efficiency of Cu plating on Ru surface. However, the electrochemical formed irreversible Ru hydrate dioxide (RuOxHy) shows better coverage of Cu UPD. The conductive Ru oxides are directly plateable liner materials as potential diffusion barriers for the IC fabrication. The part II of this dissertation demonstrates the development of a new rapid corrosion screening methodology for effective characterization Cu bimetallic corrosion in CMP and post-CMP environments. The corrosion inhibitors and antioxidants were studied in this dissertation. In part III, a new SEC methodology was developed to study the ORR catalysts. This novel SEC cell can offer cheap, rapid optical screening results, which helps the efficient development of a better ORR catalyst. Also, the SEC method is capable for identifying the poisoning of electrocatalysts. Our data show that the RuOxHy processes several outstanding properties of ORR such as high tolerance of sulfation, high kinetic current limitation and low percentage of hydrogen peroxide.

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Baig, Fakhir U. "Effects of interfacial reaction on oil displacement in a Hele-Shaw cell." Thesis, University of Ottawa (Canada), 1993. http://hdl.handle.net/10393/7666.

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An experimental study was conducted to examine the behaviour of reactive and non-reactive systems by displacement experiments of light paraffin oil/decane mixtures by water in a range of mobility ratios. Displacement experiments were performed in a Hele-Shaw cell, simulated a quarter of a reversed five-spot pattern. Displacement patterns produced by reactive and non-reactive systems were compared. It showed that the displacement patterns in the case of the reactive system were completely different from the non-reactive system. The recovery in the reactive system was always higher than in the non-reactive system. The recovery at breakthrough for both the reactive and non-reactive systems increased with the decrease in viscosity of oil. In the non-reactive system, total recovery at one hour after breakthrough increases with the decrease in oil viscosity, while in reactive system total recovery after one hour is nearly constant and independent of oil phase viscosity. Displacement experiments were performed for both favourable and unfavourable mobility ratios. In another series of displacement experiments, a slug of alkaline solution was injected followed by viscous water-glycerine solution. It was found that for all oil solutions, the breakthrough recovery for both reactive and non-reactive systems was lower in the case with a viscous backup. (Abstract shortened by UMI.)

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8

Kohler, Sven Philipp. "Dynamics of the gas-liquid interfacial reaction of O(³P) atoms with squalane." Thesis, Heriot-Watt University, 2006. http://hdl.handle.net/10399/153.

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9

Wang, Yin. "A metallurgical approach for controlling interfacial reaction in aluminium to magnesium dissimilar metal welding." Thesis, University of Manchester, 2016. https://www.research.manchester.ac.uk/portal/en/theses/a-metallurgical-approach-for-controlling-interfacial-reaction-in-aluminium-to-magnesium-dissimilar-metal-welding(baf9186c-449e-44f3-9a1e-20dfde48b966).html.

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Dissimilar welding of Al to Mg alloys could potentially find significant application in the automobile industry, if the massive production of brittle intermetallic compounds (IMCs) at the joint interface can be prevented. In order to better understand Al-Mg IMC reactions, a comprehensive investigation of the interfacial region in AA6111 - AZ31 diffusion couples was carried out in this research. Three Al-Mg binary IMCs, namely the -Al12Mg17, -AlMg and -Al3Mg2 phases, were observed to form in the Al - Mg diffusion couple. In both the Al3Mg2 and Al12Mg17 layers, residual stresses were detected. The stress components normal to the joint interface were found to be positive, which had the effect of promoting the extension of lateral cracks; while the horizontal components were compressive, which could hinder cracking in the vertical direction. As a result, the fracture resistance of the two IMCs were asymmetric with lower values along the interface than in the vertical direction. The higher stress level in the Al3Mg2 layer made it more susceptible to lateral cracking and hence becoming the weak link in the Al - Mg dissimilar joints. A potential metallurgical solution has been explored involving the introduction of Zn into the material system, so that a new intermetallic compound with better properties can be formed to replace the unfavored Al3Mg2 phase. In this research, an Al-Zn coating alloy was proposed for this purpose. To determine the optimum composition for the alloy, a numerical method that combined CALPHAD thermodynamic calculation and diffusion simulations was developed. The modelling results indicated that Al-20 at. % Zn was the optimum composition for completely suppressing the formation of Al3Mg2, and this has been verified by static diffusion and friction stir spot welding (FSSW) experiments. In both cases, the designed coating alloy was effective in changing the Al-Mg reaction path by forming the mechanically superior (Al,Zn)49Mg32 phase as a substitute for Al3Mg2. The FSS welds prepared with the Zn containing coating alloy exhibited a 6 % increase in lap shear strength, compared to the conventional Al-Mg welds. This lower than expected improvement resulted from the Zn addition reducing the liquation temperature of the material system, resulting in the production of a detrimental eutectic mixture which facilitated debonding of the welds. As a potential alternative solution, Al-Si coating material has been proposed to inhibit the growth of Al-Mg IMC layers, in which the Si phase was expected to form a partial interdiffusion barrier between the substrate materials and change the reaction path by preferentially reacting with Mg. Comparison of long-term static diffusion experiments between the Al-Si coated and Al - Mg dissimilar joints showed that the nucleation and growth of Mg2Si could change the reaction path and greatly reduce the thickness of the Al-Mg IMC layer at the joint interface. Although in actual friction stir spot welding (FSSW), Mg2Si was not formed in a detectable amounts, due to the very short reaction time, the Al-Si coating still led to a significant reduction in the IMC thickness by partially blocking the Al-Mg interdiffusion process. With the coating applied, the Al - Mg dissimilar welds exhibited enhanced mechanical performance with both their strength and fracture energy being markedly increased, through a reduction in the IMC layer thickness and the presence of Si particle toughening the reaction layer by causing crack deflection.

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10

De, Oliveira Cruz Mendes Tatsis Maria Alcina. "Marangoni instabilities under microgravity and in liquid-liquid systems with an interfacial chemical reaction." Thesis, Imperial College London, 1990. http://hdl.handle.net/10044/1/46279.

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Books on the topic "Interfacial reaction"

1

Ling, Juliette Roseanne. Enhancement of the interfacial transfer of iodine by chemical reaction. Ottawa: National Library of Canada = Bibliothèque nationale du Canada, 1999.

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2

International Symposium on Redox Mechanisms and Interfacial Properties of Molecules of Biological Importance (3rd 1987 Honolulu, Hawaii). Redox chemistry and interfacial behavior of biological molecules. New York: Plenum, 1988.

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International Symposium on Redox Mechanisms and Interfacial Properties of Molecules of Biological Importance (5th 1993 Honolulu, Hawaii). Proceedings of the Fifth International Symposium on Redox Mechanisms and Interfacial Properites [sic] of Molecules of Biological Importance, 1993. Pennington, NJ: Electrochemical Society, 1993.

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4

Sparks, Donald L., and Timothy J. Grundl, eds. Mineral-Water Interfacial Reactions. Washington, DC: American Chemical Society, 1999. http://dx.doi.org/10.1021/bk-1998-0715.

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5

Ison, Stephen John. Interfacial reactions between PbO-rich glasses and aluminium composites. [s.l.]: typescript, 2000.

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Wesley, D. A. Screening methods for developing internal pressure capacities for components in systems interfacing with nuclear power plant reactor coolant systems. Washington, DC: Division of Engineering, Office of Nuclear Regulatory Research, U.S. Nuclear Regulatory Commission, 1992.

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(Editor), Glenn Dryhurst, and K. Niki (Editor), eds. Redox Chemistry and Interfacial Behavior of Biological Molecules. Springer, 1989.

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8

M, Singh, and United States. National Aeronautics and Space Administration., eds. SiC (SCS-6) fiber reinforced-reaction formed SiC matrix composites: Microstructure and interfacial properties. [Washington, DC: National Aeronautics and Space Administration, 1997.

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M, Singh, and United States. National Aeronautics and Space Administration., eds. SiC (SCS-6) fiber reinforced-reaction formed SiC matrix composites: Microstructure and interfacial properties. [Washington, DC: National Aeronautics and Space Administration, 1997.

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M, Singh, and United States. National Aeronautics and Space Administration., eds. SiC (SCS-6) fiber reinforced-reaction formed SiC matrix composites: Microstructure and interfacial properties. [Washington, DC: National Aeronautics and Space Administration, 1997.

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Book chapters on the topic "Interfacial reaction"

1

Schmickler, Wolfgang, and Elizabeth Santos. "Hydrogen reaction and electrocatalysis." In Interfacial Electrochemistry, 163–75. Berlin, Heidelberg: Springer Berlin Heidelberg, 2010. http://dx.doi.org/10.1007/978-3-642-04937-8_14.

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2

Naoumidis, A. "Metallic Reaction for Joining of SiC Ceramics." In Interfacial Science in Ceramic Joining, 143–50. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-017-1917-9_12.

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Morgiel, J., N. Sobczak, and M. Ksiazek. "TEM Examinations of B13O2/Al Reaction Zone." In Interfacial Science in Ceramic Joining, 195–202. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-017-1917-9_17.

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Brito, M. E., M. C. Valecillos, H. Yokoyama, Y. Hirotsu, and Y. Mutoh. "Silicon Carbide-Nickel Interfacial Reaction and Structure." In Sintering ’87, 1403–8. Dordrecht: Springer Netherlands, 1988. http://dx.doi.org/10.1007/978-94-009-1373-8_236.

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Yotsutan, Shoji. "Chemical Interfacial Reaction Models with Radial Symmetry." In Nonlinear Diffusion Equations and Their Equilibrium States, 3, 561–72. Boston, MA: Birkhäuser Boston, 1992. http://dx.doi.org/10.1007/978-1-4612-0393-3_37.

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Han, Jin Sung, Jung Ho Heo, Il Sohn, and Joo Hyun Park. "Interfacial Reaction Between Magnesia Refractory and EAF Slag." In The Minerals, Metals & Materials Series, 667–71. Cham: Springer International Publishing, 2018. http://dx.doi.org/10.1007/978-3-319-95022-8_52.

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Li, Panjian, and Feipeng Zhang. "Interfacial Reaction Between Bioactive Glass and Synthetic Physiological Solution." In Ceramic Microstructures ’86, 127–36. Boston, MA: Springer US, 1987. http://dx.doi.org/10.1007/978-1-4613-1933-7_13.

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Oliveira, F. J., R. F. Silva, and J. M. Vieira. "Interfacial Reaction Kinetics of Silicon Nitride/Iron Alloys Diffusion Couples in the Range 1050°C/1250°C." In Interfacial Science in Ceramic Joining, 203–9. Dordrecht: Springer Netherlands, 1998. http://dx.doi.org/10.1007/978-94-017-1917-9_18.

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Sung, Si Young, Bong Jae Choi, and Sang Hwa Lee. "Interfacial Reaction between Molten Al Alloys and Titanium Matrix Composites." In Materials Science Forum, 310–13. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-995-4.310.

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Lee, Jea Won, In Seon Lee, Tae Won Kang, Dong Won Kim, and Sang Ho Kim. "Interfacial Reaction of Cu-Tie Coating-Polyimide Flexible Copper Clad Laminates." In Advanced Nondestructive Evaluation I, 1675–78. Stafa: Trans Tech Publications Ltd., 2006. http://dx.doi.org/10.4028/0-87849-412-x.1675.

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Conference papers on the topic "Interfacial reaction"

1

Barbee, Jr., Troy W., and Mark A. Wall. "Interface reaction characterization and interfacial effects in multilayers." In Optical Science, Engineering and Instrumentation '97, edited by Richard B. Hoover and Arthur B. C. Walker II. SPIE, 1997. http://dx.doi.org/10.1117/12.278849.

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Nie, Lei, Mingzhi Dong, Jian Cai, Michael Osterman, and Michael Pecht. "Interfacial reaction of reballed BGAs under isothermal aging conditions." In High Density Packaging (ICEPT-HDP). IEEE, 2009. http://dx.doi.org/10.1109/icept.2009.5270671.

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Akiyama, Toru, and Hiroyuki Kageshima. "Origin of Interfacial Reaction Constant for Si Thermal Oxidation." In 2003 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2003. http://dx.doi.org/10.7567/ssdm.2003.p3-21l.

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Hattori, Shingo, Naoya Matsubara, Ikuo Shohji, and Hideyuki Kuwahara. "Interfacial Reaction Between Molten Sn and Plasma Nitrided Stainless Steel." In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. American Society of Mechanical Engineers, 2013. http://dx.doi.org/10.1115/ipack2013-73170.

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Erosion behavior of plasma nitrided stainless steel by molten Sn was examined. To investigate the erosion behavior, the interfacial reaction was investigated at the temperature ranging from 350 to 450°C using plasma nitrided SUS304 and SUS316 stainless steel which sandwich pure Sn foil. As the results, it was found that the surface area of the nitrided layer is peeled and subsequently FeSn2 phases form in the reaction interface. FeSn2 phases grow toward molten Sn and Sn diffuses into the nitrided layer. Moreover, Ni3Sn4 phases form and grow in molten Sn. Apparent activation energies of the Sn diffusion into the nitrided layer were estimated to be 153 kJ/mol and 133 kJ/mol for plasma nitrided SUS304 and SUS316, respectively.

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Murali, Sarangapani, V. Sureshkumar, Lo Miew Wan, Tok Chee Wei, and Zhang Xi. "Interfacial reaction and thermal ageing of ball and stitch bonds." In 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE, 2015. http://dx.doi.org/10.1109/eptc.2015.7412302.

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Kato, K., S. Shibayama, M. Sakashita, W. Takeuchi, N. Taoka, O. Nakatsuka, and S. Zaima. "Interfacial Reaction Mechanism in Al2O3/Ge Structure by Oxygen Radical." In 2012 International Conference on Solid State Devices and Materials. The Japan Society of Applied Physics, 2012. http://dx.doi.org/10.7567/ssdm.2012.ps-1-2.

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Shen, Li, Guangchen Xu, Ran Zhao, and Fu Guo. "Interfacial reaction between the thermopile materials and eutectic Sn-based solders." In High Density Packaging (ICEPT-HDP). IEEE, 2011. http://dx.doi.org/10.1109/icept.2011.6067035.

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Huang, Mingliang, Ting Liu, Ning Zhao, and Hua Hao. "Interfacial reaction in Cu/Sn/Cu fine pitch interconnect during soldering." In 2013 14th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2013. http://dx.doi.org/10.1109/icept.2013.6756494.

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Li, D., L. M. Yin, Z. X. Yao, G. Wang, L. P. Zhang, and C. X. Wang. "Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint." In 2017 18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2017. http://dx.doi.org/10.1109/icept.2017.8046506.

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Xu, Liwei, Mingliang Huang, Quanbin Yao, Yong Wang, and Binhao Lian. "Effect of Cu on interfacial reaction in high-lead solder bumps." In 2015 16th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2015. http://dx.doi.org/10.1109/icept.2015.7236813.

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Reports on the topic "Interfacial reaction"

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Barbee, T. W. ,. Jr LLNL. Interface reaction characterization and interfacial effects in multilayers. Office of Scientific and Technical Information (OSTI), April 1998. http://dx.doi.org/10.2172/305942.

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Resasco, Daniel E. Final Technical Report- Center for Interfacial Reaction Engineering. Office of Scientific and Technical Information (OSTI), October 2017. http://dx.doi.org/10.2172/1408909.

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Nitsche, Heino, and R. Jeffrey Serne. Transuranic Interfacial Reaction Studies on Manganese Oxide Hydroxide Mineral Surfaces Project Number: 70176. Office of Scientific and Technical Information (OSTI), June 2001. http://dx.doi.org/10.2172/833638.

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Koi, Tatsumi. Interfacing the JQMD and JAM Nuclear Reaction Codes to Geant4. Office of Scientific and Technical Information (OSTI), June 2003. http://dx.doi.org/10.2172/813352.

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Dickerson, B. D., X. Zhang, and S. B. Desu. Section 1: Interfacial reactions and grain growth in ferroelectric SrBi{sub 2}Ta{sub 2}O (SBT) thin films on Si substrates. Office of Scientific and Technical Information (OSTI), April 1997. http://dx.doi.org/10.2172/494124.

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